CN105870211A - Optical sensor packaging structure and manufacturing method thereof - Google Patents

Abstract

The invention discloses an optical sensor packaging structure and a manufacturing method thereof. A first plane section and a second plane section at different heights, and a connection between the first plane section and the second plane section are arranged on the metal casing. segment; wherein, the optical sensor chip and the LED chip are installed on different sides of the first plane segment and the second plane segment respectively; the first plane segment or the second plane segment is provided with a The optical window in the optical direction of the chip; also includes a light-transmitting part for encapsulating the optical sensor chip and the LED chip on the metal casing. In the packaging structure of the present invention, the optical sensor chip and the LED chip package can realize complete optical isolation through the connecting section; the manufacturing cost can not only be greatly reduced, but also the manufacturing process can be simplified, and it can be obtained only by traditional punching, which improves the packaging efficiency. The flexibility, and the optical isolation effect of the metal shell is better.

Description

A kind of optical sensor packaging structure and manufacturing method thereof

technical field

The present invention relates to a packaging structure of a chip, and more specifically, the present invention relates to a packaging structure of an optical sensor.

Background technique

At present, optical sensors are more and more widely used in consumer electronics, such as mobile phones, smart watches, smart bracelets, etc. Using optical sensors, proximity light detection, ambient light detection, heart rate detection, blood oxygen detection, gesture recognition, etc. can be realized. The basic principle is that the LED chip emits light of a specific wavelength. After the light reaches the object to be measured, it will return a beam of light related to the object to be measured, and reach the optical receiving area of the optical receiving chip, referred to as PD.

Generally speaking, when packaging, the chip is first mounted on the PCB board, the electrodes on the chip are connected to the pins on the PCB board through the leads, and then the optical sensor and the LED chip are sealed with light-transmitting materials. Plastic packaging to protect the chip and complete the package. The optical sensor of this design has poor optical isolation performance, and the manufacturing process is relatively complicated.

Contents of the invention

An object of the present invention is to provide a new technical solution for the packaging structure of an optical sensor.

According to the first aspect of the present invention, an optical sensor packaging structure is provided, including a metal housing, an optical sensor chip, and an LED chip. The metal housing is provided with a first plane segment and a second plane segment at different heights. , and a connection section between the first plane segment and the second plane segment; wherein, the optical sensor chip and the LED chip are installed on different sides of the first plane segment and the second plane segment respectively; the first plane The segment or the second plane segment is provided with an optical window for unifying the optical direction of the optical sensor chip and the LED chip; it also includes a light-transmitting part for encapsulating the optical sensor chip and the LED chip on the metal casing.

Optionally, the optical sensor chip is mounted on the lower side of the first plane segment with its optical area facing the first plane segment, and the LED chip is mounted on the lower side of the second plane segment with its optical area facing away from the second plane segment. The upper side of the second plane segment; the optical window is arranged on the first plane segment at a position corresponding to the optical area of the optical sensor chip.

Optionally, the optical sensor chip is mounted on the lower side of the first plane segment with its optical area facing away from the first plane segment, and the LED chip is mounted on the lower side of the first plane segment with its optical area facing the second plane segment. The upper side of the second plane segment; the optical window is arranged on the second plane segment at a position corresponding to the optical area of the LED chip.

Optionally, the optical sensor chip is mounted on the upper side of the first plane segment with its optical area facing the first plane segment, and the LED chip is mounted on the upper side of the second plane segment with its optical area facing away from the second plane segment. The lower side of the second plane segment; the optical window is arranged on the first plane segment at a position corresponding to the optical area of the optical sensor chip.

Optionally, the optical sensor chip is mounted on the upper side of the first plane segment with its optical area facing away from the first plane segment, and the LED chip is mounted on the upper side of the first plane segment with its optical area facing the second plane segment. The lower side of the second plane segment; the optical window is arranged on the second plane segment at a position corresponding to the optical area of the LED chip.

Optionally, the connecting section is perpendicular to the first plane section and the second plane section.

Optionally, the metal casing further includes a plurality of pad segments for electrically connecting the optical sensor chip and the LED chip.

Optionally, the first plane segment, the second plane segment, the connecting segment, and the pad segment are formed by stamping and cutting metal plates.

Optionally, there are multiple LED chips, which are symmetrically distributed on both sides of the optical sensor chip or in a diagonal direction.

According to another aspect of the present invention, there is also provided a method for manufacturing an optical sensor packaging structure, comprising the steps of:

a) Stamping and cutting the metal plate to form a first plane segment, a second plane segment, a connection segment, an optical window and a plurality of pad segments;

b) mounting the optical sensor chip and the LED chip on different sides of the first plane segment and the second plane segment respectively;

c) Injecting a light-transmitting material to form a light-transmitting part that encapsulates the optical sensor chip and the LED chip.

In the optical sensor packaging structure of the present invention, by attaching the optical sensor chip and the LED chip on different sides of the first plane segment and the second plane segment at different heights, the LED chip and the optical sensor chip can be positioned on the first plane The connecting segment between the segment and the second planar segment realizes complete optical isolation, thereby improving the sensitivity and precision of the entire optical sensor packaging structure. Moreover, the packaging structure of the present invention adopts a metal shell, which can not only greatly reduce the manufacturing cost, but also simplifies the manufacturing process, and can be obtained only through traditional punching, which improves the flexibility of the packaging, and the metal The light isolation effect of the housing is better.

The inventors of the present invention found that in the prior art, the optical sensor chip and the LED chip are mounted on the circuit board, and it is necessary to use an opaque material to form the optical isolation part of the two chips on the circuit board, and then inject the transparent Optical materials; the optical sensor of this design has poor optical isolation performance, and the manufacturing process is relatively complicated. Therefore, the technical tasks to be achieved or the technical problems to be solved by the present invention are never thought of or expected by those skilled in the art, so the present invention is a new technical solution.

Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.

Fig. 1 is a top view of the packaging structure of the present invention.

Fig. 2 is a sectional view along A-A in Fig. 1 .

Fig. 3 is a top view of another embodiment of the packaging structure of the present invention.

FIG. 4 is a top view of a third embodiment of the packaging structure of the present invention.

FIG. 5 and FIG. 6 are flowcharts of the manufacturing process of the packaging structure in FIG. 1 .

7 and 8 are process schematic diagrams of continuous batch manufacturing of the packaging structure in FIG. 1 .

detailed description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

In all examples shown and discussed herein, any specific values should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have different values.

It should be noted that like numerals and letters denote like items in the following figures, therefore, once an item is defined in one figure, it does not require further discussion in subsequent figures.

Referring to Fig. 1 and Fig. 2, the present invention provides an optical sensor packaging structure, which includes a metal housing and an optical sensor chip 5 and an LED chip 6 arranged on the metal housing, and the optical sensor chip 5 and the LED chip 6 The light-transmitting part 7 is packaged on the metal casing. Wherein, the optical sensor chip 5 has an optical area through which the optical sensor chip 5 receives external light signals, so that corresponding control signals can be sent out according to different signals received by the optical sensor chip 5 . The LED chip 6 has an optical area through which the LED chip 6 emits light signals to the outside. The LED chip 6 cooperates with the optical sensor chip 5 to realize proximity light detection, ambient light detection, heart rate detection, blood oxygen detection, gesture recognition, etc., which belong to the common knowledge of those skilled in the art and will not be described in detail here.

The metal shell of the present invention includes a first plane section 1 and a second plane section 2 at different heights, and a connection section 3 between the first plane section 1 and the second plane section 2 . In a specific embodiment of the present invention, the first plane segment 1 is higher than the second plane segment 2 , of course, the second plane segment 2 may also be higher than the first plane segment 1 . The first plane section 1 , the second plane section 2 and the connecting section 3 can be produced by punching and cutting metal plates. For example, the first plane segment 1 can be regarded as a raised structure or a groove structure obtained after stamping relative to the second plane segment 2 . Obtaining the first plane segment 1 and the second plane segment 2 by punching a metal plate belongs to common knowledge of those skilled in the art, and will not be described in detail here.

The optical sensor chip 5 and the LED chip 6 of the present invention are respectively fixed on different sides of the first plane segment 1 and the second plane segment 2, and since the optical sensor chip 5 and the LED chip 6 are arranged on the first plane segment 1 and the second plane segment Different sides on the plane segment 2, in order to unify the optical directions of the optical sensor chip 5 and the LED chip 6, that is to say, in order to make the optical signal sent by the LED chip 6 return to the optical sensor chip 5 after passing through the measured object, it is necessary to An optical window 8 is provided on the first plane section 1 or the second plane section 2, so that the LED chip 6 or the optical sensor chip 5 can send or receive light signals through the metal casing.

In a specific embodiment of the present invention, with reference to FIG. 2, the optical sensor chip 5 is mounted on the lower side of the first plane segment 1 with its optical area facing the first plane segment 1. In order to place the optical sensor chip 5 The optical area of the optical sensor chip 5 is exposed, and the optical window 8 is arranged on the first plane segment 1 at a position corresponding to the optical area of the optical sensor chip 5 . The LED chip 6 is mounted on the upper side of the second plane segment 2 in such a way that its optical area faces away from the second plane segment 2 . Referring to the viewing direction of FIG. 2 , the optical areas of the optical sensor chip 5 and the LED chip 6 are all facing upward;

In another specific embodiment of the present invention, the optical sensor chip 5 is mounted on the lower side of the first plane segment 1 with its optical area away from the first plane segment 1, and the LED chip 6 is mounted on the lower side of the first plane segment 1 with its optical area Mounted on the upper side of the second plane segment 2 towards the second plane segment 2, at this time in order to expose the optical area of the LED chip 6, the optical window 8 is set on the second plane segment 2 corresponding to the LED chip 6 The location of the optical zone. Under this structure, the optical regions of the optical sensor chip 5 and the LED chip 6 are facing downward, and the light signal emitted by the LED chip 6 diffuses to the outside through the optical window 8 and returns to the optical sensor chip 5 when passing through the measured object.

In the third embodiment of the present invention, the optical sensor chip 5 is mounted on the upper side of the first plane segment 1 with its optical area facing the first plane segment 1, in order to expose the optical area of the optical sensor chip 5 , the optical window 8 is arranged on the first plane section 1 at a position corresponding to the optical area of the optical sensor chip 5 . The LED chip 6 is mounted on the lower side of the second plane segment 2 in such a way that its optical area faces away from the second plane segment 2 . Under this structure, the optical areas of the optical sensor chip 5 and the LED chip 6 are facing downward, and when the light signal emitted by the LED chip 6 passes through the object under test, it can return to the optical sensor chip 5 through the optical window 8 .

In the fourth embodiment of the present invention, the optical sensor chip 5 is mounted on the upper side of the first plane segment 1 with its optical area facing away from the first plane segment 1, and the LED chip 6 is mounted on the upper side of the first plane segment 1 with its optical area facing The second plane segment 2 is mounted on the lower side of the second plane segment 2; in order to expose the optical area of the LED chip 6, the optical window 8 is arranged on the second plane segment 2 corresponding to the position of the optical area of the LED chip 6 . Under this structure, the optical areas of the optical sensor chip 5 and the LED chip 6 are all facing upward, and when the optical signal emitted by the LED chip 6 diffuses to the outside world through the optical window 8, and can return to the optical sensor chip 5 when passing through the measured object .

In the optical sensor packaging structure of the present invention, by attaching the optical sensor chip and the LED chip on different sides of the first plane segment and the second plane segment at different heights, the LED chip and the optical sensor chip can be positioned on the first plane The connecting segment between the segment and the second planar segment realizes complete optical isolation, thereby improving the sensitivity and precision of the entire optical sensor packaging structure. Moreover, the packaging structure of the present invention adopts a metal shell, which can not only greatly reduce the manufacturing cost, but also simplifies the manufacturing process, and can be obtained only through traditional punching, which improves the flexibility of the packaging, and the metal The light isolation effect of the housing is better.

The first plane section 1 and the second plane section 2 of the present invention can be a plane in a horizontal state, or a plane in an inclined state. In order to improve the optical isolation effect of the optical sensor chip 5 and the LED chip 6, the connecting section 3 is relatively It is perpendicular to the first plane section 1 and the second plane section 2, so that the first plane section 1, the connecting section 3 and the second plane section 2 are approximately stepped.

In the optical sensor packaging structure of the present invention, the optical sensor chip 5 and the LED chip 6 are respectively packaged on the first plane section 1 and the second plane section 2 through the light-transmitting part 7, thereby protecting the optical sensor chip 5 and the LED chip 6. The optical area is not damaged. In the packaging structure of the present invention, the metal casing further includes a plurality of pad segments 4 for connecting the optical sensor chip 5 and the LED chip 6 . The electrical signals of the optical sensor chip 5 and the LED chip 6 can be extracted through the plurality of pad segments 4 . For example, the optical sensor chip 5 and the LED chip 6 can be directly soldered to the pad section 4 by planting solder balls, or can be electrically connected by bonding wires. This electrical connection method of planting solder balls or bonding wires belongs to the field common knowledge of the skilled person.

The pad section 4 of the present invention is the same as the first plane section 1 , the second plane section 2 and the connection section 3 , all of which are stamped and cut from a metal plate. It should be noted here that, in order to realize signal extraction, each pad segment 4 needs to be separated from other metal plates independently, otherwise the electrical signals of the chip will be strung together. However, when punching, each pad section 4 cannot be punched out from the metal plate. At this time, the injection-molded light-transmitting part 7 can solve this problem well. First, inject the light-transmitting part 7 and then butt weld it. The pad segments 4 are separated, and each independent pad segment 4 can be integrated with other components through the injection-molded light-transmitting part 7 .

One or more LED chips 6 of the present invention can be provided. For example, referring to FIG. 2 , there are two LED chips 6 , and the two LED chips 6 are symmetrically distributed on both sides of the optical sensor chip 5 . The two LED chips 6 can also be symmetrically distributed in the diagonal direction of the optical sensor chip 5 , refer to FIG. 3 . Of course, referring to FIG. 4 , four LED chips 6 are provided, and the four LED chips 6 are distributed at four corners of the optical sensor chip 5 . The quantity and distribution of the LED chip 6 and the optical sensor chip 5 can be designed according to actual needs; the packaging structure of the present invention helps to adjust the relative position of the optical sensor chip 5 and the LED chip 6 by punching the metal shell, Improved packaging flexibility.

The present invention also provides a method for manufacturing an optical sensor packaging structure, which includes the following steps:

a) Stamping and cutting the metal plate to form the first plane segment 1, the second plane segment 2 at different heights, and the connecting segment 3 between the first plane segment 1 and the second plane segment 2; at the same time An optical window 8 and a plurality of pad segments 4 can be formed on the metal plate, referring to FIG. 5; , the optical window 8 can also be arranged on the second plane segment 2;

b) Mount the optical sensor chip 5 and the LED chip 6 on different sides of the first plane segment 1 and the second plane segment 2, referring to Fig. 6; in a specific embodiment of the present invention, for example, the optical sensor chip can be 5 is mounted on the underside of the first plane segment 1 with its optical area facing the first plane segment 1, and the LED chip 6 is mounted on the second plane segment 2 with its optical area facing away from the second plane segment 2 ; At this time, the above-mentioned optical window 8 is arranged on the first plane section 1 facing the position of the optical area of the optical sensor chip 5, so that the first plane section 1 exposes the optical area of the optical sensor chip 5 through the optical window 8;

The placement process of the chip belongs to the common knowledge of those skilled in the art, for example, it can be bonded by glue; in order to lead the electrical signal of the chip, the optical sensor chip 5 and the LED chip 6 can be directly welded on the chip by solder balls. On the pad segment 4 in the first plane segment 1, of course, the optical sensor chip 5 and the LED chip 6 on the first plane segment 1 and the second plane segment 2 can also be electrically connected to the corresponding On pad segment 4;

c) Injecting a light-transmitting material to form a light-transmitting portion 7 that encapsulates the optical sensor chip 5 and the LED chip 6; through the light-transmitting portion 7, the optical sensor chip 5 and the LED chip 6 are packaged on the first plane segment 1, On the second plane section 2, the optical area of the optical sensor chip 5 and the LED chip 6 can be protected; the light-transmitting part 7 will be filled in the optical window 8 of the first plane section 1 at the same time, finally forming the optical window 8 of the present invention. Sensor packaging structure.

It should be noted here that when the pad segment 4 is formed in step a), the pad segment 4 cannot be completely separated from the metal plate, and a part needs to be reserved to connect it to the metal plate. After the injection molding of the opaque material Afterwards, the pad segment 4 is divided to realize the extraction of respective signals.

The optical sensor packaging structure of the present invention can form multiple packaging structures on the metal plate to realize continuous batch manufacturing. In a specific embodiment of the present invention, with reference to FIG. 7 , for example, four packaging structures can be formed on the metal plate 10, which are respectively denoted as the first packaging structure a, the second packaging structure b, the third packaging structure c, and the fourth packaging structure. Encapsulation structure d: when stamping and cutting the metal plate, the metal shells in the four encapsulation structures are connected together through the interconnection part 11. After the chip mounting and opaque material injection molding are completed, the metal plate 10 to cut, so as to divide the four package structures, and obtain four independent first package structure a, second package structure b, third package structure c, and fourth package structure d, refer to FIG. 8 . During the cutting process, the pad segment 4 in each package structure can be divided simultaneously, so as to realize the extraction of respective signals in a single package structure.

Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art should understand that the above examples are for illustration only and not intended to limit the scope of the present invention. Those skilled in the art will appreciate that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims (10)

1. An optical sensor packaging structure, characterized in that: comprising a metal housing, an optical sensor chip (5), an LED chip (6), the metal housing is provided with first plane segments (1) at different heights , the second plane segment (2), and the connecting segment (3) between the first plane segment (1) and the second plane segment (2); wherein, the optical sensor chip (5), the LED chip (6 ) are respectively installed on different sides of the first plane segment (1) and the second plane segment (2); the first plane segment (1) or the second plane segment (2) is provided with a unified optical sensor chip ( 5), the optical window (8) in the optical direction of the LED chip (6); also includes a light-transmitting part (7) for encapsulating the optical sensor chip (5) and the LED chip (6) on the metal casing. 2. The optical sensor packaging structure according to claim 1, characterized in that: the optical sensor chip (5) is mounted on the first plane segment (1) with its optical area facing the first plane segment (1) The lower side of the LED chip (6) is mounted on the upper side of the second plane segment (2) with its optical area away from the second plane segment (2); the optical window (8) is arranged on the first The position on the plane segment (1) corresponds to the optical area of the optical sensor chip (5). 3. The optical sensor packaging structure according to claim 1, characterized in that: the optical sensor chip (5) is mounted on the first plane segment (1) in such a way that its optical area deviates from the first plane segment (1) The lower side of the LED chip (6) is mounted on the upper side of the second plane segment (2) with its optical area facing the second plane segment (2); the optical window (8) is arranged on the second plane segment (2) The position on the plane segment (2) corresponds to the optical area of the LED chip (6). 4. The optical sensor package structure according to claim 1, characterized in that: the optical sensor chip (5) is mounted on the first plane segment (1) with its optical area facing the first plane segment (1) The upper side of the LED chip (6) is mounted on the lower side of the second plane segment (2) with its optical area away from the second plane segment (2); the optical window (8) is arranged on the first The position on the plane segment (1) corresponds to the optical area of the optical sensor chip (5). 5. The optical sensor packaging structure according to claim 1, characterized in that: the optical sensor chip (5) is mounted on the first plane segment (1) in such a way that its optical area deviates from the first plane segment (1) The upper side of the LED chip (6) is mounted on the lower side of the second plane segment (2) with its optical area facing the second plane segment (2); the optical window (8) is arranged on the second plane segment (2) The position on the plane segment (2) corresponds to the optical area of the LED chip (6). 6. The optical sensor packaging structure according to claim 1, characterized in that: the connecting section (3) is perpendicular to the first planar section (1) and the second planar section (2). 7. The optical sensor packaging structure according to claim 1, characterized in that: the metal housing further comprises a plurality of pad segments (4) for electrically connecting the optical sensor chip (5) and the LED chip (6) . 8. The optical sensor packaging structure according to claim 7, characterized in that: the first plane segment (1), the second plane segment (2), the connecting segment (3), and the pad segment (4) are stamped , Cutting sheet metal. 9. The optical sensor packaging structure according to claim 1, characterized in that: there are multiple LED chips (6), symmetrically distributed on both sides or diagonally of the optical sensor chip (5). 10. A method for manufacturing an optical sensor package structure according to any one of claims 1 to 9, characterized in that it comprises the steps of: a) Stamping and cutting the metal plate to form a first plane segment (1), a second plane segment (2), a connection segment (3), an optical window (8) and a plurality of pad segments (4); b) mounting the optical sensor chip (5) and the LED chip (6) on different sides of the first plane segment (1) and the second plane segment (2) respectively; c) Injecting a light-transmitting material to form a light-transmitting part (7) encapsulating the optical sensor chip (5) and the LED chip (6).