CN105611726B - Rigid Flex and mobile terminal - Google Patents
Rigid Flex and mobile terminal Download PDFInfo
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- CN105611726B CN105611726B CN201610105639.5A CN201610105639A CN105611726B CN 105611726 B CN105611726 B CN 105611726B CN 201610105639 A CN201610105639 A CN 201610105639A CN 105611726 B CN105611726 B CN 105611726B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
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Abstract
一种软硬结合板及移动终端,包括印刷电路板和连接于印刷电路板一端的柔性电路板,印刷电路板设第一接地线及若干根第一信号走线,第一接地线设于印刷电路板邻近柔性电路板的一侧,第一接地线上设若干个过孔,若干个过孔均贯穿印刷电路板,若干根第一信号走线设于第一接地线的一侧,若干根第一信号走线远离柔性电路板设置。本发明提供的软硬结合板及移动终端,通过在印刷电路板上设第一接地线,并在第一接地线上设若干个过孔。当进行激光去除材料时,若激光对该第一接地线造成损坏,利用该若干个过孔依然能实现印刷电路板的接地功能,从而防止其接地失效而导致信号走线无法连接信号,确保印刷电路板上功能电路的实现,提高软硬结合板的使用可靠性。
A soft and hard combination board and a mobile terminal, including a printed circuit board and a flexible circuit board connected to one end of the printed circuit board, the printed circuit board is provided with a first ground wire and a plurality of first signal traces, the first ground wire is provided On one side of the circuit board adjacent to the flexible circuit board, several via holes are provided on the first ground wire, and the several via holes all penetrate the printed circuit board. Several first signal traces are arranged on one side of the first ground wire, and several The first signal trace is arranged away from the flexible circuit board. In the rigid-flex board and the mobile terminal provided by the present invention, a first ground wire is provided on the printed circuit board, and a plurality of via holes are provided on the first ground wire. When performing laser material removal, if the laser damages the first grounding wire, the grounding function of the printed circuit board can still be realized by using the several via holes, thereby preventing its grounding failure from causing the signal line to be unable to connect to the signal, ensuring the printing The realization of the functional circuit on the circuit board improves the reliability of the soft-hard combination board.
Description
技术领域technical field
本发明涉及电路板技术领域,尤其涉及一种软硬结合板及移动终端。The invention relates to the technical field of circuit boards, in particular to a rigid-flex board and a mobile terminal.
背景技术Background technique
软硬结合板就是柔性线路板与硬性线路板,经过压合等工序,按相关工艺要求组合在一起,形成的具有柔性线路板特性与硬性线路板特性的线路板。Rigid-flex boards are flexible circuit boards and rigid circuit boards, which are combined according to relevant process requirements through pressing and other processes to form circuit boards with the characteristics of flexible circuit boards and rigid circuit boards.
目前,在进行激光切割去除材料时时,由于激光本身具有一定的宽度,当硬板上设置接地线路和信号线路时,其有可能对硬板上的信号线路或者是接地线路线路造成烧坏或者损伤,从而影响到电路的性能,严重的时候会扯断跟硬板相连的软板上的走线,从而导致软板上的功能电路失效,无法保证软硬结合板的使用可靠性。At present, when laser cutting is used to remove materials, since the laser itself has a certain width, when the grounding line and signal line are arranged on the hard board, it may cause burnout or damage to the signal line or grounding line on the hard board , thus affecting the performance of the circuit. In severe cases, the wiring on the soft board connected to the hard board will be torn off, resulting in the failure of the functional circuit on the soft board, and the reliability of the soft-hard combination board cannot be guaranteed.
发明内容Contents of the invention
鉴于现有技术中存在的上述问题,本发明所要解决的技术问题在于,提供一种防止进行激光去除材料时对硬板线路造成损坏,确保使用可靠性的软硬结合板及移动终端。In view of the above-mentioned problems in the prior art, the technical problem to be solved by the present invention is to provide a rigid-flex board and a mobile terminal that prevents damage to hard board circuits during laser material removal and ensures reliability.
为了实现上述目的,本发明实施方式提供如下技术方案:In order to achieve the above object, the embodiment of the present invention provides the following technical solutions:
第一方面,本发明提供一种软硬结合板,其包括印刷电路板和连接于印刷电路板一端的柔性电路板,所述印刷电路板上设置有第一接地线以及若干根第一信号走线,所述第一接地线设于所述印刷电路板邻近所述柔性电路板的一侧,所述第一接地线上开设有若干个过孔,所述若干个过孔沿所述第一接地线的走线方向排列设置,并且所述若干个过孔均贯穿所述印刷电路板,所述若干根第一信号走线设置于所述第一接地线的一侧,并且所述若干根第一信号走线远离所述柔性电路板设置。In the first aspect, the present invention provides a rigid-flex board, which includes a printed circuit board and a flexible circuit board connected to one end of the printed circuit board, and the printed circuit board is provided with a first ground wire and a plurality of first signal wires. line, the first ground line is set on the side of the printed circuit board adjacent to the flexible circuit board, and several via holes are opened on the first ground line, and the several via holes are arranged along the first The routing directions of the grounding wires are arranged in a row, and the plurality of via holes all pass through the printed circuit board, the plurality of first signal routings are arranged on one side of the first grounding wire, and the plurality of via holes The first signal trace is arranged away from the flexible circuit board.
其中,所述第一接地线的线径大于所述第一信号走线的线径。Wherein, the wire diameter of the first ground wire is larger than the wire diameter of the first signal trace.
其中,所述第一接地线的线径大于或等于1mm。Wherein, the diameter of the first ground wire is greater than or equal to 1mm.
其中,所述印刷电路板包括相对设置的第一面和第二面,所述第一面上设置有所述第一接地线,所述若干个过孔均贯通至所述第二面。Wherein, the printed circuit board includes a first surface and a second surface oppositely disposed, the first ground line is provided on the first surface, and the plurality of via holes all penetrate to the second surface.
其中,所述第二面上相对应所述第一接地线设置有第二接地线,并且所述第二接地线的线径与所述第一接地线相同。Wherein, a second ground wire is provided on the second surface corresponding to the first ground wire, and the wire diameter of the second ground wire is the same as that of the first ground wire.
其中,所述若干根第一信号走线上均开设有信号过孔,并且所述信号过孔贯穿至所述第二面上。Wherein, signal via holes are opened on the plurality of first signal traces, and the signal via holes penetrate to the second surface.
其中,所述信号过孔的孔壁涂覆有金属涂层,并且所述金属涂层为金属铜涂层或者金属锡涂层。Wherein, the hole wall of the signal via hole is coated with a metal coating, and the metal coating is a metal copper coating or a metal tin coating.
其中,所述第二面上相对应所述若干根第一信号走线设置有若干根第二信号走线,所述信号过孔内设有连接所述第一信号走线和第二信号走线的导电件。Wherein, the second surface is provided with a plurality of second signal traces corresponding to the plurality of first signal traces, and the signal via hole is provided with a wire connecting the first signal traces and the second signal traces. Wire conductors.
其中,相邻的两根所述第一信号走线之间的距离均相等。Wherein, the distances between two adjacent first signal traces are equal.
第二方面,本发明还提供了一种移动终端,所述移动终端包括本体、设于所述本体内部的主板以及如上述第一方面所述的软硬结合板,所述软硬结合板设于所述主板上,并与所述主板电性连接。In the second aspect, the present invention also provides a mobile terminal, the mobile terminal includes a main body, a main board disposed inside the body, and the rigid-flex board as described in the first aspect above, and the rigid-flex board is set on the main board and electrically connected with the main board.
本发明提供的软硬结合板以及移动终端,通过在印刷电路板邻近柔性电路板的一侧上设置第一接地线,并在第一接地线上设置若干个过孔。当进行激光去除材料时,若激光对该第一接地线造成损坏时,利用该若干个过孔依然能够实现印刷电路板的接地功能,从而防止其接地失效而导致信号走线无法连接信号,确保了印刷电路板上的功能电路的实现,进而提高了软硬结合板的使用可靠性。In the rigid-flex board and the mobile terminal provided by the present invention, a first ground line is provided on the side of the printed circuit board adjacent to the flexible circuit board, and several via holes are provided on the first ground line. When performing laser material removal, if the laser damages the first grounding wire, the grounding function of the printed circuit board can still be realized by using the several via holes, thereby preventing its grounding failure from causing the signal line to fail to connect to the signal, ensuring It improves the realization of the functional circuit on the printed circuit board, thereby improving the reliability of the soft-rigid combination board.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.
图1是本发明实施例提供的软硬结合板的示意图;Fig. 1 is a schematic diagram of a rigid-flex board provided by an embodiment of the present invention;
图2是图1的另外一面的示意图。FIG. 2 is a schematic view of the other side of FIG. 1 .
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
为便于描述,这里可以使用诸如“在...之下”、“在...下面”、“下”、“在...之上”、“上”等空间相对性术语来描述如图中所示的一个元件或特征与另一个(些)元件或特征的关系。可以理解,当一个元件或层被称为在另一元件或层“上”、“连接到”或“耦接到”另一元件或层时,它可以直接在另一元件或层上、直接连接到或耦接到另一元件或层,或者可以存在居间元件或层。For the convenience of description, spatial relative terms such as "under", "below", "below", "over", "upper" and other spatial relative terms can be used to describe the One element or feature shown in relationship to another element or feature(s). It will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it can be directly on, directly on, or directly on the other element or layer. Connected or coupled to another element or layer, or intervening elements or layers may be present.
可以理解,这里所用的术语仅是为了描述特定实施例,并非要限制本发明。在这里使用时,除非上下文另有明确表述,否则单数形式“一”和“该”也旨在包括复数形式。进一步地,当在本说明书中使用时,术语“包括”和/或“包含”表明所述特征、整体、步骤、元件和/或组件的存在,但不排除一个或多个其他特征、整体、步骤、元件、组件和/或其组合的存在或增加。说明书后续描述为实施本发明的较佳实施方式,然所述描述乃以说明本发明的一般原则为目的,并非用以限定本发明的范围。本发明的保护范围当视所附权利要求所界定者为准。It should be understood that the terminology used herein is only used to describe specific embodiments, not to limit the present invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms unless the context clearly dictates otherwise. Further, when used in this specification, the term "comprises" and/or "comprises" indicates the existence of said features, integers, steps, elements and/or components, but does not exclude one or more other features, integers, The presence or addition of steps, elements, components and/or combinations thereof. The following descriptions in the specification are preferred implementation modes for implementing the present invention, but the descriptions are for the purpose of illustrating the general principles of the present invention, and are not intended to limit the scope of the present invention. The scope of protection of the present invention should be defined by the appended claims.
请一并参阅图1和图2,本发明提供的一种软硬结合板100,所述软硬结合板100包括印刷电路板10和连接于所述印刷电路板10一端的柔性电路板20。所述印刷电路板10上设置有第一接地线11以及若干根第一信号走线12,所述第一接地线11设于所述印刷电路板10邻近所述柔性电路板20的一侧。所述第一接地线11上开设有若干个过孔111,所述若干个过孔11沿所述第一接地线11的走线方向排列设置,并且所述若干个过孔111均贯穿所述印刷电路板10。所述若干根第一信号走线12设置于所述第一接地线11的一侧,并且所述若干根第一信号走线12远离所述柔性电路板20设置。可以理解的是,所述软硬结合板100应用于移动终端中,该移动终端可以是手机、平板电脑、笔记本电脑等,所述软硬结合板100负责移动终端中的电子元件之间的导电。Please refer to FIG. 1 and FIG. 2 together. The present invention provides a rigid-flex board 100 . The rigid-flex board 100 includes a printed circuit board 10 and a flexible circuit board 20 connected to one end of the printed circuit board 10 . The printed circuit board 10 is provided with a first ground wire 11 and a plurality of first signal traces 12 , and the first ground wire 11 is disposed on a side of the printed circuit board 10 adjacent to the flexible circuit board 20 . Several via holes 111 are opened on the first ground wire 11, and the several via holes 11 are arranged along the running direction of the first ground wire 11, and the several via holes 111 all pass through the printed circuit board 10 . The several first signal traces 12 are disposed on one side of the first ground wire 11 , and the several first signal traces 12 are disposed away from the flexible circuit board 20 . It can be understood that the rigid-flex board 100 is applied to a mobile terminal, which may be a mobile phone, a tablet computer, a notebook computer, etc., and the rigid-flex board 100 is responsible for the conduction between electronic components in the mobile terminal. .
本发明实施例提供的软硬结合板100通过在所述第一接地线11上设置若干个贯穿所述印刷电路板10的过孔111。当进行激光去除材料时,第一接地线11被激光烧坏时,利用该若干个过孔111依然能够实现其接地功能,保证所述印刷电路板10上的功能电路的实现,确保了所述软硬结合板100的使用可靠性。In the rigid-flex board 100 provided by the embodiment of the present invention, several via holes 111 penetrating through the printed circuit board 10 are provided on the first ground wire 11 . When performing laser material removal, when the first grounding wire 11 is burnt out by the laser, the grounding function can still be realized by using the several via holes 111, which ensures the realization of the functional circuit on the printed circuit board 10 and ensures the The use reliability of the rigid-flex board 100 .
本实施例中,所述印刷电路板10为规则的方形板。所述印刷电路板10包括相对设置的第一面13和第二面14,所述第一接地线11设置于所述第一面13上。具体地,所述第一接地线11的线径大于所述第一信号走线12的线径,并且优选地,所述第一接地线11的线径大于或者等于1mm,从而当进行激光去除材料时,由于所述第一接地线11的线径较大,因此不容易被激光烧伤或者烧断,从而能够确保所述印刷电路板10的接地功能的实现。可以理解的是,在其他实施例中,所述第一接地线11的线径还可根据实际布线情况设置。In this embodiment, the printed circuit board 10 is a regular square board. The printed circuit board 10 includes a first surface 13 and a second surface 14 oppositely disposed, and the first ground wire 11 is disposed on the first surface 13 . Specifically, the wire diameter of the first ground wire 11 is larger than the wire diameter of the first signal wire 12, and preferably, the wire diameter of the first ground wire 11 is greater than or equal to 1mm, so that when laser removal material, since the first grounding wire 11 has a relatively large diameter, it is not easy to be burned or burned by the laser, thereby ensuring the realization of the grounding function of the printed circuit board 10 . It can be understood that, in other embodiments, the diameter of the first ground wire 11 can also be set according to actual wiring conditions.
进一步地,所述第一接地线11设置于所述印刷电路板10的边缘距离所述柔性电路板20的距离大于1mm,以便于所述第一接地线11与所述柔性电路板20上走线的连接,实现所述柔性电路板20上的接地功能的同时,也能够防止所述第一接地线11出现烧断或者烧伤时有可能对所述柔性电路板20上的线路造成损坏的情况。Further, the first ground wire 11 is arranged on the edge of the printed circuit board 10 at a distance greater than 1 mm from the flexible circuit board 20 , so that the first ground wire 11 and the flexible circuit board 20 can run on The connection of wires realizes the grounding function on the flexible circuit board 20, and at the same time, it can also prevent the first grounding wire 11 from being burned or possibly causing damage to the circuit on the flexible circuit board 20. .
所述若干个过孔111开设于所述第一接地线11上。本实施例中,由于所述第一接地线11的线径较大,因此,所述若干个过孔111的孔径稍小于所述第一接地线11即可,或者所述若干个过孔111的孔径与所述第一接地线11的线径相等也可以。所述若干个过孔111从所述第一面13贯通至所述第二面14上,以进一步实现所述印刷电路板10的接地功能,进而当进行激光去除材料时,若所述第一接地线11被激光烧断或者损坏时,由于所述若干个过孔111贯通至所述第二面14,因此,所述过孔111能够充当所述印刷电路板10的接地孔,从而实现所述印刷电路板10的接地功能,进而保证所述印刷电路板10上的其他功能电路的正常运行。优选地,所述若干个过孔111的孔径可为0.5mm至1.0mm。并且为了保证所述印刷电路板10的接地功能,相邻的两个所述过孔111之间的间距均相等。The plurality of via holes 111 are opened on the first ground line 11 . In this embodiment, since the diameter of the first ground wire 11 is relatively large, the diameter of the several via holes 111 is slightly smaller than that of the first ground wire 11, or the diameter of the several via holes 111 The diameter of the hole is equal to the wire diameter of the first grounding wire 11. The plurality of via holes 111 penetrate from the first surface 13 to the second surface 14, so as to further realize the grounding function of the printed circuit board 10, and then when performing laser material removal, if the first When the ground wire 11 is burnt or damaged by the laser, since the several via holes 111 penetrate to the second surface 14, the via holes 111 can serve as the ground holes of the printed circuit board 10, thereby realizing the The grounding function of the above-mentioned printed circuit board 10, and then ensure the normal operation of other functional circuits on the printed circuit board 10. Preferably, the diameter of the plurality of via holes 111 may be 0.5 mm to 1.0 mm. And in order to ensure the grounding function of the printed circuit board 10 , the distances between two adjacent via holes 111 are equal.
进一步地,所述第二面14上相对应所述第一接地线11设置有第二接地线141,并且所述第二接地线141的线径与所述第一接地线11相同。具体地,所述第一接地线11通过所述若干个过孔111连接至所述第二接地线141,以实现所述印刷电路板10的接地功能。当进行激光去除材料时,若所述第一接地线11被激光烧断或者损坏,所述过孔111依然能够连接至所述第二接地线141,因而能够使得所述印刷电路板10的接地功能得以实现。可以理解的是,在其他实施例中,所述第二接地线141的线径还可不与所述第一接地线11的线径相同,如所述第二接地线141的线径小于或者大于所述第一接地线11均可,视具体布线情况设置。Further, a second ground wire 141 is provided on the second surface 14 corresponding to the first ground wire 11 , and the wire diameter of the second ground wire 141 is the same as that of the first ground wire 11 . Specifically, the first ground wire 11 is connected to the second ground wire 141 through the plurality of via holes 111 to realize the grounding function of the printed circuit board 10 . When performing laser material removal, if the first ground wire 11 is burnt or damaged by the laser, the via hole 111 can still be connected to the second ground wire 141, thus enabling the grounding of the printed circuit board 10 function is realized. It can be understood that, in other embodiments, the wire diameter of the second ground wire 141 may not be the same as the wire diameter of the first ground wire 11, for example, the wire diameter of the second ground wire 141 is smaller or larger than The first ground wire 11 can be any, and it can be set according to the specific wiring situation.
所述若干根第一信号走线12设于所述第一接地线11远离所述柔性电路板20的一侧。本实施例中,所述若干根第一信号走线12用以实现所述印刷电路板10上的信号传输。为了便于布线并且保证信号的连续性,相邻的两根所述第一信号走线12之间的距离相等。所述第一信号走线12设置于所述第一面13上,并且所述第一信号走线12上开设有信号过孔121,所述信号过孔121贯穿至所述第二面14上。具体地,所述信号过孔121开设于所述第一信号走线12的一端上,以便于所述第一信号走线12与其他信号走线的连接。优选地,为了增强所述印刷电路板10的整体结构强度,所述信号过孔121的孔壁涂覆有金属涂层(图未示),并且所述金属涂层为金属铜涂层或者金属锡涂层,以增加所述印刷电路板10上的金属含量,增强所述印刷电路板10的整体结构强度。The plurality of first signal wires 12 are disposed on a side of the first ground wire 11 away from the flexible circuit board 20 . In this embodiment, the plurality of first signal wires 12 are used to implement signal transmission on the printed circuit board 10 . In order to facilitate wiring and ensure signal continuity, the distance between two adjacent first signal traces 12 is equal. The first signal trace 12 is disposed on the first surface 13 , and a signal via hole 121 is opened on the first signal trace 12 , and the signal via hole 121 penetrates to the second surface 14 . Specifically, the signal via hole 121 is opened on one end of the first signal trace 12 to facilitate the connection between the first signal trace 12 and other signal traces. Preferably, in order to enhance the overall structural strength of the printed circuit board 10, the hole wall of the signal via hole 121 is coated with a metal coating (not shown), and the metal coating is a metal copper coating or a metal coating. The tin coating is used to increase the metal content on the printed circuit board 10 and enhance the overall structural strength of the printed circuit board 10 .
进一步地,所述信号过孔121内设置有导电件(图未示),所述第二面14上相对应所述若干根第一信号走线12设置有若干根第二信号走线142,所述导电件连接所述第一信号走线12和第二信号走线142,以实现所述印刷电路板10上的信号连接以及信号传输。Further, a conductive member (not shown) is arranged in the signal via hole 121 , and a plurality of second signal traces 142 are arranged on the second surface 14 corresponding to the plurality of first signal traces 12 , The conductive member connects the first signal trace 12 and the second signal trace 142 to realize signal connection and signal transmission on the printed circuit board 10 .
本实施例中,所述柔性电路板20可为与所述印刷电路板10的形状相匹配的方形板。所述柔性电路板20上设置有接地线路以及信号线路,以实现所述柔性电路板20的接地功能以及信号传输功能。In this embodiment, the flexible circuit board 20 may be a square board matching the shape of the printed circuit board 10 . The flexible circuit board 20 is provided with grounding lines and signal lines to realize the grounding function and signal transmission function of the flexible circuit board 20 .
本发明还提供一种移动终端(未图示),所述移动终端包括本体(未图示)、设于所述本体内部的主板(未图示)以及所述软硬结合板100,所述软硬结合板100设于所述本体内部,并与所述主板电连接。所述移动终端可以是手机、电脑、平板、掌上游戏机或媒体播放器等。The present invention also provides a mobile terminal (not shown), the mobile terminal includes a body (not shown), a motherboard (not shown) inside the body, and the rigid-flex board 100 , the The rigid-flex board 100 is disposed inside the body and electrically connected to the main board. The mobile terminal may be a mobile phone, a computer, a tablet, a handheld game console or a media player, etc.
本发明提供的软硬结合板以及移动终端,通过在印刷电路板邻近柔性电路板的一侧上设置第一接地线,并在第一接地线上设置若干个过孔。当进行激光去除材料时,若激光对该第一接地线造成损坏时,利用该若干个过孔依然能够实现印刷电路板的接地功能,从而防止其接地失效而导致信号走线无法连接信号,确保了印刷电路板上的功能电路的实现,进而提高了软硬结合板的使用可靠性。In the rigid-flex board and the mobile terminal provided by the present invention, a first ground line is provided on the side of the printed circuit board adjacent to the flexible circuit board, and several via holes are provided on the first ground line. When performing laser material removal, if the laser damages the first grounding wire, the grounding function of the printed circuit board can still be realized by using the several via holes, thereby preventing its grounding failure from causing the signal line to fail to connect to the signal, ensuring It improves the realization of the functional circuit on the printed circuit board, thereby improving the reliability of the soft-rigid combination board.
在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、“一些示例”或类似“第一实施例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或示例。而且,描述的具体特征、结构、材料或特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of this specification, references to the terms "one embodiment," "some embodiments," "example," "specific examples," "some examples," or the like "first embodiment" etc. A specific feature, structure, material, or characteristic described by an embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
以上所述的实施方式,并不构成对该技术方案保护范围的限定。任何在上述实施方式的精神和原则之内所作的修改、等同替换和改进等,均应包含在该技术方案的保护范围之内。The implementation methods described above do not constitute a limitation to the scope of protection of the technical solution. Any modifications, equivalent replacements and improvements made within the spirit and principles of the above implementation methods shall be included in the protection scope of the technical solution.
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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