CN105555033A - Via hole method for LED (Light-Emitting Diode) aluminium substrate - Google Patents
Via hole method for LED (Light-Emitting Diode) aluminium substrate Download PDFInfo
- Publication number
- CN105555033A CN105555033A CN201610051575.5A CN201610051575A CN105555033A CN 105555033 A CN105555033 A CN 105555033A CN 201610051575 A CN201610051575 A CN 201610051575A CN 105555033 A CN105555033 A CN 105555033A
- Authority
- CN
- China
- Prior art keywords
- base plate
- led
- hole
- aluminum base
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 62
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 62
- 239000004411 aluminium Substances 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 title abstract 15
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 27
- 238000003825 pressing Methods 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000010949 copper Substances 0.000 claims abstract description 7
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 238000003475 lamination Methods 0.000 claims abstract description 5
- 239000003292 glue Substances 0.000 claims description 14
- 238000007731 hot pressing Methods 0.000 claims description 11
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- -1 polypropylene Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000011049 filling Methods 0.000 abstract description 8
- 239000011324 bead Substances 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 238000005299 abrasion Methods 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 238000007599 discharging Methods 0.000 abstract 1
- 238000005553 drilling Methods 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 238000000227 grinding Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 238000007689 inspection Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000001149 thermolysis Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a via hole method for an LED (Light-Emitting Diode) aluminium substrate, and belongs to the field of manufacturing of the aluminium substrate. The via hole method comprises the following steps of: S1, drilling a hole on the LED aluminium substrate of which the peripheral side is formed by thick copper, and cleaning a hole wall; S2, full filing a resin adhesive on the hole wall and in the hole; S3, paving a release film on a surface of the LED aluminium substrate by a lamination; and S4, after laminating the LED aluminium substrate by using a vacuum hot press and carrying out cold pressing, discharging the obtained product. According to the via hole method for the LED aluminium substrate, which is provided by the invention, by regulating and increasing aluminium substrate manufacturing technical processes, full filling resin in the via hole of the aluminium substrate, standing and baking the substrate and using lamination for curing resin after filling the resin in the hole, and simultaneously adhering and covering the release film on the surface to prevent the resin adhesive on the surface from overflowing to the surface of the substrate, the step of abrading the substrate by an abrasive belt can be omitted, and thus, the condition that expansion and shrinkage of an inner layer plate, which are generated by abrasion of the abrasive belt on the substrate, influence production accuracy of a subsequent process is avoided, and not only a lamp bead of the LED aluminium substrate is guaranteed to be directly in contact with an aluminium surface to dissipate heat so as not to generate a short circuit in the production accuracy process of the aluminium substrate, but also a service life of the LED lamp bead is prolonged.
Description
Technical field
The present invention relates to aluminium base and manufacture field, specifically a kind of passing method of LED aluminum base plate.
Background technology
Aluminium base manufacture craft is with technical advanced person and economically reasonable in principle, for the purpose of the fine quality of final manufactured goods, ensure that production process is carried out smoothly, its typical process flow comprises: sawing sheet → via hole → dry film photoimaging → examination board → etching → erosion inspection → green oil → character → green inspection → spray tin → aluminium base process → punching → inspection at end.Wherein in two step process of via hole and dry film photoimaging, carry out welding easily producing poor short circuit after boring LED location hole, dry film photoimaging need carry out abrasive belt grinding process to copper face and easily produce harmomegathus to inner plating, the making precision of operation after impact.
Summary of the invention
The present invention is in order to overcome the deficiencies in the prior art, existing aluminium base manufacture craft is in two step process of via hole and dry film photoimaging, carry out welding easily producing poor short circuit after boring LED location hole, dry film photoimaging need carry out abrasive belt grinding process to copper face and easily produce harmomegathus to inner plating, the problem of the making precision of operation after impact, propose a kind of passing method of LED aluminum base plate, technological process is increased by adjustment, object is the step avoiding sandbag nog plate, avoids inner plating to produce harmomegathus phenomenon.
In order to solve above-mentioned technical problem, the basic technical scheme that the present invention proposes is:
A passing method for LED aluminum base plate, comprises the following steps:
S1, in all sides be thick copper LED aluminum base plate on hole and clean hole wall;
S2, in hole wall and hole, fill up resin glue:
The ratio of resin glue is: epoxy resin 40-50 part, polypropylene 20-30 part, pure water 25-35 part, stirs afterwards and static 30 ± 5min, is entirely packed in hole-drilled aluminium base internal surface of hole 80 degree baking and makes its semi-solid preparation half an hour.
Before S3, pressing, lamination spreads release film in LED aluminum base plate face, prevents resin glue in hole from flowing to plate face.
S4, vacuum hotpressing machine 180 degree of pressings are used to come out of the stove after 2 hours through colding pressing 50 degree after 4 hours.
By aluminium base filling holes with resin step, the hole of script conducting is made into insulated hole, make LED board in an assembling process the positive and negative polar angle of diode directly contact aluminium face, thus effectively improve heat radiation, considerably increase the life-span of lamp pearl, make aluminium base serve effective thermolysis.
The invention has the beneficial effects as follows: the passing method of LED aluminum base plate provided by the invention increases aluminium base fabrication processing by adjustment, the full resin of filling in aluminium base via hole, after filling holes with resin, quiet non-drying-plate uses pressing cured resin, and paste with release film simultaneously and cover and prevent surface resin glue from overflowing to plate surface on surface, thus the step of abrasive belt grinding can be saved, inner plating can be avoided to produce harmomegathus because of abrasive belt grinding, the making precision of operation after impact.The present invention is by adjustment manufacture craft, and when not only having ensured the making precision of aluminium base, LED aluminum base plate lamp pearl directly contacts with aluminium face and dispels the heat and can not produce short circuit, also add the life-span of LED lamp bead.
Accompanying drawing explanation
The passing method block diagram of the LED aluminum base plate that Fig. 1 provides for the embodiment of the present invention;
The profile of the LED aluminum base plate that Fig. 2 provides for the embodiment of the present invention;
The vertical view of the LED aluminum base plate that Fig. 3 provides for the embodiment of the present invention;
Identifier declaration in figure: 1-hole, the thick copper of 2-, 3-resin glue, 4-LED aluminium base.
Embodiment
Below with reference to accompanying drawing 1 to accompanying drawing 3 and embodiment, the present invention is described further, but should not limit the scope of the invention with this.
As shown in accompanying drawing 1 to accompanying drawing 3, the invention provides a kind of passing method of LED aluminum base plate, it is characterized in that, comprise the following steps:
S1, in all sides be thick copper 2 LED aluminum base plate 4 on boring 1 clean hole wall;
S2, in hole wall and hole 1, fill up resin glue 3;
S3, lamination spread release film in LED aluminum base plate 4 face;
S4, use vacuum hotpressing machine pressing LED aluminum base plate 4 and come out of the stove after colding pressing.
Preferably, vacuum hotpressing machine pressing 4 hours are used in described step S4.
Preferably, vacuum hotpressing machine pressing 4 hours under the temperature conditions of 180 degree is used in described step S4.
Preferably, come out of the stove after using vacuum hotpressing machine to cold pressing in described step S4 2 hours.
Preferably, come out of the stove after using vacuum hotpressing machine to cold pressing under the temperature conditions of 50 degree in described step S4 2 hours.
Preferably, in described step S1, the ratio of resin glue is: epoxy resin 40-50 part, polypropylene 20-30 part, pure water 25-35 part.
Preferably, described resin glue is entirely packed in hole-drilled aluminium base plate hole and does solidification 30 ± 5min after stirring.
Preferably, 80 degree of baking semi-solid preparations are carried out to the surface of described resin glue.
By aluminium base filling holes with resin step, the hole of script conducting is made into insulated hole, make LED board in an assembling process the positive and negative polar angle of diode directly contact aluminium face, thus effectively improve heat radiation, considerably increase the life-span of lamp pearl, make aluminium base serve effective thermolysis.
The invention has the beneficial effects as follows: the passing method of LED aluminum base plate provided by the invention increases aluminium base fabrication processing by adjustment, the full resin of filling in aluminium base via hole, after filling holes with resin, quiet non-drying-plate uses pressing cured resin, and paste with release film simultaneously and cover and prevent surface resin glue from overflowing to plate surface on surface, thus the step of abrasive belt grinding can be saved, inner plating can be avoided to produce harmomegathus because of abrasive belt grinding, the making precision of operation after impact.The present invention is by adjustment manufacture craft, and when not only having ensured the making precision of aluminium base, LED aluminum base plate lamp pearl directly contacts with aluminium face and dispels the heat and can not produce short circuit, also add the life-span of LED lamp bead.
The announcement of book and instruction according to the above description, those skilled in the art in the invention can also change above-mentioned execution mode and revise.Therefore, the present invention is not limited to embodiment disclosed and described above, also should fall in the protection range of claim of the present invention modifications and changes more of the present invention.In addition, although employ some specific terms in this specification, these terms just for convenience of description, do not form any restriction to the present invention.
Claims (8)
1. a passing method for LED aluminum base plate, is characterized in that, comprises the following steps:
S1, in all sides be thick copper LED aluminum base plate on hole and clean hole wall;
S2, in hole wall and hole, fill up resin glue;
S3, lamination spread release film in LED aluminum base plate face;
S4, use vacuum hotpressing machine pressing LED aluminum base plate coming out of the stove after colding pressing.
2. the passing method of a kind of LED aluminum base plate as claimed in claim 1, is characterized in that, uses vacuum hotpressing machine pressing 4 hours in described step S4.
3. the passing method of a kind of LED aluminum base plate as claimed in claim 2, is characterized in that, uses vacuum hotpressing machine pressing 4 hours under the temperature conditions of 180 degree in described step S4.
4. the passing method of a kind of LED aluminum base plate as claimed in claim 1, is characterized in that, comes out of the stove after using vacuum hotpressing machine to cold pressing 2 hours in described step S4.
5. the passing method of a kind of LED aluminum base plate as claimed in claim 4, is characterized in that, comes out of the stove after using vacuum hotpressing machine to cold pressing under the temperature conditions of 50 degree 2 hours in described step S4.
6. the passing method of a kind of LED aluminum base plate as claimed in claim 4, is characterized in that, in described step S1, the ratio of resin glue is: epoxy resin 40-50 part, polypropylene 20-30 part, pure water 25-35 part.
7. the passing method of a kind of LED aluminum base plate as claimed in claim 6, is characterized in that, described resin glue is entirely packed in hole-drilled aluminium base plate hole and does solidification 30 ± 5min after stirring.
8. the passing method of a kind of LED aluminum base plate as claimed in claim 7, is characterized in that, carries out 80 degree of baking semi-solid preparations to the surface of described resin glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610051575.5A CN105555033A (en) | 2016-01-25 | 2016-01-25 | Via hole method for LED (Light-Emitting Diode) aluminium substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610051575.5A CN105555033A (en) | 2016-01-25 | 2016-01-25 | Via hole method for LED (Light-Emitting Diode) aluminium substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105555033A true CN105555033A (en) | 2016-05-04 |
Family
ID=55833888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610051575.5A Pending CN105555033A (en) | 2016-01-25 | 2016-01-25 | Via hole method for LED (Light-Emitting Diode) aluminium substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105555033A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108260274A (en) * | 2018-03-06 | 2018-07-06 | 宁波科杰电子科技有限公司 | A kind of LED light single-sided aluminum-base plate and its manufacturing process |
| CN109302801A (en) * | 2018-11-20 | 2019-02-01 | 景旺电子科技(龙川)有限公司 | A kind of production method of Metal Substrate jack panel |
| CN109451661A (en) * | 2018-09-13 | 2019-03-08 | 镇江华印电路板有限公司 | A kind of LED aluminum base plate exposure printing technology |
| CN111246670A (en) * | 2020-01-21 | 2020-06-05 | 惠州中京电子科技有限公司 | Method for manufacturing thin plate or soft plate through macroporous resin hole plugging |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006165508A (en) * | 2004-11-09 | 2006-06-22 | Sony Corp | Multilayer wiring board and method of manufacturing the board |
| CN101257770A (en) * | 2008-04-16 | 2008-09-03 | 汕头超声印制板公司 | Manufacturing method for embedding heat radiating fin on printed circuit board |
| CN103369871A (en) * | 2012-03-30 | 2013-10-23 | 北大方正集团有限公司 | Multi-layer printed circuit board and manufacturing method thereof |
-
2016
- 2016-01-25 CN CN201610051575.5A patent/CN105555033A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006165508A (en) * | 2004-11-09 | 2006-06-22 | Sony Corp | Multilayer wiring board and method of manufacturing the board |
| CN101257770A (en) * | 2008-04-16 | 2008-09-03 | 汕头超声印制板公司 | Manufacturing method for embedding heat radiating fin on printed circuit board |
| CN103369871A (en) * | 2012-03-30 | 2013-10-23 | 北大方正集团有限公司 | Multi-layer printed circuit board and manufacturing method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108260274A (en) * | 2018-03-06 | 2018-07-06 | 宁波科杰电子科技有限公司 | A kind of LED light single-sided aluminum-base plate and its manufacturing process |
| CN109451661A (en) * | 2018-09-13 | 2019-03-08 | 镇江华印电路板有限公司 | A kind of LED aluminum base plate exposure printing technology |
| CN109302801A (en) * | 2018-11-20 | 2019-02-01 | 景旺电子科技(龙川)有限公司 | A kind of production method of Metal Substrate jack panel |
| CN111246670A (en) * | 2020-01-21 | 2020-06-05 | 惠州中京电子科技有限公司 | Method for manufacturing thin plate or soft plate through macroporous resin hole plugging |
| CN111246670B (en) * | 2020-01-21 | 2023-10-13 | 惠州中京电子科技有限公司 | Manufacturing method of sheet or soft board macroporous resin plug hole |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160504 |