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CN105739031B - The laser diode Interface Matching device mounted based on COB - Google Patents

The laser diode Interface Matching device mounted based on COB Download PDF

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Publication number
CN105739031B
CN105739031B CN201610243402.3A CN201610243402A CN105739031B CN 105739031 B CN105739031 B CN 105739031B CN 201610243402 A CN201610243402 A CN 201610243402A CN 105739031 B CN105739031 B CN 105739031B
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CN
China
Prior art keywords
chip
laser diode
electric capacity
cob
drive integrated
Prior art date
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Active
Application number
CN201610243402.3A
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Chinese (zh)
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CN105739031A (en
Inventor
秦艳
高繁荣
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Wuhan Telecommunication Devices Co Ltd
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Wuhan Telecommunication Devices Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan Telecommunication Devices Co Ltd filed Critical Wuhan Telecommunication Devices Co Ltd
Priority to CN201610243402.3A priority Critical patent/CN105739031B/en
Publication of CN105739031A publication Critical patent/CN105739031A/en
Priority to PCT/CN2016/110352 priority patent/WO2017181701A1/en
Priority to US16/094,462 priority patent/US10700488B2/en
Application granted granted Critical
Publication of CN105739031B publication Critical patent/CN105739031B/en
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
    • H01S5/06832—Stabilising during amplitude modulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0427—Electrical excitation ; Circuits therefor for applying modulation to the laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The invention provides a kind of laser diode Interface Matching device mounted based on COB, including laser diode, drive integrated circult, the laser diode has a luminescence chip, the luminescence chip be chip dies and directly against dress on circuit boards, the drive integrated circult is made up of a driving chip, the driving chip is case chip, hold between the luminescence chip and the driving chip by one and hinder network connection, by the resistance real-time performance drive integrated circult that holds to laser diode offer bias current and modulation electric current, laser diode is set to be in excited state.The present invention solves the problem of being difficult matching by holding Interface Matching of the resistance real-time performance based on the COB laser diodes mounted and drive integrated circult, and has saved cost, improves production efficiency.

Description

The laser diode Interface Matching device mounted based on COB
Technical field
The present invention relates to laser diode Interface Matching device, more particularly to a kind of laser diode mounted based on COB Interface Matching device.
Background technology
Small-sized hot plug module is can applied to the miniaturization of 10Gbit/s Ethernets and 8.5Gbit/s fibre channel systems Plug optical module.The purpose of design of this module be by smaller volume and lower cost there is provided higher access density, It is final to improve user's access capacity.
The base and pipe cap cost accounting being currently based in the single channel device of coaxial scheme are higher, and use COB (CHIP ON BOARD) scheme, then without TO bases and pipe cap these materials, there is advantage from material in cost, and chip is direct Attachment reduces device to the assembling of module on circuit boards, in process, can be ensured by high-precision patch device.
The driving chip of small-sized hot plug module can be divided into nude film and case chip, and case chip has that thermal diffusivity is good, sexual valence Than high advantage, but and mounted based on COB laser diode Interface Matching when, because one end is case chip, the other end is gold Silk routing, is difficult matching.Therefore the laser diode of existing small-sized hot plug module is to use to be based on coaxial scheme, due to this The base of device and pipe cap cost accounting are higher in scheme, therefore production cost is higher, and need device to the assembling process of module, Complex process, low production efficiency.
It is therefore desirable to design a kind of Interface Matching device based on the COB laser diodes mounted, to solve above-mentioned ask Topic.
The content of the invention
It is an object of the invention to provide a kind of interface based on the COB laser diodes mounted and drive integrated circult With device, it is intended to be difficult to match with the interface of drive integrated circult for solving the existing laser diode based on COB attachments The problem of.
What the present invention was realized in：
The present invention provides a kind of laser diode Interface Matching device mounted based on COB, including laser diode, driving Integrated circuit, it is characterised in that：The laser diode has a luminescence chip, and the luminescence chip is chip dies and direct On circuit boards, the drive integrated circult is made up of a driving chip for attachment, and the driving chip is case chip, described luminous Hold between chip and the driving chip by one and hinder network connection, given and swashed by the appearance resistance real-time performance drive integrated circult Optical diode provides bias current and modulation electric current, laser diode is in excited state.
Further, the resistance network that holds includes six electric capacity, two resistance and two inductance.
Further, the laser diode also has a backlight chip, and the backlight chip is chip dies and direct Attachment is on circuit boards.
Further, the laser diode also has a lens, and the lens cap is placed on the luminescence chip and described In backlight chip.
Further, the lens are connected using adhesive means with circuit board.
Further, the driving chip is placed in outside the lens, holds resistance network and circuit board trace by described, most Afterwards gold wire bonding is done in the lens.
Further, connected between the backlight chip and the driving chip by a control circuit, the backlight core Piece receives the luminescence chip and sent and through the backlight of the reflection from lens, converts optical signals into electric signal and inputs to control electricity Road, then by control electronic feedback to drive integrated circult, realization is monitored backlight by drive integrated circult so as to by backlight in real time The stable stabilization for keeping the luminescence chip luminous.
Further, the control circuit has an alarm and diagnostic module, can according to the threshold value of setting there is provided alarm and Diagnostic operation.
The invention has the advantages that：
The Interface Matching device based on the COB laser diodes mounted of the present invention, is based on by holding resistance real-time performance The laser diode of COB attachments and the Interface Matching of drive integrated circult, solve the problem of being difficult matching, and use COB The laser diode of attachment does not have the base of conventional device and pipe cap, has saved cost, and reduce device to the group of module Dress, structure simplifies, and process links are few, and production efficiency is high.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the scheme frame of the Interface Matching device provided in an embodiment of the present invention based on the COB laser diodes mounted Figure；
Fig. 2 hinders net for the appearance of the Interface Matching device provided in an embodiment of the present invention based on the COB laser diodes mounted The circuit diagram of network.
It is as follows that reference represents implication：
11- luminescence chips, 12- backlight chips, 13- lens, 2- drive integrated circults, 3- hold resistance network, 4- control circuits.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on Embodiment in the present invention, it is all other that those of ordinary skill in the art are obtained under the premise of creative work is not made Embodiment, belongs to the scope of protection of the invention.
Such as Fig. 1, the embodiment of the present invention provides a kind of Interface Matching device based on the COB laser diodes mounted, including Laser diode, drive integrated circult 2, hold resistance network 3 and control circuit 4.
Such as Fig. 1, the laser diode has a luminescence chip 11 and a backlight chip 12, and the luminescence chip 11 is VCSEL chips, the backlight chip 12 is photoelectric conversion chip, and the luminescence chip 11 and the backlight chip 12 are chip Nude film and using conducting resinl directly against dress on circuit boards.The laser diode also has a lens 13, the lens 13 Cover is placed in the luminescence chip 11 and the backlight chip 12, and is connected using adhesive means with circuit board.The laser two The light path of pole pipe is：The excitation-emission laser of luminescence chip 11, through part reflective semitransparent film, the half backlight chip 12, a half transmitting is converged through the lens 13 and coupled, and is launched.
Such as Fig. 1, the drive integrated circult 2 is made up of a driving chip, and the driving chip is case chip, the driving Chip is placed in outside the lens 13, is connected by holding resistance network 3 with the luminescence chip 11, is specially：The driving core Piece is connected by circuit board trace with the resistance network 3 that holds, and the resistance network 3 that holds passes through circuit board trace and the luminescence chip 11 connections, finally do gold wire bonding in the lens 13.The laser diode and institute are realized by the resistance network 3 that holds State the Interface Matching of drive integrated circult 2.
It is a kind of circuit diagram for holding resistance network 3 provided in an embodiment of the present invention such as Fig. 2, the appearance resistance network 3 includes six Electric capacity, two resistance and two inductance, six electric capacity are respectively the first electric capacity, the second electric capacity, the 3rd electric capacity, the 4th electricity Appearance, the 5th electric capacity, the 6th electric capacity, two resistance are respectively first resistor and second resistance, and two inductance are respectively First inductance and the second inductance；The differential signal anode of the luminescence chip 11 and the differential signal anode of drive integrated circult 2 Between connect first electric capacity, the differential signal negative terminal of the luminescence chip 11 is born with the differential signal of drive integrated circult 2 Second electric capacity is connected between end, the differential signal anode of the luminescence chip 11 connects one end of first inductance, institute The other end for stating the first inductance connects ground connection after the 3rd electric capacity, and the differential signal negative terminal connection of the luminescence chip 11 is described One end of second inductance, the other end of second inductance is connected to be grounded after the 4th electric capacity, the drive integrated circult 2 Differential signal anode connects one end of the 5th electric capacity, and the other end of the 5th electric capacity connects the first resistor and is followed by Ground, the differential signal negative terminal of the drive integrated circult 2 connects one end of the 6th electric capacity, the other end of the 6th electric capacity Connect and be grounded after the second resistance.Each element is soldered to circuit board and is connected with each other by certain relation, the tool of each element Body value is set according to actual situation, realizes that drive integrated circult 2 provides inclined to laser diode by the resistance network 3 that holds Electric current and modulation electric current are put, the luminescence chip 11 of laser diode is in excited state, and maintain light power stabilising.
Such as Fig. 1, connected between the backlight chip 12 and the driving chip by a control circuit 4, the control electricity Road 4 is mainly made up of MCS-51 single-chip microcomputers, and the backlight chip 12 receives the luminescence chip 11 and sent and through the lens 13 The backlight of reflection, converts optical signals into electric signal and inputs to control circuit 4, then feed back to the integrated electricity of driving by control circuit 4 Road 2, the monitoring backlight in real time of drive integrated circult 2, so as to keep luminous steady of the luminescence chip 11 by the stabilization of backlight It is fixed.The control circuit 4 has an alarm and diagnostic module, can there is provided alarm and diagnostic operation according to the threshold value of setting.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention God is with principle, and any modification, equivalent substitution and improvements made etc. should be included in the scope of the protection.

Claims (7)

1. a kind of laser diode Interface Matching device mounted based on COB, including laser diode, drive integrated circult, its It is characterised by：The laser diode has a luminescence chip, and the luminescence chip is for chip dies and directly against mounted in circuit On plate, the drive integrated circult is made up of a driving chip, the driving chip be case chip, the luminescence chip with it is described Hold between driving chip by one and hinder network connection, carried by the resistance real-time performance drive integrated circult that holds to laser diode For bias current and modulation electric current, laser diode is set to be in excited state, the appearance resistance network includes six electric capacity, two electricity Resistance and two inductance, six electric capacity are respectively the first electric capacity, the second electric capacity, the 3rd electric capacity, the 4th electric capacity, the 5th electricity Hold, the 6th electric capacity, two resistance are respectively first resistor and second resistance, two inductance be respectively the first inductance and Second inductance；Described is connected between the differential signal anode of the luminescence chip and the differential signal anode of drive integrated circult One electric capacity, described second is connected between the differential signal negative terminal of the luminescence chip and the differential signal negative terminal of drive integrated circult Electric capacity, the differential signal anode of the luminescence chip connects one end of first inductance, and the other end of first inductance connects Connect and be grounded after the 3rd electric capacity, the differential signal negative terminal of the luminescence chip connects one end of second inductance, described the The other ends of two inductance is connected and is grounded after the 4th electric capacity, the differential signal anode connection of the drive integrated circult described the One end of five electric capacity, the other end of the 5th electric capacity is connected to be grounded after the first resistor, the difference of the drive integrated circult Sub-signal negative terminal connects one end of the 6th electric capacity, and the other end of the 6th electric capacity is connected to be grounded after the second resistance.
2. the laser diode Interface Matching device as claimed in claim 1 mounted based on COB, it is characterised in that：It is described to swash Optical diode also have a backlight chip, the backlight chip be chip dies and directly against dress on circuit boards.
3. the laser diode Interface Matching device as claimed in claim 2 mounted based on COB, it is characterised in that：It is described to swash Optical diode also has a lens, and the lens cap is placed on the luminescence chip and the backlight chip.
4. the laser diode Interface Matching device as claimed in claim 3 mounted based on COB, it is characterised in that：It is described Mirror is connected using adhesive means with circuit board.
5. the laser diode Interface Matching device as claimed in claim 3 mounted based on COB, it is characterised in that：It is described to drive Dynamic chip is placed in outside the lens, holds resistance network and circuit board trace by described, spun gold key is finally done in the lens Close.
6. the laser diode Interface Matching device as claimed in claim 3 mounted based on COB, it is characterised in that：The back of the body Connected between optical chip and the driving chip by a control circuit, the backlight chip receives the luminescence chip and sent simultaneously Backlight through the reflection from lens, converts optical signals into electric signal and inputs to control circuit, then by control electronic feedback to drive Dynamic integrated circuit, realizes and monitors backlight in real time by drive integrated circult to keep the luminescence chip to send out by the stable of backlight The stabilization of light.
7. the laser diode Interface Matching device as claimed in claim 6 mounted based on COB, it is characterised in that：The control Circuit processed has an alarm and diagnostic module, can there is provided alarm and diagnostic operation according to the threshold value of setting.
CN201610243402.3A 2016-04-19 2016-04-19 The laser diode Interface Matching device mounted based on COB Active CN105739031B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201610243402.3A CN105739031B (en) 2016-04-19 2016-04-19 The laser diode Interface Matching device mounted based on COB
PCT/CN2016/110352 WO2017181701A1 (en) 2016-04-19 2016-12-16 Cob bonding technique-based laser diode interface mating device
US16/094,462 US10700488B2 (en) 2016-04-19 2016-12-16 COB bonding laser diode interface mating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610243402.3A CN105739031B (en) 2016-04-19 2016-04-19 The laser diode Interface Matching device mounted based on COB

Publications (2)

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CN105739031A CN105739031A (en) 2016-07-06
CN105739031B true CN105739031B (en) 2017-11-03

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US (1) US10700488B2 (en)
CN (1) CN105739031B (en)
WO (1) WO2017181701A1 (en)

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CN105739031B (en) * 2016-04-19 2017-11-03 武汉电信器件有限公司 The laser diode Interface Matching device mounted based on COB
CN112379491B (en) * 2020-12-03 2024-06-07 亨通洛克利科技有限公司 Packaging structure of photoelectric chip in optical module

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CN202373844U (en) * 2011-12-20 2012-08-08 成都德浩科技有限公司 VCSEL (Vertical Cavity Surface Emitting Laser) drive circuit for plastic optical fiber transmission module
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US10700488B2 (en) 2020-06-30
US20190131764A1 (en) 2019-05-02
WO2017181701A1 (en) 2017-10-26
CN105739031A (en) 2016-07-06

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