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CN105676593B - A kind of photosensitive dry film of stable storing and preparation method thereof - Google Patents

A kind of photosensitive dry film of stable storing and preparation method thereof Download PDF

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Publication number
CN105676593B
CN105676593B CN201610034685.0A CN201610034685A CN105676593B CN 105676593 B CN105676593 B CN 105676593B CN 201610034685 A CN201610034685 A CN 201610034685A CN 105676593 B CN105676593 B CN 105676593B
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dry film
film
layer
photosensitive dry
layers
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CN105676593A (en
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韩传龙
李伟杰
严晓慧
李志强
黄森彪
周光大
林建华
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Hangzhou Foster Electronic Materials Co ltd
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Hangzhou Forster Applied Materials Ltd By Share Ltd
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor

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  • Materials For Photolithography (AREA)

Abstract

The present invention provides a kind of photosensitive dry film and preparation method thereof of stable storing, and the photosensitive dry film is successively made of support film layer, resist layer and protective film layer.Wherein, support film layer is two-sided heat-sealing type PET, has three-decker, forms by PETG layers of two layers copolyesters and positioned at two layers of PET resin layer between PETG layers of copolyesters, overcomes the disadvantage of conventional PET film heat sealability difference.It is cut by heating, so that the support membrane of incision, resist and protective film quickly seal, formation width is the hot sealing layer of 0.1-2.0mm; it can prevent resist layer from cold flow occurs in this way; inhibit edge gummosis, blocking oxygen and steam destroy, and obtain the dry film finished product of stable storing.In addition, the performances such as the resolution ratio of dry film will not be reduced even if being performed under heating conditions cutting.

Description

A kind of photosensitive dry film of stable storing and preparation method thereof
Technical field
The present invention relates to the preparation methods of a kind of photosensitive dry film with multi-layer structure and dry film.
Technical background
It is covered in printed circuit board, lead frame, semiconductor packages (such as BGA Package, chip size packages), metal In the fields such as film manufacture, photosensitive dry film is often used as the temporary protective material of pattern transfer.For example, in manufacture printed circuit board When, firstly, being bonded dry film photoresist on copper base, is covered on photosensitive dry film with the mask with certain pattern, carry out figure Shape exposure.Then, unexposed position is removed using weak alkaline aqueous solution as developer solution, then implements etching or electroplating processes and shape At figure.It is finally peeled away removal dry film cured portion, to realize pattern transfer.
Usual situation, photosensitive dry film are made of three-decker, are support film layer, resist layer, protective film layer respectively.Its In, it supports film layer and protective film layer major function is that carrying and protection are located in the middle resist layer.However, photosensitive dry film is storing up Deposit in transportational process, it is easy to there is the problem of poor storage stability, common phenomenon is that cold flow occurs, i.e., in resist layer Resist be easy supported membrane and protective film " extruding " and go out, cause resist layer became uneven occur even, in subsequent diagram In transfer process, a problem that circuitous pattern is easy to happen open circuit.Under serious situation, coiled dry film both ends are flowed out against corrosion Agent can adhere to together, and use when is difficult to open.
In order to improve the storage stability of photosensitive dry film, people have been many effort, patent document US 3,867,153 It proposes, at photosensitive dry film both ends, very narrow border area carries out photocuring processing, so that resist be prevented to flow out from both ends, improves Storage stability.If this method is feasible, it will so that the process of production is become complicated, reduce enterprises production efficiency.Patent document It is mentioned in US 4,293,635, the dosage of monomer or plasticizer in resist is reduced by (1), (2) are improved sets in resist The molecular weight of rouge can reduce cold flow tendency, extend storage time, but this can reduce photopolymerization rate, prolonging exposure time, And increases developing time, reduce production efficiency.
Summary of the invention
In view of the above-mentioned deficiencies in the prior art, it is an object of the present invention to provide photosensitive dry film and its preparation of a kind of stable storing Method.
The purpose of the present invention is what is be achieved through the following technical solutions: a kind of photosensitive dry film of stable storing, by photosensitive dry It is obtained after the heated cutting of film, the photosensitive dry film is successively made of support film layer, dry film photoresist layer and protective film layer.Its In, support film layer is two-sided heat-sealing type PET, has three-decker, by PETG layer of two layers copolyesters and positioned at two layers of copolyesters PET resin layer composition between PETG layers;The protective film layer is film layer.
Further, described copolyesters PETG layers by dimethyl terephthalate (DMT) (DMT), ethylene glycol (EG) and neopentyl glycol (NPG) three kinds of monomer polycondensations form.
Further, the two-sided heat-sealing type PET light transmittance is greater than 90%, and mist degree is less than 3%.
Further, the two-sided heat-sealing type PET can be sealed at 120-300 DEG C.
A kind of photosensitive dry film preparation method of stable storing, comprising the following steps:
(1) dry film solution is prepared: by the alkali soluble resins of 50-70 parts by weight, the monomer of 15-45 parts by weight, 0.5-10 weight It is uniformly mixed to measure the photoinitiator of part, the additive of 0.5-9 parts by weight, the solvent of 30-70 parts by weight, obtains dry film solution;
(2) coating and drying: the dry film solution that step (1) obtains is uniformly coated on two-sided heat-sealing type pet sheet face, is passed through Temperature is that 70 DEG C or so of drying tunnel is baked to, and forms dry film photoresist layer.
(3) it is bonded protective film: being bonded polyethylene film on resist layer surface, obtain the photosensitive dry film of three-decker.
(4) heating cutting dry film: Circular cutter is previously heated to 100-600 DEG C, the photosensitive dry film obtained to step (3) Heating cutting is carried out, so that incision quickly seals, formation width is the hot sealing layer of 0.1-2.0mm, obtains the sense of stable storing Light dry film.
Further, the speed of the heating cutting is 60-120m/min.
Further, the Circular cutter is with a thickness of 0.1-2.0mm.
Beneficial effects of the present invention: photosensitive dry film support membrane is two-sided heat-sealing type PET, overcomes common PET film heat sealability The disadvantage of energy difference, is cut, so that the support membrane of incision, resist and protective film quickly seal, formation width is by heating The hot sealing layer of 0.1-2.0mm can prevent resist layer from cold flow occurs in this way, inhibit edge gummosis, and blocking oxygen and steam are broken It is bad, obtain the dry film finished product of stable storing.
Specific embodiment
The present invention provides a kind of photosensitive dry film of stable storing, by obtaining after the heated cutting of photosensitive dry film;It is described photosensitive Dry film is successively made of support film layer, dry film photoresist layer and protective film layer.
Wherein, support film layer will have high transparency, low haze, good heat sealability and mechanical strength, low-moisture permeability, select With polyethylene terephthalate (PET) film, conventional PET resin can be by dimethyl terephthalate (DMT) (DMT) and second two Alcohol (EG) polycondensation forms homopolymer, but is easy to produce crystallization during stretching film forming, if carrying out heat-seal process to it, Deformation will be shunk.In order to reduce the crystallinity of PET film, the third monomer such as neopentyl glycol (NPG) is added, with DMT, EG Polycondensation obtains PETG copolymer resins, is amorphous structure, has good heat sealability, while optical property is fabulous.It utilizes Three-layer co-extruded double drawing production lines prepare tri- layers of compound PET film of A/B/A, and copolymer resins PETG, B layers of use are used at A layers Conventional PET resin obtains the PET film of two-sided heat-sealing type.Its light transmittance is greater than 90%, and mist degree is less than 3%.In addition, from coating Performance, mechanical strength, cost etc. consider, support membrane with a thickness of 15-100um, preferably 15-40um.
Dry film photoresist layer includes alkali soluble resins, monomer, photoinitiator and additive.
As alkali soluble resins of the invention, preferably carboxylic vinyl group resin, by unsaturated carboxylic acid and vinyl Copolymer compound obtains.The unsaturated carboxylic acid can enumerate (methyl) acrylic acid, butenoic acid, methacrylate, maleic acid, horse Come acid anhydrides, itaconic acid, crotonic acid etc..The vinyl compound can enumerate (methyl) methyl acrylate, (methyl) propylene Acetoacetic ester, (methyl) propyl acrylate, (methyl) butyl acrylate, (methyl) amyl acrylate, (methyl) Hexyl 2-propenoate, (methyl) lauryl acrylate, (methyl) octadecyl acrylate, (methyl) acrylate, (methyl) hydroxy-ethyl acrylate, (methyl) benzyl acrylate, styrene, α-methylstyrene, hydroxy styrenes, (methyl) acrylamide, N- methylol-propylene Amide, N- butoxymethyl-acrylamide, Phenoxyethyl (methyl) acrylate, (alkoxylate) nonyl phenol (methyl) Acrylate, N, N- dimethyl (methyl) ethyl acrylate, N, N- diethyl (methyl) ethyl acrylate, N, N- dimethyl (first Base) propyl acrylate, N, N- diethyl (methyl) propyl acrylate etc..
Carboxylic vinyl group resin can be by above-mentioned one or more unsaturated carboxylic acids and one or more vinyl Copolymer compound and obtain.The available well known method of preparation method, such as polymerisation in solution, suspension polymerisation.
As monomer of the invention, preferred (methyl) acrylate monomer, can enumerate (methyl) lauryl acrylate, (methyl) octadecyl acrylate, isobornyl thiocyanoacetate, acrylic acid tetrahydrofuran methyl esters, bisphenol-A two (methyl) acrylate, ethoxy Change (the third oxidation) bisphenol-A two (methyl) acrylate, poly- second (third) omega-diol diacrylate, ethoxyquin (the third oxidation) neopentyl glycol Diacrylate, trimethylolpropane trimethacrylate, ethoxyquin (the third oxidation) trimethylolpropane trimethacrylate, Ji Wusi The institutes such as alcohol triacrylate, pentaerythritol tetraacrylate, Dipentaerythritol Pentaacrylate, dipentaerythritol hexaacrylate The group of composition.
As photoinitiator of the invention, can with thioxanthones, benzoin phenyl ether, benzophenone, benzoin methyl ether, N, N'- tetramethyl -4,4'- diaminobenzophenone, N, N'- tetraethyl -4,4'- diaminobenzophenone, 4- methoxyl group -4'- Dimethylamino benzophenone, 2- benzyl -2- dimethylamino -1- (4- morpholino phenyl)-butanone, 2- ethyl hydrazine, phenanthrenequione, 2- tert-butyl anthraquinone, prestox anthraquinone, 1,2 benzae thracene quinone, 2,3- benzo anthraquinone, 2,3- diphenyl anthraquinone, 1- chloroanthraquinone, 2- Tectoquinone, 1,4- naphthoquinones, 9,10- phenanthrenequione, 2,3- dimethyl anthraquinone, benzoin methyl ether, benzoin ethyl ether, styrax phenyl The acridines such as bis- (9,9'- acridine) heptane of the benzil derivatives such as ether, benzil dimethyl ketal, 9- phenylacridine, 1,7- are derivative Object, N-phenylglycine, coumarin series compounds, oxazole based compound.Furthermore, it is possible to 2,4,5- triarylimidazoles dimers And its derivative, the 2- that can illustrate out (Chloro-O-Phenyl) -4,5- diphenyl-imidazole dimer, 2- (Chloro-O-Phenyl) -4,5-, bis- (first Phenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5- diphenyl-imidazole dimer, 2- (o-methoxyphenyl) -4,5- two Phenylimidazole dimer, 2- (p-methoxyphenyl) -4,5- diphenyl-imidazole dimer etc..
It as additive of the invention, can according to need, add the dyestuff containing malachite green etc, colorless crystal violet Equal light colour coupler, quality heat stabilizer, plasticizer, pigment, filler, defoaming agent, fire retardant, stabilizer, levelling agent, removing promote Agent, antioxidant, fragrance, preparation, thermal cross-linking agent etc..These components may be used alone or in combination use.
Dry film photoresist of the invention, can according to need, and be dissolved in methanol, ethyl alcohol, isopropanol, acetone, butanone, first Benzene, N,N-dimethylformamide, propylene glycol monomethyl ether, propylene glycol methyl ether acetate equal solvent or these solvents mixed solvent In.
Protective film will have low moisture-inhibiting, characteristic easily peelable, heat sealability is good, preferably polyethylene film, thickness 10- 100um, preferably 15-40um;
Hereinafter, illustrating the example of embodiments of the present invention, but the present invention is not limited to these Examples.
(embodiment 1-3, comparative example 1-2)
Each component is mixed in proportion according to the formula of following table 1,60 pbw acetones are added, have then been stirred well to Fully dissolved is made into the dry film solution that solid content is 40%.It was evenly coated on the PET films as support membrane in the production line (15um is thick) surface, solution is dried, form the dry film photoresist layer with a thickness of 26um by the drying tunnel that temperature is 70 DEG C or so, Green is presented under yellow fluorescent lamp.Then, it is bonded the polyethylene film as protective layer on its surface, with a thickness of 20um, thus The photosensitive dry film parent roll of 3-tier architecture is obtained.It is wound with 6 inches of reel, winding length is 3000m, and width is 1260mm.Photosensitive dry film parent roll is cut finally, cutting temperature according to table 1, obtains final dry film product, length 200m, Width is 248mm.
It should be noted that alkali soluble resins A is oneself preparation in table 1, using solution polymerization process, main component is first Base acrylic acid/acrylic acid/methyl methacrylate/n-BMA/lauryl acrylate/styrene=16/7/45/ 15/9/8 (Mw=76000, solid content 40%).
Table 1
Note: photoinitiator in table 1:
B-1:2,2 ', 4- tri- (2- chlorphenyl) -5- (3,4- Dimethoxyphenyl) -4 ', 5 '-diphenyl -1,1 '-diimidazole (Changzhou electronic strong new material)
B-2:N- phenylglycine (West Asia chemistry)
Monomer:
C-1: trimethylolpropane trimethacrylate (Sartomer)
C-2:(4) ethoxylated bisphenol a diacrylate (Sartomer)
C-3: polyethylene glycol (400) diacrylate (Sartomer)
C-4: polyethylene glycol (600) diacrylate (Sartomer)
Additive:
D-1: magnificent green pigment (Shanghai lark waffle Technology Co., Ltd.)
D-2: leuco crystal violet (Shanghai lark waffle Technology Co., Ltd.)
D-3: trisbromomethyl phenyl sulfone (the uncommon love chemical industry of Shanghai ladder)
D-4:N, N- diethyl hydroxylamine (Shanghai lark waffle Technology Co., Ltd.)
Hereinafter, illustrating embodiment and the sample production method (including pad pasting, exposure, development) of comparative example, sample evaluation side Method and evaluation result.
[pad pasting]
There is the copper foil surface of polyimide film to be processed by shot blasting reverse side, washes, dries.Then it is rolled at 105 DEG C Under roll temperature, photosensitive dry film protective film is removed on one side, dry film photoresist is fitted in copper-clad laminate with hot roll lamination machine on one side On, in 0.3MPa, pad pasting speed is 1.5m/min for pressure control.
[exposure]
It is exposed using the holy science and technology M-552 type exposure machine of will, is exposed energy using 21 lattice exposure guide rule of stouffer Measurement, exposure lattice number are 7-9 lattice, exposure energy 35-66mj/cm2
[development]
Sample after above-mentioned exposure is developed under the conditions of 30 DEG C with the aqueous sodium carbonate of 1%wt, development pressure Power is 1.6bar, and developing time is 1.5 times of most short developing time.
[evaluation of resolution ratio]
Using Line/Space=10/10-100/100 μm of equal line-spacings, etc. the photomask of line widths wiring pattern exposed Photodevelopment is observed after washing drying using magnifying glass.
[evaluation of storage stability]
Coiled dry film finished product is wrapped up with black plastic paper, is individually positioned in room temperature (5-20 DEG C) and 50 DEG C of constant temperature In constant humidity cabinet, the two relative humidity is all controlled after 40-65%, a period of time, dry film both ends gummosis situation is observed, with number It indicates as a result, numerical value is smaller to illustrate that dry film storage stability is better.
When storing at room temperature:
1: placing 6 months without gummosis;
2: placing 6 months and slight gummosis occur;
3: placing 3 months and slight gummosis occur;
4: placing 3 months and serious gummosis occur;
When being stored under the conditions of 50 DEG C:
1: placing 1 month without gummosis;
2: placing 1 month and slight gummosis occur;
3: placing and slight gummosis occurred in 2 week;
4: placing and serious gummosis occurred in 2 week;
Evaluation result is shown in Table 2
By embodiment 1-3 it can be found that the former storage stability is better than the latter compared with comparative example 1, cutting is warm Degree at 160 DEG C and its more than when, plastic packaging effect is obvious, and heats cutting and will not reduce dry film resolution ratio.1 He of comparative example Comparative example 2 does not seal effect using conventional PET film, and using heat-sealing type PET film, effect is obvious.
It is cut by heating, so that the heat-sealing type PET film (support membrane) of incision, dry film photoresist and PE film (protective film) It is quickly sealed, formation width is the hot sealing layer of 0.1-2.0mm, can prevent resist layer that cold flow occurs in this way, improves storage Deposit stability.Therefore, using photosensitive dry film finished product prepared by the present invention, while keeping fine resolution, it will be apparent that improve The stability of storage.

Claims (7)

1. a kind of photosensitive dry film of stable storing, which is characterized in that described photosensitive dry by being obtained after the heated cutting of photosensitive dry film Film is successively made of support film layer, dry film photoresist layer and protective film layer;Wherein, support film layer is two-sided heat-sealing type PET, is had Three-decker is formed by PETG layers of two layers copolyesters and positioned at two layers of PET resin layer between PETG layers of copolyesters;The protection Film layer is film layer.
2. photosensitive dry film according to claim 1, which is characterized in that described copolyesters PETG layers by terephthalic acid (TPA) diformazan Three kinds of ester (DMT), ethylene glycol (EG) and neopentyl glycol (NPG) monomer polycondensations form.
3. photosensitive dry film according to claim 1, which is characterized in that the two-sided heat-sealing type PET light transmittance is greater than 90%, Mist degree is less than 3%.
4. photosensitive dry film according to claim 1, which is characterized in that the two-sided heat-sealing type PET is carried out at 120-300 DEG C Heat-sealing.
5. a kind of photosensitive dry film preparation method of stable storing, which comprises the following steps:
(1) dry film solution is prepared: by the alkali soluble resins of 50-70 parts by weight, the monomer of 15-45 parts by weight, 0.5-10 parts by weight Photoinitiator, the additives of 0.5-9 parts by weight, 30-70 parts by weight solvent be uniformly mixed, obtain dry film solution;
(2) coating and drying: the dry film solution that step (1) obtains is uniformly coated on two-sided heat-sealing type pet sheet face, passes through temperature Drying tunnel for 70 DEG C is baked to, and forms dry film photoresist layer;
(3) it is bonded protective film: being bonded polyethylene film on resist layer surface, obtain the photosensitive dry film of three-decker;
(4) heating cutting dry film: being previously heated to 100-600 DEG C for Circular cutter, carries out to the photosensitive dry film that step (3) obtain Heating cutting, so that incision quickly seals, formation width is the hot sealing layer of 0.1-2.0mm, obtains the photosensitive dry of stable storing Film.
6. photosensitive dry film preparation method according to claim 5, which is characterized in that the speed of the heating cutting is 60- 120m/min。
7. photosensitive dry film preparation method according to claim 5, which is characterized in that the Circular cutter is with a thickness of 0.1- 2.0mm。
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CN109575342B (en) * 2018-12-03 2021-06-04 湖南五江高科技材料有限公司 Synthetic method of acrylic resin for photosensitive dry film
CN114114842B (en) * 2021-11-25 2025-07-01 杭州福斯特电子材料有限公司 A dry film resist laminate, resin composition and preparation method thereof
CN114114837A (en) * 2021-11-25 2022-03-01 杭州福斯特电子材料有限公司 Dry film resist and preparation method thereof

Citations (4)

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Publication number Priority date Publication date Assignee Title
EP1098223A1 (en) * 1999-11-03 2001-05-09 Shipley Company LLC Dry film photopolymerizable compositions
CN101203807A (en) * 2005-06-20 2008-06-18 东京应化工业株式会社 Photoresist film roll and method for manufacturing same
CA2751350A1 (en) * 2011-09-01 2013-03-01 Nitto Denko Corporation Adhesive patch and adhesive preparation
CN104536266A (en) * 2015-01-30 2015-04-22 杭州福斯特光伏材料股份有限公司 Dry film photoresist lamination body

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030091926A1 (en) * 1999-11-03 2003-05-15 Shipley Company, L.L.C. Dry film photoresist

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1098223A1 (en) * 1999-11-03 2001-05-09 Shipley Company LLC Dry film photopolymerizable compositions
CN101203807A (en) * 2005-06-20 2008-06-18 东京应化工业株式会社 Photoresist film roll and method for manufacturing same
CA2751350A1 (en) * 2011-09-01 2013-03-01 Nitto Denko Corporation Adhesive patch and adhesive preparation
CN104536266A (en) * 2015-01-30 2015-04-22 杭州福斯特光伏材料股份有限公司 Dry film photoresist lamination body

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