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CN105826447A - 封装结构及其制法 - Google Patents

封装结构及其制法 Download PDF

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Publication number
CN105826447A
CN105826447A CN201610051576.XA CN201610051576A CN105826447A CN 105826447 A CN105826447 A CN 105826447A CN 201610051576 A CN201610051576 A CN 201610051576A CN 105826447 A CN105826447 A CN 105826447A
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light
emitting component
preparation
encapsulating
encapsulating structures
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凌北卿
刘德忠
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Abstract

一种封装结构及其制法，该封装结构包括：具有相对的第一侧及第二侧的发光元件、接触结合该发光元件侧面的包覆体、设于该第二侧的荧光层、以及设于该第一侧的金属结构。以藉由该发光元件的侧面接触结合该包覆体，使该发光元件的侧面不发光，以减少热能产生，故可避免胶体黄化、荧光粉易受热而使发光效率降低等问题，特别是藉由该金属结构以提升散热效果。

Description

封装结构及其制法
技术领域
本发明涉及一种半导体封装件，尤指一种可发光式封装件。
背景技术
随着电子产业的蓬勃发展，电子产品在型态上趋于轻薄短小，在功能上则逐渐迈入高性能、高功能、高速度化的研发方向。其中，发光二极体(LightEmittingDiode,LED)因具有寿命长、体积小、高耐震性及耗电量低等优点，故广泛地应用于照光需求的电子产品中，因此，于工业上、各种电子产品、生活家电的应用日趋普及。
图1为揭示一种现有LED封装件1的剖面图。该LED封装件1为一基板10上形成有一反射杯100，并设置一LED元件11于该反射杯100中，且该LED元件11利用多条导线14电性连接该基板10，再以封装胶体12包覆该LED元件11。之后，形成一荧光层13于该封装胶体12上，且形成一透镜15于该荧光层13上。
然，现有LED封装件1中，因需藉由该基板10承载该LED元件11，致使该LED封装件1的厚度与宽度增加，而难以符合微小化的需求。
此外，该荧光层13距离该LED元件11过远，致使发光效率差。
又，该LED元件11位于该封装胶体13中，导致散热能力差，故常常发生胶体黄化、荧光粉易受热而使发光效率降低等问题，特别是该LED元件11的侧面11c的胶体。
因此，如何克服现有技术中的种种问题，实已成目前亟欲解决的课题。
发明内容
鉴于上述现有技术的缺失，本发明提供一种封装结构及其制法，以减少热能产生，故可避免胶体黄化、荧光粉易受热而使发光效率降低等问题。
本发明的封装结构，包括：至少一发光元件，其具有相对的第一侧与第二侧、及相邻该第一侧与第二侧的侧面；包覆体，其接触结合该发光元件的侧面，且该包覆体为非透光材；以及至少一金属结构，设于该发光元件的第一侧。
本发明还提供一种封装结构的制法，其包括：结合至少一发光元件于一承载件上，其中，该发光元件具有结合至该承载件的第一侧、相对该第一侧的第二侧、及相邻该第一侧与第二侧的侧面；形成包覆体于该承载件上，使该包覆体接触结合该发光元件的侧面，其中，该包覆体外露该发光元件的第二侧，且该包覆体为非透光材；移除该承载件，以外露该发光元件的第一侧；以及形成至少一金属结构于该发光元件的第一侧。
由上可知，本发明的封装结构及其制法，其利用晶片级封装方式，因而无需使用现有基板承载该发光元件，故能大幅缩减该封装结构的厚度与宽度，以符合微小化的需求。
此外，本发明的封装结构可将荧光层接触结合至该发光元件的第二侧，以缩短该荧光层与该发光元件间的距离，使发光效率佳。
又，该发光元件的侧面接触结合该包覆体，使该发光元件的侧面不发光，以减少热能产生，故可避免胶体黄化、荧光粉易受热而使发光效率降低等问题，特别是藉由该金属结构以提升散热效果。
附图说明
图1为现有LED封装件的剖面图；
图2A至图2D为本发明的封装结构的制法的第二实施例的剖面示意图；其中，图2C’为图2C的另一实施例；
图3A至图3E为本发明的封装结构的制法的第二实施例的剖面示意图；以及
图4为本发明的封装结构的第三实施例的剖面示意图；以及
图5A至图5E为本发明的封装结构的制法的第四实施例的剖面示意图。
符号说明
1LED封装件10基板
100反射杯11LED元件
11c、21c侧面12封装胶体
13、23荧光层14导线
15透镜2、3、4、5封装结构
20承载件200凹部
21发光元件21a第一侧
21b第二侧210线路
210’焊线211、311、411电极
22包覆体22a第一表面
22b第二表面220电性接触垫
220’外接垫24金属结构
25透光层50散热离型膜
S切割路径500开口。
具体实施方式
以下藉由特定的具体实施例说明本发明的实施方式，熟悉此技艺的人士可由本说明书所揭示的内容轻易地了解本发明的其他优点及功效。
须知，本说明书所附图式所绘示的结构、比例、大小等，均仅用以配合说明书所揭示的内容，以供熟悉此技艺的人士的了解与阅读，并非用以限定本发明可实施的限定条件，故不具技术上的实质意义，任何结构的修饰、比例关系的改变或大小的调整，在不影响本发明所能产生的功效及所能达成的目的下，均应仍落在本发明所揭示的技术内容得能涵盖的范围内。同时，本说明书中所引用的如“上”、“下”、“底”、“第一”、“第二”及“一”等用语，也仅为便于叙述的明了，而非用以限定本发明可实施的范围，其相对关系的改变或调整，在无实质变更技术内容下，当也视为本发明可实施的范畴。
图2A至图2D为本发明的封装结构2的制法的第一实施例的剖面示意图。
如图2A所示，结合多个发光元件21于一承载件20上。
于本实施例中，该发光元件21为发光二极体，其具有结合至该承载件20的第一侧21a、相对该第一侧21a的第二侧21b、及相邻该第一侧21a与第二侧21b的侧面21c，且该第二侧21b具有多个电极211。
此外，该发光元件21的第二侧21b为发光侧。
又，该承载件20的样式繁多，并无特别限制。
如图2B所示，形成一包覆体22于该承载件20上，使该包覆体22接触结合(即包覆)该发光元件21的侧面21c，且该包覆体22外露该发光元件21的第二侧21b。接着，移除该承载件20，使该发光元件21的第一侧21a外露于该包覆体22的第一表面22a，且于该发光元件21的第二侧21b上形成多条线路210。
于本实施例中，该包覆体22为非透光材，如白胶，且该包覆体22定义有结合至该承载件20的第一表面22a及相对该第一表面22a的第二表面22b，使该发光元件21的第二侧21b与该包覆体22的第二表面22b同侧。
此外，该发光元件21的第二侧21b与该包覆体22的第二表面22b齐平，使该包覆体22的第二表面22b露出该发光元件21的第二侧21b。
又，上述外露的方式也可于该包覆体22的第二表面22b上进行开孔，以露出该发光元件21的第二侧21b。
另外，该线路210以涂布方式形成者，且延伸至该包覆体22的第二表面22b，并于该包覆体22的第二表面22b上形成多个电性接触垫220，以藉由该线路210电性连接该电性接触垫220与该电极211。
如图2C所示，形成一荧光层23于该发光元件21的第二侧21b与该包覆体22的第二表面22b上。
于本实施例中，该荧光层23覆盖该发光元件21的第二侧21b上的线路210，而外露该包覆体22的第二表面22b上的线路210。
此外，于另一实施例中，也可以焊线210’取代该线路210，且以外接垫220’取代该电性接触垫220，如图2C’所示。
又，于其它实施例中，该荧光层23也可覆盖该发光元件21的第二侧21b与该包覆体22的全部第二表面22b，以覆盖全部线路210。
另外，也可以如玻璃的透光层取代荧光层23，且该玻璃为整面式，即覆盖该发光元件21的第二侧21b与该包覆体22的第二表面22b。
如图2D所示，沿如图2C所示的切割路径S进行切单制程。接着，形成一金属结构24于各该发光元件21的第一侧21a与该包覆体22的第一表面22a上，以制得多个封装结构2。
于本实施例中，该发光元件21的第一侧21a与该包覆体22的第一表面22a齐平，且该金属结构24是作为散热元件。
此外，于其它实施例中，可先形成该金属结构24，再进行切单制程。
因此，本发明的封装结构2是利用晶片级封装方式，因而无需使用现有基板承载该发光元件21，故能大幅缩减该封装结构2的厚度与宽度，以符合微小化的需求。
此外，本发明的封装结构2藉由该荧光层23接触结合该发光元件21的第二侧21b，以缩短该荧光层23与该发光元件21间的距离，使发光效率佳。
又，该发光元件21的侧面21c接触结合该包覆体22，使该发光元件21的侧面21c不发光，以减少热能产生，故可避免胶体黄化、荧光粉易受热而使发光效率降低等问题，特别是该发光元件21的第一侧21a作为散热侧，使本发明的封装结构2藉由该金属结构24散热，因而能提升散热效果。
图3A至图3D为本发明的封装结构3的制法的第二实施例的剖面示意图。本实施例与第一实施例的差异仅在于该发光元件21的电极的位置，其它制程大致相同，故以下仅叙述相异处。
如图3A所示，结合多个发光元件21于一承载件20上，且该第一侧21a具有多个电极311。
如图3B所示，形成一包覆体22于该承载件20上，使该包覆体22包覆该发光元件21的侧面21c，且该包覆体22的第二表面22b外露该发光元件21的第二侧21b。接着，移除该承载件20。
如图3C所示，形成一荧光层23于该发光元件21的第二侧21b与该包覆体22的第二表面22b上。
于本实施例中，该荧光层23覆盖该发光元件21的第二侧21b与该包覆体22的全部第二表面22b。
于其它实施例中，该荧光层23也可仅覆盖该发光元件21的第二侧21b与该包覆体22的部分第二表面22b。
如图3D所示，沿如图3C所示的切割路径S进行切单制程，及形成至少一金属结构24于该发光元件21的第一侧21a与该包覆体22的第一表面22a上。
于本实施例中，该金属结构24接触连结该电极311，且使该金属结构24作为线路用的导线或散热元件。
如图3E所示，形成一如透镜的透光层25于该荧光层23上。
另外，于图2D的后续制程也可形成一如透镜的透光层25于该荧光层23上。
因此，本发明的封装结构3是利用晶片级封装方式，因而无需使用现有基板承载该发光元件21，故能大幅缩减该封装结构2的厚度与宽度，以符合微小化的需求。
此外，本发明的封装结构3藉由该荧光层23接触结合该发光元件21的第二侧21b，以缩短该荧光层23与该发光元件21间的距离，使发光效率佳。
又，该发光元件21的侧面21c接触结合该包覆体22，使该发光元件21的侧面21c不发光，以减少热能产生，故可避免胶体黄化、荧光粉易受热而使发光效率降低等问题，特别是该发光元件21的第一侧21a作为散热侧，使本发明的封装结构2藉由该金属结构24散热，因而能提升散热效果。
图4为本发明的封装结构4的第三实施例的剖面示意图，且本实施例为应用前述各实施例的制法。
如图4所示，该发光元件21的第一侧21a与第二侧21b分别具有电极411，该线路210电性连接该电性接触垫220与该第二侧21b的电极411，该金属结构24接触连结该第一侧21a的电极411。
图5A至图5D为本发明的封装结构5的制法的第四实施例的剖面示意图。本实施例与第二实施例的差异仅在于新增散热离型膜(thermalreleasefilm)，其它制程大致相同，故以下仅叙述相异处。
如图5A所示，结合多个发光元件21于一承载件20上，且该第二侧21b具有一散热离型膜50。
如图5B所示，形成一包覆体22于该承载件20上，使该包覆体22包覆该发光元件21的侧面21c，且该包覆体22的第二表面22b外露该散热离型膜50。接着，移除该散热离型膜50和承载件20，该散热离型膜50和承载件20的移除顺序并无特别限制。经移除该散热离型膜50后，该包覆体22自该发光元件21的侧面21c凸出该发光元件21的第二侧21b，以形成开口500。
如图5C所示，形成一荧光层23于该开口500中的发光元件21的第二侧21b与该包覆体22的第二表面22b上。
于本实施例中，该荧光层23覆盖该发光元件21的第二侧21b与该包覆体22的全部第二表面22b。
于其它实施例中，该荧光层23也可仅覆盖该发光元件21的第二侧21b与该包覆体22的部分第二表面22b。
如图5D所示，沿如图5C所示的切割路径S进行切单制程，及形成至少一金属结构24于该发光元件21的第一侧21a与该包覆体22的第一表面22a上。
于本实施例中，该金属结构24接触连结该电极311，且使该金属结构24作为线路用的导线或散热元件。
如图5E所示，形成一如透镜的透光层25于该荧光层23上。
另外，于图5D的后续制程也可形成一如透镜的透光层25于该荧光层23上。
上述实施例仅用以例示性说明本发明的原理及其功效，而非用于限制本发明。任何熟习此项技艺的人士均可在不违背本发明的精神及范畴下，对上述实施例进行修改。因此本发明的权利保护范围，应如权利要求书所列。

Claims (36)

1.一种封装结构，其特征为，该封装结构包括：
至少一发光元件，其具有相对的第一侧与第二侧、及相邻该第一侧与第二侧的侧面；
包覆体，其接触结合该发光元件的侧面，且该包覆体为非透光材；以及
至少一金属结构，其设于该发光元件的第一侧。
2.如权利要求1所述的封装结构，其特征为，该发光元件为发光二极体。
3.如权利要求1所述的封装结构，其特征为，该发光元件的第一侧具有多个电极。
4.如权利要求3所述的封装结构，其特征为，该金属结构接触连结该电极。
5.如权利要求1所述的封装结构，其特征为，该发光元件的第二侧具有多个电极。
6.如权利要求5所述的封装结构，其特征为，该发光元件的第二侧上形成有多条线路，以电性连接该电极。
7.如权利要求1所述的封装结构，其特征为，该发光元件的第一侧与第二侧分别具有电极。
8.如权利要求7所述的封装结构，其特征为，该金属结构接触连结该第一侧上的该电极，且该发光元件的第二侧上形成有多条线路，该线路电性连接该第二侧上的该电极。
9.如权利要求1所述的封装结构，其特征为，该包覆体的表面齐平于发光元件的第一侧或第二侧。
10.如权利要求1所述的封装结构，其特征为，该包覆体为白胶。
11.如权利要求1所述的封装结构，其特征为，该金属结构为导线或散热件。
12.如权利要求1所述的封装结构，其特征为，该封装结构还包括荧光层，其接触结合该发光元件的第二侧。
13.如权利要求12所述的封装结构，其特征为，该封装结构还包括形成于该荧光层上的透光层。
14.如权利要求1所述的封装结构，其特征为，该封装结构还包括透光层，其接触结合该发光元件的第二侧。
15.如权利要求1所述的封装结构，其特征为，该封装结构还包括形成于该发光元件的第二侧的散热离型膜。
16.如权利要求1所述的封装结构，其特征为，该包覆体自该发光元件的侧面凸出该发光元件的第二侧，以形成开口。
17.如权利要求16所述的封装结构，其特征为，该封装结构还包括荧光层，其接触结合该开口中的发光元件的第二侧。
18.一种封装结构的制法，其特征为，该制法包括：
结合至少一发光元件于一承载件上，其中，该发光元件具有结合至该承载件的第一侧、相对该第一侧的第二侧、及相邻该第一侧与第二侧的侧面；
形成包覆体于该承载件上，使该包覆体接触结合该发光元件的侧面，其中，该包覆体外露该发光元件的第二侧，且该包覆体为非透光材；
移除该承载件，以外露该发光元件的第一侧；以及
形成至少一金属结构于该发光元件的第一侧。
19.如权利要求18所述的封装结构的制法，其特征为，该承载件具有凹部，以供该发光元件置放于该凹部中，且该包覆体形成于该凹部中以包覆该发光元件。
20.如权利要求18所述的封装结构的制法，其特征为，该发光元件为发光二极体。
21.如权利要求18所述的封装结构的制法，其特征为，该发光元件的第一侧具有多个电极。
22.如权利要求21所述的封装结构的制法，其特征为，该金属结构接触连结该电极。
23.如权利要求18所述的封装结构的制法，其特征为，该发光元件的第二侧具有多个电极。
24.如权利要求23所述的封装结构的制法，其特征为，该发光元件的第二侧上形成有多条线路，以电性连接该电极。
25.如权利要求18所述的封装结构的制法，其特征为，该发光元件的第一侧与第二侧分别具有电极。
26.如权利要求25所述的封装结构的制法，其特征为，该金属结构接触连结该第一侧上的该电极，且该发光元件的第二侧上形成有多条线路，该线路电性连接该第二侧上的该电极。
27.如权利要求18所述的封装结构的制法，其特征为，该包覆体的表面齐平于发光元件的第一侧或第二侧。
28.如权利要求18所述的封装结构的制法，其特征为，该包覆体为白胶。
29.如权利要求18所述的封装结构的制法，其特征为，该金属结构为导线或散热件。
30.如权利要求18所述的封装结构的制法，其特征为，该制法还包括接触结合荧光层于该发光元件的第二侧。
31.如权利要求30所述的封装结构的制法，其特征为，该制法还包括形成透光层于该荧光层上。
32.如权利要求18所述的封装结构的制法，其特征为，该制法还包括接触结合透光层于该发光元件的第二侧。
33.如权利要求18所述的封装结构的制法，其特征为，该制法还包括于移除该承载件后，进行切单制程。
34.如权利要求18所述的封装结构的制法，其特征为，该发光元件的第二侧具有散热离型膜。
35.如权利要求34所述的封装结构的制法，其特征为，该制法还包括于形成该包覆体之后，移除该散热离型膜。
36.如权利要求35所述的封装结构的制法，其特征为，该制法还包括接触结合荧光层于该发光元件的第二侧。
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