CN105580219A - Plating treatment of terminals and connector assembly method - Google Patents

Abstract

A plating treatment of a terminal (1) and a method for assembling a connector, comprising: a plating treatment process, having a chain terminal (1A) to which a plurality of terminals (1) are continuously connected, performing plating treatment on the chain terminal (1A); And the terminal assembling process, after the plating treatment process, the terminal (1) is separated from the chain terminal (1A) and assembled to the connector housing (20).

Description

Plating treatment of terminals and connector assembly method

technical field

The invention relates to a terminal plating treatment and a connector assembly method.

Background technique

Conventionally, when a terminal is subjected to plating such as gold plating, operations from the terminal plating to connector mounting are performed in the following steps (see Patent Document 1). That is, as shown in FIGS. 1A to 1C , the following steps are performed: a terminal plating treatment process, the terminals 50 are separated, each separated terminal 50 is placed on a holding jig 51 for plating, and the terminals 50 are plated. processing; and the terminal pressing process, after the terminal plating treatment process, the terminal 50 is placed on the pressing jig (not shown), and the terminal 50 held by the pressing jig is pressed into the connector housing (not shown). Show).

prior art literature

patent documents

Patent Document 1: Japanese Patent Application Laid-Open No. 7-201447

Contents of the invention

The problem that the present invention intends to solve

Therefore, it is necessary to remove each terminal 50 from each holding jig 51 after placing each terminal 50 on each holding jig 51 for plating and completing the plating process. Therefore, the plating operation is troublesome and requires a lot of work time.

The conventional example has problems in that it is necessary to prepare a plurality of holding jigs 51 for plating, and the scale of plating equipment is large and the cost is high.

Therefore, the purpose of the present invention is to provide a kind of terminal plating treatment and connector assembly method, can carry out the plating treatment of terminal with as simple as possible plating operation, and carry out plating operation in a short time, and can Do it with equipment that is as small in scale and low in cost as possible.

solutions to problems

The terminal plating treatment and connector assembly method of the present invention include: a plating treatment process for performing a plating treatment on the terminal; and a terminal assembly process for assembling the terminal to the connector housing, characterized in that, In the above, the plating process is performed in a state where a plurality of terminals are continuously connected to the interlock terminal; in the terminal assembly process, the terminal is separated from the interlock terminal and assembled to the connector housing after the plating process.

Alternatively, it may be possible to select between: a case of transferring to a terminal assembly process after passing through a plating treatment process; and a case of transferring to a terminal assembly process without undergoing a plating treatment process. The chain terminal may be a chain terminal in which a wire rod is processed and a terminal is connected. A plurality of terminals of the chain terminal may be continuously connected via the fragile portion.

The effect of the invention

According to the present invention, since the plating process is performed on the chain terminals to which the terminals are continuously connected, the terminal mounting operation for the plating process is simple, and the plating process can be continuously performed. Therefore, the plating process of the terminal and the plating process of the connector assembly method of the present invention are simple, can shorten the plating work time, and can perform the plating process with small-scale and low-cost equipment.

Description of drawings

FIG. 1A shows a conventional example, and is a plan view of a state in which a plurality of terminals are mounted on each holding jig.

FIG. 1B shows a conventional example, and is a front view of a state in which a plurality of terminals are mounted on each holding jig.

FIG. 1C shows a conventional example, and is a side view of a state where a plurality of terminals are mounted on each holding jig.

Fig. 2 shows one embodiment of the present invention, and is a perspective view of a chain terminal.

Fig. 3 shows one embodiment of the present invention, and is a schematic diagram of a table-top plating device.

Fig. 4A shows one embodiment of the present invention, and is a side view showing a state in which the terminal at the end of the chain terminal is held by a press-fit jig.

FIG. 4B shows one embodiment of the present invention, and is a side view showing a state in which a terminal is held by a press-fit jig.

FIG. 5 shows one embodiment of the present invention, and is a perspective view showing a state in which terminals are press-fitted into the connector housing.

FIG. 6 shows a modified example of one embodiment of the present invention, and is a schematic diagram of a brush plating apparatus.

FIG. 7 shows a modified example of one embodiment of the present invention, and is a schematic diagram of a thermal spraying device.

Explanation of reference signs

1A chain terminal

1 terminal

detailed description

Hereinafter, one embodiment of the present invention will be described based on the drawings.

However, the drawings are schematic, and it should be noted that devices, system configurations, and the like are different from actual ones. Therefore, the specific configuration should be judged in consideration of the following description. In addition, it is needless to say that the drawings include parts having different configurations from each other.

(implementation mode)

2 to 5 show an embodiment of the present invention. The plating process of the terminal 1 was performed using the table top plating apparatus 30 in the state of the chain terminal 1A. Described below.

As shown in FIG. 2 , the chain terminal 1A is formed by processing a conductive metal wire. In the chain terminal 1A, a plurality of terminals 1 are continuously connected via the fragile portion 2 . The terminal 1 is a round pin terminal, and includes: front and rear contact pin portions 1a, 1b; and a locking portion 1c in the middle thereof. The locking portion 1c has a portion protruding from the outer peripheries of the contact pin portions 1a, 1b.

As shown in Figure 3, the desktop plating device 30 has: the plating solution tank 31 that has been injected with gold-plating solution; The cleaning tank 32 that has been injected with cleaning solution; A plurality of conveying rollers 33 that move; and a drive unit (not shown) that moves the chain terminal 1A.

As shown in FIG. 5 , the press-fit jig 10 has a pair of gripping arms 10 a, and holds the terminal 1 by gripping the terminal 1 by making the interval between the opposing surfaces variable. The press-fit jig 10 is configured to be able to rotate around an axis and move three-dimensionally by a drive arm not shown.

Next, the connector assembly operation of the terminal 1 will be described. The connector assembly work includes a plating treatment process and a connector mounting process. First, the plating treatment process of the terminal 1 will be described. The interlocking terminal 1A is bent at the weak portion 2 and the like, hung over a plurality of transport rollers 33 , and placed on a path passing through the plating solution tank 31 and the cleaning tank 32 in sequence. For example, when the chain terminal 1A is moved by a drive unit (not shown), each terminal 1 of the chain terminal 1A passes through the plating solution tank 31 to be plated with gold on the surface, and then cleaned in the cleaning tank 32 . Instead of the cleaning tank 32 , a firing tank may be provided and firing may be performed. Accordingly, gold plating is continuously applied to each terminal of the chain terminal 1A.

Next, it moves to the connector assembly process of terminal 1. The connector assembly process of the terminal 1 will be described. That is, in the connector assembly process of the terminal 1, as shown in FIG. With the terminal 1 held, the weak portion 2 between the terminal 1 on the next end side is cut off, and as shown in FIG. 4B , the terminal 1 at the end is separated from the chain terminal 1A. For example, cutting is performed by rotating the press-fitting jig 10 and twisting. Then, in the connector assembly process of the terminal 1 , the press-fitting jig 10 is moved to press-fit the terminal 1 into the terminal accommodating chamber 21 of the connector housing 20 so that the front contact pin 1 a ends. The locking portion 1c of the terminal 1 is inserted while interfering with the inner wall of the terminal accommodating chamber 21, and is positioned at the insertion completion position. In this way, the connector assembly work for the terminal 1 is completed.

In addition, in the case of the terminal 1 that does not require gold plating, the plating process is not performed, and only the connector mounting process is performed on the chain terminal 1A. The treatment when the gold plating treatment is unnecessary and the treatment when the gold plating treatment is required are optional.

As described above, one embodiment of the present invention includes: a plating treatment process having chain terminal 1A to which a plurality of terminals 1 are continuously connected, performing plating treatment on chain terminal 1A; Then, the terminal 1 is separated from the chain terminal 1A and assembled to the connector housing 20 . In this way, in one embodiment of the present invention, since the chain terminal 1A to which the terminal 1 is continuously connected is subjected to the plating treatment, compared with the case where the respective terminals 1 in the separated state are subjected to the plating treatment, the plating treatment is less expensive. The terminal placement operation is simple, and the plating process can be performed continuously. Therefore, the plating treatment operation is simple, the plating operation time can be shortened, and the plating treatment can be performed with small-scale and low-cost equipment.

The plating treatment and connector assembling method of the terminal 1 can be selected from the case of performing the terminal assembling process after the plating treatment process, and the case of performing the terminal assembling process without the plating treatment. Therefore, it is also possible to respond to a request for mixing terminals 1 that have been plated and terminals 1 that do not require plating.

The chain terminal 1A is a chain terminal in which a wire rod is processed and the terminal 1 is connected. Therefore, the width of the chain terminal 1A is substantially the same, and since the chain terminal 1A can be plated while feeding out the chain terminal 1A in the longitudinal direction, the workability of the plating operation is better than that of a press-worked terminal.

The chain terminal 1A is a chain terminal in which a plurality of terminals 1 are continuously connected via the fragile portion 2 . Since the chain terminal 1A can be bent at the weak portion 2 , in one embodiment of the present invention, the form of the chain terminal 1A can be changed so as to be suitable for plating, thereby improving the workability of the plating.

When using the tabletop plating apparatus 30, gold plating is given to all the terminals 1 of the chain terminal 1A.

(Modification)

In the above-described embodiment, the plating process was performed using the table top plating apparatus 30 , but as shown in FIG. 6 , it may be performed using a brush plating apparatus 40 . The brush plating device 40 applies gold to the surface of the terminal 1 to perform gold plating. When the brush plating apparatus 40 is used, a plating process can be selectively performed on a plurality of terminals 1 in the chain terminal 1A.

In addition, as shown in FIG. 7, it can also be performed using the thermal spraying apparatus 45. The thermal spraying device 45 sprays gold particles onto the surface of the terminal 1 to perform gold plating. When the thermal spraying device 45 is used, similarly to the brush plating device 40 , a plating process can be selectively applied to a plurality of terminals 1 in the chain terminal 1A.

That is, in the above-mentioned embodiment, a plurality of different plating devices 30, 40, 45 have been exemplified, but as long as the plating device is a device that can perform the plating process under the state of the chain terminal 1A, all of the present invention able to apply.

In the above-mentioned embodiment, the terminal 1 is plated with gold in the plating treatment step, but a plating treatment other than gold plating (for example, tin plating, silver plating, nickel plating) may be performed, and the present invention is applicable to all of them.

In the above-mentioned embodiment, the terminal 1 is a round pin terminal, but it may be a terminal of any shape (for example, a polygonal terminal, a stamped terminal), and the present invention is applicable to all of them.

In the above embodiment, the terminal 1 is cut from the chain terminal 1A by twist cutting, but any cutting method (for example, punching cutting, drawing cutting, cutting with a knife) may be used.

Embodiments of the present invention have been described above, but these embodiments are merely examples for making the present invention easy to understand, and the present invention is not limited to the embodiments. The scope of protection of the present invention is not limited to the specific technical contents disclosed in the above-mentioned embodiments, but also includes various modifications, changes, substitution techniques, etc. that are easily derived therefrom.

This application claims priority based on Japanese Patent Application No. 2013-225034 for which it applied on October 30, 2013, The content of this application is taken in by reference in this-application specification.

Industrial Applicability

According to the present invention, since the plating process is performed on the chain terminals to which the terminals are continuously connected, the terminal mounting operation for the plating process is simple, and the plating process can be continuously performed. Therefore, the plating process of the terminal and the plating process of the connector assembly method of the present invention are simple, can shorten the plating work time, and can perform the plating process with small-scale and low-cost equipment.

Claims (4)

1. A plating treatment of a terminal and a method for assembling a connector, comprising: a plating treatment process for performing a plating treatment on a terminal; Override processing and connector assembly methods are characterized by, In the plating treatment step, the plating treatment is performed in a state in which a plurality of chain terminals of the terminals are continuously connected, After the plating treatment process, the terminals are separated from the interlock terminals and assembled to the connector housing. 2. The plating treatment of terminal and connector assembly method as claimed in claim 1, it is characterized in that, Ability to choose between: The case of passing through the plating treatment process and moving to the terminal assembly process; and When moving to the terminal assembly step without going through the plating treatment. 3. The plating treatment of terminal as claimed in claim 1 or 2 and connector assembly method, it is characterized in that, The interlocking terminal is a interlocking terminal in which wires are processed and connected to terminals. 4. The plating treatment of terminal and connector assembly method as claimed in claim 3, it is characterized in that, A plurality of terminals of the chain terminal are continuously connected through the fragile portion.