CN105759352B - Hot non-sensitive type planar optical waveguide and preparation method thereof - Google Patents
Hot non-sensitive type planar optical waveguide and preparation method thereof Download PDFInfo
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- CN105759352B CN105759352B CN201510385994.8A CN201510385994A CN105759352B CN 105759352 B CN105759352 B CN 105759352B CN 201510385994 A CN201510385994 A CN 201510385994A CN 105759352 B CN105759352 B CN 105759352B
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- 230000003287 optical effect Effects 0.000 title claims abstract description 114
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 239000000463 material Substances 0.000 claims abstract description 94
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 22
- 239000011162 core material Substances 0.000 claims abstract description 16
- 239000010410 layer Substances 0.000 claims description 116
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 29
- 239000004411 aluminium Substances 0.000 claims description 24
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 24
- 229910052782 aluminium Inorganic materials 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 23
- 238000004528 spin coating Methods 0.000 claims description 23
- 239000011241 protective layer Substances 0.000 claims description 19
- 229920002120 photoresistant polymer Polymers 0.000 claims description 18
- 239000000377 silicon dioxide Substances 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 13
- 238000000227 grinding Methods 0.000 claims description 12
- 238000005498 polishing Methods 0.000 claims description 11
- -1 fluorinated acrylic ester Chemical class 0.000 claims description 7
- 229910052732 germanium Inorganic materials 0.000 claims description 6
- 238000001259 photo etching Methods 0.000 claims description 6
- 238000011161 development Methods 0.000 claims description 5
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- 238000005530 etching Methods 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 238000001020 plasma etching Methods 0.000 claims description 3
- 238000003682 fluorination reaction Methods 0.000 claims 1
- 229920002313 fluoropolymer Polymers 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
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- 230000008034 disappearance Effects 0.000 description 4
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- 239000002861 polymer material Substances 0.000 description 4
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- 238000012827 research and development Methods 0.000 description 3
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- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Optical Integrated Circuits (AREA)
Abstract
The invention discloses a kind of hot non-sensitive type planar optical waveguides and preparation method thereof, which includes: basal layer and sandwich layer, and the sandwich layer is formed on the basal layer；The planar optical waveguide further includes the top covering for being coated on the sandwich layer surrounding；Top covering material includes ultraviolet polymerization formula fluorinated polymeric material, and base layer material and core material are inorganic optical materials.Hot non-sensitive type planar optical waveguide of the invention has many advantages, such as that the interference performances such as the small, anti-electromagnetic wave of optical transmission loss are strong.
Description
Technical field
The present invention relates to fiber waveguide device field, a kind of hot non-sensitive type planar optical waveguide and its preparation are related in particular to
Method.
Background technique
Optical waveguide is guidance light wave in the medium apparatus wherein propagated, also known as dielectric optical waveguide.Optical waveguide has a two major classes: one
Class is integrated light guide, including plane (film) dielectric optical waveguide and slab dielectric optical waveguide, they are usually all that photoelectricity is integrated
A part in device (or system), so referred to as integrated light guide；Another kind of is cylindrical light waveguide, commonly referred to as optical fiber.
Transmission of the light in optical waveguide is affected by extraneous factors such as temperature, to will affect made using optical waveguide
The stability of the integrated optoelectronic device (or system) of work, so existing integrated optoelectronic device (or system) is general all to install temperature
Regulating device stablizes the temperature under its use state, prevents its performance from becoming with the change of temperature bad.But general temperature
Degree regulating device (such as device is actively heated or cooled) is all costly, the energy of consumption is larger, volume is big.
Although bringing in the prior art to overcome the problems, such as above-mentioned use temperature-adjusting device, some solution party are proposed
Method, if be distributed in two optical transport layer for example, there is some the ratio between thermo-optical coeffecients for utilizing two optical transport layers of satisfaction to be equal to
The inverse of the ratio between Light Energy then includes that the effective refractive index of the optical waveguide of two optical transport layer does not vary with temperature and changes
This principle, the temperature-resistant planar optical waveguide produced, traditional way is that planar optical waveguide includes plane base
The first surrounding layer and thermo-optical coeffecient for the inorganic optical material that sandwich layer that bottom, thermo-optical coeffecient are positive, thermo-optical coeffecient are positive are negative
Organic optical materials the second surrounding layer, which is located on planar substrates layer, and the of one layer very thin is first covered on sandwich layer
One surrounding layer, then one layer of second surrounding layer is covered on the first surrounding layer.Using the first very thin surrounding layer, make to be distributed in
Disappearance field energy in second surrounding layer increases, to reduce the requirement to the second surrounding layer thermo-optical coeffecient, to realize planar light
The temperature-resistant function of waveguide.But just because of the disappearance field energy for needing increase to be distributed in the second surrounding layer, causes
The Light Energy of distribution in the core correspondingly reduces, and optical transmission loss just increases, so existing this to temperature-insensitive
The general optical transmission loss of planar optical waveguide it is all larger, and interference by external electromagnetic wave etc. is easy, so that people
Produce that optical transmission loss is big, prejudice vulnerable to interference etc. to this planar optical waveguide, without industrially using.
Summary of the invention
For this purpose, technical problem to be solved by the present invention lies in overcome temperature-resistant plane light wave in the prior art
The optical transmission loss led is big, problem vulnerable to interference etc., proposes that a kind of interference performances such as the small, anti-electromagnetic wave of optical transmission loss are strong
Hot non-sensitive type planar optical waveguide and preparation method thereof.
A kind of hot non-sensitive type planar optical waveguide of the invention, comprising:
Basal layer and sandwich layer, the sandwich layer are formed on the basal layer；
It further include the top covering for being coated on the sandwich layer surrounding；
Top covering material includes ultraviolet polymerization formula fluorinated polymeric material, and base layer material and core material are inorganic light
Learn material.
Preferably, the sign symbol of the thermo-optical coeffecient of the base layer material and core material and the top covering material
The sign symbol of thermo-optical coeffecient is opposite.
Preferably, the refractive index of the top covering material is greater than the refractive index of the base layer material.
Preferably, the ultraviolet polymerization formula fluorinated polymeric material includes fluorinated acrylic ester.
Preferably, the base layer material includes silica, and the core material includes the titanium dioxide of germanium ion doping
Silicon.
Preferably, the cross section structure of the planar optical waveguide is to bury bar shaped single mode waveguide structure.
A kind of method preparing the hot non-sensitive type planar optical waveguide of the invention, comprising the following steps:
One layer of inorganic optical material is grown on the base layer, carries out ion doping, it is anneal hardening；
It repeats the above steps repeatedly, until growing with certain thickness inorganic optical material layer；
One layer of aluminium protective layer is sputtered on inorganic optical material layer；
The spin coating photoresist on aluminium protective layer is gone after carrying out photoetching and development to obtain required pattern using aluminium corrosive agent
Except extra aluminium protective layer；
Inorganic optical material layer is performed etching using reactive ion etching method, remaining photoresist is removed later and aluminium is protected
Sheath forms core structure；
In sandwich layer surrounding spin coating ultraviolet polymerization formula fluorinated polymeric material, top covering structure is formed.
Preferably, the spin coating photoresist on aluminium protective layer specifically includes the following steps:
With 2500-3500 rpms of revolving speed on aluminium protective layer spin coating photoresist, it is hard at a temperature of 60-70 DEG C later
Film 10-20 minutes, then carry out Temperature fall.
Preferably, it is described in sandwich layer surrounding spin coating ultraviolet polymerization formula fluorinated polymeric material specifically includes the following steps:
With 1500-2500 rpms of revolving speed in sandwich layer surrounding spin coating ultraviolet polymerization formula fluorinated polymeric material, later
Post bake 110-130 minutes at a temperature of 125-175 DEG C, then carry out Temperature fall.
Preferably, further comprising the steps of:
Be configured to correspondingly a variety of lapping liquids with the different grounds travel of diameter respectively, respectively with a variety of lapping liquids according to
The descending sequence of the diameter of its grounds travel used successively grinds planar optical waveguide end face, and milling time is 25-
35 minutes；
End face polishing is carried out to the planar optical waveguide after grinding using alkalescence polishing liquid, polishing time is 4-6 hour.
The above technical solution of the present invention has the following advantages over the prior art:
By using ultraviolet polymerization formula fluorinated polymeric material as top covering material in the present invention, since this kind of material has
There is the thermo-optical coeffecient of high chemistry, physical stability, good optical characteristics and superelevation, is transmitted in planar optical waveguide
The Light Energy overwhelming majority is distributed in basal layer and sandwich layer, and only sub-fraction evanescent field Energy distribution is in top covering, institute
To increase covering inorganic optical material on sandwich layer without auxiliary, it is only necessary to cover the top covering material on sandwich layer and just be able to satisfy two
The ratio between thermo-optical coeffecient of optical transport layer is equal to the condition reciprocal of the ratio between Light Energy being distributed in two optical transport layer, with reality
The effective refractive index of existing planar optical waveguide do not vary with temperature and change it is i.e. insensitive to heat, thus reduce optical transmission loss,
Improve the ability of the interference such as anti-electromagnetic wave.The present invention has that performance is good, high reliablity compared to all-polymer planar optical waveguide
The advantages that, while can guarantee that its loss, performance, reliability can reach the level that full silicon planar lightwave is led, Er Qieben
Invention, which is also led than full silicon planar lightwave, has many advantages, such as short manufacturing cycle, simple process, at low cost.
The present invention is greater than the refractive index of base layer material by the refractive index of setting top covering material, is meeting planar light
Under the requirement of waveguide optical transmission loss and anti-interference ability etc., disappearance field energy can be made more to be distributed in top covering, thus
The requirement to the superelevation thermo-optical coeffecient of top covering material can be reduced.
By the way that base layer material and core material is arranged for silica, since current silica is mainstream in the present invention
Planar optical waveguide material do not have to additional increase Innovation Input so be conducive to realize seamless interfacing with mainstream planar optical waveguide
And reduce research and development cost.
By multiple anneal hardening step in the present invention, lattice defect and internal stress can be eliminated, makes the titanium dioxide of growth
Silicon layer becomes dense uniform, and the foreign atom of implantation is made to be diffused into alternative site, ensure that the uniformity of doping.It is more by point
Secondary growth and doping further ensure the uniformity and two of doping to form certain thickness germanium ion doped silicon dioxide layer
The compactness of silicon oxide layer.
In the present invention by setting with 2500-3500 rpms of revolving speed on aluminium protective layer spin coating photoresist and
Post bake 10-20 minutes and Temperature fall at a temperature of 60-70 DEG C, improve the uniformity and flatness of photoresist film forming, are conducive to
The good pattern of verticality is formed in subsequent photoetching and development.
It is fluorinated with 1500-2500 rpms of revolving speed in sandwich layer surrounding spin coating ultraviolet polymerization formula in the present invention by setting
Polymer material and post bake 110-130 minutes and Temperature fall at a temperature of 125-175 DEG C improve polymer material film forming
Uniformity and flatness improve the quality of prepared planar optical waveguide.
By being configured to correspondingly a variety of lapping liquids with the different grounds travel of diameter respectively in the present invention, respectively with described more
Kind of lapping liquid simultaneously successively grinds simultaneously planar optical waveguide end face according to the descending sequence of the diameter of grounds travel used in it
The step of grinding 25-35 minutes, implements grinding steps by different level step by step, improves the effect of grinding, and pass through setting
End face polishing step improves the end face flatness and its precision of planar optical waveguide, ensure that it connect with other optical waveguides
Validity, to further reduce optical transmission loss.
Detailed description of the invention
In order to make the content of the present invention more clearly understood, it below according to specific embodiments of the present invention and combines
Attached drawing, the present invention is described in further detail, wherein
Fig. 1 is a kind of hot non-sensitive type planar optical waveguide of an embodiment of the present invention；
Fig. 2 is a kind of flow chart of method for preparing hot non-sensitive type planar optical waveguide of another embodiment of the invention；
Fig. 3 is the growth course figure that hot non-sensitive type planar optical waveguide is prepared in Fig. 2；
Fig. 4 is a kind of flow chart of method for preparing hot non-sensitive type planar optical waveguide of another embodiment of the invention.
Appended drawing reference indicates in figure are as follows: 1- basal layer, 2- sandwich layer, 3- top covering.
Specific embodiment
It is a kind of a kind of hot non-sensitive type planar optical waveguide of embodiment, comprising: basal layer 1 and sandwich layer 2, institute with reference to Fig. 1
Sandwich layer 2 is stated to be formed on the basal layer 1.
Above-mentioned hot non-sensitive type planar optical waveguide further includes the top covering 3 for being coated on the sandwich layer surrounding, the thickness of sandwich layer
For H1, width W1, top covering with a thickness of H2.Top covering material includes ultraviolet polymerization formula fluorinated polymeric material, this kind of material
Material has high chemistry, physical stability and good optical characteristics, and its refractive index and thermo-optical coeffecient can be according to tools
Body requires any adjustment in a certain range, need to equably can be only spin-coated on chip using spin coating method, technique is very simple
Singly and cost is relatively low.Preferably, the ultraviolet polymerization formula fluorinated polymeric material includes fluorinated acrylic ester.
Base layer material and core material are inorganic optical materials, the thermo-optical coeffecient of base layer material and core material
Sign symbol is opposite with the sign symbol of thermo-optical coeffecient of the top covering material (for example, the thermo-optical coeffecient of top covering material is
Negative, then the thermo-optical coeffecient of base layer material and core material is positive).
Above-mentioned hot non-sensitive type planar optical waveguide working principle is: when the inorganic optical material as basal layer and sandwich layer
Thermo-optical coeffecient is timing, and the thermo-optical coeffecient of the top covering including ultraviolet polymerization formula fluorinated polymeric material is negative, and compares basal layer
With the thermo-optical coeffecient of the inorganic optical material of sandwich layer numerically high an order of magnitude, and the Light Energy overwhelming majority point in waveguide
Cloth is in the inorganic optical material of waveguide basal layer and sandwich layer, and only sub-fraction evanescent field Energy distribution is in waveguide top covering
In the middle, if meeting the inorganic optical material of basal layer and sandwich layer and the top covering including ultraviolet polymerization formula fluorinated polymeric material
The ratio between thermo-optical coeffecient of material is equal to the inverse of the ratio between Light Energy being distributed in the two, and optical waveguide can be realized and effectively roll over
Rate is penetrated not vary with temperature and change.
By using ultraviolet polymerization formula fluorinated polymeric material as one of top covering material in the present embodiment, due to this kind of
Material has the thermo-optical coeffecient of high chemistry, physical stability, good optical characteristics and superelevation, in planar optical waveguide
The Light Energy overwhelming majority of transmission is distributed in basal layer and sandwich layer, and only sub-fraction evanescent field Energy distribution is in top covering
In, so increasing covering inorganic optical material on sandwich layer without auxiliary, it is only necessary to cover the top covering material energy on sandwich layer
Meet the item reciprocal that the ratio between thermo-optical coeffecient of two optical transport layers is equal to the ratio between Light Energy being distributed in two optical transport layer
Part, to realize that the effective refractive index of planar optical waveguide does not vary with temperature and it is i.e. insensitive to heat to change, to reduce light biography
Defeated loss, the ability for improving the interference such as anti-electromagnetic wave.The present embodiment compared to all-polymer planar optical waveguide have performance it is good,
High reliability, while can guarantee that its loss, performance, reliability can reach the water that full silicon planar lightwave is led
It is flat, and the present embodiment is also led than full silicon planar lightwave has many advantages, such as short manufacturing cycle, simple process, at low cost.
The refractive index of the top covering material is greater than the refraction of the base layer material as a preferred implementation manner,
Rate.
It is greater than the refractive index of base layer material in the present embodiment by the refractive index of setting top covering material, it is flat meeting
Under the requirement of face optical waveguide optical transmission loss and anti-interference ability etc., disappearance field energy can be made more to be distributed in top covering,
So as to reduce the requirement to the superelevation thermo-optical coeffecient of top covering material.
The base layer material includes silica as a preferred implementation manner, the core material include germanium from
Sub- doping silicon dioxide.
By the way that base layer material and core material is arranged for silica, since current silica is main in the present embodiment
The planar optical waveguide material of stream does not have to additional increase research and development and throws so being conducive to realize seamless interfacing with mainstream planar optical waveguide
Enter and reduces research and development cost.
The cross section structure of the planar optical waveguide is to bury bar shaped single mode waveguide structure as a preferred implementation manner,.
H1=W1=6um, H2=10um are chosen, the refractive index of top covering is 1.45, and the refractive index of sandwich layer is 1.46, the refraction of basal layer
Rate is 1.44, using Optiwave BPM software design optical waveguide cross section structure, obtains preferable light field by digital simulation
Distribution map, and waveguide meets single mode transport condition, effective index of fundamental mode 1.4547.
It is a kind of process of method for preparing above-mentioned hot non-sensitive type planar optical waveguide of another embodiment with reference to Fig. 2
Figure, the specific steps of hot non-sensitive type planar optical waveguide is prepared corresponding to this, the generation of the hot non-sensitive type planar optical waveguide
Journey as shown in figure 3, the preparation method specifically includes the following steps:
Step S1: growing one layer of inorganic optical material 2-1 on basal layer 1, carries out ion doping, anneal hardening；It is preferred that
Ground, the method using plasma that one layer of inorganic optical material 2-1 is grown on basal layer 1 enhance chemical vapor deposition
Method.The basal layer uses silica.The ion uses germanium ion.
Step S2: repeating step S1 more times, until growing with certain thickness inorganic optical material layer 2-2；It is preferred that
Ground, the inorganic optical material layer 2-1 grown each time with a thickness of 2um, by obtaining inorganic optical material after repeatedly growing
The bed of material with a thickness of 6um.
Step S3: one layer of aluminium protective layer 4 is sputtered on inorganic optical material layer 2-2；Preferably, the aluminium protective layer 4
With a thickness of 100nm.
Step S4: the spin coating photoresist 5 on aluminium protective layer 4, after carrying out photoetching and development to obtain required pattern, using aluminium
Corrosive agent removes extra aluminium protective layer 4；It will be understood by those of skill in the art that the photoresist selects positive photoresist or negtive photoresist all
It is able to satisfy application demand, such as BP212 positive photo glue can be selected.Photolithography method can use ultraviolet photolithographic, after exposing 5s
Device is placed in the NaOH solution that concentration is 5 ‰ and is developed, the edge-perpendicular degree of obtained pattern is improved.
Step S5: inorganic optical material layer is performed etching using reactive ion etching method, removes remaining photoetching later
Glue 5 and aluminium protective layer 4 form 2 structure of sandwich layer；
Step S6: in sandwich layer surrounding spin coating ultraviolet polymerization formula fluorinated polymeric material, 3 structure of top covering is formed.Preferably,
The top covering 3 with a thickness of 10um, the cross section structure of the hot non-sensitive type planar optical waveguide obtained be bury bar shaped list
Mould waveguiding structure.
By multiple anneal hardening step in the present embodiment, lattice defect and internal stress can be eliminated, makes the dioxy of growth
SiClx layer becomes dense uniform, and the foreign atom of implantation is made to be diffused into alternative site, ensure that the uniformity of doping.By dividing
Repeatedly growth and adulterate to form certain thickness germanium ion doped silicon dioxide layer, further ensure doping uniformity and
The compactness of silicon dioxide layer.
As a preferred implementation manner, the above-mentioned spin coating photoresist 5 on aluminium protective layer 4 specifically includes the following steps:
With 2500-3500 rpms of revolving speed on aluminium protective layer 4 spin coating photoresist 5, later at a temperature of 60-70 DEG C
Post bake 10-20 minutes, then carry out Temperature fall.Preferably, revolving speed is 3000 rpms, rotational time 20s, at 65 DEG C
Post bake 15 minutes, improve the uniformity and flatness of film forming.
In the present embodiment by setting with 2500-3500 rpms of revolving speed on aluminium protective layer spin coating photoresist and
Post bake 10-20 minutes and Temperature fall at a temperature of 60-70 DEG C, improve the uniformity and flatness of photoresist film forming, are conducive to
The good pattern of verticality is formed in subsequent photoetching and development.
It is above-mentioned specific in 2 surrounding spin coating ultraviolet polymerization formula fluorinated polymeric material of sandwich layer as a preferred implementation manner,
The following steps are included:
With 1500-2500 rpms of revolving speed in sandwich layer surrounding spin coating ultraviolet polymerization formula fluorinated polymeric material, later
Post bake 110-130 minutes at a temperature of 125-175 DEG C, then carry out Temperature fall.Preferably, revolving speed is 2000 rpms, rotation
Turning the time is 20s, and post bake 120 minutes at 150 DEG C improve the uniformity and flatness of film forming.
By being arranged with 1500-2500 rpms of revolving speed in sandwich layer surrounding spin coating ultraviolet polymerization formula fluorine in the present embodiment
Fluidized polymer material and post bake 110-130 minutes and Temperature fall at a temperature of 125-175 DEG C improve polymer material film forming
Uniformity and flatness, improve the quality of prepared planar optical waveguide.
It is described anneal hardening as a preferred implementation manner, specifically includes the following steps:
120 DEG C are warming up to the heating rate of 10-20 DEG C/min, 20-30min is kept the temperature, later with the liter of 10-20 DEG C/min
Warm rate is warming up to 140 DEG C, keeps the temperature 20-30min, is warming up to 160 DEG C again later with the heating rate of 10-20 DEG C/min, heat preservation
20-30min cools to room temperature with the furnace later.Anneal hardening mode through the above way, can preferably eliminate lattice defect
And internal stress, so that the silicon dioxide layer of growth is become dense uniform, has better effect to the hard bottom of material, docile and obedient property etc..
As a preferred implementation manner, as shown in figure 4, the method for the present embodiment is further comprising the steps of:
Step S7: being configured to correspondingly a variety of lapping liquids with the different grounds travel of diameter respectively, a variety of is ground with described respectively
Grinding fluid successively grinds planar optical waveguide end face according to the descending sequence of the diameter of grounds travel used in it, milling time
It is 25-35 minutes.Preferably, it selects the grounds travel of 25um, 14um, 7um, 3.5um diameter to be configured to lapping liquid respectively, uses
The grounds travel of four kinds of diameters can obtain preferably grinding effect while improving grinding efficiency.
Step S8: end face polishing is carried out to the planar optical waveguide after grinding using alkalescence polishing liquid, polishing time is 4-6
Hour.
By being configured to correspondingly a variety of lapping liquids with the different grounds travel of diameter respectively in the present embodiment, respectively with described
A variety of lapping liquids simultaneously successively grind planar optical waveguide end face according to the descending sequence of the diameter of grounds travel used in it
And the step of grinding 25-35 minutes, implement grinding steps by different level step by step, improves the effect of grinding, and by setting
End face polishing step is set, the end face flatness and its precision of planar optical waveguide is improved, ensure that it connect with other optical waveguides
Validity, to further reduce optical transmission loss.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (8)
1. a kind of hot non-sensitive type planar optical waveguide, comprising:
Basal layer and sandwich layer, the sandwich layer are formed on the basal layer；
It is characterized in that,
It further include the top covering for being coated on the sandwich layer surrounding；
Top covering material includes ultraviolet polymerization formula fluorinated polymeric material, and base layer material and core material are inorganic optical materials
Material；The thermo-optical coeffecient of the sign symbol of the thermo-optical coeffecient of the base layer material and core material and the top covering material is just
Minus symbol is opposite；
The refractive index of the top covering material is greater than the refractive index of the base layer material.
2. hot non-sensitive type planar optical waveguide according to claim 1, which is characterized in that the ultraviolet polymerization formula fluorination is poly-
Closing object material includes fluorinated acrylic ester.
3. hot non-sensitive type planar optical waveguide according to claim 1, which is characterized in that the base layer material includes two
Silica, the core material include the silica of germanium ion doping.
4. hot non-sensitive type planar optical waveguide according to claim 1 to 3, which is characterized in that the planar optical waveguide
Cross section structure be bury bar shaped single mode waveguide structure.
5. a kind of method for preparing hot non-sensitive type planar optical waveguide described in claim 1, which is characterized in that including following step
It is rapid:
One layer of inorganic optical material is grown on the base layer, carries out ion doping, it is anneal hardening；
It repeats the above steps repeatedly, until growing with certain thickness inorganic optical material layer；
One layer of aluminium protective layer is sputtered on inorganic optical material layer；
The spin coating photoresist on aluminium protective layer is removed more after carrying out photoetching and development to obtain required pattern using aluminium corrosive agent
Remaining aluminium protective layer；
Inorganic optical material layer is performed etching using reactive ion etching method, removes remaining photoresist and aluminium protection later
Layer forms core structure；
In sandwich layer surrounding spin coating ultraviolet polymerization formula fluorinated polymeric material, top covering structure is formed.
6. according to the method described in claim 5, it is characterized in that, the spin coating photoresist on aluminium protective layer specifically include with
Lower step:
With 2500-3500 rpms of revolving speed on aluminium protective layer spin coating photoresist, later post bake at a temperature of 60-70 DEG C
10-20 minutes, then carry out Temperature fall.
7. according to the method described in claim 5, it is characterized in that, described in sandwich layer surrounding spin coating ultraviolet polymerization formula fluorinated polymers
Object material specifically includes the following steps:
With 1500-2500 rpms of revolving speed in sandwich layer surrounding spin coating ultraviolet polymerization formula fluorinated polymeric material, Zhi Hou
Post bake 110-130 minutes at a temperature of 125-175 DEG C, then carry out Temperature fall.
8. according to any method of claim 5-7, which is characterized in that further comprising the steps of:
Correspondingly a variety of lapping liquids are configured to the different grounds travel of diameter respectively, respectively with a variety of lapping liquids according to its institute
Successively planar optical waveguide end face is ground with the descending sequence of the diameter of grounds travel, milling time is 25-35 points
Clock；
End face polishing is carried out to the planar optical waveguide after grinding using alkalescence polishing liquid, polishing time is 4-6 hour.
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| CN108646345B (en) * | 2018-05-16 | 2020-04-14 | 德州尧鼎光电科技有限公司 | Method for manufacturing deep ultraviolet planar optical waveguide |
| CN110989078A (en) * | 2019-12-25 | 2020-04-10 | 易锐光电科技(安徽)有限公司 | Thin film optical waveguide and method for manufacturing the same |
| CN111045143B (en) * | 2019-12-30 | 2023-04-25 | 腾讯科技（深圳）有限公司 | Optical waveguide and method for manufacturing the same |
| CN116165741A (en) * | 2023-03-06 | 2023-05-26 | 珠海庞纳微半导体科技有限公司 | Optical waveguide, preparation method thereof, optical device and photoelectric integrated chip |
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