CN105682340B - Rigid-flex board and mobile terminal applying same - Google Patents

Abstract

The invention provides a rigid-flexible combined board which comprises a flexible substrate, a rigid substrate, a first conductive circuit, a second conductive circuit, a first reference layer and a second reference layer, wherein the flexible substrate and the rigid substrate are connected with each other, the first conductive circuit and the second conductive circuit are laid on the flexible substrate and at least partially extend to and cover the rigid substrate, the first reference layer covers a region, corresponding to the first conductive circuit, on the flexible substrate, the second reference layer covers the flexible substrate and a region, corresponding to the second conductive circuit, on the rigid substrate, the first reference layer is a mesh-shaped conductive metal layer, and the second reference layer is a solid conductive metal layer. In addition, the invention also provides a mobile terminal. The rigid-flex board can prevent the second conductive circuit from generating impedance sudden change at the boundary area of the rigid substrate and the flexible substrate, and improves the signal transmission quality.

Description

Rigid-flex board and mobile terminal using the rigid-flex board

technical field

The present invention relates to the field of electronic technology, in particular to a rigid-flex board and a mobile terminal using the rigid-flex board.

Background technique

Rigid-flex board is a combination of flexible printed circuit board (Flexible Printed Circuit, FPC) and rigid printed circuit board (Printed Circuit board, PCB) through lamination process, forming a circuit board with both FPC characteristics and PCB characteristics. The characteristics of the rigid-flex board determine that its application field covers all the application fields of FPC and PCB. For example, in mobile terminals such as smart phones, tablet computers, and liquid crystal displays, the use of the rigid-flex board is beneficial to save the internal space of the product. Reduce the volume of finished products and improve product performance.

At present, in order to ensure good flexibility, grid copper is usually used as the reference layer in the flexible board area of the rigid-flex board, while solid copper is used as the reference layer in the rigid board area. As shown in Figure 1, in this type of rigid-flex board, if there are lines that require impedance matching control to pass through the soft board area and the hard board area at the same time, it will cause the lines to be at the junction of the soft board area and the hard board area. The sudden change of impedance at the line will degrade the signal quality.

Contents of the invention

In view of the above-mentioned problems in the prior art, the present invention provides a rigid-flex board, which can reduce the sudden change in impedance between the soft board area and the hard board area, thereby ensuring the continuity of impedance matching and improving signal transmission quality.

In addition, the present invention also provides a mobile terminal using the rigid-flex board.

A rigid-flex board, comprising interconnected flexible substrates and rigid substrates, a first conductive circuit, a second conductive circuit, a first reference layer and a second reference layer, the first conductive circuit and the second conductive circuit laid on the flexible substrate, and at least partly extended to and covered on the rigid substrate, the first reference layer covers a region corresponding to the first conductive circuit on the flexible substrate, the first Two reference layers simultaneously cover the area on the flexible substrate and the rigid substrate corresponding to the second conductive circuit, the first reference layer is a mesh-shaped conductive metal layer, and the second reference layer is a solid conductive metal layer Floor.

Wherein, the flexible substrate includes a first side and a second side arranged oppositely, and two first wiring regions arranged along the first side and the second side respectively and arranged on the two The second wiring area between the first wiring areas; the rigid-flex board includes a plurality of first conductive lines and a plurality of second conductive lines, and the plurality of first conductive lines are respectively arranged on two of the second conductive lines a wiring area, and extend from the first wiring area to the rigid substrate; a plurality of the second conductive lines are arranged in the second wiring area, and extend from the second wiring area to the rigid substrate; on the substrate.

Wherein, the first reference layer covers two of the first wiring areas, the second reference layer covers the second wiring area, and at least partially covers the hard substrate corresponding to the second conductive line Area.

Wherein, the flexible substrate includes a first side, a second side, a first wiring area, and two second wiring areas that are oppositely arranged, and the two second wiring areas are respectively arranged along the first side and the second wiring area. The second side is set, the first wiring area is set between the two second wiring areas; the rigid-flex board includes a plurality of first conductive lines and a plurality of second conductive lines, and a plurality of the The first conductive lines are arranged in the first wiring area, and extend from the first wiring area to the rigid substrate; the plurality of second conductive lines are respectively arranged in two of the second wiring areas, And extend from the second wiring area to the rigid substrate.

Wherein, the first reference layer covers the first wiring area, the second reference layer covers two of the second wiring areas, and at least partially covers the hard substrate corresponding to the second conductive line Area.

Wherein, the second reference layer covering the second wiring area and the second reference layer covering the rigid substrate are located on the same plane.

Wherein, the first reference layer is mesh copper foil, and the second reference layer is solid copper foil.

Wherein, the first conductive line is a line that does not need to be controlled by impedance matching, and the second conductive line is a line that needs to be controlled by impedance matching.

Wherein, the first conductive line is a power signal transmission line, and the second conductive line is a radio frequency signal transmission line.

A mobile terminal, including a rigid-flex board, the rigid-flex board includes a flexible substrate and a rigid substrate connected to each other, a first conductive circuit, a second conductive circuit, a first reference layer and a second reference layer, the first A conductive circuit and the second conductive circuit are laid on the flexible substrate, and at least partly extend to and cover the rigid substrate, and the first reference layer covers the flexible substrate and the first The area corresponding to the conductive line, the second reference layer covers the area corresponding to the second conductive line on the flexible substrate and the rigid substrate at the same time, the first reference layer is a mesh conductive metal layer, The second reference layer is a solid conductive metal layer.

In summary, the rigid-flex board is provided with the same solid conductive metal on the area corresponding to the second conductive circuit on the flexible substrate and the area corresponding to the second conductive circuit on the rigid substrate. layer as a reference layer, so that when the second conductive circuit passes through the boundary area between the rigid substrate and the flexible substrate, there will be no sudden change in impedance, thereby improving the signal transmission quality of the rigid-flex board.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

Fig. 1 is a schematic structural view of a rigid-flex board in the prior art;

Fig. 2 is a schematic structural view of the rigid-flex board provided by the first embodiment of the present invention;

Fig. 3 is a schematic structural view of the rigid-flex board provided by the second embodiment of the present invention.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

For ease of description, spatially relative terms such as "under", "beneath", "below", "above", "on" and other spatially relative terms may be used herein to describe an element as shown in the drawings Or the relationship of a feature to another element or feature(s). It will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it can be directly on, directly on, or directly on the other element or layer. Connected or coupled to another element or layer, or intervening elements or layers may be present.

It should be understood that the terminology used herein is only used to describe specific embodiments, not to limit the present invention. As used herein, unless the context clearly dictates otherwise, the singular forms "a", "the", and "said" are intended to include the plural forms as well. Further, when used in this specification, the term "comprises" and/or "comprises" indicates the existence of said features, integers, steps, elements and/or components, but does not exclude one or more other features, integers, The presence or addition of steps, elements, components and/or combinations thereof.

Please refer to FIG. 2, the first embodiment of the present invention provides a rigid-flex board 10, including a flexible substrate 11, a rigid substrate 13, a first conductive circuit 151, a second conductive circuit 153, a first reference layer 171 and a second reference Layer 173. Wherein, the flexible substrate 11 and the rigid substrate 13 can be pressed and connected at the edge by pressing and other processes, and the first conductive circuit 151 and the second conductive circuit 153 are laid on the flexible substrate 11 and at least partially extend to and be disposed on the rigid substrate 13, the first reference layer 171 covers the area corresponding to the first conductive circuit 151 on the flexible substrate 11, and the second reference layer 173 simultaneously It covers the area corresponding to the second conductive circuit 153 on the flexible substrate 11 and the rigid substrate 13 . Wherein, the first reference layer 171 is a mesh conductive metal layer, and the second reference layer 173 is a solid conductive metal layer.

In an embodiment, the flexible substrate 11 includes a first side 1101 and a second side 1103 opposite to each other, and two first wiring regions respectively arranged along the first side 1101 and the second side 1103 111 and the second wiring region 113 arranged between the two first wiring regions 111, that is, one of the first wiring regions 111 is located between the first side 1101 and the second wiring region 113, and the other A first wiring area 113 is located between the second side 1103 and the second wiring area 113 . The rigid-flex board 10 includes a plurality of first conductive lines 151 and a plurality of second conductive lines 153, and the plurality of first conductive lines 151 are respectively arranged in two of the first wiring areas 111, and from the The first wiring area 111 extends to the rigid substrate 13; a plurality of the second conductive lines 153 are arranged on the second wiring area 113, and extend from the second wiring area 113 to the rigid substrate 13 . The first reference layer 171 covers the two first wiring regions 111, the second reference layer 173 covers the second wiring region 113, and at least partially covers the hard substrate 13 with the second conductive The area corresponding to line 153. It can be understood that the second reference layer 173 covering the second wiring region 113 of the flexible substrate 11 is located on the same plane as the second reference layer 173 covering the rigid substrate 13 .

In this embodiment, the first reference layer 171 is mesh copper foil, and the second reference layer 173 is solid copper foil. The first conductive line 151 is a line that does not require impedance matching control, such as a power signal transmission line, and the second conductive line 153 is a line that requires impedance matching control, such as a radio frequency signal transmission line. By setting the same solid copper foil on the flexible substrate 11 as the reference layer on the area corresponding to the second conductive circuit 153 that needs impedance matching control, the second conductive circuit 153 is passed through The boundary region 101 between the rigid substrate 13 and the flexible substrate 11 has the same reference potential, so as to avoid the occurrence of impedance of the second conductive circuit 153 at the boundary region 101 between the rigid substrate 13 and the flexible substrate 11 Mutation, thereby improving the quality of signal transmission. At the same time, by setting a mesh copper foil as a reference layer on the flexible substrate 11 corresponding to the first conductive line 151 that does not need to be controlled by impedance matching, it can be ensured that the rigid-flex board 10 is placed on the flexible substrate 11. The region has better flexibility.

Referring to FIG. 3 , the second embodiment of the present invention provides a rigid-flex board 20 , including a flexible substrate 21 , a rigid substrate 23 , a first conductive circuit 251 , a second conductive circuit 253 , a first reference layer 271 and a second reference layer 271 . layer 273, the flexible substrate 21 and the rigid substrate 23 can be pressed and connected at the edge by pressing and other processes, and the first conductive circuit 251 and the second conductive circuit 253 are laid on the flexible substrate 21 And at least partially extend to and cover on the rigid substrate 23, the first reference layer 271 covers the area corresponding to the first conductive circuit 251 on the flexible substrate 21, the second reference layer 273 At the same time, it covers the area corresponding to the second conductive circuit 253 on the flexible substrate 21 and the rigid substrate 23 . Wherein, the first reference layer 271 is a mesh conductive metal layer, and the second reference layer 273 is a solid conductive metal layer.

In this embodiment, the flexible substrate 21 includes a first side 2101, a second side 2103, a first wiring area 211 and two second wiring areas 213 that are oppositely arranged. The two second wiring areas 213 respectively arranged along the first side 2101 and the second side 2103, the first wiring region 211 is arranged between the two second wiring regions 213, that is, one of the second wiring regions 213 is located at the Between the first side 2101 and the first wiring region 211 , another second wiring region 213 is located between the second side 1103 and the first wiring region 211 . The rigid-flex board 20 includes a plurality of first conductive lines 251 and a plurality of second conductive lines 253, the plurality of first conductive lines 251 are arranged in the first wiring area 211, and are connected from the first wiring The region 211 extends to the rigid substrate 23; a plurality of the second conductive lines 253 are respectively arranged in the two second wiring regions 213, and extend from the two second wiring regions 213 to the rigid substrate 23 on. The first reference layer 271 covers the first wiring area 211, the second reference layer 273 covers the two second wiring areas 213, and covers the hard substrate 23 and the second conductive circuit 253 the corresponding area. It can be understood that the second reference layer 273 covering the two second wiring regions 213 of the flexible substrate 21 is located on the same plane as the second reference layer 273 covering the rigid substrate 23 .

In this embodiment, the first reference layer 271 is a mesh copper foil, and the second reference layer 273 is a solid copper foil; the first conductive line 251 is a line that does not need to be controlled by impedance matching, such as a power signal Transmission line; the second conductive line 253 is a line requiring impedance matching control, such as a radio frequency signal transmission line. By disposing the first conductive line 251 that does not need to be controlled by impedance matching at the position of the first wiring area 211 of the flexible substrate 21, and setting a mesh copper foil on the first wiring area 211 as the first reference layer 271, so as to ensure that the rigid-flex board 20 has better flexibility in the area of the flexible substrate 21. In addition, the second conductive line 253 that needs to be controlled by impedance matching is arranged on the two second wiring regions 213 located on both sides of the first wiring region 211, and the second wiring region 213 is arranged in the same manner as the The same solid copper foil on the rigid substrate 23 is used as the second reference layer 273, so that the second conductive circuit 253 has the same reference potential when passing through the boundary region 201 between the rigid substrate 23 and the flexible substrate 21, In this way, a sudden change in impedance of the second conductive circuit 253 at the boundary region 201 between the rigid substrate 23 and the flexible substrate 21 is avoided, thereby improving signal transmission quality. At the same time, by disposing the second conductive lines 253 that need to be controlled by impedance matching on the two second wiring regions 213 located on both sides of the first wiring region 211, and setting The second reference layer 273 of solid copper foil can also improve the tear resistance of the rigid-flex board 20 in the region of the flexible substrate 21 , thereby improving the reliability of the rigid-flex board 20 .

The third embodiment of the present invention also provides a mobile terminal, which includes the rigid-flex board described in the first embodiment or the second embodiment of the present invention. Wherein, the mobile terminal may be, but not limited to, a mobile phone, a tablet computer, a smart watch, and the like.

The corresponding structures, materials, acts, and equivalents of all means or step and function elements (if any) in the appended claims are intended to include any structure, material, or equivalent for performing the function in combination with other explicitly claimed elements. action. The description of the present invention has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the invention in the form disclosed. Various modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of this invention. The embodiment was chosen and described in order to better explain the principles of the invention and the practical application, and to enable others skilled in the art to understand the invention for various embodiments with various modifications as are suited to the particular use employed.

What is disclosed above is only a preferred embodiment of the present invention, and certainly cannot limit the scope of rights of the present invention with this. Those of ordinary skill in the art can understand all or part of the process for realizing the above embodiments, and according to the claims of the present invention The equivalent changes made still belong to the scope covered by the invention.

Claims (8)

1. a kind of Rigid Flex, including flexible base board interconnected and rigid substrate, which is characterized in that the soft or hard combination Plate further includes the first conducting wire, the second conducting wire, the first reference layer and the second reference layer, first conducting wire and institute It states the second conducting wire to be layed on the flexible base board, and extends at least partially into and be covered on the rigid substrate, institute It states the first reference layer and is covered on the flexible base board region corresponding with first conducting wire, second reference layer Region corresponding with second conducting wire on the flexible base board and the rigid substrate is covered simultaneously, wherein described Flexible base board and the rigid substrate are pressed in edge and are connected, the flexible base board include at least one first wiring area and At least one second wiring area, a plurality of first conducting wire are set to first wiring area, and from described first Wiring area extends on the rigid substrate, and a plurality of second conducting wire is set to second wiring area, and from Second wiring area extends on the rigid substrate, covers the second reference of the second wiring area of the flexible base board Layer is generally aligned in the same plane with the second reference layer for covering the rigid substrate；First reference layer is net-shaped conductive metal layer, Second reference layer is solid conductive metal layer；Wherein, first conducting wire is without carrying out impedance matching control Route, second conducting wire are the route for needing to carry out impedance matching control；The projection of first wiring area and the second cloth It is not overlapped between the projection in line region.

2. Rigid Flex as described in claim 1, which is characterized in that the flexible base board includes the first side being oppositely arranged Side and second side, and respectively along two the first wiring areas and setting of the first side and second side setting The second wiring area between two first wiring areas；The Rigid Flex include a plurality of first conducting wire and A plurality of second conducting wire, a plurality of first conducting wire are respectively arranged at two first wiring areas, and from described First wiring area extends on the rigid substrate；A plurality of second conducting wire is set to second wiring area, And it is extended on the rigid substrate from second wiring area.

3. Rigid Flex as claimed in claim 2, which is characterized in that first reference layer covers two first cloth Line region, second reference layer cover second wiring area, and at least partly cover on the rigid substrate with it is described The corresponding region of second conducting wire.

4. Rigid Flex as described in claim 1, which is characterized in that the flexible base board includes the first side being oppositely arranged Side, second side and the first wiring area and two the second wiring areas, two second wiring areas are respectively along described First side and the second side are arranged, and first wiring area is set between two second wiring areas；Institute Stating Rigid Flex includes a plurality of first conducting wire and a plurality of second conducting wire, and a plurality of first conducting wire is set to First wiring area, and extended on the rigid substrate from first wiring area；A plurality of second conductor wire Road is respectively arranged at two second wiring areas, and extends on the rigid substrate from second wiring area.

5. Rigid Flex as claimed in claim 4, which is characterized in that first reference layer covers first wiring region Domain, second reference layer cover two second wiring areas, and at least partly cover on the rigid substrate with it is described The corresponding region of second conducting wire.

6. Rigid Flex as described in claim 1, which is characterized in that first conducting wire is power supply signal transmission line Road, second conducting wire are radio frequency signal transmission line road.

7. Rigid Flex as claimed in any one of claims 1 to 6, which is characterized in that first reference layer is netted copper Foil, second reference layer are solid copper foil.

8. a kind of mobile terminal, which is characterized in that the mobile terminal includes as claimed in any one of claims 1 to 7 soft Harden plywood.