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CN105806900A - Humidity detection circuit - Google Patents

Humidity detection circuit Download PDF

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Publication number
CN105806900A
CN105806900A CN201610135656.3A CN201610135656A CN105806900A CN 105806900 A CN105806900 A CN 105806900A CN 201610135656 A CN201610135656 A CN 201610135656A CN 105806900 A CN105806900 A CN 105806900A
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power supply
humidity sensor
operational amplifier
humidity
temperature
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罗毅
杨昆
施云波
商春雪
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Yunnan Normal University
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Yunnan Normal University
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/22Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
    • G01N27/223Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance for determining moisture content, e.g. humidity
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/22Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
    • G01N27/228Circuits therefor

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Abstract

A humidity detection circuit belongs to the technical field of humidity sensors. The problem that humidity detection is unstable due to the fact that a humidity sensor changes along with temperature change in a low-temperature environment is solved. The humidity detection circuit is a humidity measurement circuit based on a capacitance charging and discharging and comparison method, so that temperature drift and zero drift are effectively inhibited, and the influence of parasitic capacitance on a measurement result is reduced. It is used for humidity sensor.

Description

一种湿度检测电路A humidity detection circuit

技术领域technical field

本发明属于湿度度传感器技术领域,本发明是2014年8月20日申请、申请号201410411744.2的发明专利《探空仪用加热式湿度传感器及其制备方法及一种湿度检测电路》的分案申请。The present invention belongs to the field of humidity sensor technology. The present invention is a divisional application of the invention patent "Heating Humidity Sensor for Airsonde and Its Preparation Method and a Humidity Detection Circuit" filed on August 20, 2014 with application number 201410411744.2 .

背景技术Background technique

高空气象探测业务水平是衡量一个国家大气探测科学水平的主要参考之一,而湿度探测是高空气象探测重要环节。由于高空环境恶劣,湿度变化剧烈,环境温度最低达到-90℃,这就要求湿度传感器具有耐低温、响应快、抗干扰能力强等优点,而电容式湿度传感器具备上述特点,并且制造成本较低,成为探空仪用湿度传感器研究的重要方向之一。但由于电容式湿度传感器自身结构特点,当在高湿环境中时,湿度传感器表面容易产生结露现象,使得测量误差增大,甚至造成传感器失效。目前国内外相关学者研究重点倾向于优化传感器结构、改进湿敏材料等方面。欧美等发达国家在该领域的研究一直处于世界领先的地位,如奥地利E+E公司研制的高分子电容式湿度传感器从感湿材料方面解决低温湿度测量问题,其响应时间约1.5s,分辨率约1%,不确定度约5%,能够在-80℃正常工作;芬兰维萨拉公司研发的RS92型探空仪从传感器结构和工作模式上解决低温湿度测量问题,采用两片具有加热功能的湿度传感器交替工作,其响应时间小于0.5s,分辨率约1%RH,不确定度约5%,是目前公认的高空湿度探测的标准。The operational level of upper-air meteorological detection is one of the main references to measure the scientific level of a country's atmospheric detection, and humidity detection is an important part of upper-air meteorological detection. Due to the harsh high-altitude environment, drastic changes in humidity, and the lowest ambient temperature reaches -90°C, this requires the humidity sensor to have the advantages of low temperature resistance, fast response, and strong anti-interference ability, and the capacitive humidity sensor has the above characteristics, and the manufacturing cost is relatively low. , has become one of the important research directions of humidity sensors used in radiosondes. However, due to the structural characteristics of the capacitive humidity sensor, when it is in a high-humidity environment, the surface of the humidity sensor is prone to condensation, which increases the measurement error and even causes the sensor to fail. At present, the research focus of relevant scholars at home and abroad tends to optimize the sensor structure and improve the humidity-sensitive materials. Developed countries such as Europe and the United States have always been in the leading position in the field of research in this field. For example, the polymer capacitive humidity sensor developed by the Austrian E+E company solves the problem of low-temperature humidity measurement from the aspect of moisture-sensing materials. Its response time is about 1.5s and the resolution About 1%, with an uncertainty of about 5%, and can work normally at -80°C; the RS92 radiosonde developed by Vaisala, Finland, solves the problem of low-temperature humidity measurement from the sensor structure and working mode, using two pieces with heating function The humidity sensor works alternately, its response time is less than 0.5s, the resolution is about 1%RH, and the uncertainty is about 5%, which is currently recognized as the standard for high-altitude humidity detection.

所以目前湿度传感器扔存在在低温环境下湿度测量效果不好问题。Therefore, the current humidity sensor throws the problem that the humidity measurement effect is not good in a low temperature environment.

湿度传感器自身的电感和外部引线的等效电感对湿度传感器电容值具有一定的影响。而且湿度传感器与地间的寄生电容及与引线间的寄生电容在低温环境下随温度的变化而变化,使湿度检测不稳定。The inductance of the humidity sensor itself and the equivalent inductance of the external leads have a certain influence on the capacitance of the humidity sensor. Moreover, the parasitic capacitance between the humidity sensor and the ground and the parasitic capacitance between the lead wires change with the change of temperature in a low-temperature environment, which makes the humidity detection unstable.

发明内容Contents of the invention

本发明的目的是为了解决湿度传感器在低温环境下随温度的变化而变化,使湿度检测不稳定的问题,本发明提供一种湿度检测电路。The purpose of the present invention is to solve the problem that the humidity sensor changes with the change of temperature in a low temperature environment, making the humidity detection unstable. The present invention provides a humidity detection circuit.

本发明的一种湿度检测电路,所述湿度检测电路包括探空仪用加热式湿度传感器Cm、标准电容Cs、模拟电阻RP、寄生电容CP、电阻R1、电阻R2、三个运算放大器、2个单刀双掷开关和供电电源;A humidity detection circuit of the present invention, said humidity detection circuit includes a heating type humidity sensor C m for radiosondes, a standard capacitance C s , an analog resistance R P , a parasitic capacitance C P , a resistance R1, a resistance R2, three calculation Amplifier, 2 SPDT switches and power supply;

所述湿度传感器Cm的一端和标准电容Cs的一端同时接供电电源的地端,湿度传感器Cm的另一端与第一单刀双掷开关的一个静端连接,标准电容Cs的另一端与第一单刀双掷开关的另一个静端连接,One end of the humidity sensor C m and one end of the standard capacitor C s are connected to the ground terminal of the power supply at the same time, the other end of the humidity sensor C m is connected to a static end of the first single-pole double-throw switch, and the other end of the standard capacitor C s connected with the other static terminal of the first SPDT switch,

第一单刀双掷开关的动端与模拟电阻RP的一端连接,模拟电阻RP的另一端与寄生电容CP的一端、电阻R1的一端和第一运算放大器的正向输入端同时连接供电电源的Vcc端,寄生电容CP的另一端接供电电源的地端,The moving end of the first SPDT switch is connected to one end of the analog resistor R P , and the other end of the analog resistor R P is connected to one end of the parasitic capacitor C P , one end of the resistor R1 and the positive input end of the first operational amplifier to supply power simultaneously. The Vcc end of the power supply, the other end of the parasitic capacitor C P is connected to the ground end of the power supply,

电阻R1的另一端接第二单刀双掷开关的动端,第二单刀双掷开关的一个静端接供电电源的Vcc端,第二单刀双掷开关的另一个静端接供电电源的地端,The other end of the resistor R1 is connected to the moving end of the second SPDT switch, one static end of the second SPDT switch is connected to the Vcc end of the power supply, and the other static end of the second SPDT switch is connected to the ground end of the power supply ,

第一运算放大器的信号输出端同时与电阻R2的一端同时和第一运算放大器的反向信号输入端连接,第一运算放大器的供电电源正极与供电电源的Vcc端连接,第一运算放大器的供电电源地端与供电电源的地端连接,电阻R2的另一端同时与第二运算放大器的正向信号输入端和第三运算放大器的正向信号输入端连接,第二运算放大器的反向信号输入端与供电电源的Vcc端连接,第三运算放大器的反向信号输入端与供电电源的Vcc端连接,The signal output terminal of the first operational amplifier is connected with the reverse signal input terminal of the first operational amplifier at the same time with one end of the resistor R2, the positive pole of the power supply of the first operational amplifier is connected with the Vcc end of the power supply, the power supply of the first operational amplifier The ground end of the power supply is connected to the ground end of the power supply, and the other end of the resistor R2 is simultaneously connected to the forward signal input end of the second operational amplifier and the forward signal input end of the third operational amplifier, and the reverse signal input end of the second operational amplifier end is connected with the Vcc end of the power supply, and the reverse signal input end of the third operational amplifier is connected with the Vcc end of the power supply,

第二运算放大器的供电电源正极与供电电源的Vcc端连接,第二运算放大器的供电电源地端与供电电源的地端连接。The positive pole of the power supply of the second operational amplifier is connected to the Vcc terminal of the power supply, and the ground terminal of the power supply of the second operational amplifier is connected to the ground terminal of the power supply.

本发明的有益效果在于,本发明提供提供一种湿度检测电路,具有很好的温度稳定性,能够有效的抑制温度漂移和零点漂移,减小了寄生电容对测量结果的影响。The beneficial effect of the present invention is that the present invention provides a humidity detection circuit that has good temperature stability, can effectively suppress temperature drift and zero point drift, and reduces the influence of parasitic capacitance on measurement results.

附图说明Description of drawings

图1为具体实施方式一所述的探空仪用加热式湿度传感器的原理示意图。Fig. 1 is a schematic diagram of the principle of the heating type humidity sensor for radiosonde described in the first embodiment.

图2为具体实施方式一中第一种加热器电极的结构示意图。Fig. 2 is a schematic structural diagram of the first heater electrode in the first embodiment.

图3为具体实施方式一中第二种加热器电极的结构示意图。Fig. 3 is a schematic structural diagram of the second heater electrode in the first embodiment.

图4为具体实施方式一中第三种加热器电极的结构示意图。FIG. 4 is a schematic structural view of a third heater electrode in Embodiment 1. FIG.

图5为具体实施方式一中第四种加热器电极的结构示意图。FIG. 5 is a schematic structural diagram of a fourth heater electrode in Embodiment 1. FIG.

图6为具体实施方式一中所述蛇形加热器电极的结构示意图。Fig. 6 is a schematic structural view of the serpentine heater electrode in the first embodiment.

图7为具体实施方式十中所述探空仪用加热式湿度传感器的等效电路;Fig. 7 is the equivalent circuit of the heated humidity sensor for the radiosonde described in the tenth specific embodiment;

图8为具体实施方式十中湿度检测电路的原理示意图。FIG. 8 is a schematic diagram of the principle of the humidity detection circuit in the tenth embodiment.

图9为对标准电容及湿度传感器在相同的情况分别进行充电,电容充放电曲线;。Figure 9 shows the charging and discharging curves of the standard capacitance and the humidity sensor under the same conditions;

图10为本发明的探空仪用加热式湿度传感器在+30℃环境下湿度检测性能测试曲线;Fig. 10 is the humidity detection performance test curve of the heating type humidity sensor for radiosondes of the present invention in +30°C environment;

图11为本发明的探空仪用加热式湿度传感器湿度上升与下降测量特性曲线;Fig. 11 is the temperature rise and fall measurement characteristic curve of the heating type humidity sensor for radiosondes of the present invention;

图12为本发明的探空仪用加热式湿度传感器湿度传感器时间常数测试曲线。Fig. 12 is a test curve of the time constant of the humidity sensor of the heating type humidity sensor used in the radiosonde of the present invention.

具体实施方式detailed description

具体实施方式一:结合图1说明本实施方式,本实施方式所述的探空仪用加热式湿度传感器,它包括由基底1、第一绝缘层2、蛇形加热器电极8、第二绝缘层9、下电极10、感湿层11和多孔上电极12;其中,基底1的上表面铺设第一绝缘层2;在第一绝缘层2的上表面设置有蛇形加热器电极8;Specific embodiment one: this embodiment is described in conjunction with Fig. 1, and the heating type humidity sensor for radiosonde described in this embodiment includes a base 1, a first insulating layer 2, a serpentine heater electrode 8, a second insulating Layer 9, lower electrode 10, moisture sensing layer 11 and porous upper electrode 12; wherein, the upper surface of the substrate 1 is laid with a first insulating layer 2; the upper surface of the first insulating layer 2 is provided with a serpentine heater electrode 8;

所述蛇形加热器电极8包括第一加热器焊盘5、第二加热器焊盘6、第一引出电极、第一部分蛇形电极、第二部分蛇形电极、第三部分蛇形电极和第二引出电极;The serpentine heater electrode 8 includes a first heater pad 5, a second heater pad 6, a first extraction electrode, a first part of the serpentine electrode, a second part of the serpentine electrode, a third part of the serpentine electrode and the second lead-out electrode;

第一引出电极的一端与第一部分蛇形电极的首端连接,第一部分蛇形电极的末端与第二部分蛇形电极的首端连接,第二部分蛇形电极的末端与第三部分蛇形电极的首端连接,第三部分蛇形电极的末端和第二引出电极的一端连接,第一引出电极的另一端与第一加热器焊盘5连接,第二引出电极的另一端与第二加热器焊盘6连接;One end of the first lead-out electrode is connected to the head end of the first part of the serpentine electrode, the end of the first part of the serpentine electrode is connected to the head end of the second part of the serpentine electrode, and the end of the second part of the serpentine electrode is connected to the third part of the serpentine electrode. The first end of the electrode is connected, the end of the third part of the serpentine electrode is connected to one end of the second lead-out electrode, the other end of the first lead-out electrode is connected to the first heater pad 5, and the other end of the second lead-out electrode is connected to the second lead-out electrode. Heater pad 6 connection;

第一部分蛇形电极和第三部分蛇形电极在第二部分蛇形电极的两侧呈镜像对称,且第一部分蛇形电极的蛇形排布方向与第二部分蛇形电极的蛇形排布方向互相垂直;The first part of the serpentine electrode and the third part of the serpentine electrode are mirror-symmetrical on both sides of the second part of the serpentine electrode, and the serpentine arrangement direction of the first part of the serpentine electrode is the same as the serpentine arrangement of the second part of the serpentine electrode directions perpendicular to each other;

所述第二绝缘层9铺设在蛇形加热器电极8上,并且露出第一加热器焊盘5和第二加热器焊盘6;The second insulating layer 9 is laid on the serpentine heater electrode 8, and exposes the first heater pad 5 and the second heater pad 6;

所述下电极10铺设在第二绝缘层9上;所述感湿层11铺设在下电极10上;所述多孔上电极12铺设在感湿层11上;所述基底1的下表面设置有经镂空后形成的凹槽13。The lower electrode 10 is laid on the second insulating layer 9; the moisture-sensing layer 11 is laid on the lower electrode 10; the porous upper electrode 12 is laid on the moisture-sensing layer 11; Groove 13 formed after hollowing out.

由于湿空气的饱和水蒸气含量与空气温度成正比。当空气温度较高时,空气中能够存在的水蒸气多,当空气温度较低时,空气中能够存在的水蒸气少,即使含有的水蒸气很少也会产生结露。所以,即使湿空气自身未达到饱和状态,当湿度传感器表面温度低于湿空气的饱和温度时,物体表面的水蒸气也会凝结,产生结露。若能在不影响湿度传感器测量特性的情况下,将湿度传感器表面温度恒定在某一个温度范围内,使湿度传感器表面温度高于环境温度,那么就能避免湿度传感器表面结露。Since the saturated water vapor content of humid air is directly proportional to the air temperature. When the air temperature is high, the water vapor that can exist in the air is more, and when the air temperature is low, the water vapor that can exist in the air is less, even if it contains little water vapor, condensation will occur. Therefore, even if the humid air itself is not saturated, when the surface temperature of the humidity sensor is lower than the saturation temperature of the humid air, the water vapor on the surface of the object will condense, resulting in condensation. If the surface temperature of the humidity sensor can be kept within a certain temperature range without affecting the measurement characteristics of the humidity sensor, so that the surface temperature of the humidity sensor is higher than the ambient temperature, then condensation on the surface of the humidity sensor can be avoided.

本实施方式是一种具有蛇形加热器电极的平板夹心电容式湿度传感器,通过在不同环境温度条件下控制加热器的加热功率,使得湿度传感器表面温度恒定在理想的温度范围,从而有效解决了湿度传感器高空环境下结露的问题。This embodiment is a flat sandwich capacitive humidity sensor with a serpentine heater electrode. By controlling the heating power of the heater under different ambient temperature conditions, the surface temperature of the humidity sensor is kept constant in the ideal temperature range, thereby effectively solving the problem. Condensation problem of humidity sensor in high-altitude environment.

同时,本实施方式中,采用聚酰亚胺作为湿度传感器的感湿层11,聚酰亚胺在-200℃~+260℃之间具有优良的力学性能及介电性能,在此温度范围内具有较好的尺寸稳定性,具有优秀的耐高温、耐低温、耐辐射、耐磨损性能,并且具有易于改性,加工形态多样性、合成多样性等特点。通过对湿度传感器进行加热,使得聚酰亚胺感湿薄膜工作在恒定的温度条件下。由于聚酰亚胺感湿特性随温度的变化而变化,这就要求湿度传感器在加热过程中其表面温度分布均匀,且加热面积需覆盖有效感湿区域,从而保证湿度传感器测量的稳定性和可靠性。At the same time, in this embodiment, polyimide is used as the moisture-sensitive layer 11 of the humidity sensor. Polyimide has excellent mechanical properties and dielectric properties between -200°C and +260°C. It has good dimensional stability, excellent high temperature resistance, low temperature resistance, radiation resistance, wear resistance, and has the characteristics of easy modification, diverse processing forms, and synthetic diversity. By heating the humidity sensor, the polyimide moisture-sensitive film works under constant temperature conditions. Since the moisture-sensing properties of polyimide change with temperature, this requires that the surface temperature distribution of the humidity sensor is uniform during the heating process, and the heating area must cover the effective humidity-sensing area, so as to ensure the stability and reliability of the humidity sensor measurement. sex.

本实施方式采用铂金属制备蛇形加热器,为了得到最优的加热效果,采用了如图2至图5所示的四种加热器结构,并将四种加热器加载到湿度传感器结构中,进行有限元仿真分析,包括湿度传感器热传递过程分析、衬底材料传热分析。In this embodiment, platinum metal is used to prepare serpentine heaters. In order to obtain the best heating effect, four heater structures as shown in Figure 2 to Figure 5 are used, and the four heaters are loaded into the humidity sensor structure. Perform finite element simulation analysis, including heat transfer process analysis of humidity sensor and heat transfer analysis of substrate material.

首先建立了湿度传感器热传导模型,高空环境中湿度传感器热量主要以热传导、热对流及热辐射三种形式散失,分别表示为QCond、QConv、QRad。T1、T2分别表示传感器内部温度及环境温度。湿度传感器总热散失Q可由式(1)表示。First, the heat conduction model of the humidity sensor is established. In the high-altitude environment, the heat of the humidity sensor is mainly lost in three forms of heat conduction, heat convection and heat radiation, which are respectively expressed as Q Cond , Q Conv , and Q Rad . T 1 and T 2 represent the internal temperature of the sensor and the ambient temperature, respectively. The total heat loss Q of the humidity sensor can be expressed by formula (1).

Q=QCond+QConv+QRad,(1)Q=Q Cond +Q Conv +Q Rad , (1)

为了简化分析过程,将湿度传感器近似为一个规则的长方体,假设长方体面积为S,高度为h,那么湿度传感器热传导方程可由式(2)表示In order to simplify the analysis process, the humidity sensor is approximated as a regular cuboid, assuming that the area of the cuboid is S and the height is h, then the heat conduction equation of the humidity sensor can be expressed by formula (2)

dQwxya CC oo nno dd == -- λλ SS dd tt dd xx ,, -- -- -- (( 22 ))

其中λ为导热系数,dt/dx为温度梯度向量,方向指向温度升高的方向。对上式中的x做0~h的积分可得Where λ is the thermal conductivity, dt/dx is the temperature gradient vector, and the direction points to the direction of temperature increase. Integrate x from 0 to h in the above formula to get

QQ CC oo nno dd ∫∫ 00 hh dd xx == -- λλ SS ∫∫ TT 11 TT 22 dd xx == λλ SS (( TT 11 -- TT 22 )) hh ,, -- -- -- (( 33 ))

热对流的实质是由于流体质点的宏观运动而引起的热量传递。热对流传热方程可表示为The essence of heat convection is the heat transfer caused by the macroscopic motion of fluid particles. The heat convection heat transfer equation can be expressed as

QConv=μ(T1-T2),(4) QConv = μ(T 1 -T 2 ), (4)

其中μ为空气对流系数,一般取10W/(m2·K)。Where μ is the air convection coefficient, generally 10W/(m 2 ·K).

热辐射是指物体以电磁辐射的形式将热能向外散发的传热方式,这种传热方式不依赖外界任何条件。根据斯特藩-玻耳兹曼定律(Stefan-BoltzmannLaw),热辐射传热方程可表示为Thermal radiation refers to the heat transfer method in which an object emits heat energy in the form of electromagnetic radiation. This heat transfer method does not depend on any external conditions. According to the Stefan-Boltzmann law (Stefan-BoltzmannLaw), the heat radiation heat transfer equation can be expressed as

QRad=2Sσε(T1 4-T2 4),(5)Q Rad = 2Sσε(T 1 4 -T 2 4 ), (5)

其中S为加热区面积,σ=5.67×10-8W/(m2·K4),为玻耳兹曼常数,为了简化分析过程,假设传感器为绝对黑体,那么ε=1。Where S is the area of the heating area, σ=5.67×10 -8 W/(m 2 ·K 4 ), and is Boltzmann's constant. In order to simplify the analysis process, assume that the sensor is an absolute black body, then ε=1.

假设环境温度为-70℃,生热率1.16×1011W/m3,为了简化仿真过程,做出以下两个约定:忽略材料因温度、湿度改变引起的导热系数的变化;忽略传感器各层间的接触热阻。Assuming that the ambient temperature is -70°C and the heat generation rate is 1.16×1011W/m 3 , in order to simplify the simulation process, the following two conventions are made: Ignore the change in thermal conductivity of the material due to changes in temperature and humidity; Contact thermal resistance.

从仿真结果可知,第一种加热器结构工艺实现最简单,热分布相对较均匀,但温度呈阶梯状下降,有效感湿面边缘部分温度不相同;为了使得有效感湿面积温度相同,在第一种加热器结构基础上进行了改进,从仿真结果可知,虽然目标温度覆盖区域有所增大,但温度不连续,有效感湿面温度分布不均匀;在前两种结构基础上进行了优化改进,得到第三种加热器结构,从仿真结果可知,与前两种结构相比,第三种结构热分布有所改善,目标温度覆盖区域进一步增大,但仍未覆盖整个有效感湿面;第四种结构目标温度覆盖区域最大,目标温度覆盖了有效感湿面,但传感器中心处温度不连续。From the simulation results, it can be seen that the first type of heater structure is the easiest to implement, and the heat distribution is relatively uniform, but the temperature decreases in steps, and the temperature at the edge of the effective moisture-sensitive surface is different; in order to make the temperature of the effective moisture-sensitive area the same, the A heater structure has been improved. From the simulation results, it can be seen that although the target temperature coverage area has increased, the temperature is discontinuous and the temperature distribution of the effective humidity-sensing surface is uneven; the optimization is carried out on the basis of the first two structures. Improvement, the third heater structure is obtained. From the simulation results, it can be seen that compared with the first two structures, the heat distribution of the third structure is improved, and the target temperature coverage area is further increased, but it still does not cover the entire effective moisture-sensitive surface. ; The fourth structure has the largest target temperature coverage area, and the target temperature covers the effective wet-sensing surface, but the temperature at the center of the sensor is discontinuous.

在以上四种结构基础上进行优化和改进后,本实施方式提供了如图6所示的蛇形加热器电极的结构。After optimizing and improving on the basis of the above four structures, this embodiment provides the structure of the serpentine heater electrode as shown in FIG. 6 .

加热器总体积V≈2.9×10-8m3。加热电极电阻可通过式(6)计算,其中ρ=1×10-3Ω·m,为铂电阻的电阻率,L=33.95×10-3mm,为加热电极的总长度,S=8.5×10-7m,为加热电极的横截面积。The total volume of the heater is V≈2.9×10 -8 m 3 . The heating electrode resistance can be calculated by formula (6), where ρ=1×10 -3 Ω·m is the resistivity of the platinum resistor, L=33.95×10 -3 mm is the total length of the heating electrode, S=8.5× 10 -7 m is the cross-sectional area of the heating electrode.

RR == ρρ LL SS == 11 ×× 1010 -- 33 ×× 33.9533.95 ×× 1010 -- 33 8.58.5 ×× 1010 -- 77 ≈≈ 4040 ΩΩ ,, -- -- -- (( 66 ))

对图6所示的蛇形加热器电极的结构进行仿真,从仿真结果可知,湿度传感器最高温度约为12.5℃,湿度传感器有效感湿面平均温度为2℃左右,实验证明,本实施方式的湿度传感器的温度分布均匀,目标温度覆盖了有效感湿面。The structure of the serpentine heater electrode shown in Figure 6 is simulated. From the simulation results, the maximum temperature of the humidity sensor is about 12.5°C, and the average temperature of the effective humidity sensing surface of the humidity sensor is about 2°C. The temperature distribution of the humidity sensor is uniform, and the target temperature covers the effective humidity sensing surface.

当对衬底采用腐蚀工艺进行硅衬底刻蚀,生热率仍然为1.16×1011W/m3,环境温度为-70℃,对衬底镂空后湿度传感器传感器进行仿真可看出,湿度传感器中心最高温度约为+30℃,湿度传感器有效感湿面平均温度约为+20℃,进行硅衬底刻蚀后,在相同的加热功率及环境温度下,湿度传感器温升更高,提高了加热的效率,降低了功耗。对湿度传感器背面热进行仿真,从仿真结果可看出,在硅衬底上方制备SiO2不仅具有绝缘的效果,并且具有较好的隔热效果,湿度传感器背面最高温度约为-47℃,该结构有效降低了传感器的热量散失。When the silicon substrate is etched with an etching process, the heat generation rate is still 1.16×1011W/m 3 , and the ambient temperature is -70°C. It can be seen from the simulation of the humidity sensor after the substrate is hollowed out that the center of the humidity sensor The maximum temperature is about +30°C, and the average temperature of the humidity sensor’s effective wet-sensing surface is about +20°C. After etching the silicon substrate, under the same heating power and ambient temperature, the temperature rise of the humidity sensor is higher, which improves the heating efficiency. efficiency, reducing power consumption. The heat on the back of the humidity sensor is simulated. From the simulation results, it can be seen that the SiO 2 prepared on the silicon substrate not only has an insulating effect, but also has a good heat insulation effect. The maximum temperature on the back of the humidity sensor is about -47°C. The structure effectively reduces the heat loss of the sensor.

根据对湿度传感器加热后仿真表面温度横向、纵向分布曲线,得出湿度传感器表面13.5mm×16.3mm区域的平均温度约为20℃,该区域覆盖了湿度传感器有效感湿面积。在高空低温环境下,温度变化范围为+35℃~-90℃,通过对环境温度的测量,确定加热功率,使得湿度传感器有效面积上的温度维持在+20℃左右,一方面,保证湿度传感器表面温度高于环境温度,避免湿度传感器结露;另一方面,静态实验结果表明,当湿度传感器表面维持在+20℃左右时,湿度传感器的测量特性最佳。According to the horizontal and vertical distribution curves of the simulated surface temperature after heating the humidity sensor, the average temperature of the 13.5mm×16.3mm area on the surface of the humidity sensor is about 20°C, which covers the effective humidity sensing area of the humidity sensor. In the high-altitude and low-temperature environment, the temperature range is +35°C to -90°C. By measuring the ambient temperature, the heating power is determined so that the temperature on the effective area of the humidity sensor is maintained at around +20°C. On the one hand, it ensures that the humidity sensor The surface temperature is higher than the ambient temperature to avoid condensation on the humidity sensor; on the other hand, the static test results show that when the surface of the humidity sensor is maintained at around +20°C, the measurement characteristics of the humidity sensor are the best.

进行热仿真分析时,选取+10℃~-70℃为环境温度,湿度传感器表面目标温度为+20℃,得到了表1中加热功率与环境温度的关系。When conducting thermal simulation analysis, +10°C to -70°C is selected as the ambient temperature, and the target temperature on the surface of the humidity sensor is +20°C. The relationship between the heating power and the ambient temperature in Table 1 is obtained.

表1加热功率与环境温度关系表Table 1 The relationship between heating power and ambient temperature

环境温度ambient temperature 温升temperature rise QQ 加热功率heating power +10℃+10°C +10℃+10°C 0.235×10 11W/m3 0.235×10 11 W/m 3 6.7815W6.7815W 0℃0°C +20℃+20°C 0.351×10 11W/m3 0.351×10 11 W/m 3 10.1289W10.1289W -10℃-10°C +30℃+30°C 0.467×10 11W/m3 0.467×10 11 W/m 3 13.4764W13.4764W -20℃-20°C +40℃+40°C 0.583×10 11W/m3 0.583×10 11 W/m 3 16.8239W16.8239W -30℃-30°C +50℃+50°C 0.699×10 11W/m3 0.699×10 11 W/m 3 20.1713W20.1713W -40℃-40°C +60℃+60°C 0.815×10 11W/m3 0.815×10 11 W/m 3 23.5188W23.5188W -50℃-50°C +70℃+70°C 0.931×10 11W/m3 0.931×10 11 W/m 3 26.8663W26.8663W -60℃-60°C +80℃+80°C 1.047×10 11W/m3 1.047×10 11 W/m 3 30.2138W30.2138W -70℃-70°C +90℃+90°C 1.163×10 11W/m3 1.163×10 11 W/m 3 33.5612W33.5612W

采用最小二乘法对以上数据进行曲线拟合,拟合方程如式(7)所示。Curve fitting was carried out on the above data by the method of least squares, and the fitting equation was shown in formula (7).

y=-0.0116x+0.3510,(7)y=-0.0116x+0.3510, (7)

拟合方程如式(7)表示环境温度y与加热功率x的函数关系,使得在不同的温度环境下给湿度传感器提供不同的加热功率,使得湿度传感器表面温度维持在+20℃,从而使得湿度传感器工作在理想的温度条件下。The fitting equation such as formula (7) expresses the functional relationship between the ambient temperature y and the heating power x, so that different heating powers are provided to the humidity sensor in different temperature environments, so that the surface temperature of the humidity sensor is maintained at +20°C, so that the humidity The sensor works under ideal temperature conditions.

本实施方式中的蛇形加热器电极的尺寸如图6所示。The dimensions of the serpentine heater electrodes in this embodiment are shown in FIG. 6 .

具体实施方式二:本实施方式是具体实施方式一所述的探空仪用加热式湿度传感器的制备方法,所述方法包括如下步骤:Specific embodiment two: this embodiment is the preparation method of the heating type humidity sensor described in specific embodiment one for sonde, and described method comprises the following steps:

步骤一:制备传感器的基底1,并采用去离子水清洗制备的基底1;Step 1: preparing the substrate 1 of the sensor, and cleaning the prepared substrate 1 with deionized water;

步骤二:将步骤一制备的基底1的表面氧化,生成一层致密的SiO2,作为第一绝缘层2;Step 2: Oxidize the surface of the substrate 1 prepared in Step 1 to form a layer of dense SiO 2 as the first insulating layer 2;

步骤三:在步骤二获得绝缘层上表面,采用光刻工艺和磁控溅射的方法制备蛇形加热器电极8;Step 3: Obtain the upper surface of the insulating layer in step 2, and prepare the serpentine heater electrode 8 by photolithography and magnetron sputtering;

步骤四:采用射频溅射的方法在步骤三制备的蛇形加热器电极8的上表面制备Al2O3保护层,作为第二绝缘层9;Step 4: Prepare an Al 2 O 3 protective layer on the upper surface of the serpentine heater electrode 8 prepared in Step 3 by radio frequency sputtering as the second insulating layer 9;

步骤五:采用光刻工艺和磁控溅射的方法在第二绝缘层9的上表面制备下电极10;Step 5: Prepare the lower electrode 10 on the upper surface of the second insulating layer 9 by photolithography and magnetron sputtering;

步骤六:采用腐蚀镂空的方法对步骤五制备的下电极10的上表面和步骤一所述基底1的下表面分别进行镂空处理;Step 6: Hollowing out the upper surface of the lower electrode 10 prepared in step 5 and the lower surface of the substrate 1 in step 1 by etching and hollowing out;

步骤七:在镂空处理后的下电极10的上表面制备感湿层11;Step 7: Prepare a moisture-sensitive layer 11 on the upper surface of the lower electrode 10 after hollowing out;

步骤八:采用蒸发镀膜机在感湿层11的上表面制备多孔上电极12。Step 8: Prepare a porous upper electrode 12 on the upper surface of the moisture-sensing layer 11 by using an evaporation coating machine.

具体实施方式三:本实施方式是对具体实施方式二所述的探空仪用加热式湿度传感器的制备方法的进一步限定,步骤一中,所述基底1为厚度400μm、晶向100的单晶硅;Specific embodiment three: this embodiment is a further limitation on the preparation method of the heating humidity sensor for radiosondes described in specific embodiment two. In step one, the substrate 1 is a single crystal with a thickness of 400 μm and a crystal orientation of 100 silicon;

步骤二中,所述绝缘层的厚度为500nm~1000nm。In step 2, the thickness of the insulating layer is 500nm-1000nm.

具体实施方式四:本实施方式是对具体实施方式三所述的探空仪用加热式湿度传感器的制备方法的进一步限定,步骤三中,在步骤二获得绝缘层上表面,采用光刻工艺和磁控溅射的方法制备蛇形加热器电极8的方法为:Embodiment 4: This embodiment is a further limitation on the preparation method of the heating humidity sensor for radiosondes described in Embodiment 3. In step 3, the upper surface of the insulating layer is obtained in step 2, and the photolithography process and The method for preparing serpentine heater electrode 8 by the method of magnetron sputtering is:

以蛇形加热器电极8的镂空图案为掩膜板,将光刻胶均匀涂在经步骤二获得绝缘层上表面,然后在80℃~100℃下烘20min~40min,曝光15s~30s后,转移至显影液中显影20s~40s,在去离子水中漂洗20s~30s,然后在100℃~120℃下坚膜30min~40min;Using the hollow pattern of the serpentine heater electrode 8 as a mask, evenly coat the photoresist on the upper surface of the insulating layer obtained in step 2, then bake at 80°C-100°C for 20min-40min, and expose for 15s-30s, Transfer to the developing solution for 20s~40s, rinse in deionized water for 20s~30s, and then harden the film at 100℃~120℃ for 30min~40min;

采用磁控溅射的方法在所述光刻胶的上表面镀膜,靶材为99.99%的铂,靶材尺寸为Φ60×2.5mm,在真空度达到1×10-5Pa~2×10-5Pa时,往溅射室通氩气,氩气的流量为15ml/min~25ml/min,氩气压强为1.5Pa~2.5Pa;利用丙酮溶解光刻胶,并超声至蛇形加热器电极8图案清晰。具体实施方式五:本实施方式是对具体实施方式四所述的探空仪用加热式湿度传感器的制备方法的进一步限定,步骤四中,采用射频溅射的方法在步骤三制备的蛇形加热器电极8的上表面制备Al2O3保护层的方法为:The upper surface of the photoresist is coated by magnetron sputtering, the target material is 99.99% platinum, the target size is Φ60×2.5mm, and the vacuum degree reaches 1×10 -5 Pa~2×10 - At 5 Pa, pass argon gas into the sputtering chamber, the flow rate of argon gas is 15ml/min~25ml/min, and the pressure of argon gas is 1.5Pa~2.5Pa; use acetone to dissolve the photoresist, and ultrasonically reach the electrodes of the serpentine heater 8 patterns are clear. Embodiment 5: This embodiment is a further limitation on the preparation method of the heating type humidity sensor for radiosondes described in Embodiment 4. In step 4, the serpentine heating method prepared in step 3 is adopted by radio frequency sputtering The method for preparing the Al 2 O 3 protective layer on the upper surface of the device electrode 8 is:

将光刻胶均匀涂在步骤三制备的蛇形加热器电极8的上表面,然后在80℃~100℃下烘20min~40min,将以焊盘的图案为掩膜板盖在光刻胶的上表面,曝光15s~30s后,转移至显影液中显影20s~40s,在去离子水中漂洗20s~30s,再在100℃~120℃下坚膜30min~40min;Apply the photoresist evenly on the upper surface of the serpentine heater electrode 8 prepared in step 3, then bake at 80°C to 100°C for 20min to 40min, cover the pattern of the pad on the photoresist After the upper surface is exposed for 15s~30s, it is transferred to the developer solution for 20s~40s, rinsed in deionized water for 20s~30s, and then hardened at 100℃~120℃ for 30min~40min;

当真空度达到1×10-5Pa~2×10-5Pa时,往溅射室通氩气,氩气的流量为15ml/min~25ml/min,氩气压强为1.5Pa~2.5Pa,溅射功率为60W~80W,时间为120min~180min,镀膜时压强控制在0.5Pa以下,获得Al2O3保护层。When the vacuum degree reaches 1×10 -5 Pa~2×10 -5 Pa, argon is passed into the sputtering chamber, the flow rate of argon is 15ml/min~25ml/min, and the pressure of argon is 1.5Pa~2.5Pa. The sputtering power is 60W-80W, the time is 120min-180min, and the pressure during coating is controlled below 0.5Pa to obtain the Al 2 O 3 protective layer.

具体实施方式六:本实施方式是对具体实施方式五所述的探空仪用加热式湿度传感器的制备方法的进一步限定,步骤五中,采用光刻工艺和磁控溅射的方法在第二绝缘层9的上表面制备下电极10的方法为:Embodiment 6: This embodiment is a further limitation on the preparation method of the heating humidity sensor for sondes described in Embodiment 5. In step 5, the method of photolithography and magnetron sputtering is used in the second step. The method for preparing the lower electrode 10 on the upper surface of the insulating layer 9 is:

利用丙酮溶解第二绝缘层9上的光刻胶,剥离掉第一加热器焊盘5和第二加热器焊盘6区域第二绝缘层9,采用磁控溅射的方法在第二绝缘层9的上表面进行镀膜,靶材为99.99%的金,靶材的尺寸Φ60×2.5mm,在真空度达到1×10-5Pa~2×10-5Pa时,往溅射室通氩气,氩气的流量为15ml/min~25ml/min,氩气压强为1×10-5Pa~2×10-5Pa;Utilize acetone to dissolve the photoresist on the second insulating layer 9, peel off the second insulating layer 9 of the first heater pad 5 and the second heater pad 6 area, adopt the method for magnetron sputtering on the second insulating layer Coating on the upper surface of 9, the target material is 99.99% gold, the size of the target material is Φ60×2.5mm, when the vacuum degree reaches 1×10 -5 Pa~2×10 -5 Pa, argon gas is passed into the sputtering chamber , the flow rate of argon is 15ml/min~25ml/min, and the pressure of argon is 1×10 -5 Pa~2×10 -5 Pa;

将光刻胶均匀涂在第二绝缘层9的上表面,将下电极10图案的掩模板盖在光刻胶表面的相应位置上,曝光15s~30s后,转移至显影液中显影20s~40s,在去离子水中漂洗20s~30s,然后,在100℃~120℃下坚膜30min~40min,将露出的金膜采用碘和碘化氨饱和溶液腐蚀掉,得到下电极10。Apply the photoresist evenly on the upper surface of the second insulating layer 9, cover the mask of the pattern of the lower electrode 10 on the corresponding position of the photoresist surface, after exposing for 15s-30s, transfer to the developing solution to develop for 20s-40s , rinse in deionized water for 20s to 30s, then harden the film at 100°C to 120°C for 30min to 40min, etch the exposed gold film with a saturated solution of iodine and ammonium iodide to obtain the lower electrode 10 .

具体实施方式七:本实施方式是对具体实施方式六所述的探空仪用加热式湿度传感器的制备方法的进一步限定,步骤六中,采用腐蚀镂空的方法对步骤五制备的下电极10的上表面和步骤一所述基底1的下表面分别进行镂空处理的方法为;Embodiment 7: This embodiment is a further limitation of the preparation method of the heating humidity sensor for sondes described in Embodiment 6. In step 6, the lower electrode 10 prepared in step 5 is corroded and hollowed out. The method of hollowing out the upper surface and the lower surface of the substrate 1 described in step 1 is as follows;

对步骤五制备的下电极10的上表面和步骤一所述基底1的下表面分别涂上光刻胶,然后在80℃~100℃下烘20min~40min,将以所述下电极10的上表面为制版图形的掩模版盖在下电极10的上表面上,将以镂空图形为制版图形的掩模版盖在基底1的下表面的相应位置上,双面曝光15s~30s,把曝光好的基底1放入显影液中显影20s~40s,在去离子水中漂洗20s~30s,再在100℃~120℃下坚膜30min~40min,在70℃~90℃的温度下,采用质量分数为35%~40%的氢氧化钾溶液对基底1的下表面进行镂空,形成凹槽13,凹槽13的深度约为350μm。Coating photoresist on the upper surface of the lower electrode 10 prepared in step five and the lower surface of the substrate 1 described in step one respectively, and then baking at 80° C. to 100° C. for 20 minutes to 40 minutes, using the upper surface of the lower electrode 10 as the Cover the upper surface of the lower electrode 10 with the mask plate of the plate-making pattern, cover the mask plate with the hollow pattern as the plate-making pattern on the corresponding position of the lower surface of the substrate 1, expose on both sides for 15s to 30s, and put the exposed substrate 1 Develop in the developer solution for 20s~40s, rinse in deionized water for 20s~30s, then harden the film at 100℃~120℃ for 30min~40min, and at a temperature of 70℃~90℃, use a mass fraction of 35%~40 % potassium hydroxide solution to hollow out the lower surface of the substrate 1 to form grooves 13 with a depth of about 350 μm.

具体实施方式八:本实施方式是对具体实施方式七所述的探空仪用加热式湿度传感器的制备方法的进一步限定,步骤七中,在镂空处理后的下电极10的上表面制备感湿层11的方法为:Embodiment 8: This embodiment is a further limitation on the preparation method of the heating type humidity sensor for radiosondes described in Embodiment 7. In step 7, a moisture-sensitive sensor is prepared on the upper surface of the lower electrode 10 after the hollowing out process. The layer 11 method is:

将聚酰亚胺感湿溶液涂在下电极10的上表面,然后在80℃~100℃下恒温5min~10min;Apply the polyimide moisture-sensitive solution on the upper surface of the lower electrode 10, and then keep the temperature at 80°C-100°C for 5min-10min;

将感湿薄膜图案为制版图形的掩膜板盖在下电极10的上表面,曝光15s~30s,然后在N,N-二甲基乙酰胺中显影20s~40s,在去离子水中漂洗20s~30s,然后在100℃~120℃下坚膜30min~40min,即得到感湿层11,感湿层11厚度约为1μm。Cover the upper surface of the lower electrode 10 with a mask plate whose pattern of the moisture-sensitive film is a plate-making pattern, expose for 15s to 30s, develop in N,N-dimethylacetamide for 20s to 40s, and rinse in deionized water for 20s to 30s , and then harden the film at 100° C. to 120° C. for 30 minutes to 40 minutes to obtain the moisture-sensitive layer 11 , and the thickness of the moisture-sensitive layer 11 is about 1 μm.

具体实施方式九:本实施方式是对具体实施方式八所述的探空仪用加热式湿度传感器的制备方法的进一步限定,步骤八中,采用蒸发镀膜机在感湿层11的上表面制备多孔上电极12的方法为:Specific embodiment nine: This embodiment is a further limitation of the preparation method of the heating type humidity sensor for radiosondes described in specific embodiment eight. In step eight, an evaporation coating machine is used to prepare a porous layer on the upper surface of the moisture-sensitive layer 11 The method of upper electrode 12 is:

蒸发原材料为金箔,采用多孔上电极12的图案为制版图形的掩膜版为模板,在蒸发镀膜机中成膜,蒸发电流110A~120A,蒸发时间5s~10s,即得到多孔上电极12。The evaporation raw material is gold foil, and the pattern of the porous upper electrode 12 is used as a mask plate of the plate-making pattern as a template, and the film is formed in an evaporation coating machine. The evaporation current is 110A-120A, and the evaporation time is 5s-10s, and the porous upper electrode 12 is obtained.

采用本实施方式的制备方法,湿度传感器电容值约100pF~160pF。With the preparation method of this embodiment, the capacitance of the humidity sensor is about 100pF˜160pF.

具体实施方式十:本实施方式是一种湿度检测电路,Embodiment 10: This embodiment is a humidity detection circuit,

当高空湿度发生变化时,湿度传感器电容值随之发生变化,如果能够精确得到湿度传感器电容值的变化,就能够得到高空环境湿度的变化。在大多数情况下,电容式湿度传感器可以被认为是一个纯电容,但在高温、低温、高湿条件下工作时,湿度传感器电容损耗不能忽略,当工作在高频时,电感效应也不能忽略。因此,考虑湿度传感器的损耗和电感效应时,湿度传感器不能认为是一个纯电容,等效电路如图7所示。其中Rs为电路板引线以及极板间的电阻损耗,其值随着工作频率的增高逐步变大,Rs通常很小,即使工作频率在兆赫兹以上时也很小,所以只有当工作频率极高时才需要考虑Rs对测量结果的影响;L为湿度传感器自身的电感和外部引线的等效电感,自身的电感与其结构形式有关,外部引线等效电感则与引线长度有关,引线越短,电感越小;RP为并联损耗电阻,包括极板间的介质损耗和漏电损耗,当湿度传感器工作在低频时,其损耗较大,随着工作频率的增高逐渐变小。湿度传感器电容总损耗系数可由式(8)表示。When the high-altitude humidity changes, the capacitance value of the humidity sensor changes accordingly. If the change of the capacitance value of the humidity sensor can be accurately obtained, the change of the high-altitude environment humidity can be obtained. In most cases, the capacitive humidity sensor can be considered as a pure capacitance, but when working under high temperature, low temperature and high humidity conditions, the capacitance loss of the humidity sensor cannot be ignored, and when working at high frequencies, the inductive effect cannot be ignored . Therefore, when considering the loss and inductance effect of the humidity sensor, the humidity sensor cannot be considered as a pure capacitance, and the equivalent circuit is shown in Figure 7. Among them, R s is the resistance loss between the circuit board leads and the plates, and its value gradually increases with the increase of the operating frequency. R s is usually very small, even when the operating frequency is above megahertz, so it is only when the operating frequency The influence of R s on the measurement results needs to be considered only when the temperature is extremely high; L is the inductance of the humidity sensor itself and the equivalent inductance of the external lead. The shorter the inductance, the smaller the inductance; R P is the parallel loss resistance, including the dielectric loss and leakage loss between the plates. When the humidity sensor works at a low frequency, the loss is large, and gradually decreases with the increase of the operating frequency. The total loss coefficient of the humidity sensor capacitance can be expressed by formula (8).

DD. == 11 RR pp ωω CC ++ RR sthe s ωω CC ,, -- -- -- (( 88 ))

其中ω为圆频率。从图7中可知湿度传感器电容的等效电路是存在谐振频率的,当湿度传感器处于谐振频率时将不能正常工作,设计电路时需避开谐振频率,由式(8)中可知,第一项随着谐振频率的升高其值降低,第二项随着谐振频率的升高其值增大,所以存在最优频率fb,使得总损耗系数D最小,可以通过对式(8)求最小值得到fb,如式(9)所示。where ω is the circular frequency. It can be seen from Figure 7 that the equivalent circuit of the humidity sensor capacitance has a resonant frequency. When the humidity sensor is at the resonant frequency, it will not work normally. When designing the circuit, it is necessary to avoid the resonant frequency. It can be seen from the formula (8) that the first item As the resonant frequency increases, its value decreases, and the second term increases as the resonant frequency increases, so there is an optimal frequency f b , which minimizes the total loss coefficient D, which can be minimized by formula (8) value to get f b , as shown in formula (9).

ff bb == 11 22 ππ CC 11 RR pp RR sthe s ,, -- -- -- (( 99 ))

那么湿度传感器有效电容Ce可由式(10)表示。Then the effective capacitance C e of the humidity sensor can be expressed by formula (10).

11 jωCjωC ee == jj ωω LL ++ 11 jj ωω CC ,, -- -- -- (( 1010 ))

湿度传感器电容实际变化量可由式(11)表示。The actual variation of the capacitance of the humidity sensor can be expressed by formula (11).

ΔCΔC ee CC ee == ΔΔ CC // CC 11 -- ωω 22 LL CC ,, -- -- -- (( 1111 ))

上式表明,湿度传感器自身的电感和外部引线的等效电感对湿度传感器电容值具有一定的影响。而且湿度传感器与地间的寄生电容及与引线间的寄生电容在低温环境下随温度的变化而变化。The above formula shows that the inductance of the humidity sensor itself and the equivalent inductance of the external leads have a certain influence on the capacitance of the humidity sensor. Moreover, the parasitic capacitance between the humidity sensor and the ground and the parasitic capacitance between the lead wire and the humidity sensor change with the change of temperature in a low-temperature environment.

针对上述问题,结合高空气象探测业务对湿度测量的要求,本实施方式提供了一种基于电容充放电及比较法的湿度检测电路,如图8所示。In view of the above problems, combined with the requirements of the high-altitude meteorological detection service for humidity measurement, this embodiment provides a humidity detection circuit based on capacitor charging and discharging and comparison method, as shown in FIG. 8 .

所述湿度检测电路包括探空仪用加热式湿度传感器Cm、标准电容Cs、模拟电阻RP、寄生电容CP、电阻R1、电阻R2、三个运算放大器、2个单刀双掷开关和供电电源;The humidity detection circuit includes a heating type humidity sensor C m for a radiosonde, a standard capacitance C s , an analog resistance R P , a parasitic capacitance C P , a resistance R1, a resistance R2, three operational amplifiers, two single-pole double-throw switches and Power supply;

所述湿度传感器Cm的一端和标准电容Cs的一端同时接供电电源的地端,湿度传感器Cm的另一端与第一单刀双掷开关的一个静端连接,标准电容Cs的另一端与第一单刀双掷开关的另一个静端连接,One end of the humidity sensor C m and one end of the standard capacitor C s are connected to the ground terminal of the power supply at the same time, the other end of the humidity sensor C m is connected to a static end of the first single-pole double-throw switch, and the other end of the standard capacitor C s connected with the other static end of the first SPDT switch,

第一单刀双掷开关的动端与模拟电阻RP的一端连接,模拟电阻RP的另一端与寄生电容CP的一端、电阻R1的一端和第一运算放大器的正向输入端同时连接供电电源的Vcc端,寄生电容CP的另一端接供电电源的地端,The moving end of the first SPDT switch is connected to one end of the analog resistor R P , and the other end of the analog resistor R P is connected to one end of the parasitic capacitor C P , one end of the resistor R1 and the positive input end of the first operational amplifier to supply power simultaneously. The Vcc end of the power supply, the other end of the parasitic capacitor C P is connected to the ground end of the power supply,

电阻R1的另一端接第二单刀双掷开关的动端,第二单刀双掷开关的一个静端接供电电源的Vcc端,第二单刀双掷开关的另一个静端接供电电源的地端,The other end of the resistor R1 is connected to the moving end of the second SPDT switch, one static end of the second SPDT switch is connected to the Vcc end of the power supply, and the other static end of the second SPDT switch is connected to the ground end of the power supply ,

第一运算放大器的信号输出端同时与电阻R2的一端同时和第一运算放大器的反向信号输入端连接,第一运算放大器的供电电源正极与供电电源的Vcc端连接,第一运算放大器的供电电源地端与供电电源的地端连接,电阻R2的另一端同时与第二运算放大器的正向信号输入端和第三运算放大器的正向信号输入端连接,第二运算放大器的反向信号输入端与供电电源的Vcc端连接,第三运算放大器的反向信号输入端与供电电源的Vcc端连接,The signal output terminal of the first operational amplifier is connected with the reverse signal input terminal of the first operational amplifier at the same time with one end of the resistor R2, the positive pole of the power supply of the first operational amplifier is connected with the Vcc end of the power supply, the power supply of the first operational amplifier The ground end of the power supply is connected to the ground end of the power supply, and the other end of the resistor R2 is simultaneously connected to the forward signal input end of the second operational amplifier and the forward signal input end of the third operational amplifier, and the reverse signal input end of the second operational amplifier end is connected with the Vcc end of the power supply, and the reverse signal input end of the third operational amplifier is connected with the Vcc end of the power supply,

第二运算放大器的供电电源正极与供电电源的Vcc端连接,第二运算放大器的供电电源地端与供电电源的地端连接。The positive pole of the power supply of the second operational amplifier is connected to the Vcc terminal of the power supply, and the ground terminal of the power supply of the second operational amplifier is connected to the ground terminal of the power supply.

本实施方式中第二运算放大器和第三运算放大器均采用集成电路NE5532实现,第二运算放大器的反向信号输入端和第三运算放大器的反向信号输入端输入的电压范围为1.5v-2.5v,第一运算放大器采用集成电路CA3140实现,本实施方式中供电电源提供1.5v、2.5v和5v电压。In this embodiment, both the second operational amplifier and the third operational amplifier are implemented by integrated circuit NE5532, and the voltage range input by the reverse signal input terminal of the second operational amplifier and the reverse signal input terminal of the third operational amplifier is 1.5v-2.5 v, the first operational amplifier is realized by the integrated circuit CA3140, and the power supply provides voltages of 1.5v, 2.5v and 5v in this embodiment.

RP为模拟开关导通电阻及引线电阻。由于湿度传感器与标准电容在同一测量回路,且湿度传感器与标准电容另一端与地连接,寄生电容CP为湿度传感器及标准电容的接线寄生电容及与地之间的寄生电容。R P is the on-resistance and lead resistance of the analog switch. Since the humidity sensor and the standard capacitor are in the same measurement circuit, and the other end of the humidity sensor and the standard capacitor is connected to the ground, the parasitic capacitance C P is the parasitic capacitance of the connection between the humidity sensor and the standard capacitor and the parasitic capacitance between the ground.

当不对电容充电时,第二运算放大器和第三运算放大器(NE5532)输出都为零,当给电容充电时,两个运算放大器NE5532的同向输入端输入电压逐渐升高,当输入电压达到1.5V时,第二运算放大器的输出由低电平变为高电平,触发MCU外部中断,开始计时;当输入电压达到2.5V时,第三运算放大器的输出由低电平变为高电平,再次触发MCU外部中断,计时结束,这样就得到电容的充电时间。所以可以得到标准电容的充电时间Tsc,以及湿度传感器的充电时间Tmc,标准电容的电容值已知,假设为Cs,那么湿度传感器的电容值 When the capacitor is not charged, the output of the second operational amplifier and the third operational amplifier (NE5532) are both zero. When the capacitor is charged, the input voltage of the same input terminal of the two operational amplifiers NE5532 gradually increases. When the input voltage reaches 1.5 When V, the output of the second operational amplifier changes from low level to high level, which triggers an external interrupt of the MCU and starts timing; when the input voltage reaches 2.5V, the output of the third operational amplifier changes from low level to high level , trigger the MCU external interrupt again, and the timing ends, so that the charging time of the capacitor can be obtained. Therefore, the charging time T sc of the standard capacitor and the charging time T mc of the humidity sensor can be obtained. The capacitance value of the standard capacitor is known. Assuming it is C s , then the capacitance value of the humidity sensor

对标准电容及湿度传感器在相同的情况分别进行充电,电容充放电曲线如图9所示。The standard capacitance and the humidity sensor are charged under the same conditions, and the capacitance charge and discharge curve is shown in Figure 9.

其中TC为充电时间,TD为放电时间,Vm为充电饱和电压。假设标准电容从电压为Vs,充电至Ve所需的时间为Tsc,湿度传感器从电压为Vs,充电至Ve所需的时间为Tmc,标准电容的电容值为Cs,那么Among them, T C is the charging time, T D is the discharging time, and V m is the charging saturation voltage. Assume that the time required for the standard capacitor to charge from the voltage of V s to Ve is T sc , the time required for the humidity sensor to charge from the voltage of V s to Ve is T mc , and the capacitance value of the standard capacitor is C s , So

KK 11 CC mm == TT mm cc ×× KK 22 CC sthe s TT sthe s cc ,, -- -- -- (( 1212 ))

K1为考虑模拟开关及引线电阻、寄生电容对湿度传感器电容值的影响,K2为考虑模拟开关及引线电阻、寄生电容对标准电容值的影响,由于湿度传感器与标准电容在同一回路,K1=K2,那么被测电容Cm可由式(13)得到。K 1 is to consider the influence of the analog switch and lead resistance and parasitic capacitance on the capacitance value of the humidity sensor. K 2 is to consider the influence of the analog switch and lead resistance and parasitic capacitance on the standard capacitance value. Since the humidity sensor and the standard capacitance are in the same loop, K 1 =K 2 , then the measured capacitance C m can be obtained from formula (13).

CC mm == TT mm cc ×× CC sthe s TT sthe s cc ,, -- -- -- (( 1313 ))

本实施方式具有很好的温度稳定性,能够有效的抑制温度漂移和零点漂移,减小了寄生电容对测量结果的影响。需要注意的是:考虑到分布电容及漏电流的影响,充电过程中电压不能选择0V~满量程区间;由于湿度传感器电容值在100pF~160pF之间,电容值较小,需合理调整充电时间常数,充电时间不易过长也不易过短,在保证较高的测量精度的同时缩短测量时间;充电电流不易过大,避免击穿湿度传感器;需选择具有高精度、较好的温度特性、高可靠性及稳定性的电容作为标准电容;充电电路中的运算放大器需具有较高的输入阻抗,较低的漏电流。This embodiment has good temperature stability, can effectively suppress temperature drift and zero point drift, and reduces the influence of parasitic capacitance on measurement results. It should be noted that: considering the influence of distributed capacitance and leakage current, the voltage cannot be selected in the range of 0V to full scale during charging; since the capacitance value of the humidity sensor is between 100pF and 160pF, the capacitance value is small, and the charging time constant needs to be adjusted reasonably , the charging time is not too long or too short, and the measurement time is shortened while ensuring high measurement accuracy; the charging current is not too large, so as to avoid breakdown of the humidity sensor; it is necessary to choose a sensor with high precision, good temperature characteristics, and high reliability. The capacitor with high performance and stability is used as the standard capacitor; the operational amplifier in the charging circuit needs to have high input impedance and low leakage current.

对本发明的地面试验:To the ground test of the present invention:

常温特性测试:采用双压法湿度发生器进行了湿度测量静态实验。湿度传感器工作范围为0%RH~100%RH,根据测试点选取原则及样本空间大小选取原则,选取了10%RH、30%RH、50%RH、70%RH、90%RH5个测试点,环境温度为+30℃,每个湿度点稳定20min后进行数据记录,相对湿度从10%RH上升至90%RH。实验结果如图10所示,拟合曲线表达式如(14)所示。Normal temperature characteristic test: The static experiment of humidity measurement was carried out by using the double pressure method humidity generator. The working range of the humidity sensor is 0% RH ~ 100% RH. According to the principle of selection of test points and the size of sample space, 5 test points of 10% RH, 30% RH, 50% RH, 70% RH and 90% RH were selected. The ambient temperature is +30°C, and the data is recorded after each humidity point is stable for 20 minutes, and the relative humidity rises from 10% RH to 90% RH. The experimental results are shown in Figure 10, and the fitting curve expression is shown in (14).

y=2.336x-256.553,(14)y=2.336x-256.553, (14)

从实验结果中可得出,确定系数为0.9963,湿度测量结果具有较好的线性度,灵敏度为2.336%RH/pF,标准差σ=1.917,电容测量分辨力为0.1pF,湿度测量分辨力约为0.2%RH。为了得到湿度测量的迟滞及重复性,进行了湿度上升及下降连续测试,实验结果如图11所示。It can be concluded from the experimental results that the coefficient of determination is 0.9963, the humidity measurement results have good linearity, the sensitivity is 2.336%RH/pF, the standard deviation σ=1.917, the capacitance measurement resolution is 0.1pF, and the humidity measurement resolution is about 0.2% RH. In order to obtain the hysteresis and repeatability of humidity measurement, a continuous test of humidity rise and fall was carried out, and the experimental results are shown in Figure 11.

测试温度为+30℃,湿度变化范围为10%RH-90%RH,选取了10%RH、30%RH、50%RH、70%RH、90%RH5个测试点,根据实验结果可知,湿度在上升过程与下降过程曲线的最大差值ΔHM≈0.7%RH,满量程输出YFS=100%RH,测量迟滞约为0.7%F·S,重复性约为1.9%。迟滞不确定度UH≈0.35%,线性不确定度UL=3%,重复性不确定度UR≈1.9%,那么总不确定度U≈4%。The test temperature is +30°C, the humidity range is 10%RH-90%RH, and 5 test points of 10%RH, 30%RH, 50%RH, 70%RH, and 90%RH are selected. According to the experimental results, the humidity The maximum difference ΔH M ≈0.7%RH in the rising process and the falling process curve, the full-scale output Y FS =100%RH, the measurement hysteresis is about 0.7%F·S, and the repeatability is about 1.9%. Hysteresis uncertainty U H ≈ 0.35%, linear uncertainty U L = 3%, repeatability uncertainty U R ≈ 1.9%, then the total uncertainty U ≈ 4%.

温度交变特性测试:在不对湿度传感器进行加热控制的情况下,分别于+10℃、0℃、-10℃、-40℃,-70℃温度条件下进行静态实验。通过控制湿度传感器的加热功率,使得传感器表面温度在不同环境温度条件下都维持在+20℃~+30℃左右,从而保证湿度传感器具有较好的测量特性,避免湿度传感器表面结露,加热功率参照表1数据进行控制。从测试结果中可知,当湿度传感器在低温环境下工作时,通过对湿度传感器加热,使得湿度传感器表面温度高于环境温度,其测量特性得到了明显的改善,避免了传感器结露的现象。Temperature alternating characteristic test: In the case of no heating control of the humidity sensor, static experiments were carried out at +10°C, 0°C, -10°C, -40°C, and -70°C. By controlling the heating power of the humidity sensor, the surface temperature of the sensor is maintained at around +20°C to +30°C under different ambient temperature conditions, so as to ensure that the humidity sensor has good measurement characteristics and avoid condensation on the surface of the humidity sensor. Refer to the data in Table 1 for control. It can be seen from the test results that when the humidity sensor works in a low temperature environment, the surface temperature of the humidity sensor is higher than the ambient temperature by heating the humidity sensor, and its measurement characteristics are significantly improved, avoiding the phenomenon of sensor condensation.

当湿度传感器在+10℃、0℃、-10℃、-40℃,-70℃温度环境下工作时,通过对湿度传感器进行加热后其灵敏度、平均误差、迟滞、重复性如表2所示。When the humidity sensor works in +10°C, 0°C, -10°C, -40°C, -70°C temperature environments, the sensitivity, average error, hysteresis, and repeatability of the humidity sensor are shown in Table 2 after heating the humidity sensor .

表2不同温度下加热湿度传感器后测量特性Table 2 Measurement characteristics after heating the humidity sensor at different temperatures

工作温度Operating temperature 灵敏度sensitivity 平均误差average error 迟滞hysteresis 重复性repeatability +10+10 2.338%RH/pF2.338%RH/pF 1.12%RH1.12%RH 1.16%F·S1.16% F·S 1.94%RH1.94%RH 00 2.322%RH/pF2.322%RH/pF 0.74%RH0.74%RH 0.93%F·S0.93%F·S 1.93%RH1.93%RH -10-10 2.327%RH/pF2.327%RH/pF 0.79%RH0.79%RH 1.40%F·S1.40% F·S 1.89%RH1.89%RH -40-40 2.261%RH/pF2.261%RH/pF 1.13%RH1.13%RH 1.96%F·S1.96%F·S 1.55%RH1.55%RH -70-70 2.182%RH/pF2.182%RH/pF 1.40%RH1.40%RH 1.98%F·S1.98% F·S 2.60%RH2.60%RH

时间常数测试:将自制的密封舱置于湿度发生器中,湿度传感器安装在密封舱内,通过电缆将湿度传感器的信号引出,通过控制密封舱内与密封盖连接的气缸的上下运动,可以控制密封舱的打开或关闭。设定湿度发生器的温度为+30℃,打开密封舱盖,设定湿度发生器初始湿度H0=30%,待湿度稳定后,关闭密封舱;设定湿度发生器的湿度H1=70%,待湿度稳定后,打开密封舱,同时每0.05s记录一次湿度值,假设某时刻tn湿度传感器测得的湿度值Hn满足式(15),那么tn便是湿度传感器的时间常数。Time constant test: Put the self-made sealed cabin in the humidity generator, install the humidity sensor in the sealed cabin, lead out the signal of the humidity sensor through the cable, and control the up and down movement of the cylinder connected to the sealed cover in the sealed cabin. The opening or closing of the airtight compartment. Set the temperature of the humidity generator to +30°C, open the airtight hatch, set the initial humidity of the humidity generator H 0 =30%, and close the airtight cabin after the humidity is stable; set the humidity of the humidity generator to H 1 =70 %, after the humidity is stable, open the airtight cabin, and record the humidity value every 0.05s at the same time, assuming that the humidity value H n measured by the humidity sensor at a certain time t n satisfies the formula (15), then t n is the time constant of the humidity sensor .

Hh 11 -- Hh nno Hh 11 -- Hh 00 == 63.263.2 %% ,, -- -- -- (( 1515 ))

图12为湿度传感器时间常数测试结果。从测试结果中可知,湿度传感器时间常数约为0.5s,与国外先进的RS92型探空仪湿度传感器时间常数相同,优于目前国内正在使用的GTS1型探空仪湿度传感器时间常数。Figure 12 shows the test results of the humidity sensor time constant. It can be seen from the test results that the time constant of the humidity sensor is about 0.5s, which is the same as the time constant of the foreign advanced RS92 radiosonde humidity sensor, and is better than the time constant of the GTS1 radiosonde humidity sensor currently in use in China.

本发明提供了一种具有蛇形加热器电极的平板夹心电容式湿度传感器结构及工艺制备方法,还提供了湿度检测电路,进行了地面特性实验。实验结果表明,设计的湿度传感器灵敏度约为2.3RH%/pF,迟滞约为0.7%F·S,重复性约为1.9%,测量总不确定度约为4%,时间常数约为0.5s,通过对传感器进行加热,使得湿度传感器在低温环境下能够保证其测量特性稳定,验证了该方法的科学性与有效性,为下一步工程化应用奠定技术基础。The invention provides a flat sandwich capacitive humidity sensor structure and a process preparation method with serpentine heater electrodes, and also provides a humidity detection circuit, and conducts a ground characteristic experiment. The experimental results show that the designed humidity sensor has a sensitivity of about 2.3RH%/pF, a hysteresis of about 0.7% F S, a repeatability of about 1.9%, a total measurement uncertainty of about 4%, and a time constant of about 0.5s. By heating the sensor, the humidity sensor can ensure the stability of its measurement characteristics in a low temperature environment, which verifies the scientificity and effectiveness of the method and lays a technical foundation for the next step of engineering application.

Claims (2)

1.一种湿度检测电路,其特征在于,所述湿度检测电路包括探空仪用加热式湿度传感器Cm、标准电容Cs、模拟电阻RP、寄生电容CP、电阻R1、电阻R2、三个运算放大器、2个单刀双掷开关和供电电源;1. A humidity detection circuit, characterized in that, the humidity detection circuit comprises a heating type humidity sensor C m for a radiosonde, a standard capacitance C s , an analog resistance R P , a parasitic capacitance C P , a resistance R1, a resistance R2, Three operational amplifiers, two SPDT switches and power supplies; 所述湿度传感器Cm的一端和标准电容Cs的一端同时接供电电源的地端,湿度传感器Cm的另一端与第一单刀双掷开关的一个静端连接,标准电容Cs的另一端与第一单刀双掷开关的另一个静端连接,One end of the humidity sensor C m and one end of the standard capacitor C s are connected to the ground terminal of the power supply at the same time, the other end of the humidity sensor C m is connected to a static end of the first single-pole double-throw switch, and the other end of the standard capacitor C s connected with the other static end of the first SPDT switch, 第一单刀双掷开关的动端与模拟电阻RP的一端连接,模拟电阻RP的另一端与寄生电容CP的一端、电阻R1的一端和第一运算放大器的正向输入端同时连接供电电源的Vcc端,寄生电容CP的另一端接供电电源的地端,The moving end of the first SPDT switch is connected to one end of the analog resistor R P , and the other end of the analog resistor R P is connected to one end of the parasitic capacitor C P , one end of the resistor R1 and the positive input end of the first operational amplifier to supply power simultaneously. The Vcc end of the power supply, the other end of the parasitic capacitor C P is connected to the ground end of the power supply, 电阻R1的另一端接第二单刀双掷开关的动端,第二单刀双掷开关的一个静端接供电电源的Vcc端,第二单刀双掷开关的另一个静端接供电电源的地端,The other end of the resistor R1 is connected to the moving end of the second SPDT switch, one static end of the second SPDT switch is connected to the Vcc end of the power supply, and the other static end of the second SPDT switch is connected to the ground end of the power supply , 第一运算放大器的信号输出端同时与电阻R2的一端同时和第一运算放大器的反向信号输入端连接,第一运算放大器的供电电源正极与供电电源的Vcc端连接,第一运算放大器的供电电源地端与供电电源的地端连接,电阻R2的另一端同时与第二运算放大器的正向信号输入端和第三运算放大器的正向信号输入端连接,第二运算放大器的反向信号输入端与供电电源的Vcc端连接,第三运算放大器的反向信号输入端与供电电源的Vcc端连接,The signal output terminal of the first operational amplifier is connected with the reverse signal input terminal of the first operational amplifier at the same time with one end of the resistor R2, the positive pole of the power supply of the first operational amplifier is connected with the Vcc end of the power supply, the power supply of the first operational amplifier The ground end of the power supply is connected to the ground end of the power supply, and the other end of the resistor R2 is simultaneously connected to the forward signal input end of the second operational amplifier and the forward signal input end of the third operational amplifier, and the reverse signal input end of the second operational amplifier end is connected with the Vcc end of the power supply, and the reverse signal input end of the third operational amplifier is connected with the Vcc end of the power supply, 第二运算放大器的供电电源正极与供电电源的Vcc端连接,第二运算放大器的供电电源地端与供电电源的地端连接。The positive pole of the power supply of the second operational amplifier is connected to the Vcc terminal of the power supply, and the ground terminal of the power supply of the second operational amplifier is connected to the ground terminal of the power supply. 2.根据权利要求1所述的一种湿度检测电路,其特征在于,第二运算放大器的反向信号输入端和第三运算放大器的反向信号输入端输入的电压范围为1.5v-2.5v。2. A kind of humidity detecting circuit according to claim 1, it is characterized in that, the voltage range of the reverse signal input terminal of the second operational amplifier and the reverse signal input terminal of the third operational amplifier is 1.5v-2.5v .
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