CN105636341A - PCB with hollow cavity structure and manufacturing method therefor - Google Patents
PCB with hollow cavity structure and manufacturing method therefor Download PDFInfo
- Publication number
- CN105636341A CN105636341A CN201610008169.0A CN201610008169A CN105636341A CN 105636341 A CN105636341 A CN 105636341A CN 201610008169 A CN201610008169 A CN 201610008169A CN 105636341 A CN105636341 A CN 105636341A
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- CN
- China
- Prior art keywords
- copper
- transmission line
- tabula rasa
- bonding sheet
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a PCB with a hollow cavity structure and a manufacturing method therefor. The PCB comprises a first copper-coated plate, a second copper-coated plate, a bonding sheet substrate and a differential transmission line, wherein the first copper-coated plate comprises a first optical plate; first copper-coated layers are arranged on the upper end plane and the lower end plane of the first optical plate respectively; the second copper-coated plate comprises a second optical plate; a second copper-coated layer is arranged on the lower end plane of the second optical plate; the upper end plane of the bonding sheet substrate is adhered to the first copper-coated layer on the lower end plane of the first optical plate; the lower end plane of the bonding sheet substrate is adhered to the upper end plane of the second optical plate; a hollow cavity is formed in the bonding sheet substrate; the differential transmission line and the lower end plane of the second optical plate are fixed; and the differential transmission line is positioned in the hollow cavity. According to the PCB and the manufacturing method therefor, the PCB signal transmission property can be effectively realized, and the loss of the transmission line can be greatly lowered; and in addition, the PCB has a simple manufacturing process and low cost.
Description
Technical field
The present invention relates to pcb board technical field, particularly relate to a kind of pcb board with cavity structure and preparation method thereof.
Background technology
Along with the development of the technology such as big data, cloud computing, Internet of Things, data transmission constantly develops to high frequency, high speed direction. Traditional PCB acts primarily as electrical connection effect in the communications industry, and when signal transmission rate reaches more than Gbps rank, it is necessary to consider that the loss of PCB upper transmission tape, especially for long distance signal transmission system, such as backboard. In current High-Speed PCB, single-channel transmission speed is generally 10Gbps, and part has reached 25Gbps, and with the technical development of 4G and following 5G, in High-Speed PCB, single-channel transmission speed needs to reach 40-60Gbps. Therefore, if reducing transmission line signals loss further, it is provided that PCB signal integrity can effectively facilitate the technical developments such as communication, cloud computing, Internet of Things.
The upper transmission line loss of PCB is mainly derived from dielectric loss and conductor losses. Conductor losses causes mainly due to copper conductor, reduces Copper Foil roughness and can reduce loss of signal to a certain extent, and consider Copper Foil and bonding sheet base material in conjunction with reliability, Copper Foil roughness preferably must be held in again certain roughness scope. Dielectric loss is to be caused by insulating medium layer, material dielectric constant (Dk) and fissipation factor (Df) determine. Not met High-Speed PCB development need, the copper-clad plate such as Panasonic, NELCO, Isola manufacturer is proposed High-Speed PCB material one after another, such as materials such as Megtron6/7, Meterowave2000, Tachyon, these materials Df has been lowered to 0.003, it may be said that have already decreased to the limit, Dk/Df value, close to PTFE material, is difficult to reduce loss again through lifting material property. Therefore, how to reduce transmission line surrounding medium loss further, lower signal transmission attenuation, be one, High-Speed PCB field important subject.
Summary of the invention
For above-mentioned technical problem, an object of the present invention is in that to provide a kind of pcb board with cavity structure, and it can effectively provide PCB signal transmission performance, reduces cost.
The two of the purpose of the present invention are in that to provide the manufacture method of a kind of pcb board with cavity structure, and it is used for realizing an object of the present invention.
For realizing an object of the present invention, adopt the following technical scheme that
A kind of pcb board with cavity structure, including the first copper-clad plate, second copper-clad plate, bonding sheet base material and difference transmission lines, described first copper-clad plate includes the first tabula rasa, and the upper surface of this first tabula rasa and lower surface are respectively equipped with the first copper clad layers; Described second copper-clad plate includes the second tabula rasa, and the lower surface of this second tabula rasa is provided with second copper-clad layer; First copper clad layers bonding of the upper surface of described bonding sheet base material and the first tabula rasa lower surface, the upper surface of the lower surface of bonding sheet base material and the second tabula rasa bonds; Described bonding sheet base material forms hollow cavity, and the lower surface of described difference transmission lines and the second tabula rasa is fixed, and this difference transmission lines is positioned at hollow cavity.
Preferably, described bonding sheet base material includes the 3rd tabula rasa, and upper surface and the lower surface of the 3rd tabula rasa are equipped with uncured resin layer.
Preferably, described difference transmission lines includes the first transmission line and the second transmission line, the width of this first transmission line and the second transmission line is equal, distance between first transmission line and the second transmission line is less than or equal to the twice of the first transmission line width, and described first transmission line is all higher than with the distance of hollow cavity medial wall and the distance of the second transmission line and hollow cavity medial wall or is equal to the twice of the first transmission line width.
For realizing the two of the purpose of the present invention, adopt the following technical scheme that
The manufacture method of a kind of pcb board with cavity structure, comprises the steps:
Step one: providing the first copper-clad plate, second copper-clad plate and bonding sheet base material, described first copper-clad plate includes the first tabula rasa, and the upper surface of this first tabula rasa and lower surface are respectively equipped with the first copper clad layers; Described second copper-clad plate includes the second tabula rasa, and the lower surface of this second tabula rasa is provided with second copper-clad layer;
Step 2: the first copper-clad plate carries out line pattern making, forms difference transmission lines;
Step 3: bonding sheet base material is carried out milling vacancy reason to form the hollow cavity of bonding sheet base material;
Step 4: difference transmission lines is fixed on the upper surface of the second tabula rasa, and the first copper-clad plate, bonding sheet base material, second copper-clad plate are sequentially laminated, make the upper surface of bonding sheet base material and the first copper clad layers bonding of the first tabula rasa lower surface, the upper surface of the lower surface of bonding sheet base material and the second tabula rasa bonds, and difference transmission lines is positioned at hollow cavity.
Preferably, described bonding sheet base material includes the 3rd tabula rasa, and upper surface and the lower surface of the 3rd tabula rasa are equipped with uncured resin layer.
Preferably, described difference transmission lines includes the first transmission line and the second transmission line, the width of this first transmission line and the second transmission line is equal, and described first transmission line is all higher than with the distance of hollow cavity medial wall and the distance of the second transmission line and hollow cavity medial wall or is equal to the twice of the first transmission line width.
Compared to existing technology, beneficial effects of the present invention is as follows:
The present invention can be effectively improved PCB signal, is substantially reduced the loss of transmission line surrounding medium, and processing technology is simple, and cost is low.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of pcb board with cavity structure of the present invention;
Fig. 2 is the manufacture method flow chart of a kind of pcb board with cavity structure of the present invention.
Wherein, the 1, first copper-clad plate; 11, the first tabula rasa; 12, the first copper clad layers; 2, second copper-clad plate; 21, the second tabula rasa; 22, second copper-clad layer; 3, bonding sheet base material; 31, hollow cavity; 32, the 3rd tabula rasa; 33, uncured resin layer; 4, difference transmission lines.
Detailed description of the invention
Below, in conjunction with accompanying drawing and detailed description of the invention, the present invention is described further:
Referring to Fig. 1, the present invention provides a kind of pcb board with cavity structure, it is a kind of multi-layer sheet, and including the first copper-clad plate 1, second copper-clad plate 2, bonding sheet base material 3 and difference transmission lines 4, the first copper-clad plate 1, bonding sheet base material 3, second copper-clad plate 2 set gradually from top to bottom. First copper-clad plate 1 includes the first tabula rasa 11, and the upper surface of this first tabula rasa 11 and lower surface are respectively equipped with the first copper clad layers 12; Second copper-clad plate 2 includes the second tabula rasa 21, and the lower surface of this second tabula rasa 21 is provided with second copper-clad layer 22; First copper clad layers 12 of the upper surface of bonding sheet base material 3 and the first tabula rasa 11 lower surface bonds, and the upper surface of the lower surface of bonding sheet base material 3 and the second tabula rasa 21 bonds; The reason formation of bonding sheet base material 3 milling vacancy is provided with hollow cavity 31, and the lower surface of described difference transmission lines 4 and the second tabula rasa 21 is fixed, and this difference transmission lines 4 is positioned at hollow cavity 31. With second copper-clad plate 2, first copper-clad plate 1 is distinctive in that upper and lower two end faces of the first copper-clad plate 1 are each coated with layers of copper, and second copper-clad plate 2 only lower surface is coated with layers of copper, second tabula rasa 21 and bonding sheet base material 3 are dielectric, the lower surface of difference transmission lines 4 and dielectric are fixed, it is vacuum state between upper surface distance the first copper-clad plate 1, that is, certain distance is had between top and first copper clad layers 12 of difference transmission lines 4, non-filler matter in hollow cavity 31, forms vacuum.
As preferred embodiment, bonding sheet base material 3 includes the 3rd tabula rasa 32, and upper surface and the lower surface of the 3rd tabula rasa 32 are equipped with uncured resin layer 33, and this structure can effectively reduce harmomegathus ratio during lamination, thering is provided aligning accuracy, uncured resin layer 33 plays the effect of bonding.
Bonding sheet base material 3 can also be other structures, for instance other copper-clad plate base material tabula rasas.
Difference transmission lines 4 includes the first transmission line and the second transmission line, the width of this first transmission line and the second transmission line is equal, distance between first transmission line and the second transmission line is less than or equal to the twice of the first transmission line width, and described first transmission line is all higher than with the distance of hollow cavity 31 medial wall and the distance of the second transmission line and hollow cavity 31 medial wall or is equal to the twice of the first transmission line width. Here the distance of the medial wall of the first transmission line and hollow cavity 31 refers to the distance between the first transmission line and its hithermost medial wall, and the distance of the second transmission line and the medial wall of hollow cavity 31 is in like manner.
On the other hand, also provide for the manufacture method of a kind of pcb board with cavity structure, referring to Fig. 2, comprise the steps:
S1: selected material required for the present invention, it is provided that the first copper-clad plate, second copper-clad plate and bonding sheet base material, described first copper-clad plate includes the first tabula rasa, and the upper surface of this first tabula rasa and lower surface are respectively equipped with the first copper clad layers; Described second copper-clad plate includes the second tabula rasa, and the lower surface of this second tabula rasa is provided with second copper-clad layer;
S2: the first copper-clad plate is carried out line pattern making; Make line pattern by sawing sheet, development, etching work procedure, form difference transmission lines;
S3: bonding sheet base material is carried out milling vacancy reason to form the hollow cavity of bonding sheet base material; By boring, milling plate current journey by empty for the local milling of bonding sheet base material;
S4: difference transmission lines is fixed on the upper surface of the second tabula rasa, and the first copper-clad plate, bonding sheet base material, second copper-clad plate are sequentially laminated, make the upper surface of bonding sheet base material and the first copper clad layers bonding of the first tabula rasa lower surface, the upper surface of the lower surface of bonding sheet base material and the second tabula rasa bonds, and difference transmission lines is positioned at hollow cavity, last outer graphics makes and obtains final pcb board.
The one way in which of bonding sheet base material is for including the 3rd tabula rasa, upper surface and the lower surface of the 3rd tabula rasa are equipped with uncured resin layer, which is formation tabula rasa after copper is removed in copper-clad plate two rim etching, and it is coated with uncured resin in its twice, its material can be FR4 material, it is also possible to for other resin system copper-clad plate base materials.
Difference transmission lines includes the first transmission line and the second transmission line, the width of this first transmission line and the second transmission line is equal, distance between first transmission line and the second transmission line is less than or equal to the twice of the first transmission line width, and described first transmission line is all higher than with the distance of hollow cavity medial wall and the distance of the second transmission line and hollow cavity medial wall or is equal to the twice of the first transmission line width.
Conventional FR4 material is adopted to make 6 laminates, the dielectric constant of dielectric is 4.2 (1GHz), Df is 0.02 (1GHz), adopts this material to make 6/6mil difference transmission lines and is positioned at the 3rd layer, difference transmission lines impedance design is 100ohm, and length of transmission line is 10Inch. Adopting Network Analyzer test transmission line loss, under normal configuration transmission line 10GHz frequency, loss test result is 1.1dB/Inch, and the loss of difference transmission lines is only 0.53dB/Inch in the present invention.
Present invention have the advantage that (1) makes transmission line surrounding medium loss reduce by the structural design of hollow cavity, thus pcb board signal transmission performance can be effectively improved, lower signal transmission attenuation, adopt conventional material to make High-Speed PCB, reduce material cost of manufacture; (2) bonding sheet is the solidification tabula rasa of coated with resins, can effectively reduce harmomegathus ratio during pressing, improves aligning accuracy; (3) processing technology is compatible with existing pcb board processing technology, and technique is simple, and cost is low.
It will be apparent to those skilled in the art that can technical scheme as described above and design, make other various corresponding changes and deformation, and all these change and deformation all should belong within the protection domain of the claims in the present invention.
Claims (6)
1. a pcb board with cavity structure, it is characterized in that, including the first copper-clad plate, second copper-clad plate, bonding sheet base material and difference transmission lines, described first copper-clad plate includes the first tabula rasa, and the upper surface of this first tabula rasa and lower surface are respectively equipped with the first copper clad layers; Described second copper-clad plate includes the second tabula rasa, and the lower surface of this second tabula rasa is provided with second copper-clad layer; First copper clad layers bonding of the upper surface of described bonding sheet base material and the first tabula rasa lower surface, the upper surface of the lower surface of bonding sheet base material and the second tabula rasa bonds; Described bonding sheet base material forms hollow cavity, and the lower surface of described difference transmission lines and the second tabula rasa is fixed, and this difference transmission lines is positioned at hollow cavity.
2. having the pcb board of cavity structure as claimed in claim 1, it is characterised in that described bonding sheet base material includes the 3rd tabula rasa, upper surface and the lower surface of the 3rd tabula rasa are equipped with uncured resin layer.
3. there is the pcb board of cavity structure as claimed in claim 1, it is characterized in that, described difference transmission lines includes the first transmission line and the second transmission line, the width of this first transmission line and the second transmission line is equal, distance between first transmission line and the second transmission line is less than or equal to the twice of the first transmission line width, and described first transmission line is all higher than with the distance of hollow cavity medial wall and the distance of the second transmission line and hollow cavity medial wall or is equal to the twice of the first transmission line width.
4. the manufacture method of a pcb board with cavity structure, it is characterised in that comprise the steps:
Step one: providing the first copper-clad plate, second copper-clad plate and bonding sheet base material, described first copper-clad plate includes the first tabula rasa, and the upper surface of this first tabula rasa and lower surface are respectively equipped with the first copper clad layers; Described second copper-clad plate includes the second tabula rasa, and the lower surface of this second tabula rasa is provided with second copper-clad layer;
Step 2: the first copper-clad plate carries out line pattern making, forms difference transmission lines;
Step 3: bonding sheet base material is carried out milling vacancy reason to form the hollow cavity of bonding sheet base material;
Step 4: difference transmission lines is fixed on the upper surface of the second tabula rasa, and the first copper-clad plate, bonding sheet base material, second copper-clad plate are sequentially laminated, make the upper surface of bonding sheet base material and the first copper clad layers bonding of the first tabula rasa lower surface, the upper surface of the lower surface of bonding sheet base material and the second tabula rasa bonds, and difference transmission lines is positioned at hollow cavity.
5. having the manufacture method of the pcb board of cavity structure as claimed in claim 4, it is characterised in that described bonding sheet base material includes the 3rd tabula rasa, upper surface and the lower surface of the 3rd tabula rasa are equipped with uncured resin layer.
6. there is the manufacture method of the pcb board of cavity structure as claimed in claim 4, it is characterized in that, described difference transmission lines includes the first transmission line and the second transmission line, the width of this first transmission line and the second transmission line is equal, and described first transmission line is all higher than with the distance of hollow cavity medial wall and the distance of the second transmission line and hollow cavity medial wall or is equal to the twice of the first transmission line width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610008169.0A CN105636341A (en) | 2016-01-01 | 2016-01-01 | PCB with hollow cavity structure and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610008169.0A CN105636341A (en) | 2016-01-01 | 2016-01-01 | PCB with hollow cavity structure and manufacturing method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105636341A true CN105636341A (en) | 2016-06-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610008169.0A Pending CN105636341A (en) | 2016-01-01 | 2016-01-01 | PCB with hollow cavity structure and manufacturing method therefor |
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| Country | Link |
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| CN (1) | CN105636341A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107864553A (en) * | 2017-12-07 | 2018-03-30 | 生益电子股份有限公司 | PCB manufacturing method and PCB |
| CN110636718A (en) * | 2019-10-30 | 2019-12-31 | 生益电子股份有限公司 | A kind of manufacturing method of PCB |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102143647A (en) * | 2010-11-25 | 2011-08-03 | 聚信科技有限公司 | Circuit board and manufacturing method thereof |
| CN102413629A (en) * | 2011-07-27 | 2012-04-11 | 大唐移动通信设备有限公司 | Printed circuit board and manufacturing method thereof |
| JP2013098888A (en) * | 2011-11-04 | 2013-05-20 | Sony Corp | Electronic circuit, manufacturing method of electronic circuit, and packaging member |
-
2016
- 2016-01-01 CN CN201610008169.0A patent/CN105636341A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102143647A (en) * | 2010-11-25 | 2011-08-03 | 聚信科技有限公司 | Circuit board and manufacturing method thereof |
| CN102413629A (en) * | 2011-07-27 | 2012-04-11 | 大唐移动通信设备有限公司 | Printed circuit board and manufacturing method thereof |
| JP2013098888A (en) * | 2011-11-04 | 2013-05-20 | Sony Corp | Electronic circuit, manufacturing method of electronic circuit, and packaging member |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107864553A (en) * | 2017-12-07 | 2018-03-30 | 生益电子股份有限公司 | PCB manufacturing method and PCB |
| CN110636718A (en) * | 2019-10-30 | 2019-12-31 | 生益电子股份有限公司 | A kind of manufacturing method of PCB |
| CN110636718B (en) * | 2019-10-30 | 2021-01-05 | 生益电子股份有限公司 | Manufacturing method of PCB |
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Application publication date: 20160601 |