CN105842783A - Optical waveguide, manufacturing method therefor, and electronic device - Google Patents
Optical waveguide, manufacturing method therefor, and electronic device Download PDFInfo
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- CN105842783A CN105842783A CN201510014269.XA CN201510014269A CN105842783A CN 105842783 A CN105842783 A CN 105842783A CN 201510014269 A CN201510014269 A CN 201510014269A CN 105842783 A CN105842783 A CN 105842783A
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Abstract
The invention relates to an optical waveguide, a manufacturing method therefor, and an electronic device. The method comprises the steps: S1, providing a substrate; S2, sequentially forming a bottom cover layer, a core layer and a top cover layer on the substrate, so as to form the optical waveguide, wherein the bottom cover layer and/or the top cover layer are/is formed through a jet printing method. The invention aims at solving the problems in the prior art, and provides the preparation method for the optical waveguide based on polymer. The method selects the gel jet printing method to form the bottom cover layer and/or the top cover layer. The method overcomes the constraint on size in the prior art, and the method is excellent in performance, such as low-propagation loss, low interchannel cross talk, high bandwidth, and MMF and a photodetector with high coupling efficiency.
Description
Technical field
The present invention relates to semiconductor applications, in particular it relates to a kind of fiber waveguide and preparation side thereof
Method, electronic device.
Background technology
At consumer electronics field, multifunctional equipment is increasingly liked by consumer, compared to function
Simple equipment, multifunctional equipment manufacturing process will be more complicated, and ratio is if desired for integrated in circuit version
The chip of multiple difference in functionalitys, thus occur in that 3D integrated circuit (integrated circuit, IC) skill
Art, 3D integrated circuit (integrated circuit, IC) is defined as a kind of system-level integrated morphology,
Multiple chips are stacked in vertical plane direction, thus saves space.
It is " high performance-price ratio, high reliability, multi-functional, small-sized that microelectronic packaging technology is faced with electronic product
Change and low cost " challenge that brings of development trend and opportunity.Along with to high-performance computer
In (high-performance computers, HPCs), data processing speed improves constantly, at present
On backboard (backplane) based on electric wire and plate, the interconnection between (on-board) becomes high-performance
The bottleneck of computer.
For more advanced high-performance computer of future generation, optical interconnection (optical interconnect)
Technology achieves the connection of low power consumption, high density and low cost, and above-mentioned various advantages cause
Interest widely, in the many decades in past, concurrent multimode optical fiber (Multi-Mode Fiber, MMF)
Module in the frame of some high-performance computers to the interconnection (rack-to-rack interconnects) of frame
In be developed.
Prior art shows relative and conventional silicon core (Si-core) graded index by experiment
The superior function of (graded-index, GI)-core polymeric optical waveguides, the lowest propagation loss
(low-propagation loss), low crosstalk (low interchannel crosstalk) high bandwidth (high
Bandwidth) and with MMF and photodetector (photodetectors) there is high coupling efficiency
(high coupling efficiency)。
The preparation method not only complex steps of current described fiber waveguide and degree of accuracy is relatively low, constrain institute
State the application of fiber waveguide, it is therefore desirable to improve the preparation method of described fiber waveguide further, with further
Improve the performance of device.
Summary of the invention
Introducing the concept of a series of reduced form in Summary, this will be in specific embodiment party
Formula part further describes.The Summary of the present invention is not meant to attempt to limit
Go out key feature and the essential features of technical scheme required for protection, more do not mean that and attempt really
The protection domain of fixed technical scheme required for protection.
The present invention is in order to overcome the problem of presently, there are, it is provided that the preparation method of a kind of fiber waveguide, including:
Step S1: substrate is provided；
Step S2: sequentially form undercoat, sandwich layer and top cladding over the substrate, to form fiber waveguide,
Wherein said undercoat and/or described top cladding are formed by the method for jet printing.
Alternatively, described step S2 includes:
Step S21: sequentially form described undercoat and described sandwich layer over the substrate；
Step S22: form low-refraction top by the method for aeroge jet printing on described sandwich layer and cover
The spaced described top cladding of material layer is covered on material layer and high index of refraction top.
Alternatively, described step S2 includes:
Step S21: form bottom electrode by the method for described jet printing over the substrate and cover
Cover the undercoat of described bottom electrode, in described undercoat, be wherein formed with some spaced grooves；
Step S22: form described sandwich layer, to cover described undercoat and to fill described groove；
Step S23: form described top cladding on described sandwich layer, to cover described sandwich layer；
Step S24: form top electrodes on described top cladding.
Alternatively, described step S22 includes:
Step S221: formed by the method for described aeroge jet printing and there is the described low of some openings
Material layer is covered on refractive index top；
Step S222: form described high index of refraction top by the method for described aeroge jet printing and cover material
Layer, to fill described opening, forms described top cladding.
Alternatively, still further comprise between described step S221 and described step S222 and open described
Mouth carries out the step repaired and freeze.
Alternatively, in described step S24, the method for focused ion bundle gas assistant depositing is selected to be formed
Described top electrodes.
Alternatively, described bottom electrode selects silver electrode；
Described top electrodes selects silver electrode.
Alternatively, may further comprise: between described step S21 and described step S22 described recessed
Coating clearance wall is formed on the sidewall of groove.
Alternatively, after forming described coating clearance wall, still further comprise the step of plasma finishing.
Alternatively, described undercoat and top cladding have different refractive indexs.
Alternatively, described method still further comprises step S3: perform ultraviolet curing step, with solidification
Described fiber waveguide.
Alternatively, described undercoat, described sandwich layer and described top cladding select polymeric material.
Present invention also offers a kind of fiber waveguide prepared based on above-mentioned method.
Present invention also offers a kind of electronic installation, including above-mentioned fiber waveguide.
The present invention is to solve problems of the prior art, it is provided that a kind of light based on polymer
The preparation method of waveguide, in the process select aeroge jet printing formed described undercoat and/or
Described top cladding, solves the restriction of size in prior art by described method, and described method has
There are superior performance, the lowest propagation loss (low-propagation loss), low crosstalk (low
Interchannel crosstalk) high bandwidth (high bandwidth) and with MMF and photodetection
Device (photodetectors) has high coupling efficiency (high coupling efficiency).
Accompanying drawing explanation
The drawings below of the present invention is used for understanding the present invention in this as the part of the present invention.In accompanying drawing
Show embodiments of the invention and description thereof, be used for explaining assembly of the invention and principle.At accompanying drawing
In,
Fig. 1 a-1b is the preparation process schematic diagram of fiber waveguide in an embodiment of the prior art；
Fig. 2 a-2e is the preparation process schematic diagram of fiber waveguide in another embodiment of prior art；
Fig. 3 a-3d is the preparation process schematic diagram of fiber waveguide in an embodiment of the prior art；
Fig. 4 a-4d is the preparation process schematic diagram of fiber waveguide in another embodiment of prior art；
Fig. 5 is the preparation technology flow chart of fiber waveguide described in the embodiment of the invention.
Detailed description of the invention
In the following description, a large amount of concrete details is given to provide to the present invention the most thoroughly
Understand.It is, however, obvious to a person skilled in the art that the present invention can be without one
Or multiple these details and be carried out.In other example, in order to avoid obscuring with the present invention,
Technical characteristics more well known in the art are not described.
It should be appreciated that the present invention can implement in different forms, and should not be construed as being limited to this
In propose embodiment.On the contrary, it is open thoroughly with complete to provide these embodiments to make, and incite somebody to action this
The scope of invention fully passes to those skilled in the art.In the accompanying drawings, in order to clear, Ceng He district
Size and relative size may be exaggerated.Same reference numerals represents identical element from start to finish.
It should be understood that when element or layer be referred to as " ... on ", " with ... adjacent ", " being connected to " or " coupling
Conjunction is arrived " other element or during layer, its can directly on other element or layer, adjacent thereto, connect
Or be coupled to other element or layer, or element between two parties or layer can be there is.On the contrary, claimed when element
For " directly exist ... on ", " with ... direct neighbor ", " being directly connected to " or " being directly coupled to " other yuan
When part or layer, the most there is not element between two parties or layer.Although it should be understood that can use term first,
Two, the various element of third description, parts, district, floor and/or part, these elements, parts, district,
Layer and/or part should not be limited by these terms.These terms be used merely to distinguish an element, parts,
District, floor or part and another element, parts, district, floor or part.Therefore, without departing from the present invention
Under teaching, the first element discussed below, parts, district, floor or part be represented by the second element,
Parts, district, floor or part.
Spatial relationship term such as " ... under ", " ... below ", " following ", " ... under ",
" ... on ", " above " etc., here can describe for convenience and be used thus in description figure
A shown element or feature and other element or the relation of feature.It should be understood that except shown in figure
Orientation beyond, spatial relationship term is intended to also include the different orientation of device in using and operating.Example
As, if the device upset in accompanying drawing, then, it is described as " below other element " or " its it
Under " or " under it " element or feature will be oriented to other element or feature " on ".Therefore, example
Property term " ... below " and " ... under " upper and lower two orientations can be included.Device can additionally take
Correspondingly explained to (90-degree rotation or other orientation) and spatial description language as used herein.
The purpose of term as used herein is only that description specific embodiment and the limit not as the present invention
System.When using at this, " one ", " one " and " described/to be somebody's turn to do " of singulative is also intended to include plural number
Form, unless context is expressly noted that other mode.It is also to be understood that term " forms " and/or " including ",
When using in this specification, determine described feature, integer, step, operation, element and/or parts
Existence, but be not excluded for one or more other feature, integer, step, operation, element, parts
And/or group existence or interpolation.When using at this, term "and/or" includes any of relevant Listed Items
And all combinations.
In order to thoroughly understand the present invention, detailed step and detailed knot will be proposed in following description
Structure, in order to explaination technical scheme.Presently preferred embodiments of the present invention is described in detail as follows, but
In addition to these describe in detail, the present invention can also have other embodiments.
During the preparation method of fiber waveguide has much at present, below in conjunction with accompanying drawing, described preparation method is divided
Do not illustrate, the preparation process signal of fiber waveguide during wherein Fig. 1 a-1b is an embodiment of the prior art
Figure；Fig. 2 a-2e is the preparation process schematic diagram of fiber waveguide in another embodiment of prior art.
First first method is as shown in Figure 1a, first provides substrate 101, on described substrate 101
Form sandwich layer (core layer) 102, on described sandwich layer 102, then form photomask layer
(photo-mask), then carrying out ultraviolet light irradiation, heating, to obtain fiber waveguide.
Second method as shown in Figure 1 b, in order to improve the performance of fiber waveguide, it is provided that substrate 101,
Form undercoat (bottom cladding) 104 on described substrate 101, then form sandwich layer (core
Layer) 102, on described sandwich layer 102, then form top cladding (top cladding) 105, in institute
State and on top cladding 105, form photomask layer (photo-mask) 103, then carry out ultraviolet light irradiation,
Heating, wherein, described undercoat and described top cladding have different refractive indexs.
The third method as shown in figs. 2 a-e, first, it is provided that substrate 201, and shape over the substrate
Become bottom electrode 202, as shown in Figure 2 a；Then undercoat 203 is formed, to cover described bottom electricity
Pole 202, as shown in Figure 2 b.
Then flexible mold (flexible mold) 204 is selected to pattern described undercoat 203, with
Groove is formed, as shown in Figure 2 c in described undercoat 203.
Then sandwich layer 205 is formed to cover described undercoat 203 and to fill described groove, such as Fig. 2 d
Shown in.
The last top electrodes 207 that formed on described top cladding 206, as shown in Figure 2 e.
Although there is multiple preparation method in prior art, but described method is the most loaded down with trivial details but also effect
Not ideal enough with performance.
Embodiment 1
The present invention is to solve the problem that prior art exists, it is provided that the preparation of a kind of new fiber waveguide
Method, is further described described method below in conjunction with the accompanying drawings, and wherein Fig. 3 a-3d is existing skill
The preparation process schematic diagram of fiber waveguide in art one embodiment.
Step 301 is first carried out, it is provided that substrate 301, forms undercoat 302 and core over the substrate
Layer 302.
Specifically, as shown in Figure 3 a, the most described substrate 301 can be selected commonly used in the art
Semiconductor substrate, described substrate 301 can be at least one in the following material being previously mentioned: silicon, absolutely
Stacking SiGe (S-SiGeOI) on stacking silicon (SSOI), insulator on silicon (SOI), insulator on edge body,
Germanium on insulator SiClx (SiGeOI) and germanium on insulator (GeOI) etc..
Alternatively, described substrate 301 forms bottom electrode (not shown), described bottom
Electrode can select conventional conductive material, it is not limited to a certain, in this embodiment, described
Bottom electrode selects argent.
Further, described substrate 301 forms undercoat (bottom cladding) 302, to cover
Cover described substrate 301 and described bottom electrode.
Wherein said undercoat is selected has the relatively low or polymeric material of high index.
Then in described undercoat 302, sandwich layer (core layer) 303 is formed, wherein, to cover
Stating undercoat, described sandwich layer 303 can select various materials commonly used in the art, it is not limited to certain
A kind of.
Perform step 302, formed by the method for described aeroge jet printing and there is the low of patterns of openings
Material layer is covered on refractive index top.
Specifically, as shown in Figure 3 b, aeroge jet printing (Aerosol Jet is selected in this step
Printing) method forms described top cladding.
The application select the method for aeroge jet printing (Aerosol Jet Printing) form described top
Coating is low temperature process, and described method is gentleer to environment, reduces the generation of waste material,
Can also print on nonplanar substrate, and more accurate.
Perform step 303, the step that described patterns of openings is modified and freezes.
Specifically, described method can select method commonly used in the art, it is not limited to a certain,
This repeats no more.
Perform step 304, form high index of refraction top by the method for described aeroge jet printing and cover material
Layer 305, to fill described patterns of openings, forms described top cladding (top cladding) 304.
Specifically, as shown in Figure 3 c, the method selecting described aeroge jet printing in this step is formed
Material layer 305 is covered on high index of refraction top, to fill described patterns of openings, forms graded index
The polymeric optical waveguides of (graded-index, GI), it has more excellent performance, the lowest biography
Broadcast loss (low-propagation loss), low crosstalk (low interchannel crosstalk) high bandwidth
(high bandwidth) and there is high coupling with MMF and photodetector (photodetectors)
Close efficiency (high coupling efficiency).
Can also be formed by the method for described aeroge jet printing in this embodiment and there is patterns of openings
High index of refraction top cover material layer；Then low-refraction is formed by the method for described aeroge jet printing
Material layer is covered on top, to fill described patterns of openings, forms described top cladding 304.
Material layer is covered on wherein said low-refraction top and to cover the refractive index difference of material layer permissible on high index of refraction top
Select according to specific needs.
Perform step 305, perform ultraviolet curing step, to solidify described fiber waveguide.
Specifically, as shown in Figure 3 d, the most described ultraviolet curing can select the method for routine,
It is not limited to a certain kind.
So far, the introduction of the fiber waveguide process of the embodiment of the present invention is completed.After the above step, also
Can include other correlation step, here is omitted.Further, in addition to the foregoing steps, this enforcement
The preparation method of example can also include other steps among each step above-mentioned or between different step,
These steps all can be realized by various techniques of the prior art, and here is omitted.
The present invention is to solve problems of the prior art, it is provided that a kind of light based on polymer
The preparation method of waveguide, in the process select aeroge jet printing formed described undercoat and/or
Described top cladding, solves the restriction of size in prior art by described method, and described method has
There are superior performance, the lowest propagation loss (low-propagation loss), low crosstalk (low
Interchannel crosstalk) high bandwidth (high bandwidth) and with MMF and photodetection
Device (photodetectors) has high coupling efficiency (high coupling efficiency).
Fig. 5 is the preparation technology flow process of the present invention one specifically polymer optical wave guide described in embodiment
Figure, specifically includes following steps:
Step S1: substrate is provided；
Step S2: sequentially form undercoat, sandwich layer and top cladding over the substrate, to form fiber waveguide,
Wherein said undercoat and/or described top cladding are formed by the method for jet printing.
Embodiment 2
The present invention is to solve the problem that prior art exists, it is provided that the preparation of a kind of new fiber waveguide
Method, is further described described method below in conjunction with the accompanying drawings, and wherein Fig. 4 a-4d is existing skill
The preparation process schematic diagram of fiber waveguide in art one embodiment.
Step 401 is first carried out, described substrate 401 forms the end by the method for described jet printing
Portion's electrode 402 and cover the undercoat 403 of described bottom electrode, has in wherein said undercoat 403
There are some spaced grooves.
Specifically, as shown in fig. 4 a, the most described substrate 401 can be selected commonly used in the art
Semiconductor substrate, described substrate 301 can be at least one in the following material being previously mentioned: silicon, absolutely
Stacking SiGe (S-SiGeOI) on stacking silicon (SSOI), insulator on silicon (SOI), insulator on edge body,
Germanium on insulator SiClx (SiGeOI) and germanium on insulator (GeOI) etc..
Alternatively, described bottom electrode 402 can select conventional conductive material, it is not limited to certain
One, in this embodiment, described bottom electrode selects argent.
Further, described substrate 401 forms undercoat (bottom cladding) 403, to cover
Cover described substrate 401 and described bottom electrode 402.
Wherein said undercoat is selected has the relatively low or polymeric material of high index.
Wherein said undercoat 403 has some spaced grooves, in follow-up step
The sandwich layer of patterning is formed in rapid.
The method of glue jet printing (Jet Printing) is selected to form described bottom electrode 402 in this application
And covering the undercoat 403 of described bottom electrode, described method is low temperature process, Er Qiesuo
State method gentleer to environment, reduce the generation of waste material, it is also possible to carry out on nonplanar substrate
Print, and more accurate.
Perform step 402, the sidewall of described groove is formed coating clearance wall.
Specifically, select in this step and cover described in fluorinated polymer (fluorinated polymer) formation
Lamellar spacing wall, to adjust opening and the degree of depth of described groove.
Alternatively, then perform the step of plasma finishing, to improve the profile of described groove further,
Improve the performance of device.
Perform step 403, form described sandwich layer 404, to cover described undercoat 403 and to fill described
Groove.
Specifically, as shown in Figure 4 b, the described sandwich layer 404 formed in this step fills described groove,
The sandwich layer 404 of patterning is formed by described method.
Wherein said sandwich layer selects polymer, but is not limited to a certain kind and does not repeats them here.
Perform step 404, described sandwich layer 404 forms described top cladding 405, to cover described core
Layer 404.
Specifically, as illustrated in fig. 4 c, described top cladding 405 and described undercoat have different refractive indexs,
To form the polymeric optical waveguides with formation graded index (graded-index, GI), it has
More excellent performance, the lowest propagation loss (low-propagation loss), low crosstalk (low
Interchannel crosstalk) high bandwidth (high bandwidth) and with MMF and photodetection
Device (photodetectors) has high coupling efficiency (high coupling efficiency).
Perform step 405, described top cladding 405 is formed top electrodes 406.
Specifically, as shown in figure 4d, described in this step, top electrodes 406 can select conventional leading
Electric material, it is not limited to a certain, in this embodiment, described top electrodes 406 selects metal
Silver.
Specifically, focused ion bundle (focused ion beam) gas assistant depositing (gas assisted is selected
Deposition) method forms described top electrodes 406.
Described focused ion bundle (focused ion beam) gas assistant depositing (gas assisted
Deposition) method can select the operating parameter of routine, it is not limited to a certain scope, the most detailed at this
Thin description.
So far, the introduction of the fiber waveguide process of the embodiment of the present invention is completed.After the above step, also
Can include other correlation step, here is omitted.Further, in addition to the foregoing steps, this enforcement
The preparation method of example can also include other steps among each step above-mentioned or between different step,
These steps all can be realized by various techniques of the prior art, and here is omitted.
Embodiment 3
Present invention also offers a kind of fiber waveguide, described fiber waveguide selects the method described in embodiment 1 or 2
Preparation.It is prepared by the method for the present invention the fiber waveguide obtained and there is lower energy consumption, it is also possible to carry further
The performance of high fiber waveguide and yield.
Embodiment 4
Present invention also offers a kind of electronic installation, including the fiber waveguide described in embodiment 3.Wherein, light
Wave guide member is the semiconductor device described in embodiment 3, or according to the preparation method described in embodiment 1 or 2
The fiber waveguide obtained.
The electronic installation of the present embodiment, can be mobile phone, panel computer, notebook computer, net book,
Game machine, television set, VCD, DVD, navigator, photographing unit, video camera, recording pen, MP3,
Any electronic product such as MP4, PSP or equipment, it is possible to for any centre including described semiconductor device
Product.The electronic installation of the embodiment of the present invention, owing to employing above-mentioned semiconductor device, thus has
Better performance.
The present invention is illustrated by above-described embodiment, but it is to be understood that, above-mentioned enforcement
Example is only intended to citing and descriptive purpose, and is not intended to limit the invention to described embodiment
In the range of.In addition it will be appreciated by persons skilled in the art that and the invention is not limited in above-mentioned enforcement
Example, can also make more kinds of variants and modifications according to the teachings of the present invention, these variants and modifications
Within all falling within scope of the present invention.Protection scope of the present invention is wanted by attached right
Book and equivalent scope thereof is asked to be defined.
The present invention is illustrated by above-described embodiment, but it is to be understood that, above-mentioned enforcement
Example is only intended to citing and descriptive purpose, and is not intended to limit the invention to described embodiment
In the range of.In addition it will be appreciated by persons skilled in the art that and the invention is not limited in above-mentioned enforcement
Example, can also make more kinds of variants and modifications according to the teachings of the present invention, these variants and modifications
Within all falling within scope of the present invention.Protection scope of the present invention is wanted by attached right
Book and equivalent scope thereof is asked to be defined.
Claims (14)
1. a preparation method for fiber waveguide, including:
Step S1: substrate is provided；
Step S2: sequentially form undercoat, sandwich layer and top cladding over the substrate, to form fiber waveguide,
Wherein said undercoat and/or described top cladding are formed by the method for jet printing.
Method the most according to claim 1, it is characterised in that described step S2 includes:
Step S21: sequentially form described undercoat and described sandwich layer over the substrate；
Step S22: form low-refraction top by the method for aeroge jet printing on described sandwich layer and cover
The spaced described top cladding of material layer is covered on material layer and high index of refraction top.
Method the most according to claim 1, it is characterised in that described step S2 includes:
Step S21: form bottom electrode by the method for described jet printing over the substrate and cover
Cover the undercoat of described bottom electrode, in described undercoat, be wherein formed with some spaced grooves；
Step S22: form described sandwich layer, to cover described undercoat and to fill described groove；
Step S23: form described top cladding on described sandwich layer, to cover described sandwich layer；
Step S24: form top electrodes on described top cladding.
Method the most according to claim 2, it is characterised in that described step S22 includes:
Step S221: formed by the method for described aeroge jet printing and there is the described low of some openings
Material layer is covered on refractive index top；
Step S222: form described high index of refraction top by the method for described aeroge jet printing and cover material
Layer, to fill described opening, forms described top cladding.
Method the most according to claim 4, it is characterised in that in described step S221 and described
The step described opening repaired and freezes is still further comprised between step S222.
Method the most according to claim 3, it is characterised in that in described step S24, selects
The method of focused ion bundle gas assistant depositing forms described top electrodes.
7. according to the method described in claim 3 or 6, it is characterised in that described bottom electrode selects silver
Electrode；
Described top electrodes selects silver electrode.
Method the most according to claim 3, it is characterised in that in described step S21 and described step
Formation coating clearance wall on the sidewall of described groove is may further comprise: between rapid S22.
Method the most according to claim 8, it is characterised in that formed described coating clearance wall it
After still further comprise plasma finishing step.
Method the most according to claim 1, it is characterised in that described undercoat and top cladding tool
There is different refractive indexs.
11. methods according to claim 1, it is characterised in that described method still further comprises
Step S3: perform ultraviolet curing step, to solidify described fiber waveguide.
12. methods according to claim 1, it is characterised in that described undercoat, described sandwich layer
Polymeric material is selected with described top cladding.
13. 1 kinds of fiber waveguides prepared based on the method one of claim 1 to 12 Suo Shu.
14. 1 kinds of electronic installations, including the fiber waveguide described in claim 13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510014269.XA CN105842783A (en) | 2015-01-12 | 2015-01-12 | Optical waveguide, manufacturing method therefor, and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510014269.XA CN105842783A (en) | 2015-01-12 | 2015-01-12 | Optical waveguide, manufacturing method therefor, and electronic device |
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| Publication Number | Publication Date |
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| CN105842783A true CN105842783A (en) | 2016-08-10 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510014269.XA Pending CN105842783A (en) | 2015-01-12 | 2015-01-12 | Optical waveguide, manufacturing method therefor, and electronic device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109669244A (en) * | 2018-11-27 | 2019-04-23 | 苏州席正通信科技有限公司 | A kind of three-dimensional optical waveguide production method based on 3D printing |
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| US6160273A (en) * | 1998-07-15 | 2000-12-12 | Xerox Corporation | Diode pumped solid state edge emitting light source |
| CN1450383A (en) * | 2003-04-30 | 2003-10-22 | 华中科技大学 | Clad modulation wave guide type electro-optical modulator |
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