CN105632997B - The safe pick-up method and system of silicon chip in silicon wafer carrying device - Google Patents
The safe pick-up method and system of silicon chip in silicon wafer carrying device Download PDFInfo
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- CN105632997B CN105632997B CN201511023511.6A CN201511023511A CN105632997B CN 105632997 B CN105632997 B CN 105632997B CN 201511023511 A CN201511023511 A CN 201511023511A CN 105632997 B CN105632997 B CN 105632997B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a kind of safe pick-up method of silicon chip in silicon wafer carrying device and systems, movement locus and the position of manipulator are set by training data, the distance between piece fork and silicon chip measured value is detected using the sensor group on mechanical handsheet fork, the section line equation for the piece fork place plane for judging silicon chip place plane and manipulator is calculated according to distance measure and calculates the inclination angle that silicon chip is pitched relative to piece accordingly, to judge whether silicon chip will produce sliding, it is ensured that silicon chip can just take piece in the case of not generating sliding.Therefore, the present invention realizes pose during taking piece to silicon chip and has carried out real-time judge, causes silicon chip impaired to avoid mechanical handsheet fork from touching silicon chip, improves the safety for taking piece process.
Description
Technical field
The present invention relates to semiconductor processing equipment technical fields, and in particular to a kind of silicon wafer carrying device of semiconductor equipment
The safe pick-up method and silicon chip distribution identifying system of middle silicon chip.
Background technology
The secure access of silicon chip and transport are integrated circuit one very important technical indicators of big production line；It was producing
Silicon chip fragment rate should be less than ten a ten thousandths caused by usually requiring that transporting equipment itself in journey.As batch type wafer heat
System, relative to one chip process system, chip transmission, silicon chip needed for each production technology place and take piece number more,
Thus chip transmission, silicon chip are placed and are taken the safety and reliability requirement higher of piece.
Currently, manipulator is widely used in semiconductor integrated circuit manufacturing technology field, manipulator is chip transmission
Important equipment in system, for accessing and, with the silicon chip after process, instruction can be received, essence before transportation technology processing
The certain point really navigated on three-dimensional or two-dimensional space carries out picking and placeing silicon chip, both can carry out picking and placeing operation to single piece of silicon chip,
More pieces of silicon chips can be carried out picking and placeing operation.
Currently, the silicon chip of batch type wafer heat system passes the side for taking the location parameter of link generally to use off-line teaching
Formula is obtained and stored in controller, while being detected and being calibrated by the period.Manipulator is according to the number of the off-line teaching of storage
Loading or unloading operation is carried out according to the silicon chip placed on load carrier.When manipulator to silicon chip when carrying out picking and placeing operation, silicon chip carries
Mechanism is due to the influence of the factors such as variation of ambient temperature, load variation and mechanical structure deformation, and manipulator is by offline storage
When position coordinates pick and place the silicon chip on load carrier, exists and generate the risk that collision causes silicon chip or equipment to be damaged, causing can not
The loss made up.Simultaneously as silicon chip generate during heat treatment temperature distortion situations such as can also make the reality point of silicon chip
Cloth state is different with off-line teaching location parameter so that and the movement that manipulator picks and places silicon chip is in non-secure states,
Referring to Fig. 1, Fig. 1 is that manipulator is placed and positional structure when taking piece in chip transmission, silicon chip in the prior art
Schematic diagram.As shown, when silicon chip 2 is in the abnormalities such as inclination in support member 3, manipulator 1 is in automatic access silicon
The movement of piece 2 is in non-security working condition, is very easy to the damage for causing silicon chip 2 and equipment (including manipulator 1).
Therefore, it is completed after silicon chip is placed or before preparing to take piece in manipulator 1, it need to be to the silicon in silicon chip group in support member 3
2 distribution of piece carries out accurate pose identification, while the various abnormalities to identifying provide accurate counter-measure, with reality
Now safety picks and places piece.
Invention content
In order to overcome problem above, the present invention is directed to by pitching upper bottom relative to mechanical handsheet on silicon wafer carrying device
The identification of the distribution security state pose for the silicon chip set carries out chip transmission, and provides a kind of silicon chip distribution identification system
System diagnoses relative level degree distribution results, it is ensured that silicon to fast and accurately measure state of the silicon chip in silicon wafer carrying device
The safety pickup of piece.
In order to achieve the above object, the present invention provides a kind of safety of silicon chip in semiconductor equipment silicon wafer carrying device to pick up
Take method, the semiconductor equipment includes the silicon wafer carrying device for placing multiple silicon chips and for picking up and transporting silicon
There is support member, the silicon wafer horizontal to be positioned in support member for the manipulator of piece, the silicon wafer carrying device, multiple described
Silicon chip arranges in the vertical direction, and the manipulator is pitched with piece, and described fork upper and lower surface is fixed with not in same straight line
On three or more sensor groups, the sensor group is for defining one or more reference planes；The recognition methods packet
It includes and takes piece process and film releasing process；It is described to take the piece process to include：
Step S01：Setting takes piece theory training data, execution to take piece operational order；
Step S02：The robot movement prefetches the manipulator on piece home and does not stretch also to piece home is prefetched
Enter silicon wafer carrying device region；
Step S03：Pre- below the silicon chip placement region to be taken into silicon wafer carrying device of the manipulator takes piece upwards
Position moves, in this motion process, each sensor and the silicon chip to be taken in the periodically continued acquisition sensor group
The distance of bottom and the measured value at a distance from adjacent silicon chip below the silicon chip to be taken, and institute is judged according to the measured value
That states whether manipulator can be below safe operation to the silicon chip placement region to be taken pre- takes piece position upwards；It is described pre- upward
It takes the manipulator on piece position to can not touch the support member of the silicon chip bottom to be taken and the bottom and can not touch described
Adjacent silicon piece upper surface below silicon chip to be taken；If so, thening follow the steps S05；If it is not, then executing step S04；
Step S04：Manipulator is out of service, and alarm latency is handled；
Step S05：The manipulator run to it is described wait take below silicon chip placement region it is pre- upwards take piece position after, root
According to each measured value of the sensor at a distance from the silicon chip to be taken in the newest sensor group, silicon chip to be taken described in calculating
The inclination angle of place plane and plane where the piece fork of the manipulator；
Step S06：Judge to touch described when taking silicon chip, the silicon chip to be taken in described fork-join according to the inclination angle
Whether sliding will produce；If so, thening follow the steps S07；If it is not, then executing step S08；
Step S07：Manipulator is out of service, and alarm latency is handled；
Step S08：According to each sensor in the newest sensor group at a distance from the silicon chip to be taken
Measured value, the maximum distance and minimum range of silicon chip to be taken described in calculating and plane where the piece fork of the manipulator；
Step S09：Piece theory training data is taken to judge in conjunction with described according to the maximum distance and the minimum range
Whether the piece fork of the manipulator can take safely piece；If so, thening follow the steps S11；If it is not, then executing step S10；
Wherein, it is described take piece theory training data include the thickness of silicon chip, adjacent silicon chip spacing, described pre- take on piece position upwards
The piece of manipulator pitches bottom and takes the piece of the manipulator on piece position to pitch to the distance of the lower side silicon wafer upper surface of described fork, pre- exit
The distance of adjacent support member above top to the silicon chip to be taken and described pre- piece position is taken to take to exiting in advance upwards
The distance between piece position；
Step S10：Manipulator is out of service, alarms and waits pending；
Step S11：The piece fork of the manipulator contacts according to the training data and picks up the silicon chip to be taken, then
Pre- exit that the manipulator rises to above the silicon chip to be taken takes piece position；
Step S12：The manipulator takes piece position machine to exit the silicon wafer carrying device region outward by pre- exit
To exiting home, and judges whether the whole silicon chip in the silicon wafer carrying device picks up and finish；If it is,
Execute step S13；If it is not, then executing step S02；
Step S13：Stop taking the operation of piece process；
Preferably, the pre- safety margins for taking the distance of adjacent silicon chip below the piece position bottoms Shang Piancha to silicon chip to be taken upwards
Value is that lower safety takes piece allowance, when wait take the adjacent lower side silicon wafer of silicon chip in it is horizontal positioned when, and pre- piece position upper piece is taken to pitch upwards
To when taking the distance of adjacent silicon chip below silicon chip to take piece allowance more than lower safety, the manipulator in this step S03 includes for bottom
Piece pitches the silicon chip that will not touch the adjacent lower section of silicon chip to be taken.
Preferably, in the step S03, the minimum of the silicon chip bottom to be taken and plane where the piece fork of the manipulator
It waits taking described in the thickness-pre- piece fork bottom for taking piece position upwards of spacing-silicon chip of distance limit=adjacent silicon chip
The location variation that the distance of adjacent silicon chip-equipment allows below silicon chip, the step 03 specifically include：The manipulator is to silicon
Below silicon chip placement region to be taken in piece bogey it is pre- upwards take piece position move, in this motion process, periodically
Each sensor is to the distance of the silicon chip bottom to be taken and to below the silicon chip to be taken in sensor group described in continuous acquisition
The measured value of the distance of adjacent silicon chip, and the minimum value of these measured values is sought, by the minimum value and the minimum range pole
Limit value compares, and when the minimum value is less than the minimum range limiting value, executes the step S04；Otherwise the step is executed
Rapid S05.
Preferably, the step S05 is specifically included：
Step S051：The manipulator run to it is described wait take below silicon chip placement region it is pre- upwards take piece position after,
Obtain each measured value of the sensor at a distance from the silicon chip to be taken in the newest sensor group；
Step S052：It is to take the XOY plane of piece process with plane where the piece fork of the manipulator, sets theoretical silicon chip
Excircle distribution equation is cylindrical surface equation, calculates the cylindrical surface equation, is waited for according to described in the newest measured value calculating
Take the plane equation of silicon chip lower surface；
Step S053：The section line side of the plane equation and the cylindrical surface equation of silicon chip lower surface to be taken described in calculating
Journey；
Step S054：Described during piece is taken to pitch place with described according to the section line equation calculation section line
The angle of XOY plane, i.e., the described inclination angle for taking piece to be located at the silicon chip to be taken in the process；
The step S06 is specifically included：Setting silicon chip not will produce the theory α coefficient inclination angle threshold value of sliding, incline described
Oblique angle is compared with theory α coefficient inclination angle threshold value；When the inclination angle is less than or equal to the theory α coefficient inclination angle
When threshold value, the step S08 is executed；Otherwise, the step S07 is executed.
Preferably, theory α coefficient inclination angle threshold value is equal to the arctan function value of the friction coefficient of silicon chip.
Preferably, the step S08 is specifically included：Go out the function about distance using the section line equation calculation, and
In conjunction with the cylindrical surface equation as restrictive condition, the maximum distance and the minimum range are acquired using the differential method.
Preferably, the step S09 is specifically included：Bottom is pitched according to the pre- piece for taking the manipulator on piece position upwards
The piece fork top of the manipulator on piece position is taken to be waited for described in the distance of the lower side silicon wafer upper surface of described fork and pre- exit
Take silicon chip to be taken described in the distance calculating of the adjacent support member above silicon chip and plane where the piece fork of the manipulator
Maximum distance limiting value and minimum range limiting value；The maximum distance limiting value is equal to described pre- takes piece position to moving back in advance upwards
Go out to take the distance between piece position, for judging that manipulator pre- takes silicon chip to be taken described in piece position to contact upwards from described
Whether rise can touch the silicon chip to be taken, the thickness of spacing-silicon chip of the minimum range limiting value=adjacent silicon chip in the process
Degree-pre- the location variation for taking distance-equipment of adjacent silicon chip below piece position to the silicon chip to be taken to allow upwards, is used
In judge manipulator from it is described prefetch piece home to it is described it is pre- upwards take piece position motion process in whether touch institute
State silicon chip adjacent below silicon chip to be taken and the silicon chip to be taken；When the minimum range be more than the minimum range limiting value,
And the maximum distance be less than the maximum distance limiting value when, then execute the step S11；Otherwise, the step is executed
S10。
Preferably, in the step S11, manipulator rise to it is pre- exit take piece position after, stop motion is treated and takes silicon chip
Whether it is detected on piece fork；If so, thening follow the steps S12；If it is not, then manipulator stop motion, and alarm
Etc. pending.
Preferably, the silicon wafer carrying device includes that the internal film magazine for being mounted with silicon chip and loading silicon chip enter reaction chamber
Silicon chip supporting mechanism；The semiconductor equipment also has the film magazine supporting mechanism for carrying the film magazine.
To achieve the goals above, the present invention also provides a kind of according in above-mentioned semiconductor equipment silicon wafer carrying device
Silicon chip distribution identifying system in the semiconductor equipment silicon wafer carrying device of the safe pick-up method of silicon chip, including：
Sensor group is set to the upper and lower surface of the piece fork of the manipulator, waits taking described in for detecting described fork
Distance measure and described the fork silicon to be taken described in of silicon chip bottom or the silicon chip bottom being positioned in the support member
The distance measure of adjacent silicon piece below piece；
Whether judgment means can touch silicon chip for judging the manipulator in taking piece or film releasing motion process, with
And silicon chip is judged whether on the piece fork of the manipulator, and send signal to warning device；
Control device, controlled according to the judging result of the judgment means manipulator whether stop motion；And
Piece operational order is taken for controlling the manipulator execution, theoretical training data is set；
Warning device receives the signal that the judgment means are sent out, then sends out alarm.
The safe pick-up method of silicon chip and silicon chip distribution are known in the silicon wafer carrying device of the semiconductor equipment of the present invention
Movement locus and the position of manipulator are arranged by training data for other system, are visited using the sensor group on mechanical handsheet fork
The distance between piece fork and silicon chip measured value is surveyed, the piece for judging silicon chip place plane and manipulator is calculated according to distance measure
The section line equation of plane where fork simultaneously calculates the inclination angle that silicon chip is pitched relative to piece accordingly, to judge whether silicon chip can produce
Raw sliding, it is ensured that silicon chip can just take piece in the case of not generating sliding.Therefore, the present invention realizes during taking piece to silicon chip
Pose judged, cause silicon chip impaired to avoid mechanical handsheet fork from touching silicon chip, improve the peace for taking piece process
Quan Xing.
Description of the drawings
Fig. 1 is that manipulator is placed and position view when taking piece in chip transmission, silicon chip in the prior art；
Fig. 2 is the structural schematic diagram of the silicon wafer carrying device of the semiconductor equipment of the preferred embodiment of the present invention；
Fig. 3 is the chip transmission of the preferred embodiment of the present invention, take manipulator during piece or film releasing piece fork and
The relative position relation perspective diagram of silicon chip；
Fig. 4 is sensor group, the relative position of manipulator, silicon chip and support member of the preferred embodiment of the present invention
Relationship schematic top plan view；
Fig. 5 is the position relationship and take sheet path that silicon chip, support member and the piece of the preferred embodiment of the present invention are pitched
Line schematic diagram；
Fig. 6 is the flow diagram of the safe pick-up method of the silicon chip of the preferred embodiment of the present invention；
Fig. 7 a are plane, inclined silicon chip and silicon chip excircle point where the piece fork of the preferred embodiment of the present invention
The relative position relation schematic diagram on cloth cylindrical surface；
Fig. 7 b are plane, inclined silicon chip and silicon chip excircle point where the piece fork of the preferred embodiment of the present invention
The cross section structure schematic diagram of the relative position relation on cloth cylindrical surface；
Fig. 8 is the inclination silicon chip stress diagram of the preferred embodiment of the present invention.
Specific implementation mode
To keep present disclosure more clear and easy to understand, below in conjunction with Figure of description, present disclosure is made into one
Walk explanation.Certainly the invention is not limited to the specific embodiment, the general replacement known to those skilled in the art
Cover within the scope of the present invention.
The semiconductor equipment of the present invention includes silicon wafer carrying device for placing multiple silicon chips and for picking up and transporting
There is support member, silicon wafer horizontal to be positioned in support member for the manipulator of silicon chip, silicon wafer carrying device, and multiple silicon chips are vertical
It is arranged on direction；As shown in Fig. 2, the silicon wafer carrying device in the semiconductor equipment of the preferred embodiment of the present invention, including：
The film magazine B of silicon chip is mounted with for inside and load the silicon chip supporting mechanism A that silicon chip enters reaction chamber C in black line frame；Semiconductor
Also there is equipment the film magazine supporting mechanism F of carrying film magazine B, film magazine supporting mechanism F to be connected on pedestal G；Manipulator E is used for from piece
Silicon chip is picked up in box B and is positioned on silicon chip supporting mechanism A, when the fire door D of the bottoms reaction chamber C is opened, silicon chip support
Mechanism A carries silicon chip and enters in reaction chamber C, or ought after reaction, and the fire door D of the bottoms reaction chamber C is opened, silicon chip
Supporting mechanism A carries that treated, and silicon chip is exited from the bottoms reaction chamber C, and manipulator E picks up silicon from silicon chip supporting mechanism A
It piece and is positioned in film magazine B；Arrow in Fig. 2 indicates the movable direction of all parts.Therefore, of the invention to take piece process
It can be, but not limited to include the process for picking up silicon chip from film magazine, can also include the mistake for picking up silicon chip from silicon chip supporting mechanism
Journey；Similarly, film releasing process of the invention can be, but not limited to include that silicon chip is positioned in film magazine, can also include putting silicon chip
It is placed on silicon chip supporting mechanism.
In the present invention, manipulator with piece pitch, piece fork upper and lower surface be fixed with three be not arranged on the same straight line or with
On sensor group, sensor group is for defining one or more reference planes；Three sensors of piece fork upper surface are for defining
Upper reference plane, for three sensors of piece fork lower surface for defining lower reference plane, upper reference plane and lower reference plane can be same
Plane may be tool plane at regular intervals；In semiconductor applications, manipulator generally has single gripper or more
Gripper, to adapt to the needs of mass production.In some the embodiment of the present invention, manipulator can have more machineries
Pawl, in three or more sensors of the upper and lower surface of piece fork of any one or more grippers, the following examples
Only by taking a piece of manipulator fork upper and lower surface is respectively provided with three sensors as an example, other embodiment principles
Identical, details are not described herein.
Below in conjunction with attached drawing 3-8 and specific embodiment to the peace of silicon chip in the semiconductor equipment silicon wafer carrying device of the present invention
Full pick-up method and silicon chip distribution identifying system are described in further detail.It should be noted that attached drawing be all made of it is very simple
The form of change, using non-accurate ratio, and only to it is convenient, clearly achieve the purpose that aid in illustrating the present embodiment.
Silicon chip distribution identifying system includes in the semiconductor equipment silicon wafer carrying device of the present embodiment：It is set to machinery
Sensor group, judgment means, control device and warning device on handsheet fork.
It please refers to Fig. 3 and Fig. 4, in the present embodiment, carries silicon chip W in support member 101, support member 101 is uniformly point
It is distributed in the edge of the silicon chip W of half, the piece fork 101 of manipulator 100 is symmetrical V-type, and manipulator 100 also has hold assembly；Piece
The symmetry axis of fork 101 is overlapped with the diameter of silicon chip W, and the width between two sloped sidewall outermosts of piece fork 101 is less than silicon chip W
Diameter；
The sensor group (black filled circles) of the present embodiment is set to the upper and lower surface of the piece fork 101 of manipulator 100, is used for
Detection lug pitch adjacent silicon chip below the distance measure and piece fork 101 a to silicon chip of 101 to one silicon chip bottom away from
From measured value；Sensor S1, S2, S3 there are three being arranged in the upper surface of piece fork 101, two of which sensor S1 and S2 distinguish position
In V-type piece fork 101 symmetrical two skew walls on and corresponding to be placed in piece fork 101 on silicon chip W diametrically, remaining one
Sensor S3 is located on the position intersected on the inside of symmetrical two skew walls of V-type piece fork 101, is established in 101 place plane of piece fork
Origin, is set as XOY reference planes, the midpoint of the line of sensor S1, S2 with the line of sensor S3 it is vertical and divide sensing equally
The line of device S1, S2；Therefore, V-type piece is pitched into the line of two sensors S1, S2 on skew wall and is set as X-axis, by sensor S1,
The midpoint of the line of S2 is set as Y-axis with the line of sensor S3, and the midpoint of the line of sensor S1, S2 is coordinate origin O, with this
XOY plane where constituting piece fork, what needs to be explained here is that, in the relative position relation for being related to sensor, sensor is regarded
For a point.In the present embodiment, the measured value that is fed back of sensor S1, S2, S3 of 101 upper surfaces is pitched with piece to judge silicon chip W
Pose and take whether piece process can take safely piece, for calculate cylindrical surface equation, section line equation, plane where silicon chip with
The minimum range and maximum distance of plane where the angle, section line and piece fork of plane where piece fork；In the present embodiment, sensor
It is realized by optical signal detection distance.
The judgment means of the present embodiment, for judging that manipulator includes that piece fork whether can in taking piece or film releasing motion process
Silicon chip is touched, and judges silicon chip whether on the piece fork of the manipulator, when silicon chip may be touched to warning device
Send signal；
Control device, according to the judging result of judgment means come control machinery hand whether stop motion；And for controlling
Manipulator execution takes piece operational order, and theoretical training data is arranged；Before taking piece or film releasing, teaching first is inputted to control device
Data, then control device take piece operational order according to these training data control machinery hands to execute；When judgment means judge
When manipulator may touch silicon chip, control device makes manipulator stop motion；Referring to Fig. 5, one for the present invention is preferable
The position relationship and take piece route schematic diagram that silicon chip, support member and the piece of embodiment are pitched；Silicon chip W is located at support member 102
On, thick dashed line with the arrow indicates that the route for taking piece process or film releasing process of the present embodiment, fine dotted line frame indicate in movement
The positions silicon chip W ', P1 are to prefetch piece home, and the positions P2 are that pre- to take piece position, P3 upwards be the piece of manipulator during taking piece
Fork-join contacts the position of silicon chip, and P4 is pre- to exit that take piece position or pre- downward film releasing position, P5 be manipulator during taking piece
The position of wafer is clamped in hold assembly, and P6 is to exit home after taking piece.The each ginseng of theoretical training data is shown in Fig. 5
Number, including the distance s of the thickness d of silicon chip W, support member thickness t, adjacent silicon chip W, the pre- manipulator taken upwards on the P2 of piece position
Piece pitch bottom to piece pitches the distance s2 of lower side silicon wafer upper surface, pre- exit at the top of the silicon chip for taking the piece on the P4 of piece position to pitch is arrived
The distance s1 of the adjacent support member bottom in piece fork top and pre- take piece position P2 between exiting in advance and take piece position P4 upwards
Distance s3.
Warning device receives the signal that judgment means are sent out, then sends out alarm.
Referring to Fig. 6, the safe pick-up method of silicon chip includes in the semiconductor equipment silicon wafer carrying device of the present embodiment：
Step S01：Setting takes piece theory training data, execution to take piece operational order；
Specifically, piece theory training data is taken by being inputted into control device, to which control machinery hand execution takes piece to grasp
It instructs；It includes the thickness of silicon chip, the spacing of adjacent silicon chip, the pre- manipulator taken upwards on piece position to take piece theory training data
Piece pitch bottom and pitch the distance of lower side silicon wafer upper surface to piece, pre- exit at the top of the silicon chip for taking the piece on piece position to pitch to waiting taking
The distance of adjacent support member above silicon chip and pre- take piece position to exiting in advance and take the distance between piece position upwards；
Step S02：For robot movement to piece home is prefetched, the manipulator prefetched on piece home does not extend into silicon also
Piece bogey region；
Specifically, prefetching piece home in the side of silicon wafer carrying device, manipulator in this position can not touch silicon
Silicon chip in piece bogey；Preferably, prefetching distance s between adjacent silicon chip of the piece position more than 2 times.
Step S03：Pre- below the silicon chip placement region to be taken into silicon wafer carrying device of manipulator takes piece position upwards
Movement, in this motion process, in periodically continued acquisition sensor group each sensor at a distance from silicon chip bottom to be taken and
Measured value below silicon chip to be taken at a distance from adjacent silicon chip, and judge whether manipulator being capable of safe operation according to measured value
Pre- below to silicon chip placement region to be taken takes piece position upwards；It is pre- to take the manipulator on piece position to can not touch silicon to be taken upwards
The support member of piece bottom and the bottom and it can not touch adjacent silicon piece upper surface below silicon chip to be taken；If it is, executing
Step S05；Otherwise, step S04 is executed；
Specifically, the pre- safety margins for taking the distance of adjacent silicon chip below the piece position bottoms Shang Piancha to silicon chip to be taken upwards
Value is that lower safety takes piece allowance, when wait take the adjacent lower side silicon wafer of silicon chip in it is horizontal positioned when, and pre- piece position upper piece is taken to pitch upwards
To when taking the distance of adjacent silicon chip below silicon chip to take piece allowance more than lower safety, the manipulator in this step S03 includes for bottom
Piece pitches the silicon chip that will not touch the adjacent lower section of silicon chip to be taken.The minimum of plane where the piece of silicon chip bottom to be taken and manipulator fork
Distance limit Zmin-limitThe thickness d-of distance s-silicon chip of=adjacent silicon chip is pre- to take the piece of piece position to pitch bottom to waiting taking upwards
The location variation γ that the distance s2- equipment of adjacent silicon chip allows below silicon chip.
This step S03 is specifically included：Manipulator below the silicon chip placement region to be taken into silicon wafer carrying device it is pre- to
On take piece position to move, in this motion process, each sensor is to silicon chip bottom to be taken in periodically continued acquisition sensor group
The distance in portion and measured value to the distance of adjacent silicon chip below silicon chip to be taken, three sensors of mechanical handsheet fork upper surface
Distance measure is Z1, Z2 and Z3, and seeks the minimum value Z of these measured valuesmin-distance, by judgment means by this most
Small value Zmin-distanceWith minimum range limiting value Zmin-limit、Zmin-limitIt compares：
As minimum value Zmin-distanceLess than minimum range limiting value Zmin-limitWhen, execute step S04；
Otherwise, as minimum value Zmin-distanceMore than or equal to minimum spacing limiting value Zmin-limitWhen, execute step S05；
What needs to be explained here is that when three range detection sensors, the detection of three sensors to silicon chip bottom emits
Line is parallel, so as to detect the distance of corresponding position on silicon chip；
Step S04：Manipulator is out of service, and alarm latency is handled；
Specifically, control device control machinery hand is out of service etc. pending, judgment means send signal to warning device,
Warning device sends out alarm after receiving the signal that judgment means are sent；
Step S05：Manipulator run to wait take below silicon chip placement region it is pre- upwards take piece position after, according to newest
Each measured value of the sensor at a distance from silicon chip to be taken in sensor group, the piece of plane and manipulator where calculating silicon chip to be taken
The inclination angle of plane where fork；
Specifically, step S05 is specifically included：
Step S051：Manipulator run to wait take below silicon chip placement region it is pre- upwards take piece position after, obtain it is newest
Sensor group in each measured value of the sensor at a distance from silicon chip to be taken；
Specifically, sensor in manipulator operational process in sensor group can continuous probe at certain intervals, when
Manipulator run to wait take below silicon chip placement region it is pre- upwards take piece position after, should according to the measured value of newest detection come
Carry out subsequent calculating.
Step S052：It is to take the XOY plane of piece process with plane where the piece fork of manipulator, sets the outer circle of theoretical silicon chip
All distribution equations are cylindrical surface equation, calculate cylindrical surface equation, and the flat of silicon chip lower surface to be taken is calculated according to newest measured value
Face equation；
Specifically, using the positions P2 as basic point, the O point corresponding positions on piece fork are that theoretical silicon chip places center, i.e. silicon
Piece be placed on XOY plane along Z-direction up and down in the cylindrical surface of a diameter of circumference of silicon chip, to set silicon chip radius as R,
A diameter of 2R, sets silicon chip circumference and position deviation as σ, i.e., it is center of circle R+ σ as in the circumference of radius that silicon chip, which is distributed in using O points,；
Cylindrical surface equation is X2+Y2=R.
Step S053：Calculate the plane equation of silicon chip lower surface to be taken and the section line equation of cylindrical surface equation；
Specifically, please referring to the piece fork place plane for the preferred embodiment that Fig. 7 a and Fig. 7 b, Fig. 7 a are the present invention, inclining
The relative position relation schematic diagram of oblique silicon chip and silicon chip excircle distribution cylinder, Fig. 7 b are that one of the present invention is preferably real
The cross section structure of the relative position relation of plane, inclined silicon chip and silicon chip excircle distribution cylinder where applying the piece fork of example
Schematic diagram；The cylinder that cylinder 201 is constituted for silicon chip peripheral circumferential, plane where piece fork are 202, when silicon chip W to be taken is in incline
When ramp-like state, the intersecting surface that silicon chip W to be taken is generated in cylinder 201 is inclined, as shown in Figure 7b, plane where piece fork
202 as reference plane in horizontal positioned, the angle that acquires section line and plane 202 where piece fork be exactly silicon chip W to be taken relative to
The inclination angle of horizontal plane.
The distance measure that three sensors of piece fork upper surface obtain is respectively z1, z2 and z3, with defined XOY
Plane is it is found that silicon chip corresponds respectively to the coordinate in 3 points of the space being not arranged on the same straight line of three sensors in the plane
Value is respectively (x1, y1, z1), (x2, y2, z2) and (x3, y3, z3)；Silicon chip lower surface to be taken is calculated according to these coordinate values
Plane equation, aX+bY+cZ+d=0；
Wherein, a, b, c and d calculating formula are as follows：
A=y1z2-y1z3-y2z1+y2z3+y3z1-y3z2
B=-x1z2+x1z3+x2z1-x2z3-x3z1+x3z2
C=x1y2-x1y3-x2y1+x2y3+x3y1-x3y2,
D=-x1y2z3+x1y3z2+x2y1z3-x2y3z1-x3y1z2+x3y2z1.
Then, the section line equation for calculating the plane equation and cylindrical surface equation, establishing set of equations is：
AX+bY+cZ+d=0
X2+Y2=R
It can be obtained by two above equation：AX+BY+CZ+D=0, the equation are section line equation.
Step S054：According to section line equation calculation section line and the angle of XOY plane where taking piece fork during piece,
Piece is taken to be located at the inclination angle of silicon chip to be taken in the process；
Specifically, being according to plane equation composition equation group where the plane equation of silicon chip lower surface to be taken and piece fork：
AX+BY+CZ+D=0
Z=0
Their normal vector is respectively { A, B, C } and { 0,0,1 }, if the angle of the two normal vectors is α, then this
The angle of two planes is exactly α, then,
Cos α=C/ [√ (A2+B2+C2)]
α=arc cos (C/ [√ (A2+B2+C2)]).
Step S06：Judge to touch when taking silicon chip in piece fork-join according to inclination angle, whether silicon chip to be taken will produce sliding；
If so, thening follow the steps S07；If it is not, then executing step S08；
Locating slot or the fork generation sliding of silicon chip opposite panel are skidded off specifically, sliding herein includes silicon chip, please refers to figure
8, for the inclination silicon chip stress diagram of the preferred embodiment of the present invention, wherein α is that silicon chip and horizontal plane incline in practice
Oblique angle, silicon chip by downward gravity mg, support member to silicon chip reaction force N, in addition, setting the coefficient of sliding friction of silicon chip
For μ, it is slightly larger than force of sliding friction by maximum static friction force, is approximately force of sliding friction here, rubs so the maximum of silicon chip is quiet
Wiping power is μm gcos α, and when the resultant force of gravity and frictional force is zero, when just silicon chip being made not move downward, corresponding silicon chip inclines
Oblique angle is the theory α coefficient inclination angle threshold value δ of silicon chip；
The theory α coefficient inclination angle threshold value that silicon chip not will produce sliding is set according to silicon chip stressing conditions：
μ=0 mgsin (δ)-mg cos (δ), to obtain δ=arc tan (μ).
The inclined angle alpha of the silicon chip to be taken acquired is compared with theory α coefficient inclination angle threshold value；Be less than when inclination angle or
When equal to theory α coefficient inclination angle threshold value, step S08 is executed；Otherwise, step S07 is executed；Specially：
When judgment means judge α≤δ, illustrating to touch in piece fork-join will not cause silicon chip to be taken to generate sliding when taking silicon chip,
It can continue that piece is taken to operate, execute step S08；
When judgment means judge α ＞ δ, illustrating to touch in piece fork-join can cause silicon chip to be taken to generate sliding when taking silicon chip, such as
Fruit manipulator continues the danger for taking piece operation to will produce touching silicon chip, executes step S07；
Step S07：Manipulator is out of service, and alarm latency is handled；
Specifically, control device control machinery hand is out of service etc. pending, judgment means send a signal to warning device,
Warning device sends out alarm；
Step S08：It is waited for according to each measured value of the sensor at a distance from silicon chip to be taken, calculating in newest sensor group
The maximum distance and minimum range of plane where taking the piece of silicon chip and manipulator fork；
Specifically, going out the function about distance using section line equation calculation, and combine cylindrical surface equation as limitation item
Part acquires maximum distance and minimum range using the differential method；Specifically, obtaining Z=(- D-AX-BY)/C by section line equation, limit
Condition processed is：X2+Y2=R can acquire Z with the differential methodminAnd Zmax。
Step S09：According to maximum distance and minimum range binding isotherm training data come judge manipulator piece fork whether
Piece can be taken safely；If so, thening follow the steps S11；If it is not, then executing step S10；
Specifically, step S09 includes：The piece of the manipulator on piece position is taken to pitch bottom to piece fork lower section silicon upwards according to pre-
The distance s2 of piece upper surface and pre- exit take at the top of the piece fork of the manipulator on piece position to adjacent above silicon chip to be taken
The maximum distance limiting value Z of plane where the distance s3 of support member calculates the piece fork of silicon chip and manipulator to be takenmax-limitMost
Small distance limiting value Zmin-limit；
Maximum distance limiting value Zmax-limitPiece position is taken to take the distance between piece position s3 to pre- exit upwards equal to pre-,
For judging manipulator takes in piece position to the uphill process for contacting silicon chip to be taken whether silicon chip to be taken can be touched upwards from pre-；
Minimum range limiting value Zmin-limitThe thickness d-of distance s-silicon chip of=adjacent silicon chip is pre- to take piece position to waiting for upwards
The location variation γ for taking the distance s2- equipment of adjacent silicon chip below silicon chip to allow, for judging that manipulator is safe from piece is prefetched
Silicon chip adjacent below silicon chip to be taken and silicon chip to be taken whether is touched in position to the pre- motion process for taking piece position upwards；
Judgment means judge above-mentioned minimum range ZminMore than minimum range limiting value Zmin-limit, and maximum distance ZmaxIt is small
In maximum distance limiting value Zmax-limitWhen, illustrate that manipulator can take safely piece, thens follow the steps S11；Otherwise, step is executed
S10；
Step S10：Manipulator is out of service, alarms and waits pending；
Specifically, control device control machinery hand is out of service etc. pending, judgment means send a signal to warning device,
Warning device sends out alarm；
Step S11：The piece fork of manipulator contacts according to training data and picks up silicon chip to be taken, and then manipulator, which rises to, waits for
Pre- exit above silicon chip is taken to take piece position；
Specifically, manipulator rise to it is pre- exit take piece position after, stop motion, treat take silicon chip whether piece pitch it is enterprising
Row detection；If so, thening follow the steps S12；If it is not, then manipulator stop motion, and alarm latency is handled；Here,
Control device control machinery hand stop motion etc. is pending, and judgment means send a signal to warning device, and warning device sends out police
Report；
Step S12：Manipulator takes piece position machine to exit silicon wafer carrying device region outward to home by exiting in advance, and
And judges whether whole silicon chips in silicon wafer carrying device pick up and finish；If so, thening follow the steps S13；If it is not, then holding
Row step S02；
Specifically, during manipulator exits outward, in the positions P5, the hold assembly of manipulator is executed to silicon chip
Holding action, it is ensured that silicon chip will not be fallen in transmission process.Preferably, exiting silicon wafer carrying device region outward to security bit
Set the distance s of the adjacent silicon chip more than 2 times.
Step S13：Stop taking the operation of piece process；
Table one is please referred to, manipulator during taking piece process and film releasing for another preferred embodiment of the present invention arrives
The distance of the silicon chip of its upper and lower position and the safe condition classification chart of silicon chip；In table one, during taking piece, piece fork the positions P1,
On the positions P5 and the positions P6, the sensor that can be pitched by piece detects to obtain as a result, the piece on the positions P1 pitches upper table
The distance between the sensor detection piece fork in face and silicon wafer carrying device, it is as the same on the positions P6；On the positions P5, piece pitches upper surface
Sensor detects piece fork at a distance from the silicon chip being positioned in support member.
Table one
In conclusion the present invention semiconductor equipment silicon wafer carrying device in silicon chip safe pick-up method and its safety
Picking up system, by training data be arranged manipulator movement locus and position, using mechanical handsheet fork on sensor group come
Piece fork and the distance between silicon chip measured value are detected, silicon chip place plane and manipulator are judged to calculate according to distance measure
The section line equation of plane where piece fork simultaneously calculates the inclination angle that silicon chip is pitched relative to piece accordingly, to judge that silicon chip whether can
Generate sliding, it is ensured that silicon chip can just take piece in the case of not generating sliding or ensure not generating sliding after silicon chip is placed.Therefore,
The pose that the present invention realizes to silicon chip during taking piece or film releasing is judged, to avoid mechanical handsheet fork from touching
Silicon chip causes silicon chip impaired, improves the safety for taking piece or film releasing process.
Although the present invention disclosed with preferred embodiment it is as above, the right embodiment illustrate only for the purposes of explanation and
, it is not limited to the present invention, if those skilled in the art can make without departing from the spirit and scope of the present invention
Dry changes and retouches, and the protection domain that the present invention is advocated should be subject to described in claims.
Claims (10)
1. the safe pick-up method of silicon chip in a kind of silicon wafer carrying device of semiconductor equipment, the semiconductor equipment includes being used for
The silicon wafer carrying device of multiple silicon chips and the manipulator for picking up and transporting silicon chip are placed, the silicon wafer carrying device has branch
Support part part, the silicon wafer horizontal are positioned in support member, and multiple silicon chips arrange in the vertical direction, the manipulator tool
There are piece fork, described fork upper and lower surface to be respectively fixed with three or more sensors being not arranged on the same straight line
Group, the sensor group is for defining one or more reference planes；The safe pick-up method of silicon chip includes：
Step S01：Setting takes piece theory training data, execution to take piece operational order；
Step S02：For the robot movement to piece home is prefetched, the manipulator prefetched on piece home does not extend into silicon also
Piece bogey region；
Step S03：Pre- below the silicon chip placement region to be taken into silicon wafer carrying device of the manipulator takes piece position upwards
Movement, in this motion process, each sensor and the silicon chip bottom to be taken in the periodically continued acquisition sensor group
Distance and the measured value at a distance from adjacent silicon chip below the silicon chip to be taken, and the machine is judged according to the measured value
Tool hand whether can be below safe operation to the silicon chip placement region to be taken pre- take piece position upwards；It is described pre- to take piece upwards
Manipulator on position can not touch the support member of the silicon chip bottom to be taken and the bottom and can not touch and described waits taking
Adjacent silicon piece upper surface below silicon chip；If so, thening follow the steps S05；If it is not, then executing step S04；
Step S04：Manipulator is out of service, and alarm latency is handled；
Step S05：The manipulator run to it is described wait take below silicon chip placement region it is pre- upwards take piece position after, according to most
Each measured value of the sensor at a distance from the silicon chip to be taken in the new sensor group, where silicon chip to be taken described in calculating
The inclination angle of plane and plane where the piece fork of the manipulator；
Step S06：Described in judging to touch in described fork-join according to the inclination angle when taking silicon chip, whether the silicon chip to be taken
It will produce sliding；If so, thening follow the steps S07；If it is not, then executing step S08；
Step S07：Manipulator is out of service, and alarm latency is handled；
Step S08：According to each measurement of the sensor at a distance from the silicon chip to be taken in the newest sensor group
It is worth, the maximum distance and minimum range of silicon chip to be taken described in calculating and plane where the piece fork of the manipulator；
Step S09：Piece theory training data is taken come described in judging in conjunction with described according to the maximum distance and the minimum range
Whether the piece fork of manipulator can take safely piece；If so, thening follow the steps S11；If it is not, then executing step S10；Its
In, it is described take piece theory training data include the thickness of silicon chip, adjacent silicon chip spacing, described pre- take machine on piece position upwards
The piece of tool hand pitches bottom and takes the piece of the manipulator on piece position to pitch top to the distance of the lower side silicon wafer upper surface of described fork, pre- exit
The distance of adjacent support member above portion to the silicon chip to be taken and described pre- piece position is taken to take piece to exiting in advance upwards
The distance between position；
Step S10：Manipulator is out of service, alarms and waits pending；
Step S11：The piece fork of the manipulator contacts according to the training data and picks up the silicon chip to be taken, then described
Pre- exit that manipulator rises to above the silicon chip to be taken takes piece position；
Step S12：The manipulator takes piece position machine to exit the silicon wafer carrying device region outward to moving back by pre- exit
Go out home, and judges whether the whole silicon chip in the silicon wafer carrying device picks up and finish；If it is, executing
Step S13；If it is not, then executing step S02；
Step S13：Stop taking the operation of piece process.
2. the safe pick-up method of silicon chip, feature in the silicon wafer carrying device of semiconductor equipment according to claim 1
It is, it is pre- to take the safe limit value of the distance of adjacent silicon chip below the piece position bottoms Shang Piancha to silicon chip to be taken for lower safety upwards
Take piece allowance, when wait take the adjacent lower side silicon wafer of silicon chip in it is horizontal positioned when, and pre- take the piece position bottoms Shang Piancha to waiting taking upwards
When the distance of adjacent silicon chip takes piece allowance more than lower safety below silicon chip, piece fork will not touch silicon chip to be taken in this step S03
The silicon chip of adjacent lower section.
3. the safe pick-up method of silicon chip, feature in the silicon wafer carrying device of semiconductor equipment according to claim 1
It is, in the step S03, the minimum range limiting value of the silicon chip bottom to be taken and plane where the piece fork of the manipulator
The thickness-of spacing-silicon chip of=adjacent silicon chip is described pre- to take the piece of piece position to pitch bottom to silicon chip lower section the to be taken phase upwards
The location variation that the distance of adjacent silicon chip-equipment allows, the step S03 are specifically included：The manipulator is carried to silicon chip and is filled
Pre- below silicon chip placement region to be taken in setting takes piece position to move upwards, in this motion process, periodically continued acquisition
Each sensor is to the distance of the silicon chip bottom to be taken and to adjacent silicon chip below the silicon chip to be taken in the sensor group
Distance measured value, and the minimum value of these measured values is sought, by the minimum value compared with the minimum range limiting value
Compared with, when the minimum value be less than the minimum range limiting value when, execute the step S04；Otherwise the step S05 is executed.
4. the safe pick-up method of silicon chip, feature in the silicon wafer carrying device of semiconductor equipment according to claim 1
It is, the step S05 is specifically included：
Step S051：The manipulator run to it is described wait take below silicon chip placement region it is pre- upwards take piece position after, obtain
Each measured value of the sensor at a distance from the silicon chip to be taken in the newest sensor group；
Step S052：It is to take the XOY plane of piece process with plane where the piece fork of the manipulator, sets the outer circle of theoretical silicon chip
All distribution equations are cylindrical surface equation, calculate the cylindrical surface equation, according to silicon to be taken described in the newest measured value calculating
The plane equation of piece lower surface；
Step S053：The section line equation of the plane equation and the cylindrical surface equation of silicon chip lower surface to be taken described in calculating；
Step S054：Take described fork place XOY during piece flat with described according to the section line equation calculation section line
The angle in face, i.e., the described inclination angle for taking piece to be located at the silicon chip to be taken in the process；
The step S06 is specifically included：Setting silicon chip not will produce the theory α coefficient inclination angle threshold value of sliding, by the inclination angle
It is compared with theory α coefficient inclination angle threshold value；When the inclination angle is less than or equal to theory α coefficient inclination angle threshold value
When, execute the step S08；Otherwise, the step S07 is executed.
5. the safe pick-up method of silicon chip, feature in the silicon wafer carrying device of semiconductor equipment according to claim 4
It is, theory α coefficient inclination angle threshold value is equal to the arctan function value of the friction coefficient of silicon chip.
6. the safe pick-up method of silicon chip, feature in the silicon wafer carrying device of semiconductor equipment according to claim 4
It is, the step S08 is specifically included：Go out the function about distance using the section line equation calculation, and in conjunction with the circle
Cylindrical equation acquires the maximum distance and the minimum range as restrictive condition, using the differential method.
7. the safe pick-up method of silicon chip, feature in the silicon wafer carrying device of semiconductor equipment according to claim 6
It is, the step S09 is specifically included：It is pitched to described according to the pre- piece fork bottom for taking the manipulator on piece position upwards
The distance of lower side silicon wafer upper surface and pre- exit take the piece of the manipulator on piece position to pitch above top to the silicon chip to be taken
Adjacent support member distance calculate described in silicon chip to be taken and the manipulator piece fork where plane maximum distance pole
Limit value and minimum range limiting value；The maximum distance limiting value is equal to described pre- takes piece position to exiting in advance and take piece position upwards
The distance between, it is for judging manipulator from the pre- uphill process for taking silicon chip to be taken described in piece position to contact upwards
It is no to touch the silicon chip to be taken, the thickness-of spacing-silicon chip of the minimum range limiting value=adjacent silicon chip it is described it is pre- to
On take the location variation that distance-equipment of adjacent silicon chip below piece position to the silicon chip to be taken allows, for judging machinery
Hand prefetches in piece home to the pre- motion process for taking piece position upwards whether touch the silicon chip to be taken from described
The adjacent silicon chip with below the silicon chip to be taken；When the minimum range is more than the minimum range limiting value, and the maximum
When distance is less than the maximum distance limiting value, then the step S11 is executed；Otherwise, the step S10 is executed.
8. the safe pick-up method of silicon chip, feature in the silicon wafer carrying device of semiconductor equipment according to claim 1
Be, in the step S11, manipulator rise to it is pre- exit take piece position after, stop motion, treat taking silicon chip whether piece pitch
On be detected；If so, thening follow the steps S12；If it is not, then manipulator stop motion, and alarm latency is handled.
9. the safe pick-up method of silicon chip, feature in the silicon wafer carrying device of semiconductor equipment according to claim 1
It is, the silicon wafer carrying device includes the silicon chip support that the internal film magazine for being mounted with silicon chip and loading silicon chip enter reaction chamber
Mechanism；The semiconductor equipment also has the film magazine supporting mechanism for carrying the film magazine.
10. according to silicon chip safety pickup side in the silicon wafer carrying device of semiconductor equipment described in any one of claim 1-9
The silicon chip distribution identifying system of method, including：
Sensor group is set to the upper and lower surface of the piece fork of the manipulator, for detecting described fork to the silicon chip to be taken
Under the distance measure and described fork to the silicon chip to be taken of bottom or the silicon chip bottom being positioned in the support member
The distance measure of Fang Xianglin silicon chips；
Whether judgment means can touch silicon chip in taking piece motion process for judging the manipulator, and judge silicon chip
Whether on the piece fork of the manipulator, and signal is sent to warning device；
Control device, controlled according to the judging result of the judgment means manipulator whether stop motion；And it is used for
It controls the manipulator execution and takes piece operational order, theoretical training data is set；
Warning device receives the signal that the judgment means are sent out, then sends out alarm.
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| CN110797277B (en) * | 2018-08-01 | 2022-05-27 | 北京北方华创微电子装备有限公司 | Silicon wafer position detection method and device and semiconductor processing equipment |
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| CN113394149B (en) * | 2021-06-30 | 2024-08-13 | 乐孜芯创自动化设备(上海)有限公司 | Silicon wafer transmission fork with position detection function, manipulator and transmission method |
| CN117097247B (en) * | 2023-10-20 | 2023-12-29 | 南通玖方新材料股份有限公司 | Self-adaptive direction adjusting method and device for photovoltaic silicon wafer carrier |
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