CN105493648A - Vehicular electronic control device - Google Patents

Abstract

An electronic control device (10, 100) for a vehicle, comprising: a heating component (20); a substrate (30) on which the heating component (20) is installed; and a storage case for accommodating the heating component (20) and the substrate (30) (40), the heating component (20) and the substrate (30) are sealed in the storage case (40) by the resin portion (60) filled inside the storage case (40), the vehicle electronic control device (10, 100 ) further has a heat diffusion cover (50) made of metal, and the heat diffusion cover (50) is attached to the first substrate (30) in a state of covering the heat generation component (20) at a predetermined distance from the heat generation component (20). The mounting surface (30a) is sealed in the storage case (40) by the resin portion (60) filled inside the storage case (40).

Description

Electronic Control Units for Vehicles

technical field

The present invention relates to an electronic control device for a vehicle, and more particularly to an electronic control device for a vehicle that accommodates a substrate mounted with a heat generating component in a storage case, and fills the housing case with resin to seal the substrate and the heat generating component in the storage case.

Background technique

In recent years, electronic control devices for vehicles mounted on vehicles such as two-wheeled motor vehicles and four-wheeled motor vehicles have adopted the following structure. On the other hand, structural components such as electronic circuit boards on which electronic components are mounted are stored in the storage case, and resin is filled in the storage case in order to seal and fix the structural components stored in the storage case.

Under such circumstances, Patent Document 1 discloses an electronic control device that seals and fixes the circuit board to the housing case by filling the gap between the circuit board and the housing case housing the circuit board with resin. inside, thereby attempting to secure a waterproof function and a dustproof function and to improve shock resistance and vibration resistance. In this configuration, the heat generating component is mounted on the circuit board, the heat generated from the heat generating component is transferred to the housing case through the resin filled in the housing case, and the heat is dissipated from the housing case to the outside.

In addition, the functions required of electronic control devices for vehicles have become high-level, and a large number of heat-generating components may be installed. Examples of such heat generating components include switching elements densely mounted on a circuit board in a drive circuit for driving a motor. As such switching elements, FETs (Field-Effect Transistors: Field-Effect Transistors) are generally used in many cases.

prior art literature

patent documents

Patent Document 1: Japanese Patent Laid-Open No. 2011-35106

Contents of the invention

The problem to be solved by the invention

However, according to research by the present inventors, it is known that in the structure of Patent Document 1, the heat generated from the heat-generating components mounted on the circuit board is transmitted to the storage case through the resin filled in the storage case, and from the storage case to the External heat dissipation, so the temperature rise in the electronic control device can be suppressed, but sometimes the heat generated by the heat-generating components exceeds the heat transferable heat of the resin filled in the housing case, and as a result, due to heat retention in the housing The resin inside the shell has a tendency to create areas of localized high temperature.

In addition, if the heating element is a FET or the like that switches at high speed, this tendency is more pronounced. In particular, in the current situation where many FETs are mounted on a circuit board in a dense state, when driving a motor or the like, a plurality of The temperature tends to rise easily due to the heat generated by the FET, and the tendency to generate a local high temperature region is more prominent.

That is, at present, there is a situation where it is desired to realize a vehicle electronic control device with a new structure capable of reliably suppressing the generation of locally high-temperature regions due to heat generated in heat-generating components such as switching elements.

The present invention has been accomplished through the above studies, and its object is to provide an electronic control device for a vehicle that can suppress generation of areas of localized high temperature.

means to solve the problem

In order to achieve the above objects, a first aspect of the present invention is an electronic control device for a vehicle, which includes: a heat generating component; a substrate on which the heat generating component is mounted; and a storage case that houses the heat generating component and the The substrate is sealed in the storage case with the resin filled inside the storage case, the electronic control device for vehicles further has a first heat diffusion cover made of metal, The first heat diffusion cover is attached to the first mounting surface of the substrate while covering the heat-generating component at a predetermined interval from the heat-generating component, and passes through the resin filled in the storage case. and be sealed in the storage case.

In addition, on the basis of the first aspect of the present invention, the second aspect of the present invention is that the vehicle electronic control device further has a second heat diffusion cover made of metal, and the second heat diffusion cover is installed on the side of the substrate. The second installation surface, the second installation surface is the back side of the first installation surface, the second heat diffusion cover covers the second installation surface and the first installation surface on which the heat-generating component is installed The region corresponds to the region, and is sealed in the storage case by the resin filled inside the storage case.

In addition, in addition to the second aspect of the present invention, the third aspect of the present invention is that the electronic control device for a vehicle further includes a fastening member made of resin, and the fastening member connects the first The heat diffusion cover and the second heat diffusion cover are fastened together.

In addition, in the fourth aspect of the present invention based on any one of the first to third aspects, the resin filled in the first heat diffusion cover and the inside of the first heat diffusion cover is along the The other electronic components mounted on the board are disposed in the housing case so as to be offset relative to the heat generating components.

In addition, the present invention is based on any one of the first to third aspects, and in a fifth aspect, the thermal conductivity of the storage case is higher than the thermal conductivity of the resin portion.

Invention effect

According to the structure of the first aspect of the present invention, the present invention is an electronic control device for a vehicle, which has a heat-generating component, a substrate on which the heat-generating component is mounted, and a storage case for storing the heat-generating component and the substrate. The heat-generating component and the substrate are sealed in the storage case with resin, and the vehicle electronic control device further has a first heat diffusion cover made of metal, and the first heat-diffusion cover covers the heat-generating component at a predetermined interval. The state is mounted on the first mounting surface of the substrate, and is sealed in the storage case by the resin filled inside the storage case, thereby efficiently heat-transferring the heat generated from the heat-generating component and dissipating it to the outside, enabling Suppress areas that generate localized high temperatures.

Here, if the distance between the first heat diffusion cover and the heat generating component is too long, the problem that a local high temperature region is generated cannot be solved. Therefore, based on a simulation or the like, the heat diffusion cover is installed in a range where a local high temperature occurs without the heat diffusion cover. Thereby, the first heat diffusion cover receives the heat generated in the heat-generating component, and the heat can be diffusively transferred to the tank around the first heat diffusion cover by virtue of the high thermal conductivity of the first heat diffusion cover made of metal. Sealed in resin. Thereby, while the temperature around the first heat diffusion cover increases diffusely, the temperature inside the first heat diffusion cover can be lowered, so that it is practically possible to reduce local high temperature regions.

In addition, according to the structure of the second aspect of the present invention, the vehicle electronic control device further includes a second heat diffusion cover made of metal, and the second heat diffusion cover is attached to the second mounting surface on the back side of the first mounting surface of the substrate. surface, and covers the area on the second installation surface corresponding to the area on the first installation surface where the heat-generating components are installed, and the second heat diffusion cover is sealed in the storage case by the resin filled inside the storage case Thus, the heat generated in the heat-generating component mounted on the first mounting surface and transferred to the second mounting surface via the substrate can be efficiently transferred to the outside in the same manner as the first heat diffusion cover. Heat dissipation can reliably suppress the generation of localized high temperature areas.

In addition, according to the third aspect of the present invention, the vehicle electronic control device further includes a resin fastening member for fastening the first heat diffusion cover and the second heat diffusion cover to each other via the substrate. Together, thus, the first heat diffusion cover and the second heat diffusion cover can be mounted on the substrate without soldering, so there is no need for the study of the layout on the substrate for soldering or the space for the substrate for soldering. , can make the installation of electronic components and the routing of circuit patterns have a degree of freedom, and since the first heat diffusion cover and the second heat diffusion cover made of metal are not installed on the substrate by riveting, it is possible to reduce the risk of damage caused by riveting. The metal powder generated by the first heat diffusion cover and the second heat diffusion cover may cause a short circuit on the substrate.

In addition, according to the fourth aspect of the present invention, the first heat diffusion cover and the resin filled inside the first heat diffusion cover are arranged in the storage case so as to be offset relative to the heat generating components along with other electronic components mounted on the substrate, Accordingly, the heat transfer area can be increased to avoid other electronic components having poor heat resistance, and the amount of heat radiated to other electronic components having poor heat resistance can be reduced.

In addition, according to the fifth aspect of the present invention, the thermal conductivity of the storage case is set to be higher than the thermal conductivity of the resin portion, so that the storage case can efficiently and diffusely receive the heat generated by the heat-generating component via the heat diffusion cover and the resin portion. , so as to more reliably dissipate heat to the outside of the storage case.

Description of drawings

1A is a perspective view showing a vehicle electronic control device according to a first embodiment of the present invention, and is shown in a state in which a part of its housing case is cut away.

FIG. 1B is a partially enlarged view of FIG. 1A shown in a state where the heat diffusion cover of the vehicle electronic control device in this embodiment is removed.

Fig. 2 is a cross-sectional view along line A-A in a state in which a part of the storage case in Fig. 1A is cut away.

3A is a schematic diagram showing how heat generated by a heat-generating component of the vehicle electronic control device according to the present embodiment is transferred to the outside, and corresponds in position to FIG. 2 .

3B is a plan view showing the temperature distribution around the heat-generating component in the state where the heat-generating component is covered with the heat-diffusing cover in the vehicle electronic control device according to the present embodiment.

3C is a plan view showing the temperature distribution around the heat-generating component in the electronic control device for a vehicle according to the present embodiment in a state where the heat-generating component is not covered by the heat diffusion cover.

4 is a cross-sectional view of a vehicle electronic control device according to a second embodiment of the present invention with a part of its housing case cut away, and corresponds in position to FIG. 2 .

detailed description

Hereinafter, the electronic control device for a vehicle in each embodiment of the present invention will be described in detail with reference to the drawings as appropriate. In addition, in the drawing, the x-axis, y-axis, and z-axis constitute a three-axis orthogonal coordinate system, and the direction of the z-axis corresponds to the up-down direction.

(first embodiment)

Hereinafter, the electronic control device for a vehicle according to the first embodiment of the present invention will be described in detail with reference to the drawings as appropriate.

<Structure of Electronic Control Unit for Vehicles>

First, the configuration of the electronic control device for a vehicle in the present embodiment will be described in detail below with reference to FIGS. 1A to 2 .

FIG. 1A is a perspective view showing a vehicle electronic control device according to the present embodiment, and is shown in a state in which a part of its housing case is cut away. FIG. 1B is a state in which the heat diffusion cover is removed. A partial enlargement of the . In addition, FIG. 2 is a cross-sectional view along line A-A in a state in which a part of the storage case in FIG. 1A is cut away. In addition, in FIG. 1A and FIG. 1B , for convenience of description, illustration of heat generating components, electronic components other than connectors, and resin parts is omitted, and in FIG. 2 , for convenience of description, the inside of the heat diffusion cover is omitted. A diagram of the resin section of .

As shown in FIGS. 1A to 2 , the vehicle electronic control device 10 in this embodiment mainly includes a heat generating component 20 , a substrate 30 , a housing case 40 , a thermal diffusion cover 50 , a resin portion 60 and a connector 70 .

The heat generating component 20 is typically constituted by switching elements such as a plurality of FETs constituting a drive circuit. The heat generating component 20 generates heat due to switching operation when an unillustrated motor or the like is driven. That is, the heat generating component 20 is a component that generates heat when performing its operation, and as shown in FIG. The region of the component 20 tends to become high temperature during its operation.

The substrate 30 is typically a circuit substrate such as a glass epoxy resin substrate, and has a first mounting surface 30 a and a second mounting surface 30 b serving as a rear surface of the first mounting surface 30 a. A plurality of electronic components 13a, 13b, heat generating components 20, and connectors 70 are mounted on the first mounting surface 30a, and a thermal diffusion cover 50 covering the heat generating components 20 is mounted. On the other hand, a plurality of electronic components 13c are mounted on the second mounting surface 30b. The electronic component 13a mounted on the first mounting surface 30a is higher in the vertical direction than the heat generating component 20 and the electronic component 13b mounted on the first mounting surface 30a, and the electronic component 13c mounted on the second mounting surface 30b. higher parts.

The housing case 40 is typically made of resin, and houses the electronic components 13 a , 13 b , and 13 c , the heat generating component 20 , the substrate 30 , the thermal diffusion cover 50 , and a part of the connector 70 . The storage case 40 is configured in a bag shape having an opening 41 opened to the outside at one end, and a part of the connector 70 protrudes from the opening 41 to the outside. A high top wall portion 42 extending from the opening portion 41 toward the positive direction of the x-axis is provided at the central portion of the storage case 40 in the y-axis direction, and electronic components such as capacitors, which are relatively tall components, are disposed below the high top wall portion 42 . 13a. The upper wall parts other than the high top wall part 42 of the storage case 40 are low top wall parts 43 lower than the high top wall part 42 in height. Shortened heat generating component 20, electronic component 13b, and electronic component 13c. Accordingly, the vehicle electronic control device 10 can be downsized and the volume of the resin portion 60 can be reduced.

The heat diffusion cover 50 is typically made of metal such as iron, and is attached to the first mounting surface 30 a of the substrate 30 by soldering or the like in a state of covering the heat generating component 20 at a predetermined distance from the heat generating component 20 . superior.

More specifically, the heat diffusion cover 50 is a rectangular parallelepiped box-shaped member with an open bottom, and the heat diffusion cover 50 has: a concave portion 51 for accommodating the heat generating component 20; four side wall portions 52a, 52b, 52c, 52d , which are arranged around the concave portion 51; a plurality of foot portions 54, which extend downward from the lower ends 53a, 53b, 53c, 53d of the four sidewall portions 52a, 52b, 52c, 52d, and are formed on the substrate correspondingly A plurality of hole portions not shown in the figure 30 are embedded and fixed to the substrate 30 by soldering or the like; a plurality of gap portions 55 are respectively formed to be adjacent to the four side wall portions 52a, 52b, 52c, and 52d. The side walls correspond to each other; and the top plate portion 56. The concave portion 51 is defined by the four side wall portions 52 a , 52 b , 52 c , and 52 and the top plate portion 56 . In addition, when the heat diffusion cover 50 is attached to the substrate 30, a plurality of gaps 90 are respectively formed between the lower end portions 53a, 53b, 53c, and 53d of the heat diffusion cover 50 and the first mounting surface 30a of the substrate 30. . The gap portion 55 and the gap portion 90 are provided to allow resin to flow into the heat diffusion cover 50 .

In addition, the heat diffusion cover 50 is not limited to a rectangular parallelepiped box shape, and may be set in any shape capable of covering the heat generating component 20 with a predetermined interval therebetween. In addition, on the heat diffusion cover 50, in order to make the resin easily flow into the inside of the heat diffusion cover 50, in addition to the gap 55 and the gap 90, a top plate 56 and the like may be provided to communicate with the outside of the heat diffusion cover 50 and the inside of the heat diffusion cover 50. Internal penetrations or cutouts.

The fluid resin material filled in the storage case 40 flows into the inside and outside of the heat diffusion cover 50 and hardens to form the resin portion 60 . At this time, the fluid resin material filled in the housing case 40 flows into the heat diffusion cover 50 from the gap 55 and the gap 90 of the heat diffusion cover 50 . The resin part 60 seals and fixes the heat generating component 20 covered by the heat diffusion cover 50 inside the heat diffusion cover 50 , and also seals a part of the electronic components 13 a , 13 b , 13 c , the substrate 30 , the heat diffusion cover 50 , and the connector 70 . And it is fixed inside the storage case 40 .

Here, the shape of the heat diffusion cover 50 and the distance between the heat-generating component 20 and the heat-diffusion cover 50 are set to realize the structure that the resin part 60 must exist between the heat-generating component 20 and the heat diffusion cover 50, so as to avoid occurrence of The portion where the heat generating component 20 is in direct contact with the heat diffusion cover 50 . Furthermore, the thermal conductivity of each of the resin portion 60 made of resin, the storage case 40 made of resin, and the thermal diffusion cover 50 made of metal is set so that the thermal conductivity of the thermal diffusion cover 50 is maximized.

As a result, the heat generated in the heat generating component 20 is not unnecessarily shrouded in its periphery, but the heat is diffusively transferred to the heat diffusion cover 50 through the resin portion 60 inside the heat diffusion cover 50 , and the heat is suppressed from re-radiating to the heat diffusion cover 50 . In the form of heat transfer to the resin part 60 inside the diffusion cover 50, the heat is transferred inside the components of the thermal diffusion cover 50 itself, and at the same time, the heat is transferred to the resin part 60 between the thermal diffusion cover 50 and the storage case 40 through the thermal diffusion cover 50, and The heat is diffusively transferred to the storage case 40 via the resin portion 60 between the thermal diffusion cover 50 and the storage case 40 , and then dissipated to the outside of the storage case 40 .

In addition, the thermal conductivity of each of the resin portion 60 made of resin and the resin storage case 40 is preferably set so that the thermal conductivity of the storage case 40 is higher than the thermal conductivity of the resin portion 60 . Thereby, the housing case 40 efficiently and diffusely receives the heat generated in the heat generating member 20 via the thermal diffusion cover 50 and the resin portion 60 , and can more reliably dissipate heat to the outside of the housing case 40 .

In addition, the shape of the heat diffusion cover 50 and the distance between the heat-generating components 20 and the heat diffusion cover 50 are set so that the first mounting surface 30 a side is grasped in advance by simulation or actual measurement in the absence of the heat diffusion cover 50 . The position that becomes high temperature above the specified temperature is based on the position that becomes high temperature grasped in this way, and the area where heat should be transferred is identified.

Specifically, a predetermined interval r1 is provided between the top plate portion 56 of the heat diffusion cover 50 and the heat generating component 20 . A predetermined distance r2 is provided between the side wall portion 52 a of the heat diffusion cover 50 and the heat generating component 20 , and a predetermined distance r3 is provided between the side wall portion 52 c of the heat diffusion cover 50 and the heat generating component 20 . Here, it is preferable that among these intervals r1, r2, and r3, the relationship of interval r1<interval r2<interval r3 exists, and the heat diffusion cover 50 and the resin part 60 inside it cover the heating element 20 along the direction of the heating element 20. The electronic component 13a is deviated to the positive direction side of the x-axis. For example, if the electronic component 13a arranged on the positive side of the y-axis with respect to the heating element 20 is an electronic component with relatively low heat resistance, by setting the size relationship between the intervals r1, r2, and r3 in this way, , offsetting the heat diffusion cover 50 and the resin portion 60 inside it, the heat generated in the heat generating component 20 can pass through the resin portion 60 inside the heat diffusion cover 50 to increase its heat transfer area on the side of the positive direction of the x-axis The form conducts heat and transfers to the heat diffusion cover 50 to avoid unnecessary heat covering the periphery of the heat generating component 20 and avoiding the electronic components 13a, and the heat is transferred inside the heat diffusion cover 50 itself and transferred from the heat The diffusion cover 50 transfers heat to the storage case 40 via the resin portion 60 between the storage case 40 and the thermal diffusion cover 50 , and then dissipates heat to the outside of the storage case 40 . That is, the amount of heat dissipated to the electronic component 13a close to the heating element 20 can be further reduced, and the amount of heat dissipated to the electronic component 13b farther from the heating element 20 than the electronic component 13a can be further reduced.

Of course, predetermined intervals (not shown) are provided between the side wall portion 52b of the heat diffusion cover 50 and the heat generating component 20 and between the side wall portion 52d of the heat diffusion cover 50 and the heat generating component 20 .

The connector 70 has a fitting portion 70a that is a recess that fits with a mating connector not shown, and has a connection terminal 71 that is formed by bending a long plate-shaped metal The connector 70 is formed by a part, and a part protrudes to the outside of the connector 70 . The connector 70 is mounted on the first mounting surface 30 a of the substrate 30 in a state where the connection terminals 71 are soldered to the substrate 30 . That is, as for the connection terminal 71, one end thereof is inserted into a through hole (not shown) formed on the substrate 30 and soldered, and the other end is exposed in the fitting portion 70a so that it can be connected to the not shown in the mating side connector. connected to the connection terminals shown.

<Assembly method of electronic control unit for vehicle>

Next, a method of assembling the vehicle electronic control device 10 in this embodiment will be described in detail below with reference to FIGS. 1A to 2 .

First, heat generating component 20 and electronic components 13a and 13b are mounted on first mounting surface 30a of substrate 30 by soldering or the like, and electronic component 13c is mounted on second mounting surface 30b of substrate 30 by soldering or the like.

Next, in the state where the heat-generating component 20 is covered by the heat-diffusion cover 50, the plurality of leg portions 54 of the heat-diffusion cover 50 are respectively fitted into the plurality of holes of the first mounting surface 30a of the substrate 30 correspondingly, and then the These are soldered to the substrate 30 , and the thermal diffusion cover 50 is attached to the substrate 30 . In addition, the attachment of the thermal diffusion cover 50 to the substrate 30 is not limited to soldering, and attachment structures such as fastening or riveting may be used.

The connection terminals 71 of the connector 70 are soldered to the substrate 30 at the same time, and the connector 70 is mounted on the substrate 30 .

Next, the substrate 30 on which the electronic components 13 a , 13 b , and 13 c , the heat generating component 20 , and the connector 70 are mounted, and the thermal diffusion cover 50 is housed in the storage case 40 through the opening 41 of the storage case 40 .

Finally, a fluid resin material is poured into the housing case 40 from the opening 41 to fill it, and then cured, whereby the electronic components 13a, 13 b , 13 c , the heat generating component 20 , the substrate 30 , the heat diffusion cover 50 , and part of the connector 70 are sealed and fixed in the housing case 40 . At this time, the fluid resin material filled in the storage case 40 flows into the heat diffusion cover 50 from the gap 55 and the gap 90 of the heat diffusion cover 50 and hardens, thereby sealing the heat generating component 20. And fixed inside the heat diffusion cover 50 .

<The state of heat generation when the heat-generating parts are heated>

Next, the heat-generating state when the heat-generating component 20 of the vehicle electronic control device 10 in this embodiment generates heat will be described in detail below with reference to FIGS. 3A to 3C .

3A is a schematic diagram showing how heat generated by a heat-generating component of the vehicle electronic control device according to the present embodiment is transferred to the outside, and corresponds in position to FIG. 2 . In addition, FIG. 3B is a plan view showing the temperature distribution around the heat-generating component in a state where the heat-generating component is covered by the heat-diffusing cover of the vehicle electronic control device in this embodiment, and FIG. 3C is a plan view showing the temperature distribution of the vehicle in this embodiment. It is a plan view of the temperature distribution around the heat-generating component in the state where the heat-generating component is not covered with the heat-diffusing cover by the electronic control device. In addition, in FIG. 3A, for convenience of description, only the heat generating component 20, the substrate 30, the heat diffusion cover 50 and the non-heat generating component 80 are shown, and in FIG. 3B and FIG. Diffusion cover 50 .

As shown in FIG. 3A , the heat generated in heat generating component 20 radially transfers to resin portion 60 inside heat diffusion cover 50 as indicated by arrow D1 in FIG. 3A , and reaches heat diffusion cover 50 . At this time, since the contact area between the heat generating component 20 and the resin portion 60 inside the thermal diffusion cover 50 is relatively larger than the contact area between the heat generating component 20 and the substrate 30 , the ratio of the heat generated in the heat generating component 20 to the substrate 30 is relatively large. relatively low. In addition, in FIG. 3A , the illustration of the downward heat transfer is omitted for convenience of description.

The heat reaching the heat diffusion cover 50 is transferred to the inside of the heat diffusion cover 50 itself as indicated by the arrow D2 in FIG. 3A . At this time, since the thermal conductivity of the resin portion 60 inside the heat diffusion cover 50 is lower than that of the heat diffusion cover 50, it is possible to reliably prevent the heat transferred inside the heat diffusion cover 50 itself from being transferred to the heat diffusion cover 50 again. The internal resin portion 60 conducts heat.

The heat transferred inside the heat diffusion cover 50 itself is radially transferred from the heat diffusion cover 50 to the resin portion 60 outside the heat diffusion cover 50 as indicated by arrow D3 in FIG. 3A , and reaches the housing case 40 .

Then, the heat reaching the storage case 40 is dissipated to the outside of the storage case 40 . At this time, because the heat received by the storage case 40 is that the heat generated by the heat generating component 20 is diffusely transmitted through the resin portion 60 inside the heat diffusion cover 50 , the heat diffusion cover 50 , and the resin portion 60 outside the heat diffusion cover 50 . Therefore, the heat radiated to the outside of the storage case 40 is not concentrated and radiated to the non-heat-generating components 80 such as the electronic components 13a and 13b existing outside the heat diffusion cover 50, and the thermal influence on the non-heat-generating components 80 can be reduced.

Next, the temperature distribution when the heat generating component 20 of the vehicle electronic control device 10 generates heat will be described in detail with reference to FIGS. 3B and 3C .

Here, in FIG. 3B and FIG. 3C, it shows that temperature becomes high with equal temperature difference in order of temperature t1, t2, t3.... In addition, FIGS. 3B and 3C show the temperature distribution when the heat generating component 20 is heated under the same conditions except whether or not the heat diffusion cover 50 is present.

In the vehicle electronic control device 10 shown in FIG. 3B covering the heat-generating component 20 with the heat-diffusing cover 50 , the temperature rises closer to the heat-generating component 20 , but the temperature distribution is relatively uniform in accordance with the arrangement area of the heat-diffusing cover 50 . Thus, the temperature of the region with the highest temperature where the heat generating component 20 is installed is about t5.

On the other hand, in the vehicle electronic control device shown in FIG. 3C in which the heat-generating component 20 is not covered by the heat-diffusing cover 50, the temperature rises sharply closer to the heat-generating component 20, and the temperature is highest in the region where the heat-generating component 20 is mounted. The temperature is t10.

As can be seen from the above, since the temperature t5 is lower than the temperature t10, when the heat-generating component 20 is covered with the heat-diffusing cover 50, compared with the case where the heat-generating component 20 is not covered with the heat-diffusing cover 50, the heat-generating component 20 generates heat. The heat is diffused and transferred to be equalized, and the maximum temperature of the vehicle electronic control device 10 can be reduced. 3B and 3C show the temperature distribution on the first mounting surface 30 a of the substrate 30 , and the trend of the temperature distribution on the second mounting surface 30 b of the substrate 30 is also the same.

According to the structure of the present embodiment as described above, the vehicle electronic control device 10 has the heat generating component 20 , the substrate 30 on which the heat generating component 20 is mounted, and the housing case 40 for housing the heat generating component 20 and the board 30 . The inner resin portion 60 seals the heat generating component 20 and the substrate 30 in the housing case 40. The vehicle electronic control device 10 also has a heat diffusion cover 50 made of metal, and the heat diffusion cover 50 is separated from the heat generating component 20. The heat-generating components 20 are mounted on the first mounting surface 30a of the substrate 30 in a state of covering the heat-generating components 20 at predetermined intervals, and are sealed in the housing case 40 by the resin portion 60 filled in the housing case 40 , thereby efficiently protecting The heat generated from the heat generating component 20 is transferred and dissipated to the outside, and it is possible to suppress generation of a local high temperature region.

In addition, according to the structure of the present embodiment, the heat diffusion cover 50 and the resin portion 60 filled inside the heat diffusion cover 50 are arranged in the housing case 40 so as to be offset relative to the heat generating component 20 along with the other electronic components 13 a mounted on the substrate 30 . Accordingly, the heat transfer area can be increased while avoiding the other electronic component 13a having low heat resistance, and the amount of heat radiated to the other electronic component 13a having low heat resistance can be reduced.

In addition, according to the configuration of the present embodiment, by setting the thermal conductivity of the storage case 40 higher than the thermal conductivity of the resin portion 60 , the storage case 40 efficiently and diffusely receives the heat-generating components through the thermal diffusion cover 50 and the resin portion 60 . 20, and can more reliably dissipate heat to the outside of the storage case 40.

(second embodiment)

Next, the vehicle electronic control device according to the second embodiment of the present invention will be described in detail below with appropriate reference to the drawings.

<Structure of Electronic Control Unit for Vehicles>

First, the configuration of the electronic control device for a vehicle in the present embodiment will be described in detail below with reference to FIG. 4 .

4 is a cross-sectional view of a vehicle electronic control device according to a second embodiment of the present invention with a part of its housing case cut away, and corresponds in position to FIG. 2 .

As shown in FIG. 4 , in the vehicle electronic control device 100 in this embodiment, the main difference is that a thermal diffusion cover 50 is provided instead of the thermal diffusion cover 50 on the vehicle electronic control device 10 in the first embodiment. Cover 110 and heat spreader cover 120. Therefore, in this embodiment, the description will be made focusing on the above-mentioned differences, and the same reference numerals will be attached to the same components as those in the first embodiment, and the description will be appropriately omitted or simplified. In addition, in FIG. 4, illustration of the inside of the heat diffusion cover 110 and the resin part 60 inside the heat diffusion cover 120 is abbreviate|omitted for convenience of description.

Vehicle electronic control device 100 in this embodiment mainly includes heat generating component 20 , substrate 30 , housing case 40 , resin portion 60 , connector 70 , heat diffusion covers 110 , 120 , and fastening member 130 .

The heat diffusion cover 110 is typically a rectangular parallelepiped box-shaped member that is made of metal such as iron and has an open bottom. The solid member 130 is mounted on the first mounting surface 30 a of the substrate 30 , which is different from the structure of the thermal diffusion cover 50 in the vehicle electronic control unit 10 . That is, the heat diffusion cover 110 is compatible with the heat diffusion cover 50 in the vehicle electronic control unit 10 except that the through hole 111 for penetrating the fastening member 130 is formed on the top plate portion 56 in the plate thickness direction. have the same structure.

Like the heat diffusion cover 110, the heat diffusion cover 120 is typically a cuboid box-shaped member made of metal such as iron, but the heat diffusion cover 120 covers the mounting area on the second mounting surface 30b and the first mounting surface 30a. The state of the region corresponding to the region where the heat generating component 20 exists is mounted on the second mounting surface 30b by the fastening member 130 . The heat diffusion cover 120 is mounted on the second mounting surface 30b in a state of covering a projected region of the first mounting surface 30a where the heat generating component 20 is mounted and viewed from above on the second mounting surface 30b. Here, the area covered by the heat diffusion cover 120 is not limited to coincide with the projected area, and may be larger than the projected area as long as it includes the projected area as shown in FIG. 4 .

More specifically, the heat diffusion cover 120 is a cuboid box-shaped member with an open top, and the heat diffusion cover 120 has: a recess 121; a plurality of feet 124, which are further extended upwards from the upper ends 123a, 123b, 123c, 123d of the four sidewalls 122a, 122b, 122c, 122d, and are correspondingly embedded in the omitted diagram formed on the substrate 30 Among the plurality of hole portions shown; a plurality of gap portions 125 formed corresponding to adjacent side walls of the four side wall portions 122a, 122b, 122c, and 122d; and a bottom plate portion 126. The concave portion 121 is defined by the four side wall portions 122 a , 122 b , 122 c , and 122 d and the bottom plate portion 126 . In addition, when the heat diffusion cover 120 is mounted on the substrate 30 , a plurality of gaps 190 are respectively formed between the upper ends 123 a , 123 b , 123 c , and 123 d of the heat diffusion cover 120 and the second mounting surface 30 b of the substrate 30 . The gap portion 125 and the gap portion 190 are provided for allowing resin to flow into the inside of the thermal diffusion cover 120 . A through-hole 127 is formed in the bottom plate portion 126 to pass through the fastening member 130 in the plate thickness direction.

For the height h2 of the heat diffusion cover 120 from the second installation surface 30b when the heat diffusion cover 120 is installed on the second installation surface 30b of the substrate 30, because the heat generating component 20 is not installed on the second installation surface 30b, it is set It is set to be lower than the height h1 of the heat diffusion cover 110 from the first mounting surface 30 a when the heat diffusion cover 110 is mounted on the first mounting surface 30 a of the substrate 30 . Thereby, the distance between the second mounting surface 30b of the substrate 30 and the housing case 40 can be reduced, so that the vehicle electronic control device 10 can be downsized. In addition, electronic components such as other heat generating components may be mounted on the second mounting surface 30 b of the substrate 30 in the thermal diffusion cover 120 . In addition, the thermal diffusion cover 120 is made of the same material as the thermal diffusion cover 110, which has great advantages in terms of cost, etc., but as long as it is a material with a thermal conductivity higher than that of the storage case 40 and the resin part 60, any material may be used. It is formed using a metal material different from that of the thermal diffusion cover 110 .

The fluid resin material filled in the storage case 40 flows into the inside and the outside of the heat diffusion cover 110 and the heat diffusion cover 120 and hardens to form the resin portion 60 . At this time, the fluid resin material filled inside the storage case 40 flows into the inside of the heat diffusion cover 110 from the gap 55 and the gap 90 of the heat diffusion cover 110 , and flows from the gap 125 of the heat diffusion cover 120 . And the gap part 190 flows into the inside of the heat diffusion cover 120 . The resin part 60 seals and fixes the heat-generating component 20 covered by the heat diffusion cover 110 inside the heat diffusion cover 110, and the electronic components 13a, 13b, 13c, the substrate 30, the connector 70, the heat diffusion cover 110, the heat diffusion cover 120 and a part of the connector 70 are sealed and fixed inside the housing case 40 .

The fastening part 130 is typically made of resin, and the fastening part 130 has a head 130a at one end and a fastening part 130b at the other end, wherein the head 130a has a diameter larger than that of the through hole 127. . The fastening member 130 is inserted through the through hole 111 formed in the heat diffusion cover 110 , the through hole (not shown) formed in the substrate, and the through hole 127 formed in the heat diffusion cover 120 , and the head In the state where the portion 130a is in contact with the bottom plate portion 126 around the through hole 127 of the heat diffusion cover 120, the fastening portion 130b is pressed into or screwed to the top plate portion around the through hole 111 of the heat diffusion cover 110. 56 are fastened together so that the heat spreader cover 110 and the heat spreader cover 120 are fixed relative to the substrate 30 . In addition, the thermal conductivity of the fastening member 130 is set to be about the same as the thermal conductivity of the resin portion 60 , and set to be smaller than the respective thermal conductivity of the heat diffusion cover 110 and the heat diffusion cover 120 .

<Assembly method of electronic control unit for vehicle>

Next, a method of assembling the vehicle electronic control device 100 in the present embodiment will be described in detail below with reference to FIG. 4 . In addition, in the method of assembling the electronic control device for a vehicle in this embodiment, descriptions of the same steps as those in the method of assembling the electronic control device for a vehicle in the first embodiment are omitted or simplified.

First, the heat generating component 20 and the electronic components 13a, 13b are mounted on the first mounting surface 30a of the substrate 30 by soldering or the like, and the electronic component 13c is mounted on the second mounting surface 30b of the substrate 30 by soldering or the like. The heat diffusion cover 110 and the heat diffusion cover 120 are covered with the heat diffusion cover 120 in a state where the region of the first installation surface 30a where the heat generating component 20 is mounted is viewed from above and projected on the second installation surface 30b. 120 is attached to the substrate 30 via the fastening member 130 via the substrate 30 .

Specifically, the fastening portion 130 b of the fastening member 130 is inserted through the through hole 127 of the heat diffusion cover 120 from the outside of the heat diffusion cover 120 .

Next, the fastening portion 130b of the fastening member 130 that has passed through the through hole 127 and the through hole of the substrate in sequence is inserted into the through hole 111 of the heat diffusion cover 110 from the inside of the heat diffusion cover 110 until the head of the fastening member 130 is inserted. The portion 130 a contacts the bottom plate portion 126 around the through hole 127 of the heat diffusion cover 120 .

At this time, the fastening portion 130b of the fastening member 130 and the top plate portion 56 around the through hole 111 of the heat diffusion cover 110 are fastened together by pressing or screwing, so that the heat diffusion cover 110 and the heat diffusion cover 110 are fastened together. 120 is fixedly mounted to the base plate 30 relative to the base plate 30 .

Next, the substrate 30 on which the connector 70 is mounted and the electronic components 13 a , 13 b , 13 c , the heat generating component 20 , the heat diffusion cover 110 , and the heat diffusion cover 120 is housed in the storage case 40 from the opening 41 of the storage case 40 . .

Finally, the resin material is flowed into the housing case 40 from the opening 41 to be filled and cured, so that the heat-generating component 20 is covered by the heat diffusion cover 110 and the aforementioned projected area is covered by the heat diffusion cover 120 , Parts of electronic components 13 a , 13 b , 13 c , heat generating components 20 , substrate 30 , heat diffusion cover 110 , heat diffusion cover 120 , and connector 70 are sealed and fixed in housing case 40 . At this time, the fluid resin material filled inside the storage case 40 flows into the inside of the heat diffusion cover 110 from the gap portion 55 and the gap portion 90 of the heat diffusion cover 110 and hardens, thereby sealing the heat generating component 20 in the heat diffusion layer. The inside of the cover 110. In addition, in the heat diffusion cover 120 , when electronic components such as other heat generating components are mounted on the second mounting surface 30 b of the substrate 30 , the electronic components are similarly sealed in the heat diffusion cover 120 .

<The state of heat generation when the heat-generating parts are heated>

Next, the heat generation state when the heat generating component 20 in the vehicle electronic control device 100 in this embodiment generates heat will be described in detail below.

The heat-generating state of the heat-generating component 20 of the vehicle electronic control device 100 in this embodiment is the same as that described with reference to FIG. The content is the same as that described with reference to FIG. 3B .

However, in the vehicle electronic control device 100 of the present embodiment, since the heat diffusion cover 120 is provided in addition to the heat diffusion cover 110 , the heat when the heat generating component 20 generates heat is also transferred to the heat diffusion cover 120 via the substrate 30 . The inner resin part 60. In this way, the heat transferred to the resin portion 60 inside the heat diffusion cover 120 is diffusely transferred toward the heat diffusion cover 120 , and in the form of suppressing heat transfer to the resin portion 60 inside the heat diffusion cover 120 again, the heat is transmitted to the heat diffusion cover 120 itself. The heat is transferred inside the components, and the heat is transferred to the resin part 60 between the heat diffusion cover 120 and the storage case 40 through the heat diffusion cover 120, and the heat is transferred to the storage case 40 through the resin part 60 between the heat diffusion cover 120 and the storage case 40 The heat is diffusely transferred and then dissipated to the outside of the storage case 40 . Thereby, the heat when the heat generating component 20 generates heat is further diffused and transferred to be equalized through the substrate 30 , and the maximum temperature of the vehicle electronic control device 10 can be further reduced. Here, since the thermal conductivity of the fastening member 130 is set to be about the same as the thermal conductivity of the resin portion 60, and is set to be smaller than the respective thermal conductivity of the heat diffusion cover 110 and the heat diffusion cover 120, the thermal conductivity of the heat-generating component When the heat at the time of 20 heat generation is diffused and equalized, unnecessary thermal influence will not be brought. In addition, in the heat diffusion cover 120, even when electronic components such as other heat-generating components are mounted on the second mounting surface 30b of the substrate 30, the heat generated by the heat-generating components 20 and the like can be further diffused and This is equalized to further reduce the maximum temperature of the vehicle electronic control device 10 .

In addition, in this embodiment, no heat-generating components are attached to the inside of the heat diffusion cover 120 , but heat-generating components may be separately attached to both the inside of the heat diffusion cover 110 and the inside of the heat diffusion cover 120 .

According to the structure of the present embodiment described above, in addition to the effects of the first embodiment, there is also a metal heat diffusion cover 120 attached to the first mounting surface 30a of the substrate 30 on the back surface. 2 on the installation surface 30b, and cover the area of the second installation surface 30b corresponding to the area where the heat generating component 20 is installed on the first installation surface 30a, and the heat diffusion cover 120 passes through the resin part 60 filled in the storage case 40 It is sealed in the storage case 40, thereby, the heat generated by the heat generating component 20 mounted on the first mounting surface 30a and transmitted to the second mounting surface 30b via the substrate can be efficiently transferred and dissipated to the outside, Regions where localized high temperatures develop can be reliably suppressed.

In addition, according to the structure of the present embodiment, there is further provided the fastening member 130 made of resin for fastening the heat diffusion cover 110 and the heat diffusion cover 120 to each other via the substrate 30 , so that soldering can be eliminated. And heat diffusion cover 110 and heat diffusion cover 120 are installed on substrate 30, therefore do not need to be used for the study of the layout of soldering to substrate 30 or the space of the substrate for soldering, can make the mounting of electronic components and the layout of circuit patterns The routing has a degree of freedom, and since the thermal diffusion cover 110 and the thermal diffusion cover 120 made of metal are not mounted on the substrate by riveting, it is possible to reduce the occurrence of dust on the substrate due to metal powder generated from the thermal diffusion cover when riveting. Possibility of phenomena such as short circuits.

In addition, for the present invention, the type, arrangement, number, etc. of components are not limited to the above-mentioned embodiments, and of course, the structural elements can be appropriately replaced with structural elements that achieve equivalent effects, without departing from the gist of the invention. Appropriate changes can be made within the scope.

Industrial availability

As described above, the present invention can provide an electronic control device for a vehicle that can suppress generation of a local high temperature region by efficiently transferring heat generated from a heat generating component and dissipating it to the outside. Due to its universal nature, it is expected to be widely used in electronic control devices for vehicles such as motorcycles.

Claims (5)

1. An electronic control device for a vehicle, comprising: heating parts; a substrate on which the heat generating component is mounted; and a storage case that accommodates the heat generating component and the substrate, sealing the heat-generating component and the substrate in the housing case with resin filled inside the housing case, It is characterized in that, The electronic control device for a vehicle further includes a first heat diffusion cover made of metal, and the first heat diffusion cover is attached to the first heat-generating component of the substrate in a state of covering the heat-generating component with a predetermined interval therebetween. 1 mounting surface, and is sealed in the storage case by the resin filled inside the storage case. 2. The vehicle electronic control device according to claim 1, wherein: The vehicle electronic control device further has a second heat diffusion cover made of metal, and the second heat diffusion cover is mounted on a second mounting surface of the substrate, the second mounting surface being the back side of the first mounting surface. , the second heat diffusion cover covers an area of the second installation surface corresponding to the area on the first installation surface where the heat-generating component is installed, and passes through the resin filled inside the storage case and be sealed in the storage case. 3. The vehicle electronic control device according to claim 2, wherein: This vehicle electronic control device further includes a resin fastening member for fastening the first heat diffusion cover and the second heat diffusion cover to each other via the substrate. 4. The vehicle electronic control device according to any one of claims 1 to 3, wherein: The resin filled in the first heat diffusion cover and the second heat diffusion cover is arranged in the housing case in an offset manner relative to the heat generating component along with other electronic components mounted on the substrate. . 5. The vehicle electronic control device according to any one of claims 1 to 4, wherein: The thermal conductivity of the housing case is higher than the thermal conductivity of the resin portion.