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CN105522283B - A kind of control method of the parameters of laser cutting based on temperature field, apparatus and system - Google Patents

A kind of control method of the parameters of laser cutting based on temperature field, apparatus and system Download PDF

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CN105522283B
CN105522283B CN201511021496.1A CN201511021496A CN105522283B CN 105522283 B CN105522283 B CN 105522283B CN 201511021496 A CN201511021496 A CN 201511021496A CN 105522283 B CN105522283 B CN 105522283B
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temperature
temperature field
laser cutting
laser
distribution data
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CN105522283A (en
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段爱琴
巩水利
陈新松
陈俐
王彬
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AVIC Manufacturing Technology Institute
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AVIC Beijing Aeronautical Manufacturing Technology Research Institute
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
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    • G06F30/17Mechanical parametric or variational design

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Abstract

The invention provides a kind of control method of the parameters of laser cutting based on temperature field, apparatus and system, it is related to laser cutting technique field.Method includes obtaining cutting zone thermo parameters method data by infrared thermal imagery system, and determines according to the thermo parameters method data temperature value of each temperature spot in the temperature field;The control strategy of parameters of laser cutting is determined according to the temperature value of each temperature spot in the temperature field;The parameters of laser cutting is controlled according to the control strategy of the parameters of laser cutting, to cause laser cutter to cut workpiece to be cut according to the parameters of laser cutting.The present invention can solve current parameters of laser cutting and only rely on laser cutting operation person rule of thumb manually adjust, and cause each point otherness in cutting path big, be difficult to realize the uniformity of kerf quality, easily cause the problem of workpiece quality is poor or scraps.

Description

Temperature field-based laser cutting parameter control method, device and system
Technical Field
The invention relates to the technical field of laser cutting, in particular to a method, a device and a system for controlling laser cutting parameters based on a temperature field.
Background
Currently, laser cutting is a thermal cutting method in which a workpiece is cut by irradiating the workpiece with a focused high-power-density laser beam to melt, vaporize, ablate, or reach the ignition point of the irradiated material, and simultaneously blowing off the molten material with a high-speed gas stream coaxial with the beam. The laser cutting technology has been widely applied in the field of workpiece cutting because of its advantages of high cutting speed, small heat affected zone, small workpiece deformation, no inertia of light beam, high-speed cutting, good verticality of cutting edge, etc., and has become one of the common means for processing various metal and non-metal parts.
In the existing mainstream laser cutting equipment, parameters which can be controlled or selected and have an influence on the cutting result are divided into two types, one type is equipment intrinsic parameters, including laser wavelength, beam mode, output mode (continuous or pulse, etc.), focused spot diameter, energy distribution thereof, and the like, and the factors are generally basically determined along with the purchase of the laser equipment. Another category is the parameters which can be selected during the machining process, including laser power, cutting speed, focal position, type and pressure of the auxiliary gas, distance between nozzle and workpiece, etc., which also have a decisive influence on the quality of the cut.
The current method of controlling these alternative parameter adjustments may be to preset these parameters in the machining program, and these parameter values are typically obtained empirically or through prior experimentation. These parameters can only be adjusted manually by the operator based on experience during the part machining process. However, when a large-scale complex space three-dimensional part is cut by laser, differences of all points in a cutting path are large, and cutting parameters are manually adjusted by an operator according to experience, so that the consistency of the quality of a cut is difficult to realize, the width of the cut, particularly the thickness of a remelted layer and a heat affected zone is increased, even surface ablation or incomplete cutting is caused in severe cases, and the parts are out of tolerance and scrapped in allowance-free precision cutting.
Disclosure of Invention
The embodiment of the invention provides a method, a device and a system for controlling laser cutting parameters based on a temperature field, and aims to solve the problems that the difference of each point in a cutting path is large, the consistency of the quality of a cut is difficult to realize, and the quality of a workpiece is poor or the workpiece is easy to scrap because the current laser cutting parameters are manually adjusted only by a laser cutting operator according to experience.
In order to achieve the purpose, the invention adopts the following technical scheme:
a control method of laser cutting parameters based on a temperature field comprises the following steps:
acquiring temperature field distribution data of a cutting area through an infrared thermal imaging system, and determining temperature values of all temperature points in the temperature field according to the temperature field distribution data;
determining a control strategy of laser cutting parameters according to the temperature values of all temperature points in the temperature field;
and controlling the laser cutting parameters according to the control strategy of the laser cutting parameters, so that the laser cutter can cut the workpiece to be cut according to the laser cutting parameters.
Specifically, the infrared thermal imaging system comprises a first infrared camera and a second infrared camera which are distributed on two sides of the laser cutter;
the method comprises the following steps of acquiring temperature field distribution data of a cutting area through an infrared thermal imaging system, and determining temperature values of temperature points in the temperature field according to the temperature field distribution data, wherein the method comprises the following steps:
collecting temperature field distribution data of a cutting area through the first infrared camera, and determining a first temperature value of each temperature point in the temperature field;
collecting temperature field distribution data of a cutting area through the second infrared camera, and determining a second temperature value of each temperature point in the temperature field;
and comparing the first temperature value and the second temperature value of each temperature point in the temperature field, selecting the larger value of the first temperature value and the second temperature value of each temperature point, and taking the larger value as the temperature value of the temperature point.
Specifically, the determining a control strategy of the laser cutting parameters according to the temperature values of the temperature points in the temperature field includes:
if N is presentminT1<NT1<NmaxT1Determining that the control strategy is that the laser cutting parameters do not need to be adjusted and maintaining the current laser cutting parameters; wherein N isT1The temperature value of each temperature point in the temperature field is larger than T1Number of temperatures, NminT1Is a preset first temperature point number threshold value, NmaxT1Is a preset second temperature point number threshold value.
Further, determining a control strategy of the laser cutting parameters according to the temperature values of the temperature points in the temperature field, further comprising:
if N is presentT1≥NmaxT1And N isT2≥NmaxT2Determining that the control strategy is abnormal in the laser cutting process, and stopping cutting the workpiece to be cut; wherein N isT2The temperature value of each temperature point in the temperature field is larger than T2Number of temperatures, T2>T1,NmaxT2A preset third temperature point quantity threshold value;
if N is presentT1≥NmaxT1And N isT2<NmaxT2,NT3<NmaxT3Determining the control strategy to be a first preset percentage for reducing the laser power in the laser cutting parameters to the current laser power or a second preset percentage for increasing the cutting speed in the laser cutting parameters to the current cutting speed; wherein N isT3The temperature value of each temperature point in the temperature field is larger than T3Number of temperatures, T3<T1,NmaxT3A preset fourth temperature point quantity threshold value;
if N is presentT1≥NmaxT1And N isT2<NmaxT2,NT3≥NmaxT3And determining the control strategy to be a third preset percentage for increasing the laser power in the laser cutting parameters to the current laser power or a fourth preset percentage for decreasing the cutting speed in the laser cutting parameters to the current cutting speed.
Further, determining a control strategy of the laser cutting parameters according to the temperature values of the temperature points in the temperature field, further comprising:
if N is presentT1≤NminT1And determining that the control strategy is abnormal in the laser cutting process, and stopping cutting the workpiece to be cut.
In addition, after the cutting area temperature field distribution data is acquired through the infrared thermal imaging system, the method comprises the following steps:
according to uncertainty information of result change of the temperature field distribution data of the cutting area obtained by the infrared thermal imaging system and time delay information of the transmission of the temperature field distribution data of the cutting area from the laser cutting control device to the laser cutter, determining the maximum allowable variation range of the temperature field distribution data of the cutting area;
and removing the cutting area temperature field distribution data outside the maximum allowable variation range, and acquiring the cutting area temperature field distribution data within the maximum allowable variation range.
Specifically, according to the uncertainty information of the result change of the cutting area temperature field distribution data obtained by the infrared thermal imaging system and the time lag information of the cutting area temperature field distribution data transmitted between the laser cutting control device and the laser cutter, the maximum allowable variation range of the cutting area temperature field distribution data is determined, and the method comprises the following steps:
according to the formula:
determining the maximum allowable variation range of the temperature field distribution data of the cutting area, wherein αiUncertain parameters meeting robustness requirements for a control system of laser cutting parameters based on a temperature field;is αiThe mean value of (a);is αiDispersion of (2); thetarRobust reliability of control systems for laser cutting parameters based on temperature field, θr=min(||||)-1;min(||||) Is a non-probability reliability index of a control system of laser cutting parameters based on a temperature field.
A control device for laser cutting parameters based on temperature field, comprising:
the temperature field distribution data acquisition unit is used for acquiring temperature field distribution data of a cutting area through an infrared thermal imaging system and determining the temperature value of each temperature point in the temperature field according to the temperature field distribution data;
the control strategy determining unit is used for determining a control strategy of the laser cutting parameters according to the temperature values of the temperature points in the temperature field;
and the laser cutting parameter control unit is used for controlling the laser cutting parameters according to the control strategy of the laser cutting parameters so that the laser cutter can cut the workpiece to be cut according to the laser cutting parameters.
Specifically, the infrared thermal imaging system comprises a first infrared camera and a second infrared camera which are distributed on two sides of the laser cutter;
the temperature field distribution data acquisition unit comprises:
the first acquisition module is used for acquiring the distribution data of the temperature field of the cutting area through the first infrared camera and determining a first temperature value of each temperature point in the temperature field;
the second acquisition module is used for acquiring the distribution data of the temperature field of the cutting area through the second infrared camera and determining a second temperature value of each temperature point in the temperature field;
and the comparison module is used for comparing the first temperature value and the second temperature value of each temperature point in the temperature field, selecting the larger value of the first temperature value and the second temperature value of each temperature point, and taking the larger value as the temperature value of the temperature point.
In addition, the control strategy determination unit is specifically configured to:
in NminT1<NT1<NmaxT1When the laser cutting parameters are determined to be the laser cutting parameters, the laser cutting parameters are not required to be adjusted, and the current laser cutting parameters are maintained; wherein N isT1The temperature value of each temperature point in the temperature field is larger than T1Number of temperatures, NminT1Is a preset first temperature point number threshold value, NmaxT1Is a preset second temperature point number threshold value.
Further, the control strategy determination unit is further configured to:
in NT1≥NmaxT1And N isT2≥NmaxT2When the control strategy is determined to be abnormal in the laser cutting process, stopping cutting the workpiece to be cut; wherein N isT2The temperature value of each temperature point in the temperature field is larger than T2Number of temperatures, T2>T1,NmaxT2A preset third temperature point quantity threshold value;
in NT1≥NmaxT1And N isT2<NmaxT2,NT3<NmaxT3Then, determining the control strategy to reduce the laser power in the laser cutting parameters to a first preset percentage of the current laser power or increase the cutting speed in the laser cutting parametersA second preset percentage to the current cutting speed; wherein N isT3The temperature value of each temperature point in the temperature field is larger than T3Number of temperatures, T3<T1,NmaxT3A preset fourth temperature point quantity threshold value;
in NT1≥NmaxT1And N isT2<NmaxT2,NT3≥NmaxT3And then determining the control strategy to increase the laser power in the laser cutting parameters to a third preset percentage of the current laser power or decrease the cutting speed in the laser cutting parameters to a fourth preset percentage of the current cutting speed.
Further, the control strategy determination unit is further configured to:
in NT1≤NminT1And if so, determining that the control strategy is abnormal in the laser cutting process, and stopping cutting the workpiece to be cut.
In addition, the control device for the laser cutting parameters based on the temperature field further comprises a temperature field distribution data screening unit, which is used for:
according to uncertainty information of result change of the temperature field distribution data of the cutting area obtained by the infrared thermal imaging system and time delay information of the transmission of the temperature field distribution data of the cutting area from the laser cutting control device to the laser cutter, determining the maximum allowable variation range of the temperature field distribution data of the cutting area;
and removing the cutting area temperature field distribution data outside the maximum allowable variation range, and acquiring the cutting area temperature field distribution data within the maximum allowable variation range.
In addition, the temperature field distribution data screening unit is specifically configured to:
according to the formula:
determining the maximum allowable variation range of the temperature field distribution data of the cutting area, wherein αiUncertain parameters meeting robustness requirements for a control system of laser cutting parameters based on a temperature field;is αiThe mean value of (a);is αiDispersion of (2); thetarRobust reliability of control systems for laser cutting parameters based on temperature field, θr=min(||||)-1;min(||||) Is a non-probability reliability index of a control system of laser cutting parameters based on a temperature field.
A control system for laser cutting parameters based on a temperature field, comprising: the system comprises a laser cutter, an infrared thermal imaging system, a cutting platform, a laser cutting control device and an alternating current servo motor; the alternating current servo motor is used for driving the laser cutter;
the infrared thermal imaging system comprises a first infrared camera and a second infrared camera; the first infrared camera and the second infrared camera are distributed on two sides of the laser cutter so as to acquire temperature field distribution data sent by the laser cutter when the laser cutter cuts a workpiece to be cut; the cutting platform is positioned below the laser cutter;
the first infrared camera and the second infrared camera are respectively connected with the laser cutting control device through Ethernet; the laser cutting control device is connected with the alternating current servo motor and is connected with the laser cutter through a first I/O port.
In addition, the control system of the laser cutting parameters based on the temperature field also comprises a programmable logic controller;
the programmable logic controller is connected with the laser cutting control device;
and the programmable logic controller is respectively connected with a proportional servo valve and an automatic focusing system of the laser cutter through a second I/O port.
According to the control method, the device and the system for the laser cutting parameters based on the temperature field, provided by the embodiment of the invention, the control strategy of the laser cutting parameters can be determined through the temperature field distribution data of the cutting area during laser cutting, so that a laser cutting operator is not required to manually adjust various devices in laser cutting according to experience, and the problems that the difference of each point in a cutting path is large, the consistency of the quality of a cut is difficult to realize and the quality of a workpiece is poor or the workpiece is easy to scrap due to the fact that the current laser cutting parameters are manually adjusted only by the laser cutting operator according to experience are solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a first flowchart of a method for controlling laser cutting parameters based on a temperature field according to an embodiment of the present invention;
fig. 2 is a second flowchart of a method for controlling laser cutting parameters based on a temperature field according to an embodiment of the present invention;
fig. 3 is a first schematic structural diagram of a control device for laser cutting parameters based on a temperature field according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a control device for laser cutting parameters based on a temperature field according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a control system for laser cutting parameters based on a temperature field according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, an embodiment of the present invention provides a method for controlling laser cutting parameters based on a temperature field, including:
step 101, acquiring temperature field distribution data of a cutting area through an infrared thermal imaging system, and determining temperature values of temperature points in a temperature field according to the temperature field distribution data.
And 102, determining a control strategy of laser cutting parameters according to the temperature values of all temperature points in the temperature field.
And 103, controlling the laser cutting parameters according to the control strategy of the laser cutting parameters so that the laser cutter can cut the workpiece to be cut according to the laser cutting parameters.
According to the control method of the laser cutting parameters based on the temperature field, provided by the embodiment of the invention, the control strategy of the laser cutting parameters can be determined through the temperature field distribution data of the cutting area during laser cutting, so that a laser cutting operator is not required to manually adjust various devices in laser cutting according to experience, and the problems that the difference of each point in a cutting path is large, the consistency of the quality of a cut is difficult to realize, and the quality of a workpiece is poor or the workpiece is easy to scrap due to the fact that the current laser cutting parameters are manually adjusted only by the laser cutting operator according to experience are solved.
In order to make those skilled in the art better understand the present invention, a more detailed embodiment is listed below, and as shown in fig. 2, an embodiment of the present invention provides a method for controlling laser cutting parameters based on a temperature field, including:
step 201, collecting cutting area temperature field distribution data through a first infrared camera, and collecting cutting area temperature field distribution data through a second infrared camera.
Specifically, the specification of the data points of the temperature field distribution data collected by each infrared camera here may be 512 × 512 pixels, and the size of each data point is 0.07 mm/pixel. Thus, 262144 pixel points are collected by one infrared camera.
Here, the infrared thermography system comprises a first infrared camera and a second infrared camera distributed at both sides of the laser cutter; therefore, the two infrared cameras are used for collecting the temperature field distribution data of the cutting area, and the influence of the change of the nozzle shadow on the temperature field distribution data caused by different cutting directions can be eliminated.
Step 202, according to the uncertainty information of the result change of the temperature field distribution data of the cutting area obtained by the infrared thermal imaging system and the time lag information of the transmission of the temperature field distribution data of the cutting area from the laser cutting control device to the laser cutter, determining the maximum allowable variation range of the temperature field distribution data of the cutting area.
Specifically, according to the uncertainty information of the result change of the cutting area temperature field distribution data obtained by the infrared thermal imaging system and the time lag information of the cutting area temperature field distribution data transmitted between the laser cutting control device and the laser cutter, the maximum allowable variation range of the cutting area temperature field distribution data is determined, and the method comprises the following steps:
here, the following equation may be used:
determining the maximum allowable variation range of the temperature field distribution data of the cutting area, wherein αiUncertain parameters meeting robustness requirements for a control system of laser cutting parameters based on a temperature field;is αiThe mean value of (a);is αiDispersion of (2); thetarRobust reliability of control systems for laser cutting parameters based on temperature field, θr=min(||||)-1;min(||||) Is a non-probability reliability index of a control system of laser cutting parameters based on a temperature field.
It should be noted that, because the embodiment of the present invention needs to adjust the laser cutting parameters, unstable states such as oscillation of the whole system may occur, and therefore, in order to ensure the stability of the adjustment of the laser cutting parameters, the uncertainty of the change of the result of the thermal infrared imaging system acquiring the temperature field distribution data of the cutting area and the time lag of the transmission of the temperature field distribution data of the cutting area between the laser cutting control device and the laser cutter need to be analyzed.
According to the robust control theory, the result of the temperature field distribution data of the cutting area obtained by the infrared thermal imaging system is defined as α (t), so that α (t) is α in the detection interval01(t),(t)∈[-1,1]Wherein α0α (t) mean value α1α (t) is the dispersion and (t) is the normalized interval variable.
Thus, the non-probabilistic reliability index of the control system for laser cutting parameters based on temperature field can be expressed as:
θnp=min(||||)
laser based on temperature fieldRobust reliability of the control system of the cutting parameters, thetar=min(||||)-1。
In addition, the control system of the laser cutting parameters based on the temperature field controls the power output of the laser, which is generally realized by fast I/O, and the refresh of the fast I/O is realized by a digital control loop, so that the process of sending a signal to the response of the laser by the control system of the laser cutting parameters based on the temperature field can be basically regarded as a definite time lag, and for this, the following steps are carried out:
z(t)=Cx(t)+Cex(t-e)+Dw(t)
wherein, x (t) ∈ RmIs the state vector of the system, w (t) ∈ RqExternal disturbances of finite energy, i.e. w (t) ∈ L2[0,∞),z(t)∈RpAnd is called to be output for the system. A, A thereine、B、C、CeD is a known matrix of appropriate dimensions, e>0 is the lag time.
For a control system of laser cutting parameters based on a temperature field, a constant gamma >0 is given, and if symmetric positive definite matrixes rho >0 and S >0 exist, the following formula is established:
the control system of the laser cutting parameters based on the temperature field has H-infinity performance gamma.
The control system of the laser cutting parameters based on the temperature field can be provided with an upper computer, the cutting area temperature field distribution data collected by the infrared camera can be processed through software in the upper computer, and the upper computer and the control device of the laser cutting parameters at the rear end can be connected through the Ethernet, so that the processing result of the upper computer is transmitted to the control device of the laser cutting parameters. For a single image, the processing time of the software, and the resulting delivery time of the ethernet are indeterminate, which can be considered to be an indeterminate skew system, namely:
z(t)=Cx(t)+Cex(t-e)+D1w(t)+D2u(t)
wherein u (t) ∈ RrFor control input of the system, a state feedback controller is adopted: u (t) ═ kx (t). The closed loop system formed by the controller applied to the system is as follows:
x(t)=Ac(α)x(t)+Ae(α)x(t-e)+B1(α)w(t)
z(t)=Ccx(t)+Cex(t-e)+D1w(t)
wherein A isc(α)=A(α)+B2(α)K;Cc=C+D2K
All the time-varying uncertainty parameters α (t) of the control system of the laser cutting parameters based on the temperature field can be defined by its upper and lower bounds, can be described as interval variables, and can be expressed in a standardized form, thereby expressing the system matrix as an affine matrix function form as follows:
Ac(α)=Ac()=A0+∑iAi i(t)
Ae(α)=Ae()=Ad0+∑jAej j(t)
B1(α)=B1()=B10+∑kA1k k(t)
B2(α)=B2()=B20+∑lA2l l(t)
summarizing (t) as if there were symmetric positive definite matrices ρ >0 and S >0 for a time-varying uncertainty time-lag system and given a constant γ >0, the following equation holds:
where "β" denotes the transpose of the symmetric matrix block.
Wherein,
from the viewpoint of control performanceWhen established, the system is reliable, so the functional function of the control system performance reliability analysis based on the laser cutting parameters of the temperature field can be defined as:
here, the following are defined:
will be provided withExpressed as: m (), P, S, so that the robust reliability of the control system for laser cutting parameters based on the temperature field can be solved by the following optimization problem:
the robust reliability theta of the control system of the laser cutting parameter based on the temperature field can be obtained by an LMI method and a non-probability reliability index solving methodr=min(||||) -1. Further, the following formula may be used:
and determining the maximum allowable variation range of the temperature field distribution data of the cutting area.
And step 203, removing the cutting area temperature field distribution data outside the maximum allowable variation range, and acquiring the cutting area temperature field distribution data within the maximum allowable variation range.
In this way, the interference of the discrete cutting area temperature field distribution data on the final result can be avoided.
And 204, determining a first temperature value of each temperature point in the temperature field according to the cutting region temperature field distribution data within the maximum allowable variation range acquired by the first infrared camera, and determining a second temperature value of each temperature point in the temperature field according to the cutting region temperature field distribution data within the maximum allowable variation range acquired by the second infrared camera.
Step 205, comparing the first temperature value and the second temperature value of each temperature point in the temperature field, selecting the larger value of the first temperature value and the second temperature value of each temperature point, and taking the larger value as the temperature value of the temperature point.
After step 205, step 206, step 207, step 208, step 209 or step 210 is performed.
Step 206, if NminT1<NT1<NmaxT1Determining that the control strategy is that the laser cutting parameters do not need to be adjusted and the current laser cutting parameters are maintained; wherein N isT1The temperature value of each temperature point in the temperature field is larger than T1Number of temperatures, e.g. T1The temperature can be 300 ℃, NminT1Is a preset first temperature point number threshold, for example, 1000, NmaxT1The threshold value for the number of second temperature points is preset, and may be 2500, for example.
Step 207, if NT1≥NmaxT1And N isT2≥NmaxT2Determining that the control strategy is abnormal in the laser cutting process, and stopping cutting the workpiece to be cut; wherein N isT2The temperature value of each temperature point in the temperature field is larger than T2Number of temperatures, T2>T1E.g. T2May be 400 ℃ and NmaxT2The threshold value for the number of third temperature points is preset, and may be 100, for example.
Step 208, if NT1≥NmaxT1And N isT2<NmaxT2,NT3<NmaxT3And determining the control strategy to reduce the laser power in the laser cutting parameters to a first preset percentage of the current laser power or increase the cutting speed in the laser cutting parameters to a second preset percentage of the current cutting speed. Wherein N isT3The temperature value of each temperature point in the temperature field is larger than T3Number of temperatures, T3<T1E.g. T3At 200 ℃ NmaxT3The threshold value is a preset fourth temperature point number threshold value, and for example, can be 11000. The first and second predetermined percentages may be 10%, but are not limited thereto.
Step 209, if NT1≥NmaxT1And N isT2<NmaxT2,NT3≥NmaxT3And determining the control strategy to increase the laser power in the laser cutting parameters to a third preset percentage of the current laser power or decrease the cutting speed in the laser cutting parameters to a fourth preset percentage of the current cutting speed. The third and fourth predetermined percentages may also be 10%, but are not limited thereto.
Step 210, if NT1≤NminT1And determining that the control strategy is abnormal in the laser cutting process, and stopping cutting the workpiece to be cut. After step 206, step 207, step 208, step 209 and step 210, step 211 is performed.
And step 211, controlling the laser cutting parameters according to the control strategy of the laser cutting parameters, so that the laser cutter can cut the workpiece to be cut according to the laser cutting parameters.
According to the control method of the laser cutting parameters based on the temperature field, provided by the embodiment of the invention, the control strategy of the laser cutting parameters can be determined through the temperature field distribution data of the cutting area during laser cutting, so that a laser cutting operator is not required to manually adjust various devices in laser cutting according to experience, and the problems that the difference of each point in a cutting path is large, the consistency of the quality of a cut is difficult to realize, and the quality of a workpiece is poor or the workpiece is easy to scrap due to the fact that the current laser cutting parameters are manually adjusted only by the laser cutting operator according to experience are solved.
Corresponding to the method embodiments shown in fig. 1 and fig. 2, as shown in fig. 3, an embodiment of the present invention further provides a control device for laser cutting parameters based on a temperature field, including:
the temperature field distribution data acquisition unit 31 may acquire temperature field distribution data of the cutting region through the infrared thermal imaging system, and determine a temperature value of each temperature point in the temperature field according to the temperature field distribution data.
The control strategy determination unit 32 may determine the control strategy of the laser cutting parameters according to the temperature values of the temperature points in the temperature field.
The laser cutting parameter control unit 33 may control the laser cutting parameters according to a control strategy of the laser cutting parameters, so that the laser cutter cuts the workpiece to be cut according to the laser cutting parameters.
Specifically, the infrared thermography system comprises a first infrared camera and a second infrared camera which are distributed on two sides of the laser cutter.
As shown in fig. 4, the temperature field distribution data acquisition unit 31 may include:
the first collecting module 311 may collect the cutting region temperature field distribution data through a first infrared camera, and determine a first temperature value of each temperature point in the temperature field.
The second collecting module 312 may collect the distribution data of the temperature field of the cutting region through a second infrared camera, and determine a second temperature value of each temperature point in the temperature field.
The comparing module 313 may compare the first temperature value and the second temperature value of each temperature point in the temperature field, select a larger value of the first temperature value and the second temperature value of each temperature point, and use the larger value as the temperature value of the temperature point.
In addition, the control policy determining unit 32 may specifically:
in NminT1<NT1<NmaxT1Determining the control strategy to be the laser cutting parameter without adjustment, and maintaining the current laser cutting parameter; wherein N isT1The temperature value of each temperature point in the temperature field is larger than T1Number of temperatures, NminT1Is a preset first temperature point number threshold value, NmaxT1Is a preset second temperature point number threshold value.
Further, the control strategy determination unit 32 may further:
in NT1≥NmaxT1And N isT2≥NmaxT2Determining the control strategy as a laser cutting processStopping cutting the workpiece to be cut if the workpiece to be cut is abnormal; wherein N isT2The temperature value of each temperature point in the temperature field is larger than T2Number of temperatures, T2>T1,NmaxT2Is a preset third temperature point number threshold value.
In NT1≥NmaxT1And N isT2<NmaxT2,NT3<NmaxT3Determining a control strategy to reduce the laser power in the laser cutting parameters to a first preset percentage of the current laser power or increase the cutting speed in the laser cutting parameters to a second preset percentage of the current cutting speed; wherein N isT3The temperature value of each temperature point in the temperature field is larger than T3Number of temperatures, T3<T1,NmaxT3Is a preset fourth temperature point number threshold value.
In NT1≥NmaxT1And N isT2<NmaxT2,NT3≥NmaxT3And then, determining the control strategy to increase the laser power in the laser cutting parameters to a third preset percentage of the current laser power or decrease the cutting speed in the laser cutting parameters to a fourth preset percentage of the current cutting speed.
Further, the control strategy determination unit 32 may further:
in NT1≤NminT1And when the control strategy is determined to be that the laser cutting process is abnormal, stopping cutting the workpiece to be cut.
In addition, as shown in fig. 4, the control device for laser cutting parameters based on temperature field further includes a temperature field distribution data screening unit 34, which can:
and determining the maximum allowable variation range of the distribution data of the temperature field of the cutting area according to the uncertainty information of the result change of the distribution data of the temperature field of the cutting area obtained by the infrared thermal imaging system and the time lag information of the transmission of the distribution data of the temperature field of the cutting area from the laser cutting control device to the laser cutter.
And removing the cutting area temperature field distribution data outside the maximum allowable variation range, and acquiring the cutting area temperature field distribution data within the maximum allowable variation range.
In addition, the temperature field distribution data screening unit 34 may specifically:
according to the formula:
determining the maximum allowable variation range of the temperature field distribution data of the cutting area, wherein αiUncertain parameters meeting robustness requirements for a control system of laser cutting parameters based on a temperature field;is αiThe mean value of (a);is αiDispersion of (2); thetarRobust reliability of control systems for laser cutting parameters based on temperature field, θr=min(||||)-1;min(||||) Is a non-probability reliability index of a control system of laser cutting parameters based on a temperature field.
It should be noted that, for a specific implementation manner of the control device for laser cutting parameters based on a temperature field according to the embodiment of the present invention, reference may be made to the method embodiments corresponding to fig. 1 and fig. 2, which are not described herein again.
The control device for the laser cutting parameters based on the temperature field can determine the control strategy of the laser cutting parameters through the temperature field distribution data of the cutting area during laser cutting, so that a laser cutting operator is not required to manually adjust various devices in laser cutting according to experience, and the problems that the difference of each point in a cutting path is large, the consistency of the quality of a cut is difficult to realize, and the quality of a workpiece is poor or the workpiece is easy to scrap due to the fact that the current laser cutting parameters are manually adjusted only by the laser cutting operator according to experience are solved.
As shown in fig. 5, an embodiment of the present invention provides a control system 40 for laser cutting parameters based on a temperature field, including: a laser cutter 41, an infrared thermal imaging system 42, a cutting platform 43, a laser cutting control device 44 and an alternating current servo motor 45; the ac servo motor 45 may drive the laser cutter 41.
The infrared thermal imaging system 42 includes a first infrared camera 421 and a second infrared camera 422. The first infrared camera 421 and the second infrared camera 422 are distributed at two sides of the laser cutter 41 to acquire temperature field distribution data sent by the laser cutter 41 when cutting a workpiece to be cut; the cutting platform 43 is located below the laser cutter 41.
The first infrared camera 421 and the second infrared camera 422 are respectively connected with the laser cutting control device 44 through ethernet; the laser cutting control device 44 is connected to an ac servo motor 45 and to the laser cutter 41 through a first I/O port 46.
In addition, the control system 40 for laser cutting parameters based on temperature field further comprises a programmable logic controller 47. The programmable logic controller 47 is connected to the laser cutting control device 44. The programmable logic controller 47 is connected to a proportional servo valve 49 of the laser cutter 41 and an auto focus system 50 through a second I/O port 48, respectively.
It should be noted that the laser cutting control device 44 may include, but is not limited to, an upper computer, a digital control system, and a driving system.
The control system for the laser cutting parameters based on the temperature field provided by the embodiment of the invention can determine the control strategy of the laser cutting parameters through the temperature field distribution data of the cutting area during laser cutting, so that a laser cutting operator is not required to manually adjust various devices in laser cutting according to experience, and the problems that the difference of each point in a cutting path is large, the consistency of the quality of a cut is difficult to realize, and the quality of a workpiece is poor or the workpiece is easy to scrap due to the fact that the current laser cutting parameters are manually adjusted only by the laser cutting operator according to experience are solved.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
The principle and the implementation mode of the invention are explained by applying specific embodiments in the invention, and the description of the embodiments is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims (12)

1. A control method of laser cutting parameters based on a temperature field is characterized by comprising the following steps:
acquiring temperature field distribution data of a cutting area through an infrared thermal imaging system, and determining temperature values of all temperature points in the temperature field according to the temperature field distribution data;
determining a control strategy of laser cutting parameters according to the temperature values of all temperature points in the temperature field;
controlling the laser cutting parameters according to the control strategy of the laser cutting parameters, so that a laser cutter can cut a workpiece to be cut according to the laser cutting parameters;
after acquiring the temperature field distribution data of the cutting area through the infrared thermal imaging system, the method comprises the following steps:
according to uncertainty information of result change of the temperature field distribution data of the cutting area obtained by the infrared thermal imaging system and time delay information of the transmission of the temperature field distribution data of the cutting area from the laser cutting control device to the laser cutter, determining the maximum allowable variation range of the temperature field distribution data of the cutting area;
and removing the cutting area temperature field distribution data outside the maximum allowable variation range, and acquiring the cutting area temperature field distribution data within the maximum allowable variation range.
2. The method for controlling the temperature field-based laser cutting parameters according to claim 1, wherein the infrared thermography system comprises a first infrared camera and a second infrared camera distributed at two sides of a laser cutter;
the method comprises the following steps of acquiring temperature field distribution data of a cutting area through an infrared thermal imaging system, and determining temperature values of temperature points in the temperature field according to the temperature field distribution data, wherein the method comprises the following steps:
collecting temperature field distribution data of a cutting area through the first infrared camera, and determining a first temperature value of each temperature point in the temperature field;
collecting temperature field distribution data of a cutting area through the second infrared camera, and determining a second temperature value of each temperature point in the temperature field;
and comparing the first temperature value and the second temperature value of each temperature point in the temperature field, selecting the larger value of the first temperature value and the second temperature value of each temperature point, and taking the larger value as the temperature value of the temperature point.
3. The method for controlling the laser cutting parameters based on the temperature field according to claim 1, wherein the determining the control strategy of the laser cutting parameters according to the temperature values of the temperature points in the temperature field comprises:
if N is presentminT1<NT1<NmaxT1Determining that the control strategy is that the laser cutting parameters do not need to be adjusted and maintaining the current laser cutting parameters; wherein N isT1The temperature value of each temperature point in the temperature field is larger than T1Number of temperatures, NminT1Is a preset first temperature point number threshold value, NmaxT1Is a preset second temperature point number threshold value.
4. The method for controlling laser cutting parameters based on the temperature field according to claim 3, wherein the determining the control strategy of the laser cutting parameters according to the temperature value of each temperature point in the temperature field further comprises:
if N is presentT1≥NmaxT1And N isT2≥NmaxT2Determining that the control strategy is abnormal in the laser cutting process, and stopping cutting the workpiece to be cut; wherein N isT2The temperature value of each temperature point in the temperature field is larger than T2Number of temperatures, T2>T1,NmaxT2A preset third temperature point quantity threshold value;
if N is presentT1≥NmaxT1And N isT2<NmaxT2,NT3<NmaxT3Determining the control strategy to be a first preset percentage for reducing the laser power in the laser cutting parameters to the current laser power or a second preset percentage for increasing the cutting speed in the laser cutting parameters to the current cutting speed; wherein N isT3The temperature value of each temperature point in the temperature field is larger than T3Number of temperatures, T3<T1,NmaxT3A preset fourth temperature point quantity threshold value;
if N is presentT1≥NmaxT1And N isT2<NmaxT2,NT3≥NmaxT3Determining the control strategy to increase the laser power in the laser cutting parameters to a third preset percentage of the current laser power or to increase the laser cutting parametersTo a fourth preset percentage of the current cutting speed.
5. The method for controlling laser cutting parameters based on the temperature field according to claim 4, wherein the determining the control strategy of the laser cutting parameters according to the temperature value of each temperature point in the temperature field further comprises:
if N is presentT1≤NminT1And determining that the control strategy is abnormal in the laser cutting process, and stopping cutting the workpiece to be cut.
6. The method for controlling the temperature field-based laser cutting parameters according to claim 5, wherein the maximum allowable variation range of the cutting region temperature field distribution data is determined according to uncertainty information of the variation of the result of the cutting region temperature field distribution data obtained by the infrared thermography system and time lag information of the transmission of the cutting region temperature field distribution data from the laser cutting control device to the laser cutter, and the method comprises the following steps:
according to the formula:
<mrow> <msub> <mi>&amp;alpha;</mi> <mi>i</mi> </msub> <mo>=</mo> <msubsup> <mi>&amp;alpha;</mi> <mi>i</mi> <mi>c</mi> </msubsup> <mo>+</mo> <mrow> <mo>(</mo> <msub> <mi>&amp;theta;</mi> <mi>r</mi> </msub> <mo>+</mo> <mn>1</mn> <mo>)</mo> </mrow> <msubsup> <mi>&amp;alpha;</mi> <mi>i</mi> <mi>r</mi> </msubsup> <msub> <mi>&amp;delta;</mi> <mi>i</mi> </msub> <mo>,</mo> <mrow> <mo>(</mo> <mo>|</mo> <msub> <mi>&amp;delta;</mi> <mi>i</mi> </msub> <mo>|</mo> <mo>&amp;le;</mo> <mn>1</mn> <mo>)</mo> </mrow> </mrow>
determining the maximum allowable variation range of the temperature field distribution data of the cutting area, wherein αiUncertain parameters for satisfying robustness requirements for control systems of laser cutting parameters based on temperature field;Is αiThe mean value of (a);is αiDispersion of (2); thetarRobust reliability of control systems for laser cutting parameters based on temperature field, θr=min(||||)-1;min(||||) Is a non-probability reliability index of a control system of laser cutting parameters based on a temperature field.
7. A control device of laser cutting parameters based on a temperature field is characterized by comprising:
the temperature field distribution data acquisition unit is used for acquiring temperature field distribution data of a cutting area through an infrared thermal imaging system and determining the temperature value of each temperature point in the temperature field according to the temperature field distribution data;
the control strategy determining unit is used for determining a control strategy of the laser cutting parameters according to the temperature values of the temperature points in the temperature field;
the laser cutting parameter control unit is used for controlling the laser cutting parameters according to the control strategy of the laser cutting parameters so that the laser cutter can cut the workpiece to be cut according to the laser cutting parameters;
the temperature field distribution data screening unit is used for determining the maximum allowable variation range of the cutting area temperature field distribution data according to the uncertainty information of the result variation of the cutting area temperature field distribution data acquired by the infrared thermal imaging system and the time delay information of the transmission of the cutting area temperature field distribution data from the laser cutting control device to the laser cutter; and removing the cutting area temperature field distribution data outside the maximum allowable variation range, and acquiring the cutting area temperature field distribution data within the maximum allowable variation range.
8. The control device for the temperature field based laser cutting parameters according to claim 7, wherein the infrared thermography system comprises a first infrared camera and a second infrared camera distributed at two sides of the laser cutter;
the temperature field distribution data acquisition unit comprises:
the first acquisition module is used for acquiring the distribution data of the temperature field of the cutting area through the first infrared camera and determining a first temperature value of each temperature point in the temperature field;
the second acquisition module is used for acquiring the distribution data of the temperature field of the cutting area through the second infrared camera and determining a second temperature value of each temperature point in the temperature field;
and the comparison module is used for comparing the first temperature value and the second temperature value of each temperature point in the temperature field, selecting the larger value of the first temperature value and the second temperature value of each temperature point, and taking the larger value as the temperature value of the temperature point.
9. The device for controlling laser cutting parameters based on a temperature field according to claim 7, wherein the control strategy determination unit is specifically configured to:
in NminT1<NT1<NmaxT1When the laser cutting parameters are determined to be the laser cutting parameters, the laser cutting parameters are not required to be adjusted, and the current laser cutting parameters are maintained; wherein N isT1The temperature value of each temperature point in the temperature field is larger than T1Number of temperatures, NminT1Is a preset first temperature point number threshold value, NmaxT1Is a preset second temperature point number threshold value.
10. The apparatus for controlling parameters of laser cutting based on temperature field according to claim 9, wherein the control strategy determining unit is further configured to:
in NT1≥NmaxT1And N isT2≥NmaxT2When the control strategy is determined to be abnormal in the laser cutting process, stopping cutting the workpiece to be cut; wherein N isT2The temperature value of each temperature point in the temperature field is larger than T2Number of temperatures, T2>T1,NmaxT2A preset third temperature point quantity threshold value;
in NT1≥NmaxT1And N isT2<NmaxT2,NT3<NmaxT3Determining the control strategy to be a first preset percentage for reducing the laser power in the laser cutting parameters to the current laser power or a second preset percentage for increasing the cutting speed in the laser cutting parameters to the current cutting speed; wherein N isT3The temperature value of each temperature point in the temperature field is larger than T3Number of temperatures, T3<T1,NmaxT3A preset fourth temperature point quantity threshold value;
in NT1≥NmaxT1And N isT2<NmaxT2,NT3≥NmaxT3And then determining the control strategy to increase the laser power in the laser cutting parameters to a third preset percentage of the current laser power or decrease the cutting speed in the laser cutting parameters to a fourth preset percentage of the current cutting speed.
11. The apparatus for controlling parameters of laser cutting based on temperature field according to claim 10, wherein the control strategy determining unit is further configured to:
in NT1≤NminT1And if so, determining that the control strategy is abnormal in the laser cutting process, and stopping cutting the workpiece to be cut.
12. The control device for laser cutting parameters based on a temperature field according to claim 11, wherein the temperature field distribution data screening unit is specifically configured to:
according to the formula:
<mrow> <msub> <mi>&amp;alpha;</mi> <mi>i</mi> </msub> <mo>=</mo> <msubsup> <mi>&amp;alpha;</mi> <mi>i</mi> <mi>c</mi> </msubsup> <mo>+</mo> <mrow> <mo>(</mo> <msub> <mi>&amp;theta;</mi> <mi>r</mi> </msub> <mo>+</mo> <mn>1</mn> <mo>)</mo> </mrow> <msubsup> <mi>&amp;alpha;</mi> <mi>i</mi> <mi>r</mi> </msubsup> <msub> <mi>&amp;delta;</mi> <mi>i</mi> </msub> <mo>,</mo> <mrow> <mo>(</mo> <mo>|</mo> <msub> <mi>&amp;delta;</mi> <mi>i</mi> </msub> <mo>|</mo> <mo>&amp;le;</mo> <mn>1</mn> <mo>)</mo> </mrow> </mrow>
determining the maximum allowable variation range of the temperature field distribution data of the cutting area, wherein αiUncertain parameters meeting robustness requirements for a control system of laser cutting parameters based on a temperature field;is αiThe mean value of (a);is αiDispersion of (2); thetarRobust reliability of control systems for laser cutting parameters based on temperature field, θr=min(||||)-1;min(||||) Is a non-probability reliability index of a control system of laser cutting parameters based on a temperature field.
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