CN105583695A - Probe clearing method of probe and probe - Google Patents
Probe clearing method of probe and probe Download PDFInfo
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- CN105583695A CN105583695A CN201410568450.0A CN201410568450A CN105583695A CN 105583695 A CN105583695 A CN 105583695A CN 201410568450 A CN201410568450 A CN 201410568450A CN 105583695 A CN105583695 A CN 105583695A
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- probe
- clear
- pin
- needle method
- faller gill
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- 239000000523 sample Substances 0.000 title claims abstract description 208
- 238000000034 method Methods 0.000 title claims abstract description 52
- 238000012360 testing method Methods 0.000 claims abstract description 34
- 238000005498 polishing Methods 0.000 claims abstract description 28
- 239000003344 environmental pollutant Substances 0.000 claims abstract description 15
- 231100000719 pollutant Toxicity 0.000 claims abstract description 15
- 238000002161 passivation Methods 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000010954 inorganic particle Substances 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 230000004913 activation Effects 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 4
- 244000137852 Petrea volubilis Species 0.000 claims description 2
- 238000011990 functional testing Methods 0.000 abstract description 23
- 230000008569 process Effects 0.000 abstract description 10
- 238000000227 grinding Methods 0.000 abstract description 5
- 230000008859 change Effects 0.000 abstract description 4
- 230000003213 activating effect Effects 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- NCWQJOGVLLNWEO-UHFFFAOYSA-N methylsilicon Chemical compound [Si]C NCWQJOGVLLNWEO-UHFFFAOYSA-N 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007619 statistical method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a probe clearing method of a probe and the probe. The probe clearing method comprises the following steps of performing polishing treatment on the surface of the probe so as to clear pollutants on the surface of the probe, and cutting and activating the surface of the probe; and performing grinding treatment on a probe tip of the probe so as to passivate the probe tip of the probe. According to the probe clearing method and the probe disclosed by the invention, the surface of the probe is subjected to polishing treatment so as to clear the pollutants on the surface of the probe, and the length of the probe has no significant loss; then the probe tip of the probe is subjected to grinding treatment for passivating the probe tip of the probe, thereby reducing the condition that a test bond pad is punched caused by excessive acuteness of the probe tip, and reducing the probability that the probe is broken caused by excessive fragility of the probe tip. Therefore, after the probe is cleared by adopting the probe clearing method provided by the invention, the length of the probe tip has no significant change, further the loss of the probe in the probe clearing process is reduced, and the aim of improving the test yield of a functional test performed by adopting the probe is achieved.
Description
Technical field
The application relates to the technical field of semiconductor integrated circuit, in particular to a kind of clear needle method and probe of probe.
Background technology
The whole manufacturing process of semiconductor devices can be divided into the processing procedures such as wafer manufacture, chip testing and chip package. Wherein, crystalline substanceCircle manufacture refers to manufactures semiconductor devices on wafer, after the manufacture that completes semiconductor devices, can form multiple on waferThe chip (naked crystalline substance) repeating. In chip testing step, need to carry out functional test to chip, to guarantee before encapsulationFilter out defective products, thereby reduce widely chip package and manufacturing cost.
At present, conventionally adopt tester table to carry out functional test to chip. Tester table comprises probe station (probe), probeOn platform, there is probe card (probecard), and probe card comprises at least one probe (probeneedle). Chip is being carried outIn the step of functional test, be conventionally provided with one or more testing weld pads (pad) on chip, probe needs and testing weld padContact, just can complete functional test.
For example, adopting probe to test for a long time (200,000 times), afterwards, the needle point of probe can be oxidized, thereby increased winkTime impedance. Meanwhile, the surface of probe can produce pollutant (for example testing weld pad residue is generally aluminium bits), thereby makesPin trace in functional test step is excessive, cross dark or be offset, and then affects the yield of functional test, even causes coreScrapping of sheet. Therefore,, for assurance function test is normally carried out, (for example every employing probe enters after must be at set intervalsAfter 200,000 tests of row) to the clear pin of probe.
In the clear pin process of existing probe, can only realize single clear pin action, for example, be merely able to be partial to mill in clear pin processOr be partial to sticky single action, cause the loss of pin process middle probe clearly to increase, and then make the pin in functional test stepTrace is excessive, mistake is dark or be offset. Therefore, in functional test process, need engineer to make regular check on pin trace, and if visitedExcessive or the skew of pin card pin trace, needs that engineer is frequent to install and unloading probe card, thereby causes test yield to decline.
Summary of the invention
The application aims to provide a kind of clear needle method and probe of probe, to reduce the loss of pin process middle probe clearly, and improves and adoptsTest yield while carrying out functional test with probe.
To achieve these goals, the application provides a kind of clear needle method of probe, and this clear needle method comprises the following steps: rightPolishing is carried out on the surface of probe, to remove the lip-deep pollutant of probe, and activation is cut in the surface of probe;The needle point of probe is carried out to milled processed, with the needle point of passivation probe.
Further, the step of polishing comprises: probe is inserted in the clear faller gill of viscosity; By probe from the clear faller gill of viscosityPropose.
Further, the clear faller gill of viscosity is mixed by inorganic particle and sticky agent.
Further, inorganic particle is silica, titanium oxide or silicon nitride, and sticky agent is organic siliconresin.
Further, in the step of polishing, the degree of depth that is inserted into the probe in the clear faller gill of viscosity is 50～70 μ m.
Further, carry out the step of 400～600 polishings, to remove the lip-deep pollutant of probe, and to probeSurface cut activation.
Further, the step of milled processed comprises: the needle point of probe is placed on the surface of rigid clear faller gill and grinds.
Further, rigid clear faller gill is potsherd, silicon chip sand paper.
Further, carry out the step of 400～600 milled processed, with the needle point of passivation probe.
Further, probe is placed in test machine, and test machine carries out polishing and milled processed to probe automatically.
The arrangements of steps of the clear pin further, probe being carried out is in the following period: every employing probe carries out 200,000 times～1,500,000 timesAfter test, probe is carried out to pin clearly; Or the frequency of complying with while adopting probe to test is carried out automatically clear pin; Or irregularly probe is enteredThe clear pin of row.
Meanwhile, the application also provides a kind of probe, and the above-mentioned clear needle method that this probe is provided by the application is processed and obtained.
Technique effect: the application is by the surface of probe being carried out to polishing to remove the lip-deep pollutant of probe, and spyThe pin length of pin does not have obvious loss. Then, the application is by the needle point of probe being carried out to the needle point of milled processed with passivation probe,Punched thereby reduced the testing weld pad too sharply causing due to needle point, and reduced due to the too fragile spy causing of needle pointThe probability of pin generation broken needle. Therefore, adopt the clear needle method that provides of the application to ask after pin, length of needlepoint is without significant change,The state of needle point approaches the state of new probe card, has realized and has reduced the loss of pin process middle probe clearly, and improved employing probe and enterThe object of test yield when row functional test. Further, the application has also realized the automatic monitoring function of tester table,Improve the utilization rate of tester table and probe.
Brief description of the drawings
The Figure of description that forms the application's a part is used to provide further understanding of the present application, the application's schematic realityExecute example and explanation thereof for explaining the application, do not form the improper restriction to the application. In the accompanying drawings:
Fig. 1 shows the schematic flow sheet of the clear needle method of the probe that the application's embodiment provides;
The probe that Fig. 2 shows employing the embodiment of the present application 1 to be provided carries out the schematic top plan view of the pin trace after functional test;And
The probe that Fig. 3 shows employing the application comparative example 1 to be provided carries out the schematic top plan view of the pin trace after functional test.
Detailed description of the invention
It should be noted that, in the situation that not conflicting, the group mutually of the feature in embodiment and embodiment in the applicationClose. Describe below with reference to the accompanying drawings and in conjunction with the embodiments the application in detail.
It should be noted that the term that used is only in order to describe detailed description of the invention here, but not intention restriction is according to this ShenIllustrative embodiments please. As used herein, unless context explicitly points out in addition, otherwise singulative is also intended toComprise plural form, in addition, it is to be further understood that when using in this manual term " to comprise " and/or when " comprising ",It indicates and has feature, step, operation, device, assembly and/or their combination.
As what introduce in background technology, in the clear pin process of existing probe, can only realize single clear pin action, cause pin clearlyThe loss of process middle probe increases, so make pin trace in functional test step excessive, excessively dark, meticulous, punch or occurSkew. Present inventor studies for the problems referred to above, has proposed a kind of clear needle method of probe. As shown in Figure 1,This clear needle method comprises the following steps: polishing is carried out in the surface of probe, and to remove the lip-deep pollutant of probe, andActivation is cut on surface to probe; The needle point of probe is carried out to milled processed, with the needle point of passivation probe.
The application is by the surface of probe being carried out to polishing to remove the lip-deep pollutant of probe, and the pin of probe is longThere is obvious loss. Then, the application is by the needle point of probe being carried out to the needle point of milled processed with passivation probe, thereby reducedBecause the testing weld pad that needle point too sharply causes is punched, and reduce due to the too fragile probe generation broken needle causing of needle pointProbability. Therefore, adopt the clear needle method that provides of the application to ask after pin, length of needlepoint is without significant change, the state of needle pointApproach the state of new probe card, realized and reduced the loss of pin process middle probe clearly, and improve employing probe and carry out functional surveyThe object of test yield when examination. Further, the application has also realized the automatic monitoring function of tester table, improves test machineThe utilization rate of platform and probe.
To the illustrative embodiments of clear needle method of the probe providing according to the application be described in more detail below. But, theseIllustrative embodiments can be implemented by multiple different form, and should not be interpreted as being only limited to reality set forth hereinExecute mode. Should be understood that, it is in order to make the open thorough and complete of the application that these embodiments are provided, and by thisThe design of a little illustrative embodiments fully conveys to those of ordinary skill in the art.
First, polishing is carried out in the surface of probe, to remove the lip-deep pollutant of probe, and the surface of probe is enteredRow cuts activation. Wherein, the step of polishing comprises: probe is inserted in the clear faller gill of viscosity; By probe from the clear pin of viscosityIn sheet, propose. This step is by probe being inserted to the clear faller gill of viscosity and propose probe from the clear faller gill of viscosity, thus realized rightPolishing is carried out on the surface of probe, the surface of probe is produced the effect of similar " cutting ", thereby has removed the table of probePollutant on face, and can make probe attenuate.
The clear faller gill of above-mentioned viscosity can be the clear faller gill of common having " viscosity " in this area. For example, the clear faller gill of viscosity is passableMixed by inorganic particle and sticky agent. Wherein, the material of inorganic particle and binding agent can be chosen with reference to prior artThis. Preferably, inorganic particle is silica, titanium oxide or silicon nitride, and sticky agent is organic siliconresin. Certainly the clear faller gill of viscosityThe material also can for other with etching character, sticky agent can also be other viscosity materials.
In this step, the degree of depth that is inserted into the probe in the clear faller gill of viscosity is also the important ginseng that determines clear pin effect, optimizes syringe needleNumber. In order to obtain better clear pin effect, present inventor has carried out lot of experiments. Result of study shows, insertsWhile being 50～70 μ m to the degree of depth of the probe in the clear faller gill of viscosity, can remove more up hill and dale the lip-deep pollutant of probe,And syringe needle is cut to activation effectively. More preferably, when the degree of depth that is inserted into the probe in the clear faller gill of viscosity is 60 μ mEffect is best.
Similarly, the number of times of execution polishing step is also the important parameter that determines clear pin effect. Inventor throws carrying out equallyThe number of times of light treatment step has carried out lot of experiments. Result of study shows, carries out the step of 400～600 polishings,Can remove more up hill and dale the lip-deep pollutant of probe and effectively cut syringe needle. More preferably, carry out 500 polishings placeWhen reason, effect is best.
Complete polishing is carried out in the surface of probe, to remove the lip-deep pollutant of probe, and the surface of probe is carried outAfter cutting the step of activation, the needle point of probe is carried out to milled processed, with the needle point of passivation probe. Particularly, milled processedStep comprise: the needle point of probe is placed on the surface of rigid clear faller gill and grinds. Through after this step, the pin of probePoint is able to passivation, punched thereby reduced the testing weld pad too sharply causing due to needle point, and reduced due to needle point tooThe probe generation broken needle that fragility causes. Meanwhile, this step can also be removed the oxide on needle point etc., has further improved to adopt and has visitedTest yield when pin carries out functional test.
Above-mentioned rigid clear faller gill can be the common clear faller gill with higher hardness, for example potsherd, silicon chip or sand in this areaPaper. Wherein, potsherd can be the common clear faller gill of being made up of ceramic material in prior art, the clear faller gill of for example zirconiaDeng. Certainly, rigid clear faller gill can be also that other grind material. Further, carry out the step of 400～600 milled processedSuddenly, with the needle point of passivation probe.
In this step, the number of times of carrying out milled processed step is the important parameter that determines clear pin effect. Better clear in order to obtainPin effect, present inventor has carried out lot of experiments. Result of study shows, carries out 400～600 milled processedClear pin better effects if when step. More preferably, while carrying out the step of 500 milled processed, clear pin effect is best.
In the above-mentioned clear needle method providing in the application, probe is placed in test machine, and test machine carry out polishing place to probe automaticallyReason and milled processed. Therefore, the application has realized the automatic monitoring function of tester table, has improved the profit of tester table and probeBy rate. The period of the clear pin particularly, probe being carried out can be set according to demand. For example, every employing probe carries out 20After ten thousand times～1,500,000 times tests, probe is carried out to pin clearly; Or the frequency of complying with while adopting probe to test is carried out automatically clear pin; Or notRegularly probe is carried out to the automatically clear pin of routine.
Meanwhile, the application also provides a kind of probe, and the above-mentioned clear needle method that this probe is provided by the application is processed and obtained. This spyLoss in pin is reduced, thereby has improved the test yield while adopting probe to carry out functional test.
Below by the illustrative embodiments of describing in more detail according to the application. But these illustrative embodiments can be byMultiple different form is implemented, and should not be interpreted as being only limited to embodiment set forth herein. Be to be understood thatBe, it is in order to make the open thorough and complete of the application that these embodiments are provided, and by these illustrative embodimentsDesign fully conveys to those of ordinary skill in the art.
Further illustrate the clear needle method of the probe that the application provides below in conjunction with embodiment.
Embodiment 1
The present embodiment provides a kind of clear needle method of probe, comprises the following steps:
Polishing is carried out in the surface of probe, comprises probe is inserted in the clear faller gill of viscosity, and by probe from the clear pin of viscosityThe step proposing in sheet, wherein the clear faller gill of viscosity is mixed by silica and methyl silicon resin, is inserted in the clear faller gill of viscosityThe degree of depth of probe is 50 μ m, and the number of times of carrying out polishing step is 600 times;
The needle point of probe is carried out to milled processed, comprise the needle point of probe is placed in to the step of grinding on the surface of rigid clear faller gillSuddenly, wherein, rigid clear faller gill is silicon chip, and the number of times of carrying out milled processed step is 600 times.
Embodiment 2
The present embodiment provides a kind of clear needle method of probe, comprises the following steps:
Polishing is carried out in the surface of probe, comprises probe is inserted in the clear faller gill of viscosity, and by probe from the clear pin of viscosityThe step proposing in sheet, wherein the clear faller gill of viscosity is mixed by silicon nitride and methyl silicon resin, is inserted in the clear faller gill of viscosityThe degree of depth of probe is 70 μ m, and the number of times of carrying out polishing step is 400 times;
The needle point of probe is carried out to milled processed, comprise the needle point of probe is placed in to the step of grinding on the surface of rigid clear faller gillSuddenly, wherein, rigid clear faller gill is silicon chip, and the number of times of carrying out milled processed step is 400 times.
Embodiment 3
The present embodiment provides a kind of clear needle method of probe, comprises the following steps:
Polishing is carried out in the surface of probe, comprises probe is inserted in the clear faller gill of viscosity, and by probe from the clear pin of viscosityThe step proposing in sheet, wherein the clear faller gill of viscosity is mixed by titanium oxide and methyl silicon resin, is inserted in the clear faller gill of viscosityThe degree of depth of probe is 60 μ m, and the number of times of carrying out polishing step is 500 times;
The needle point of probe is carried out to milled processed, comprise the needle point of probe is placed in to the step of grinding on the surface of rigid clear faller gillSuddenly, wherein, rigid clear faller gill is zirconia ceramics sheet, and the number of times of carrying out milled processed step is 500 times.
Comparative example 1
This comparative example provides a kind of clear needle method of probe, comprises the following steps:
Probe is placed on rigid clear faller gill and carries out milled processed, and wherein, rigid clear faller gill is silicon chip, carries out milled processed stepNumber of times be 500 times.
Test:
Measure the probe that embodiment 1 to 3 and comparative example 1 are provided and carry out the size (comprising that needle point diameter and pin are long) after pin clearly,Its result is asked for an interview table 1. As can be seen from Table 1, the probe that embodiment 1 to 3 is provided carries out clearly after pin, and needle point diameter is21～23 μ m, pin is long is 0.11mil; The probe that comparative example 1 provides carries out clearly after pin, and needle point diameter is 17 μ m, and pin length is0.07mil. Visible, the loss of embodiment 1 to 3 middle probe is significantly less than the loss of comparative example 1 middle probe.
Table 1
| Needle point diameter/μ m | Pin length/mil | |
| Embodiment 1 | 22 | 0.12 |
| Embodiment 2 | 21 | 0.11 |
| Embodiment 3 | 23 | 0.14 |
| Comparative example 1 | 17 | 0.07 |
The application also adopts high-power microscope that the probe that adopts embodiment 1 and comparative example 1 to provide is provided to carry out after functional testThe photo of pin trace. Wherein, Figure 2 shows that the probe that adopts embodiment 1 to provide carries out the photograph of the pin trace after functional testSheet, the probe that Fig. 3 provides for employing comparative example 1 carries out the photo of the pin trace after functional test. As can be seen from Figure 2,The probe that adopts embodiment 1 to provide carries out the pin trace ovalize after functional test, belongs to normal pin trace; Adopt comparative example 1The pin trace that the probe providing carries out after functional test is rectangle, and skew, excessive, even perforation have occurred visible pin trace.It should be noted in the discussion above that the probe that adopts embodiment 2 and embodiment 3 to provide carries out the also ovalize of pin trace after functional test,Belong to normal pin trace, photo and Fig. 2 of its pin trace are basic identical.
Meanwhile, the application also adopts statistical method to obtain the False Rate that adopts probe chip while carrying out functional test. Wherein, visitThe degree of depth that pinprick enters aluminum pad is 30～38 μ m, chip while adopting the probe that provides of embodiment 1 to 3 to carry out functional testThe scope of False Rate is 1.8%～3%, the model of the False Rate of chip when the probe that adopts comparative example 1 to provide carries out functional testEnclose is 2%～8%. Visible, when the probe that adopts embodiment 1 to 3 to provide carries out functional test, the False Rate of chip is obviously littleThe False Rate of chip in the time that the probe that adopts comparative example 1 to provide carries out functional test.
As can be seen from the above description, the application's the above embodiments have realized following technique effect:
(1) the application is by the surface of probe being carried out to polishing to remove the lip-deep pollutant of probe, and the pin of probeLength does not have obvious loss. Then, the application is by the needle point of probe being carried out to the needle point of milled processed with passivation probe, thereby subtractsLack the testing weld pad too sharply causing due to needle point and punched, and reduced because the too fragile probe causing of needle point occursThe probability of broken needle.
(2) the clear needle method that adopts the application to provide is asked after pin, and length of needlepoint is without significant change, and the state of needle point approaches newThe state of probe card, has realized and has reduced the loss of pin process middle probe clearly, and improves while adopting probe to carry out functional testThe object of test yield.
(3) the clear needle method that the application provides has effectively promoted quality, life-span and test yield, the stability of probe card.
(4) the application has also realized the automatic monitoring function of tester table, improves the utilization rate of tester table and probe.
The preferred embodiment that the foregoing is only the application, is not limited to the application, for those skilled in the art, the application can have various modifications and variations. All within the application's spirit and principle, any amendment of doing, etc.With replacement, improvement etc., within all should being included in the application's protection domain.
Claims (12)
1. a clear needle method for probe, is characterized in that, described clear needle method comprises the following steps:
Polishing is carried out in the surface of described probe, to remove the lip-deep pollutant of described probe, and to described spyActivation is cut on the surface of pin;
The needle point of described probe is carried out to milled processed, with the needle point of probe described in passivation.
2. clear needle method according to claim 1, is characterized in that, the step of described polishing comprises:
Described probe is inserted in the clear faller gill of viscosity;
Described probe is proposed from the clear faller gill of described viscosity.
3. clear needle method according to claim 2, is characterized in that, the clear faller gill of described viscosity is mixed by inorganic particle and sticky agentClose and form.
4. clear needle method according to claim 3, is characterized in that, described inorganic particle is silica, titanium oxide or nitrogenizeSilicon, described sticky agent is organic siliconresin.
5. clear needle method according to claim 2, is characterized in that, in the step of described polishing, is inserted into viscosityThe degree of depth of the described probe in clear faller gill is 50～70 μ m.
6. clear needle method according to claim 5, is characterized in that, carries out the step of 400～600 described polishings,To remove the lip-deep pollutant of described probe, and activation is cut in the surface of described probe.
7. clear needle method according to claim 1, is characterized in that, the step of described milled processed comprises: by described probeNeedle point be placed on the surface of rigid clear faller gill and grind.
8. clear needle method according to claim 7, is characterized in that, described rigid clear faller gill is potsherd, silicon chip or sand paper.
9. clear needle method according to claim 7, is characterized in that, carries out the step of 400～600 described milled processed,With the needle point of probe described in passivation.
10. according to the clear needle method described in any one in claim 1 to 9, it is characterized in that, described probe is placed in test machine,Described test machine carries out described polishing and described milled processed to described probe automatically.
11. according to the clear needle method of claim 10, it is characterized in that, the arrangements of steps of the clear pin that described probe is carried out belowPeriod:
The described probe of every employing carries out, after 200,000 times～1,500,000 times tests, described probe is carried out to pin clearly; Or
Frequency while test according to the described probe of employing is carried out automatically clear pin;
Or irregularly described probe is carried out to pin clearly.
12. 1 kinds of probes, is characterized in that, described probe is processed and obtained by the clear needle method described in any one in claim 1 to 11.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410568450.0A CN105583695A (en) | 2014-10-22 | 2014-10-22 | Probe clearing method of probe and probe |
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| CN201410568450.0A CN105583695A (en) | 2014-10-22 | 2014-10-22 | Probe clearing method of probe and probe |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110531121A (en) * | 2019-09-30 | 2019-12-03 | 燕山大学 | A kind of dressing method of atomic force microscope probe needle point |
| CN112531431A (en) * | 2020-10-31 | 2021-03-19 | 东莞市川富电子有限公司 | Preparation of high-stability low-impedance spring needle electric connector and probe electroplating process |
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