CN105634429A - Oscillator with temperature sensing component and method of making same - Google Patents

Abstract

An oscillator with a temperature sensing assembly and a manufacturing method thereof are provided. The base is provided with a body which is provided with a containing chamber and a cover plate which closes the containing chamber. The piezoelectric component is arranged in the accommodating chamber, and the temperature sensing component is arranged on the lower surface of the body and used for sensing the working environment temperature of the piezoelectric component and then carrying out temperature compensation through the integrated circuit. The welding pads are arranged on the lower surface of the body, the electric supporting blocks are respectively jointed on the lower surface of the body through the welding pads and surround the temperature sensing assembly, and the welding pads and the electric supporting blocks have a preset height so as to form a space for accommodating the temperature sensing assembly.

Description

Oscillator with temperature sensing component and method of making same

technical field

The invention relates to an oscillator and a manufacturing method thereof, in particular to an oscillator with a temperature sensing component and a manufacturing method thereof.

Background technique

Referring to Fig. 1, China Taiwan No. 201334404A1 Early Publication No. Invention Patent discloses an oscillator 1, which includes: a base 11, a piezoelectric component 12, two adhesive parts 13, an upper surrounding wall 14, and an upper cover 15. A thermistor assembly 16, and a lower surrounding wall 17.

The base 11 has an upper surface 110 and a lower surface 111 opposite to the upper surface 110 . The piezoelectric component 12 is coupled to the upper surface 110 of the base 11 through the adhesive member 13 . The upper surrounding wall 14 is disposed on the upper surface 110 around the piezoelectric component 12 . The upper cover 15 is disposed on the upper surrounding wall 14 and together with the base 11 defines a closed chamber 112 for accommodating the piezoelectric element 12 . The thermistor assembly 16 is disposed on the lower surface 111 of the base 11 . The lower surrounding wall 17 is disposed on the lower surface 111 of the base 11 to surround the thermistor assembly 16 .

Those who are familiar with this technical field know that the temperature and frequency characteristics of the piezoelectric component 12 due to temperature changes will vary with the cutting angle of the piezoelectric component 12. Therefore, when the piezoelectric component 12 When 12 has different cutting angles, it will produce different temperature and frequency characteristics.

Moreover, the oscillator 1 is usually mounted on an external circuit board (not shown), and the thermistor assembly 16 is used to detect the working environment temperature of the oscillator 1 and give back the temperature on the external circuit board. Application-specific integrated circuit (ASIC) (not shown), and the application-specific integrated circuit compensates the frequency drift of the piezoelectric element 12 due to temperature, and then outputs a stable reference frequency (Reference frequency). The lower surrounding wall 17 is used to elevate the entire oscillator 1, and protect and prevent the thermistor assembly 16 from contacting the external circuit board, and the lower surrounding wall 17 is mainly made of a multilayer alumina ceramic substrate or It is composed of printed circuit board (Printedcircuitboard, PCB) and other materials.

In addition, in the process of bonding the oscillator 1 to the external circuit board, pads (not shown) must be arranged on the external circuit board first, and then solder paste is printed on the pads; The placement machine mounts the oscillator 1 on the external circuit board; finally, the oscillator 1 is electrically combined with the external circuit board through reflow soldering (Reflow).

It can be seen from the above description that the oscillator 1 needs to print solder paste on the pad of the external circuit board before it can be electrically combined with the external circuit board. Therefore, it is easy to cause the problem of solder refusal due to poor wettability of the solder paste and the pad between the two different materials.

Furthermore, in order to protect the thermistor assembly 16 from being crushed and damaged by the external circuit board, the oscillator 1 must elevate the thermistor assembly 16 through the lower surrounding wall 17 . However, the lower surrounding wall 17 is mainly composed of a multi-layer alumina ceramic substrate or a printed circuit board, which needs to be manufactured using a co-fired ceramic process or a printed circuit board manufacturing process. Therefore, making the lower surrounding wall 17 requires higher production costs and more complicated procedures. Moreover, since the alumina ceramic substrate or the printed circuit board is made of multi-layer structures pressed together, the stacked structure will also limit the height adjustment of the lower wall 17, and cannot be optimally adjusted. It also does not meet the trend of thinning.

Therefore, improving the existing oscillator to solve the problems of high cost and its overall height limitation is a subject to be broken through by those skilled in the art.

Contents of the invention

The object of the present invention is to provide an oscillator with a temperature sensing component.

The oscillator with temperature sensing component of the present invention is electrically connected to an external circuit board, and includes a base, a piezoelectric component, a temperature sensing component, a plurality of welding pads, and a plurality of electrical supporting blocks.

The base has a body formed with a chamber, a cover plate closing the chamber, and a first wiring pattern and a second wiring pattern arranged on the body. The piezoelectric component is arranged in the chamber of the base and electrically connected to the first wiring pattern. The temperature sensing component is disposed on a lower surface of the body of the base and is electrically connected to the first wiring pattern and the second wiring pattern, and communicates with the piezoelectric component through the first wiring pattern electrical connection. The welding pads are arranged on the lower surface of the body of the base and are respectively electrically connected to the second wiring patterns. The electrical support blocks are respectively bonded to the lower surface of the body of the base through the solder pads and surround the temperature sensing component, and are used to electrically connect to the circuit of the external circuit board, the solder pads and the The electrical supporting block has a predetermined height, which is sufficient to form a space between the base and the external circuit board for accommodating the temperature sensing component.

Preferably, the aforementioned oscillator has a temperature sensing component, the temperature sensing component is used to detect the working environment temperature of the piezoelectric component and compensate the piezoelectric component through an integrated circuit for external temperature compensation or an integrated circuit for its own temperature compensation. The frequency drift of electrical components due to temperature differences.

Preferably, in the aforementioned oscillator with a temperature sensing component, the first wiring pattern has a first line and a second line, and the first line of the first wiring pattern has a a first end extending from the lower surface thereof, an extension extending laterally from the first end in the interior of the body, and a second end extending downward from the extension to the lower surface of the body; The second circuit of the first wiring pattern has a first end portion extending from the upper surface of the body toward the lower surface thereof, a first extension portion extending laterally from the first end portion in the interior of the body, a Its first extension extends downward to the second end of the lower surface of the body, a second extension extends laterally from the first extension in the interior of the body, and a second extension extends downward from the second extension extending to the third end of the lower surface of the body; the second wiring pattern has a first line, a second line, a third line, and a fourth line, and the first wiring pattern of the second wiring pattern The circuit, the second circuit, the third circuit, and the fourth circuit respectively have a first end extending from the lower surface of the body toward the upper surface, and a peripheral edge extending from the first end in the interior of the body toward the body an extension portion extending laterally, and a second end portion extending downward from the extension portion to the lower surface of the body; the piezoelectric component is connected to each of the first line and the second line of the first wiring pattern One end, the temperature sensing component is connected to the second end of the first line of the first wiring pattern and the second end and the third end of the second line of the first wiring pattern, and connected to the second wiring Each first end of the first line, the second line, the third line, and the fourth line of the pattern; the pads are respectively connected to the first line, the second line, and the third line of the second wiring pattern, and each second end of the fourth line.

Preferably, in the aforementioned oscillator with a temperature sensing component, the welding pad is circular, and the predetermined height is inversely proportional to the diameter of the welding pad.

Preferably, in the aforementioned oscillator with a temperature sensing component, the electrical support block is made of conductive material.

In addition, another object of the present invention is to provide a method for manufacturing an oscillator with a temperature sensing component.

The manufacturing method of the oscillator with temperature sensing components of the present invention includes a material preparation step, a piezoelectric component setting step, a sealing step, an electrical support block bonding step, and a temperature sensing component mounting step.

The material preparation step is to prepare a base, a piezoelectric component, a temperature sensing component, and a plurality of electrical support blocks. A first wiring pattern and a second wiring pattern are isolated on the body.

The step of arranging the piezoelectric component is to set the piezoelectric component in the chamber of the base and electrically connect to the first wiring pattern.

In the sealing step, the cover plate is used to close the chamber of the body of the base, so as to seal the piezoelectric component in the chamber.

The step of connecting the electrical support block is to attach a plurality of electrical support blocks to the lower surface of the base through a plurality of welding pads disposed on the lower surface of the base and electrically connected to the second wiring pattern. .

The step of mounting the temperature sensing component is to place the temperature sensing component on the lower surface of the base surrounded by the electrical support block, and electrically connect the first wiring pattern and the second wiring pattern , so that the temperature sensing component and the piezoelectric component are electrically connected through the first wiring pattern, thereby forming an oscillator with a temperature sensing component.

In the present invention, the predetermined height formed by the solder pad and the electrical supporting block is enough to make the oscillator electrically connected to an external circuit board to form a receiving space between the base and the external circuit board. space for the temperature sensing component.

Preferably, the manufacturing method of the aforementioned oscillator with a temperature sensing component also includes a package test step, the package test step is to conduct an electrical characteristic detection and an aging test on the oscillator to confirm that the oscillator can be normal work and meet the needs of the application side.

Preferably, in the aforementioned manufacturing method of an oscillator with a temperature sensing component, in the material preparation step, the first wiring pattern of the base has a first circuit and a second circuit, and the first wiring pattern The first line has a first end extending from an upper surface of the body toward its lower surface, an extension extending laterally from the first end in the interior of the body, and an extension extending downward from the extension Extending to the second end of the lower surface of the body; the second line of the first wiring pattern has a first end extending from the upper surface of the body toward its lower surface, and a first end extending from the first end to the lower surface of the body. A first extension extending laterally inside the body, a second end extending downward from the first extension to the lower surface of the body, a first extension extending laterally inside the body from the first extension Two extensions, and a third end extending downward from the second extension to the lower surface of the body; the second wiring pattern has a first line, a second line, a third line, and A fourth line, the first line, the second line, the third line, and the fourth line of the second wiring pattern respectively have a first end extending from the lower surface of the body toward the upper surface, a The first end extends laterally toward the periphery of the body in the interior of the body, and a second end extends downward from the extension to the lower surface of the body; in the step of setting the piezoelectric component, the electric In the following step of the permanent support block and the step of mounting the temperature sensing component, the piezoelectric component is connected to the first ends of the first line and the second line of the first wiring pattern, and the temperature sensing component is connected to the first end of the second line. The second end of the first line of a wiring pattern, the second end and the third end of the second line, and connected to the first line, the second line, and the third line of the second wiring pattern , and each first end of the fourth circuit; the electrical support block is respectively connected to the first circuit, the second circuit, the third circuit, and the fourth circuit of the second wiring pattern through the pad each second end.

Preferably, in the aforementioned manufacturing method of an oscillator with a temperature sensing component, in the step of affixing the electrical support block, the welding pad is circular, and the predetermined height is inversely proportional to the diameter of the welding pad.

Preferably, in the aforementioned manufacturing method of an oscillator with a temperature sensing component, in the step of following the electrical support block, the electrical support block is made of conductive material.

The beneficial effect of the present invention is that: by means of the electrical support block directly arranged under the base, it can effectively solve the problem of the existing lower surrounding wall composed of a multi-layer alumina ceramic substrate or a printed circuit board. The resulting problems of high cost and height limitation; in addition, when the oscillator of the present invention is combined with the external circuit board, the problem of solder rejection caused by different materials can also be solved.

Description of drawings

FIG. 1 is a schematic cross-sectional view illustrating an oscillator disclosed in Taiwan's Early Publication No. 201334404A1 Invention Patent;

FIG. 2 is an exploded perspective view illustrating an embodiment of an oscillator of the present invention having a temperature sensing component;

Fig. 3 is a schematic side view illustrating the connection relationship between the components of this embodiment of the present invention;

4 is a schematic top view illustrating an upper surface of a base of the embodiment of the present invention and a first wiring pattern displayed on the upper surface thereof;

5 is a schematic diagram illustrating the interior of the base of the embodiment of the present invention, and a first wiring pattern and a second wiring pattern shown inside;

6 is a schematic bottom view illustrating the lower surface of the base of the embodiment of the present invention, and the first wiring pattern, the second wiring pattern and a plurality of welding pads displayed on the lower surface;

Figure 7 is an X-Y scatter diagram illustrating the relationship between the ball diameter of the electrical support block and the predetermined height of this embodiment of the present invention;

Figure 8 is an X-Y scatter diagram illustrating the relationship between the diameter of the pad and the predetermined height of this embodiment of the present invention;

FIG. 9 is a flow chart illustrating an embodiment of the method for fabricating an oscillator with a temperature sensing element of the present invention.

detailed description

The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

Referring to FIG. 2 and FIG. 3, an embodiment of the oscillator with temperature sensing components of the present invention is electrically connected to an external circuit board 200, and this embodiment of the oscillator with temperature sensing components of the present invention includes a base 2 , a piezoelectric component 5 , a temperature sensing component 6 , a plurality of welding pads 7 , and a plurality of electrical supporting blocks 8 .

The base 2 has a body 22 forming a chamber 21 , a cover 23 closing the chamber 21 , and a first wiring pattern 3 and a second wiring pattern 4 disposed on the body 22 . In this embodiment of the present invention, the first wiring pattern 3 and the second wiring pattern 4 are shown in FIG. 4 , FIG. 5 , and FIG. 6 . And the base 2 is made of ceramic material (Ceramics), but not limited thereto.

The piezoelectric component 5 is disposed in the chamber 21 of the base 2, and is electrically connected to the first wiring pattern 3 through a first electrical adhesive 51, and is protected by the cover plate 23 to be enclosed in the In the chamber 21 , in this embodiment, the piezoelectric component 5 is made of quartz (Quartz), but the present invention is not limited thereto.

The temperature sensing component 6 is arranged on a lower surface of the body 22 of the base 2, and is used to detect the working environment temperature of the piezoelectric component 5, and through the integrated circuit of external temperature compensation or the integration of its own temperature compensation The circuit compensates the frequency drift of the piezoelectric component 5 due to temperature difference. In this embodiment, the temperature sensing component 6 is composed of an integrated circuit with its own temperature compensation, which mainly includes a temperature sensing reading structure, a compensation circuit structure, and a device for driving the piezoelectric component 5 to generate Oscillating drive circuit architecture. The temperature sensing component 6 is electrically connected to the first wiring pattern 3 and the second wiring pattern 4 through a plurality of second electrical adhesives 61 as shown in FIG. The pattern 3 is electrically connected to the piezoelectric element 5 and outputs a stable reference frequency through the second wiring pattern 4 . In addition, it should be noted that the temperature sensing component 6 can also be a thermistor component, and is electrically connected to the external circuit board 200 through the second wiring pattern 4, and the external circuit board 200 Compensate the frequency drift of the piezoelectric component 5 due to the temperature difference.

The welding pads 7 are disposed on the lower surface of the main body 22 of the base 2 and are respectively electrically connected to the second wiring patterns 4 .

The electrical support block 8 is used to electrically connect to the circuit of the external circuit board 200 , and is respectively connected to the lower surface of the body 22 of the base 2 through the solder pads 7 and surrounds the temperature sensing component 6 , the welding pad 7 and the electrical supporting block 8 have a predetermined height H, the predetermined height H is sufficient to form a space between the base 2 and the external circuit board 200 for accommodating the temperature sensing component 6 . The electrical supporting blocks 8 are respectively made of conductive materials. In this embodiment, the electrical supporting blocks 8 are described by taking solder balls as an example.

In detail, the first wiring pattern 3 of the base 2 has a first circuit 31 and a second circuit 32 as shown in FIG. 2 . Referring to FIG. 2 again, and referring to FIG. 4 , FIG. 5 and FIG. 6 together, the first circuit 31 of the first wiring pattern 3 has a first end portion 311 extending from the upper surface of the body 22 toward the lower surface thereof. , an extension 312 extending laterally from the first end 311 of the body 22, and a second end 313 extending downward from the extension 312 to the lower surface of the body 22; The second line 32 of the line pattern 3 has a first end portion 321 extending from the upper surface of the body 22 toward its lower surface, and a first extension portion extending laterally from the first end portion 321 inside the body 22 322, a second end portion 323 extending downward from the first extension portion 322 to the lower surface of the body 22, a second extension portion 324 extending laterally from the first extension portion 322 in the interior of the body 22, and a third end portion 325 extending downward from the second extension portion 324 to the lower surface of the main body 22 .

Referring to FIG. 5 and FIG. 6 again, the second wiring pattern 4 has a first line 41 , a second line 42 , a third line 43 , and a fourth line 44 . The first line 41, the second line 42, the third line 43 and the fourth line 44 of the second wiring pattern 4 respectively have a first end portion 411, 421 extending from the lower surface of the body 22 toward the upper surface. . 412 , 422 , 432 , 442 extend down to the second end 413 , 423 , 433 , 443 of the lower surface of the body 22 .

Also refer to FIG. 2 again, and refer to FIG. 4 , FIG. 5 and FIG. 6 at the same time. The first ends 311, 321, and the temperature sensing component 6 is connected to the second end 313 of the first line 31 of the first wiring pattern 3 and the second end 323 of the second line 32 and the second end 323 of the second line 32. Three end portions 325, and connected to the first end portions 411, 421, 431, 441 of the first line 41, the second line 42, the third line 43, and the fourth line 44 of the second wiring pattern 4; The pads 7 are respectively connected to the second ends 413 , 423 , 433 , 443 of the first circuit 41 , the second circuit 42 , the third circuit 43 , and the fourth circuit 44 of the second wiring pattern 4 .

Referring to FIG. 7, change the ball diameter of the electrical support block 8 (solder ball) described in this embodiment, and fix the diameter of the solder pad 7 to 0.3 mm. From the measurement data shown in FIG. 7, it can be seen that with the As the ball diameter of the electrical support block 8 increases, the predetermined height H formed by it gradually increases, that is, the predetermined height H is proportional to the ball diameter of the electric support block 8 . Referring to FIG. 8, the diameter of the welding pad 7 in this embodiment is changed, and the ball diameter of the fixed electrical support block 8 (solder ball) is 0.45mm. It can be known from the measurement data shown in FIG. As the diameter of the welding pad 7 increases, the predetermined height H formed by it gradually decreases, that is, the predetermined height H is inversely proportional to the diameter of the welding pad 7 . Therefore, it can be seen from the above description that the size of the welding pad 7 and the electrical support block 8 will affect the predetermined height H, that is to say, the present invention can change the welding pad 7 and the The size of the electrical support block 8 can further control the predetermined height H, and the adjustment range of the predetermined height H can be accurate to below 0.1mm, compared with the existing alumina ceramic substrate or printed circuit board, it can It effectively solves the problem of its height limitation and is more in line with the trend of thinning.

In this embodiment of the present invention, through the mutual cooperation of the first wiring pattern 3 and the second wiring pattern 4, the piezoelectric components 5 respectively arranged in the chamber 21 of the base 2 and the piezoelectric element 5 arranged in the base The temperature sensing component 6 on the lower surface of the body 22 of the seat 2 is electrically connected, and the second wiring pattern 4 is electrically connected to the welding pad 7, and at the same time, the welding pad 7 is respectively connected to the electrical support block 8 are electrically connected/bonded to each other, so that this embodiment can be electrically connected to the external circuit board 200 through the electrical supporting block 8 .

Referring to FIG. 9 , an embodiment of the manufacturing method of an oscillator with a temperature sensing component of the present invention is to manufacture an oscillator with a temperature sensing component as shown in FIG. 3 . This embodiment of the manufacturing method of the present invention includes a material preparation step 91, a piezoelectric component setting step 92, a sealing step 93, an electrical support block subsequent step 94, a temperature sensing component mounting step 95, and a Package test step 96.

The material preparation step 91 is to prepare the base 2 , the piezoelectric component 5 , the temperature sensing component 6 , and the electrical support block 8 . In the present invention, the detailed structure of the base 2 and the specific materials used for the base 2 and the piezoelectric component 5 have been described in the foregoing description, and will not be repeated here. But what needs to be specially explained here is that in the embodiment of the manufacturing method, the through silicon via (Through silicon via) technology is used to form the extension part 312 of the first line 31 of the first wiring pattern 3, the first wiring pattern 3 The first extension part 322 and the second extension part 324 of the second line 32 of the line pattern 3, and the first line 41, the second line 42, the third line 43 and the fourth line 44 of the second wiring pattern 4 Each extension portion 412 , 422 , 432 , 442 is disposed in the main body 22 . In addition, the piezoelectric component 5 firstly grinds a quartz to the desired thickness to roughly adjust its frequency; then, the quartz is etched and cleaned to remove cracks and attached foreign matter and oil stains generated during the grinding process, and Drying to make the frequency range of the quartz more concentrated; finally, the electrode is evaporated on the surface of the quartz (the applicable electrode composition can be Ag, Cr/Ag/Cr or Cr/Ag), and the piezoelectric component can be prepared 5.

The piezoelectric component setting step 92 is to set the piezoelectric component 5 in the chamber 21 of the base 2, and to electrically connect to the first wiring pattern 3 through the first electrical adhesive 51. The respective first end portions 311, 321 of the first line 31 and the second line 32 are hardened. What needs to be added here is that before the blocking step 93, a crystal frequency adjustment step (not shown in the figure) is also implemented. The step of adjusting the frequency of the crystal is to use ion beam (Ionbeam) to perform dry etching on the electrode of the quartz, so as to fine-tune its frequency.

The sealing step 93 is to utilize a sealing ring (Sealring, not shown) disposed on the top edge of the main body 22 of the base 2 to seal the base with the cover plate 23 through seam sealing. 2 in the chamber 21 of the body 22, so that the piezoelectric assembly 5 is enclosed in the chamber 21. In this embodiment, the sealing ring and the cover plate 23 are illustrated by taking Fe—Co—Ni as an example, but the present invention is not limited thereto.

Following step 94, the electrical support block is separately disposed on the lower surface of the base 2 and electrically connected to the first circuit 41, the second circuit 42, the third circuit 43 and the second circuit 4 of the second wiring pattern 4. The welding pads 7 of the second ends 413, 423, 433, 443 of the four lines 44 are used to connect the electrical supporting block 8 to the lower surface of the base 2 so that it is electrically connected to the base 2. The external circuit board 200 has a predetermined height H, so that the space between the base 2 and the external circuit board 200 can accommodate the temperature sensing component 6 .

It should be noted here that although the electrical support block 8 is made of conductive material in principle, its shape is not limited. However, when the selected materials are different, the following methods will be different. In the embodiment of the manufacturing method of the present invention, the electrical support block 8 is illustrated by taking solder balls (Solderball) as an example, and the solder balls can use the solder ball grid array (BGA) Ball attachment process or screen printing solder paste technology is formed under the circular pad 7 through reflow soldering.

In addition, it should be further explained that, in order to control the predetermined height H more precisely, the appearance of the welding pad 7 needs to be circular so as to match the contour of the electrical supporting block 8 (solder ball). Therefore, in order to make the appearance of the welding pad 7 round, it is necessary to use the process method of through silicon via (via) to make the first line 41, the second line 42, and the third line of the second wiring pattern 4 43 and the extensions 412, 422, 432, 442 of the fourth line 44 respectively extend downwards to the second ends 413, 423, 433, 443 of the lower surface of the body 22 through the through holes (see FIG. 5 and FIG. 6). That is to say, the method of conducting the extension parts 412, 422, 432, 442 of the second wiring pattern 4 with the second end parts 413, 423, 433, 443 through the through holes is different from the existing via Compared with the conduction mode of the external wires, it can effectively avoid the tin being absorbed by the external wires during the process of planting the solder balls, which will cause the height of the solder balls to deviate, thereby affecting the predetermined height H.

The temperature sensing component mounting step 95 is to use surface mount technology (Surfacemountingtechnology, SMT), the temperature sensing component 6 is arranged on the lower surface of the base 2 and surrounded by the electrical support block 8, and through The second electrical adhesive 61 is electrically connected to the second end 313 of the first line 31 of the first wiring pattern 3 and the second end 323 and the third end 325 of the second line 32 , and Connected to each first end 411, 421, 431, 441 of the first line 41, the second line 42, the third line 43, and the fourth line 44 of the second wiring pattern 4, so as to sense the temperature The component 6 and the piezoelectric component 5 are electrically connected through the first wiring pattern 3 to form the oscillator with a temperature sensing component as shown in FIG. 3 .

The packaging test step 96 is to conduct an electrical characteristic test and an aging test on the oscillator to confirm that the oscillator can operate normally and meet the requirements of the application end.

The advantage of the method for making the oscillator with the temperature sensing component of the present invention is different from that of the oscillator 1 (refer to FIG. 1 again), the oscillator 1 needs to use The oscillator 1 can be electrically connected to the external circuit board by printing solder paste on the external circuit board by surface mount technology. However, according to the content recorded in the prior art of this case, it is known that due to different materials, the problem of solder rejection is likely to occur due to poor wettability. In contrast to this embodiment of the method for manufacturing an oscillator with a temperature sensing component of the present invention, since the electrical support block 8 (solder ball) directly replaces the lower surrounding wall 17 of the oscillator 1, on the one hand it can avoid It is different from the problem of solder rejection, and the oscillator with temperature sensing components of the present invention can be easily adhered to the external circuit board 200; on the other hand, the lower wall 17 can also be improved due to the use of multilayer alumina ceramic Or the high cost and height restrictions derived from expensive materials such as fiberglass.

To sum up, the oscillator with temperature sensing components and the manufacturing method thereof of the present invention replace the lower surrounding wall 17 of the general oscillator 1 by the electrical support block 8 arranged under the base 2, Not only can the problem of high cost be improved, but also when the oscillator of the present invention is bonded to the external circuit board 200, there is no problem of solder rejection due to material compatibility; in addition, by adjusting the solder pad 7 or the electrical support The size of the block 8 can obtain the desired predetermined height H, which can indeed achieve the purpose of the present invention.

Claims (10)

1. having an agitator for temperature sensing component, be electrically connected to a external circuit board, this has the agitator of temperature sensing component, comprises a pedestal, piezoelectric element, temperature sensing component, a multiple weld pad and multiple electrical bracer; It is characterized in that:

This pedestal has one and is formed with the body of a room, a cover plate closing this room, and is configured at first Wiring pattern of this body and second Wiring pattern;

This piezoelectric element, is arranged in the room of this pedestal and is electrically connected to this first Wiring pattern;

This temperature sensing component, is arranged at a lower surface of the body of this pedestal and is electrically connected to this first Wiring pattern and this second Wiring pattern, and through this first Wiring pattern with this piezoelectric element in electrically connecting;

Described weld pad, is arranged at the lower surface of the body of this pedestal and is electrically connected in this second Wiring pattern;

Described electrical bracer, the lower surface of the body of this pedestal it is engaged in respectively and around this temperature sensing component through described weld pad, and in order to be electrically connected to the circuit of this external circuit board, described weld pad and described electrical bracer have a predetermined altitude, and this predetermined altitude is enough to the space making to form this temperature sensing component accommodating between this pedestal and this external circuit board.

2. there is the agitator of temperature sensing component as claimed in claim 1, it is characterised in that: this temperature sensing component compensates this piezoelectric element because of frequency drift produced by temperature contrast in order to the integrated circuit detecting the operating ambient temperature of this piezoelectric element the integrated circuit compensated through external temperature or own temperature compensates.

3. there is the agitator of temperature sensing component as claimed in claim 1, it is characterized in that: this first Wiring pattern has a first line and second circuit, the first line of this first Wiring pattern has a first end extended from the upper surface of this body, an extension extended in the inner transverse of this body from its first end towards its lower surface, and portion of extending from extends downward the second end of lower surface of this body; Second circuit of this first Wiring pattern have a first end extended towards its lower surface from the upper surface of this body, first extension extended in the inner transverse of this body from its first end, one extend downward the second end of lower surface of this body, second extension extended from its first extension and the 3rd end of a lower surface extending downward this body from its second extension in the inner transverse of this body from its first extension; This second Wiring pattern has a first line, the second circuit, a tertiary circuit, and the 4th circuit, the first line of this second Wiring pattern, the second circuit, tertiary circuit, and the 4th circuit be respectively provided with a first end extended towards upper surface from the lower surface of this body, one from its first end in the inside of this body the extension towards the periphery horizontal expansion of this body, and portion of extending from extends downward the second end of lower surface of this body; This piezoelectric element is connected to the first line of this first Wiring pattern and each first end of the second circuit, this temperature sensing component is connected to the second end of the first line of this first Wiring pattern and the second end of the second circuit thereof and the 3rd end, and it is connected to the first line of this second Wiring pattern, the second circuit, tertiary circuit and each first end of the 4th circuit; Described weld pad connects the first line of this second Wiring pattern, the second circuit, tertiary circuit and each the second end of the 4th circuit respectively.

4. there is the agitator of temperature sensing component as claimed in claim 1, it is characterised in that: described weld pad is rounded, and the diameter of this predetermined altitude and described weld pad is inversely proportional to.

5. there is the agitator of temperature sensing component as claimed in claim 1, it is characterised in that: described electrical bracer is made up of the material with electric conductivity.

6. there is a manufacture method for the agitator of temperature sensing component, comprise a material preparation process, piezoelectric element setting steps, sealing step, an electrical bracer then step, and a temperature sensing component carries step; It is characterized in that:

This material preparation process, it is prepare pedestal, piezoelectric element, a temperature sensing component, and multiple electrical bracer, this pedestal has one and is formed with the body of a room, a cover plate, and first Wiring pattern being configured at this body being electrically insulated from each other and second Wiring pattern;

This piezoelectric element setting steps, is be arranged in the room of this pedestal by this piezoelectric element, and is electrically connected to this first Wiring pattern;

This sealing step, utilizes the room of the body of this this pedestal of cover closure, to be closed in this room by this piezoelectric element;

This is bracer then step electrically, is through the lower surface being arranged at this pedestal and is electrically connected to multiple weld pads of this second Wiring pattern, with by multiple electrical bracers then in the lower surface of this pedestal;

This temperature sensing component carries step, it is this temperature sensing component is arranged at the lower surface of this pedestal and surrounded by described electrical bracer, and it is electrically connected to this first Wiring pattern and this second Wiring pattern, it is electrically connect to make this temperature sensing component pass through this first Wiring pattern with this piezoelectric element, thus constituting an agitator with temperature sensing component;

The predetermined altitude that described weld pad and described electrical bracer are formed is enough to make this agitator when being electrically connected to a external circuit board, makes to be formed between this pedestal and this external circuit board the space of this temperature sensing component accommodating.

7. there is the manufacture method of the agitator of temperature sensing component as claimed in claim 6, it is characterized in that: also comprise a packaging and testing step, this packaging and testing step is that this agitator carries out an electrical characteristics detection and a burn-in test, to confirm this agitator energy normal operation and to meet the demand of application end.

8. there is the manufacture method of the agitator of temperature sensing component as claimed in claim 6, it is characterized in that: in this material preparation process, first Wiring pattern of this pedestal has a first line and second circuit, the first line of this first Wiring pattern has a first end extended from a upper surface of this body, an extension extended in the inner transverse of this body from its first end towards its lower surface, and portion of extending from extends downward the second end of lower surface of this body; Second circuit of this first Wiring pattern have a first end extended towards its lower surface from the upper surface of this body, first extension extended in the inner transverse of this body from its first end, one extend downward the second end of lower surface of this body, second extension extended from its first extension and the 3rd end of a lower surface extending downward this body from its second extension in the inner transverse of this body from its first extension; This second Wiring pattern has a first line, the second circuit, a tertiary circuit, and the 4th circuit, the first line of this second Wiring pattern, the second circuit, tertiary circuit, and the 4th circuit be respectively provided with a first end extended towards upper surface from the lower surface of this body, one from its first end in the inside of this body the extension towards the periphery horizontal expansion of this body, and portion of extending from extends downward the second end of lower surface of this body; Carry in step at this piezoelectric element setting steps, electrically a bracer then step and temperature sensing component, this piezoelectric element is connected to the first line of this first Wiring pattern and each first end of the second circuit, this temperature sensing component is connected to the second end of the first line of this first Wiring pattern and the second end of the second circuit thereof and the 3rd end, and it is connected to the first line of this second Wiring pattern, the second circuit, tertiary circuit and each first end of the 4th circuit; Described electrical bracer connects the first line of this second Wiring pattern, the second circuit, tertiary circuit and each the second end of the 4th circuit respectively through described weld pad.

9. there is the manufacture method of the agitator of temperature sensing component as claimed in claim 6, it is characterised in that: in this electrically a bracer then step, described weld pad is rounded, and the diameter of this predetermined altitude and described weld pad is inversely proportional to.

10. there is the manufacture method of the agitator of temperature sensing component as claimed in claim 6, it is characterised in that: in this electrically a bracer then step, described electrical bracer is made up of the material with electric conductivity.