CN105908146B - Rotary magnetic control target and horizontal magnetic-controlled sputtering coating equipment - Google Patents
Rotary magnetic control target and horizontal magnetic-controlled sputtering coating equipment Download PDFInfo
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- CN105908146B CN105908146B CN201610514130.6A CN201610514130A CN105908146B CN 105908146 B CN105908146 B CN 105908146B CN 201610514130 A CN201610514130 A CN 201610514130A CN 105908146 B CN105908146 B CN 105908146B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
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Abstract
The present invention discloses a kind of rotary magnetic control target and horizontal magnetic-controlled sputtering coating equipment, and rotary magnetic control target includes target, magnetic core and magnet, and magnetic core is set in the middle part of target, and magnetic core periphery is equipped at least one magnet, and one end of magnet towards target is tapered.Horizontal magnetic-controlled sputtering coating equipment includes sequentially connected preceding pre-vacuum chamber, preceding thick pumping room, preceding essence pumping room, preceding surge chamber, coating chamber, rear surge chamber, essence takes out room, rear slightly pumping room and rear pre-vacuum chamber afterwards, coating chamber is one or more, rotary magnetic control target is equipped in each coating chamber, rotary magnetic control target is located above workpiece.This rotary magnetic control target enhances the magnetic line of force in the distribution density of target material surface, can increase the target number of particles sputtered out, to improve the plating membrane efficiency of workpiece surface by the way that magnet end is designed as tip.It is applied in horizontal magnetic-controlled sputtering coating equipment, the plating membrane efficiency of workpiece can be effectively improved, shorten the production cycle of entire processing line, to improve production efficiency.
Description
Technical field
The present invention relates to magnetron sputtering technology field, more particularly to a kind of rotary magnetic control target and rotary with this
The horizontal magnetic-controlled sputtering coating equipment of magnetic control target.
Background technology
In magnetron sputtering coating system, generally use plane-type magnetic controlled target or rotary magnetic control target to workpiece in coating chamber
Surface carries out sputter coating.Wherein, rotary magnetic control target plated film is to lean on electronics percussion argon molecule, it is made to become argon ion, argon from
For son again under the action of magnetic field and electric field, high velocity bombardment target material surface sputters required material with ion, molecular state
Come, is coated on workpiece surface.Currently, in general rotary magnetic control target, the end of magnet is generally planar structure, in practical life
In production, the distribution of the magnetic line of force more disperses, and electron density is relatively low, therefore the target number of particles sputtered out is also less, plating
Membrane efficiency is unable to get raising, causes entire coating wire production efficiency low, production cost is higher.
In addition, in entire coating system, to the vacuumize process of each vacuum chamber, the efficiency of each technique process is affected
And coating quality.Workpiece enters coating chamber and carries out the front and back of plated film, be required to first to be sent into pre-vacuum chamber, slightly take out room, essence take out room etc. into
Row pretreatment or buffered.In traditional vacuum coating system, each vacuum chamber be respectively equipped with it is independent vacuumize unit,
It is respectively independent to use.But in actual production, the vacuumizing effect of the vacuum coating system of the structure is unsatisfactory, especially needle
The slightly room of pumping is vacuumized, since the forepumping ability of lobe pump is often poor, thick interior of taking out is difficult to reach low pressure state,
So that workpiece is difficult to obtain preferable buffered in slightly pumping interior, the processing effect for influencing subsequent processing operations is tended to；
Meanwhile to when slightly the room of pumping vacuumizes, the used time is also grown, therefore the plated film period of entire vacuum coating system is also extended,
Plating membrane efficiency is difficult to be improved.
In addition, after filming equipment works a period of time, residual film layer is had in coating chamber, and can be increasingly thicker, i.e.,
Make cleaning also can some remain in plated film chamber interior walls, due to these residual film layers discharge quantities can bigger, to plate
During film room is evacuated, the gas remained in film layer can slowly release, and both influence vacuumizing for equipment in this way
Time also influences the coating effects of new workpiece.
Invention content
The high density magnetic line of force, effectively increasing can be generated it is an object of the invention to overcome the deficiencies of the prior art and provide a kind of
Add the rotary magnetic control target of the target number of particles sputtered out.
Another object of the present invention is to provide a kind of horizontal magnetron sputtering platings with above-mentioned rotary magnetic control target to set
It is standby.
The technical scheme is that：A kind of rotary magnetic control target, including target, magnetic core and magnet, magnetic core are set to target
Middle part, magnetic core periphery are equipped at least one magnet, and one end of magnet towards target is tapered.
The target is hollow cylindrical-shaped structure, and magnetic core and magnet are respectively positioned in the space in the middle part of target.
The magnetic core is hollow cylindrical-shaped structure, and magnetic core periphery is equipped with fixed frame, and magnet is installed on fixed frame.It is fixed
Sector structure or the braced frame similar to sector structure can be used in frame, and main function is for installing magnet, being located at magnet
The holder segment of tapered end periphery can be Open architecture (i.e. the tapered end of magnet is directly adjacent to target inner wall), also may be used
For enclosed construction (being also separated with braced frame between the tapered end of magnet and target inner wall).
The opposite both ends of the magnet are respectively tapering point and planar ends, and planar ends are installed on fixed frame, tapering point court
To target inner wall.
In the same axial cross section of target (i.e. in the vertical direction of workpiece conveying direction), the magnet is integral type knot
Structure or split structure；
When magnet is an integral structure, magnet is rectangular-shape, and the tapering point of magnet is in triangular prism shape；
When magnet is split structure, magnet is made of the multiple piecemeals being distributed side by side, and each piecemeal is cylindrical-shaped structure
Or rectangular parallelepiped structure；When each piecemeal is cylindrical-shaped structure, the tapering point of each piecemeal is in coniform；When each piecemeal is cuboid knot
When structure, the tapering point of each piecemeal is in tetrapyamid shape.
The target and magnetic core are arranged concentrically, in the annular space that magnet is formed between target and magnetic core；In target
Same radial section in (i.e. in the parallel direction of workpiece conveying direction), magnetic core periphery is set there are three magnet, and three magnet are simultaneously
Row is installed on fixed frame.I.e. in the structure, when the magnet on axial cross section is an integral structure, it is equipped in entire rotary target
Three magnet；When the magnet on axial cross section is split structure, three groups of magnetic being made of piecemeal are equipped in entire rotary target
Iron.In addition, according to the actual size size of rotary target, the quantity of magnet can be flexibly arranged.
This rotary magnetic control target is in use, its principle is：Since one end of magnet towards target is tapered, in use, magnetic
The line of force is drawn from the tip of magnet, enhances the magnetic line of force in the distribution density of target material surface, and the magnetic field intensity of target material surface is close
Degree is higher, also stronger to the constraint ability of electronics, and after electron density increases, the plasma density of target material surface can be increasingly
Height, therefore the target number of particles sputtered out can be increasing, to improve the plating membrane efficiency of workpiece surface.
A kind of horizontal magnetic-controlled sputtering coating equipment with above-mentioned rotary magnetic control target, according to the conveying direction of workpiece, packet
Include sequentially connected preceding pre-vacuum chamber, preceding thick pumping room, preceding essence take out room, preceding surge chamber, coating chamber, rear surge chamber, rear essence take out room, rear thick
Room and rear pre-vacuum chamber are taken out, coating chamber is one or more, is equipped with rotary magnetic control target in each coating chamber, rotary magnetic control target is located at
Above workpiece.In addition to this, according to the conveying direction of workpiece, the front end of preceding pre-vacuum chamber is additionally provided with into piece platform, rear pre-vacuum chamber
Rear end is additionally provided with slice platform.
Heater is additionally provided in the coating chamber, heater is located at below workpiece.
The heater includes heating tube and heating pipe fitting, and heating tube is in the U-shaped shape being horizontally arranged, heating tube both sides
End is fixedly connected by collar nut with heating pipe fitting, and heating pipe fitting is fixedly connected with the inner wall of coating chamber, heating tube
It is additionally provided with sealing ring, the external heat source in end of heating tube with the junction of heating pipe fitting.Wherein, stainless steel can be used in heating tube
Heating tube；The main function of sealing ring is that protection heating pipe fitting is not damaged by heating power.The setting of heater can take out in coating chamber
It being heated before vacuum or to coating chamber when vacuumizing, the gas quick release that can accelerate to remain in film layer comes out, to
Shorten the time that equipment vacuumizes, improves the service efficiency of equipment.
The preceding pre-vacuum chamber and preceding thick pumping room are equipped with the first pumping unit, and preceding essence takes out room and is equipped with the second pumping unit, preceding slow
It rushes room, coating chamber and rear surge chamber and is evacuated unit equipped with third, rear essence takes out room and is equipped with the 4th pumping unit, the rear thick room and rear pre- of taking out
It takes out room and is equipped with the 5th pumping unit；
First pumping unit and the second pumping set structure are identical, respectively include pre- pumping valve, roughing valve, bypass valve, first
It is respectively equipped with pre- pumping on lobe pump and the first mechanical pump, preceding pre-vacuum chamber and rear pre-vacuum chamber to manage, preceding thick pumping room and rear thick take out are divided on room
Pipe She You not be taken out slightly；Pumping valve in advance is arranged in pre- take out on pipe, roughing valve and the first lobe pump is arranged in thick take out on pipe, pumping pipe and slightly pumping pipe in advance
Between be also connected to by shunt valve, shunt valve be equipped at least first mechanical pump (according to the volume size and reality of pre-vacuum chamber
Border needs, and the quantity of the first mechanical pump can be flexibly arranged, and when needing to be arranged more, each first mechanical pump is parallel on shunt valve
)；Wherein, pre- pipe, pre- pumping valve and the first mechanical pump taken out forms the first exhaust pipe, thick to take out pipe, roughing valve, bypass valve, side
Lu Guan, the first lobe pump and the first mechanical pump form the second exhaust pipe.In addition, also being set respectively on preceding pre-vacuum chamber and rear pre-vacuum chamber
There are bleeder pipe, bleeder pipe to be equipped with vent valve.In use, by taking the first pumping unit as an example, principle is：First mechanical pump is plating
It being kept it turned in the whole work process of film device, workpiece is opened after workbench enters pre-vacuum chamber and takes out valve in advance, and first
Mechanical pump is evacuated pre-vacuum chamber, when the vacuum degree in pre-vacuum chamber reaches 2000Pa, pre-vacuum chamber and preceding thick pumping room before opening
Between vacuum lock, roughing valve and bypass valve, close it is pre- take out valve, by the first lobe pump and the first mechanical pump to preceding thick pumping room into
Row vacuumizes, and workpiece is sent into thick pumping room, pre-vacuum chamber and the preceding thick vacuum lock taken out between room before closing later, and opens deflation
Valve deflates to preceding pre-vacuum chamber, and when the pressure in current pre-vacuum chamber is balanced with atmospheric pressure, pre-vacuum chamber is sent into new work further along
Part so recycles.During being somebody's turn to do, preceding pre-vacuum chamber and the preceding thick unlatching pressure for taking out the vacuum lock between room can increase substantially,
Reachable 2000Pa or more, the first mechanical pump pumping speed for being primarily due to the first lobe pump prime is bigger, and exhaust capacity is strong, energy
The gas of lobe pump prime is taken away in time, the operating pressure of such lobe pump can be in higher range (being higher than 2000Pa)；
The vacuum pressure of preceding pre-vacuum chamber is extracted into less than after 2000Pa, it may not be necessary to is evacuated again, at this moment using the first machine of pre-vacuum chamber
Tool pumps, and by thick the first lobe pump prime for taking out room before the access of the first mechanical pump, can utilize the pumping work(of the first mechanical pump in this way
Can, the utilization rate of each pump is effectively reached into highest level, while pumping efficiency can be improved, saves energy consumption.Second air exhauster
The course of work of group is opposite with the first pumping unit.
Preceding essence takes out and is respectively equipped with diffusion pump on the outside of room, preceding surge chamber, each coating chamber, rear surge chamber and rear essence pumping room, preceding
Essence, which takes out the diffusion pump on room and is evacuated unit with second, to be connect, preceding surge chamber, each coating chamber and diffusion pump on rear surge chamber and the
Three pumping unit connections, rear essence are taken out the diffusion pump on room and are connect with the 4th pumping unit.Second pumping unit, third are evacuated unit
It is identical with the 4th pumping structure of unit, respectively include exhaust tube, extraction valve, the second lobe pump and the second mechanical pump, exhaust tube
It is connect with diffusion pump, gas flow is installed, extraction valve, the second lobe pump and the second mechanical pump are set gradually on exhaust tube.
The present invention compared with the existing technology, has the advantages that：
For this rotary magnetic control target by the way that magnet end is designed as tip, the distribution for enhancing the magnetic line of force in target material surface is close
Degree, makes, it reinforces the constraint ability to electronics, to improve the plasma density of target material surface, increases the target particle sputtered out
Quantity, to improve the plating membrane efficiency of workpiece surface.
This rotary magnetic control target is applied in horizontal magnetic-controlled sputtering coating equipment, the plated film effect of workpiece can be effectively improved
Rate shortens the production cycle of entire processing line, to improve production efficiency.
In this horizontal magnetic-controlled sputtering coating equipment, heater is also added in coating chamber, can before coating chamber vacuumizes or
Coating chamber is heated when vacuumizing, the gas quick release that can accelerate to remain in film layer comes out, so as to shorten equipment
The time vacuumized improves the service efficiency of equipment.
In this horizontal magnetic-controlled sputtering coating equipment, for the defect of extract system in traditional filming equipment, also to preceding pre- pumping
Room, preceding thick pumping room, rear pre-vacuum chamber, the rear thick extract system for taking out room improve, it can be achieved that multiple mechanical series connections of pumps are to slightly taking out
Roots's pump discharge of room is evacuated, and the pressure that lobe pump exports can be made to substantially reduce, to meet lobe pump in entrance pressure
It is strong it is higher in the case of also can normal operation work.Its is simple in structure, and improvement cost is low, but vacuumizes demand for slightly take out room
For, there is preferable vacuumizing effect, while can realize rapid vacuumizing, shorten the cycle period vacuumized, further contracts
Casual labourer's part plated film period.
Description of the drawings
Fig. 1 is the structural schematic diagram of this rotary magnetic control target.
Fig. 2 is the structural schematic diagram of this horizontal magnetic-controlled sputtering coating equipment.
Fig. 3 is the Section A-A view of Fig. 2.
Fig. 4 is the structural schematic diagram of the first pumping unit and the second pumping unit in Fig. 2.
Fig. 5 is the structural schematic diagram of single heating tube.
Fig. 6 is the schematic enlarged-scale view of heating tube and heating tube joint in Fig. 5.
Specific implementation mode
With reference to embodiment, the present invention is described in further detail, and embodiments of the present invention are not limited thereto.
Embodiment 1
A kind of rotary magnetic control target of the present embodiment, as shown in Figure 1, including target 1, magnetic core 2 and magnet 3, magnetic core is set to target
In the middle part of material, magnetic core periphery is equipped at least one magnet, and one end of magnet towards target is tapered.
Target is hollow cylindrical-shaped structure, and magnetic core and magnet are respectively positioned in the space in the middle part of target.
Magnetic core is hollow cylindrical-shaped structure, and magnetic core periphery is equipped with fixed frame 4, and magnet is installed on fixed frame.Fixed frame
Sector structure or the braced frame similar to sector structure can be used, main function is for installing magnet, being located at magnet and bore
The holder segment of shape end periphery can be Open architecture (i.e. the tapered end of magnet is directly adjacent to target inner wall), or
Enclosed construction (is also separated with braced frame) between the tapered end of magnet and target inner wall.
The opposite both ends of magnet are respectively tapering point and planar ends, and planar ends are installed on fixed frame, and tapering point is towards target
Material inner wall.
In the same axial cross section of target (i.e. in the vertical direction of workpiece conveying direction), magnet is an integral structure,
In a rectangular parallelepiped shape, the tapering point of magnet is in triangular prism shape to magnet.
Target and magnetic core are arranged concentrically, in the annular space that magnet is formed between target and magnetic core；In the same of target
In one radial section (i.e. in the parallel direction of workpiece conveying direction), magnetic core periphery is set there are three magnet, and three magnet are pacified side by side
Loaded on fixed frame, i.e., in the structure, set that there are three magnet in entire rotary target.But in practical applications, according to rotary target
The quantity of actual size size, magnet can be flexibly arranged.
This rotary magnetic control target is in use, its principle is：Since one end of magnet towards target is tapered, in use, magnetic
The line of force 5 is drawn from the tip of magnet, enhances the magnetic line of force in the distribution density of target material surface, and the magnetic field intensity of target material surface is close
Degree is higher, also stronger to the constraint ability of electronics 6, and after electron density increases, the plasma of target material surface (is in the present embodiment
Argon ion 7) density can be higher and higher, therefore the target number of particles sputtered out can be increasing, to improve workpiece table
The plating membrane efficiency in face.
Embodiment 2
A kind of rotary magnetic control target of the present embodiment, compared with Example 1 compared with, the difference is that：In the same of target
In axial cross section (i.e. in the vertical direction of workpiece conveying direction), when magnet is split structure, magnet is more by what is be distributed side by side
A piecemeal composition, each piecemeal are cylindrical-shaped structure, and the tapering point of each piecemeal is in coniform.
Target and magnetic core are arranged concentrically, in the annular space that magnet is formed between target and magnetic core；In the same of target
In one radial section (i.e. in the parallel direction of workpiece conveying direction), magnetic core periphery is equipped with three groups of magnet, and three groups of magnet are pacified side by side
Loaded on fixed frame, i.e., in the structure, three groups of magnet being made of piecemeal are equipped in entire rotary target.But in practical applications,
According to the actual size size of rotary target, the quantity of piecemeal can be flexibly arranged in the group number and every group of magnet of magnet.
Embodiment 3
A kind of rotary magnetic control target of this present embodiment, compared with Example 1 compared with, the difference is that：In the same of target
In one axial cross section (i.e. in the vertical direction of workpiece conveying direction), when magnet is split structure, magnet by being distributed side by side
Multiple piecemeal compositions, each piecemeal are rectangular parallelepiped structure, and the tapering point of each piecemeal is in tetrapyamid shape.
Target and magnetic core are arranged concentrically, in the annular space that magnet is formed between target and magnetic core；In the same of target
In one radial section (i.e. in the parallel direction of workpiece conveying direction), magnetic core periphery is equipped with three groups of magnet, and three groups of magnet are pacified side by side
Loaded on fixed frame, i.e., in the structure, three groups of magnet being made of piecemeal are equipped in entire rotary target.But in practical applications,
According to the actual size size of rotary target, the quantity of piecemeal can be flexibly arranged in the group number and every group of magnet of magnet.
Embodiment 4
A kind of horizontal magnetic-controlled sputtering coating equipment of rotary magnetic control target of the present embodiment, as shown in Figure 2 or Figure 3, according to work
The conveying direction of part, including sequentially connected preceding pre-vacuum chamber 8, preceding thick pumping room 9, preceding essence pumping room 10, preceding surge chamber 11, coating chamber
12, rear surge chamber 13, afterwards essence pumping room 14, rear thick pumping room 15 and rear pre-vacuum chamber 16, coating chamber is one or more, in each coating chamber
Equipped with rotary magnetic control target, rotary magnetic control target is located above workpiece.In addition to this, according to the conveying direction of workpiece, preceding pre- pumping
The front end of room is additionally provided with into piece platform 17, and the rear end of rear pre-vacuum chamber is additionally provided with slice platform 18.In coating chamber be equipped with embodiment 1,
The rotary magnetic control target 19 of structure described in embodiment 2 or embodiment 3.
Embodiment 5
A kind of horizontal magnetic-controlled sputtering coating equipment of rotary magnetic control target of the present embodiment, compared with Example 4 compared with different
Place is that as shown in figures 2 or 4, preceding pre-vacuum chamber and preceding thick pumping room are equipped with the first pumping unit, and preceding essence is taken out room and taken out equipped with second
Mechanism of qi group, preceding surge chamber, coating chamber and rear surge chamber are equipped with third and are evacuated unit, and rear essence takes out room and is equipped with the 4th pumping unit, after
Thick room and the rear pre-vacuum chamber taken out is equipped with the 5th pumping unit；
First pumping unit and the second pumping set structure are identical, respectively include pre- pumping valve 20, roughing valve 21, bypass valve
22, the first lobe pump 23 and the first mechanical pump 24, are respectively equipped with pre- pumping pipe 25 on preceding pre-vacuum chamber and rear pre-vacuum chamber, preceding thick pumping room and
It slightly takes out afterwards and is respectively equipped with thick pumping pipe 26 on room；Pre- pumping valve is arranged in pre- take out on pipe, roughing valve and the first lobe pump is arranged in thick take out on pipe,
Pre- take out also is connected to by shunt valve 37 between pipe and thick pumping pipe, and shunt valve is equipped at least first mechanical pump and (is taken out according to pre-
The quantity of the volume size and actual needs of room, the first mechanical pump can be flexibly arranged, when needing to be arranged more, each first machinery
Parallel connection of pumps is on shunt valve)；Wherein, it is pre- take out pipe, it is pre- take out valve and the first mechanical pump forms the first exhaust pipe, it is thick take out pipe,
Roughing valve, bypass valve, shunt valve, the first lobe pump and the first mechanical pump form the second exhaust pipe.In addition, preceding pre-vacuum chamber is with after
Bleeder pipe 27 is further respectively had on pre-vacuum chamber, bleeder pipe is equipped with vent valve 28.In use, by taking the first pumping unit as an example,
Principle is：First mechanical pump is kept it turned in the whole work process of filming equipment, and workpiece enters pre- from workbench
After taking out room, pre- pumping valve is opened, the first mechanical pump is evacuated pre-vacuum chamber, when the vacuum degree in pre-vacuum chamber reaches 2000Pa,
Pre-vacuum chamber and preceding thick vacuum lock, roughing valve and the bypass valve taken out between room before opening, close it is pre- take out valve, by the first lobe pump and
First mechanical pump vacuumizes preceding thick pumping room, and workpiece is sent into thick pumping room, pre-vacuum chamber and preceding thick pumping room before closing later
Between vacuum lock, and open vent valve, deflate to preceding pre-vacuum chamber, the pressure in current pre-vacuum chamber is balanced with atmospheric pressure
When, pre-vacuum chamber is sent into new workpiece further along, so recycles.During being somebody's turn to do, preceding pre-vacuum chamber and the preceding thick vacuum lock taken out between room
Unlatching pressure can increase substantially, reach 2000Pa or more, be primarily due to the first lobe pump prime first machinery
Pumping speed ratio is larger, and exhaust capacity is strong, can take the gas of lobe pump prime in time away, and the operating pressure of such lobe pump can be
In higher range (being higher than 2000Pa)；The vacuum pressure of preceding pre-vacuum chamber is extracted into less than after 2000Pa, it may not be necessary to it is evacuated again,
At this moment thick the first lobe pump prime for taking out room before the access of the first mechanical pump in this way may be used using the first mechanical pump of pre-vacuum chamber
Using the air extracting function of the first mechanical pump, the utilization rate of each pump is effectively reached highest level, while pumping can be improved
Efficiency saves energy consumption.The course of work of second pumping unit is opposite with the first pumping unit.
Preceding essence takes out and is respectively equipped with diffusion pump 34 on the outside of room, preceding surge chamber, each coating chamber, rear surge chamber and rear essence pumping room,
It is preceding essence take out room on diffusion pump with second pumping unit connect, the diffusion pump on preceding surge chamber, each coating chamber and rear surge chamber and
Third is evacuated unit connection, and rear essence is taken out the diffusion pump on room and connect with the 4th pumping unit.Second pumping unit, third air exhauster
Group is identical with the 4th pumping structure of unit, respectively includes exhaust tube 29, extraction valve 30, the second lobe pump 31 and the second mechanical pump
32, exhaust tube is connect with diffusion pump, installs gas flow, extraction valve, the second lobe pump and the second machine are set gradually on exhaust tube
Tool pumps.
Embodiment 6
A kind of horizontal magnetic-controlled sputtering coating equipment of rotary magnetic control target of the present embodiment, compared with Example 5 compared with different
Place is, as shown in figure 3, being additionally provided with heater 33 in coating chamber, heater is located at below workpiece.As shown in Figure 5 or Figure 6,
Heater includes heating tube 38 and heating pipe fitting 35, and in horizontal positioned U-shaped shape, the end of heating tube both sides passes through heating tube
Collar nut 39 is fixedly connected with heating pipe fitting, and heating pipe fitting is fixedly connected with the inner wall of coating chamber, heating tube and heating
The junction of pipe fitting is additionally provided with sealing ring 36, the external heat source in end of heating tube.Wherein, stainless steel heating can be used in heating tube
Pipe；The main function of sealing ring is that protection heating pipe fitting is not damaged by heating power.The setting of heater can be vacuumized in coating chamber
Preceding or while vacuumizing, heats coating chamber, and the gas quick release that can accelerate to remain in film layer comes out, so as to shorten
The time that equipment vacuumizes improves the service efficiency of equipment.
As described above, the present invention can be better realized, above-described embodiment is only presently preferred embodiments of the present invention, is not used
To limit the practical range of the present invention；It is i.e. all according to equivalent changes and modifications made by the content of present invention, all wanted for right of the present invention
Range claimed is asked to be covered.
Claims (7)
1. a kind of rotary magnetic control target, which is characterized in that including target, magnetic core and magnet, magnetic core is set in the middle part of target, outside magnetic core
Week is equipped at least one magnet, and one end of magnet towards target is tapered；
The target is hollow cylindrical-shaped structure, and magnetic core and magnet are respectively positioned in the space in the middle part of target；
The magnetic core is hollow cylindrical-shaped structure, and magnetic core periphery is equipped with fixed frame, and magnet is installed on fixed frame；
The target and magnetic core are arranged concentrically, in the annular space that magnet is formed between target and magnetic core；In the same of target
In one radial section, magnetic core periphery is set there are three magnet, and three magnet are mounted side by side on fixed frame.
2. a kind of rotary magnetic control target according to claim 1, which is characterized in that the opposite both ends of the magnet are respectively to bore
Shape end and planar ends, planar ends are installed on fixed frame, and tapering point is towards target inner wall.
3. a kind of rotary magnetic control target according to claim 2, which is characterized in that in the same axial cross section of target, institute
Magnet is stated to be an integral structure or split structure；
When magnet is an integral structure, magnet is rectangular-shape, and the tapering point of magnet is in triangular prism shape；
When magnet is split structure, magnet is made of the multiple piecemeals being distributed side by side, and each piecemeal is cylindrical-shaped structure or length
Cube structure；When each piecemeal is cylindrical-shaped structure, the tapering point of each piecemeal is in coniform；When each piecemeal is rectangular parallelepiped structure
When, the tapering point of each piecemeal is in tetrapyamid shape.
4. a kind of horizontal magnetic-controlled sputtering coating equipment with any one of the claims 1 to 3 rotary magnetic control target, feature
It is, according to the conveying direction of workpiece, including sequentially connected preceding pre-vacuum chamber, preceding thick pumping room, preceding essence pumping room, preceding surge chamber, plating
Film room, rear surge chamber, essence takes out room, rear thick pumping room and rear pre-vacuum chamber afterwards, and coating chamber is one or more, and rotation is equipped in each coating chamber
Rotatable magnetic control target, rotary magnetic control target are located above workpiece.
5. a kind of horizontal magnetic-controlled sputtering coating equipment according to claim 4, which is characterized in that be additionally provided in the coating chamber
Heater, heater are located at below workpiece.
6. a kind of horizontal magnetic-controlled sputtering coating equipment according to claim 5, which is characterized in that the heater includes heating
Pipe and heating pipe fitting, in horizontal positioned U-shaped shape, the end of heating tube both sides is connect heating tube by collar nut and heating tube
Head is fixedly connected, and heating pipe fitting is fixedly connected with the inner wall of coating chamber, and heating tube and the junction of heating pipe fitting are additionally provided with
Sealing ring, the external heat source in end of heating tube.
7. a kind of horizontal magnetic-controlled sputtering coating equipment according to claim 4, which is characterized in that the preceding pre-vacuum chamber and preceding thick
It takes out room and is equipped with the first pumping unit, preceding essence takes out room and is equipped with the second pumping unit, and preceding surge chamber, coating chamber and rear surge chamber are equipped with the
Three pumping units, rear essence take out room equipped with the 4th pumping unit, and rear thick room and the rear pre-vacuum chamber taken out is equipped with the 5th pumping unit；
First pumping unit and the second pumping set structure are identical, respectively include pre- pumping valve, roughing valve, bypass valve, the first Roots
Pump and the first mechanical pump are respectively equipped with pre- pumpings pipe on preceding pre-vacuum chamber and rear pre-vacuum chamber, are set respectively on preceding thick pumpings room and rear slightly pumping room
There is thick take out to manage；Pre- pumping valve is arranged in pre- take out on pipe, roughing valve and the first lobe pump is arranged in thick take out on pipe, between pre- pumping pipe and thick pumping pipe
It is also connected to by shunt valve, shunt valve is equipped at least first mechanical pump；Wherein, pre- to take out pipe, pre- pumping valve and the first machinery
Pump group is thick to take out pipe, roughing valve, bypass valve, shunt valve, the first lobe pump and the first mechanical pump composition second at the first exhaust pipe
Exhaust pipe.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610514130.6A CN105908146B (en) | 2016-06-30 | 2016-06-30 | Rotary magnetic control target and horizontal magnetic-controlled sputtering coating equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610514130.6A CN105908146B (en) | 2016-06-30 | 2016-06-30 | Rotary magnetic control target and horizontal magnetic-controlled sputtering coating equipment |
Publications (2)
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| CN105908146A CN105908146A (en) | 2016-08-31 |
| CN105908146B true CN105908146B (en) | 2018-08-24 |
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| CN201610514130.6A Active CN105908146B (en) | 2016-06-30 | 2016-06-30 | Rotary magnetic control target and horizontal magnetic-controlled sputtering coating equipment |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107365973B (en) * | 2017-08-29 | 2024-02-02 | 肇庆市德信真空设备有限公司 | Vacuum coating production line and coating method |
| CN115110051B (en) * | 2022-07-12 | 2023-07-25 | 江西贵得科技有限公司 | Film-coated rotary target core structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1336965A (en) * | 1999-11-18 | 2002-02-20 | 东京电子株式会社 | Magnet device with high target utilization ratio used for sputtering target with conical butt |
| CN201486861U (en) * | 2009-08-19 | 2010-05-26 | 河南中光学集团有限公司 | Device for quickly pumping vacuum |
| CN103354844A (en) * | 2011-01-06 | 2013-10-16 | 零件喷涂公司 | Sputtering apparatus |
| CN105543790A (en) * | 2016-02-15 | 2016-05-04 | 佛山市佛欣真空技术有限公司 | Vacuum coating machine system and operating method thereof |
| CN205907351U (en) * | 2016-06-30 | 2017-01-25 | 肇庆市科润真空设备有限公司 | Rotation type megnetron sputtering target and horizontal magnetron sputtering filming equipment |
-
2016
- 2016-06-30 CN CN201610514130.6A patent/CN105908146B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1336965A (en) * | 1999-11-18 | 2002-02-20 | 东京电子株式会社 | Magnet device with high target utilization ratio used for sputtering target with conical butt |
| CN201486861U (en) * | 2009-08-19 | 2010-05-26 | 河南中光学集团有限公司 | Device for quickly pumping vacuum |
| CN103354844A (en) * | 2011-01-06 | 2013-10-16 | 零件喷涂公司 | Sputtering apparatus |
| CN105543790A (en) * | 2016-02-15 | 2016-05-04 | 佛山市佛欣真空技术有限公司 | Vacuum coating machine system and operating method thereof |
| CN205907351U (en) * | 2016-06-30 | 2017-01-25 | 肇庆市科润真空设备有限公司 | Rotation type megnetron sputtering target and horizontal magnetron sputtering filming equipment |
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|---|---|
| CN105908146A (en) | 2016-08-31 |
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