CN105881198A - Adsorption gasket used for polishing template - Google Patents
Adsorption gasket used for polishing template Download PDFInfo
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- CN105881198A CN105881198A CN201410857872.XA CN201410857872A CN105881198A CN 105881198 A CN105881198 A CN 105881198A CN 201410857872 A CN201410857872 A CN 201410857872A CN 105881198 A CN105881198 A CN 105881198A
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- layer
- polyurethane resin
- adsorption
- epoxy
- gasket
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- 238000001179 sorption measurement Methods 0.000 title claims abstract description 39
- 238000005498 polishing Methods 0.000 title claims abstract description 19
- 229920005749 polyurethane resin Polymers 0.000 claims abstract description 29
- 239000011342 resin composition Substances 0.000 claims abstract description 13
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 8
- 239000004970 Chain extender Substances 0.000 claims description 7
- 239000000654 additive Substances 0.000 claims description 7
- -1 glycidyl ester Chemical class 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 239000004814 polyurethane Substances 0.000 claims description 7
- 150000005846 sugar alcohols Polymers 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 6
- 239000005056 polyisocyanate Substances 0.000 claims description 6
- 229920001228 polyisocyanate Polymers 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- 150000003384 small molecules Chemical class 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 5
- 239000004088 foaming agent Substances 0.000 claims description 5
- 239000004745 nonwoven fabric Substances 0.000 claims description 5
- 229920002635 polyurethane Polymers 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 3
- 230000001413 cellular effect Effects 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 239000003086 colorant Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims description 2
- 239000005871 repellent Substances 0.000 claims description 2
- 230000002940 repellent Effects 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- QGLWBTPVKHMVHM-KTKRTIGZSA-N (z)-octadec-9-en-1-amine Chemical compound CCCCCCCC\C=C/CCCCCCCCN QGLWBTPVKHMVHM-KTKRTIGZSA-N 0.000 claims 1
- 239000004821 Contact adhesive Substances 0.000 claims 1
- 239000004831 Hot glue Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 235000010358 acesulfame potassium Nutrition 0.000 claims 1
- 239000010426 asphalt Substances 0.000 claims 1
- 230000003139 buffering effect Effects 0.000 claims 1
- 239000000470 constituent Substances 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 239000000741 silica gel Substances 0.000 claims 1
- 229910002027 silica gel Inorganic materials 0.000 claims 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims 1
- 230000006835 compression Effects 0.000 abstract description 8
- 238000007906 compression Methods 0.000 abstract description 8
- 239000002131 composite material Substances 0.000 abstract description 6
- 238000011084 recovery Methods 0.000 abstract description 3
- 239000012948 isocyanate Substances 0.000 description 9
- 150000002513 isocyanates Chemical class 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 229920005862 polyol Polymers 0.000 description 4
- 150000003077 polyols Chemical class 0.000 description 4
- GTACSIONMHMRPD-UHFFFAOYSA-N 2-[4-[2-(benzenesulfonamido)ethylsulfanyl]-2,6-difluorophenoxy]acetamide Chemical compound C1=C(F)C(OCC(=O)N)=C(F)C=C1SCCNS(=O)(=O)C1=CC=CC=C1 GTACSIONMHMRPD-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 101710130081 Aspergillopepsin-1 Proteins 0.000 description 3
- 102100031007 Cytosolic non-specific dipeptidase Human genes 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 238000010189 synthetic method Methods 0.000 description 3
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 229920001730 Moisture cure polyurethane Polymers 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical group CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- MTZUIIAIAKMWLI-UHFFFAOYSA-N 1,2-diisocyanatobenzene Chemical group O=C=NC1=CC=CC=C1N=C=O MTZUIIAIAKMWLI-UHFFFAOYSA-N 0.000 description 1
- ZTNJGMFHJYGMDR-UHFFFAOYSA-N 1,2-diisocyanatoethane Chemical compound O=C=NCCN=C=O ZTNJGMFHJYGMDR-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical class C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- 239000004135 Bone phosphate Substances 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical class NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- DNNXXFFLRWCPBC-UHFFFAOYSA-N N=C=O.N=C=O.C1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C1=CC=CC=C1 DNNXXFFLRWCPBC-UHFFFAOYSA-N 0.000 description 1
- 241001597008 Nomeidae Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- 235000011089 carbon dioxide Nutrition 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001112 coagulating effect Effects 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- UZBQIPPOMKBLAS-UHFFFAOYSA-N diethylazanide Chemical compound CC[N-]CC UZBQIPPOMKBLAS-UHFFFAOYSA-N 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 229940059574 pentaerithrityl Drugs 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 238000007540 photo-reduction reaction Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Landscapes
- Polyurethanes Or Polyureas (AREA)
Abstract
The invention relates to an adsorption gasket used for a polishing template. The adsorption gasket is characterized in that the adsorption gasket comprises gasket bodies located in gasket containing holes of the polishing template. The adsorption gasket is of a composite structure formed by three layer-shaped objects. The composite structure sequentially comprises a first layer, namely, an elastic porous adsorption layer formed by a solvent-free polyurethane resin composition, a second layer, namely, an attaching layer, and a third layer, namely, a buffer layer from top to bottom. The gasket is environment-friendly and good in adsorption strength, has a high compression ratio and a high compression recovery rate and can make a polishing workpiece and the adsorption gasket easily separated.
Description
Technical field
The present invention relates to a kind of polishing template adsorption gasket, belong to CMP art.
Background technology
Chemically mechanical polishing (CMP) is presently the most universal semiconductor material surface planarizing technique, and it is to be rubbed by machinery
Wipe the technique formed that combines with chemical attack, take into account the advantage of the two thus obtain more perfect wafer surface.Throwing
In photoreduction process, be provided with put film perforation polishing template must use adsorption gasket adsorb with fixed polished workpiece and with repeat
Mill is rubbed in rule action with the hands, and described polishing workpiece is such as quasiconductor, stores media base material, integrated circuit, LCD flat panel glass
With objects such as photoelectric panels.Polishing effect is played an important role by the quality of described adsorption gasket.
Conventional synthesis needs to consume substantial amounts of organic solvent with dilution polyurethane resin, and environment causes the biggest pollution.Along with
Expanding economy and the enhancing of people's environmental consciousness, various countries scientist starts to develop new synthesis technique, few with or without having
Machine solvent.Further, the isocyanate material of synthesis of polyurethane is poisonous, in course of reaction, has part trip
From isocyanates evaporate, therefore base polyurethane prepolymer for use as is modified process, especially base polyurethane prepolymer for use as is entered
Row end capping reaction is necessary.
Therefore, it is necessary to provide a kind of environment-friendly type adsorption gasket improving composition material.
Summary of the invention
It is an object of the invention to provide a kind of environment-friendly type adsorption gasket improving adsorption gasket structure and composition material thereof, this
The composite construction that adsorption gasket is made up of three nonwoven fabric from filaments, described composite construction is followed successively by from top to bottom: ground floor is by nothing
The elastic cellular adsorption layer of solvent polyurethane resin combination composition, the second layer is laminating layer, and third layer is cushion.
Detailed description of the invention
For present disclosure, feature and effect can be further appreciated that, hereby enumerate following example, describe in detail as follows:
The adsorption layer of the adsorption gasket of this enforcement state is made up of no-solvent polyurethane compositions, has the foaming that uniformity is good
Hole, shows high compression ratio and compresses and restorative make polished workpiece in polishing process firm can must be fixed on absorption
On pad, it is squeezed in process of lapping and can get rid of inner air formation low pressure, and the addition of cushion can make absorption layer have
There is preferably compressibility, and then make absorption affinity strengthen.
Depending on the thickness of described adsorption gasket can require according to different chips polishing.
The material of this adsorption gasket is solvent-free polyurethane resin compositions.Building-up process does not use organic solvent.Organic
Solvent, from environment-friendly type, toxicity, is all worthless from the standpoint of energy efficiency.Environment-friendly solvent-free or employing non-organic solvent
Common concern by people.
This solvent-free polyurethane resin compositions includes 75-85% polyurethane resin, 1-5% chain extender, 1-3% foaming agent, 1-5%
(+)-2,3-Epoxy-1-propanol type epoxy resin, small-molecule substance containing reactive hydrogen and suitable additive.
Described polyurethane resin composition is to obtain by making polyalcohols polyisocyanate esters carry out to react and harden.
Described isocyanate ester compound can include aromatic series, aromatic-aliphatic, aliphatic, alicyclic diisocyanate and
Its derivant etc..Its concrete example include toluene di-isocyanate(TDI), ethylene diisocyanate, m-benzene diisocyanate, to benzene
Diisocyanate, adjacent phenylene diisocyanate, Tetramethylene .-1,3-diisocyanate, hexamethylene-1,3-diisocyanate, 2,
2 '-'-diphenylmethane diisocyanate, isophorone diisocyanate, Carbodiimide-Modified 4,4 ' diphenyl methane two isocyanide
One in acid esters or two of which mixture.
Described polyhydric alcohol can include PEPA, one in polyether polyol and more than.
Described PEPA is formed with polyol condensating by organic polycarboxylic acid.Polyhydric alcohol include ethylene glycol, propylene glycol, one
One or both mixture in diglycol ethylene, tetramethylolmethane.
Described polyether polyol includes one or both in Polyoxypropylene diol, polyether Glycols, polyether-tribasic alcohol
Mixture.
Described chain extender can include two kinds in dihydromethyl propionic acid (DMPA), ethylene glycol, BDO.By control
Chain extender mol ratio processed, it is possible to make polyurethane resin composition have suitable density or hardness, to meet different-thickness suction
The requirement of attached pad and guarantee suitable compression ratio and compression and back elastic force.Described chain extender can account in whole polyurethane resin
1-5%.
Described foaming agent can include doing main component with water, with methane dioxide, carbonic acid gas, azodiisobutyronitrile, azo two
Methanamides etc. are two or more.The 1-3% in whole polyurethane resin can be accounted for.
Described solvent-free polyurethane resin compositions also can add catalyst, water repellent, filler, pore opening regulation
One or more additives in agent and colorant.
One or more in the optional amine of described catalyst, organic titanic compound, organo-tin compound, the most organic
Tin compound, concrete example is dibutyl tin laurate, and its consumption accounts for the 0.5-5% in whole polyurethane resin.
The described small-molecule substance containing reactive hydrogen for and remain the reaction of unreacted polyisocyanate, described containing reactive hydrogen
In the optional diethylamide of small-molecule substance, aniline, ethanol, water, phenol, acetic acid, acetamide, carbamate one
Kind.
The building-up process of described solvent-free polyurethane resin compositions adds (+)-2,3-Epoxy-1-propanol type epoxy resin to polyurethane
(partly) performed polymer carries out end capping reaction.
The present invention can use semi-prepolymer synthetic method, performed polymer synthetic method and one-step method etc. to carry out, preferably half pre-polymerization
Body synthetic method, the ratio of the amount controlling the material of polyisocyanate and PEPA is more than 2: 1, obtains isocyanate terminated
With free isocyanates.
Containing above-mentioned polyol component, polyisocyanate, chain extender, foaming agent, the small-molecule substance containing reactive hydrogen with
And in the urethane composition of the present invention of suitable additive etc., the mixed proportion of its composition, as long as can be by this
The foaming of urethane compositions, obtains the purpose with high-compressibility and compression resilience as the present invention, then this mixing
Ratio has no particular limits.
Accompanying drawing explanation
Fig. 1 is a kind of sectional view polishing template of patent of the present invention
Fig. 2 is a kind of sectional view polishing template adsorption gasket of patent of the present invention
Primary clustering symbol description
1. polishing template 2. puts film perforation 3. adsorption gasket 4. adsorption layer 5. laminating layer 6. cushion
Detailed description of the invention
For present disclosure, feature and effect can be further appreciated that, hereby enumerate following example, and coordinate accompanying drawing detailed
It is described as follows:
With reference to Fig. 1, for the sectional view of described polishing template 1.It includes putting film perforation 2 and adsorption gasket 3.
With reference to Fig. 2, for the sectional view of described adsorption gasket.It includes three nonwoven fabric from filaments, and nonwoven fabric from filaments is followed successively by from top to bottom:
Ground floor is to have resilient adsorption layer 4, and the second layer is laminating layer 5, and third layer is cushion 6.
First, polyisocyanate, polyhydric alcohol, dibutyl tin laurate are put in vacuum response container, begins to warm up
Stirring is warming up to 80 degree, and the viscosity in regulation course of reaction, isothermal reaction 1-2 hour, treat that isocyanates reaches reason simultaneously
After opinion value, reduction temperature, to 40 degree, is slowly added to (+)-2,3-Epoxy-1-propanol type epoxy resin, carries out polyurethane (partly) performed polymer
End capping reaction, is subsequently adding reactive hydrogen small-molecule substance, reaction temperature 50-70 degree, reacts 1-2 hour, add chain extension afterwards
Agent, carries out chain extending reaction 1-10 minute.
Polyurethane resin prepared by mixing and additive, carry out high-speed stirred 5-15 minute, at 2000-5000rpm bar
It is centrifuged 5-15 minute under part, it is thus achieved that the slurry of polyurethane resin composition.By described obtained polyurethane resin composition
It is coated on polyethylene terephthalate (PET) or polybutylene terephthalate (PBT) thin film, in coagulating basin
After solidifying, wash, be dehydrated, prepare the polyurethane resin adsorption layer for adsorption gasket after drying.
Control ratio and chain extender, the foaming agent of polyhydric alcohol and isocyanates, small-molecule substance containing reactive hydrogen and suitably
Additive, the adsorption strength of the adsorption gasket prepared is 2.8～3.2kg/12.25cm2, its compression ratio up to 50%,
And its compressive recovery rate is up to 96%.
Being known by above-mentioned, if using polyhydric alcohol and the polyurethane resin composition of the specific ratio of isocyanates, one can be prepared
Plant higher compression ratio and the environment-protecting polyurethane resin combination of higher recovery.
These are only the explanation principle of the present invention and effect thereof, and the unrestricted present invention.Therefore the personage in this technology it is familiar with
Modify to above-mentioned and change the spirit without departing from the present invention.The interest field of the present invention should claim as mentioned
Listed.
Claims (8)
1. polishing a template adsorption gasket, it includes three nonwoven fabric from filaments, and nonwoven fabric from filaments is followed successively by from top to bottom: ground floor
The elastic cellular adsorption layer being made up of solvent-free polyurethane resin compositions, the second layer is laminating layer, and third layer is buffering
Layer.
A kind of polishing template adsorption gasket the most according to claim 1, it is characterised in that: described adsorption gasket
Ground floor is the adsorption layer with elastic cellular, and its material is solvent-free polyurethane resin constituent；Described adsorption gasket
The second layer is laminating layer, and the material of described laminating layer is contact adhesive, silica gel, PU resin or hot melt adhesive；Described absorption
The third layer of pad is cushion, and the material of cushion is similar to ground floor, but more preferable than the compressibility of ground floor.
A kind of polishing template adsorption gasket the most according to claim 1, it is characterised in that: described adsorption gasket
Depending on thickness can require according to different chips polishing.
Solvent-free polyurethane resin compositions the most according to claim 2, it is characterised in that: described new polyurethane
Resin combination includes 75-85% polyurethane resin, 1-5% chain extender, 1-3% foaming agent, 1-5% (+)-2,3-Epoxy-1-propanol type asphalt mixtures modified by epoxy resin
Fat, small-molecule substance containing reactive hydrogen and suitable additive.
Solvent-free polyurethane resin compositions the most according to claim 2, it is characterised in that: described is solvent-free poly-
Urethane resin combination also can add the one in catalyst, water repellent, filler, pore opening regulator and colorant or
Multiple additives.
(+)-2,3-Epoxy-1-propanol type epoxy resin the most according to claim 4, it is characterised in that: described (+)-2,3-Epoxy-1-propanol type ring
The (+)-2,3-Epoxy-1-propanol type epoxy resin that epoxy resins is described is that (+)-2,3-Epoxy-1-propanol resin, glycidyl ester epoxy resin, shrink are sweet
One or more in oleyl amine based epoxy resin.
Polyurethane resin the most according to claim 6, it is characterised in that: described solvent-free polyurethane resin combination
Thing by be polyalcohols and polyisocyanate esters reaction obtain.
Polyurethane resin the most according to claim 6, it is characterised in that: described solvent-free polyurethane resin combination
The building-up process of thing adds (+)-2,3-Epoxy-1-propanol type epoxy resin polyurethane (partly) performed polymer is carried out end capping reaction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410857872.XA CN105881198A (en) | 2014-12-29 | 2014-12-29 | Adsorption gasket used for polishing template |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410857872.XA CN105881198A (en) | 2014-12-29 | 2014-12-29 | Adsorption gasket used for polishing template |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105881198A true CN105881198A (en) | 2016-08-24 |
Family
ID=56998848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410857872.XA Pending CN105881198A (en) | 2014-12-29 | 2014-12-29 | Adsorption gasket used for polishing template |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105881198A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109605137A (en) * | 2018-12-27 | 2019-04-12 | 衢州晶哲电子材料有限公司 | A kind of unpowered rotation of silicon wafer is without wax polishing template and its polishing method |
| CN110900438A (en) * | 2019-12-18 | 2020-03-24 | 上海超硅半导体有限公司 | Wafer polishing device and method |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1330581A (en) * | 1998-11-09 | 2002-01-09 | 东丽株式会社 | Polishing pad and polishing device |
| CN1476367A (en) * | 2000-12-01 | 2004-02-18 | �����֯��ʽ���� | Polishing pad, manufacturing method thereof, and buffer layer for polishing pad |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109605137A (en) * | 2018-12-27 | 2019-04-12 | 衢州晶哲电子材料有限公司 | A kind of unpowered rotation of silicon wafer is without wax polishing template and its polishing method |
| CN110900438A (en) * | 2019-12-18 | 2020-03-24 | 上海超硅半导体有限公司 | Wafer polishing device and method |
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