CN105880114B - Filling type L ED fluorescent powder film coating device - Google Patents

Abstract

The invention relates to a technology for manufacturing and coating an optical fluorescent powder film, and provides a filling type L ED fluorescent powder film coating device which can accurately control the thickness of a formed film.

Description

A filling type LED phosphor coating device

technical field

The invention belongs to the field of optics, and relates to an optical phosphor film production and application technology, which is mainly used for the film formation and application of the fluorescent film in the production process of LED lighting appliances.

Background technique

At present, due to the limitations of phosphor coating technology in LED lamps and LED light-emitting devices, the illumination effect is not good: there are phenomena such as light spots, yellow-green edges, and color coordinate drift. Therefore, LED phosphor film coating technology has become a key technology in the production process of lamps. If the LED phosphor coating is not uniform or the thickness accuracy does not meet the requirements, it will cause deviations in light color and light guidance. Therefore, LED phosphor coating The quality of technology is directly related to the qualified rate of finished products. However, the existing LED phosphor film production and application technology is only achieved by brushing, roller pressing or exposure molding, which cannot accurately control the thickness of the LED phosphor film, nor can it control the thickness of the LED phosphor film. Uniformity of overall thickness. The defects of the prior art greatly reduce the pass rate of lamp products. Seriously limit the development of light control field.

Contents of the invention

Aiming at the technical problems existing in the prior art, the object of the present invention is to provide a new device and solution for making and applying LED phosphor film. A filling type LED phosphor coating device is provided. The overall structure of the present invention includes: a host, a keyboard, a display, a carrier board, a cover pressure module, a thickness control module, a module for injecting LED phosphor and silica gel mixture, a casing and a transmission mechanism . The thickness control module is composed of a precision screw and a servo motor. The conveying mechanism conveys the carrier on the assembly line to directly below the capping module. The casing is provided with position control sensors, which are respectively located on both sides of the casing. The cover pressing module includes: a cover pressing plate, a connecting seat arranged on the cover pressing plate, an ultrasonic device for defoaming or cleaning, a port for injecting fluorescent powder and silica gel mixture, a thickness sensor, a filling sensor and a demoulding liquid injection and air charging port. The connecting seat is connected with the tight screw rod of the thickness control module, and the up and down movement of the cover pressure module is controlled by the thickness control module, forming a film-forming space of a certain thickness with the carrier plate, thereby controlling the film-forming thickness of the LED fluorescent film. The injection module is connected with the injection port, and the mixture of LED fluorescent powder and silica gel is injected into the film-forming space with adjusted thickness through the injection port. The thickness sensor senses the thickness of the LED fluorescent film in real time. The defoaming or cleaning ultrasonic device is started when the mixture of LED phosphor and silica gel is injected into the film-forming space to remove the bubbles of the mixture of LED phosphor and silica gel in the film-forming space. The fill sensor sends out a fill signal when the injected phosphor and silicone mixture flows to the fill sensor. After the film is filled, inject gas or volatile liquid from the mold release injection liquid filling port to separate the formed LED fluorescent film from the cover pressure module.

The film-forming plane of the carrier plate of the present invention is an inclined plane, the lower part is located under the injection port, and the upper part is located under the filling sensor. The lower bottom surface of the cover pressing plate at the lower part of the cover pressing module is parallel to the inclined plane of the carrier plate, thus forming a uniform thickness injection film-forming space. The mixture of LED phosphor and silica gel is injected into the film-forming space from the injection port. Due to the LED phosphor and The density of the silicone mixture is higher than that of air. The mixture of LED phosphor and silica gel is slowly filled from the bottom, and the air above is expelled. When the mixture of LED phosphor and silica gel is filled, the air in the space has been excluded, and the sensor will sense the film formation when it is filled. Liquid, fill sensors are actually thickness sensors with vent holes. A plurality of heating devices are arranged inside the cover press plate at the lower part of the cover press module to accelerate the curing of the mixture of LED phosphor powder and silica gel.

The control flow of each module of the present invention is as follows: the host computer starts the self-test program after starting up; the host computer loads the control parameters input through the keyboard, starts the transmission mechanism to transmit the carrier board, and under the cooperation of the position control sensor, the carrier board is transferred to the cover press. Right below the module; the thickness control module controls the operation of the cover pressure module under the cooperation of the thickness sensor until a film-forming space with precise thickness is formed with the carrier plate; the thickness sensor transmits the LED fluorescent film thickness monitoring value to the host in real time during the injection process At the same time, turn on the defoaming or cleaning of the ultrasonic device to remove the bubbles formed in the LED phosphor and silica gel mixture and during the injection process; when the film thickness data detected by the full sensor and the film thickness sensor are consistent, it indicates that the glue has been filled. The signal is transmitted to the host, and the host sends an instruction to the injection valve in the injection module to stop the injection; then, the host sends a signal to the heating device to accelerate the curing of the mixture of LED phosphor powder and silica gel to form an LED phosphor film. The host sends a signal to open the demoulding according to the set time, and the demoulding gas or liquid is injected from the demoulding liquid injection port, so that the cured LED fluorescent film is separated from the cover pressure plate under the cover pressure module, and the transmission mechanism will carry the carrier plate 1 Send away together with the cured and formed LED fluorescent film. Continuous production can be achieved by repeating the above process. In order to improve the light-emitting effect of the light-emitting device, the film-forming space formed between the upper surface of the carrier plate and the lower surface of the cover plate can be designed into a corresponding shape according to the light distribution characteristics, and the surfaces on both sides are polished or frosted. deal with.

The present invention will be further described below in conjunction with specific embodiments with reference to the accompanying drawings.

Description of drawings

Fig. 1 is the overall structure schematic diagram of the present invention;

Fig. 2 is the schematic diagram of the disassembled state of the module of the present invention;

Fig. 3 is the schematic diagram of casing and positioning device of the present invention;

Fig. 4 is a schematic diagram of the internal structure of the present invention;

Fig. 5 is a structural schematic diagram of the cover pressing plate and the base of the present invention;

Fig. 6 is a schematic diagram of the injection film forming space of the present invention;

Figure 7 is a schematic diagram of heat curing of the present invention;

Fig. 8 is a schematic diagram of the control flow of the present invention;

The symbols in the figure are

1 - carrier board;

2-Cover pressure module, 21-Cover pressure plate, 22-Connecting seat, 23-Defoaming or cleaning ultrasonic devices, 24-Injection port, 25-Thickness sensor, 26-Fill sensor, 27-Demolding liquid injection Inflatable port, 28-heating device;

3-thickness control module, 31-tight screw, 32-servo motor;

4-Injection module, 41-Material box, 42-Injection valve;

5-chassis, 51-position control sensor;

6 - Transmission mechanism.

Detailed ways

The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

As shown in FIG. 1 and FIG. 2 , the overall structure of the present invention includes: a carrier plate 1 , a cover pressing module 2 , a thickness control module 3 , a material injection module 4 , a casing 5 , and a transmission mechanism 6 . Wherein the thickness control module 3 is composed of two parts, a compact screw rod 31 and a servo motor 32 . The injection module 4 is composed of a material box 41 and a material injection valve 42 arranged at the lower end of the material box 41 . The conveying mechanism 6 conveys the carrier board 1 on the assembly line to directly below the capping module 2 .

As shown in FIG. 3 , position control sensors 51 are disposed on the casing 5 , respectively located on both sides of the casing 5 .

As shown in Fig. 2 and Fig. 4, the cover press module 2 of the present invention is provided with a cover press plate 21, on which the cover press plate 21 is provided with a connection seat 22, a defoaming or cleaning ultrasonic device 23, a material injection port 24, and a thickness sensor 25 , Filling the sensor 26, demoulding liquid injection filling port 27. The connection seat 22 is connected with the tight screw 31 of the thickness control module 3, through which the thickness control module 3 controls the up and down movement of the capping module 2, and forms a space with a certain thickness with the carrier plate 1, thereby controlling the thickness of the film. The injection module 4 is connected with the injection port 24, and the mixture of LED fluorescent powder and silica gel is injected into the film-forming space with adjusted thickness through the injection port 24. The thickness sensor 25 senses the thickness of the film in real time. The defoaming or cleaning ultrasonic device 23 is turned on when the mixture of LED fluorescent powder and silica gel is injected into the film-forming space, and the bubbles formed during the injection process are removed. When the injected LED phosphor and silica gel mixture flows to the full sensor 26, the detection data of the full sensor 26 is compared with the detection data of the thickness sensor 25, and when the data are consistent, a full signal is sent. After the film is filled, gas or volatile liquid is injected from the mold release injection liquid filling port 27 to separate the formed LED fluorescent film from the capping module 2 .

As shown in FIG. 5 and FIG. 6 , the film-forming plane of the carrier 1 of the present invention is an inclined plane, the lower part is located below the injection port 23 , and the higher part is located under the filling sensor 26 . The bottom surface of the cover press plate 21 at the lower part of the cover press module 2 is parallel to the inclined plane of the carrier plate 1 , thereby forming a film-forming space for LED fluorescent films with uniform thickness. In order to improve the light-emitting effect of the light-emitting device, the film-forming space formed between the upper surface of the carrier plate 1 and the lower surface of the cover plate 21 can be designed into a corresponding shape according to the light distribution characteristics, and the surfaces on both sides are polished or frosted. Wait for processing.

As shown in Figure 6, the mixture of LED phosphor and silica gel of the present invention is injected from the injection port 23. Since the density of the mixture of LED phosphor and silica gel is greater than that of air, the liquid is slowly filled from the bottom and the air above is squeezed out. When the LED phosphor and silica gel The filling of the mixture means that the air in the space has been removed, and the filling sensor 26 will sense the mixture of LED fluorescent powder and silica gel.

As shown in FIG. 7 , a plurality of heating devices 28 are arranged inside the cover press plate 21 at the lower part of the cover press module 2 of the present invention to accelerate the curing of the mixture of LED phosphor powder and silica gel.

As shown in Fig. 8, the control flow of each module of the present invention is: host A starts the self-test program after starting up; host A loads the control parameters input through the keyboard C, starts the transmission mechanism 6 to transmit the carrier board 1, and controls the sensor at the position With the cooperation of 51, the carrier plate 1 is transferred to the right below the capping module 2; the thickness control module 3 controls the operation of the capping module 2 under the cooperation of the thickness sensor 25, until a film-forming space with precise thickness is formed with the carrier plate 1 ; During the filling process, the thickness sensor 25 transmits the thickness monitoring value to the host A in real time, and simultaneously opens the defoaming or cleaning ultrasonic device 23 to remove the bubbles formed in the mixture of LED fluorescent powder and silica gel and during the filling process; The full sensor 26 transmits a signal to the host A, and the host A sends an instruction to the injection valve 42 in the injection module 4 to stop the injection; then, the host A sends a signal to the heating device 28 to accelerate the curing of the LED phosphor and the silica gel mixture to form LED fluorescent film. Host A sends a signal to start the demoulding according to the set time, and injects demoulding gas or liquid through the demoulding injection liquid injection port 27, so that the cured LED fluorescent film is separated from the cover pressing plate 21 under the cover pressing module 2, and the The mechanism 6 sends away the carrier board 1 together with the cured and formed LED fluorescent film. Continuous production can be achieved by repeating the above process.

Claims (7)

1. A filling type LED phosphor coating device, comprising: a host, a keyboard, a display, a carrier plate, a cover pressure module, a thickness control module, a material injection module, a casing and a transmission mechanism, characterized in that: the thickness control The module is composed of a tight screw and a servo motor; the injection module is composed of a material box and an injection valve located at the lower end of the material box; Soak or clean the ultrasonic device, material injection port, thickness sensor, filling sensor and demoulding injection liquid filling port; the connecting seat is connected with the tight screw of the thickness control module, and the up and down movement of the cover pressure module is controlled by the thickness control module , form a space with a certain thickness with the carrier plate, so as to control the thickness of the LED fluorescent film; film space; the thickness sensor senses the thickness of the film in real time; when the injected liquid flows to the full sensor, the full sensor sends a full signal; Gas or volatile liquid is injected into the gas filling port to separate the formed LED fluorescent film from the cover pressure module. 2. A filling-type LED phosphor film coating device as claimed in claim 1, characterized in that: said carrier plate is provided with an inclined film-forming plane, the lower part is located below the injection port, and the upper part is located under the injection port. The lower part of the full sensor; the lower bottom surface of the cover press plate at the lower part of the cover press module is parallel to the inclined plane of the carrier plate, thereby forming a uniform thickness injection film forming space. 3. A filling-type LED phosphor coating device as claimed in claim 1, characterized in that: the control flow of each module is as follows: the host starts the self-test program after starting up; the host loads the control parameters input through the keyboard, and starts The conveying mechanism transfers the carrier board, and with the cooperation of the position control sensor, the carrier board is transferred to the right below the cover pressing module; the thickness control module controls the operation of the cover pressing module under the cooperation of the thickness sensor until it forms a precise thickness with the carrier board. The film-forming space; during the filling process, the thickness sensor transmits the thickness monitoring value to the host in real time, and at the same time turns on the defoaming or cleaning the ultrasonic device to remove the bubbles formed in the film-forming liquid during the filling process; when filling, the filling sensor The device transmits a signal to the host, and the host sends an instruction to the injection valve in the injection module to stop the injection; then, the host sends a signal to the heating device to accelerate the curing of the LED phosphor and silica gel mixture to form an LED fluorescent film; the host sends a command according to the set Timely send the demoulding signal, inject gas or volatile liquid from the demoulding liquid injection port, so that the cured LED fluorescent film is separated from the cover pressure plate under the cover pressure module, and the transmission mechanism will carry the carrier plate together with the cured and formed LED The fluorescent film is sent away. 4. A filling-type LED phosphor coating device as claimed in claim 1, characterized in that: the casing is provided with position control sensors, which are respectively located on both sides of the casing; the transmission mechanism conveys the assembly line When the carrier on the top reaches the bottom of the cover pressure module, it is precisely positioned with the cooperation of the position sensor. 5. A filling-type LED phosphor coating device as claimed in claim 1, characterized in that: said defoaming or cleaning ultrasonic device is turned on during injection, and the mixture of LED phosphor and silica gel during injection can be removed In addition to the formation of air bubbles, it also acts as a device for cleaning itself. 6. A filling-type LED phosphor coating device as claimed in claim 1, characterized in that: a plurality of heating devices are arranged inside the cover press plate at the lower part of the cover press module to accelerate the curing of the film-forming liquid. effect. 7. A filling-type LED phosphor coating device as claimed in claim 2, characterized in that: the film-forming space can be designed into a corresponding shape according to the light distribution characteristics, and the surfaces on both sides are polished or frosted deal with.