CN105504742A - Method for preparing novel enhanced polycarbonate material by using waste/used compact discs and printed circuit boards - Google Patents
Method for preparing novel enhanced polycarbonate material by using waste/used compact discs and printed circuit boards Download PDFInfo
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- 229920000515 polycarbonate Polymers 0.000 title claims abstract description 32
- 239000004417 polycarbonate Substances 0.000 title claims abstract description 32
- 239000002699 waste material Substances 0.000 title claims abstract description 32
- 239000000463 material Substances 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims description 24
- 239000013528 metallic particle Substances 0.000 claims abstract description 21
- 230000003287 optical effect Effects 0.000 claims abstract description 21
- 239000002245 particle Substances 0.000 claims abstract description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 5
- 239000008187 granular material Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 239000000243 solution Substances 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 238000001746 injection moulding Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 238000004064 recycling Methods 0.000 abstract description 10
- 238000002156 mixing Methods 0.000 abstract description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 7
- 239000002585 base Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000000053 physical method Methods 0.000 description 3
- 238000011069 regeneration method Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 230000008929 regeneration Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 231100000357 carcinogen Toxicity 0.000 description 1
- 239000003183 carcinogenic agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- 238000010169 landfilling Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/20—Recycled plastic
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
Abstract
本发明涉及废弃光盘和破碎印刷电路板产生的非金属颗粒的回收利用,属于废弃物再生利用的技术领域。本发明基于由废光盘处理得到的聚碳酸酯材料和由印刷线路板得到的非金属颗粒两种废料,控制非金属颗粒的粒度为50~200目,添加比例10%~15%条件进行两种废料的混合,得到新型的非金属颗粒增强的聚碳酸酯材料。由于回收利用的废光盘得到的聚碳酸酯材料的机械强度大幅度下降以致不符合聚碳酸酯材料应用强度要求的,而本发明既实现了两种废料的资源化,又得到了机械强度符合聚碳酸酯材料使用标准的新型非金属颗粒增强聚碳酸酯材料。The invention relates to the recycling of non-metallic particles produced by discarded CDs and broken printed circuit boards, and belongs to the technical field of waste recycling. The present invention is based on two kinds of waste materials: polycarbonate material obtained from waste optical discs and non-metallic particles obtained from printed circuit boards, the particle size of non-metallic particles is controlled to be 50-200 mesh, and the addition ratio is 10%-15%. The blending of waste materials resulted in a novel non-metallic particle-reinforced polycarbonate material. Because the mechanical strength of the polycarbonate material obtained from the recycling of waste optical disks is greatly reduced, it does not meet the application strength requirements of polycarbonate materials. However, the present invention not only realizes the recycling of two kinds of waste materials, but also obtains a mechanical strength that meets the requirements of polycarbonate materials. Carbonate materials use standard new non-metallic particle reinforced polycarbonate materials.
Description
技术领域technical field
本发明涉及废弃光盘和破碎印刷电路板产生的非金属颗粒的回收利用,属于废物再生利用和新型材料合成的技术领域。The invention relates to the recovery and utilization of non-metallic particles produced by waste CDs and broken printed circuit boards, and belongs to the technical field of waste recycling and synthesis of new materials.
背景技术Background technique
随着光盘产业的迅猛发展,光盘产量和消费量还在不断增加,直接导致废旧光盘的逐年堆积。光盘是由多层组分材料组成的复合产品,在盘基上依次附着记录、反射、印刷一级防护等功能层,但各功能层的性质相差很大且不同类型光盘的制造材料也有所不同。光盘按其功能分为不可擦写光盘,如CD-ROM,DVD-ROM和可擦写光盘,如CD-RW,DVD-RAM以及写入式光盘CD-R。就CD而言,其基本结构由聚碳酸酯(PC)衬底,铝反射层和紫外线固化胶(UV)三层组成,材料组成中至少有93%以上的是聚碳酸酯,还包含少量锌、硅、金及银等多种有用元素。With the rapid development of the optical disc industry, the output and consumption of optical discs are still increasing, which directly leads to the accumulation of waste optical discs year by year. The optical disc is a composite product composed of multi-layer component materials. Functional layers such as recording, reflection, and printing primary protection are attached to the disc base in sequence, but the properties of each functional layer vary greatly, and the manufacturing materials of different types of optical discs are also different. . Optical discs are divided into non-rewritable optical discs according to their functions, such as CD-ROM, DVD-ROM and rewritable optical discs, such as CD-RW, DVD-RAM, and rewritable optical discs CD-R. As far as CD is concerned, its basic structure consists of three layers of polycarbonate (PC) substrate, aluminum reflective layer and ultraviolet curing glue (UV). At least 93% of the material composition is polycarbonate, and it also contains a small amount of zinc , silicon, gold and silver and other useful elements.
目前对废旧光盘资源化技术分为物理法和化学法。物理方法主要为机械破碎法,直接应用机械装置对光盘进行摩擦,将表面层和反射层从光盘磨去。此种方法选择面较宽,原料不需分类,可实现全自动化。缺点是耗损率打,而且无法回收反射层中金属。化学法是利用碱或酸等剥离剂与反射层的金属反应,使生成物可溶入溶液,同时将保护胶层和印刷层剥离下来该法损耗率低,可回收金属,直接成本低廉,但可能造成剥离剂的二次污染。物理法和化学法最后都会得到光盘盘基聚碳酸酯PC材料,对PC的处理主要分为焚烧法、填埋法和熔融再生法。焚烧法虽然有处理量大、效率高等优点,但焚烧后会产生大量的有害气体,包括致癌物质,对大气和环境造成危害,并且设备投资维护费用高昂。而聚碳酸酯属于高分子聚合物,在环境中难以降解,填埋法并不是一种合理的处理方法。熔融再生是将聚碳酸酯进行破碎干燥挤出造粒进行熔融再生制作新的PC产品。At present, there are physical methods and chemical methods for recycling waste discs. The physical method is mainly a mechanical crushing method, which directly applies a mechanical device to rub the optical disc to remove the surface layer and the reflective layer from the optical disc. This method has a wide range of options, and the raw materials do not need to be classified, and can be fully automated. The disadvantage is that the loss rate is high, and the metal in the reflective layer cannot be recovered. The chemical method is to use a stripping agent such as alkali or acid to react with the metal of the reflective layer, so that the product can be dissolved into the solution, and at the same time, the protective adhesive layer and the printing layer are peeled off. This method has low loss rate, recyclable metal, and low direct cost, but It may cause secondary pollution of the stripper. The physical method and chemical method will finally get the disc-based polycarbonate PC material, and the treatment of PC is mainly divided into incineration method, landfill method and melting regeneration method. Although the incineration method has the advantages of large processing capacity and high efficiency, it will produce a large amount of harmful gases after incineration, including carcinogens, causing harm to the atmosphere and the environment, and the equipment investment and maintenance costs are high. However, polycarbonate is a high molecular polymer, which is difficult to degrade in the environment, and landfilling is not a reasonable disposal method. Melt regeneration is to crush, dry, extrude and granulate polycarbonate for melt regeneration to produce new PC products.
印刷电路板作为电子产品不可或缺的一部分,其基板材料通常为玻璃纤维强化酚醛树脂或环氧树脂,其上焊接各种构件,其中包含大量可回收的金属非金属组分,具有较高的资源回收价值。目前对废弃印刷线路板的回收处理技术主要包括三类:As an integral part of electronic products, printed circuit boards are usually made of glass fiber-reinforced phenolic resin or epoxy resin, on which various components are welded, which contain a large number of recyclable metal and non-metal components, with high Resource recovery value. At present, the recycling technologies for waste printed circuit boards mainly include three categories:
热处理,包括焚烧、热解、直接冶炼等,该方法过程相对简单,而且在减容减量、处理规模及效率方面具有一定优势,但环境污染严重。化学处理法,主要是用酸,离子液体等对线路板进行处理,但此方法不能处理结构组分复杂的电路板并且浸提液和残渣一般具有腐蚀性或毒性,易引起二次污染。机械物理处理法是目前国内最主要的废弃电路板回收处理的方法,其流程主要为对电路板进行一级破碎、二级破碎,然后通过静电、磁力、重力等分选方式将金属材料和非金属材料分开。其中的非金属粉末成分主要为玻璃纤维和热固性环氧树脂,该方法优点在于工艺简单,经济成本低,对环境影响小。Heat treatment, including incineration, pyrolysis, direct smelting, etc., is a relatively simple method, and has certain advantages in volume reduction, treatment scale and efficiency, but it causes serious environmental pollution. The chemical treatment method mainly uses acid, ionic liquid, etc. to treat the circuit board, but this method cannot deal with the circuit board with complex structural components, and the leachate and residue are generally corrosive or toxic, which is easy to cause secondary pollution. The mechanical physical treatment method is currently the most important method for recycling waste circuit boards in China. The metal material is separated. The non-metallic powder components are mainly glass fiber and thermosetting epoxy resin. The method has the advantages of simple process, low economic cost and little impact on the environment.
发明内容Contents of the invention
针对目前废弃光盘和破碎废弃印刷电路板得到的非金属颗粒的产生量大难处理的特点,并且回收的废旧光盘聚碳酸酯盘基机械强度大幅度下降而无法再次利用造成资源的浪费,将废旧光盘进行处理得到的聚碳酸酯盘基与非金属颗粒进行熔融混合造粒得到新型的非金属颗粒增强的聚碳酸酯材料,从而实现了两种废料的资源化。In view of the characteristics of the large amount of non-metallic particles obtained from waste optical discs and broken waste printed circuit boards, which are difficult to handle, and the mechanical strength of the recycled waste optical disc polycarbonate disc base is greatly reduced and cannot be reused, resulting in a waste of resources. The polycarbonate disk base obtained from the processing of the optical disc is melt-mixed and granulated with non-metallic particles to obtain a new type of non-metallic particle-reinforced polycarbonate material, thereby realizing the recycling of two kinds of waste materials.
一种用废旧光盘和废弃印刷电路板破碎产生的非金属颗粒制备新型增强聚碳酸酯材料的方法,其特征在于具有以下的工艺过程和步骤:A method for preparing a novel reinforced polycarbonate material from non-metallic particles produced by crushing waste CDs and waste printed circuit boards, characterized in that it has the following process and steps:
a)将废旧光盘用1mol/L的氢氧化钠溶液浸泡,处理4h后得到纯净的聚碳酸酯盘基,清洗,破碎,烘干;a) Soak the waste optical discs in 1mol/L sodium hydroxide solution, and obtain a pure polycarbonate disc base after treatment for 4 hours, wash, crush, and dry;
b)将废旧电路板破碎分选得到的非金属颗粒与硅烷偶联剂以100:1固液比混合高速搅拌20min对其进行改性,烘干后筛选出50~200目不同粒度的颗粒;b) Mix the non-metallic particles obtained by crushing and sorting waste circuit boards with a silane coupling agent at a solid-to-liquid ratio of 100:1 and stir at high speed for 20 minutes to modify them, and screen out particles with different particle sizes of 50-200 mesh after drying;
c)将改性后不同粒度的非金属颗粒以10%~15%的质量比与破碎的聚碳酸酯颗粒通过高速搅拌机搅拌混匀后,用双螺杆挤出机高温熔融挤出造粒,再用注塑机制得新的增强聚碳酸酯材料。c) After the modified non-metallic particles of different particle sizes are mixed with the broken polycarbonate particles in a mass ratio of 10% to 15% by a high-speed mixer, they are melted and extruded by a twin-screw extruder at high temperature to granulate, and then A new reinforced polycarbonate material was produced using an injection molding machine.
本发明方法用废旧光盘得到的回收聚碳酸酯和废弃电路板得到的非金属颗粒在一定条件下混合得到增强材料,即解决了光盘和非金属颗粒废料的处理处置的问题,又实现了两种废料的资源化。此外,将废弃电路板非金属颗粒作为增强剂加入回收聚碳酸酯,使其在机械强度、尺寸稳定性等方面均得到显著提升,成为高潜力新型材料。The method of the invention mixes recycled polycarbonate obtained from waste optical discs and non-metallic particles obtained from discarded circuit boards under certain conditions to obtain a reinforcing material, which solves the problem of disposal of waste CDs and non-metallic particles, and realizes two Recycling of waste. In addition, the non-metallic particles of waste circuit boards are added to recycled polycarbonate as a reinforcing agent, so that its mechanical strength and dimensional stability have been significantly improved, and it has become a high-potential new material.
具体实施方式detailed description
现将本发明的实施例叙述于后。Embodiments of the present invention will now be described below.
实施例1Example 1
将废旧光盘用1mol/L的氢氧化钠溶液浸泡4h,得到聚碳酸酯盘基,将其清洗、干燥、破碎。将破碎的电路板非金属颗粒与硅烷偶联剂以100:1固液比混合高速搅拌20min对其进行改性,烘干备用。将破碎的电路板非金属颗粒与硅烷偶联剂以100:1固液比混合高速搅拌20min对其进行改性,烘干备用。取足量的制备好的破碎聚碳酸酯颗粒以100:12质量比添加颗粒大小为50目的改性破碎电路板非金属颗粒,混合均匀后用双螺杆挤出机挤出造粒后,注塑机得到标准测试模型,得到回收增强材料的的拉伸强度为35MPa,弯曲强度为78MPa,热变形温度在148℃。Soak waste optical discs in 1mol/L sodium hydroxide solution for 4 hours to obtain polycarbonate disc bases, which are cleaned, dried and crushed. Mix the broken non-metallic particles of the circuit board with the silane coupling agent at a solid-to-liquid ratio of 100:1 and stir at high speed for 20 minutes to modify them, and dry them for later use. Mix the broken non-metallic particles of the circuit board with the silane coupling agent at a solid-to-liquid ratio of 100:1 and stir at high speed for 20 minutes to modify them, and dry them for later use. Take a sufficient amount of prepared broken polycarbonate particles and add non-metallic particles with a particle size of 50 mesh modified broken circuit boards in a mass ratio of 100:12. After mixing evenly, extrude and granulate with a twin-screw extruder. The standard test model is obtained, and the tensile strength of the recycled reinforced material is 35MPa, the bending strength is 78MPa, and the heat distortion temperature is 148°C.
实施例2Example 2
将废旧光盘用1mol/L的氢氧化钠溶液浸泡4h,得到聚碳酸酯盘基,将其清洗、干燥、破碎。将破碎的电路板非金属颗粒与硅烷偶联剂以100:1固液比混合高速搅拌20min对其进行改性,烘干备用。取足量的制备好的破碎聚碳酸酯颗粒以100:12质量比添加颗粒大小为160目的改性破碎电路板非金属颗粒,混合均匀后用双螺杆挤出机挤出造粒后,注塑机得到标准测试模型,得到回收增强材料的的拉伸强度为55MPa,弯曲强度为80MPa,热变形温度在150℃。Soak waste optical discs in 1mol/L sodium hydroxide solution for 4 hours to obtain polycarbonate disc bases, which are cleaned, dried and crushed. Mix the broken non-metallic particles of the circuit board with the silane coupling agent at a solid-to-liquid ratio of 100:1 and stir at high speed for 20 minutes to modify them, and dry them for later use. Take a sufficient amount of prepared broken polycarbonate particles and add non-metallic particles with a particle size of 160 meshes in a mass ratio of 100:12. After mixing evenly, extrude and granulate with a twin-screw extruder, and use an injection molding machine The standard test model is obtained, and the tensile strength of the recycled reinforced material is 55MPa, the bending strength is 80MPa, and the heat distortion temperature is 150°C.
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CN112090929A (en) * | 2020-09-08 | 2020-12-18 | 清远市东江环保技术有限公司 | Plastic pyrolysis recovery granulation method for waste electrical and electronic products |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2165253A (en) * | 1984-10-01 | 1986-04-09 | Mobay Chemical Corp | Glass fiber reinforced polycarbonates |
CN1464075A (en) * | 2002-06-07 | 2003-12-31 | 中国科学院过程工程研究所 | Process for reclaiming polycarbonate substrate from abandoned optical discs |
CN102161798A (en) * | 2010-02-24 | 2011-08-24 | 郭玉文 | Waste printed circuit board nonmetal powder/polypropylene composite material and preparation method thereof |
-
2015
- 2015-12-09 CN CN201510902338.0A patent/CN105504742A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2165253A (en) * | 1984-10-01 | 1986-04-09 | Mobay Chemical Corp | Glass fiber reinforced polycarbonates |
CN1464075A (en) * | 2002-06-07 | 2003-12-31 | 中国科学院过程工程研究所 | Process for reclaiming polycarbonate substrate from abandoned optical discs |
CN102161798A (en) * | 2010-02-24 | 2011-08-24 | 郭玉文 | Waste printed circuit board nonmetal powder/polypropylene composite material and preparation method thereof |
Non-Patent Citations (1)
Title |
---|
于守武等: "《高分子材料改性-原理及技术》", 31 May 2015, 知识产权出版社 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112090929A (en) * | 2020-09-08 | 2020-12-18 | 清远市东江环保技术有限公司 | Plastic pyrolysis recovery granulation method for waste electrical and electronic products |
CN112090929B (en) * | 2020-09-08 | 2024-10-01 | 清远市东江环保技术有限公司 | Plastic pyrolysis recovery granulation method for waste electrical and electronic products |
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