CN105578728B - A kind of whole plate aluminium FPC and preparation technology with bearing bed signaling transfer point - Google Patents

Abstract

The invention relates to the technical field of flexible circuit boards, in particular to a whole-board aluminum flexible circuit board with load-bearing layer transfer function and its preparation process, including the whole-board flexible circuit board, thermosetting glue, whole-board aluminum reinforcement and load-bearing Membrane, the whole flexible circuit board is composed of several flexible circuit board bodies and frame, several flexible circuit board bodies are located in the frame, there is a gap between the flexible circuit board body and the frame, the bottom of the whole board flexible circuit board and the whole board The top of the aluminum reinforcement is bonded with a thermosetting adhesive, and the bottom of the entire aluminum reinforcement is attached with a carrier film. Compared with the prior art, the present invention designs a whole-board aluminum flexible circuit board structure with the transfer function of the load-bearing layer. When in use, only the flexible circuit board body needs to be removed from the bearing film, and the bearing film has a degree of support. The advantages of strong, low viscosity, non-adhesive, and high temperature resistance meet the assembly accuracy of product surface packaging, and ensure the consistency of product dimensional stability and product dimensional accuracy.

Description

A full-board aluminum flexible circuit board with load-bearing layer transfer function and its preparation process

technical field

The invention relates to the technical field of flexible circuit boards, in particular to a whole-board aluminum flexible circuit board with a load-bearing layer transfer function and a preparation process thereof.

Background technique

Nowadays, LED lamps have been gradually popularized and applied to automobile lamps. The three-dimensional assembly and excellent lamp holder support of the product structure after the combination of flexible circuit boards and metal reinforcements are more and more widely used in automobile lamps. Due to the different shapes and irregular height differences of the automotive lamp circuit board during the surface packaging and lamp holder bracket assembly process, the existing flexible circuit boards have the following defects:

The existing metal reinforcement is bonded to the body of the flexible circuit board one by one with 3M glue. This bonding method not only has low production efficiency, but also has poor product dimensional accuracy, which brings many troubles to the surface packaging process, such as solder paste deviation. Bad bits, component offsets, etc.

In addition, after the 3M glue is pasted, the performance is relatively stable and there is no bubble in the normal temperature environment. However, after surface packaging and returning to high temperature, the air in the 3M glue expands when heated, which makes the flexible circuit board body irregularly arch from the metal reinforcement, and the surface of the product is poor. The bonding force of the 3M glue is low, resulting in poor surface packaging welding. The situation, such as virtual soldering of components, tombstone, offset, short circuit, etc.

In order to solve the above problems, the aluminum sheet is reinforced and a tie-in is added to form a whole-plate aluminum reinforced structure. However, with the whole board aluminum reinforcement structure, it is necessary to punch or shape the whole board of the aluminum flexible circuit board after the surface is packaged, so as to complete the processing of the single-chip product. During the die-cutting or scooping process after surface packaging, since the components have been assembled, it is easy to cause inconsistent product assembly accuracy, and components are prone to electrostatic breakdown and crushing.

Therefore, it is necessary to design a full-board aluminum flexible circuit board with a load-bearing layer transfer function and its preparation process, which can not only maintain dimensional stability, bonding force, and peel strength, but also avoid punching after packaging to reduce quality. risk.

Contents of the invention

The purpose of the present invention is to overcome the deficiencies of the prior art, and to provide a full-board aluminum flexible circuit board with a load-bearing layer transfer function and its preparation process, which can not only maintain dimensional stability, bonding force, and peel strength, but also avoid packaging The final die-cut fishing type to reduce the quality risk.

In order to achieve the above purpose, the present invention is a whole-board aluminum flexible circuit board with the function of transferring the load-bearing layer, including the whole-board flexible circuit board, thermosetting glue, whole-board aluminum reinforcement and bearing film, characterized in that: the whole board The flexible circuit board is composed of several flexible circuit board bodies and a frame, several flexible circuit board bodies are located in the frame, there is a gap between the flexible circuit board body and the frame, the bottom of the whole flexible circuit board and the aluminum reinforced part of the whole board The top is bonded with thermosetting adhesive, and the bottom of the whole plate reinforced with aluminum is attached with a carrier film.

A preparation process for a full-board aluminum flexible circuit board with a load-bearing layer transfer function, characterized in that: it is specifically prepared according to the following steps: Step 1, roughening the protective film of the whole board flexible circuit board; Paste thermosetting adhesive on the bottom of the flexible circuit board to form the entire flexible circuit board with thermosetting adhesive; step 3, roughen the entire aluminum sheet and form the entire aluminum reinforcement, and paste the entire flexible circuit board with thermosetting adhesive Combine with the whole plate of aluminum reinforcement to form an assembly; step 4, put the assembly into a pressing machine with a temperature of 160-200°C and a pressure of 15-35 kg/cm2, and press for 90-120 minutes. The thermosetting glue is melted, and the entire flexible circuit board and the entire aluminum plate are reinforced and bonded; step 5, put the assembly into a baking machine at a temperature of 160-180°C, and perform curing and baking for 90-120 minutes. Glue curing; step 6, surface treatment of the assembly with gold or anti-oxidation film; step 7, at room temperature, cover the bottom of the assembly with a carrier film; step 8, die-cut the whole plate of aluminum reinforced brother-in-law; step 9. Surface mount.

The specific steps of roughening the protective film of the entire flexible circuit board are as follows: step a1, adopting a method with a line speed of 1-3 m/min, a sand volume concentration of 10-30%, and a spray pressure of 20-35psi. The sandblasting line sandblasts the surface of the protective film; step a2, put the entire flexible circuit board into the roughening liquid at a temperature of 40-55°C, soak for 2-5 minutes, and the surface of the protective film forms a honeycomb-like roughness Point; step a3, put the entire flexible circuit board into tap water or pure water at room temperature, and perform 1-2 minutes of recovery washing; step a4, put the entire flexible circuit board into the neutralizing solution at room temperature, and perform 3 second to 2 minutes of soaking; step a5, put the entire flexible circuit board into tap water or pure water at room temperature, and perform overflow washing for 1-2 minutes twice; step a6, adopt a line speed of 2-5 m/ Minutes, the dryer with a temperature of 70-90°C dries the entire flexible circuit board.

Described coarsening medicinal solution is mixed by the potassium permanganate of 40-70g/L, the sodium hydroxide of 40-70g/L, the potassium hydroxide of 5-10g/L, and described neutralization liquid comprises 10 -30g/L hydrogen peroxide and 10-30g/L sulfuric acid, the concentration of sulfuric acid is 98%.

The specific steps of roughening and strengthening the entire aluminum sheet are as follows: step b1, punching or scooping the entire aluminum sheet; step b2, using a brush roller made of non-woven fabric to brush the surface of the entire aluminum sheet Grinding, the brush marks are 10-20 mm, the line speed is 10-20 rpm; step b3, using 40-50g/L of sodium hydroxide, the line speed is 1.5-2.5 rpm, and the pressure is 20-40psi, The aluminum sheet roughening line with a temperature of 47-53°C roughens the entire aluminum sheet, and the surface of the entire aluminum sheet is honeycomb-shaped; step b4, put the entire aluminum sheet into tap water or pure water at room temperature, and use the speed Wash with overflow water at 10-20 rpm and jet pressure of 10-25psi; step b5, put the whole plate of aluminum sheet into the neutralizing solution at room temperature, use the speed of 10-20 rpm, jet pressure It is 10-25psi neutralization and washing; step b6, put the whole plate of aluminum sheet into pure water at room temperature, and wash it three times, using a rotating speed of 10-20 rev/min, a rotating speed of 10-20 rev/min, jet flow Washing with overflow water at a pressure of 10-25 psi; step b7, drying the entire aluminum sheet with a dryer with a rotating speed of 10-20 rpm, a temperature of 70-90°C, and a strong wind pressure of 10-25 psi.

The neutralizing liquid is composed of 20-35g/L sodium persulfate and 20-50g/L sulfuric acid, and the sulfuric acid concentration is 98%.

Compared with the prior art, the present invention designs a whole-board aluminum flexible circuit board structure with the transfer function of the load-bearing layer. When in use, only the body of the flexible circuit board needs to be removed from the carrying film, and the carrying film has a degree of support. The advantages of strong, low viscosity, non-adhesive, and high temperature resistance meet the surface packaging and assembly accuracy of the product, ensure the dimensional stability of the product and the consistency of the dimensional accuracy of the product, and completely solve the adverse problems of electrostatic breakdown and crushing of components, and The operation is simple and the production efficiency is high. The invention reduces the quality risk after the surface package is assembled, and also reduces the cost of making the punching die.

Description of drawings

Fig. 1 is a layered schematic diagram of the present invention.

Fig. 2 is a structural schematic diagram of the present invention.

Fig. 3 is an enlarged view of A in Fig. 2 of the present invention.

Referring to Figure 1 and Figure 2, 1 is the whole flexible circuit board; 2 is the thermosetting glue; 3 is the aluminum reinforcement of the whole board; 4 is the main body of the flexible circuit board; 5 is the supporting film; 6 is the frame.

Detailed ways

The present invention will be further described now in conjunction with accompanying drawing.

Referring to Figures 1-3, the present invention is a full-board aluminum flexible circuit board with load-bearing layer transfer function, including a full-board flexible circuit board, thermosetting adhesive, full-board aluminum reinforcement and a load-bearing film. The whole flexible circuit board 1 is composed of several flexible circuit board bodies 4 and frame 6, several flexible circuit board bodies 4 are located in the frame 6, there is a gap between the flexible circuit board body 4 and the frame 6, the whole flexible circuit board The bottom of 1 is bonded to the top of the entire aluminum reinforcement 3 with thermosetting adhesive 2 , and the bottom of the entire aluminum reinforcement 3 is attached with a carrier film 5 .

A preparation process of a full-board aluminum flexible circuit board with a load-bearing layer transfer function, which is specifically prepared according to the following steps: Step 1, roughening the protective film of the whole-board flexible circuit board; Paste thermosetting adhesive on the bottom to form the entire flexible circuit board with thermosetting adhesive; step 3, roughen the entire aluminum sheet and form the entire aluminum reinforcement, and paste the entire flexible circuit board with thermosetting adhesive and the entire aluminum Reinforce the combination to form an assembly; Step 4, put the assembly into a pressing machine with a temperature of 160-200°C and a pressure of 15-35 kg/cm2, and press for 90-120 minutes, and the thermosetting glue melts , the entire flexible circuit board is bonded with the entire aluminum reinforcement; step 5, put the assembly into a baking machine with a temperature of 160-180°C, and perform curing and baking for 90-120 minutes, and the thermosetting glue is cured; step 6. Use chemical gold or anti-oxidation film to surface the assembly; step 7, cover the bottom of the assembly with a carrier film at room temperature; step 8, die-cut the entire board with aluminum reinforcement; step 9, surface encapsulation .

The specific steps for roughening the protective film of the entire flexible circuit board are as follows: step a1, use a sandblasting line with a line speed of 1-3 m/min, a sand volume concentration of 10-30%, and a spray pressure of 20-35psi Sandblast the surface of the protective film, use physical methods to change the structure of the surface of the protective film, and enhance the treatment effect of the subsequent roughening liquid on the protective film; step a2, put the entire flexible circuit board into a roughened Soak in the chemical solution for 2-5 minutes, use strong oxidant and strong alkali to roughen the surface of the protective film, so that honeycomb rough spots are formed on the surface of the protective film. Potassium hydroxide, 40-70g/L sodium hydroxide, 5-10g/L potassium hydroxide are mixed. Using the roughening liquid of this formula to roughen the surface of the protective film can enhance the surface roughness of the protective film and There is a honeycomb shape, which can enhance the bonding force between the thermosetting adhesive and the flexible circuit board, but the existing common roughening liquid can not achieve the surface roughness of the protective film, and the bonding force with the thermosetting adhesive is poor; step a3, the entire flexible circuit board Put it in tap water or pure water at room temperature, and wash it with water for 1-2 minutes to clean the roughening solution remaining on the surface of the entire flexible circuit board to avoid cross-contamination; step a4, put the entire flexible circuit board at room temperature In the neutralizing solution, soak for 3 seconds to 2 minutes to neutralize the roughening solution, further avoid the residue of the roughening solution, and roughen the copper surface of the flexible board area, wherein the neutralizing solution includes 10-30g /L of hydrogen peroxide and 10-30g/L of sulfuric acid, the concentration of sulfuric acid is 98%; step a5, put the entire flexible circuit board into tap water or pure water at room temperature, and perform overflow washing for 1-2 minutes twice, Clean the remaining neutralizing solution on the surface of the entire flexible circuit board; step a6, use a dryer with a line speed of 2-5 m/min and a temperature of 70-90°C to dry the entire flexible circuit board, and dry The surface of the entire flexible circuit board avoids residual moisture from affecting the subsequent combination effect.

The specific steps for coarsening the entire aluminum sheet are as follows: step b1, punching or scooping the entire aluminum sheet to meet the graphic requirements of different drawings; step b2, using a brush roller made of non-woven fabric, The surface is brushed, the brush mark is 10-20 mm, and the speed is 10-20 rpm to remove the passivation film on the surface of the entire aluminum sheet, and remove the debris and burrs remaining on the product after punching or scooping Drop, enhance the subsequent roughening effect of sodium hydroxide on the entire plate aluminum sheet; step b3, using 40-50g/L sodium hydroxide, at a speed of 1.5-2.5 rpm, a pressure of 20-40psi, and a temperature of 47-53 ℃ aluminum plate roughening line, roughen the entire aluminum sheet, use strong alkali to roughen the surface of the entire aluminum sheet, the surface of the entire aluminum sheet is honeycomb; step b4, put the entire aluminum sheet at room temperature In the tap water or pure water, use the overflow water washing with a rotation speed of 10-20 rpm and a jet pressure of 10-25psi to clean the residual sodium hydroxide on the entire aluminum sheet to avoid cross-contamination; step b5, the entire plate Put the aluminum sheet into the neutralizing solution at room temperature, and use a neutralizing wash with a rotating speed of 10-20 rpm and a spray pressure of 10-25psi to neutralize the sodium hydroxide, further avoiding the residue of sodium hydroxide, and The surface of the whole aluminum sheet is modified and attacked, wherein the neutralizing solution is 20-35g/L of sodium persulfate and 20-50g/L of sulfuric acid, and the concentration of sulfuric acid is 98%; step b6, put the whole plate of aluminum sheet in a room temperature In pure water, wash three times, using overflow water washing with a speed of 10-20 rpm and a jet pressure of 10-25 psi, to clean the remaining neutralizing liquid on the entire aluminum sheet; step b7, use a speed of 10-20 Rotation per minute, the temperature is 70-90 ℃, and the strong wind pressure is 10-25psi to dry the whole aluminum sheet, so as to avoid the influence of residual moisture on the subsequent combination effect.

The present invention designs a whole-board aluminum flexible circuit board structure with the transfer function of the bearing layer. When in use, it is only necessary to remove the flexible circuit board body 4 from the bearing film 5. The bearing film 5 has strong support and low viscosity. The advantages of non-adhesive and high temperature resistance meet the assembly accuracy of product surface packaging, ensure product dimensional stability and consistency of product dimensional accuracy, and completely solve adverse problems such as electrostatic breakdown and crushing of components, and are easy to operate and easy to produce The efficiency is high, and the invention reduces the quality risk after the surface package is assembled, and also reduces the cost of making punching dies.

In addition, the present invention optimizes the preparation process of the entire aluminum-reinforced flexible circuit board, roughening the surface of the protective film of the entire flexible circuit board, roughening the surface of the entire aluminum sheet, and pressing The two are fixed by the joint method, and the pressed product is flat and has strong temperature resistance. During the high-temperature process of surface packaging and returning to the furnace, the bonding force between the whole flexible circuit board and the whole board aluminum reinforcement is good, and the peeling strength is high, which will not happen. The bad phenomenon of arching or delamination can completely solve the bad problems of components such as virtual soldering, tombstone, offset, and short circuit during surface packaging processing. At the same time, the rework rate after surface packaging is greatly reduced, product quality is improved, and production efficiency is improved.

Claims (5)

1. a kind of preparation technology of the whole plate aluminium FPC with bearing bed signaling transfer point, including whole plate FPC, Hot-setting adhesive, the reinforcement of whole plate aluminium and carrier film, it is characterised in that：Whole plate FPC（1）By several FPC bodies （4）And frame（6）Composition, several FPC bodies（4）Positioned at frame（6）It is interior, FPC body（4）With frame （6）Between be provided with gap, whole plate FPC（1）Bottom and whole plate aluminium reinforcement（3）Top use hot-setting adhesive（2）It is viscous Close, whole plate aluminium reinforcement（3）Bottom be pasted with carrier film（5）, specifically prepare as follows：Step 1, to whole plate flexible wires The diaphragm of road plate is roughened；Step 2, hot-setting adhesive is pasted in whole plate FPC bottom, forms whole plate FPC patch Hot-setting adhesive；Step 3, whole plate aluminium flake is roughened and forms whole plate aluminium reinforcement, by whole plate FPC paste hot-setting adhesive with it is whole The reinforcement of plate aluminium is combined, and forms sub-assembly；Step 4, sub-assembly being put into temperature as 160-200 DEG C, pressure is 15-35 kilograms/it is flat Square centimetre of pressing machine, the pressing of 90-120 minutes is carried out, hot-setting adhesive melts, and whole plate FPC glues with whole plate aluminium reinforcement Close；Step 5, sub-assembly is put into the baking machine that temperature is 160-180 DEG C, carries out the solidification baking of 90-120 minutes, hot-setting adhesive Solidification；Step 6, sub-assembly is surface-treated using change gold or oxidation-resistant film；Step 7, under room temperature state, in sub-assembly Bottom covers carrier film；Step 8, it is punched the husband of sister of whole plate aluminium reinforcement；Step 9, surface encapsulation.

2. a kind of preparation technology of whole plate aluminium FPC with bearing bed signaling transfer point according to claim 1, It is characterized in that：The described diaphragm to whole plate FPC carries out roughening and comprised the following steps that：Step a1, using linear speed For 1-3 ms/min, sand volumetric concentration is 10-30%, and spray pressure is that 20-35psi sandblasting line sprays to diaphragm surface Sand；Step a2, whole plate FPC is put into the roughening decoction that temperature is 40-55 DEG C, carries out the immersion of 2-5 minutes, protected Cuticula surface forms cellular coarse point；Step a3, whole plate FPC is put into the running water or pure water of room temperature, carried out The recovery washing of 1-2 minutes；Step a4, whole plate FPC is put into the neutralizer of room temperature, carries out the leaching of -2 minutes 3 seconds Bubble；Step a5, whole plate FPC is put into the running water or pure water of room temperature, carries out the overflow washing of 1-2 minutes twice； Step a6, linear speed is used as 2-5 ms/min, temperature is that 70-90 DEG C of dryer is dried to whole plate FPC.

3. a kind of preparation technology of whole plate aluminium FPC with bearing bed signaling transfer point according to claim 2, It is characterized in that：Described roughening decoction is by 40-70g/L potassium permanganate, 40-70g/L sodium hydroxide, 5-10g/L hydrogen Potassium oxide mixes, and described neutralizer includes 10-30g/L hydrogen peroxide and 10-30g/L sulfuric acid, and sulfuric acid concentration is 98%。

4. a kind of preparation technology of whole plate aluminium FPC with bearing bed signaling transfer point according to claim 1, It is characterized in that：Described comprises the following steps that to the roughening of whole plate aluminium flake：Step b1, whole plate aluminium flake is punched out or dragged for type； Step b2, brush roll of the material for adhesive-bonded fabric is used, brushing is carried out to whole plate aluminum flake surface, brush mark is 10-20 millimeters, and rotating speed is 10-20 revs/min；Step b3, it is 1.5-2.5 revs/min in rotating speed using 40-50g/L sodium hydroxide, pressure 20- 40psi, the aluminium sheet that temperature is 47-53 DEG C are roughened line, whole plate aluminium flake are roughened, and whole plate aluminum flake surface is in cellular；Step B4, whole plate aluminium flake is put into the running water or pure water of room temperature, uses rotating speed as 10-20 revs/min, jet pressures 10- 25psi overflow washing；Step b5, whole plate aluminium flake is put into the neutralizer of room temperature, using rotating speed be 10-20 revs/min, spray Flowing pressure is that 10-25psi neutralization is washed；Step b6, whole plate aluminium flake is put into the pure water of room temperature, carried out three times, rotating speed 10- 20 revs/min, the overflow that jet pressures are 10-25psi washing；Step b7, using rotating speed, temperature is for 10-20 revs/min 70-90 DEG C, high wind pressure is that 10-25psi dryer is dried to whole plate aluminium flake.

5. a kind of preparation technology of whole plate aluminium FPC with bearing bed signaling transfer point according to claim 4, It is characterized in that：Described neutralizer is by 20-35g/L sodium peroxydisulfate and 20-50g/L sulfuric acid, sulfuric acid concentration 98%.