CN105644028A - Natural graphite/locally heat-insulation combined radiating fin - Google Patents
Natural graphite/locally heat-insulation combined radiating fin Download PDFInfo
- Publication number
- CN105644028A CN105644028A CN201610138532.0A CN201610138532A CN105644028A CN 105644028 A CN105644028 A CN 105644028A CN 201610138532 A CN201610138532 A CN 201610138532A CN 105644028 A CN105644028 A CN 105644028A
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- Prior art keywords
- native graphite
- layer
- heat
- microns
- local
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a natural graphite/locally heat-insulation combined radiating fin. The natural graphite/locally heat-insulation combined radiating fin comprises back adhesive layers, a locally heat-insulation layer and a natural graphite radiating layer. The natural graphite radiating layer is arranged on the upper sides of the back adhesive layers, the locally heat-insulation layer is arranged inside the natural graphite radiating layer or is arranged on the upper side of the natural graphite radiating layer, and the integral thickness of the combined radiating fin ranges from 30 micrometers to 2100 micrometers. Owing to the mode, the natural graphite/locally heat-insulation combined radiating fin has the advantages that local high-temperature heat can be quickly radiated, and the natural graphite/locally heat-insulation combined radiating fin is high in radiating speed.
Description
Technical field
The present invention relates to the technical field of heat dissipation for mobile communication, particularly relate to the heat insulation heat sink compound in a kind of native graphite/local.
Background technology
At present, the demand of notebook and TV and display screen make consumption increase, the demand of display screen high brightness makes light emitting diode make consumption increase, also strengthening the caloric value of equipment, battery power consumption increases simultaneously, and battery capacity also and then improves, display apparatus is made to generate heat more because power consumption strengthens, as can not be effectively controlled heating, not only high temperature makes the CPU operating of equipment go wrong or loss of function, also can make heat-producing device shortening in service life. And because needing importing heat sink material under the condition of high temperature, again because of the in-house limited space of mobile phone and tablet PC, so traditional thick and heavy radiating subassembly cannot be used, it is necessary to use thin fin material.
Separately because hand communication machine and tablet PC do not design radiator fan, so the heat that device interior produces need to be reached fin by heater, reached casing by fin again to dispel the heat, but because of handheld device inherent space constraints, use thin radiative material, the heat of equipment major part can concentrate on the place near from heater so that casing each portion temperature of handheld device is uneven, makes hand-held feel be deteriorated. So the CPUCPU of equipment generates heat because of high-speed cruising, for improving its speed of service, current radiating mode has not reached requirement.
Summary of the invention
The technical problem that present invention mainly solves is to provide the heat insulation heat sink compound in a kind of native graphite/local, it is possible to diffusion local high heat, and rapid heat dissipation rapidly.
For solving above-mentioned technical problem, the technical scheme that the present invention adopts is: provide a kind of native graphite/local heat insulation heat sink compound, including: gum layer, local thermal insulation layer and native graphite heat dissipating layer, described gum layer be provided above native graphite heat dissipating layer, described local thermal insulation layer is arranged on native graphite heat dissipating layer inside or is arranged on above native graphite heat dissipating layer, and described heat sink compound integral thickness is 30 microns��2100 microns.
In a preferred embodiment of the present invention, described local thermal insulation layer is built in native graphite heat dissipating layer with mosaic mode.
In a preferred embodiment of the present invention, described local thermal insulation layer sticks on native graphite heat dissipating layer upper surface by local back adhesive layer.
In a preferred embodiment of the present invention, the native graphite of described native graphite heat dissipating layer is spent sintering by polyimide thin slice through 2500 to 2800 and is formed, and the base material thickness of described native graphite heat dissipating layer is at 10 microns��80 microns.
In a preferred embodiment of the present invention, the material of described local thermal insulation layer is lamellar aeroge or nonconducting non-metallic sheet or low thermal conductivity flaky material, and the thickness of described local thermal insulation layer is at 10 microns��1000 microns.
In a preferred embodiment of the present invention, described gum heat dissipating layer thickness is at 3 microns��100 microns.
In a preferred embodiment of the present invention, described native graphite layer thickness is 5 microns��80 microns
The invention has the beneficial effects as follows: the present invention adopts local thermal insulation layer to be labelled to maximum temperature point, then allow local high heat spread to surrounding, alleviate high temperature concentration phenomenon, it is possible to spread rapidly heat.
Accompanying drawing explanation
Fig. 1 is the structural representation of native graphite/local of the present invention heat insulation heat sink compound one preferred embodiment;
Fig. 2 is the heat radiation schematic diagram of embodiment in Fig. 1;
Fig. 3 is the structural representation of heat insulation another preferred embodiment of heat sink compound in native graphite/local of the present invention;
Fig. 4 is the heat radiation schematic diagram of embodiment in Fig. 3;
In accompanying drawing, the labelling of each parts is as follows: 1, gum layer; 2, local thermal insulation layer; 3, native graphite heat dissipating layer; 4, heat generating component; 5, shell.
Detailed description of the invention
Below in conjunction with accompanying drawing, presently preferred embodiments of the present invention is described in detail, so that advantages and features of the invention can be easier to be readily appreciated by one skilled in the art, thus protection scope of the present invention being made apparent clear and definite defining.
Referring to Fig. 1 and Fig. 3, the embodiment of the present invention includes:
The heat insulation heat sink compound in a kind of native graphite/local, including: gum layer 1, local thermal insulation layer 2 and native graphite heat dissipating layer 3, described gum layer 1 be provided above native graphite heat dissipating layer 3, described local thermal insulation layer 2 is arranged on native graphite heat dissipating layer 3 inside or is arranged on above native graphite heat dissipating layer 3, and described heat sink compound integral thickness is 30 microns��2100 microns.
Furtherly, described local thermal insulation layer 2 is built in native graphite heat dissipating layer 3 with mosaic mode; Described local thermal insulation layer 2 sticks on native graphite heat dissipating layer 3 upper surface by local back glue-line 1; The native graphite of described native graphite heat dissipating layer 3 is spent sintering by polyimide thin slice through 2500 to 2800 and is formed, and the base material thickness of described native graphite heat dissipating layer 3 is at 10 microns��80 microns; The material of described local thermal insulation layer 2 is lamellar aeroge or nonconducting non-metallic sheet or low thermal conductivity flaky material, and the thickness of described local thermal insulation layer 2 is at 10 microns��1000 microns; Described gum layer 1 thickness is at 3 microns��100 microns; Described native graphite heat dissipating layer 3 thickness is 5 microns��80 microns.
Embodiment one:
Refer to Fig. 1 and Fig. 2, the present invention is the composite fin of native graphite heat dissipating layer+local thermal insulation layer+gum layer, with native graphite as heat radiating material, it is attached on the heat generating component 4 of handheld communication machine or tablet PC with double faced adhesive tape gum layer, the Btu utilization native graphite heat dissipating layer 3 of heat generating component 4 is conducted to device housings 5, being transmitted in air by 5 heats of device housings, such mechanism constitutes the heater heat dissipation path of handheld communication machine or tablet PC.
On handheld communication machine or tablet PC, because of use in be hand-held, because of handheld communication machine or tablet PC inherent space constraints, the fin that thickness is too big cannot be used, so when handheld communication machine or the heating of tablet PC heater, by heat sink compound, heat is conducted, because heat sink compound thickness limits, fin surface temperature is more high the closer to heater temperature, more low further away from heater temperature, in the heat conduction path of equipment, fin is heat to be conducted again the shell 5 to equipment, and shell 5 contacts with hands.Because the thickness of equipment cooling sheet is limited, heat-sinking capability is limited, higher by heater spot temperature, from heater more away from temperature more low, thus take, have the phenomenon that each spot temperature of handheld device enclosure 5 is inconsistent, and affect the not good problem of the feel in use.
Embodiment two:
Refer to Fig. 3 and Fig. 4,
The present invention is based on tradition native graphite fin, a piece of with heater local of the same size thermal insulation layer 2 setting up on the native graphite heat dissipating layer 3 at heater position, native graphite heat dissipating layer 3 is thermally isolated closest to the part of heater, so shell temperature nearest corresponding to heater can reduce, again because of the relation of native graphite heat conduction, originally the heat on the position native graphite heat dissipating layer 3 nearest from heat generating component 4 is toward heater center to four sides diffusion, the area that native graphite heat dissipating layer 3 is the warmmest is made to increase, because the caloric value of heater is fixed value, when highest temperature position area increases, then the temperature value of the highest temperature can reduce because area increases, namely originally concentrate on the little area highest temperature at heater position, affecting casing is also the little area highest temperature concentrated, and isolate with shell 5 because local thermal insulation layer 2 native graphite heat dissipating layer 3 originally collects the small areas highest temperature, the highest temperature value of shell 5 temperature made reduces, and reduce hand-held discomfort.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every equivalent structure utilizing description of the present invention and accompanying drawing content to make or equivalence flow process conversion; or directly or indirectly it is used in other relevant technical fields, all in like manner include in the scope of patent protection of the present invention.
Claims (7)
1. the heat insulation heat sink compound in native graphite/local, it is characterized in that, including: gum layer, local thermal insulation layer and native graphite heat dissipating layer, described gum layer be provided above native graphite heat dissipating layer, described local thermal insulation layer is arranged on native graphite heat dissipating layer inside or is arranged on above native graphite heat dissipating layer, and described heat sink compound integral thickness is 30 microns��2100 microns.
2. the heat insulation heat sink compound in native graphite/local according to claim 1, it is characterised in that: described local thermal insulation layer is built in native graphite heat dissipating layer with mosaic mode.
3. the heat insulation heat sink compound in native graphite/local according to claim 1, it is characterised in that: described local thermal insulation layer sticks on native graphite heat dissipating layer upper surface by local back adhesive layer.
4. the heat insulation heat sink compound in native graphite/local according to claim 1, it is characterized in that: the native graphite of described native graphite heat dissipating layer is spent sintering by polyimide thin slice through 2500 to 2800 and formed, and the base material thickness of described native graphite heat dissipating layer is at 10 microns��80 microns.
5. the heat insulation heat sink compound in native graphite/local according to claim 1, it is characterized in that: the material of described local thermal insulation layer is lamellar aeroge or nonconducting non-metallic sheet or low thermal conductivity flaky material, and the thickness of described local thermal insulation layer is at 10 microns��1000 microns.
6. the heat insulation heat sink compound in native graphite/local according to claim 1, it is characterised in that: described gum heat dissipating layer thickness is at 3 microns��100 microns.
7. the heat insulation heat sink compound in native graphite/local according to claim 1, it is characterised in that: described native graphite layer thickness is 5 microns��80 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610138532.0A CN105644028A (en) | 2016-03-11 | 2016-03-11 | Natural graphite/locally heat-insulation combined radiating fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610138532.0A CN105644028A (en) | 2016-03-11 | 2016-03-11 | Natural graphite/locally heat-insulation combined radiating fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105644028A true CN105644028A (en) | 2016-06-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610138532.0A Pending CN105644028A (en) | 2016-03-11 | 2016-03-11 | Natural graphite/locally heat-insulation combined radiating fin |
Country Status (1)
| Country | Link |
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| CN (1) | CN105644028A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1487786A (en) * | 2003-08-04 | 2004-04-07 | 台达电子工业股份有限公司 | Uniform temperature device |
| CN102573417A (en) * | 2010-12-23 | 2012-07-11 | 仁宝电脑工业股份有限公司 | Shell structure and electronic device with same |
| CN202750393U (en) * | 2012-07-20 | 2013-02-20 | 深圳市飞荣达科技股份有限公司 | Heat conductive layer sheet |
| CN104470324A (en) * | 2013-09-17 | 2015-03-25 | 松下电器产业株式会社 | Composite sheet |
| CN204994196U (en) * | 2015-09-08 | 2016-01-20 | 昆山汉品电子有限公司 | A thermal -insulated membrane of heat dissipation and heat radiation structure for electronic components |
| CN105611810A (en) * | 2016-03-11 | 2016-05-25 | 奇华光电（昆山）股份有限公司 | Artificial/local thermal insulation composite heat sink |
| CN205408382U (en) * | 2016-03-11 | 2016-07-27 | 奇华光电（昆山）股份有限公司 | Electrographite / part separates heat recombination fin |
-
2016
- 2016-03-11 CN CN201610138532.0A patent/CN105644028A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1487786A (en) * | 2003-08-04 | 2004-04-07 | 台达电子工业股份有限公司 | Uniform temperature device |
| CN102573417A (en) * | 2010-12-23 | 2012-07-11 | 仁宝电脑工业股份有限公司 | Shell structure and electronic device with same |
| CN202750393U (en) * | 2012-07-20 | 2013-02-20 | 深圳市飞荣达科技股份有限公司 | Heat conductive layer sheet |
| CN104470324A (en) * | 2013-09-17 | 2015-03-25 | 松下电器产业株式会社 | Composite sheet |
| CN204994196U (en) * | 2015-09-08 | 2016-01-20 | 昆山汉品电子有限公司 | A thermal -insulated membrane of heat dissipation and heat radiation structure for electronic components |
| CN105611810A (en) * | 2016-03-11 | 2016-05-25 | 奇华光电（昆山）股份有限公司 | Artificial/local thermal insulation composite heat sink |
| CN205408382U (en) * | 2016-03-11 | 2016-07-27 | 奇华光电（昆山）股份有限公司 | Electrographite / part separates heat recombination fin |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160608 |