CN105728929A - Nanometer diffusion bonding method for Cu and CuCrZr alloy - Google Patents

Abstract

The invention relates to the field of metal connection and powder metallurgy, specifically the nano-diffusion connection method of Cu and CuCrZr alloy; adopts mechanical alloying method to prepare Cu?Mn alloy powder of 20-50 μm; Cu-Mn alloy powder is deposited on the surface to be connected with CuCrZr alloy; the diffusion connection of Cu and CuCrZr alloy is carried out with Cu-Mn alloy powder as the intermediate layer. In the nano-diffusion connection method of Cu and CuCrZr alloy provided by the present invention, the Cu-Mn alloy powder is a nano-alloy powder, which can further reduce the temperature required for connection and increase the diffusion connection rate when used as an intermediate layer powder for diffusion connection. By adding Cu ?The Mn interlayer and the adjustment of the connection process can realize the nano-diffusion connection of Cu and CuCrZr alloy at a lower temperature, which reduces the damage of high temperature to the performance of CuCrZr alloy and the subsequent heat treatment process, and reduces the production cost.

Description

Nano-Diffusion Bonding Method of Cu and CuCrZr Alloy

technical field

The invention relates to the field of metal connection and powder metallurgy, in particular to a nano-diffusion connection method of Cu and CuCrZr alloy.

Background technique

CuCrZr alloy is an important heat sink material in nuclear fusion reactor devices due to its good thermal conductivity, high temperature strength, and ability to resist radiation damage; tungsten (W) has a high melting point, good thermal shock resistance, and low tritium retention And other characteristics, are important for plasmonic materials. Achieving a reliable connection between W and CuCrZr alloy is a key step in the preparation of plasma-oriented components (PFC). However, when W and CuCrZr are directly connected, due to the large difference in thermal expansion coefficient between the two, a large thermal stress will be generated, which will cause cracks and lead to failure of the connecting member. Using soft Cu as the buffer layer can effectively improve the connection behavior between W and CuCrZr. First, the connection between W and Cu is achieved at a higher temperature, and then the good metallurgical combination of Cu and CuCrZr alloy is achieved to obtain the connection module of W and CuCrZr alloy.

At present, when Cu and CuCrZr are connected by general welding, brazing and other processes, the connection temperature is too high, which will easily lead to the growth of CuCrZr alloy grains and the aggregation of secondary phase particles, which will reduce the hardness and strength of CuCrZr alloy. , it is difficult to meet the engineering requirements of PFC for heat sink materials. Moreover, if the connection temperature is too high, the material is prone to defects such as cracks and deformation, thereby reducing the strength of the connection. Diffusion bonding is a solid-phase welding method, and the bonding temperature is low (generally 0.5 to 0.8 times the melting point of the base metal), which can effectively avoid damage to the properties of the base metal due to high temperature. However, when Cu and CuCrZr are directly diffused and connected, the required connection temperature is high, and the strength of pure copper is low, which will weaken the Cu/CuCrZr connection strength, which is not suitable for large-scale applications and high-strength requirements in production.

Contents of the invention

In view of the above-mentioned technical problems, the present invention provides a nano-diffusion connection method of Cu and CuCrZr alloy, which solves the low-temperature, high-efficiency, and high-strength connection problems of Cu and CuCrZr alloy. The present invention adopts mechanical alloying to prepare highly active nano-Cu-Mn alloy Powder, using nano-diffusion bonding technology to achieve good metallurgical bonding and high bonding strength of Cu and CuCrZr alloys at low temperatures.

For achieving the above object, the scheme adopted in the present invention is:

The nano-diffusion connection method of Cu and CuCrZr alloy comprises the following steps:

(1) Prepare 20-50 μm Cu-Mn alloy powder by mechanical alloying method;

(2) Deposit Cu-Mn alloy powder on the surface to be connected of base metal Cu and CuCrZr alloy by coating method or spreading method;

(3) Mechanically polish the surface to be connected of the base metal Cu and CuCrZr alloy to remove the surface oxide film; put the base metal into acetone and absolute ethanol, and perform ultrasonic cleaning; The alloy powder is used as the intermediate layer for diffusion bonding of Cu and CuCrZr alloy. The diffusion connection pressure is 5-50MPa, the connection temperature is 550°C-850°C, and the holding time is 1h-5h, to obtain the Cu/CuCrZr connection part. After wire-cutting the Cu/CuCrZr connection part, it was stretched at room temperature, and the connection interface was detected by SEM and EDS.

Wherein, the Cu-Mn alloy powder is composed of the following raw materials in parts by weight: 50-80 parts of Cu powder, and 20-50 parts of Mn powder.

After Cu powder and Mn powder are mixed, use argon as the protective gas for high-energy ball milling, the ball-to-material ratio is 5-10:1, the speed is 300-500r/min, and the ball-milling time is 10-60 hours; after ball milling, the powder slurry The material was placed in a vacuum drying oven and dried at 40°C for 20 hours; the dried powder was sieved through an 80-mesh sieve and collected for later use.

In the nano-diffusion bonding method of Cu and CuCrZr alloy provided by the present invention, the Cu-Mn alloy powder is a nano-alloy powder, which has the characteristics of fine particle size, high activity, and strong diffusion ability, and can further reduce the The temperature required for connection and the increase of diffusion connection rate, by adding Cu-Mn interlayer and adjusting the connection process, the nano-diffusion connection of Cu and CuCrZr alloy can be realized at a lower temperature, reducing the damage of high temperature to the performance of CuCrZr alloy and The subsequent heat treatment process reduces the production cost; the tensile strength of the final connection sample can reach more than 200MPa, and the connection interface has no defects such as pores and cracks.

detailed description

The specific implementation of the present invention will be described in conjunction with the examples.

Example 1

(1) According to the mass ratio of Cu powder 80g and Mn powder 20g, the ball milling process parameters are as follows:

Vacuum dry the powder after high-energy ball milling, which is the intermediate layer alloy powder;

(2) Mechanically grind the surface to be connected of the base metal Cu and CuCrZr alloy to remove the surface oxide film, so that the surface of the base material to be connected is as smooth as possible. Then the samples were put into acetone and absolute ethanol, ultrasonically cleaned, and dried for later use.

(3) The Cu-Mn alloy powder and absolute ethanol after the ball mill drying were made into a solution according to the mass ratio of 20:1, and ultrasonically stirred in an ultrasonic cleaner for 2 minutes to disperse the slurry evenly, and the prepared slurry was used Coating technology uniform deposition in Cu and CuCrZr alloys.

(4) Put Cu and CuCrZr alloys in a pressurized bonding furnace, carry out diffusion bonding at 30MPa, 800°C, and hold for 3 hours. Finally, Cu/CuCrZr bonding with a tensile strength of 220MPa and no pores and cracks at the bonding interface can be obtained. Sample.

Example 2

(1) According to the mass ratio of Cu powder 67g and Mn powder 33g, the ball milling process parameters are as follows:

The powder after high-energy ball milling is vacuum-dried to obtain Cu-Mn alloy powder;

(2) Mechanically grind the surface to be connected of the base metal Cu and CuCrZr alloy to remove the surface oxide film, so that the surface of the base material to be connected is as smooth as possible. Then the samples were put into acetone and absolute ethanol, ultrasonically cleaned, and dried for later use.

(3) The Cu-Mn alloy powder and absolute ethanol after the ball mill drying were made into a solution according to the mass ratio of 20:1, and ultrasonically stirred in an ultrasonic cleaner for 2 minutes to disperse the slurry evenly, and the prepared slurry was used Coating technology uniform deposition in Cu and CuCrZr alloys.

(4) Put Cu and CuCrZr alloy in a pressurized bonding furnace, carry out diffusion bonding at 30MPa, 800°C, hold time for 1h, and finally obtain a Cu/CuCrZr connection with a tensile strength of 220MPa and no pores and cracks at the bonding interface Sample.

Example 3

(1) According to the mass ratio of Cu powder 50g and Mn powder 50g, the ball milling process parameters are as follows:

The powder after high-energy ball milling is vacuum-dried to obtain Cu-Mn alloy powder;

(2) The surface to be connected of the parent metal Cu and CuCrZr alloy is mechanically polished to remove the surface oxide film, so that the surface to be connected is as smooth as possible. Then the samples were put into acetone and absolute ethanol, ultrasonically cleaned, and dried for later use.

(3) The ball-milled Cu-Mn alloy powder and absolute ethanol are made into a solution according to the mass ratio of 20:1, and ultrasonically stirred in an ultrasonic cleaner for 3 minutes to disperse the slurry evenly, and the prepared slurry is coated with Coating technology uniform deposition in Cu and CuCrZr alloys.

(4) Place Cu and CuCrZr alloy in a pressurized bonding furnace, carry out diffusion bonding at 30MPa, 800°C, and hold for 4 hours to obtain a bonded sample with a tensile strength of 200MPa.

Example 4

(1) According to the mass ratio of Cu powder 67g and Mn powder 33g, the ball milling process parameters are as follows:

The powder after high-energy ball milling is vacuum-dried to obtain Cu-Mn alloy powder;

(2) The surface to be connected of the parent metal Cu and CuCrZr alloy is mechanically polished to remove the surface oxide film, so that the surface is as smooth as possible. Then the samples were put into acetone and absolute ethanol, ultrasonically cleaned, and dried for later use.

(3) The ball-milled Cu-Mn alloy powder and absolute ethanol are made into a solution according to the mass ratio of 20:1, and ultrasonically stirred in an ultrasonic cleaner for 3 minutes to disperse the slurry evenly, and the prepared slurry is coated with Coating technology uniform deposition in Cu and CuCrZr alloys.

(4) Place Cu and CuCrZr alloy in a pressurized bonding furnace, carry out diffusion bonding at 10MPa, 650°C, and hold for 4 hours to obtain a bonded sample with a tensile strength of 200MPa.

Example 5

(1) According to the mass ratio of Cu powder 67g and Mn powder 33g, the ball milling process parameters are as follows:

The powder after high-energy ball milling is vacuum-dried to obtain Cu-Mn alloy powder;

(2) The surface to be connected of the parent metal Cu and CuCrZr alloy is mechanically polished to remove the surface oxide film, so that the surface is as smooth as possible. Then the samples were put into acetone and absolute ethanol, ultrasonically cleaned, and dried for later use.

(3) The ball-milled Cu-Mn alloy powder and absolute ethanol are made into a solution according to the mass ratio of 20:1, and ultrasonically stirred in an ultrasonic cleaner for 3 minutes to disperse the slurry evenly, and the prepared slurry is coated with Coating technology uniform deposition in Cu and CuCrZr alloys.

(4) Place Cu and CuCrZr alloy in a pressurized bonding furnace, carry out diffusion bonding at 40MPa, 850°C, and hold the holding time for 3h to obtain a bonded sample with a tensile strength of 200MPa.

Example 6

(1) According to the mass ratio of Cu powder 67g and Mn powder 33g, the ball milling process parameters are as follows:

The powder after high-energy ball milling is vacuum-dried to obtain Cu-Mn alloy powder;

(2) The surface to be connected of the parent metal Cu and CuCrZr alloy is mechanically polished to remove the surface oxide film, so that the surface is as smooth as possible. Then the samples were put into acetone and absolute ethanol, ultrasonically cleaned, and dried for later use.

(3) The ball-milled Cu-Mn alloy powder and absolute ethanol are made into a solution according to the mass ratio of 20:1, and ultrasonically stirred for 3 minutes in an ultrasonic cleaner to disperse the slurry evenly, and the prepared slurry is spread technology deposited uniformly in Cu and CuCrZr alloys.

(4) Place Cu and CuCrZr alloy in a pressurized bonding furnace, carry out diffusion bonding at 10MPa, 750°C, and hold for 2 hours to obtain a bonded sample with a tensile strength of 200MPa.

Example 7

(1) According to the mass ratio of Cu powder 67g and Mn powder 33g, the ball milling process parameters are as follows:

Vacuum dry the powder after high-energy ball milling, which is the intermediate layer alloy powder;

(2) The surface to be connected of the parent metal Cu and CuCrZr alloy is mechanically polished to remove the surface oxide film, so that the surface is as smooth as possible. Then the samples were put into acetone and absolute ethanol, ultrasonically cleaned, and dried for later use.

(3) The ball-milled Cu-Mn alloy powder and absolute ethanol are made into a solution according to the mass ratio of 20:1, and ultrasonically stirred for 3 minutes in an ultrasonic cleaner to disperse the slurry evenly, and the prepared slurry is spread technology deposited uniformly in Cu and CuCrZr alloys.

(4) Put Cu and CuCrZr alloy in a pressurized bonding furnace, carry out diffusion bonding at 40MPa, 550°C, hold time for 3h, and obtain a bonded sample with a tensile strength of 200MPa.

Example 8

(1) According to the mass ratio of Cu powder 67g and Mn powder 33g, the ball milling process parameters are as follows:

Vacuum dry the powder after high-energy ball milling, which is the intermediate layer alloy powder;

(2) The surface to be connected of the parent metal Cu and CuCrZr alloy is mechanically polished to remove the surface oxide film, so that the surface is as smooth as possible. Then the samples were put into acetone and absolute ethanol, ultrasonically cleaned, and dried for later use.

(3) The ball-milled Cu-Mn alloy powder and absolute ethanol are made into a solution according to the mass ratio of 20:1, and ultrasonically stirred for 3 minutes in an ultrasonic cleaner to disperse the slurry evenly, and the prepared slurry is spread technology deposited uniformly in Cu and CuCrZr alloys.

(4) Place Cu and CuCrZr alloy in a pressurized bonding furnace, carry out diffusion bonding at 5MPa, 850°C, and hold for 1h to obtain a bonded sample with a tensile strength of 200MPa.

Claims (4)

1. The nanodiffusion method of attachment of 1.Cu and CuCrZr alloy, it is characterised in that comprise the following steps:

   (1) mechanical alloying method is used to prepare the Cu-Mn alloy powder of 20～50 μm；

   (2) cladding process or method of sprawling is used to deposit on to be connected of mother metal Cu and CuCrZr alloy Cu-Mn alloy powder；

   (3) face to be connected of mother metal Cu and CuCrZr alloy is carried out mechanical grinding, remove surface film oxide； Mother metal is put in acetone and dehydrated alcohol, carry out ultrasonic cleaning；Utilize pressurization Diffusion bonding techniques, with Cu-Mn Alloy powder is the diffusion connection that intermediate layer carries out Cu and CuCrZr alloy.
2. The nanodiffusion method of attachment of Cu and the CuCrZr alloy described in 1 the most as requested, it is characterised in that: Described Cu-Mn alloy powder, by following raw material by weight: Cu powder 50～80 parts, Mn Powder 20～50 parts.
3. The nanodiffusion method of attachment of Cu and the CuCrZr alloy described in 2 the most as requested, it is characterised in that: After described Cu powder and the mixing of Mn powder, using argon is that protective gas carries out high-energy ball milling, and ratio of grinding media to material is 5～10:1, rotating speed is 300-500r/min, and Ball-milling Time is 10-60 hour；After ball milling, powder slurries is put In vacuum drying oven, in 40 DEG C of dry 20h；Dried powder is sieved through 80 mesh sieve, collects Standby.
4. The nanodiffusion method of attachment of Cu and the CuCrZr alloy described in 1 to 3 any one the most as requested, its Being characterised by: it is 5～50MPa that the diffusion described in step (3) connects pressure, connecting temperature is 550 DEG C～850 DEG C, Temperature retention time is 1h～5h.