CN105530765A - Circuit board with embedded components and manufacturing method thereof - Google Patents

Abstract

The invention provides a multilayer circuit board with an embedded element, which comprises a core-layer circuit board, an electronic part, a first film, a second film and a conductive circuit layer, wherein a through mounting hole is formed in the core-layer circuit board; the electronic part is accommodated in the mounting hole; multiple conductive convex blocks are formed on the electrode of the electronic part; the sectional areas of the conductive convex blocks in the direction far away from the electrode from the electrode are gradually decreased; the first film and the second film are formed respectively at opposite two sides of the core-layer circuit board; the multiple conductive convex blocks pass through the first film; the conductive circuit layer is formed on the surface of the first film and the surface of the second film respectively; and the conductive convex blocks passing through the first film and the conductive circuit layer attached to the first film are contacted and electrically connected. The invention also relates to a method of manufacturing the above circuit board.

Description

Circuit board with embedded components and manufacturing method thereof

technical field

The invention relates to the field of circuit board production, in particular to a circuit board with embedded components and a production method thereof.

Background technique

In order to achieve the goal of lightness, lightness and shortness, various manufacturers have begun to devote themselves to changing the electronic components that were originally soldered on the surface of the multilayer circuit board to be buried inside the multilayer circuit board, so as to increase the wiring area on the surface of the circuit board and reduce the circuit size. Board size and reduce its weight and thickness, the electronic components can be active or passive components. When the existing embedded multilayer circuit board mounts the embedded electronic components, solder paste electronic components need to be welded into the circuit board through reflow soldering. Due to the high temperature in the reflow furnace, it is easy to cause deformation of the circuit board. , thereby affecting the quality of the circuit board.

Contents of the invention

Therefore, it is necessary to provide a high-quality circuit board with embedded components and a manufacturing method thereof that does not require reflow.

A method for manufacturing a multilayer circuit board with embedded components, comprising the steps of: providing a core circuit board, forming a through installation hole on the core circuit board; providing electronic parts, on the electrodes of the electronic parts Forming a plurality of conductive bumps, the cross-sectional area of each of the conductive bumps gradually decreases from the electrode to the direction away from the electrode; storing the electronic components after the conductive bumps are formed in the core layer circuit In the installation hole of the board, and on both sides of the core layer circuit board, the film and copper foil are sequentially laminated; the pressing makes the core layer circuit board and each of the copper foils bonded through one of the films, And each of the conductive bumps penetrates through one of the films and is in contact with and electrically connected to the copper foil attached to the film, thereby forming a circuit substrate; making each of the copper foils to form a conductive circuit layer, to electrically connect the electronic components with the conductive circuit layer, thereby forming the multilayer circuit board with embedded components.

A multi-layer circuit board with embedded components includes a core layer circuit board, an electronic component, a first film, a second film and a conductive circuit layer. A through installation hole is formed on the core layer circuit board. The electronic components are accommodated in the installation holes. A plurality of conductive bumps are formed on the electrodes of the electronic components, and the cross-sectional area of each of the conductive bumps decreases gradually in a direction away from the electrodes. The first film and the second film are respectively formed on opposite sides of the core circuit board, and a plurality of the conductive bumps penetrate the first film. The conductive circuit layers are respectively formed on the surfaces of the first film and the second film. The conductive bumps penetrating through the first film are in contact with and electrically connected to the conductive circuit layer attached to the first film.

Compared with the prior art, the multilayer circuit board with embedded components and the manufacturing method of the embodiment of the present invention form conductive bumps with pointed ends on electronic parts, so that the conductive bumps pierce the film and conductive lines Layer electrical connection, so that the electronic parts are embedded, and no reflow is required, which can reduce the problems of circuit board warpage and shrinkage mismatch caused by reflow, thereby improving the yield of circuit board production.

Description of drawings

FIG. 1 is a cross-sectional view of a multilayer circuit board with embedded components provided by the first embodiment of the present invention.

FIG. 2 is a cross-sectional view of a core circuit board provided by a second embodiment of the present invention.

FIG. 3 is a cross-sectional view after forming mounting holes on the core circuit board in FIG. 2 .

FIG. 4 is a cross-sectional view after forming conductive bumps on the electronic component according to the second embodiment of the present invention.

FIG. 5 is a cross-sectional view of the electronic component shown in FIG. 4 accommodated in the mounting hole of the core circuit board in FIG. 3 and build-up materials are laminated on both sides of the core circuit board to form a laminated structure.

FIG. 6 is a cross-sectional view of the laminated structure in FIG. 5 after being pressed to form a circuit substrate.

FIG. 7 is a cross-sectional view of a four-layer circuit board with embedded components obtained by making the copper foil in FIG. 6 into a conductive circuit layer.

Explanation of main component symbols

Multilayer circuit boards with embedded components 100 Core PCB 10 electronic parts 17 first film 181 second film 191 third conductive circuit layer twenty two The fourth conductive circuit layer twenty three Substrate layer 11 first conductive circuit layer 121 second conductive line layer 131 Conductive Via 141 Mounting holes 16 Main body 173 electrode 171 upper surface 1711 lower surface 1712 Conductive bump 172 The first conductive blind via twenty four Second Conductive Blind Via 25 third film 27 fifth conductive line layer 28 fourth film 29 The sixth conductive circuit layer 30 first conductive layer 12 second conductive layer 13 line area 14 Parts installation area 15 first build-up material 18 Second build-up material 19 superimposed structure 20 first copper foil 182 Second copper foil 192 Four-layer circuit board with embedded components 26

The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.

detailed description

Please refer to Fig. 1, the first embodiment of the present invention provides a multilayer circuit board 100 with embedded components, including: a core layer circuit board 10, electronic components 17 accommodated in the core layer circuit board 10, forming and core The first film 181 and the second film 191 on both sides of the laminated circuit board 10 , the third conductive circuit layer 22 formed on the first film 181 side, and the fourth conductive circuit layer 23 formed on the second film 191 side.

The core circuit board 10 includes a substrate layer 11, and a first conductive circuit layer 121 and a second conductive circuit layer 131 arranged on opposite sides of the substrate layer 11, and a conductive via 141 is electrically connected to the first conductive circuit layer 131. The circuit layer 121 and the second conductive circuit layer 131 have a mounting hole 16 passing through the core circuit board 10 .

The electronic component 17 is accommodated in the mounting hole 16 . The electronic component 17 includes a main body 173 and an electrode 171 , and the thickness of the electronic component 17 is equal to or slightly smaller than the depth of the installation hole 16 . The main body 173 is roughly rectangular, and the two electrodes 171 are formed at both ends of the main body 173 in the longitudinal direction. The two electrodes 171 each include an upper surface 1711 and an upper surface 1711 opposite The lower surface 1712, the two upper surfaces 1711 are located on the same side of the electronic component 17, the two lower surfaces 1712 are located on the opposite side of the electronic component 17, the upper surfaces 1711 of the two electrodes 171 And the conductive bump 172 is formed on the lower surface 1712 . The extension direction of the conductive bump 172 is perpendicular to the core circuit board 10 . The cross-sectional area of the conductive bump 172 gradually decreases from the electrode 171 to the direction away from the electrode 171 .

At least one first conductive blind hole 24 is formed in the first film 181, at least one second conductive blind hole 25 is formed in the second film 191, and the first conductive blind hole 24 is electrically connected to the first The conductive circuit layer 121 is connected to the third conductive circuit layer 22 , and the second conductive blind hole 25 is electrically connected to the second conductive circuit layer 131 and the fourth conductive circuit layer 23 . The conductive bumps 172 on both sides of the electronic component 17 pass through the first and second films 181 and 191 respectively, and are electrically connected to the third and fourth conductive circuit layers 22 and 23 respectively.

A third film 27 and a fifth conductive circuit layer 28 are sequentially formed on the side of the third conductive circuit layer 22 , and a fourth film 29 and a sixth conductive circuit layer 30 are sequentially formed on the side of the fourth conductive circuit layer 23 . A third conductive blind hole 31 and a fourth conductive blind hole 32 are respectively formed in the third film 27 and the fourth film 29, and the third conductive blind hole 31 is electrically connected to the third conductive circuit layer 22 and the The fifth conductive circuit layer 28 , the fourth conductive circuit layer 32 electrically connects the fourth conductive circuit layer 23 and the sixth conductive circuit layer 30 .

Please refer to FIGS. 2-7 together. The second embodiment of the present invention provides a method for manufacturing the above-mentioned multilayer circuit board 100 with embedded components, including the following steps:

The first step, please refer to FIG. 2, provides a core layer circuit board 10, the core layer circuit board 10 includes a substrate layer 11, and a first conductive layer 12 and a second conductive layer arranged on opposite sides of the substrate layer 11. Layer 13.

In this embodiment, a circuit board unit of the core circuit board 10 is taken as an example for illustration. The core circuit board 10 is divided into a circuit area 14 and a component mounting area 15 . The size of the part mounting area 15 is approximately the same as the size of the parts to be mounted. The first conductive layer 12 and the second conductive layer 13 in the circuit region 14 are all conductive circuit layers formed with conductive circuits, defining the first conductive layer 12 and the second conductive layer 13 in the circuit region 14 They are the first conductive circuit layer 121 and the second conductive circuit layer 131 respectively. The core circuit board 10 is further formed with at least one conductive via 141 in the circuit area 14 , and the conductive via 141 is electrically connected to the first conductive circuit layer 121 and the second conductive circuit layer 131 . The first conductive layer 12 and the second conductive layer 13 in the component mounting area 15 do not form conductive circuits, and are disconnected from the first conductive layer 12 and the second conductive layer 13 in the circuit area 14 respectively. In another embodiment, the first conductive layer 12 and the second conductive layer 13 in the component mounting area 15 may not be connected with the first conductive layer 12 and the second conductive layer 13 in the circuit area 14. phase disconnected. In other embodiments, the first conductive layer 12 and the second conductive layer 13 may not be formed in the component mounting area 15 .

In this embodiment, the materials of the first conductive layer 12 and the second conductive layer 13 are both copper. In the present embodiment, the substrate layer 11 is an insulating layer, that is, the core circuit board 10 is a double-sided circuit board. In other embodiments, the base material layer 11 may also include multiple layers of insulating layers and conductive circuit layers. At this time, the insulating layers and conductive circuit layers are arranged alternately, and the outermost two sides of the base material layer 11 are insulating layers. That is, in other embodiments, the core circuit board 10 may also be a multi-layer circuit board. In other embodiments, the number of component mounting areas 15 may also be multiple; the core circuit board 10 may include multiple circuit board units.

The second step, please refer to FIG. 3 , is to remove the core circuit board 10 in the component mounting area 15 , so as to form a mounting hole 16 on the core circuit board 10 .

In this embodiment, the core layer circuit board 10 is cut along the boundary line between the circuit area 14 and the component mounting area 15 by means of laser cutting, thereby removing the core layer circuit in the component mounting area 15 plate 10. The installation hole 16 penetrates through the core circuit board 10 , and the installation hole 16 is used for accommodating an electronic component. Because in this embodiment, the first conductive layer 12 and the second conductive layer 13 in the component mounting area 15 are respectively disconnected from the first conductive layer 12 and the second conductive layer 13 in the circuit area 14, Therefore, only the substrate layer 11 is cut and the conductive layer is not cut during cutting, which is easier to cut. In other embodiments, the installation hole 16 may also be formed by punching, scooping and other methods.

The third step, referring to FIG. 4 , provides an electronic component 17, and forms a conductive bump 172 on the electrode 171 of the electronic component 17, and the conductive bump 172 is in a direction away from the electrode 171 from the electrode 171. The cross-sectional area gradually decreases.

In this embodiment, the electronic component 17 includes a main body 173 and two electrodes 171 . The main body 173 is roughly rectangular, and the two electrodes 171 are formed at both ends of the main body 173 in the longitudinal direction. The two electrodes 171 each include an upper surface 1711 and an upper surface 1711 opposite For the lower surface 1712 , the two upper surfaces 1711 are located on the same side of the electronic component 17 , and the two lower surfaces 1712 are located on the opposite side of the electronic component 17 . The number of the conductive bumps 172 is four, which are respectively formed on the upper surface 1711 and the lower surface 1712 of the two electrodes 171 . The thickness of the electronic component 17 is equal to or slightly smaller than the depth of the installation hole 16 .

Forming the conductive bump 172 on the electrode 171 of the electronic component 17 includes the steps: first, form a conductive paste on the upper surface 1711 and the lower surface 1712 of each electrode 171 of the electronic component 17 by printing, so The conductive paste can be silver paste, copper paste, etc.; secondly, the conductive paste is solidified to obtain the conductive bump 172, and the conductive bump 172 is cross-sectional from the electrode 171 to the direction away from the electrode 171. The area gradually decreases, and the conductive bump 172 may be in the shape of a cone, a truncated cone, a triangular pyramid, a triangular prism, a polygonal pyramid, or a polygonal truncated pyramid.

In other embodiments, the conductive bumps 172 may also be formed only on the upper surface 1711, or only on the lower surface 1712; the number of the conductive bumps 172 is not limited to this embodiment, For example, two or more conductive bumps 172 may be formed on the upper surface 1711 and the lower surface 1712 of each electrode 171 .

The fourth step, please refer to FIG. 5, accommodate the electronic components 17 formed with conductive bumps 172 in the mounting holes 16 of the core circuit board 10, and stack them on both sides of the core circuit board 10. Combine the first build-up material 18 and the second build-up material 19 so that the conductive bumps 172 of the electronic components 17 are all in contact with the build-up material, thereby forming a stacked structure 20 .

In this embodiment, the first build-up material 18 includes a first film 181 and a first copper foil 182, and the second build-up material 19 includes a second film 191 and a second copper foil 192, so The conductive bumps 172 on both sides of the electronic component 17 are in direct contact with the first and films 181 and 191 respectively. The first and second films 181 and 191 may be semi-cured insulating resin sheets, and may include toughening materials such as glass fiber cloth. The thicknesses of the first film 181 and the second film 191 are substantially the same as the heights of the contacting conductive bumps 172 protruding from the core circuit board 10 .

In this embodiment, the forming step of the laminated structure 20 includes: firstly, providing the first film 181, and pre-laminating the first film 181 on one side of the core circuit board 10 by rolling. side, that is, the opening of one end of the mounting hole 16 is closed by the first film 181; then, the electronic component 17 formed with the conductive bump 172 is accommodated in the mounting hole 16 of the core circuit board 10 and the conductive bump 172 on one side of the electronic component 17 is supported on the first film 181; then, on the side of the first film 181 away from the core circuit board 10 The first copper foil 182 is sequentially laminated with the second film 191 and a second copper foil 192 on the side of the core circuit board 10 away from the first film 181 , so as to form the laminated structure 20 .

The fifth step, please refer to FIG. 6, is to press the laminated structure 20, make the core layer circuit board 10 bond with the first build-up material 18 and the second build-up material 19, and make the The conductive bumps 172 on both sides of the electronic component 17 pass through the first and second films 181 and 191 respectively, and are respectively electrically connected to the copper foils on the same side, thereby forming a circuit substrate 21 .

Because in this embodiment, the cross-sectional area of the conductive bump 172 gradually decreases from the electrode 171 to the direction away from the electrode 171, that is, it has a sharper end, so under the action of pressure, the The conductive bump 172 can pierce through the first film 181 and the second film 191 so as to be electrically connected with the first and second copper foils 182, 192, and because the thickness of the first film 181 and the second film 191 is consistent with The heights of the conductive bumps 172 that are in contact with the core layer circuit board 10 are substantially the same, so the conductive bumps 172 can be electrically connected with the first and second copper foils 182, 192 without piercing. through the first and second copper foils 182,192.

The sixth step, please refer to FIG. 7, the first copper foil 182 is fabricated to form the third conductive circuit layer 22, the second copper foil 192 is fabricated to form the fourth conductive circuit layer 23, and the first film At least one first conductive blind hole 24 is formed in 181, at least one second conductive blind hole 25 is formed in the second film 191, so that the first conductive blind hole 24 is electrically connected to the first conductive circuit layer 121 and The third conductive circuit layer 22 makes the second conductive blind hole 25 electrically connect the second conductive circuit layer 131 and the fourth conductive circuit layer 23, and makes the conductive parts on both sides of the electronic component 17 electrically conductive. The bumps 172 are respectively electrically connected to the conductive circuit layers on the same side, that is, the electronic component 17 is electrically connected to the third and fourth conductive circuit layers 22, 23, thereby obtaining a four-layer Circuit board 26 with embedded components.

In this embodiment, the conductive blind hole and the conductive circuit layer can be formed through the following steps: first, at least one blind hole is formed on the first film 181 and the first copper foil 182 by laser ablation, and At least one blind hole is formed on the second film 191 and the second copper foil 192; after that, electroplating forms an electroplating layer on the wall of the blind hole, so that the blind hole is made to form a first conductive blind hole 24 and a second conductive blind hole. holes 25; finally, the first copper foil 182 is fabricated to form the third conductive circuit layer 22 by image transfer process and etching process, and the second copper foil 192 is fabricated to form the fourth conductive circuit layer 23.

In the seventh step, please refer to FIG. 1 together, add layers on both sides of the circuit board 26 with embedded components in the four layers, and form the third film 27 and the fifth conductive circuit layer 28, the fourth film 29 and the fourth film respectively. Six conductive circuit layers 30, and respectively form a third conductive blind hole 31 and a fourth conductive blind hole 32 in the third film 27 and the fourth film 29, so that the third conductive blind hole 31 is electrically connected to the The third conductive circuit layer 22 and the fifth conductive circuit layer 28 make the fourth conductive blind hole 32 electrically connect the fourth conductive circuit layer 23 and the sixth conductive circuit layer 30, thereby obtaining a buried multilayer circuit board 100 of components.

The way of adding layers in this step is similar to that of the fourth to sixth steps, that is, the film and copper foil are laminated first, then conductive blind holes are formed in the film, and finally the copper foil is made into a conductive circuit. Of course, if only a four-layer circuit board needs to be formed, this step does not need to be performed.

It can be understood that a solder resist layer can also be formed on the multilayer circuit board 100 with embedded components to protect the exposed conductive lines on the outermost sides; the multilayer circuit board in this case can also be formed in the seventh step. The multilayer circuit board 100 with embedded components can be obtained by having more conductive circuit layers and including more circuit layers.

Compared with the prior art, the multilayer circuit board 100 with embedded components and the manufacturing method of the embodiment of the present invention form the conductive bump 172 with a sharp point on the electronic component 17, so that the conductive bump penetrates the film and the conductive circuit layer Electrical connection, so that the electronic parts 17 are embedded, and no reflow is required, which can reduce the problems of circuit board warping and shrinkage mismatch caused by reflow, thereby improving the production yield of the circuit board.

It can be understood that those skilled in the art can make various other corresponding changes and modifications according to the technical concept of the present invention, and all these changes and modifications should belong to the protection scope of the claims of the present invention.

Claims (20)

1. A method for making a multilayer circuit board with embedded components, comprising steps: providing a core layer circuit board, forming through mounting holes on the core layer circuit board; An electronic component is provided, and a plurality of conductive bumps are formed on the electrodes of the electronic component, and the cross-sectional area of each of the conductive bumps gradually decreases from the electrode to the direction away from the electrode; The electronic components formed with conductive bumps are housed in the mounting holes of the core circuit board, and film and copper foil are sequentially stacked on both sides of the core circuit board; Pressing the core layer circuit board and each of the copper foils through one of the films, and making each of the conductive bumps pass through one of the films and connect to the film attached to the film. The copper foils are in contact and electrically connected to form a circuit substrate; Each of the copper foils is fabricated to form a conductive circuit layer, and the electronic components are electrically connected to the conductive circuit layer, thereby forming the multilayer circuit board with embedded components. 2 . The method for manufacturing a multilayer circuit board with embedded components according to claim 1 , wherein the mounting holes are formed on the core circuit board by laser cutting, punching or scooping. 3 . 3. The method for manufacturing a multilayer circuit board with embedded components as claimed in claim 1, wherein the core circuit board comprises a base material layer and first conductive lines arranged on opposite sides of the base material layer layer and a second conductive circuit layer, the core layer circuit board includes a circuit area and a component mounting area, the first conductive circuit layer and the second conductive circuit layer are only formed in the circuit area, along the circuit Cutting the core circuit board at a boundary line between the area and the component mounting area to remove the core circuit board in the component mounting area to form the mounting hole. 4. The method for manufacturing a multilayer circuit board with embedded components as claimed in claim 1, wherein the core circuit board comprises a base material layer and a first conductive layer disposed on opposite sides of the base material layer and a second conductive layer, the core layer circuit board includes a circuit area and a component mounting area, the first conductive layer and the second conductive layer in the circuit area and the described component mounting area The first conductive layer and the second conductive layer are disconnected, the first conductive layer and the second conductive layer in the circuit area are respectively the first conductive circuit layer and the second conductive circuit layer, along the circuit area and the Cutting the core circuit board at the boundary line of the component mounting area to remove the core circuit board in the component mounting area to form the mounting hole. 5. The method for manufacturing a multilayer circuit board with embedded components as claimed in claim 1, wherein the method for forming the conductive bump comprises: printing a conductive paste on the electrode of the electronic component, and curing the conductive paste to obtain the conductive bumps. 6. The method for manufacturing a multilayer circuit board with embedded components according to claim 1, wherein the conductive paste is silver paste or copper paste. 7. The manufacturing method of a multilayer circuit board with embedded components as claimed in claim 1, wherein the shape of the conductive bump is conical, truncated, triangular, triangular, multi-prism Pyramidal or polygonal truncated. 8. The manufacturing method of a multilayer circuit board with embedded components as claimed in claim 1, wherein said electronic part comprises a main body and two electrodes, and said two electrodes all comprise a lower surface, two The lower surface is located on the same side of the electronic component, and at least one conductive bump is formed on the lower surface of each electrode, and each of the conductive bumps penetrates through one side of the core circuit board during pressing. The film is electrically connected to the copper foil attached to the film. 9. The manufacturing method of a multilayer circuit board with embedded components as claimed in claim 8, the two electrodes also include an upper surface opposite to the lower surface, and the two upper surfaces are located on the electronic part On the opposite side of the electrode, at least one conductive bump is also formed on the upper surface of each electrode. When pressing, each of the conductive bumps respectively penetrates the same side of the film and is connected with the film. The adjacent copper foils are electrically connected. 10. The method for manufacturing a multilayer circuit board with embedded components as claimed in claim 9, wherein the number of the conductive bumps is four, and the conductive bumps are respectively formed on the two electrodes upper and lower surfaces. 11. The method for manufacturing a multilayer circuit board with embedded components as claimed in claim 9, wherein the electronic components formed with conductive bumps are accommodated in mounting holes of the core circuit board, The step of sequentially stacking films and copper foils on both sides of the core circuit board includes: providing a first film, and pre-attaching the first film to the core circuit board by rolling On one side, after that, accommodate the electronic component formed with the conductive bump in the mounting hole of the core circuit board, and support the conductive bump on the side of the electronic component on the first film, Then, the first copper foil is stacked on the side of the first film away from the core circuit board, and the second copper foil is sequentially stacked on the side of the core circuit board away from the first film. film and a second copper foil. 12. The method for manufacturing a multilayer circuit board with embedded components as claimed in claim 11, wherein the thicknesses of the first film and the second film respectively protrude from the conductive bumps in contact with them. The core boards are the same height. 13. The method for manufacturing a multilayer circuit board with embedded components according to claim 1, wherein the thickness of the electronic component is equal to or slightly smaller than the depth of the mounting hole. 14. The method for manufacturing a multilayer circuit board with embedded components as claimed in claim 1, characterized in that, after making each of the copper foils to form a conductive circuit layer, further comprising: The step of building up layers on the surface. 15. A multilayer circuit board with embedded components, comprising: A core layer circuit board, the core layer circuit board is formed with through mounting holes; An electronic component, the electronic component is accommodated in the mounting hole, a plurality of conductive bumps are formed on the electrodes of the electronic component, each of the conductive bumps is in the direction away from the electrode from the electrode The cross-sectional area gradually decreases; a first film and a second film formed on opposite sides of the core circuit board, a plurality of the conductive bumps passing through the first film; and Conductive circuit layers are respectively formed on the surfaces of the first film and the second film, and the conductive bumps penetrating through the first film are in contact with and electrically connected to the conductive circuit layers attached to the first film. 16. The multilayer circuit board with embedded components as claimed in claim 15, wherein a plurality of conductive bumps penetrate the second film, and the conductive bumps penetrating the second film are connected with the conductive bumps. The conductive circuit layer attached to the first film is electrically connected. 17. The multilayer circuit board with embedded components according to claim 15, wherein the conductive bumps are formed by curing conductive paste. 18. The multilayer circuit board with embedded components as claimed in claim 15, wherein said electronic part comprises a main body and two electrodes, and said two electrodes all comprise a lower surface and a surface connected to said lower surface. On the opposite upper surface, the two lower surfaces are located on the same side of the electronic component, the two upper surfaces are located on the opposite side of the electronic component, the number of the conductive bumps is four, the The conductive bumps are respectively formed on the upper surface and the lower surface of the two electrodes. 19. The multilayer circuit board with embedded components according to claim 15, wherein the shape of the conductive bump is conical, conical, triangular, triangular, polygonal, or Polygonal platform. 20. The multilayer circuit board with embedded components as claimed in claim 15, wherein the thickness of the electronic component is equal to or slightly smaller than the depth of the mounting hole.