CN105755513A - Tinning preservative - Google Patents
Tinning preservative Download PDFInfo
- Publication number
- CN105755513A CN105755513A CN201610271871.6A CN201610271871A CN105755513A CN 105755513 A CN105755513 A CN 105755513A CN 201610271871 A CN201610271871 A CN 201610271871A CN 105755513 A CN105755513 A CN 105755513A
- Authority
- CN
- China
- Prior art keywords
- phenol
- acrylic acid
- preservative
- coating
- tin plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003755 preservative agent Substances 0.000 title claims abstract description 25
- 230000002335 preservative effect Effects 0.000 title claims abstract description 25
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 40
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 22
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 20
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 18
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000008367 deionised water Substances 0.000 claims abstract description 10
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 7
- 238000007747 plating Methods 0.000 claims description 27
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 3
- -1 polyoxyethylene Polymers 0.000 claims description 3
- 239000004094 surface-active agent Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract description 20
- 238000000576 coating method Methods 0.000 abstract description 20
- 238000005260 corrosion Methods 0.000 abstract description 7
- 230000007797 corrosion Effects 0.000 abstract description 7
- 238000007254 oxidation reaction Methods 0.000 abstract description 6
- 239000003963 antioxidant agent Substances 0.000 abstract description 5
- 230000003078 antioxidant effect Effects 0.000 abstract description 5
- 239000003381 stabilizer Substances 0.000 abstract description 4
- 238000006056 electrooxidation reaction Methods 0.000 abstract description 2
- 229910001432 tin ion Inorganic materials 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 1
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 230000000087 stabilizing effect Effects 0.000 abstract 1
- 230000002195 synergetic effect Effects 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000002421 anti-septic effect Effects 0.000 description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 238000010186 staining Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005518 electrochemistry Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000005028 tinplate Substances 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000002242 deionisation method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229940051841 polyoxyethylene ether Drugs 0.000 description 1
- 229920000056 polyoxyethylene ether Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a tinning preservative.The tinning preservative is prepared from phenol, acrylic acid, hydrochloric acid and deionized water.In a deionized water solution, the concentration of phenol ranges from 10 g/L to 50 g/L, the concentration of acrylic acid ranges from 10 mL/L to 50 mL/L, and the concentration of hydrochloric acid ranges from 10 mL/L to 50 mL/L.A stabilizing agent and an antioxidant have different stabilizing functions.Acrylic acid is mainly used for preventing divalent tin ions from being chemically oxidized, phenol has the function of inhibiting electrochemical oxidation, and therefore oxidization of Sn2+ can be effectively inhibited through the compounding and synergistic effect of phenol and acrylic acid, and the corrosion resisting performance of a tin coating can be enhanced well through mixing use of phenol and acrylic acid.Meanwhile, alkylphenol ethoxylates and other nonionic surfactants can also be added, the smooth and bright coating with uniform thickness is obtained, the anticorrosion performance is improved, and meanwhile the welding capacity of the coating is improved.
Description
Technical field
The present invention relates to a kind of tin plating field of electrochemistry, be specifically related to a kind of tin plating preservative.
Background technology
Metallic tin tool has been widely used and long applicating history.China, from the Bronze Age, just exploits cassiterite in a large number, has verified so far and still unquarried cassiterite remains little.On international market, stannum valency constantly rises, close to nickel valency.Therefore, economize on stannum, reduce its waste, both there is applied economics meaning, there is again long-range strategic importance.The stannum of the overwhelming majority is applied to surface treatment at present, two Main way: producing tin plate and electronic product, wherein tin plate ratio is very big again.
At present, in the tin plating process of all kinds of systems, all there are some impurity such as ferrum, zinc, nickel, copper, manganese and sulfur etc. in tin coating, these impurity are in tin coating surface or internal existence, when the coating moisture absorption of stannum is at its surface formation moisture film, and under hydrogen sulfide in oxygen or air or carbon dioxide or fumes of sulphuric acid participate in, forming the micro-galvanic element of countless electrochemistry on tin coating surface, it is oxidized and corrode that stannum loses electronics as battery one electrode.Meanwhile, after coating surface is oxidized, its solderability can be greatly reduced.
Summary of the invention
The technical problem to be solved is that tin coating is easily corroded, and solderability reduces, it is therefore intended that provide a kind of tin plating preservative, solves the corrosive problem of tin coating, can effectively prevent tin coating from go bad variable color, raising solderability.
The present invention is achieved through the following technical solutions:
A kind of tin plating preservative, comprises component phenol, acrylic acid, hydrochloric acid and deionized water.
Described each component concentration in aqueous is: phenol 10～50g/L, acrylic acid 10～50mL/L, hydrochloric acid 10～50mL/L.
Described each component concentration in aqueous is: phenol concentration is 20～25g/L, acrylic acid 25～30mL/L, hydrochloric acid 20～25mL/L.
Also include nonionic surfactant.
Described surfactant is alkylphenol polyoxyethylene.
Described nonionic surfactant concentration in deionization is 3～6mL/L.
The use temperature range of described tin plating preservative is 25～55 DEG C.
Wherein, phenol is as the antioxidant ingredients of tin plating preservative.Especially in acid system, Sn2+Easily aoxidized by anode, oxidation product Sn4+Corrosion resistance and the solderability of coating can be affected.Phenol is the chemical substance of a kind of reproducibility, can effectively alleviate Sn2+Degree of oxidation, improve the stablizing of plating solution.But the corrosion resistance of coating is affected little as antioxidant by independent phenol, need to add acrylic acid as stabilizer.Stabilizer has different Stabilization from antioxidant, and acrylic acid mainly prevents the chemical oxidation of divalent tin ion, and phenol then has the effect suppressing electrochemical oxidation, therefore can effectively suppress Sn by phenol and acrylic acid composite synergism2+Oxidation, both mix use can be good at strengthen tin coating corrosion resisting property.
Nonionic surfactant is adsorbed on copper electrode surface, temporarily hinder the stannum deposition on copper surface, thus the time that displacement reaction carries out can be extended, additionally surfactant can suppress nuclei growth in its surface adsorption, the speed of growth that can make each crystal face is close, forms the crystal of compact structure, marshalling.Significantly improve dispersibility and the covering power of plating solution, obtain smooth coating bright, in uniform thickness.The preferred alkylphenol polyoxyethylene of nonionic surfactant, such as bisphenol A polyethenoxy ether, bisphenol S polyoxyethylene ether etc..
The present invention compared with prior art, has such advantages as and beneficial effect:
1, the present invention is a kind of tin plating preservative, uses phenol as antioxidant and acrylic acid as stabilizer, and both complex roles use, and can effectively suppress Sn2+It is oxidized to Sn4+Oxidation, improve the stability of plating solution, add the antiseptic power of coating, improve the ability of the anti-complexion changed of stannum, improve 3-6 month than the anti-complexion changed time of the product used in prior art；
2, the present invention is that a kind of tin plating preservative, dispersibility and covering power are better, and coating crystal grain is careful, marshalling, has good solderability, can pass through twice reflow soldering；
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearly understand, below in conjunction with embodiment, the present invention is described in further detail, and exemplary embodiment and the explanation thereof of the present invention are only used for explaining the present invention, not as a limitation of the invention.
Embodiment 1
A kind of tin plating preservative, is mixed after claiming sample by following components proportioning, phenol 23g/L, acrylic acid 27mL/L, hydrochloric acid 25mL/L, and all the other are deionized water.The use temperature of tin plating preservative is 25 DEG C.
Compared with prior art, test coating through resisting salt fog corrosion and obvious rust staining just occurs after 48h.It is smooth that tin-plated product can be always maintained at light, extends 3 months than the existing product retention time.Show that there is higher antiseptic power.
Embodiment 2
A kind of tin plating preservative, is mixed after claiming sample by following components proportioning, phenol 10g/L, acrylic acid 12mL/L, hydrochloric acid 10mL/L and bisphenol A polyethenoxy ether 4mL/L, and all the other are deionized water.The use temperature of tin plating preservative is 40 DEG C.
Compared with prior art, test coating through resisting salt fog corrosion and obvious rust staining just occurs after 96h.Tin-plated product can be always maintained at smooth, extends 6 months than the existing product retention time.The present embodiment, dispersibility and covering power are best, and antiseptic property is best, and surfacing is compacted, and has good weldability.
Embodiment 3
A kind of tin plating preservative, is mixed after claiming sample by following components proportioning, phenol 46g/L, acrylic acid 50mL/L, hydrochloric acid 48mL/L and bisphenol A polyethenoxy ether 6mL/L, and all the other are deionized water.The use temperature of tin plating preservative is 50 DEG C.
Compared with prior art, test coating through resisting salt fog corrosion and obvious rust staining just occurs after 73h.Tin-plated product can be always maintained at smooth, extends 5 months than the existing product retention time.There is good antiseptic property.
Above-described detailed description of the invention; the purpose of the present invention, technical scheme and beneficial effect have been further described; it is it should be understood that; the foregoing is only the specific embodiment of the present invention; the protection domain being not intended to limit the present invention; all within the spirit and principles in the present invention, any amendment of making, equivalent replacement, improvement etc., should be included within protection scope of the present invention.
Claims (7)
1. a tin plating preservative, it is characterised in that comprise component phenol, acrylic acid, hydrochloric acid and deionized water.
2. a tin plating preservative according to claim 1, it is characterised in that described each component concentration in deionized water solution is: phenol 10～50g/L, acrylic acid 10～50mL/L, hydrochloric acid 10～50mL/L.
3. the tin plating preservative of one according to claim 2, it is characterised in that described each component concentration in deionized water solution is: phenol 20～25g/L, acrylic acid 25～30mL/L, hydrochloric acid 20～25mL/L.
4. the tin plating preservative of one according to claim 1, it is characterised in that also include nonionic surfactant.
5. the tin plating preservative of one according to claim 4, it is characterised in that described surfactant is alkylphenol polyoxyethylene.
6. the tin plating preservative of one according to claim 4 or 5, it is characterised in that described nonionic surfactant concentration in deionized water solution is 3～6mL/L.
7. the tin plating preservative of one according to any one of claim 1 to 6, it is characterised in that the use temperature range of described tin plating preservative is 25～55 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610271871.6A CN105755513A (en) | 2016-04-28 | 2016-04-28 | Tinning preservative |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610271871.6A CN105755513A (en) | 2016-04-28 | 2016-04-28 | Tinning preservative |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105755513A true CN105755513A (en) | 2016-07-13 |
Family
ID=56326108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610271871.6A Pending CN105755513A (en) | 2016-04-28 | 2016-04-28 | Tinning preservative |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105755513A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112144048A (en) * | 2020-09-21 | 2020-12-29 | 广州三孚新材料科技股份有限公司 | Chemical tin plating solution for heterojunction solar battery and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0889147A1 (en) * | 1996-02-29 | 1999-01-07 | Nippon Steel Corporation | Tin plating method and bath having wide optimum current density range |
| CN1390985A (en) * | 2001-05-24 | 2003-01-15 | 希普列公司 | Composition and method for tinplating |
| CN101476150A (en) * | 2008-12-29 | 2009-07-08 | 广州电器科学研究院 | Device and method for electroplating Sn-Cu alloy |
| CN101619470A (en) * | 2008-06-12 | 2010-01-06 | 罗门哈斯电子材料有限公司 | Electrolytic tin plating solution and electrolytic tin plating method |
| CN104562100A (en) * | 2014-12-31 | 2015-04-29 | 苏州禾川化学技术服务有限公司 | Multi-functional half-white brightness tin-plated additive |
| CN104988544A (en) * | 2015-06-26 | 2015-10-21 | 吕小方 | Electrolytic tinning annexing agent |
| CN105308218A (en) * | 2013-06-26 | 2016-02-03 | 株式会社杰希优 | Electroplating solution for tin or tin alloy, and use for same |
-
2016
- 2016-04-28 CN CN201610271871.6A patent/CN105755513A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0889147A1 (en) * | 1996-02-29 | 1999-01-07 | Nippon Steel Corporation | Tin plating method and bath having wide optimum current density range |
| CN1390985A (en) * | 2001-05-24 | 2003-01-15 | 希普列公司 | Composition and method for tinplating |
| CN101619470A (en) * | 2008-06-12 | 2010-01-06 | 罗门哈斯电子材料有限公司 | Electrolytic tin plating solution and electrolytic tin plating method |
| CN101476150A (en) * | 2008-12-29 | 2009-07-08 | 广州电器科学研究院 | Device and method for electroplating Sn-Cu alloy |
| CN105308218A (en) * | 2013-06-26 | 2016-02-03 | 株式会社杰希优 | Electroplating solution for tin or tin alloy, and use for same |
| CN104562100A (en) * | 2014-12-31 | 2015-04-29 | 苏州禾川化学技术服务有限公司 | Multi-functional half-white brightness tin-plated additive |
| CN104988544A (en) * | 2015-06-26 | 2015-10-21 | 吕小方 | Electrolytic tinning annexing agent |
Non-Patent Citations (1)
| Title |
|---|
| 上海轻工业专科学校编: "《电镀原理与工艺》", 30 November 1978, 上海科学技术出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112144048A (en) * | 2020-09-21 | 2020-12-29 | 广州三孚新材料科技股份有限公司 | Chemical tin plating solution for heterojunction solar battery and preparation method thereof |
| CN112144048B (en) * | 2020-09-21 | 2021-11-12 | 广州三孚新材料科技股份有限公司 | Electroless tin plating solution for heterojunction solar cell and preparation method thereof |
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Application publication date: 20160713 |