CN105783576B - A kind of composite heat-conducting fin - Google Patents
A kind of composite heat-conducting fin Download PDFInfo
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- CN105783576B CN105783576B CN201410813889.5A CN201410813889A CN105783576B CN 105783576 B CN105783576 B CN 105783576B CN 201410813889 A CN201410813889 A CN 201410813889A CN 105783576 B CN105783576 B CN 105783576B
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Abstract
The present invention provides a kind of composite heat-conducting fins comprising: the first conductive substrate, first conductive substrate are provided with multiple through holes perpendicular to first conductive substrate；Multiple second thermally conductive sheets, the upper and lower surfaces of first conductive substrate and the inner surface of through hole is arranged in second thermally conductive sheet, and the second thermally conductive sheet that the upper and lower surfaces of first conductive substrate are arranged in is basically parallel to the first conductive substrate, the second thermally conductive sheet that the inner surface of the through hole is arranged in is basically parallel to the inner surface of the through hole.
Description
Technical field
The invention belongs to a kind of radiating element more particularly to a kind of composite heat-conducting fins of high thermal conductivity.
Background technique
Heat Conduction Material has in national defense industry and national economy every field to be widely applied very much.With industrial production and section
The rapid development of technology, people propose update, higher requirement to Heat Conduction Material, in addition to thermal conductivity, it is desirable to which material has
Excellent comprehensive performance is for example light, workability, excellent in mechanical performance, resistant to chemical etching etc..
Cooling fin is often used in field of electronics to radiate.Cooling fin is usually to be made of the metal of high thermal conductivity
, heat can be transmitted in environment from heat generating components by modes such as conduction, convection current or radiation.But metal material is led
Hot property is limited, such as the thermal conductivity 377W/mK of copper, and the thermal conductivity of aluminium is 230W/mK.
High molecular material has the excellent molding of light, resistant to chemical etching, easy processing, electrical insulation capability, mechanics and antifatigue
The excellent feature such as function admirable；But high molecular material is insulator, and thermal conductivity is extremely low, greatly limit it
The application in thermally conductive field.
In recent years, graphene was attracted wide attention as a kind of new material in the whole world.It is by carbon atom with
sp2What the monoatomic layer of hydridization connection was constituted, theoretic throat is only 0.35nm, is the most thin two-dimentional material found at present
Material.Graphene is the basic unit for constituting other carbon materials, can be warped into the fullerene of zero dimension, curls into one-dimensional CNTs
Or it is stacked to three-dimensional graphite.This special construction has contained abundant and peculiar physical phenomenon, and graphene is made to show to be permitted
Mostly excellent physicochemical properties.Referred to herein is its thermal property, it has as a kind of low-dimensional nano-carbon material
The up to thermal conductivity of 3000W/mK~6000W/mK is the best material of presently found heating conduction.But graphene
Material also has a shortcoming, for example its folding resistance is poor, and the intensity of material is weak, can tear easily or because adhered to position occurs
It is displaced and generates damaged and entry material and fall off, therefore it can not be applied separately as heat sink material.
Since carbon nanotube is found since 1991, the very big attention of scientific circles and industrial circle is caused at once.Carbon nanotube
For the coaxial round tube for being made of several layers to tens of layers the carbon atom of hexagonal arrangement.Carbon nanotube have excellent thermal conductivity,
Electric property and mechanical performance.However, since carbon nanotube has very big draw ratio, thus its heat alongst
Conductance is very high, and the thermal conductivity of its vertical length direction is very low, this is unfavorable for carbon nanotube as Heat Conduction Material and carries out industrialization
Using.
To sum up, develop high bond strength, the composite heat-conducting fin of high heat conductance not only has great creativeness, for electricity
Sub- industrial emissions also have huge impetus.
Summary of the invention
The main object of the present invention is to provide a kind of composite heat-conducting fin of high thermal conductivity, which not only has higher
Thermal conductivity, bond strength also with higher is applied to the electronics such as integrated circuit, electronic device, heat exchanger, LED
In the radiator of equipment, plays rapid cooling and ensure that electronic component is efficient, stablize, the effect that the long-life runs.
In order to achieve the goal above, the present invention proposes following technical scheme:
A kind of composite heat-conducting fin comprising: the first conductive substrate, it is vertical which is provided with multiple through holes
In first conductive substrate；The upper and lower table of first conductive substrate is arranged in multiple second thermally conductive sheets, second thermally conductive sheet
The inner surface of face and through hole, and the second thermally conductive sheet that the upper and lower surfaces of first conductive substrate are arranged in is basically parallel to
First conductive substrate, the second thermally conductive sheet that the inner surface of the through hole is arranged in are basically parallel to the interior table of the through hole
Face.
First conductive substrate is thermally conductive same tropism Materials, and the thermal conductivity of first conductive substrate is 0.05W/mK
~500W/mK, second thermally conductive sheet be thermally conductive Metamaterials, along its in-plane thermal conductivity be 1000W/mK~
6000W/m·K。
First conductive substrate be metal foil, first conductive substrate with a thickness of 5 μm~500 μm, described second
Thermally conductive sheet with a thickness of 0.01 μm~10 μm.
The aperture of the through hole is 1 μm~1000 μm.
The density of the through hole is 102A/cm2~104A/cm2。
Second thermally conductive sheet includes graphene or carbon nano-tube film.
First conductive substrate is polymeric membrane, first conductive substrate with a thickness of 1 μm~1000 μm, described the
Two thermally conductive sheets with a thickness of 0.01 μm~10 μm.
A kind of composite heat-conducting fin comprising a conductive substrate, perpendicular to the conductive substrate setting multiple heat pipes and with point
Cloth the opposite upper and lower surfaces of the conductive substrate graphene, the heat pipe by being formed through the graphene of the conductive substrate,
And the stone of the upper and lower surfaces of the conductive substrate is arranged in basically perpendicular to the conductive substrate in the graphene for forming the heat pipe
Mertenyl is originally parallel to conductive substrate.
A kind of composite heat-conducting fin comprising a netted conductive substrate and coat the conductive substrate thermally conductive anisotropy it is thermally conductive
Layer, the mesh aperture of the conductive substrate are 1 μm~1000 μm；The heat-conducting layer coats the upper and lower surface and net of the conductive substrate
The hole wall in hole, the heat-conducting layer are 1000W/mK~6000W/mK along the thermal conductivity of its in-plane, its vertical plane side
To thermal conductivity be 1W/mK~100W/mK.
The heat-conducting layer on the conductive substrate with a thickness of 0.01 μm~10 μm, the heat-conducting layer is attached on hole wall
With a thickness of 0.01 μm~10 μm.
Compared to the prior art, composite heat-conducting fin provided by the invention has the advantages that (1) has excellent thermal diffusivity
Energy.The thermally conductive sheet of prior art preparation is usually to tile on the surface of the substrate, and direction of heat flow causes most perpendicular to the surface of substrate
Whole heat dissipation effect is unsatisfactory.And composite heat-conducting fin of the present invention, two surfaces of the first conductive substrate and through hole is interior
Surface is provided with the second thermally conductive sheet.The second thermally conductive sheet positioned at the lower surface of the first conductive substrate can not only transmit heat source
Heat be quickly dispersed in the surface of the first conductive substrate, and can be by obtained heat by investing the inner surface of through hole
Second thermally conductive sheet is quickly transferred to the second thermally conductive sheet of the first conductive substrate upper surface.It is transferred to the heat on top passes through second
Thermally conductive sheet surface is quickly spread, and realizes rapid cooling eventually by the mode of convection current and radiation.That is, the composite heat-conducting
The thermal conductivity on the direction perpendicular to the first conductive substrate surface can be improved in the second thermally conductive sheet through internal surface of hole of piece, from
And substantially increase the overall thermal conductivity of composite heat-conducting fin.Also, by carrying out reasonable aperture design and Kong Mi to through hole
Degree design can make the thermally conductive more uniform of composite heat-conducting fin.(2) second thermally conductive sheets and the first conductive substrate bond strength are high.It is existing
The second thermally conductive sheet for having technology to prepare is since it is laid in the first conductive substrate surface, and there are interfacial stresses between the two, thus holds
Easily lead to the removing of the second thermally conductive sheet.And composite heat-conducting fin of the present invention, the second thermally conductive sheet therein are not placed only in first and lead
Two surfaces up and down of hot radical piece, and be distributed in the inner surface of through hole, this is distributed in the interior of upper and lower surface and through hole
First conductive substrate is clipped in the middle and is entangled firm, to greatly improve by the layer structure that second thermally conductive sheet on surface is connected
The bond strength of second thermally conductive sheet and the first conductive substrate.
Detailed description of the invention
Fig. 1 is that the structural schematic diagram of composite heat-conducting fin of the present invention (wherein, 1 indicates the first conductive substrate；2 indicate to pass through
Perforation；3 indicate the second thermally conductive sheet).
Fig. 2 is the microscope photo for the composite heat-conducting fin that the embodiment of the present invention 1 obtains.
Fig. 3 a is Raman map measured by the location A of composite heat-conducting fin described in Fig. 2.
Fig. 3 b is Raman map measured by the B location of composite heat-conducting fin described in Fig. 2.
Specific embodiment
Composite heat-conducting fin provided by the invention and preparation method thereof is described further below with reference to attached drawing.
Substance provided by the present invention can be synthesized by marketable material or traditional chemical transform mode.
Other aspects of the present invention are apparent to those skilled in the art due to this disclosure
's.
Below in conjunction with specific embodiment, the present invention is furture elucidated.It should be understood that these embodiments are merely to illustrate the present invention
Rather than it limits the scope of the invention.
Unless otherwise defined or described herein, all professional and scientific terms used herein and the skilled people of art technology
Meaning known to member is identical.Furthermore any method similar to or equal to what is recorded and material all can be applied to the present invention
In method.
Referring to Fig. 1, the present invention provides a kind of composite heat-conducting fin.The composite heat-conducting fin includes: 1 He of the first conductive substrate
Multiple second thermally conductive sheets 3.First conductive substrate 1 is provided with multiple through holes 2 perpendicular to first conductive substrate 1.This
The upper and lower surfaces of first conductive substrate 1 and the inner surface of through hole is arranged in two thermally conductive sheets 3.Specifically, being arranged described
Second thermally conductive sheet 3 of the upper and lower surfaces of the first conductive substrate 1 is basically parallel to the first conductive substrate 1, is arranged in the through hole
Second thermally conductive sheet 3 of 2 inner surface is basically parallel to the inner surface of the through hole 2.
The composite heat-conducting fin is available by following preparation method.The preparation method comprises the following steps:
(1) the first conductive substrate 1 is subjected to surface cleaning processing, treatment process include: oil removing, pickling, washing, alcohol wash,
Drying；
Wherein, first conductive substrate 1 is thermally conductive same tropism Materials, and the thermal conductivity of first conductive substrate 1 is
0.05W/mK~500W/mK.First conductive substrate 1 can be metal foil or polymeric membrane.When the first conductive substrate 1 is
When metal foil, first conductive substrate 1 with a thickness of 5 μm~500 μm, preferably 10 μm~100 μm.When the first conductive substrate
1 be polymeric membrane when, first conductive substrate 1 with a thickness of 1 μm~1000 μm, preferably 10 μm~100 μm.
(2) the first conductive substrate 1 after cleaning is subjected to aperture processing, aperture mode includes that laser boring, plasma are beaten
Hole, machine drilling, chemical etching hole etc. obtain multiple through holes 2；
Wherein, the hole density of the through hole 2 is 101A/cm2~106A/cm2, preferably 102A/cm2~104A/
cm2.When the first conductive substrate 1 is metal foil, the aperture of the through hole 2 is 1 μm~1000 μm；In order to enable first is thermally conductive
Substrate 1 radiates more evenly, and the aperture of the through hole 2 is preferably 10 μm~500 μm.When the first conductive substrate 1 is polymeric membrane
When, the aperture of the through hole 2 is 100nm~100 μm；In order to enable the heat dissipation of the first conductive substrate 1 is more evenly, through hole 2
Aperture is preferably 1 μm~50 μm；
(3) in the inner surface setting for the upper and lower surfaces and through hole 2 for carrying out the first conductive substrate 1 of aperture processing
Two thermally conductive sheets 3 make the second thermally conductive sheet 3 of the upper and lower surfaces that first conductive substrate 1 is arranged in be basically parallel to first thermally conductive
Substrate 1, the second thermally conductive sheet 3 that the inner surface of the through hole 2 is arranged in are basically parallel to the inner surface of the through hole 2.
Specifically, second thermally conductive sheet 3 is thermally conductive Metamaterials, the thermal conductivity along its in-plane is 1000W/
MK~6000W/mK.Since the second thermally conductive sheet 3 has thermally conductive anisotropy, when heat reaches the second thermally conductive sheet 2, heat meeting
Rapidly the high direction of thermal conductivity is transmitted and is dispersed in 3 plane of the second thermally conductive sheet, without being detained.Second thermally conductive sheet
With a thickness of 0.01 μm~10 μm.
Second thermally conductive sheet includes graphene or carbon nano-tube film.Second thermally conductive sheet 3 can pass through liquid phase deposition
Or chemical vapour deposition technique is formed in first conductive substrate 1.
When using liquid phase deposition, it can be pre-formed the dispersion liquid of containing graphene or carbon nanotube, then will be opened
First conductive substrate 1 of hole processing immerses in the dispersion liquid of containing graphene or carbon nanotube, takes out after a period of time, dries
Up to the composite heat-conducting fin.Specifically, graphene or carbon nanotube, dispersing agent and solvent are passed through high-speed stirred, ultrasound, ball
The means such as mill and/or sand milling are dispersed, and the dispersion liquid of homogeneous and stable containing graphene or carbon nanotube is obtained.The dispersion
Agent is oligomer of phenylamine.The oligomer of phenylamine has good dissolubility, dissolves in the solvent.The oligomer of phenylamine
Including one of aniline tripolymer, six aggressiveness of Tetraaniline, aniline pentamer or aniline or combination.The oligomer of phenylamine can
π-π interaction force is formed between graphene or carbon nanotube and realizes combination.Specifically, due in the oligomer of phenylamine
Phenyl ring it is close with graphene and carbon nano tube structure, thus the oligomer of phenylamine can between graphene or carbon nanotube shape
It realizes at pi-pi bond and is uniformly mixed with graphene or carbon nanotube.
The solvent can be deionized water, ethyl alcohol, acetone, isopropanol, butanol, ethyl acetate, toluene, chloroform, dimethyl
One of formamide, dimethyl sulfoxide dichloroethanes or combination.Graphite in the dispersion liquid of the containing graphene or carbon nanotube
The mass percent (i.e. solid content) of alkene or carbon nanotube is 0.1%~10%.It is appreciated that described second thermally conductive in order to help
Piece it is closer be adsorbed in first conductive substrate, can to first conductive substrate carry out negative electrical charge processing.Due to aniline
Oligomer is positively charged so that the dispersion liquid containing graphene or carbon nanotube is also positively charged, the first conductive substrate and graphene or
Adventitious deposit of the carbon nanotube by strong electrostatic attraction, realization graphene or carbon nanotube on the first conductive substrate surface,
To obtain composite heat-conducting fin.
When using chemical vapour deposition technique, it is anti-that the first conductive substrate 1 that can handle the aperture is put into chemical deposition
Area is answered, carbon-source gas and carrier gas are passed through, under certain temperature and pressure conditions, by chemical vapour deposition technique to realize in metal
The surface of foil 1 and the hole wall of through hole 2 deposit graphene or carbon nanotube.
This is deposited on the graphene on the surface of the first conductive substrate 1 and the inner surface of through hole 2 or carbon nanotube is linked to be one
Bodily form layered structure, and the first conductive substrate 1 is clipped in the middle and is entangled firm.I.e. described second thermally conductive sheet 3 covers described first
The surface of conductive substrate 1 and the inner surface of through hole 2.
When the material of second thermally conductive sheet 3 is graphene, the second thermally conductive sheet 3 graphene group pure by multilayer
At.The number of plies of graphene is 1 layer~100 layers in second thermally conductive sheet 3.Second thermally conductive sheet 3 with a thickness of 0.01 μm~
10μm.At this point, when the first conductive substrate is metal foil, the thermal conductivity of obtained composite heat-conducting fin be 500W/mK~
The bond strength of 2000W/mK, the second thermally conductive sheet and the first conductive substrate is 1Mpa~100Mpa；When the first conductive substrate is
When polymeric membrane, the thermal conductivity of obtained composite heat-conducting fin is 20W/mK~500W/mK, the second thermally conductive sheet and first thermally conductive
The bond strength of substrate is 1Mpa~20Mpa.
When the material of second thermally conductive sheet 3 is carbon nanotube, second thermally conductive sheet 3 is by multiple disorderly arranged carbon
Nanotube composition.Mutual one network structure of overlap to form of two adjacent carbon nanotubes.Second thermally conductive sheet 3 with a thickness of
0.01 μm~10 μm.
The present invention also provides another composite heat-conducting fins comprising a conductive substrate, perpendicular to the conductive substrate setting
The graphene of multiple heat pipes and the upper and lower surfaces opposite with the conductive substrate is distributed in.The heat pipe is by running through the thermally conductive base
The graphene of piece is formed.The graphene of the heat pipe is formed basically perpendicular to the conductive substrate, the conductive substrate is set
The graphene of upper and lower surfaces is basically parallel to conductive substrate.
The present invention also provides another composite heat-conducting fins comprising a netted conductive substrate and coats leading for the conductive substrate
The heat-conducting layer of hot anisotropy, the mesh aperture of the conductive substrate are 1 μm~1000 μm.The heat-conducting layer coats the conductive substrate
Upper and lower surface and mesh hole wall.The heat-conducting layer is 1000W/mK~6000W/m along the thermal conductivity of its in-plane
K, the thermal conductivity of its vertical in-plane are 1W/mK~100W/mK.
The composite heat-conducting fin is applied to the heat dissipation of integrated circuit, electronic device, heat exchanger or LED as heat dissipation element
In device.
Compared to the prior art, composite heat-conducting fin provided by the invention has the advantages that (1) has excellent thermal diffusivity
Energy.The thermally conductive sheet of prior art preparation is usually to tile on the surface of the substrate, and direction of heat flow causes most perpendicular to the surface of substrate
Whole heat dissipation effect is unsatisfactory.And composite heat-conducting fin of the present invention, two surfaces of the first conductive substrate and through hole is interior
Surface is provided with the second thermally conductive sheet.The second thermally conductive sheet positioned at the lower surface of the first conductive substrate can not only transmit heat source
Heat be quickly dispersed in the surface of the first conductive substrate, and can be by obtained heat by investing the inner surface of through hole
Second thermally conductive sheet is quickly transferred to the second thermally conductive sheet of the first conductive substrate upper surface.It is transferred to the heat on top passes through second
Thermally conductive sheet surface is quickly spread, and realizes rapid cooling eventually by the mode of convection current and radiation.That is, the composite heat-conducting
The thermal conductivity on the direction perpendicular to the first conductive substrate surface can be improved in the second thermally conductive sheet through internal surface of hole of piece, from
And substantially increase the overall thermal conductivity of composite heat-conducting fin.Also, by carrying out reasonable aperture design and Kong Mi to through hole
Degree design can make the thermally conductive more uniform of composite heat-conducting fin.(2) second thermally conductive sheets and the first conductive substrate bond strength are high.It is existing
The second thermally conductive sheet for having technology to prepare is since it is laid in the first conductive substrate surface, and there are interfacial stresses between the two, thus holds
Easily lead to the removing of the second thermally conductive sheet.And composite heat-conducting fin of the present invention, the second thermally conductive sheet therein are not placed only in first and lead
Two surfaces up and down of hot radical piece, and be distributed in the inner surface of through hole, this is distributed in the interior of upper and lower surface and through hole
First conductive substrate is clipped in the middle and is entangled firm, to greatly improve by the layer structure that second thermally conductive sheet on surface is connected
The bond strength of second thermally conductive sheet and the first conductive substrate.
To further describe the present invention, here is the preparation method of the graphene composite film-stuck, under different parameters
Specific embodiment:
Embodiment 1:
The copper foil of 35 μ m-thicks is chosen, and carries out oil removing to it, the cleaning treatments such as pickling, washing, alcohol are washed, dried.It will cleaning
Copper foil afterwards carries out laser boring processing, obtains multiple through holes.The aperture of the through hole is 100 μm, hole density 2000
A/cm2.Then the processed copper foil of aperture will be carried out and be put into chemical vapor deposition reaction zone, be passed through methane and reductive hydrogen,
Under 1000 DEG C and 50Pa pressure conditions, graphene layer is deposited in the hole wall of copper foil surface and through hole.Finally obtain graphene
Composite copper foil.The graphene layer with a thickness of 0.05 μm.
The graphene composite copper foil is tested for the property.Specifically, being measured by heat reflection method film coefficient of heat transfer
Instrument (model Nano TR, German NETZSCH company) measures its thermal conductivity；By pulling open method adhesion-force tester (model
PosiTest AT, DeFelsko company, the U.S.) measure the bond strength of graphene and metal foil.Test result are as follows: the graphite
The thermal conductivity of alkene composite copper foil is 1000W/mK, and the bond strength of graphene and copper foil is 10Mpa.
Also the graphene composite copper foil take pictures under microscope and Raman spectrum test.Referring to Fig. 2,
It can be seen that being evenly distributed with multiple through holes on the surface of copper foil.Please refer to Fig. 3 a and Fig. 3 b, it is seen then that copper foil surface and pass through
The obtained Raman figure in the position of perforation is in 1600cm-1And 2700cm-1Position nearby occurs corresponding respectively to graphene
The peak G and the peak 2D absorption peak, this explanation on the surface of copper foil and the inner wall of through hole is all covered with the graphene.
Embodiment 2:
10g graphene, 3g Tetraaniline and 990g ethyl alcohol are weighed, is uniformly mixed under high velocity agitation and is formed solid content and be
1% graphene dispersing solution.The goldleaf of 5 μ m-thicks is chosen, and carries out oil removing to it, at the cleanings such as pickling, washing, alcohol are washed, dried
Reason.Goldleaf after cleaning is subjected to plasma aperture processing, obtains multiple through holes.The aperture of the through hole is 1 μm, Kong Mi
Degree is 105A/cm2.Then the processed goldleaf of aperture will be carried out to be immersed in above-mentioned graphene dispersing solution, taken out after 5min, dried
The dry compound goldleaf of graphene to obtain the final product.Graphene layer, the thickness of the graphene layer are formed on the surface of goldleaf and the hole wall of through hole
Degree is 0.5 μm.
The compound goldleaf of the graphene is tested for the property.Test method is the same as embodiment 1.Test result are as follows: the stone
The thermal conductivity of the black compound goldleaf of alkene is 1000W/mK, and the bond strength of graphene and goldleaf is 20Mpa.
Embodiment 3:
5g graphene, 2g aniline pentamer and 995g acetone are weighed, is uniformly mixed under high velocity agitation and is formed solid content and be
5 ‰ graphene dispersing solution.The silver foil of 100 μ m-thicks is chosen, and carries out oil removing to it, the cleaning such as pickling, washing, alcohol are washed, dried
Processing.Silver foil after cleaning is subjected to chemical etching aperture processing, obtains multiple through holes.The aperture of the through hole is 10 μ
M, hole density is 104A/cm2.Then the processed silver foil of aperture will be carried out to be immersed in above-mentioned graphene dispersing solution, after 2min
It takes out, the compound silver foil of graphene obtained by drying.Graphene layer, the graphene are formed on the surface of silver foil and the hole wall of through hole
Layer with a thickness of 0.1 μm.
The compound silver foil of the graphene is tested for the property.Test method is the same as embodiment 1.Test result are as follows: the stone
The thermal conductivity of the black compound silver foil of alkene is 1500W/mK, and the bond strength of graphene and silver foil is 5Mpa.
Embodiment 4:
2g graphene, six aggressiveness of 2g aniline and 998g tetrahydrofuran are weighed, formation is uniformly mixed under high velocity agitation and contains admittedly
The graphene dispersing solution that amount is 2 ‰.Choose aperture be 50 μm, hole density 102A/cm2, with a thickness of 500 μm of porous PET films,
And it is started the cleaning processing and negative electrical charge processing.Then above-mentioned stone will be immersed in by the porous PET film of negative electrical charge processing
It in black alkene dispersion liquid, is taken out after 10min, the compound PET film of graphene obtained by drying.In the surface of PET film and the hole wall of through hole
Formed graphene layer, the graphene layer with a thickness of 0.3 μm.
The compound PET film of the graphene is tested for the property.Test method is the same as embodiment 1.Test result are as follows: the stone
The thermal conductivity of the black compound PET film of alkene is 20W/mK, and the bond strength of graphene and PET film is 2Mpa.
Embodiment 5:
The nickel plating copper foil of 200 μ m-thicks is chosen, and carries out oil removing to it, the cleaning treatments such as pickling, washing, alcohol are washed, dried.It will
Nickel plating copper foil after cleaning carries out laser boring processing, obtains multiple through holes.The aperture of the through hole is 50 μm, hole density
It is 103A/cm2.Then the processed nickel plating copper foil of aperture will be carried out and be put into chemical vapor deposition reaction zone, be passed through methane and hydrogen
Gas, under 1100 DEG C and 0.1Pa pressure conditions, in the hole wall deposition of carbon nanotubes layer of nickel plating copper foil surface and through hole.Finally
Obtain carbon nanotube composite nickel-plating copper foil.The carbon nanotube layer with a thickness of 0.1 μm.
The carbon nanotube composite nickel-plating copper foil is tested for the property.Test method is the same as embodiment 1.Test result are as follows:
The thermal conductivity of the carbon nanotube composite nickel-plating copper foil is 1200W/mK, and carbon nanotube and the bond strength of nickel plating copper foil are
5Mpa。
The above description of the embodiment is only used to help understand the method for the present invention and its core ideas.It should be pointed out that pair
For those skilled in the art, without departing from the principle of the present invention, the present invention can also be carried out
Some improvements and modifications, these improvements and modifications also fall within the scope of protection of the claims of the present invention.To these embodiments
A variety of modifications are it will be apparent that the general principles defined herein can be not for those skilled in the art
It is realized in other embodiments in the case where being detached from the spirit or scope of the present invention.Therefore, the present invention is not intended to be limited to this
These embodiments shown in text, and it is to fit to the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. a kind of composite heat-conducting fin, characterized in that it comprises:
First conductive substrate, first conductive substrate are provided with multiple through holes perpendicular to first conductive substrate；
Multiple second thermally conductive sheets, second thermally conductive sheet are arranged in the upper and lower surfaces and through hole of first conductive substrate
Surface, and the second thermally conductive sheet that the upper and lower surfaces of first conductive substrate are arranged in is basically parallel to the first conductive substrate, if
Set the inner surface that the second thermally conductive sheet in the inner surface of the through hole is basically parallel to the through hole；
Wherein, first conductive substrate is metal foil, and second thermally conductive sheet is graphene, and the graphene is heavy by liquid phase
Area method is formed in the metal foil；
The process of the liquid phase deposition are as follows: graphene, dispersing agent and solvent are dispersed, the dispersion of containing graphene is obtained
Then the first conductive substrate for carrying out aperture processing is immersed in dispersion liquid, is taken out after dipping by liquid, drying obtains the composite guide
Backing；Wherein, the dispersing agent is oligomer of phenylamine, and the oligomer of phenylamine includes aniline tripolymer, Tetraaniline, aniline
One of six aggressiveness of pentamer or aniline or combination, form pi-pi bond between the oligomer of phenylamine and graphene.
2. a kind of composite heat-conducting fin as described in claim 1, which is characterized in that first conductive substrate is thermally conductive same tropism
Material, the thermal conductivity of first conductive substrate are 0.05W/mK~500W/mK, and second thermally conductive sheet is thermally conductive incorgruous
Property material, along its in-plane thermal conductivity be 1000W/mK~6000W/mK.
3. a kind of composite heat-conducting fin as claimed in claim 2, which is characterized in that first conductive substrate with a thickness of 5 μm
~500 μm, second thermally conductive sheet with a thickness of 0.01 μm~10 μm.
4. a kind of composite heat-conducting fin as claimed in claim 3, which is characterized in that the aperture of the through hole is 1 μm~1000 μ
m。
5. a kind of composite heat-conducting fin as claimed in claim 4, which is characterized in that the density of the through hole is 101A/cm2~
106A/cm2。
6. a kind of composite heat-conducting fin as described in claim 1, which is characterized in that it includes a netted conductive substrate and cladding should
The heat-conducting layer of the thermally conductive anisotropy of conductive substrate, the mesh aperture of the conductive substrate are 1 μm~1000 μm；The heat-conducting layer packet
The upper and lower surface of the conductive substrate and the hole wall of mesh are covered, the heat-conducting layer is 1000W/mK along the thermal conductivity of its in-plane
The thermal conductivity of~6000W/mK, its vertical in-plane are 1W/mK~100W/mK, and the heat-conducting layer includes graphene.
7. a kind of composite heat-conducting fin as claimed in claim 6, which is characterized in that thickness of the heat-conducting layer on the conductive substrate
Degree be 0.01 μm~10 μm, the heat-conducting layer be attached on hole wall with a thickness of 0.01 μm~10 μm.
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| CN201410813889.5A CN105783576B (en) | 2014-12-24 | 2014-12-24 | A kind of composite heat-conducting fin |
| EP15865917.7A EP3228592A4 (en) | 2014-12-02 | 2015-11-27 | DISPERSANT OF GRAPHENE AND ITS APPLICATION |
| PCT/CN2015/095742 WO2016086796A1 (en) | 2014-12-02 | 2015-11-27 | Graphene dispersant and application thereof |
| TW104139658A TWI602611B (en) | 2014-12-02 | 2015-11-27 | Graphene dispersant and its application |
| US15/607,552 US10696790B2 (en) | 2014-12-02 | 2017-05-29 | Graphene dispersant and application thereof |
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| CN102906015A (en) * | 2011-02-09 | 2013-01-30 | 创业发展联盟技术有限公司 | Method for producing multilayer graphene coated substrate |
| CN103086362A (en) * | 2012-12-11 | 2013-05-08 | 武汉工程大学 | Preparation method for electroactive aniline oligomer-modified graphene |
| CN203015365U (en) * | 2012-12-24 | 2013-06-19 | 郑淳展 | heat sink |
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| US4010519A (en) * | 1975-11-24 | 1977-03-08 | Shur-Lok Corporation | Fastener structures utilizing a thermoplastic adhesive |
| DE3035749A1 (en) * | 1980-09-22 | 1982-05-06 | Siemens AG, 1000 Berlin und 8000 München | HEAT-DISCHARGE PCB |
| CN100556264C (en) * | 2007-08-07 | 2009-10-28 | 哈尔滨工程大学 | A kind of preparation method of graphite-metal compound heat dispersion base material |
| JP2011000884A (en) * | 2009-06-17 | 2011-01-06 | Laird Technologies Inc | Suitable multilayer heat conductive intermediate structure, and memory module equipped with the same |
| CN204461194U (en) * | 2014-12-24 | 2015-07-08 | 中国科学院宁波材料技术与工程研究所 | A kind of composite heat-conducting fin |
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| CN102906015A (en) * | 2011-02-09 | 2013-01-30 | 创业发展联盟技术有限公司 | Method for producing multilayer graphene coated substrate |
| CN103258802A (en) * | 2012-02-15 | 2013-08-21 | 松下电器产业株式会社 | Graphite structure, and electronic device using same |
| CN103086362A (en) * | 2012-12-11 | 2013-05-08 | 武汉工程大学 | Preparation method for electroactive aniline oligomer-modified graphene |
| CN203015365U (en) * | 2012-12-24 | 2013-06-19 | 郑淳展 | heat sink |
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