CN105623543A - High-strength high-temperature resistance heat-conducting adhesive based on amino resin - Google Patents
High-strength high-temperature resistance heat-conducting adhesive based on amino resin Download PDFInfo
- Publication number
- CN105623543A CN105623543A CN201410615869.7A CN201410615869A CN105623543A CN 105623543 A CN105623543 A CN 105623543A CN 201410615869 A CN201410615869 A CN 201410615869A CN 105623543 A CN105623543 A CN 105623543A
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- CN
- China
- Prior art keywords
- amino resins
- heat conduction
- adhesive based
- strength
- nano
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 229920003180 amino resin Polymers 0.000 title claims abstract description 25
- 239000000853 adhesive Substances 0.000 title claims abstract description 20
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 20
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 18
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 12
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000007822 coupling agent Substances 0.000 claims abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000000919 ceramic Substances 0.000 claims abstract description 6
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000000843 powder Substances 0.000 claims abstract description 6
- 239000002994 raw material Substances 0.000 claims abstract description 6
- 239000011701 zinc Substances 0.000 claims abstract description 6
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 6
- 229940008099 dimethicone Drugs 0.000 claims abstract description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims abstract description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 3
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- FEPBITJSIHRMRT-UHFFFAOYSA-N 4-hydroxybenzenesulfonic acid Chemical group OC1=CC=C(S(O)(=O)=O)C=C1 FEPBITJSIHRMRT-UHFFFAOYSA-N 0.000 claims description 3
- 229920000877 Melamine resin Polymers 0.000 claims description 3
- 239000004640 Melamine resin Substances 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229940082337 dimethicone 20 Drugs 0.000 claims description 3
- 230000009477 glass transition Effects 0.000 abstract description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 1
- 239000000463 material Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a high-strength high-temperature resistance heat-conducting adhesive based on amino resin. The heat-conducting adhesive comprises the following raw materials by mass percentage: 30-45% of amino resin, 3-8% of acetone, 4-14% of hydroquinone, 10-30% of dimethicone, 0-3% of nano zinc, 0-3% of nano silver, 2-6% of nano ceramic powder, 10-20% of vinyltriethoxysilane, 0.5-1.5% of sodium hydroxide, 0.5-1.5% of a coupling agent, and 2-4% of a curing agent. The heat-conducting adhesive has the advantages of good heat conduction performance, high temperature resistance, high strength, and low cost. Through tests, a glass-transition temperature of a cured product is higher than 180 DEG C; bonding strength can reach more than 20 Mpa, bonding strength is reduced by less than 3% after roasting at the temperature of 260 DEG C, and a heat conduction coefficient can reach 4.5W/m.K.
Description
Technical field
The present invention relates to adhesive technical field, particularly relate to a kind of high-strength high temperature-resistant heat conduction adhesive based on amino resins.
Background technology
Along with electronic devices and components and electronic equipment develop to aspect thin, light, little, whether heat conduction, heat radiation well just become the key issue affecting product quality. General electronic devices and components, when the long-time temperature of its operating temperature exceedes the operating temperature 8 DEG C of permission, the life-span will reduce by 50%, and such as the chip of great power LED, the temperature of its P-N junction, generally no more than 70 DEG C, exceedes and will have a strong impact on its light decay and light intensity. Therefore, the life-span of electronic devices and components, electronic equipment to be extended, improve its reliability, it is desirable to the encapsulating material used has enough good heat conductivity. The heat conduction adhesive used in the market, major part is external imported material, costly, and seldom has and can reach high temperature resistant have excellent heat conductivility simultaneously simultaneously.
Summary of the invention
The present invention provides a kind of high-strength high temperature-resistant heat conduction adhesive based on amino resins, good heat conductivity, high temperature resistant, intensity is high, and cost is low.
In order to reach above technique effect, technical scheme is as follows:
A kind of high-strength high temperature-resistant heat conduction adhesive based on amino resins, its proportioning raw materials includes by mass percentage:
Amino resins 30��45%;
Acetone 3��8%;
Hydroquinone 4��14%;
Dimethicone 10��30%;
Nano-Zinc 0��3%;
Nanometer silver 0��3%;
Nano-ceramic powder 2��6%;
VTES 10��20%;
Sodium hydroxide 0.5��1.5%;
Coupling agent 0.5��1.5%;
Firming agent 2��4%.
Preferably, its proportioning raw materials includes by mass percentage:
Amino resins 37%;
Acetone 5%;
Hydroquinone 10%;
Dimethicone 20%;
Nano-Zinc 2
Nanometer silver 2
Nano-ceramic powder 4
VTES 15%;
Sodium hydroxide 1%;
Coupling agent 1%;
Firming agent 3.
Further, described amino resins is the one of melamine resin and Polyamide-Polyamsne-Epichlorohydrin.
Further, described coupling agent is titanate coupling agent.
Further, described firming agent is 4-hydroxy benzenesulfonic acid.
The present invention compared with prior art has the advantages that:
The present invention provides a kind of high-strength high temperature-resistant heat conduction adhesive based on amino resins, good heat conductivity, high temperature resistant, intensity is high, and cost is low. The high-strength high temperature-resistant heat conduction adhesive solidfied material glass transition temperature based on amino resins of the present invention is higher than 180 DEG C after tested; Adhesion strength can reach more than 20Mpa, and adhesion strength reduces less than 3% after 260 DEG C of temperature bakings; Heat conductivity can reach 4.5W/m K.
Detailed description of the invention
Describing technical scheme in detail below in conjunction with specific embodiment, illustrative examples and explanation in this present invention are used for explaining technical scheme, but not as a limitation of the invention.
Embodiment 1:
A kind of high-strength high temperature-resistant heat conduction adhesive based on amino resins, its proportioning raw materials includes by mass percentage:
Amino resins 37%;
Acetone 5%;
Hydroquinone 10%;
Dimethicone 20%;
Nano-Zinc 2
Nanometer silver 2
Nano-ceramic powder 4
VTES 15%;
Sodium hydroxide 1%;
Coupling agent 1%;
Firming agent 3.
Described amino resins is melamine resin; Described coupling agent is titanate coupling agent; Described firming agent is 4-hydroxy benzenesulfonic acid.
The present embodiment provides a kind of high-strength high temperature-resistant heat conduction adhesive based on amino resins, and good heat conductivity is high temperature resistant, intensity is high, and cost is low. The high-strength high temperature-resistant heat conduction adhesive solidfied material glass transition temperature based on amino resins of the present embodiment is higher than 180 DEG C after tested; Adhesion strength can reach more than 20Mpa, and adhesion strength reduces less than 3% after 260 DEG C of temperature bakings; Heat conductivity can reach 4.5W/m K.
The above is the preferred embodiment of the present invention; it should be pointed out that, for those skilled in the art, under the premise without departing from the principles of the invention; can also making some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (5)
1. the high-strength high temperature-resistant heat conduction adhesive based on amino resins, it is characterised in that: its proportioning raw materials includes by mass percentage:
Amino resins 30��45%;
Acetone 3��8%;
Hydroquinone 4��14%;
Dimethicone 10��30%;
Nano-Zinc 0��3%;
Nanometer silver 0��3%;
Nano-ceramic powder 2��6%;
VTES 10��20%;
Sodium hydroxide 0.5��1.5%;
Coupling agent 0.5��1.5%;
Firming agent 2��4%.
2. a kind of high-strength high temperature-resistant heat conduction adhesive based on amino resins according to claim 1, it is characterised in that: its proportioning raw materials includes by mass percentage:
Amino resins 37%;
Acetone 5%;
Hydroquinone 10%;
Dimethicone 20%;
Nano-Zinc 2
Nanometer silver 2
Nano-ceramic powder 4
VTES 15%;
Sodium hydroxide 1%;
Coupling agent 1%;
Firming agent 3.
3. a kind of high-strength high temperature-resistant heat conduction adhesive based on amino resins according to claim 1, it is characterised in that: described amino resins is the one of melamine resin and Polyamide-Polyamsne-Epichlorohydrin.
4. a kind of high-strength high temperature-resistant heat conduction adhesive based on amino resins according to claim 1, it is characterised in that: described coupling agent is titanate coupling agent.
5. a kind of high-strength high temperature-resistant heat conduction adhesive based on amino resins according to claim 1, it is characterised in that: described firming agent is 4-hydroxy benzenesulfonic acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410615869.7A CN105623543A (en) | 2014-11-05 | 2014-11-05 | High-strength high-temperature resistance heat-conducting adhesive based on amino resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410615869.7A CN105623543A (en) | 2014-11-05 | 2014-11-05 | High-strength high-temperature resistance heat-conducting adhesive based on amino resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105623543A true CN105623543A (en) | 2016-06-01 |
Family
ID=56038909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410615869.7A Pending CN105623543A (en) | 2014-11-05 | 2014-11-05 | High-strength high-temperature resistance heat-conducting adhesive based on amino resin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105623543A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12084593B2 (en) | 2018-12-19 | 2024-09-10 | Ppg Industries Ohio, Inc. | Sprayable silicone polymer dispersion |
-
2014
- 2014-11-05 CN CN201410615869.7A patent/CN105623543A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12084593B2 (en) | 2018-12-19 | 2024-09-10 | Ppg Industries Ohio, Inc. | Sprayable silicone polymer dispersion |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160601 |