CN105679488A - Magnetic induction device - Google Patents

Abstract

The magnetic induction device provided by the present invention comprises a plurality of outer conductors, a first substrate and a magnetic core. The plurality of outer conductors comprises a first outer conductor and a second outer conductor, the surface of the first substrate is provided with at least one groove, the at least one groove comprises a first groove, an inner conductor is provided in the first groove along the extension direction, one end of the inner conductor is connected to the first outer conductor, the other end of the inner conductor is connected to the second outer conductor, and the magnetic core is provided between the inner conductor and the plurality of outer conductors. Compared with the existing magnetic induction device, the problem that the thickness of the existing bottom conductor and the preparation of the high-performance magnetic core are difficult to be taken into account can be improved.

Description

A magnetic induction device

technical field

The invention relates to the field of basic electrical components, in particular to a magnetic induction device.

Background technique

The integration of magnetic sensing devices, especially power inductors, has an urgent need in processors and mobile wearable power management. In the case of high integration, it is a key technical issue to realize a magnetic induction device with a large inductance value/DC resistance ratio.

Existing integrated magnetic induction devices are usually located on the surface of the substrate, and have a bottom conductor, a top conductor connected to the bottom conductor, and a magnetic core between the bottom conductor and the top conductor. The connection between the bottom conductor and the top conductor is in the shape of a solenoid. A high-performance magnetic core needs to be prepared on a relatively flat surface, so the thickness of the underlying conductor should not be too thick, generally not more than 5 microns. If the thickness of the bottom conductor is thinner, the resistance value of the bottom conductor will be higher. Therefore, it is difficult to balance the thickness of the bottom conductor and the high-performance magnetic core.

Contents of the invention

In view of this, the present invention provides a magnetic induction device. Compared with the existing magnetic induction device, it can solve the problem that the existing bottom conductor thickness and the preparation of the high-performance magnetic core are difficult to balance.

To achieve the above object, the present invention provides the following technical solutions:

A magnetic induction device, comprising a plurality of outer conductors, a first substrate and a magnetic core, the plurality of outer conductors include a first outer conductor and a second outer conductor, the surface of the first substrate is provided with at least one groove , the at least one groove includes a first elongated groove, an inner conductor is arranged in the first elongated groove, one end of the inner conductor is connected to the first outer conductor, and the inner conductor The other end of the conductor is connected to the second outer conductor, and the magnetic core is arranged between the inner conductor and the first outer conductor and the second outer conductor.

Specifically, the first outer conductor and the second outer conductor may have a predetermined angle with the inner conductor, and the predetermined angle may be an angle smaller than 90 degrees, so that a plurality of outer conductors and the inner conductor are connected to form a spiral Wire tubular.

Preferably, a third outer conductor is further included, the at least one groove further includes a second elongated groove parallel to the first elongated groove, and the inner conductor includes a first inner conductor and a second inner conductor. Conductor, the first inner conductor and the second inner conductor are sequentially arranged in the first elongated groove and the second elongated groove, one end of the first inner conductor and the first outer conductor One end is connected, the other end of the first inner conductor is connected with one end of the second outer conductor; the other end of the second outer conductor is connected with one end of the second inner conductor, and the second The other end of the inner conductor is connected to one end of the third outer conductor; the magnetic core is arranged between the inner conductor and the plurality of outer conductors.

Since the first inner conductor and the second inner conductor are respectively disposed in the first elongated groove and the second elongated groove, the first inner conductor and the second inner conductor are parallel to each other. The plurality of outer conductors can also be arranged in parallel, and the first inner conductor and the second inner conductor are also arranged in parallel, so the plurality of outer conductors and the first inner conductor and the second inner conductor can form a solenoid-shaped structure.

Preferably, a first insulating layer is provided between each of the inner conductors and the first substrate.

The first insulating layer may be silicon oxide, specifically prepared by thermal oxidation, aluminum oxide, or other methods such as deposition.

Preferably, other components of the integrated circuit are provided on the surface of the first substrate away from the at least one groove.

The integrated circuit is arranged on the surface of the first substrate away from the at least one groove, and can share the substrate area with the magnetic induction device, so as to make full use of the space of the first substrate, thereby being more conducive to miniaturization.

Preferably, at least two through holes are provided on the surface of the first substrate away from the at least one groove, and the at least two through holes respectively extend to one or more of the at least one groove. The groove, the at least two through holes are provided with conductive material. The inner conductor may be electrically connected to the integrated circuit through the conductor material.

The at least two through holes may extend along a direction perpendicular to the surface where the at least one groove is located, and extend to communicate with a plurality of grooves in the at least one groove, so that the inner conductor and the outer conductor The formed helical structure is electrically connected to the integrated circuit, so that the magnetic induction device acts on the integrated circuit and realizes single-substrate integration.

Preferably, in the above-mentioned magnetic induction device, a second insulating layer is provided between the conductor material in the at least two through holes and the first substrate.

The second insulating layer may be silicon oxide, specifically prepared by thermal oxidation, aluminum oxide, or other methods such as deposition.

Preferably, the above-mentioned magnetic induction device further includes a second substrate, the second substrate is provided with at least two first conductors, and at least two of the plurality of outer conductors can be separated by welding or the like. The at least two first conductors are electrically connected to the at least two first conductors, and the at least two first conductors can be electrically connected to the integrated circuit by wire bonding or the like.

The second substrate and at least two first conductors arranged on the second substrate are used to electrically connect the solenoid-shaped structure formed by the inner conductor and the outer conductor to the integrated circuit, and the integrated circuit may be arranged on the first The surface of the substrate away from the inner conductor. Wherein, the first conductor may specifically be electrically connected to the integrated circuit by packaging such as wire bonding.

Preferably, in the above magnetic induction device, the surface of the first substrate provided with at least one groove is also provided with an integrated circuit.

The integrated circuit may be arranged on one or both surfaces of the surface away from the at least one groove and the surface where the at least one groove is located, and the arrangement of the integrated circuit should not be construed as a limitation of the present invention.

Preferably, in the above magnetic induction device, a third insulating layer is provided between the inner conductor and the first substrate and the magnetic core.

The third insulating layer can be silicon oxide or polyimide material; it can be prepared by deposition or by spin coating; the specific material and preparation method of the third insulating layer should not be understood as a limitation of the present invention.

Preferably, in the above-mentioned magnetic induction device, a fourth insulating layer is arranged between the plurality of outer conductors and the magnetic core.

The fourth insulating layer can be silicon oxide or polyimide material; it can be prepared by deposition or by spin coating; the specific material and preparation method of the fourth insulating layer should not be understood as a limitation of the present invention.

The magnetic induction device provided by the present invention includes a plurality of outer conductors, a first substrate and a magnetic core, the plurality of outer conductors include a first outer conductor and a second outer conductor, and the surface of the first substrate is provided with at least one concave Groove, the at least one groove includes a first groove, an inner conductor is arranged in the first groove, one end of the inner conductor is connected to the first outer conductor, and the other end of the inner conductor is connected to the first outer conductor. The second outer conductor is connected, and the magnetic core is arranged between the inner conductor, the first outer conductor and the second outer conductor. Compared with the existing magnetic induction device, it can solve the problem that the thickness of the existing bottom conductor and the preparation of the high-performance magnetic core are difficult to balance.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

Fig. 1 is a schematic structural diagram of a magnetic induction device provided by a first embodiment of the present invention;

Fig. 2 is a cross-sectional view of the magnetic induction device provided by the first embodiment of the present invention;

Fig. 3 is a schematic structural diagram of a magnetic induction device provided by a second embodiment of the present invention;

Fig. 4 is a cross-sectional view of the magnetic induction device provided by the second embodiment of the present invention;

Fig. 5 is a cross-sectional view of a magnetic induction device provided by a third embodiment of the present invention;

Fig. 6 is a cross-sectional view of a magnetic induction device provided by a fourth embodiment of the present invention;

7 is a schematic structural diagram of a magnetic induction device provided by a fifth embodiment of the present invention;

Fig. 8 is a flow chart of the preparation of the magnetic induction device provided by the embodiment of the present invention;

Fig. 9 is a flowchart of steps included in the first step of Fig. 8;

Fig. 10 is a flow chart of LIGA that can be used to prepare the magnetic induction device provided by the embodiment of the present invention.

Among them, the reference signs are summarized as follows:

Outer conductor 110; first outer conductor 111; second outer conductor 112; third outer conductor 113; first substrate 120; magnetic core 130; first groove 141; second groove 142; third groove 143; Columnar groove 144; inner conductor 150; first inner conductor 151; second inner conductor 152; third inner conductor 153; first insulating layer 161; second insulating layer 162; third insulating layer 163; fourth insulating layer 164; integrated circuit 170; via 180;

The second substrate 210 ; the first conductor 220 .

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.

Please refer to FIG. 1 . FIG. 1 shows a magnetic induction device provided by a first embodiment of the present invention, including a plurality of outer conductors 110 , a first substrate 120 and a magnetic core 130 . The plurality of outer conductors 110 include first outer conductors 111 and second outer conductors 112 arranged in sequence. The surface of the first substrate 120 is provided with at least one groove, the at least one groove includes a first groove 141, and an inner conductor 150 is arranged in the first groove 141 along the extending direction, and the inner conductor One end of 150 is connected to the first outer conductor 111, the other end of the inner conductor 150 is connected to the second outer conductor 112, and the magnetic core 130 is arranged between the inner conductor 150 and the plurality of between the outer conductors 110.

Specifically, both the first outer conductor 111 and the second outer conductor 112 may have a predetermined angle with the inner conductor 150, and the predetermined angle may be an angle smaller than ninety degrees. For details, please refer to FIG. 1, No. An outer conductor 111 and a second outer conductor 112 can be rehearsed in parallel, so that the inner conductor 150 and the first outer conductor 111 and the second outer conductor 112 connected to the inner conductor 150 are distributed in a spiral shape.

Specifically, it also includes a third outer conductor 113, the at least one groove also includes a second groove 142 and a third groove 143 arranged in parallel with the first groove 141, and the inner conductor 150 includes the first inner conductor 150. The conductor 151, the second inner conductor 152 and the third inner conductor 153, the first inner conductor 151, the second inner conductor 152 and the third inner conductor 153 are sequentially arranged in the first groove 141 and the second groove 142 And the third groove 143, please refer to FIG. 1 for details. One end of the first inner conductor 151 is connected to one end of the first outer conductor 111, and the other end of the first inner conductor 151 is connected to one end of the second outer conductor 112; The other end of the conductor 112 is connected to one end of the second inner conductor 152, and the other end of the second inner conductor 152 is connected to one end of the third outer conductor 113; the magnetic core 130 is arranged on the inner conductor 150 and the plurality of outer conductors 110.

Since the first inner conductor 151 and the second inner conductor 152 are disposed in the first groove 141 and the second groove 142 and the third groove 143 respectively, the first inner conductor 151 and the second inner conductor 152 are parallel to each other. Taking the second outer conductor 112 as an example, as shown in FIG. The right ends of the conductors 151 are connected as shown. The right end as shown in the figure of the third outer conductor 113 is connected to the right end as shown in the figure of the second inner conductor 152 . Therefore, the outer conductor 110 and the inner conductor 150 form a helical structure through the above connection manner.

Specifically, the first groove 141 , the second groove 142 , and the third groove 143 may be elongated grooves, or grooves of other shapes. The magnetic induction device provided by the embodiment of the present invention may also include a third inner conductor 153 and a third groove 143 and a third outer conductor 113 containing the third inner conductor 153, the specific number of the outer conductor 110, the inner conductor 150 and the groove It should not be construed as limiting the invention.

A first insulating layer 161 may be disposed between each inner conductor 150 of the inner conductors 150 and the first substrate 120 , please refer to FIG. 2 for details. The first insulating layer 161 may be silicon oxide, specifically prepared by thermal oxidation, aluminum oxide, or other methods such as deposition.

An integrated circuit 170 is disposed on the surface of the first substrate 120 away from the at least one groove, please refer to FIG. 4 and FIG. 5 for details. The integrated circuit is disposed on the surface of the first substrate 120 away from the at least one groove, and can share the substrate area with the magnetic induction device, so that the space of the first substrate 120 can be fully utilized, which is more conducive to miniaturization.

Two through holes 180 may be provided on the surface of the first substrate 120 away from the at least one groove, please refer to FIG. 3 and FIG. 4 for details. The two through holes 180 respectively extend to two grooves in the at least one groove, the two through holes 180 are provided with conductive material, and the inner conductor 150 passes through the conductive material and the integrated circuit. electrical connection. Specifically, the integrated circuit may be placed on the surface of the first substrate 120 away from the at least one groove.

Specifically, the position of the through hole 180 may also be set at other positions, please refer to FIG. 7 for details.

The two through holes 180 may extend along a direction perpendicular to the surface where the at least one groove is located, and extend to communicate with two grooves in the at least one groove, so that the inner conductor 150 and the outer conductor 150 are connected to each other. The solenoid-shaped structure formed by the conductor 110 is electrically connected to the integrated circuit, so that the magnetic induction device acts on the integrated circuit.

The inner conductor 150 and the through hole 180 can be implemented based on commercial advanced packaging technologies such as Through Silicon Via (Through Silicon Via), Through Glass Via (Through Glass Via), and the like. The outer conductor 110 can be implemented based on a commercial advanced packaging process such as copper pillar (CopperPillar). The magnetic induction device provided by the embodiment of the present invention is easy to be mass-produced.

Specifically, the at least one groove may include a first groove 141, a second groove 142, and a third groove 143, and may also include a cylindrical groove 144 extending in the same direction as the through hole 180. Details See Figure 3. The two through holes 180 may extend to two grooves in at least one groove as shown in FIG. Another through hole 180 may extend to the groove corresponding to the third inner conductor 153 .

A second insulating layer 162 is disposed between the conductive material in the two through holes 180 and the first substrate 120 , please refer to FIG. 4 for details. The second insulating layer 162 may be silicon oxide, specifically prepared by thermal oxidation, aluminum oxide, or other methods such as deposition.

The above-mentioned magnetic induction device may also include a second substrate 210, the second substrate 210 is provided with two first conductors 220, and the two outer conductors 110 in the plurality of outer conductors 110 are respectively welded or the like. It is electrically connected with the two first conductors 220, and the two first conductors 220 are electrically connected with the integrated circuit by wire bonding or the like.

The second substrate 210 and the two first conductors 220 disposed on the second substrate 210 are used to electrically connect the solenoid-shaped structure formed by the inner conductor 150 and the outer conductor 110 to the integrated circuit, and the integrated circuit may specifically be It is disposed on the surface of the first substrate 120 away from the inner conductor 150 . Wherein, the first conductor 220 may specifically be electrically connected to the integrated circuit by packaging such as wire bonding.

One of the two first conductors 220 can be connected with the first outer conductor 111 shown in FIG. 1 , and the other of the two first conductors 220 can be connected with the third outer conductor 111 shown in FIG. Conductors 113 are connected. Which outer conductor 110 the two first conductors 220 are connected to should not be construed as a limitation to the present invention.

The surface of the first substrate 120 provided with at least one groove is also provided with an integrated circuit 170 , please refer to FIG. 6 for details. Wherein, the integrated circuit 170 can be arranged on the surface away from the at least one groove, can also be arranged on the surface where the at least one groove is located, or be arranged on the above two surfaces, the integrated circuit 170 should not be understood as a limitation of the present invention .

A third insulating layer 163 is disposed between the inner conductor 150 and the first substrate 120 and the magnetic core 130 , please refer to FIG. 2 , FIG. 4 , FIG. 5 and FIG. 6 for details. The third insulating layer 163 can be made of silicon oxide or polyimide; it can be prepared by deposition or by spin coating; the specific material and preparation method of the third insulating layer 163 are not specified. It should be understood as a limitation of the present invention.

In the above magnetic induction device, a fourth insulating layer 164 is disposed between the plurality of outer conductors 110 and the magnetic core 130 , please refer to FIG. 2 , FIG. 4 , FIG. 5 and FIG. 6 for details. The fourth insulating layer 164 can be made of silicon oxide or polyimide; it can be prepared by deposition or by spin coating; the specific material and preparation method of the fourth insulating layer 164 are not limited. It should be understood as a limitation of the present invention.

The magnetic induction device provided by the embodiment of the present invention can be prepared through the following process:

S1, forming a groove for placing the inner conductor and a through hole for placing the inner conductor and the conductor material on the other side of the substrate by etching and other processes on the first substrate 120 .

S2, forming an insulating layer on the surface of the first substrate 120 and the grooves and through holes 180 opened in the first substrate 120 by chemical reaction or deposition.

Specifically, the first insulating layer 161 disposed between each inner conductor 150 and the first substrate 120 , and the second insulating layer 162 disposed between the conductor material in the through hole 180 and the first substrate 120 .

S3, forming an adhesion barrier layer and a conductor electroplating seed layer on the surface of the above-mentioned insulating layer through processes such as deposition.

S4, filling the groove and the through hole 180 with the conductor material through a process such as electroplating.

The conductor material here includes the inner conductor 150 and the conductor material in the through hole 180 .

S5, removing the electroplating conductor, conductor electroplating seed layer and adhesion barrier layer on the surface of the first substrate 120 by polishing or etching.

S6, preparing an insulating layer on the side of the substrate having the internal conductor 150 by a process such as deposition.

For example, the inner conductor 150 and the third insulating layer 163 between the first substrate 120 and the magnetic core 130 .

S7, realize the preparation of the magnetic core 130 through processes such as electroplating and deposition.

Specifically, the magnetic core 130 can also be manufactured by depositing a magnetic material layer, photolithography, and etching the magnetic material layer.

S8 , preparing an insulating layer on the side of the substrate having the magnetic core 130 through processes such as deposition.

For example, the fourth insulating layer 164 is disposed between the plurality of outer conductors 110 and the magnetic core 130 .

S9 , etching the insulating layer on the surface of the first substrate 120 to expose the part of the inner conductor 150 for connecting with the outer conductor 110 .

S10, the outer conductor 110 on the fourth insulating layer 164 is prepared by a process such as deposition.

Wherein, step S1 may specifically include the following preparation process:

S11, forming a hard mask layer having a layout pattern of the internal conductor 150 on one side of the first substrate 120 through processes such as deposition, photolithography, and etching.

S12, forming a photoresist layer with a layout pattern of the through hole 180 on the same surface of the first substrate 120 by photolithography.

S13, etching the substrate using the photoresist layer as a mask, and the etching depth is not less than the thickness of the substrate minus the thickness of the inner conductor.

S14, removing the photoresist layer.

S15 , etching the first substrate 120 by using the hard mask layer as a mask, and the etching depth is consistent with the thickness of the inner conductor 150 .

S16 , removing the hard mask layer.

Wherein, step S7 or S10 can specifically adopt the following LIGA process preparation process:

S201, forming an adhesion barrier layer and an electroplating seed layer by processes such as deposition.

S202, forming a photoresist layer by photolithography.

S203, filling the area not covered by the photoresist with magnetic material or conductor by electroplating.

S204, removing the photoresist, the electroplating seed layer and the adhesion barrier layer.

In the embodiment provided by the present invention, the material of the first substrate 120 may be silicon, or other materials such as glass, quartz, organic substrate, sapphire, etc. The thickness of the first substrate 120 may be between 100 microns and 500 microns.

The material of the inner conductor 150 can be mainly copper and its alloys, or other materials such as gold, tungsten, aluminum and their alloys. The thickness of the inner conductor 150 may be 20 microns to 200 microns, the width of the inner conductor 150 may be 5 microns to 200 microns, and the distance between adjacent inner conductors 150 may be 5 microns to 200 microns. The surface of the inner conductor 150 in contact with the first substrate 120 may have enhanced adhesion (such as Ti, Ta and other metals and their alloys), diffusion between barrier materials (for example, TiN, TaN and other metal nitrides), and is useful for subsequent One or more layers of material for process preparation (eg Cu seed layer).

The material of the outer conductor 110 can be mainly copper and its alloys, or other materials such as gold, tungsten, aluminum and their alloys. The thickness of the outer conductor 110 may be 10 microns to 100 microns, the width of the outer conductor 110 may be 5 microns to 200 microns, and the distance between adjacent outer conductors 110 may be 5 microns to 200 microns.

The material of the magnetic core 130 can be nickel, iron, cobalt and other materials and their alloys, oxides, composite materials, etc., and can be prepared by electroplating, sputtering, and other methods. The thickness of the magnetic core 130 may be 1 micron to 10 microns. The magnetic core 130 may adopt a layered structure, that is, it is composed of alternating magnetic material layers and non-magnetic material layers. The magnetic core 130 can be in a bar shape, or in any other shape, and can form a single or multiple closed loops.

In some existing schemes, a rectangular parallelepiped groove is sometimes provided on the surface where the inner conductor 150 is located and both the inner conductor 150 and the magnetic core 130 are placed in the rectangular parallelepiped groove, but the preparation process of this structure is relatively complicated and needs to be Photolithography is performed in the case of deep silicon trenches, which is not easy for mass production.

The embodiment of the present invention only shows the inductance formed by one solenoid coil wound around the magnetic core 130 , and multiple solenoid coil wound magnetic cores 130 can also be easily realized to form a coupled inductor or a transformer. The magnetic core 130 in the embodiment of the present invention may have an open shape, or may have one or more closed loop shapes. The solenoid coils may be coupled through the magnetic core 130 or an air circuit.

The magnetic induction device provided by the present invention includes a plurality of outer conductors 110, a first substrate 120, and a magnetic core 130, and the plurality of outer conductors 110 include a first outer conductor 111 and a second outer conductor 112, and the first substrate 120 The surface of the at least one groove is provided with at least one groove, and the at least one groove includes a first groove 141, an inner conductor 150 is arranged in the first groove 141, and one end of the inner conductor 150 is connected to the first outer conductor 111, the other end of the inner conductor 150 is connected to the second outer conductor 112, the first outer conductor 111 and the second outer conductor 112 have a predetermined angle with the inner conductor 150, the The magnetic core 130 is disposed between the inner conductor 150 and the first outer conductor 111 and the second outer conductor 112 . Compared with the existing magnetic induction device, it can solve the problem that the thickness of the existing bottom conductor and the preparation of the high-performance magnetic core 130 are difficult to balance.

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention have been clearly and completely described above in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

Accordingly, the above detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention but represents only selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

It should be noted that like numerals and letters denote similar items in the following figures, therefore, once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship that is usually placed when the product of the invention is used, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying References to devices or elements must have a particular orientation, be constructed, and operate in a particular orientation and therefore should not be construed as limiting the invention. In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions, and should not be construed as indicating or implying relative importance.

In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation", "installation", "connection" and "connection" should be understood in a broad sense, for example, it may be a fixed connection, It can also be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

Claims (10)

1. a magnetic induction device, it is characterized in that: include multiple outer conductor, first substrate and magnetic core, the plurality of outer conductor includes the first outer conductor and the second outer conductor that are arranged in order, the surface configuration of described first substrate has at least one groove, at least one groove described includes the first groove, in described first groove, bearing of trend is provided with inner wire, one end of described inner wire is connected with described first outer conductor, the other end of described inner wire is connected with described second outer conductor, described magnetic core is arranged between described inner wire and the plurality of outer conductor.

2. magnetic induction device according to claim 1, it is characterized in that: also include the 3rd outer conductor, at least one groove described also includes the second groove, described inner wire includes the first inner wire and the second inner wire, described first inner wire and the second inner wire are set in turn in described first groove and the second groove

One end of described first inner wire is connected with one end of described first outer conductor, and the other end of described first inner wire is connected with one end of described second outer conductor;

The other end of described second outer conductor is connected with one end of described second inner wire, and the other end of described second inner wire is connected with one end of described 3rd outer conductor; Described magnetic core is arranged between described inner wire and the plurality of outer conductor.

3. magnetic induction device according to claim 1, it is characterised in that: it is provided with the first insulating barrier between described inner wire and described first substrate.

4. magnetic induction device according to claim 1, it is characterised in that: the surface configuration away from least one groove described of described first substrate has integrated circuit.

5. magnetic induction device according to claim 4, it is characterized in that: the surface configuration away from least one groove described of described first substrate has at least two through hole, described at least two through hole extends respectively to the multiple grooves at least one groove described, being provided with conductor material in described at least two through hole, described inner wire is electrically connected with described integrated circuit by described conductor material.

6. magnetic induction device according to claim 5, it is characterised in that: it is provided with the second insulating barrier between conductor material and described first substrate in said two through hole.

7. magnetic induction device according to claim 4, it is characterized in that: also include the second substrate, described second substrate is provided with at least two the first conductor, at least two outer conductor in the plurality of outer conductor electrically connects with described at least two the first conductor respectively, and described at least two the first conductor all electrically connects with described integrated circuit.

8. magnetic induction device according to claim 1, it is characterised in that: the surface being provided with at least one groove of described first substrate is additionally provided with integrated circuit.

9. magnetic induction device according to claim 1, it is characterized in that: the surface configuration away from least one groove described of described first substrate has at least two through hole, described at least two through hole extends respectively to the multiple grooves at least one groove described, being provided with conductor material in described at least two through hole, described inner wire is connected away from the surface electrical of at least one groove described with described first substrate by described conductor material.

10. the magnetic induction device according to any one of claim 19, it is characterised in that: described inner wire and be provided with the 3rd insulating barrier between the first substrate and described magnetic core, it is provided with the 4th insulating barrier between the plurality of outer conductor and described magnetic core.