CN105677070A - Conductive pattern structure of touch panel and manufacturing method thereof - Google Patents

Abstract

The application discloses a manufacturing method of a conductive pattern structure of a touch panel, which comprises the following steps: providing a substrate; depositing a plurality of first conductive units and a plurality of second conductive units on one side of the substrate through the mask, wherein the first conductive units are arranged along a first axial direction in a separated mode, and the second conductive units are arranged along a second axial direction in a separated mode; forming a plurality of first electrical connection parts and a plurality of second electrical connection parts, wherein each first electrical connection part is electrically connected with the adjacent first conductive units to form at least one first axial conductive group, and each second electrical connection part is electrically connected with the adjacent second conductive units to form at least one second axial conductive group; and disposing a plurality of insulating materials on the substrate to electrically insulate the first and second axially conductive groups from each other. The touch panel manufactured by the manufacturing method can achieve the effect of simplifying the manufacturing process of the touch panel.

Description

Conductive pattern structure of touch panel and manufacturing method thereof

technical field

The present invention relates to a touch panel, in particular to a conductive pattern structure of the touch panel and a manufacturing method thereof.

Background technique

With the advancement of science and technology, various information devices are continuously introduced, such as mobile phones, tablet computers, ultra-thin notebook computers, and satellite navigation. In addition to generally using a keyboard or a mouse for input or manipulation, using touch technology to manipulate an information device is a rather intuitive and popular manipulation method. Among them, the touch panel has a humanized and intuitive input operation interface, so that users of any age can directly select or control information equipment with fingers or stylus, so it is becoming more and more popular in the market.

Generally speaking, touch panels can be classified into resistive, capacitive, and optical based on their sensing principles. Currently, the mainstream technology in the market is capacitive touch panels with high sensitivity and multi-touch capabilities. Since the capacitive touch panel can sense multi-touch at the same time, it is usually applied to high-frequency and relatively sophisticated electronic devices, such as smart phones, tablet computers, or notebook computers with touch input functions.

As far as capacitive touch panels are concerned, most of the materials used are transparent conductive films (such as indium tin oxide ITO), which use the capacitance induction formed by the contact between the transparent electrodes on the touch panel and human fingers or conductive objects. And through the operation of the integrated control circuit, it is converted into coordinate data that can be interpreted by the operating system to determine its touched position. However, in the known touch panel, a plurality of transparent electrodes (or conductive patterns) arranged mutually must be formed on a glass or plastic substrate by a yellow light process.

However, the process of the yellow light process is complicated. It is necessary to coat the photoresist first, then expose it with a photomask having the above-mentioned pattern of transparent electrodes arranged with each other, and then go through the steps of developing, etching, and cleaning to form the transparent electrodes arranged with each other. electrode. Therefore, such a complicated yellow light process will increase the manufacturing cost of the touch panel. Not to mention most capacitive touch panels, where the transparent electrodes are staggered, need to be provided with insulating materials to avoid short circuits in the circuit, and this type of panel requires a more complicated process. In addition, the multiple processes of the yellow light process and the influence of the developer and etching solution are likely to cause damage to the substrate.

Contents of the invention

The object of the present invention is to provide a conductive pattern structure of a touch panel and a manufacturing method thereof. The touch panel manufactured by the manufacturing method can achieve the effect of simplifying the manufacturing process of the touch panel.

The present invention provides a conductive pattern structure of a touch panel, including a substrate, at least one first axial conductive group, at least one second axial conductive group, and a plurality of insulating materials. The first axial conductive group is disposed on one side of the substrate, the first axial conductive group includes a plurality of first conductive units and a plurality of first electrical connections, and these first conductive units are separated along the first axial direction It is provided that the first electrical connection parts are respectively electrically connected to the adjacent first conductive units, and at least part of the two ends of the first electrical connection parts overlap with the adjacent first conductive units. The second axial conductive group and the first axial conductive group are disposed on the same side of the substrate, the second axial conductive group includes a plurality of second conductive units and a plurality of second electrical connection parts, and these first axial conductive groups The two conductive units are spaced apart along the second axial direction, the second electrical connection parts are respectively electrically connected to the adjacent second conductive units, and at least part of the two ends of the second electrical connection parts are connected to the adjacent first second conductive units. The two conductive units overlap. The insulating materials are respectively disposed between the first axial conductive group and the second axial conductive group, so as to electrically insulate the first axial conductive group and the second axial conductive group from each other.

In one embodiment of the present invention, the first axial conductive group has a convex portion at the position where each first electrical connection portion overlaps with the adjacent first conductive units.

The present invention further proposes a method for manufacturing a conductive pattern structure of a touch panel, including the following steps: providing a substrate; depositing a plurality of first conductive units and a plurality of second conductive units on one side of the substrate through a mask, these The first conductive units are spaced apart along the first axial direction, and the second conductive units are spaced apart along the second axial direction; a plurality of first electrical connection parts and a plurality of second electrical connection parts are formed, and each first electrical connection The adjacent first conductive units are electrically connected to form at least one first axial conductive group, and the second electrical connection parts are electrically connected to adjacent second conductive units to form at least one second conductive unit. an axial conductive group; and disposing a plurality of insulating materials on the substrate to electrically insulate the first axial conductive group and the second axial conductive group from each other.

In an embodiment of the present invention, the first conductive units have necks, and the insulating materials are respectively disposed on the necks.

In an embodiment of the present invention, the first electrical connection parts and the second electrical connection parts are disposed by deposition, evaporation, sputtering, printing or inkjet.

In one embodiment of the present invention, when the deposition step is performed, the first conductive units are spatially discontinuous, and the second conductive units are spatially discontinuous.

In one embodiment of the present invention, these insulating materials are provided by deposition, vapor deposition, printing, inkjet or glue dispensing.

In one embodiment of the present invention, the first axial conductive group has a convex portion at the position where each first electrical connection portion overlaps with the adjacent first conductive units.

The present invention further provides a conductive pattern structure of a touch panel, including a substrate, at least one first axial conductive group, at least one second axial conductive group, and a plurality of insulating materials. The first axial conductive group is disposed on one side of the substrate, the first axial conductive group includes a plurality of first conductive units and a plurality of first electrical connections, and these first conductive units are separated along the first axial direction It is provided that the first electrical connection parts are respectively electrically connected to the adjacent first conductive units, wherein at least part of the thickness of each first electrical connection part is smaller than the thickness of the first conductive unit. The second axial conductive group and the first axial conductive group are disposed on the same side of the substrate, the second axial conductive group includes a plurality of second conductive units and a plurality of second electrical connection parts, and these first axial conductive groups The two conductive units are spaced apart along the second axis, and the second electrical connection parts are respectively electrically connected to the adjacent second conductive units. These insulating materials are respectively disposed between the first axial conductive group and the second axial conductive group, so as to electrically insulate the first axial conductive group and the second axial conductive group from each other.

The present invention further proposes a method for manufacturing a conductive pattern structure of a touch panel, comprising the following steps: providing a substrate; depositing a plurality of first conductive units, a plurality of first electrical elements on one side of the substrate through a first mask; A connecting portion and a plurality of second conductive units, these first conductive units are arranged at intervals along the first axis, and these first electrical connecting portions are respectively electrically connected to the adjacent first conductive units to form at least one first axis To the conductive group, wherein at least part of the thickness of each first electrical connection part is smaller than the thickness of each first conductive unit, and these second conductive units are arranged separately along the second axis; forming a plurality of second electrical connection parts, electrically These second conductive units adjacent to each other are connected to form a second axial conductive group; and a plurality of insulating materials are arranged on the substrate so that the first axial conductive group and the second axial conductive group are connected to each other Electrically insulated.

Based on the above, the conductive pattern structure of the touch panel of the present invention and its manufacturing method first pass through a mask to deposit the first conductive unit and the second conductive unit with special patterns, and then directly set the conductive material, the second conductive unit, and the second conductive unit. An electrical connection part and a second electrical connection part are used to form a first axial conductive group and a second axial conductive group. Therefore, the manufacturing process of the touch panel can be simplified. Specifically, by using a mask to deposit the first conductive unit and the second conductive unit with a special pattern instead of the known multi-process yellow light process, the purpose of reducing the manufacturing process is achieved.

Description of drawings

FIG. 1 is a schematic diagram of a conductive pattern structure of a touch panel according to a first embodiment of the present invention.

FIG. 2 is a flow chart of the steps of the method for manufacturing the conductive pattern structure of the touch panel according to the first embodiment of the present invention.

FIG. 3 is a schematic diagram of an implementation of step S10 and step S20 shown in FIG. 2 .

FIG. 4 is a schematic diagram of a mask in step S20 shown in FIG. 2 .

FIG. 5 is a schematic diagram of an implementation manner of step S30 shown in FIG. 2 .

FIG. 6 is a cross-sectional view of the conductive pattern structure shown in FIG. 1 along the line A-A.

FIG. 7 is a flowchart of steps of another manufacturing method of the conductive pattern structure according to the first embodiment of the present invention.

FIG. 8 is a schematic diagram of a mask in step S42 shown in FIG. 7 .

FIG. 9 is a schematic flowchart of the steps of another manufacturing method implementation manner of the conductive pattern structure according to the first embodiment of the present invention.

FIG. 10 is a flow chart of the steps of the method for manufacturing the conductive pattern structure of the touch panel according to the second embodiment of the present invention.

FIG. 11 is a schematic diagram of the first mask in step S20 shown in FIG. 10 .

FIG. 12A is a schematic diagram of an implementation of step S10 and step S25 shown in FIG. 10 .

Fig. 12B is a cross-sectional view taken along line A-A shown in Fig. 12A.

FIG. 13 is a schematic diagram of a conductive pattern structure of a touch panel according to a second embodiment of the present invention.

detailed description

The conductive pattern structure and the manufacturing method of the touch panel according to the preferred embodiment of the present invention will be described below with reference to the relevant drawings, wherein the same components will be described with the same reference numerals. The drawings of all the embodiments of the present invention are for illustration only, and do not represent real dimensions and proportions.

1 is a schematic diagram of a conductive pattern structure 1 of a touch panel according to a first embodiment of the present invention, and FIG. 2 is a flow chart of the steps of a manufacturing method of a conductive pattern structure 1 of a touch panel according to a first embodiment of the present invention. The manufacturing method shown in FIG. 2 makes the conductive pattern structure 1 of the touch panel shown in FIG. 1, and the conductive pattern structure 1 can be applied to touch substrates of various display panels, such as liquid crystal display panels ( LiquidCrystalDisplay, LCD), light-emitting diode (LED) display panel or organic light-emitting diode (OLED) display panel, electronic paper (book) and other touch substrates. The main structure of the conductive pattern structure 1 of the touch panel of this embodiment will be briefly described below, and then its manufacturing method will be described in a row.

Please refer to FIG. 1 , the conductive pattern structure 1 of this embodiment includes a substrate 11 , at least one first axial conductive group 12 , at least one second axial conductive group 13 and a plurality of insulating materials 14 . The first axial conductive group 12 is disposed on one side of the substrate 11. The first axial conductive group 12 includes a plurality of first conductive units 121 and a plurality of first electrical connection parts 122. These first conductive units 121 Separated along the first axis X, the first electrical connection portions 122 are respectively electrically connected to the adjacent first conductive units 121 . The second axial conductive group 13 is disposed on the same side of the substrate 11 as the first axial conductive group 12, and the second axial conductive group 13 includes a plurality of second conductive units 131 and a plurality of second electrical connections portion 132 , and the second conductive units 131 are spaced apart along the second axis Y.

As shown in Figure 2, the manufacturing method of the conductive pattern structure 1 includes the following steps: providing a substrate (step S10); depositing a plurality of first conductive units and a plurality of second conductive units on one side of the substrate through a mask, these The first conductive units are spaced apart along the first axis, and the second conductive units are spaced apart along the second axis (step S20); a plurality of insulating materials are arranged on the substrate (step S30); and a plurality of first electrical elements are formed. A connection part and a plurality of second electrical connection parts (step S40).

3 is a schematic diagram of the implementation of step S10 and step S20 shown in FIG. 2 , and FIG. 4 is a schematic diagram of the mask 2 in step S20 shown in FIG. 2 , please refer to FIG. 2 , FIG. 3 and FIG. 4 at the same time. In step S10 , a substrate 11 is provided, wherein the material of the substrate 11 may include resin, metal, ceramics, glass, plastic or other transparent materials. And in step S20, a plurality of first conductive units 121 and a plurality of second conductive units 131 are deposited on one side of the substrate 11 through the mask 2, and the first conductive units 121 are spaced apart along the first axis X, and The second conductive units 131 are arranged at intervals along the second axis Y. Specifically, this embodiment adopts the pattern configuration of the mask 2. As shown in FIG. 4, the mask 2 of this embodiment has a plurality of first openings 21 and a plurality of second openings 22, and the conductive material is 2 is deposited on the substrate 11, so that the first conductive units 121 arranged separately along the first axis X and a plurality of second conductive units 131 arranged separately along the second axis Y are formed on the substrate 11, as shown in FIG. 3 Show. That is to say, when the deposition step ( S20 ) is performed, the first conductive units 121 are spatially discontinuous, and the second conductive units 131 are spatially discontinuous, so as to form a configuration relationship separated from each other.

Wherein, the deposition method can be, for example but not limited to, evaporation (evaporation), sputtering (sputter) or chemical deposition, etc., and the first conductive units 121 and the second conductive units 131 are formed on the substrate 11 through the mask 2 , the pattern of the first conductive unit 121 is the same as that of the first opening 21 , and the pattern of the second conductive unit 131 is the same as that of the second opening 22 . The conductive material (namely the first conductive unit 121 and the second conductive unit 131) can be, for example but not limited to, indium tin oxide (indium-tinoxide, ITO) or indium zinc oxide (indium-zinc oxide, IZO), metal, graphite vinyl or other conductive materials.

FIG. 5 is a schematic diagram of an embodiment of step S30 shown in FIG. 2 , and then, in step S30 , a plurality of insulating materials 14 are disposed on the substrate 11 . Specifically, please refer to FIG. 3, the first conductive unit 121 of this embodiment has a neck 123, except for the tip of the first conductive unit 121, the neck 123 is the narrowest part of the first conductive unit 121. region, and preferably, the neck portion 123 is disposed near the center of the first conductive unit 121 so that the first conductive unit 121 has a symmetrical shape. Next, as shown in FIG. 5 , in step S30 , insulating materials 14 are respectively disposed on the necks 123 . In addition, in this embodiment, the insulating material 14 can be, for example but not limited to, silicon dioxide (SiO2), and can be provided in a manner such as but not limited to deposition, evaporation, printing (printing), inkjet (inkjeting) or dispensing , preferably, the insulating material 14 of this embodiment is formed on the neck portion 123 of the first conductive unit 121 by printing. Wherein, the insulating material 14 can electrically insulate the first axial conductive group 12 and the second axial conductive group 13 shown in FIG. 1 from each other, details of which will be described in detail below.

Please refer to FIG. 1 and FIG. 2, in step S40, a plurality of first electrical connection parts 122 and a plurality of second electrical connection parts 132 are formed, and the arrangement thereof is that each first electrical connection part 122 The adjacent first conductive units 121 are electrically connected to form at least one first axial conductive group 12, and each second electrical connection part 132 is disposed on the insulating material 14 to electrically connect the adjacent second The conductive unit 131 is used to form at least one second axial conductive group 13 .

That is to say, the first axial conductive group 12 of this embodiment is composed of a plurality of first conductive units 121 and a plurality of first electrical connection parts 122, wherein the first conductive units 121 have a neck portion 123 and extend along the They are spaced apart along the first axis X, and the first electrical connection portions 122 are respectively electrically connected to two adjacent first conductive units 121 . Wherein, the width of the first electrical connection portion 122 in this embodiment is approximately the same as the aforementioned neck portion 123 of the first conductive unit 121. Of course, the present invention does not limit the width of the first electrical connection portion 122, and may also be The structure that fills the gap between two adjacent first conductive units 121 , that is, the width of the first electrical connection portion 122 may also be equal to the widest part of the first conductive unit 121 , which is not limited in the present invention. The second axial conductive group 13 of this embodiment is composed of a plurality of second conductive units 131 and a plurality of second electrical connection parts 132, and these second conductive units 131 are arranged separately along the second axis Y, The second electrical connection portion 132 is disposed on the insulating material 14 to electrically connect two adjacent second conductive units 131 .

As shown in FIG. 1 , in the conductive pattern structure 1 manufactured according to the manufacturing method of this embodiment, at least part of the two ends of the first electrical connection part 122 overlaps with the adjacent first conductive unit 121 , and due to the second The electrical connection parts 132 are respectively electrically connected to two adjacent second conductive units 131 , so at least part of the two ends of the second electrical connection parts 132 overlap with the adjacent second conductive units 131 . Therefore, part of the first electrical connection portion 122 and the second electrical connection portion 132 in this embodiment overlap with the adjacent first conductive unit 121 or second conductive unit 131 at both ends, so in the overlapping area, the second The heights of the first electrical connection portion 122 and the second electrical connection portion 132 are also higher than the first conductive unit 121 or the second conductive unit 131 . FIG. 6 is a cross-sectional view of the conductive pattern structure 1 shown in FIG. 1 on the A-A section line. FIG. 6 shows two adjacent first conductive units 121 and the first electrical connection portion 122 connected therebetween. As can be seen from the illustration, where the first electrical connection portion 122 and the first conductive unit 121 overlap in this embodiment, the height of the first electrical connection portion 122 is higher than that of the first conductive unit 121 . Furthermore, as shown in FIG. 1 , the first axial conductive group 12 in this embodiment has a convex portion 124 at the position where each first electrical connection portion 122 overlaps with an adjacent first conductive unit 121 . Similarly, the second axial conductive group 13 also has a convex portion (not shown) at the position where each second electrical connection portion 132 overlaps with the adjacent second conductive unit 131 .

In terms of manufacturing method, please refer to FIG. 5, the first electrical connection part 122 and the second electrical connection part 132 can be, for example but not limited to, deposition (which can be vapor deposition, sputtering or chemical deposition), printing or inkjet It is arranged on the substrate 11 in a manner, in this embodiment, it is printed, so the first electrical connection part 122 can be arranged between two adjacent first conductive units 121 through the design of the printed steel plate. , and the second electrical connection portion 132 is disposed on the insulating material 14 to electrically connect two adjacent second conductive units 131 .

In other embodiments, the first electrical connection portion 122 and the second electrical connection portion 132 can also be formed by deposition, as shown in FIG. 7 , which is another example of the conductive pattern structure of the first embodiment of the present invention. A flow chart of the steps of the manufacturing method. Step S42 of this embodiment deposits a plurality of first electrical connection parts 122 and a plurality of second electrical connection parts 132 on one side of the substrate 11 through another mask 3 . FIG. 8 is a schematic diagram of the mask 3 in step S42 shown in FIG. 7. Please refer to FIG. 5, FIG. 7 and FIG. 8 ), and the pattern and position of the third opening 31 correspond to the first electrical connection portion 122 , while the pattern and position of the fourth opening 32 correspond to the second electrical connection portion 132 . The mask 3 is set corresponding to the substrate 11, and the conductive material is deposited on the substrate 11 through the mask 3, so that the first electrical connection part 122 and the second electrical connection part 132 are deposited on the substrate 11, and this The embodiment is deposited on the substrate 11 by sputtering, as shown in FIG. 1 , to form the first axial conductive group 12 and the second axial conductive group 13 that are electrically connected. Certainly, the conductive material forming the first conductive unit 121 and the second conductive unit 131 may be the same as or different from the conductive material forming the first electrical connection portion 122 and the second electrical connection portion 132, and their materials may be, for example, But not limited to indium tin oxide, or indium zinc oxide.

As mentioned above, the plurality of insulating materials 14 provided in step S30 are respectively provided between the first axial conductive group 12 and the second axial conductive group 13, so that the first axial conductive group 12 and the second axial conductive group 13 are electrically insulated from each other to avoid short circuit.

In addition, the present invention does not limit the implementation sequence of the steps of forming the first conductive unit 121 and the second conductive unit 131 (step S20 ) and forming the first electrical connection portion 122 and the second electrical connection portion 132 (step S40 ). 9 is a flow chart of the steps of another manufacturing method of the conductive pattern structure according to the first embodiment of the present invention. As shown in FIG. S40), then corresponding to the position of the second electrical connection portion 132, and setting the insulating material 14 (step S30), then, depositing the first conductive unit 121 and the second conductive unit 131 (step S20), to form the first The axial conductive group 12 and the second axial conductive group 13 .

Based on the above, in the previous embodiment, in step S20, a plurality of first conductive units 121 and a plurality of second conductive units 131 are directly deposited on one side of the substrate 11 through the mask 2, so it can replace the known multiple processes Yellow light process, in order to achieve the purpose of reducing the manufacturing process.

In the second embodiment of the present invention, a different mask is provided, which is referred to as the first mask 4 herein, which can also directly deposit a plurality of first conductive units and a plurality of second conductive units on one side of the substrate, In order to achieve the purpose of reducing the manufacturing process. 10 is a flow chart of the steps of the method for manufacturing the conductive pattern structure of the touch panel according to the second embodiment of the present invention. The conductive pattern structure 5 of the second embodiment of the present invention can be obtained by implementing the manufacturing method as shown in FIG. 10 (please first Refer to Figure 13).

The manufacturing method of the conductive pattern structure 2 according to the second embodiment of the present invention includes the following steps: providing a substrate (step S10); These first conductive units are spaced apart along the first axial direction, and these first electrical connection parts are respectively electrically connected to the adjacent first conductive units to form at least one first An axial conductive group, wherein at least part of the thickness of each first electrical connection part is smaller than the thickness of each first conductive unit, and these second conductive units are arranged separately along the second axial direction (step S25); an insulating material (step S30); forming a plurality of second electrical connection parts on one side of the substrate to electrically connect adjacent second conductive units to form a second axial conductive group (step S45).

FIG. 11 is a schematic diagram of the first mask 4 in step S20 shown in FIG. 10 , and FIG. 12A is a schematic diagram of an implementation of step S10 and step S25 shown in FIG. 10 , please match FIG. 11 and FIG. 12A . First, the substrate 51 is provided in step S10, and then, in step S25, a plurality of first conductive units 521, a plurality of first electrical connection parts 522 and a plurality of first conductive units 521 are deposited on one side of the substrate 51 through the first mask 4. a second conductive unit 531. Specifically, the first mask 4 of this embodiment has a plurality of fifth openings 41 and a plurality of sixth openings 42 . Wherein, the pattern of the fifth opening 41 corresponds to the first conductive unit 521 and part of the first electrical connection portion 522, the pattern of the fifth opening 41a shown in FIG. 11 corresponds to the first conductive unit 521, and the fifth opening The figure 41b corresponds to a part of the first electrical connection portion 522 . In addition, the pattern of the sixth opening 42 corresponds to the second conductive unit 531 . In step S25, a conductive material is deposited on one side of the substrate 51 through the first mask 4, and can be deposited on the substrate 51 to form a first conductive unit 521, a first electrical connection portion 522 and a plurality of second conductive materials. Unit 531, as shown in Figure 12A. The deposition method in this embodiment can also be, for example but not limited to, sputtering, vapor deposition, chemical deposition and the like. Wherein, although the first mask 4 used in this embodiment has the fifth opening 41b corresponding to the part of the first electrical connection portion 522, during the deposition process, after the conductive material passes through the fifth opening 41b, it will go to Both sides are diffused to form first electrical connection parts 522 electrically connected to each other, wherein at least part of the thickness of the first electrical connection part 522 is smaller than the thickness of each first conductive unit 521 , as shown in FIG. 12B . FIG. 12B is a cross-sectional view along line A-A shown in FIG. 12A , which shows that the thickness of the first electrical connection portion 522 near the center is smaller than that of the first conductive unit 521 .

Please refer to FIG. 12A , in step S25, the first conductive units 521 can be formed to be separated along the first axis X, and the first electrical connection parts 522 are respectively electrically connected to the adjacent first conductive units 521, so as to A pattern structure of at least one first-axis conductive group 52 is formed, and the second conductive units 531 are arranged at intervals along the second axis Y.

FIG. 13 is a schematic diagram of a conductive pattern structure of a touch panel according to a second embodiment of the present invention, please refer to FIG. 10 , FIG. 12A and FIG. 13 at the same time. Next, in step S30, a plurality of insulating materials 54 are disposed on the substrate 51, and in this embodiment, disposed on the first electrical connection portion 522, and in step S45, a plurality of insulating materials 54 are formed on one side of the substrate 51. A second electrical connection portion 532 is disposed on the insulating material 54 in this embodiment to electrically connect adjacent second conductive units 531 to form the second axial conductive group 53 . Therefore, the insulating material 54 of this embodiment is disposed between the first electrical connection portion 522 and the second electrical connection portion 532, so that the first axial conductive group 52 and the second axial conductive group 53 are electrically connected to each other. sex insulation.

Based on the above, the conductive pattern structure 5 of the touch panel of the second embodiment of the present invention can be prepared through the above-mentioned manufacturing method, and its main structure includes a substrate 51, a first axial conductive group 52, a second axial To the conductive group 53 and the insulating material 54 . The first axial conductive group 52 is disposed on one side of the substrate 51. The first axial conductive group 52 includes a first conductive unit 521 and a first electrical connection portion 522. The first conductive unit 521 is along the first axial direction. The Xs are spaced apart, and the first electrical connection parts 522 are respectively electrically connected to the adjacent first conductive units 521 , wherein at least part of the thickness of the first electrical connection parts 522 is smaller than the thickness of the first conductive units 521 . The second axial conductive group 53 is disposed on the same side of the substrate 51 as the first axial conductive group 52, the second axial conductive group 53 includes a second conductive unit 531 and a second electrical connection portion 532, and The second conductive units 531 are spaced apart along the second axis Y, and the second electrical connection portions 532 are respectively electrically connected to adjacent second conductive units 531 . The insulating material 54 is respectively disposed between the first axial conductive group 52 and the second axial conductive group 53 to electrically insulate the first axial conductive group 52 and the second axial conductive group 53 from each other.

To sum up, the conductive pattern structure of the touch panel of the present invention and the manufacturing method thereof first pass through a mask to deposit the first conductive unit and the second conductive unit with a special pattern, and then directly set the conductive material, the second conductive unit, etc. An electrical connection part and a second electrical connection part are used to form a first axial conductive group and a second axial conductive group. Therefore, the manufacturing process of the touch panel can be simplified. Specifically, by using a mask to deposit the first conductive unit and the second conductive unit with a special pattern instead of the known multi-process yellow light process, the purpose of reducing the manufacturing process is achieved.

The foregoing descriptions are illustrative only, not limiting. Any equivalent modifications or changes made without departing from the spirit and scope of the present invention shall be included in the appended claims.

Claims (10)

1. a conductive pattern structure for contact panel, comprising:

Substrate;

At least one first axial group of conducting electricity, it is arranged on the side of described substrate, described first axial conduction group comprises multiple first conductive unit and multiple first electrical junction, described first conductive unit axially separates setting along first, described first electrical junction is electrically connected adjacent described first conductive unit respectively, and the two ends of described first electrical junction are overlapping with adjacent described multiple first conductive units at least partly;

At least one the 2nd axial group of conducting electricity, it is arranged on the same side of described substrate with the described first axial conduction group, described 2nd axial conduction group comprises multiple 2nd conductive unit and multiple 2nd electrical junction, and described 2nd conductive unit axially separates setting along the 2nd, described 2nd electrical junction is electrically connected adjacent described 2nd conductive unit respectively, and the two ends of described 2nd electrical junction at least partly are overlapping with adjacent described 2nd conductive unit; And

Multiple insulating material, is separately positioned on described first and axially conducts electricity group and the described 2nd axially between conduction group, so that the described first axial conduction group and the described 2nd axial conduction group are electrically insulated each other.

2. the conductive pattern structure of contact panel as claimed in claim 1, wherein said first axially conducts electricity group on the position that each described first electrical junction is overlapping with adjacent described first conductive unit, has protuberance.

3. a manufacture method for the conductive pattern structure of contact panel, comprises the following steps:

Substrate is provided;

Depositing multiple first conductive unit and multiple 2nd conductive unit by mask in the side of described substrate, described first conductive unit axially separates setting along first, and described 2nd conductive unit axially separates setting along the 2nd;

Form multiple first electrical junction and multiple 2nd electrical junction, each described first electrical junction is electrically connected adjacent described first conductive unit, to form at least one first axial group of conducting electricity, each described 2nd electrical junction is electrically connected adjacent described 2nd conductive unit, to form at least one the 2nd axial group of conducting electricity; And

Multiple insulating material is set over the substrate, so that the described first axial conduction group and the described 2nd axial conduction group are electrically insulated each other.

4. the manufacture method of the conductive pattern structure of contact panel as claimed in claim 3, wherein said first conductive unit has neck, and described insulating material is separately positioned on described neck.

5. the manufacture method of the conductive pattern structure of contact panel as claimed in claim 3, wherein said first electrical junction and described 2nd electrical junction are to deposit, to steam plating, spatter plating, print or arrange in the way of ink-jet.

6. the manufacture method of the conductive pattern structure of contact panel as claimed in claim 3, wherein when carrying out deposition step, described first conductive unit is spatially mutually discontinuous, and described 2nd conductive unit is spatially mutually discontinuous.

7. the manufacture method of the conductive pattern structure of contact panel as claimed in claim 3, wherein said insulating material is arranged in the way of depositing, to steam plating, printing, ink-jet or some glue.

8. the manufacture method of the conductive pattern structure of contact panel as claimed in claim 3, on the wherein said first position that axially conduction group first electrical junction described in each is overlapping with adjacent described first conductive unit, has protuberance.

9. a conductive pattern structure for contact panel, comprising:

Substrate;

At least one first axial group of conducting electricity, it is arranged on the side of described substrate, described first axial conduction group comprises multiple first conductive unit and multiple first electrical junction, described first conductive unit axially separates setting along first, described first electrical junction is electrically connected adjacent described first conductive unit respectively, and wherein at least part of thickness of each described first electrical junction is less than the thickness of described first conductive unit; And

At least one the 2nd axial group of conducting electricity, it is arranged on the same side of described substrate with the described first axial conduction group, described 2nd axial conduction group comprises multiple 2nd conductive unit and multiple 2nd electrical junction, and described 2nd conductive unit axially separates setting along the 2nd, described 2nd electrical junction is electrically connected adjacent described 2nd conductive unit respectively; And

Multiple insulating material, is separately positioned on the described first axial conduction group and the described 2nd and axially leads between group, so that the described first axial conduction group and the described 2nd axial conduction group are electrically insulated each other.

10. a manufacture method for the conductive pattern structure of contact panel, comprises the following steps:

Substrate is provided;

By the first mask at the side of described substrate multiple first conductive unit of deposition, multiple first electrical junction and multiple 2nd conductive unit, described first conductive unit axially separates setting along first, described first electrical junction is electrically connected adjacent described first conductive unit respectively, to form at least one first axial group of conducting electricity, wherein at least part of thickness of each described first electrical junction is less than the thickness of each described first conductive unit, and described 2nd conductive unit axially separates setting along the 2nd;

Form multiple 2nd electrical junction, it is electrically connected adjacent described 2nd conductive unit, to form the 2nd axial group of conducting electricity; And

Multiple insulating material is set over the substrate, so that the described first axial conduction group and the described 2nd axial conduction group are electrically insulated each other.