CN105885481A - LED lamp bead installation circuit board surface light reflection layer cooling coating - Google Patents
LED lamp bead installation circuit board surface light reflection layer cooling coating Download PDFInfo
- Publication number
- CN105885481A CN105885481A CN201610378558.2A CN201610378558A CN105885481A CN 105885481 A CN105885481 A CN 105885481A CN 201610378558 A CN201610378558 A CN 201610378558A CN 105885481 A CN105885481 A CN 105885481A
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- Prior art keywords
- parts
- led lamp
- reflection layer
- lamp bead
- cooling coating
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- 239000011248 coating agent Substances 0.000 title claims abstract description 18
- 238000000576 coating method Methods 0.000 title claims abstract description 18
- 239000011324 bead Substances 0.000 title claims abstract description 15
- 238000001816 cooling Methods 0.000 title claims abstract description 11
- 238000009434 installation Methods 0.000 title abstract 3
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 claims abstract description 14
- GPNDARIEYHPYAY-UHFFFAOYSA-N palladium(ii) nitrate Chemical compound [Pd+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O GPNDARIEYHPYAY-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 10
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims abstract description 7
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims abstract description 7
- 235000011130 ammonium sulphate Nutrition 0.000 claims abstract description 7
- 239000002199 base oil Substances 0.000 claims abstract description 7
- 229910021538 borax Inorganic materials 0.000 claims abstract description 7
- 229910052791 calcium Inorganic materials 0.000 claims abstract description 7
- 239000011575 calcium Substances 0.000 claims abstract description 7
- 150000008442 polyphenolic compounds Chemical class 0.000 claims abstract description 7
- 235000013824 polyphenols Nutrition 0.000 claims abstract description 7
- 239000004328 sodium tetraborate Substances 0.000 claims abstract description 7
- 235000010339 sodium tetraborate Nutrition 0.000 claims abstract description 7
- 229910000420 cerium oxide Inorganic materials 0.000 claims abstract description 6
- 229920001684 low density polyethylene Polymers 0.000 claims abstract description 6
- 239000004702 low-density polyethylene Substances 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 27
- 239000000203 mixture Substances 0.000 claims description 17
- 239000012752 auxiliary agent Substances 0.000 claims description 12
- 210000000988 bone and bone Anatomy 0.000 claims description 12
- 230000005855 radiation Effects 0.000 claims description 12
- 238000001354 calcination Methods 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 229910017083 AlN Inorganic materials 0.000 claims description 7
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 7
- 229920002907 Guar gum Polymers 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 6
- 239000012467 final product Substances 0.000 claims description 6
- 229960002154 guar gum Drugs 0.000 claims description 6
- 235000010417 guar gum Nutrition 0.000 claims description 6
- 239000000665 guar gum Substances 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 238000000498 ball milling Methods 0.000 claims description 5
- 239000006185 dispersion Substances 0.000 claims description 5
- 239000000243 solution Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 4
- 239000012141 concentrate Substances 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 238000000227 grinding Methods 0.000 claims description 4
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 4
- 239000000395 magnesium oxide Substances 0.000 claims description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 4
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 4
- 239000004576 sand Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 4
- 239000011734 sodium Substances 0.000 claims description 4
- 229910052708 sodium Inorganic materials 0.000 claims description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 4
- 229910000165 zinc phosphate Inorganic materials 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 2
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 claims description 2
- -1 dithio Zinc phosphate Chemical compound 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims description 2
- 229910052684 Cerium Inorganic materials 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- WMYJOZQKDZZHAC-UHFFFAOYSA-H trizinc;dioxido-sulfanylidene-sulfido-$l^{5}-phosphane Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([S-])=S.[O-]P([O-])([S-])=S WMYJOZQKDZZHAC-UHFFFAOYSA-H 0.000 claims 1
- 230000008901 benefit Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052725 zinc Inorganic materials 0.000 abstract description 3
- 239000011701 zinc Substances 0.000 abstract description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 abstract 2
- 230000000903 blocking effect Effects 0.000 abstract 1
- 238000005034 decoration Methods 0.000 abstract 1
- 239000003292 glue Substances 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000003860 storage Methods 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 150000002019 disulfides Chemical class 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
The invention discloses an LED lamp bead installation circuit board surface light reflection layer cooling coating. The LED lamp bead installation circuit board surface light reflection layer cooling coating is prepared from, by weight, 82-85 parts of aluminum, 12-14 parts of aluminum nitride, 4-5 parts of calcium hexaluminate, 1-2 parts of borax, 2-4 parts of nano cerium oxide, 5-8 parts of nanometer titania, 0.5-1.5 parts of palladium nitrate, 0.5-1.5 parts of 500SN base oil, 0.5-1.5 parts of zinc dialkyl dithiophosphate, 1-2 parts of an ammonium sulfate solution, 1-2 parts of carbon tetrachloride, 2-4 parts of Gul glue, 2-4 parts of polyphenol, 0.5-1.5 parts of low-density polyethylene and 4-5 parts of auxiliaries. According to the cooling coating, the advantages of aluminum, aluminum nitride, auxiliaries and other components are synthesized, the good heat conduction and insulation performance are achieved, the obtained cooling coating is compact in structure and high in surface smoothness, the decoration effect is achieved, the good waterproof dampness blocking capacity is achieved, the temperature resistance is good, the cooling coating is not likely to crack and more durable, an LED lamp can be effectively protected due to the good cooling capacity, and the service life of the lamp can be greatly prolonged.
Description
Technical field
The present invention relates to light fixture heat sink material, be specifically related to a kind of LED lamp bead mounting circuit boards light-reflection layer
Heat radiation coating.
Background technology
LED is referred to as forth generation light source, has the advantages such as energy-saving and environmental protection, safety, low energy consumption, high brightness,
Being widely used in daily life, the heat dispersion of LED lamp itself is most important, directly influences lamp
The service life of tool and illuminating effect.Existing LED heat sink material is mainly by metal material systems such as aluminum, copper
Become, there is the shortcomings such as cost limits, insulating properties are inadequate, the most necessary improvement material in actual use
The formula of material, makes material reach the best radiating effect, improves the serviceability of light fixture, extend and use
Life-span.
Summary of the invention
The offer one LED lamp bead mounting circuit boards light-reflection layer heat radiation coating of present invention innovation.
The technical solution adopted in the present invention is:
A kind of LED lamp bead mounting circuit boards light-reflection layer heat radiation coating, is made up of the raw material of following weight portion:
Aluminum 82-85, aluminium nitride 12-14, calcium hexaluminate 4-5, Borax 1-2, nano-cerium oxide 2-4, nano-silica
Change titanium 5-8, Palladous nitrate. 0.5-1.5,500SN base oil 0.5-1.5, zinc dialkyl dithiophosphate 0.5-1.5,
Ammonium sulfate 1-2, carbon tetrachloride 1-2, guar gum 2-4, polyphenol 2-4, Low Density Polyethylene 0.5-1.5,
Auxiliary agent 4-5.
As preferably, described a kind of LED lamp bead mounting circuit boards light-reflection layer heat radiation coating, by following
The raw material of weight portion is made: aluminum 85, aluminium nitride 12, calcium hexaluminate 4, Borax 1, nano-cerium oxide 3, receive
Rice titanium dioxide 6, Palladous nitrate. 1,500SN base oil 1, zinc dialkyl dithiophosphate 1, ammonium sulfate
1, carbon tetrachloride 1, guar gum 3, polyphenol 3, Low Density Polyethylene 1, auxiliary agent 4.
Described auxiliary agent is made up of the raw material of following weight portion: polyaluminium sulfate 4-5, animal bone 8-10, sodium
Sand 1-3, polyimides 4-5, silver-coated copper powder 8-10, magnesium oxide 12-14, light magnesium carbonate 5-8, system
Preparation Method is: first cool down standby after 800-900 DEG C of temperature lower calcination 10-12h by animal bone, then will polymerization
Aluminum sulfate is dissolved in suitable quantity of water and is configured to the aqueous solution that concentration is 4-6%, and will calcining after animal bone and its
Its residual components puts in solution, concentrate drying after mix and blend dispersion 2-3h, grinds to form 300-400 mesh
Fine powder, to obtain final product.
Described a kind of LED lamp bead mounting circuit boards light-reflection layer heat radiation coating, its production method is as follows:
(1) above-mentioned formula material mix and blend is disperseed 1-2h, gained material is put into ball milling in ball mill
Process, make 10000-hole sieve surplus≤0.05% of gained material；
(2) material of step (1) gained is dried at 80-100 DEG C, the moisture content of holding material≤
0.02%, compressing, under nitrogen atmosphere by sending in mould after powder body grinding distribution 40-50min subsequently
After sintering 4-6h with the temperature of 650-700 DEG C, through naturally cooling to room temperature and get final product.
The invention have the benefit that the heat sink material of the present invention combines the compositions such as aluminum, aluminium nitride, auxiliary agent
Advantage, have good heat conduction and insulating properties, prepared heat sink material compact structure, surface smoothness concurrently
Height, great decorative effect, the most excellent anti-water resistance tidal energy power, heat resistance is good, the most easy to crack,
The most durable in use, its good heat-sinking capability is effectively protected LED lamp, is greatly prolonged the use of light fixture
Life-span.
Detailed description of the invention
For the ease of the understanding of present invention, below in conjunction with embodiment, the invention will be further described,
Following example are only a part of embodiment of the present invention.
Embodiment 1
A kind of LED lamp bead mounting circuit boards light-reflection layer heat radiation coating, making step is as follows:
(1) take respectively according to percentage by weight: polyaluminium sulfate 5g, animal bone 10g, sodium sand 3g, poly-
Acid imide 5g, silver-coated copper powder 10g, magnesium oxide 14g, light magnesium carbonate 8g, first by animal bone at 800-900 DEG C
Cool down standby after temperature lower calcination 12h, then polyaluminium sulfate is dissolved in suitable quantity of water that to be configured to concentration be 6%
Aqueous solution, and the animal bone after calcining and other residual components are put in solution, mix and blend dispersion 2-3h
Rear concentrate drying, grinds to form 300-400 mesh fine powder, obtains auxiliary agent, by standby for auxiliary agent sealed storage.
(2) take respectively according to percentage by weight: aluminum 85g, aluminium nitride 12g, calcium hexaluminate 4g, Borax 1g,
Nano-cerium oxide 3g, nano titanium oxide 6g, Palladous nitrate. 1g, 500SN base oil 1g, dialkyl dithio
Zinc phosphate 1g, ammonium sulfate 1g, carbon tetrachloride 1g, guar gum 3g, polyphenol 3g, Low Density Polyethylene
1g, auxiliary agent 4g.
A) above-mentioned formula material mix and blend is disperseed 1-2h, at ball milling in gained material input ball mill
Reason, makes 10000-hole sieve surplus≤0.05% of gained material；
B) material of step (1) gained is dried at 80-100 DEG C, keeps moisture content≤0.02% of material,
Compressing by sending in mould after powder body grinding distribution 40-50min subsequently, under nitrogen atmosphere with
After the temperature sintering 4-6h of 650-700 DEG C, through naturally cooling to room temperature and get final product.
Embodiment 2
A kind of LED lamp bead mounting circuit boards light-reflection layer heat radiation coating, making step is as follows:
(1) take respectively according to percentage by weight: polyaluminium sulfate 4g, animal bone 9g, sodium sand 2g, polyamides
Imines 4g, silver-coated copper powder 10g, magnesium oxide 14g, light magnesium carbonate 5g, first by animal bone at 800-900 DEG C
Cool down standby after temperature lower calcination 12h, then polyaluminium sulfate is dissolved in suitable quantity of water that to be configured to concentration be 6%
Aqueous solution, and the animal bone after calcining and other residual components are put in solution, mix and blend dispersion 2-3h
Rear concentrate drying, grinds to form 300-400 mesh fine powder, obtains auxiliary agent, by standby for auxiliary agent sealed storage.
(2) take respectively according to percentage by weight: aluminum 85g, aluminium nitride 13g, calcium hexaluminate 5g, Borax 2g,
Nano-cerium oxide 3g, nano titanium oxide 6g, Palladous nitrate. 1g, 500SN base oil 0.5g, dialkyl disulfides
Gather for zinc phosphate 0.5g, ammonium sulfate 2g, carbon tetrachloride 2g, guar gum 2g, polyphenol 2g, low-density
Ethylene 0.5g, auxiliary agent 5g.
A) above-mentioned formula material mix and blend is disperseed 1-2h, at ball milling in gained material input ball mill
Reason, makes 10000-hole sieve surplus≤0.05% of gained material；
B) material of step (1) gained is dried at 80-100 DEG C, keeps moisture content≤0.02% of material,
Compressing by sending in mould after powder body grinding distribution 40-50min subsequently, under nitrogen atmosphere with
After the temperature sintering 4-6h of 650-700 DEG C, through naturally cooling to room temperature and get final product.
Above content is only citing made for the present invention and explanation, affiliated those skilled in the art
Described specific embodiment is made various amendment or supplements or use similar mode to substitute, as long as
Without departing from invention design or surmount scope defined in the claims, the guarantor of the present invention all should be belonged to
Protect scope.
Claims (4)
1. a LED lamp bead mounting circuit boards light-reflection layer heat radiation coating, it is characterised in that by following heavy
The raw material of amount part is made: aluminum 82-85, aluminium nitride 12-14, calcium hexaluminate 4-5, Borax 1-2, nano oxygen
Change cerium 2-4, nano titanium oxide 5-8, Palladous nitrate. 0.5-1.5,500SN base oil 0.5-1.5, dialkyl group
Zinc dithiophosphate 0.5-1.5, ammonium sulfate 1-2, carbon tetrachloride 1-2, guar gum 2-4, polyphenol 2-4,
Low Density Polyethylene 0.5-1.5, auxiliary agent 4-5.
A kind of LED lamp bead mounting circuit boards light-reflection layer heat radiation coating the most according to claim 1,
It is characterized in that, be made up of the raw material of following weight portion: aluminum 85, aluminium nitride 12, calcium hexaluminate 4, Borax
1, nano-cerium oxide 3, nano titanium oxide 6, Palladous nitrate. 1,500SN base oil 1, dialkyl dithio
Zinc phosphate 1, ammonium sulfate 1, carbon tetrachloride 1, guar gum 3, polyphenol 3, Low Density Polyethylene 1, help
Agent 4.
A kind of LED lamp bead mounting circuit boards light-reflection layer heat radiation coating the most according to claim 1,
It is characterized in that, described auxiliary agent is made up of the raw material of following weight portion: polyaluminium sulfate 4-5, animal bone
8-10, sodium sand 1-3, polyimides 4-5, silver-coated copper powder 8-10, magnesium oxide 12-14, light magnesium carbonate 5-8,
Preparation method is: first cool down standby after 800-900 DEG C of temperature lower calcination 10-12h by animal bone, then will be poly-
Close aluminum sulfate to be dissolved in suitable quantity of water and be configured to the aqueous solution that concentration is 4-6%, and by the animal bone after calcining with
Other residual components puts in solution, concentrate drying after mix and blend dispersion 2-3h, grinds to form 300-400 mesh
Fine powder, to obtain final product.
4. a kind of LED lamp bead mounting circuit boards light-reflection layer heat radiation coating as claimed in claim 1, its
Production method is as follows: above-mentioned formula material mix and blend is disperseed 1-2h by (1), and gained material is put into ball milling
Ball-milling treatment in machine, makes 10000-hole sieve surplus≤0.05% of gained material；
(2) material of step (1) gained is dried at 80-100 DEG C, the moisture content of holding material≤
0.02%, compressing, under nitrogen atmosphere by sending in mould after powder body grinding distribution 40-50min subsequently
After sintering 4-6h with the temperature of 650-700 DEG C, through naturally cooling to room temperature and get final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610378558.2A CN105885481A (en) | 2016-05-31 | 2016-05-31 | LED lamp bead installation circuit board surface light reflection layer cooling coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610378558.2A CN105885481A (en) | 2016-05-31 | 2016-05-31 | LED lamp bead installation circuit board surface light reflection layer cooling coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105885481A true CN105885481A (en) | 2016-08-24 |
Family
ID=56710695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610378558.2A Pending CN105885481A (en) | 2016-05-31 | 2016-05-31 | LED lamp bead installation circuit board surface light reflection layer cooling coating |
Country Status (1)
| Country | Link |
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| CN (1) | CN105885481A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107987624A (en) * | 2017-12-07 | 2018-05-04 | 安徽新欧电子科技有限公司 | A kind of LED circuit board light-reflection layer heat radiation coating |
| EP3705061A3 (en) * | 2019-03-08 | 2020-11-25 | Ethicon LLC | Staple height indicator for powered surgical stapler |
| US11116508B2 (en) | 2019-03-08 | 2021-09-14 | Cilag Gmbh International | Electrical potential shifting circuit for powered surgical stapler |
| US11123075B2 (en) | 2019-03-08 | 2021-09-21 | Cilag Gmbh International | Circular surgical stapler |
| US11224432B2 (en) | 2019-03-08 | 2022-01-18 | Cilag Gmbh International | Timer circuit to control firing of powered surgical stapler |
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| CN107987624A (en) * | 2017-12-07 | 2018-05-04 | 安徽新欧电子科技有限公司 | A kind of LED circuit board light-reflection layer heat radiation coating |
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| US11147559B2 (en) | 2019-03-08 | 2021-10-19 | Cilag Gmbh International | Staple height indicator for powered surgical stapler |
| US11224432B2 (en) | 2019-03-08 | 2022-01-18 | Cilag Gmbh International | Timer circuit to control firing of powered surgical stapler |
| US12082817B2 (en) | 2019-03-08 | 2024-09-10 | Cilag Gmbh International | Power control circuit for powered surgical stapler |
| CN115849915A (en) * | 2022-12-23 | 2023-03-28 | 福建华清电子材料科技有限公司 | Aluminum nitride ball rolling forming method |
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