CN105502949A - Bismuth oxide series low-melting-point glass for copper-aluminum sealing and preparation method thereof - Google Patents
Bismuth oxide series low-melting-point glass for copper-aluminum sealing and preparation method thereof Download PDFInfo
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- CN105502949A CN105502949A CN201610025115.5A CN201610025115A CN105502949A CN 105502949 A CN105502949 A CN 105502949A CN 201610025115 A CN201610025115 A CN 201610025115A CN 105502949 A CN105502949 A CN 105502949A
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- glass
- sealing
- copper
- aluminium
- bismuth oxide
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C29/00—Joining metals with the aid of glass
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- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
Abstract
The invention provides constituents of bismuth oxide series low-melting-point glass for copper-aluminum sealing and preparation processes of products which are made of the glass and are in different forms. The glass is characterized by comprising, by mass, 60-80% of Bi2O3, 1-5% of Al2O3, 3-16% of B2O3, 2.1-7% of ZnO, 5-16% of BaO, 0-1.5% of CaF2, 0-1.5% of ZrO2, 0-2% of SiO2, 0.5-1.5% of MgO, 0.5-1.5% of Sb2O3, 0.1-1.5% of CuO and 0.1-1.5% of Fe2O3. The preparation process of the glass is applicable to preparation of glass raw powder, glass prillling powder and glass prefabricated bodies, wherein the glass prilling powder relates to application of organic matter binder facilitating glue removal. The glass prepared through the method has excellent mechanical properties (including interface bonding strength) and electrolyte corrosion resistance, achieves a good copper-aluminum sealing effect and satisfies the air-tightness sealing requirements of electrode poles of power lithium ion batteries.
Description
Technical field
The invention belongs to low-melting point leadless seal glass field, sealing-in bismuth oxide system's low melting glass and manufacture method thereof between the copper-aluminium being specifically related to lithium ion battery cover board negative lug (connection terminal).
Background technology
The problem of environmental pollution that the finiteness of petroleum resources and fuel-engined vehicle bring, impels Devoting Major Efforts To Developing new-energy automobile in the world, comprises the electromobile that lithium-ion-power cell drives.Power cell is made up of battery unit (battery core), the battery pile (Pack) be made up of battery core and the module that is made up of Pack.The Structural Design Requirement negative lug of battery core is made up of oxygen free copper or copper alloy, and this lug will do electrical insulating property and bubble-tight sealing-in with battery aluminum shell.
This type of sealing-in adopts a kind of plastic cement sealing member at present, and its shortcoming is that the sealed plastic after hot injection moulding can be out of shape, and causes resistance to air loss to decline, i.e. electrolyte leakage.Also have a kind of sealing-in method to be use the ceramic ring of nickel plating, then weld as resistance to air loss with pole and shell respectively this ceramic ring with brazing metal, its shortcoming is that the interfacial bonding property of this nickel coating is poor, and weldprocedure complexity etc.Current development trend is with seal glass sealing-in lug.Glass-sealed feature is anti-aging, heat-resisting, and electrical insulating property is good, but corresponding challenge is that the fusing point of Aluminum-aluminum alloy is low, requires to adopt low temperature sealing glass, will have suitably high thermal expansivity simultaneously, suitable electrolyte resistance corrosive nature, good electrical insulating property, and enough physical strengths.
The existing seal glass with low melting point and high thermal expansion coefficient has alkaline metal silicate glass, but known to SiO
2the anti-electrolytic corrosion poor-performing of glass; Also has phosphate glass, although this glass has been successfully applied to the copper of electric signal transmission ~ aluminium envelope electric connector (requiring dielectric properties and water resistance), their chemical stability, physical strength and hermetic seal have not also reached the rigors of lithium ion battery environment for use.Current oxidation bismuth glass has low sealing temperature, high electrical insulating property, high physical strength, with good corrosion resistance nature, the corrosive nature of especially anti-electrolytic solution, but blemish in an otherwise perfect thing be oxidation bismuth glass thermal expansivity not high enough, namely much smaller than the thermal expansivity of copper, Aluminum-aluminum alloy.
Patent (the Ji Hongyan of the people such as Ji Hongyan, Shen Zhuoshen, a kind of aluminium sealing microcrystalline glass and preparation method thereof, Chinese invention patent, application publication number CN102219385, Shen Qing Publication day: 2011.10.19.) relate to a kind of oxidation lead base aluminium sealing microcrystalline glass, and plumbous poisonous, do not meet the development trend that seal glass is unleaded; Patent (the Ren Yuefeng of the people such as Ren Yuefeng, Feng Sheng, Feng Qing, Hu Shui, Yang Wenbo, a kind of unleaded Al and Alalloy sealing-in low melting point glass and preparation method thereof, Chinese invention patent, publication number CN101538116, publication date: 2009.09.23.) relate to a kind of lead-free phosphate system low temperature sealing glass, although its sealing temperature is low, thermal expansivity is high, and its resistance to air loss, physical strength and chemical stability do not meet the requirement of lithium ion battery sealing-in; Patent (the Zhang Teng of the people such as Zhang Teng, Chen Bin, Zou Peichao, Fang Lihua, a kind of crystallization type lead-free low-temperature seal glass and preparation thereof and using method, application publication number CN103626398,2014.03.12.) have employed a kind of crystallization type lead-free low-temperature seal glass, its sealing temperature and thermal expansivity proper, but containing the SiO of high-content in glass
2, its existence means this glass easily by the corrosion of lithium-ion battery electrolytes.
More relevant patent has: the patent (He Feng of the people such as He Feng, Cheng Jinshu, Xie Jun, Zheng Weihong, Lu Ping, a kind of rare-earth doped leadless and low-melting point sealing glass and preparation method thereof, Chinese invention patent, publication number CN101456674, publication date: 2009.06.17.) mention a kind of bismuth oxide system low temperature sealing glass, its objective is for stainless low-temperature sealing, do not relate to the glass sealing between aluminium and copper; Patent (the Li Shengchun of the people such as Li Shengchun, Zheng Qingyun, Wu Rongli, a kind of lead-free solder glass, Chinese invention patent, application publication number CN102010127,2011.04.13.) also mention a kind of oxidation bismuth glass, its objective is for the inorganic bond phase in electric slurry, but its sealing temperature is higher; Patent (the Chen Pei of the people such as Chen Pei, Qiao Wenjie, Li Shengchun, He Yafei, Xia Xiufeng, for the leadless bismuth oxide solder glass and preparation method thereof of electron device sealing-in, Chinese invention patent, CN101456673,2009.06.17.) relate to a kind of oxidation bismuth glass, its objective is the sealing-in for electron device, but its thermal expansivity is on the low side, sealing temperature is higher; Finally also have two kinds of bismuth oxide system seal glasses, their original ideas are the encapsulation for flat-panel monitor, but their thermal expansivity is on the low side; (well goes out the rising sun, low melting glass, sealing compositions and sealing compound, Chinese invention patent; publication number CN1772676,2006.05.17; Benefit Tian Jizhang, the former Itou Kentaro of stone, next is male for wood, and Yi Dongke is great, tablet and tablet-integrated exhaust pipe, Chinese invention patent, application publication number CN102471139,2012.05.23.).
The present invention is intended to optimize bismuth oxide system glass formula, to obtain higher thermal expansivity, thus realizes the compression-type sealing-in between satisfied copper ~ aluminium two metal.In this compression-type sealing-in, copper or copper alloy are used as conductive core pole, and aluminum or aluminum alloy is used as metal shell, therebetween with the glass sealing of bismuth oxide system, to play the effect of electrical isolation and sealing.
Summary of the invention
For solving the problem, the invention discloses a kind of bismuth oxide glass that aluminum shell and copper stem stem can be sealed, comprise the formula of this glass and the preparation method of this glass (comprising glass frit, the former powder of glass, glass pelletizing and glass preform).
In order to reach above object, the invention provides following technical scheme:
Sealing-in bismuth oxide system low melting glass between a kind of copper-aluminium, comprises following feed composition: Bi
2o
3, Al
2o, B
2o
3, ZnO, BaO, CaF
2, ZrO
2, SiO
2, MgO, Sb
2o
3, CuO, Fe
2o
3.
Preferably, between described copper-aluminium, in sealing-in bismuth oxide system low melting glass, the mass percent of each feed composition is as follows: Bi
2o
3: 60 ~ 80%; Al
2o
3: 1 ~ 5%; B
2o
3: 3 ~ 16%; ZnO:2.1 ~ 7%; BaO:5 ~ 16%; CaF
2: 0 ~ 1.5%; ZrO
2: 0 ~ 1.5%; SiO
2: 0 ~ 2%; MgO:0.5 ~ 1.5%; Sb
2o
3: 0.5 ~ 1.5%; CuO:0.1 ~ 1.5%; Fe
2o
3: 0.1 ~ 1.5%.
In this formula, Bi
2o
3and B
2o
3glass network structure organizer, Bi simultaneously
2o
3content be directly proportional within the specific limits to thermal expansivity, ZnO, CaF
2can reduce the fusing point of glass, BaO can improve thermal expansivity, but B
2o
3thermal expansivity can be reduced, Al
2o
3,zrO
2, MgO and Fe
2o
3electrical insulating property and chemical stability, the mechanical property of glass can be improved, Sb
2o
3glaze texture or the glossiness of glass can be improved, CuO and Fe
2o
3wetting property and the mobility of glass can be improved.
Between copper-aluminium, a preparation method for sealing-in bismuth oxide system low melting glass, comprises the steps:
1) according to the mass percent of sealing-in bismuth oxide system low melting glass feed composition between above-mentioned copper-aluminium, the oxide compound weighed required for certain glass melting amount maybe can form the raw material dosage of the precursor of requisite oxygen compound, and described precursor can be to form the carbonate of corresponding oxide, borate or oxyhydroxide;
2) load weighted raw material powder is mixed;
3) by mixed material heating melting;
4) deionized water water quenching or preheated mold teeming practice is adopted to make glass chilling, obtained glass fragment;
Preferably, glass fragment is made the former powder of glass by dry method or wet ball grinding;
Preferably, the organic binder bond added in the former powder of glass, stirs, obtained glass pelletizing;
Preferably, carry out pressed compact with glass pelletizing, then binder removal and sintering, obtained copper ~ aluminium glass for sealing precast body.
Preferably, in described step 3) the heating and melting of compound in temperature 1200 ~ 1300
ocarry out under C, insulation and homogenizing 1 ~ 3 hour.
Preferably, the mass percent of described organic binder bond is 3 ~ 5%.
Preferably, described organic binder bond is one or more the mixing organism in paraffin, stearic acid, polyvinyl alcohol, polyoxyethylene glycol.
Preferably, the former powder of described glass is through moto-vibro screen screening, the former powder of glass that granularity is less than 120 microns.
The beneficial effect that the present invention obtains is: can carry out the low melting point bismuth oxide system glass sealing between copper (or alloy) and aluminium (or alloy) under the temperature condition below aluminum or aluminum alloy fusing point, and the lug terminal stud (electrode) that institute's sealing-in becomes all is better than other alkaline metal silicate system and phosphate-based low-melting point sealing glass in sealing strength, resistance to air loss and solidity to corrosion, meets the rigors of power lithium ion battery electrode sealing-in completely.In addition the present invention also has the feature of safety and environmental protection, meets European RoHS standard, also meets the requirement of China Green environmental protection.Overcome the problem of traditional leaded low-melting point sealing glass contaminate environment and harm personnel safety.
Accompanying drawing explanation
The sealing-in thermal dilatometry of bismuth oxide system low melting glass between Fig. 1, copper-aluminium;
Sealing-in bismuth oxide system low melting glass precast body between Fig. 2, copper-aluminium;
Copper-aluminium the closure of Fig. 3, lithium ionic cell cathode ear pole (electrode).
Embodiment
Below in conjunction with the drawings and specific embodiments, illustrate the present invention further, following embodiment should be understood and be only not used in for illustration of the present invention and limit the scope of the invention.
Between copper-aluminium, the feed composition mass percent of sealing-in bismuth oxide system low melting glass is as follows: Bi
2o
3: 60 ~ 80%; Al
2o
3: 1 ~ 5%; B
2o
3: 3 ~ 16%; ZnO:2.1 ~ 7%; BaO:5 ~ 16%; CaF
2: 0 ~ 1.5%; ZrO
2: 0 ~ 1.5%; SiO
2: 0 ~ 2%; MgO:0.5 ~ 1.5%; Sb
2o
3: 0.5 ~ 1.5%; CuO:0.1 ~ 1.5%; Fe
2o
3: 0.1 ~ 1.5%.
Between above-mentioned copper-aluminium, the preparation method of sealing-in bismuth oxide system low melting glass comprises the following steps:
1) according to the mass percent of the oxide compound constituent element in patent formulation, calculate and the raw material dosage of the oxide compound weighed required for certain glass melting amount or the precursor about oxide compound;
2) load weighted raw material powder ball mill (such as planetary ball mill) is carried out wet mixing, Ball-milling Time is 4 ~ 8 hours, takes out gained raw material powder slurry afterwards, and 125
otoast 4 ~ 8 hours at C temperature, until dry;
3) compound of drying is put in crucible (as aluminum oxide), then be placed in electric furnace, with 3 ~ 6
oc/min. heating rate is to 1200 ~ 1300
oc, is incubated 1 ~ 3 hour at this temperature;
4) furnace temperature is allowed to drop to 1100
oabout C, is poured into glass melt in deionized water, obtained glass fragment; If glass melt is poured on the steel plate of prior preheating, then can obtain the glass frit of bulk;
5) glass fragment and deionized water or alcohol planetary ball mill are carried out ball milling, ball milling condition is rotating speed=200 ~ 250rpm, and Ball-milling Time is 6 ~ 10 hours;
6) 120 ~ 140
odry 4 ~ 8 hours at C temperature, obtain the former powder of glass;
7) use moto-vibro screen, the former powder of screening glass, selects granularity to be less than the former powder of glass of 120 microns;
8) in the former powder of glass, add 3 ~ 5%(mass percent) binding agent, stir, control the content of solvent or water, obtained glass pelletizing;
9) pressed compact is carried out with glass pelletizing, then binder removal and sintering, obtained copper ~ aluminium glass for sealing precast body.
In embodiment 1 ~ 4 between copper-aluminium the feed composition per-cent of sealing-in bismuth oxide system low melting glass in table 1.
The manufacturing process program of the various embodiments described above of the present invention is substantially identical, and just processing parameter is slightly different, is explained with embodiment 1.
The manufacturing process of embodiment 1 is as follows:
(1) according to the mass percent of the oxide compound constituent element in table 1, calculate and the raw material dosage of the oxide compound weighed required for certain glass melting amount or the precursor about oxide compound, wherein Al
2o
3, B
2o
3, BaO precursor be Al (OH) respectively
3, H
3bO
3, BaCO
3, during calculating, weight fraction exchange to be used;
(2) load weighted raw material powder poured in zirconia ball grinding jar, add appropriate amount of deionized water, carry out wet mixing with ball mill (such as planetary ball mill), Ball-milling Time is 4 ~ 8 hours, takes out gained raw material powder slurry afterwards, and 125
otoast 4 ~ 8 hours at C temperature, until dry;
(3) compound of drying is put in crucible (as aluminum oxide or platinum crucible), then be placed in normal air electric furnace, with 3 ~ 6
oc/min. heating rate is to 1200 ~ 1300
oc, is incubated 1 ~ 3 hour at this temperature;
(4) furnace temperature is allowed to drop to 1100
oabout C, at this moment glass still has mobility, then glass melt is poured in the container be equipped with in deionized water, the obtained glass fragment because of chilling; If on steel plate glass melt being poured on prior preheating or in mould, subsequently by annealing thermal treatment, then the glass frit of bulk can be obtained;
(5) glass fragment and deionized water or alcohol are mixed, and carry out ball milling with planetary ball mill, ball milling condition is rotating speed=200 ~ 250rpm, and Ball-milling Time is 6 ~ 10 hours, takes out glass powder slurry afterwards, 120 ~ 140
odry 4 ~ 8 hours at C temperature, obtain being unscreened the former powder of glass;
(6) use moto-vibro screen, the former powder of glass in screening previous step, obtains the former powder of glass that granularity is less than 120 microns;
(7) in the former powder of glass after screening, add 3 ~ 5%(mass percent) binding agent, stir, the obtained glass pelletizing being applicable to dry pressing base;
(8) carry out pressed compact with above-mentioned glass pelletizing at below 100MPa, then binder removal and sintering processes are carried out to base substrate draft glue discharging furnace, obtained copper-aluminium glass for sealing precast body (as shown in Figure 2).The processing parameter of binder removal and sintering is: top temperature will lower than 450
oc, soaking time is less than 30min. at the maximum temperature.
Carry out performance test respectively to sealing-in bismuth oxide system low melting glass between the copper-aluminium in embodiment 1 ~ 4, test result is as shown in table 2.
Glass transition temp (the T of the glass powder sintered compact in table
g), glass transition temperature (T
f) and thermal expansivity (a) be (the German Nai Chi instrument manufacturing company limited recorded with two sample differential formula thermal dilatometers of material system of Shenzhen University; Model: DIL402CD).
Above-mentioned glass preform is placed between copper-aluminium matter and makes lithium ion cell electrode closure by Leakless sealing, Fig. 3 is the copper-aluminium closure of lithium ionic cell cathode ear pole (electrode), and the test result of the lithium ion battery cover board made of sealing-in bismuth oxide system low melting glass between copper-aluminium of the present invention is in table 3.
Technique means disclosed in the present invention program is not limited only to the technique means disclosed in above-mentioned embodiment, also comprises the technical scheme be made up of above technical characteristic arbitrary combination.It should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a sealing-in bismuth oxide system low melting glass between copper-aluminium, is characterized in that, comprise following feed composition: Bi
2o
3, Al
2o, B
2o
3, ZnO, BaO, CaF
2, ZrO
2, SiO
2, MgO, Sb
2o
3, CuO, Fe
2o
3.
2. sealing-in bismuth oxide system low melting glass between copper-aluminium as claimed in claim 1, it is characterized in that, between described copper-aluminium, in sealing-in bismuth oxide system low melting glass, the mass percent of each feed composition is as follows: Bi
2o
3: 60 ~ 80%; Al
2o
3: 1 ~ 5%; B
2o
3: 3 ~ 16%; ZnO:2.1 ~ 7%; BaO:5 ~ 16%; CaF
2: 0 ~ 1.5%; ZrO
2: 0 ~ 1.5%; SiO
2: 0 ~ 2%; MgO:0.5 ~ 1.5%; Sb
2o
3: 0.5 ~ 1.5%; CuO:0.1 ~ 1.5%; Fe
2o
3: 0.1 ~ 1.5%.
3. a sealing-in preparation method for bismuth oxide system low melting glass between copper-aluminium, is characterized in that, comprise the steps:
The mass percent of sealing-in bismuth oxide system low melting glass feed composition between copper-aluminium according to claim 1 and 2, the oxide compound weighed required for certain glass melting amount maybe can form the raw material dosage of the precursor of requisite oxygen compound;
Load weighted raw material powder is mixed;
By mixed material heating melting;
Deionized water water quenching or preheated mold teeming practice is adopted to make glass chilling, obtained glass fragment.
4. the sealing-in preparation method of bismuth oxide system low melting glass between copper-aluminium as claimed in claim 3, is characterized in that, glass fragment is made the former powder of glass by dry method or wet ball grinding.
5. the sealing-in preparation method of bismuth oxide system low melting glass between copper-aluminium as claimed in claim 4, it is characterized in that, the organic binder bond added in the former powder of glass, stirs, obtained glass pelletizing.
6. the sealing-in preparation method of bismuth oxide system low melting glass between copper-aluminium as claimed in claim 5, is characterized in that, carry out pressed compact with glass pelletizing, then binder removal and sintering, obtained copper ~ aluminium glass for sealing precast body.
7. the sealing-in preparation method of bismuth oxide system low melting glass between copper-aluminium as claimed in claim 3, it is characterized in that, in described step 3), the heating and melting of compound is 1200 ~ 1300
ocarry out at C temperature, insulation and homogenizing 1 ~ 3 hour.
8. the sealing-in preparation method of bismuth oxide system low melting glass between copper-aluminium as claimed in claim 5, it is characterized in that, the mass percent of described organic binder bond is 3 ~ 5%.
9. between the copper-aluminium as described in claim 5 or 8, the sealing-in preparation method of bismuth oxide system low melting glass, is characterized in that, described organic binder bond is one or more the mixing organism in paraffin, stearic acid, polyvinyl alcohol, polyoxyethylene glycol.
10. the sealing-in preparation method of bismuth oxide system low melting glass between copper-aluminium as claimed in claim 4, is characterized in that, the former powder of described glass is through moto-vibro screen screening, the former powder of glass that granularity is less than 120 microns.
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GB2587074A (en) * | 2019-07-15 | 2021-03-17 | Johnson Matthey Plc | Composition, paste and methods |
CN114195397A (en) * | 2021-12-20 | 2022-03-18 | 西安赛尔电子材料科技有限公司 | Glass-metal sealing material for conductor assembly of pressurized water reactor electrical penetration and preparation method thereof |
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