CN105489978B - The method of adjustment of distributed MEMS phase shifter operating voltage based on phase-shift phase mechanical-electric coupling - Google Patents
The method of adjustment of distributed MEMS phase shifter operating voltage based on phase-shift phase mechanical-electric coupling Download PDFInfo
- Publication number
- CN105489978B CN105489978B CN201610041328.7A CN201610041328A CN105489978B CN 105489978 B CN105489978 B CN 105489978B CN 201610041328 A CN201610041328 A CN 201610041328A CN 105489978 B CN105489978 B CN 105489978B
- Authority
- CN
- China
- Prior art keywords
- mrow
- msub
- mems
- bridge
- mfrac
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000010363 phase shift Effects 0.000 title claims abstract description 90
- 230000008878 coupling Effects 0.000 title claims abstract description 42
- 238000010168 coupling process Methods 0.000 title claims abstract description 42
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000005259 measurement Methods 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 8
- 230000005540 biological transmission Effects 0.000 claims description 51
- 239000004020 conductor Substances 0.000 claims description 18
- 238000013461 design Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/18—Phase-shifters
- H01P1/182—Waveguide phase-shifters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/006—Manufacturing dielectric waveguides
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Waveguide Switches, Polarizers, And Phase Shifters (AREA)
Abstract
本发明公开了一种基于相移量机电耦合的分布式MEMS移相器工作电压的调整方法,包括确定分布式MEMS移相器的结构参数、材料属性和电磁工作参数;确定工作电压标准值V0和相移量标准值Δφ0;施加2V0的工作电压,测量M个MEMS桥中相移量Δφi;比较相移量测量值Δφi与标准值Δφ0;当相移量测量值Δφi>标准值Δφ0,得MEMS桥有向上的高度误差,计算等效电路参数和工作电压调整量;当相移量测量值Δφi≤标准值Δφ0,得MEMS桥向下高度误差或无误差,计算等效电路参数和高度误差值,计算工作电压的调整量;判断是否已对全部计算工作电压调整量;重新施加到相应的MEMS桥上,测量分布式MEMS移相器的整体相移量;判断调整工作电压后的分布式MEMS移相器电性能是否满足指标要求。本方法为实际工作的可靠性提供了理论指导。
The invention discloses a method for adjusting the operating voltage of a distributed MEMS phase shifter based on the electromechanical coupling of the phase shift, including determining the structural parameters, material properties and electromagnetic working parameters of the distributed MEMS phase shifter; determining the standard value of the operating voltage V 0 and the standard value of phase shift Δφ 0 ; apply a working voltage of 2V 0 to measure the phase shift Δφ i in M MEMS bridges; compare the measured value of phase shift Δφ i with the standard value Δφ 0 ; when the measured value of phase shift Δφ i > standard value Δφ 0 , the MEMS bridge has an upward height error, calculate the equivalent circuit parameters and operating voltage adjustment; when the phase shift measurement value Δφ i ≤ standard value Δφ 0 , the MEMS bridge has a downward height error or no Error, calculate the equivalent circuit parameters and height error value, calculate the adjustment of the operating voltage; judge whether the adjustment of the operating voltage has been calculated for all; reapply to the corresponding MEMS bridge, and measure the overall phase shift of the distributed MEMS phase shifter Quantity; judge whether the electrical performance of the distributed MEMS phase shifter after adjusting the working voltage meets the index requirements. This method provides theoretical guidance for the reliability of practical work.
Description
技术领域technical field
本发明属于微波器件技术领域,具体是一种基于相移量机电耦合的分布式MEMS移相器工作电压的调整方法。本发明涉及分布式MEMS移相器工作电压的调整方法,可用于指导工作过程中分布式MEMS移相器工作电压的调整量,保证相移量满足性能要求。The invention belongs to the technical field of microwave devices, in particular to a method for adjusting the working voltage of a distributed MEMS phase shifter based on electromechanical coupling of phase shift. The invention relates to a method for adjusting the operating voltage of a distributed MEMS phase shifter, which can be used to guide the adjustment amount of the operating voltage of the distributed MEMS phase shifter during the working process, so as to ensure that the phase shift amount meets the performance requirements.
背景技术Background technique
随着RF MEMS(Micro-electromechanical Systems)技术的发展,MEMS移相器,因其小型化、损耗低、成本低、性能好等优势,已广泛应用于各种雷达和卫星导航等领域中。其中分布式MEMS移相器相对于其他形式的MEMS移相器工艺制造更容易、体积更小、性能更好,并被誉为“最有吸引力的器件之一”,因此成为国内外学者研究的热点。With the development of RF MEMS (Micro-electromechanical Systems) technology, MEMS phase shifters have been widely used in various radar and satellite navigation fields due to their advantages of miniaturization, low loss, low cost, and good performance. Among them, the distributed MEMS phase shifter is easier to manufacture, smaller in size and better in performance than other forms of MEMS phase shifters, and is known as "one of the most attractive devices", so it has become a research topic for domestic and foreign scholars. hotspots.
分布式MEMS移相器利用“R-L-C”网络实现移相功能。“R-L-C”网络由若干个“R-L-C”(移相)单元按照一定规则组成,每个“R-L-C”单元只能完成有限的移相。而“R-L-C”移相单元是以机械的物理结构形式出现的。要完成整个移相器移相的功能,需要大量的机械结构单元,随着机械结构单元数目阶跃性的增长,各种副作用也会随之产生。因此,在日益严峻的军事需求下,发展具有高性能、高抗干扰性能的分布式MEMS移相器就凸显的尤为重要。分布式MEMS移相器是电磁、精密机械结构等多学科相结合的系统,其电性能不仅取决于电磁学科的设计水平,同时也取决于机械结构的设计水平。机械结构不仅是电性能的载体和保障,并且往往制约着电性能的实现,同时,电性能的实现对机械结构也提出了更高的要求。分布式MEMS移相器是多个MEMS桥重复排列组成的结构,由于机械加工设备精度、安装精度的限制,以及工作过程中受到振动、热功耗等外载荷的影响,致使MEMS桥高度发生改变,从而使得移相器的相移量产生偏差,性能降低。因此,为了降低MEMS桥高度误差对相移量的影响,确保分布式MEMS移相器能够正常工作,必须对控制MEMS桥高度的工作电压进行调整。The distributed MEMS phase shifter utilizes the "R-L-C" network to realize the phase shifting function. The "R-L-C" network is composed of several "R-L-C" (phase-shifting) units according to certain rules, and each "R-L-C" unit can only complete limited phase-shifting. The "R-L-C" phase shifting unit appears in the form of a mechanical physical structure. To complete the phase-shifting function of the entire phase shifter, a large number of mechanical structural units are required. As the number of mechanical structural units increases stepwise, various side effects will also occur. Therefore, under the increasingly severe military requirements, it is particularly important to develop a distributed MEMS phase shifter with high performance and high anti-interference performance. Distributed MEMS phase shifter is a multidisciplinary system combining electromagnetics and precision mechanical structures. Its electrical performance depends not only on the design level of electromagnetic disciplines, but also on the design level of mechanical structures. Mechanical structure is not only the carrier and guarantee of electrical performance, but also often restricts the realization of electrical performance. At the same time, the realization of electrical performance also puts forward higher requirements for mechanical structure. The distributed MEMS phase shifter is a structure composed of multiple MEMS bridges repeatedly arranged. Due to the limitation of machining equipment precision and installation precision, and the influence of external loads such as vibration and thermal power consumption during the working process, the height of the MEMS bridge changes. , so that the phase shift amount of the phase shifter is deviated, and the performance is degraded. Therefore, in order to reduce the influence of the MEMS bridge height error on the phase shift and ensure the normal operation of the distributed MEMS phase shifter, the working voltage for controlling the MEMS bridge height must be adjusted.
因此,有必要利用分布式MEMS移相器MEMS桥结构参数和相移量之间的机电耦合模型,根据测量的相移量反推计算出MEMS桥高度的误差,利用控制电压和MEMS桥高度关系式,快速给出工作电压调整量,保证分布式MEMS移相器受外界环境影响下仍能正常工作。Therefore, it is necessary to use the electromechanical coupling model between the structural parameters of the MEMS bridge and the phase shift of the distributed MEMS phase shifter, calculate the error of the height of the MEMS bridge according to the measured phase shift, and use the relationship between the control voltage and the height of the MEMS bridge The formula quickly gives the adjustment amount of the working voltage to ensure that the distributed MEMS phase shifter can still work normally under the influence of the external environment.
发明内容Contents of the invention
基于上述问题,为了保证分布式MEMS移相器在实际工作环境中相移量的性能,本发明利用分布式MEMS移相器结构参数MEMS桥高度和相移量之间的机电耦合模型,可以实现分布式MEMS移相器结构参数和电参数耦合分析,有效地解决了分布式MEMS移相器工作过程中无法确定MEMS桥高度的问题,结合工作电压对MEMS桥的控制关系式,直接得到工作电压调整量,为分布式MEMS移相器实际工作中的可靠性提供了理论指导。Based on the above-mentioned problems, in order to ensure the performance of the phase shift amount of the distributed MEMS phase shifter in the actual working environment, the present invention utilizes the electromechanical coupling model between the structural parameters of the distributed MEMS phase shifter MEMS bridge height and the phase shift amount to realize The coupling analysis of structural parameters and electrical parameters of the distributed MEMS phase shifter effectively solves the problem that the height of the MEMS bridge cannot be determined during the working process of the distributed MEMS phase shifter. Combined with the control relationship between the operating voltage and the MEMS bridge, the operating voltage can be directly obtained The adjustment amount provides a theoretical guidance for the reliability of the distributed MEMS phase shifter in actual work.
实现本发明目的的技术解决方案是,一种基于相移量机电耦合的分布式MEMS移相器工作电压的调整方法,该方法包括下述步骤:The technical solution that realizes the object of the present invention is, a kind of method for adjusting the operating voltage of the distributed MEMS phase shifter based on phase shift amount electromechanical coupling, the method comprises the following steps:
(1)根据分布式MEMS移相器的基本结构,确定分布式MEMS移相器的结构参数、材料属性和电磁工作参数;(1) According to the basic structure of the distributed MEMS phase shifter, determine the structural parameters, material properties and electromagnetic working parameters of the distributed MEMS phase shifter;
(2)根据分布式MEMS移相器设计要求,确定分布式MEMS移相器的工作电压标准值V0和相移量标准值Δφ0;(2) According to the design requirements of the distributed MEMS phase shifter, determine the working voltage standard value V of the distributed MEMS phase shifter 0 and the phase shift amount standard value Δφ 0 ;
(3)对分布式MEMS移相器施加2V0的工作电压,测量分布式MEMS移相器此工作状态下,M个MEMS桥中第i个(1≤i≤M)MEMS桥产生的相移量Δφi;(3) Apply a working voltage of 2V 0 to the distributed MEMS phase shifter, and measure the phase shift generated by the i-th (1≤i≤M) MEMS bridge among the M MEMS bridges under the working state of the distributed MEMS phase shifter Quantity Δφ i ;
(4)比较相移量测量值Δφi与标准值Δφ0,如果测量值大于标准值,则继续步骤5,否则转至步骤8;(4) Compare the measured value of phase shift Δφ i with the standard value Δφ 0 , if the measured value is greater than the standard value, continue to step 5, otherwise go to step 8;
(5)当相移量测量值Δφi大于标准值Δφ0时,可得MEMS桥有向上的高度误差,计算第i个MEMS桥的等效电路参数;(5) When the phase shift measurement value Δφ i is greater than the standard value Δφ 0 , it can be obtained that the MEMS bridge has an upward height error, and the equivalent circuit parameters of the i-th MEMS bridge are calculated;
(6)利用单个MEMS桥的机电耦合模型,反推计算第i个MEMS桥向上的高度误差值;(6) Utilize the electromechanical coupling model of a single MEMS bridge, reversely calculate the height error value of the i-th MEMS bridge upward;
(7)利用工作电压对MEMS桥高度的控制关系式,根据MEMS桥向上的高度误差值,分别计算第i个MEMS桥“up”和“down”两个工作状态下工作电压的调整量,然后转至步骤(11);(7) Utilize the control relational expression of operating voltage to the height of MEMS bridge, according to the height error value of MEMS bridge upward, calculate the adjustment amount of operating voltage under two operating states of "up" and "down" of the i-th MEMS bridge respectively, and then Go to step (11);
(8)当相移量测量值Δφi小于或等于标准值Δφ0时,可得MEMS桥有向下的高度误差,计算第i个MEMS桥的等效电路参数;(8) When the phase shift measurement value Δφ i is less than or equal to the standard value Δφ 0 , it can be obtained that the MEMS bridge has a downward height error, and the equivalent circuit parameters of the i-th MEMS bridge are calculated;
(9)利用单个MEMS桥的机电耦合模型,反推计算第i个MEMS桥向下的高度误差值;(9) Utilize the electromechanical coupling model of a single MEMS bridge, reversely calculate the downward height error value of the ith MEMS bridge;
(10)利用工作电压对MEMS桥高度的控制关系式,根据MEMS桥向下的高度误差值,计算第i个MEMS桥“up”工作状态下工作电压的调整量;(10) Utilize the control relationship expression of the working voltage to the height of the MEMS bridge, and calculate the adjustment amount of the working voltage under the "up" working state of the i-th MEMS bridge according to the downward height error value of the MEMS bridge;
(11)判断是否已对全部MEMS桥计算了工作电压的调整量,如果是,则得到了M个MEMS桥工作电压的调整量,否则,测量下一个MEMS桥的相移量,并重复步骤(3)到步骤(11);(11) judge whether the adjustment amount of working voltage has been calculated to all MEMS bridges, if so, then obtain the adjustment amount of M MEMS bridge operating voltages, otherwise, measure the phase shift amount of next MEMS bridge, and repeat step ( 3) to step (11);
(12)利用计算出的工作电压调整量,重新施加到相应的MEMS桥上,测量分布式MEMS移相器的整体相移量;(12) Utilize the calculated operating voltage adjustment amount to reapply to the corresponding MEMS bridge to measure the overall phase shift amount of the distributed MEMS phase shifter;
(13)判断调整电压后的分布式MEMS移相器电性能是否满足指标要求,如果满足,则说明得到了分布式MEMS移相器工作电压的最优调整量,可使分布式MEMS移相器在工作环境下达到最优性能;否则,修改分布式MEMS移相器的结构参数,并重复步骤(1)到步骤(13),直至满足要求。(13) Determine whether the electrical performance of the distributed MEMS phase shifter after adjusting the voltage meets the index requirements. If it is satisfied, it means that the optimal adjustment amount of the operating voltage of the distributed MEMS phase shifter has been obtained, which can make the distributed MEMS phase shifter Reach the optimal performance in the working environment; otherwise, modify the structural parameters of the distributed MEMS phase shifter, and repeat steps (1) to (13) until the requirements are met.
所述步骤(1)分布式MEMS移相器的结构参数,包括共面波导传输线、MEMS桥和介质层的长度、宽度和厚度,相邻两个桥的间距,以及MEMS桥距介质层的高度;所述分布式MEMS移相器的材料属性包括介质层的相对介电常数;所述分布式MEMS移相器的电磁工作参数包括分布式MEMS移相器的电磁工作频率ω。The structural parameters of the step (1) distributed MEMS phase shifter include the length, width and thickness of the coplanar waveguide transmission line, the MEMS bridge and the dielectric layer, the distance between two adjacent bridges, and the height of the MEMS bridge from the dielectric layer ; The material properties of the distributed MEMS phase shifter include the relative permittivity of the dielectric layer; the electromagnetic operating parameters of the distributed MEMS phase shifter include the electromagnetic operating frequency ω of the distributed MEMS phase shifter.
所述步骤(5)当相移量测量值Δφi大于标准值Δφ0时,计算第i个MEMS桥的等效电路参数:Described step (5) calculates the equivalent circuit parameter of the i-th MEMS bridge when the phase shift measurement value Δφ i is greater than the standard value Δφ 0 :
(5a)将步骤(3)中的相移量测量值与步骤(2)的标准值比较,当相移量测量值Δφi大于标准值Δφ0时,可得MEMS桥有向上的高度误差;(5a) compare the phase shift measured value in step (3) with the standard value of step (2), when the phase shift measured value Δφ i is greater than the standard value Δφ 0 , the MEMS bridge has an upward height error;
(5b)计算第i个MEMS桥的等效电路参数,MEMS桥未加载时,传输线上单位长度的等效电容值Ct公式为:(5b) Calculate the equivalent circuit parameters of the i-th MEMS bridge. When the MEMS bridge is not loaded, the equivalent capacitance value C t per unit length on the transmission line is:
式中,εr是介质层的相对介电常数,c是光速,Z0是传输线的特征阻抗;In the formula, ε r is the relative permittivity of the dielectric layer, c is the speed of light, Z 0 is the characteristic impedance of the transmission line;
MEMS桥未加载时,传输线上单位长度的等效电感值Lt公式为:When the MEMS bridge is not loaded, the formula of the equivalent inductance L t per unit length on the transmission line is:
式中,Ct是传输线上单位长度的等效电容值,Z0是传输线的特征阻抗。In the formula, C t is the equivalent capacitance value per unit length on the transmission line, and Z 0 is the characteristic impedance of the transmission line.
所述步骤(6)利用单个MEMS桥的机电耦合模型,反推计算第i个MEMS桥向上的高度误差值:Described step (6) utilizes the electromechanical coupling model of single MEMS bridge, back-calculates the upward height error value of i-th MEMS bridge:
(6a)利用单个MEMS桥的机电耦合模型,以及步骤(3)第i个MEMS桥相移量的测量值可反推计算出“up”工作状态下可变电容值Cui(Δh),该耦合模型如下:(6a) Using the electromechanical coupling model of a single MEMS bridge and the measured value of the phase shift of the i-th MEMS bridge in step (3), the variable capacitance value C ui (Δh) in the "up" working state can be calculated inversely. The coupling model is as follows:
式中,s是相邻MEMS桥间距值,ω是工作频率,Ct是传输线上单位长度的等效电容值,Lt是传输线上单位长度的等效电感值,Cd是“down”工作状态下可变电容值,Cui(Δh)是“up”工作状态下可变电容值;Δφi是第i个MEMS桥相移量的测量值;In the formula, s is the distance between adjacent MEMS bridges, ω is the operating frequency, C t is the equivalent capacitance value per unit length on the transmission line, L t is the equivalent inductance value per unit length on the transmission line, and C d is the "down" working The variable capacitance value in the state, C ui (Δh) is the variable capacitance value in the "up" working state; Δφ i is the measured value of the i-th MEMS bridge phase shift;
(6b)根据步骤(6a)计算的“up”工作状态下可变电容值Cui(Δh),利用“up”工作状态下可变电容值与MEMS桥高度误差的关系式,可以反推得到第i个MEMS桥向上的高度误差Δh,该关系式如下:(6b) According to the variable capacitance value C ui (Δh) in the "up" working state calculated in step (6a), using the relationship between the variable capacitance value and the MEMS bridge height error in the "up" working state, it can be inversely obtained The upward height error Δh of the i-th MEMS bridge, the relationship is as follows:
式中,wc是中心导体宽度,wb是桥宽度,h是MEMS桥距介质层的理想高度,td是介质层厚度,ε0是空气的相对介电常数,εr是介质层的相对介电常数,L是MEMS桥长,Δh是MEMS桥向上的高度误差。In the formula, w c is the width of the central conductor, w b is the width of the bridge, h is the ideal height of the MEMS bridge from the dielectric layer, t d is the thickness of the dielectric layer, ε 0 is the relative permittivity of air, ε r is the dielectric layer Relative permittivity, L is the length of the MEMS bridge, and Δh is the height error of the MEMS bridge upward.
所述步骤(7)利用工作电压对MEMS桥高度的控制关系式,根据MEMS桥向上的高度误差值,分别计算第i个MEMS桥“up”和“down”两个工作状态下工作电压的调整量:The step (7) utilizes the control relational expression of the working voltage to the height of the MEMS bridge, and according to the upward height error value of the MEMS bridge, calculates the adjustment of the working voltage under the two working states of the i-th MEMS bridge "up" and "down" respectively quantity:
(7a)工作电压对MEMS桥高度的控制关系式如下所示:(7a) The control relationship between the working voltage and the height of the MEMS bridge is as follows:
式中,k是MEMS桥的弹性刚度,h是MEMS桥的理想高度,ε0是空气的相对介电常数,wc是中心导体宽度,wb是桥宽度;where k is the elastic stiffness of the MEMS bridge, h is the ideal height of the MEMS bridge, ε0 is the relative permittivity of air, wc is the center conductor width, and wb is the bridge width;
(7b)根据步骤(6b)中MEMS桥向上的高度误差值,因MEMS桥“up”工作状态下的理想工作电压为零,故计算第i个MEMS桥“up”工作状态下工作电压的调整量如下:(7b) According to the upward height error value of the MEMS bridge in step (6b), because the ideal working voltage under the MEMS bridge "up" working state is zero, so calculate the adjustment of the working voltage under the i-th MEMS bridge "up" working state The amount is as follows:
式中,k是MEMS桥的弹性刚度,Δh是MEMS桥向上的高度误差,ε0是空气的相对介电常数,wc是中心导体宽度,wb是桥宽度;where k is the elastic stiffness of the MEMS bridge, Δh is the upward height error of the MEMS bridge, ε0 is the relative permittivity of air, wc is the width of the central conductor, and wb is the width of the bridge;
(7c)根据步骤(6b)中MEMS桥向上的高度误差值,因MEMS桥“down”工作状态下理想的工作电压为Vd 0,所以第i个MEMS桥“down”工作状态下工作电压的调整量如下:(7c) According to the upward height error value of the MEMS bridge in step (6b), because the ideal working voltage of the MEMS bridge in the "down" working state is V d 0 , the working voltage of the i-th MEMS bridge in the "down" working state is The adjustments are as follows:
式中,k是MEMS桥的弹性刚度,h是MEMS桥的理想高度,Δh是MEMS桥向上的高度误差,ε0是空气的相对介电常数,wc是中心导体宽度,wb是桥宽度。where k is the elastic stiffness of the MEMS bridge, h is the ideal height of the MEMS bridge, Δh is the upward height error of the MEMS bridge, ε0 is the relative permittivity of air, wc is the center conductor width, and wb is the bridge width .
所述步骤(8)当相移量测量值Δφi小于或等于标准值Δφ0时,计算第i个MEMS桥的等效电路参数:Described step (8) when phase shift amount measurement value Δφ i is less than or equal to standard value Δφ 0 , calculate the equivalent circuit parameter of the i-th MEMS bridge:
(8a)将步骤(3)中的相移量测量值与步骤(2)的标准值比较,当相移量测量值Δφi小于标准值Δφ0时,可得MEMS桥有向下的高度误差,当相移量测量值Δφi等于标准值Δφ0时,MEMS桥没有误差,工作电压不需要调整;(8a) Compare the measured value of phase shift in step (3) with the standard value of step (2), when the measured value of phase shift Δφ i is less than the standard value Δφ 0 , it can be concluded that the MEMS bridge has a downward height error , when the phase shift measurement value Δφ i is equal to the standard value Δφ 0 , the MEMS bridge has no error, and the working voltage does not need to be adjusted;
(8b)计算第i个MEMS桥的等效电路参数,MEMS桥未加载时,传输线上单位长度的等效电容值Ct公式为:(8b) Calculate the equivalent circuit parameters of the i-th MEMS bridge. When the MEMS bridge is not loaded, the equivalent capacitance value C t per unit length on the transmission line is:
式中,εr是介质层的相对介电常数,c是光速,Z0是传输线的特征阻抗;In the formula, ε r is the relative permittivity of the dielectric layer, c is the speed of light, Z 0 is the characteristic impedance of the transmission line;
MEMS桥未加载时,传输线上单位长度的等效电感值Lt公式为:When the MEMS bridge is not loaded, the formula of the equivalent inductance L t per unit length on the transmission line is:
式中,Ct是传输线上单位长度的等效电容值,Z0是传输线的特征阻抗。In the formula, C t is the equivalent capacitance value per unit length on the transmission line, and Z 0 is the characteristic impedance of the transmission line.
所述步骤(9)利用单个MEMS桥的机电耦合模型,反推计算第i个MEMS桥向下的高度误差值:Described step (9) utilizes the electromechanical coupling model of single MEMS bridge, reversely calculates the downward height error value of the ith MEMS bridge:
(9a)利用单个MEMS桥的机电耦合模型,以及步骤(3)第i个MEMS桥相移量的测量值可反推计算出“up”工作状态下可变电容值Cui(Δh),该耦合模型如下:(9a) Using the electromechanical coupling model of a single MEMS bridge, and the measured value of the phase shift of the i-th MEMS bridge in step (3), the variable capacitance value C ui (Δh) in the "up" working state can be calculated inversely. The coupling model is as follows:
式中,s是相邻MEMS桥间距值,ω是工作频率,Ct是传输线上单位长度的等效电容值,Lt是传输线上单位长度的等效电感值,Cd是“down”工作状态下可变电容值,Cui(Δh)是“up”工作状态下可变电容值”;Δφi是第i个MEMS桥相移量的测量值;In the formula, s is the distance between adjacent MEMS bridges, ω is the operating frequency, C t is the equivalent capacitance value per unit length on the transmission line, L t is the equivalent inductance value per unit length on the transmission line, and C d is the "down" working The variable capacitance value in the state, C ui (Δh) is the variable capacitance value in the "up" working state"; Δφ i is the measured value of the i-th MEMS bridge phase shift;
(9b)根据步骤(9a)计算的“up”工作状态下可变电容值Cui(Δh),利用“up”工作状态下可变电容值与MEMS桥高度误差的关系式,可以反推得到第i个MEMS桥向下的高度误差Δh,该关系式如下:(9b) According to the variable capacitance value C ui (Δh) in the "up" working state calculated in step (9a), using the relationship between the variable capacitance value and the MEMS bridge height error in the "up" working state, it can be inversely obtained The downward height error Δh of the i-th MEMS bridge, the relationship is as follows:
式中,wc是中心导体宽度,wb是桥宽度,h是MEMS桥距介质层的理想高度,td是介质层厚度,ε0是空气的相对介电常数,εr是介质层的相对介电常数,L是MEMS桥长,Δh是MEMS桥向下的高度误差。In the formula, w c is the width of the central conductor, w b is the width of the bridge, h is the ideal height of the MEMS bridge from the dielectric layer, t d is the thickness of the dielectric layer, ε 0 is the relative permittivity of air, ε r is the dielectric layer Relative permittivity, L is the length of the MEMS bridge, Δh is the height error of the MEMS bridge downward.
所述步骤(10)利用工作电压对MEMS桥高度的控制关系式,根据MEMS桥向下的高度误差值,计算第i个MEMS桥“up”工作状态下工作电压的调整量根据步骤(7a)中工作电压对MEMS桥高度的控制关系式,利用步骤(9b)MEMS桥向下的高度误差值,因MEMS桥“up”工作状态下的理想工作电压为零,故计算第i个MEMS桥“up”工作状态下工作电压的调整量如下:The step (10) utilizes the control relational expression of the working voltage to the height of the MEMS bridge, and calculates the adjustment amount of the working voltage under the "up" working state of the i-th MEMS bridge according to the downward height error value of the MEMS bridge. According to step (7a) In the middle working voltage to the control relational expression of MEMS bridge height, utilize step (9b) the height error value of MEMS bridge downward, because the ideal working voltage under the MEMS bridge " up " work state is zero, so calculate the ith MEMS bridge " The adjustment value of the working voltage in the working state is as follows:
式中,k是MEMS桥的弹性刚度,Δh是MEMS桥向下的高度误差,ε0是空气的相对介电常数,wc是中心导体宽度,wb是桥宽度。where k is the elastic stiffness of the MEMS bridge, Δh is the downward height error of the MEMS bridge, ε0 is the relative permittivity of air, wc is the width of the central conductor, and wb is the width of the bridge.
本发明与现有技术相比,具有以下特点:Compared with the prior art, the present invention has the following characteristics:
1.本发明利用分布式MEMS移相器中关键结构参数MEMS桥高度和电参数相移量之间耦合关系的耦合模型,可直接分析在工作过程中分布式MEMS移相器受内部载荷环境和外界载荷环境的影响,导致MEMS桥高度偏移对相移量的影响,解决了目前不能直接得到结构参数和电参数的问题。1. The present invention utilizes the coupling model of the coupling relationship between the key structural parameter MEMS bridge height and the electric parameter phase shift amount in the distributed MEMS phase shifter, and can directly analyze that the distributed MEMS phase shifter is affected by the internal load environment and The influence of the external load environment leads to the influence of the height offset of the MEMS bridge on the phase shift, which solves the problem that the structural parameters and electrical parameters cannot be obtained directly at present.
2.利用分布式MEMS移相器机电耦合模型,当测量出分布式MEMS移相器相移量时,可定量得到MEMS桥高度的误差,利用工作电压对MEMS桥高度的控制关系式,可快速给出合理的工作电压调整量,有效降低了分布式MEMS移相器在实际工况下环境载荷对其电性能的影响。2. Using the electromechanical coupling model of the distributed MEMS phase shifter, when the phase shift of the distributed MEMS phase shifter is measured, the error of the height of the MEMS bridge can be quantitatively obtained, and the control relationship between the working voltage and the height of the MEMS bridge can be quickly A reasonable working voltage adjustment is given, which effectively reduces the influence of the environmental load on the electrical performance of the distributed MEMS phase shifter under actual working conditions.
附图说明Description of drawings
图1是本发明一种基于相移量机电耦合的分布式MEMS移相器工作电压的调整方法的流程图;Fig. 1 is a kind of flow chart of the adjustment method of the distributed MEMS phase shifter operating voltage based on phase shift electromechanical coupling of the present invention;
图2是分布式MEMS移相器“up”工作状态下部分结构示意图;Figure 2 is a schematic diagram of the partial structure of the distributed MEMS phase shifter in the "up" working state;
图3是分布式MEMS移相器“down”工作状态下部分结构示意图;Figure 3 is a schematic diagram of the partial structure of the distributed MEMS phase shifter in the "down" working state;
图4是分布式MEMS移相器剖面示意图。Fig. 4 is a schematic cross-sectional view of a distributed MEMS phase shifter.
具体实施方式Detailed ways
下面结合附图及实施例对本发明做进一步说明。The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
参照图1,本发明为一种基于相移量机电耦合的分布式MEMS移相器工作电压的调整方法,具体步骤如下:Referring to Fig. 1, the present invention is a method for adjusting the working voltage of a distributed MEMS phase shifter based on electromechanical coupling of phase shift, and the specific steps are as follows:
步骤1,确定分布式MEMS移相器的结构参数和电磁工作参数。Step 1, determine the structural parameters and electromagnetic working parameters of the distributed MEMS phase shifter.
分布式MEMS移相器结构参数如图2所示,包括共面波导传输线、MEMS桥和介质层的长度、宽度和厚度,相邻两个桥的间距,MEMS桥距介质层的高度。分布式MEMS移相器的材料属性,包括介质层的相对介电常数。分布式MEMS移相器的电磁工作参数,包括分布式MEMS移相器的电磁工作频率ω。The structural parameters of the distributed MEMS phase shifter are shown in Figure 2, including the length, width and thickness of the coplanar waveguide transmission line, MEMS bridge and dielectric layer, the distance between two adjacent bridges, and the height of the MEMS bridge from the dielectric layer. Material properties of distributed MEMS phase shifters, including relative permittivity of dielectric layers. The electromagnetic working parameters of the distributed MEMS phase shifter include the electromagnetic working frequency ω of the distributed MEMS phase shifter.
步骤2,确定分布式MEMS移相器的工作电压标准值V0和相移量标准值Δφ0。Step 2, determining the standard value V 0 of the working voltage and the standard value Δφ 0 of the phase shift amount of the distributed MEMS phase shifter.
步骤3,测量分布式MEMS移相器第i个(1≤i≤M)MEMS桥产生的相移量Δφi。Step 3, measure the phase shift Δφ i generated by the i-th (1≤i≤M) MEMS bridge of the distributed MEMS phase shifter.
对分布式MEMS移相器施加2V0的工作电压,测量分布式MEMS移相器此工作状态下,M个MEMS桥中第i个(1≤i≤M)MEMS桥产生的相移量Δφi。Apply a working voltage of 2V 0 to the distributed MEMS phase shifter, and measure the phase shift Δφ i of the i-th (1≤i≤M) MEMS bridge among the M MEMS bridges under the working state of the distributed MEMS phase shifter .
步骤4,比较相移量测量值Δφi与标准值Δφ0。Step 4, comparing the phase shift measured value Δφ i with the standard value Δφ 0 .
如果测量值大于标准值,则继续步骤5,否则转至步骤8。If the measured value is greater than the standard value, continue to step 5, otherwise go to step 8.
步骤5,当相移量测量值Δφi大于标准值Δφ0时,计算第i个MEMS桥的等效电路参数。Step 5, when the phase shift measured value Δφ i is greater than the standard value Δφ 0 , calculate the equivalent circuit parameters of the i-th MEMS bridge.
(5a)将步骤3中的相移量测量值与步骤2的标准值比较,当相移量测量值Δφi大于标准值Δφ0时,可得MEMS桥有向上的高度误差;(5a) compare the phase shift measurement value in step 3 with the standard value of step 2, when the phase shift measurement value Δφ i is greater than the standard value Δφ 0 , the MEMS bridge has an upward height error;
(5b)计算第i个MEMS桥的等效电路参数,MEMS桥未加载时,传输线上单位长度的等效电容值Ct公式为:(5b) Calculate the equivalent circuit parameters of the i-th MEMS bridge. When the MEMS bridge is not loaded, the equivalent capacitance value C t per unit length on the transmission line is:
式中,εr是介质层的相对介电常数,c是光速,Z0是传输线的特征阻抗;In the formula, ε r is the relative permittivity of the dielectric layer, c is the speed of light, Z 0 is the characteristic impedance of the transmission line;
MEMS桥未加载时,传输线上单位长度的等效电感值Lt公式为:When the MEMS bridge is not loaded, the formula of the equivalent inductance L t per unit length on the transmission line is:
式中,Ct是传输线上单位长度的等效电容值,Z0是传输线的特征阻抗。In the formula, C t is the equivalent capacitance value per unit length on the transmission line, and Z 0 is the characteristic impedance of the transmission line.
步骤6,利用单个MEMS桥的机电耦合模型,反推计算第i个MEMS桥向上的高度误差值。Step 6: Using the electromechanical coupling model of a single MEMS bridge, back-calculate the upward height error value of the i-th MEMS bridge.
(6a)利用单个MEMS桥的机电耦合模型,以及步骤3第i个MEMS桥相移量的测量值可反推计算出“up”工作状态下可变电容值Cui(Δh),该耦合模型如下:(6a) Using the electromechanical coupling model of a single MEMS bridge and the measured value of the phase shift of the i-th MEMS bridge in step 3, the variable capacitance value C ui (Δh) in the "up" working state can be reversely calculated. The coupling model as follows:
式中,s是相邻MEMS桥间距值,ω是工作频率,Ct是传输线上单位长度的等效电容值,Lt是传输线上单位长度的等效电感值,Cd是“down”工作状态下可变电容值,Cui(Δh)是“up”工作状态下可变电容值;Δφi是第i个MEMS桥相移量的测量值;In the formula, s is the distance between adjacent MEMS bridges, ω is the operating frequency, C t is the equivalent capacitance value per unit length on the transmission line, L t is the equivalent inductance value per unit length on the transmission line, and C d is the "down" working The variable capacitance value in the state, C ui (Δh) is the variable capacitance value in the "up" working state; Δφ i is the measured value of the i-th MEMS bridge phase shift;
(6b)根据步骤(6a)计算的“up”工作状态下可变电容值Cui(Δh),利用“up”工作状态下可变电容值与MEMS桥高度误差的关系式,可以反推得到第i个MEMS桥向上的高度误差Δh,该关系式如下:(6b) According to the variable capacitance value C ui (Δh) in the "up" working state calculated in step (6a), using the relationship between the variable capacitance value and the MEMS bridge height error in the "up" working state, it can be inversely obtained The upward height error Δh of the i-th MEMS bridge, the relationship is as follows:
式中,wc是中心导体宽度,wb是桥宽度,h是MEMS桥距介质层的理想高度,td是介质层厚度,ε0是空气的相对介电常数,εr是介质层的相对介电常数,L是MEMS桥长,Δh是MEMS桥向上的高度误差。In the formula, w c is the width of the central conductor, w b is the width of the bridge, h is the ideal height of the MEMS bridge from the dielectric layer, t d is the thickness of the dielectric layer, ε 0 is the relative permittivity of air, ε r is the dielectric layer Relative permittivity, L is the length of the MEMS bridge, and Δh is the height error of the MEMS bridge upward.
步骤7,根据MEMS桥向上的高度误差值,分别计算第i个MEMS桥“up”和“down”两个工作状态下工作电压的调整量。Step 7, according to the upward height error value of the MEMS bridge, calculate the adjustment amount of the working voltage of the i-th MEMS bridge under the two working states of "up" and "down".
(7a)工作电压对MEMS桥高度的控制关系式如下所示:(7a) The control relationship between the working voltage and the height of the MEMS bridge is as follows:
式中,k是MEMS桥的弹性刚度,h是MEMS桥的理想高度,ε0是空气的相对介电常数,wc是中心导体宽度,wb是桥宽度;where k is the elastic stiffness of the MEMS bridge, h is the ideal height of the MEMS bridge, ε0 is the relative permittivity of air, wc is the center conductor width, and wb is the bridge width;
(7b)根据步骤(6b)中MEMS桥向上的高度误差值,因MEMS桥“up”工作状态下的理想工作电压为零,故计算第i个MEMS桥“up”工作状态下工作电压的调整量如下(7b) According to the upward height error value of the MEMS bridge in step (6b), because the ideal working voltage under the MEMS bridge "up" working state is zero, so calculate the adjustment of the working voltage under the i-th MEMS bridge "up" working state The amount is as follows
式中,k是MEMS桥的弹性刚度,Δh是MEMS桥向上的高度误差,ε0是空气的相对介电常数,wc是中心导体宽度,wb是桥宽度;where k is the elastic stiffness of the MEMS bridge, Δh is the upward height error of the MEMS bridge, ε0 is the relative permittivity of air, wc is the width of the central conductor, and wb is the width of the bridge;
(7c)根据步骤(6b)中MEMS桥向上的高度误差值,因MEMS桥“down”工作状态下理想的工作电压为Vd 0,所以第i个MEMS桥“down”工作状态下工作电压的调整量如下:(7c) According to the upward height error value of the MEMS bridge in step (6b), because the ideal working voltage of the MEMS bridge in the "down" working state is V d 0 , the working voltage of the i-th MEMS bridge in the "down" working state is The adjustments are as follows:
式中,k是MEMS桥的弹性刚度,h是MEMS桥的理想高度,Δh是MEMS桥向上的高度误差,ε0是空气的相对介电常数,wc是中心导体宽度,wb是桥宽度。where k is the elastic stiffness of the MEMS bridge, h is the ideal height of the MEMS bridge, Δh is the upward height error of the MEMS bridge, ε0 is the relative permittivity of air, wc is the center conductor width, and wb is the bridge width .
步骤8,当相移量测量值Δφi小于或等于标准值Δφ0时,计算第i个MEMS桥的等效电路参数。Step 8, when the phase shift measured value Δφ i is less than or equal to the standard value Δφ 0 , calculate the equivalent circuit parameters of the i-th MEMS bridge.
(8a)将步骤3中的相移量测量值与步骤2的标准值比较,当相移量测量值Δφi小于标准值Δφ0时,可得MEMS桥有向下的高度误差,当相移量测量值Δφi等于标准值Δφ0时,MEMS桥没有误差,工作电压不需要调整;(8a) Compare the measured value of phase shift in step 3 with the standard value in step 2. When the measured value of phase shift Δφ i is less than the standard value Δφ 0 , it can be obtained that the MEMS bridge has a downward height error. When the phase shift When the measured value Δφ i is equal to the standard value Δφ 0 , the MEMS bridge has no error and the working voltage does not need to be adjusted;
(8b)计算第i个MEMS桥的等效电路参数,MEMS桥未加载时,传输线上单位长度的等效电容值Ct公式为:(8b) Calculate the equivalent circuit parameters of the i-th MEMS bridge. When the MEMS bridge is not loaded, the equivalent capacitance value C t per unit length on the transmission line is:
式中,εr是介质层的相对介电常数,c是光速,Z0是传输线的特征阻抗;In the formula, ε r is the relative permittivity of the dielectric layer, c is the speed of light, Z 0 is the characteristic impedance of the transmission line;
MEMS桥未加载时,传输线上单位长度的等效电感值Lt公式为:When the MEMS bridge is not loaded, the formula of the equivalent inductance L t per unit length on the transmission line is:
式中,Ct是传输线上单位长度的等效电容值,Z0是传输线的特征阻抗。In the formula, C t is the equivalent capacitance value per unit length on the transmission line, and Z 0 is the characteristic impedance of the transmission line.
步骤9,利用单个MEMS桥的机电耦合模型,反推计算第i个MEMS桥向下的高度误差值。Step 9: Using the electromechanical coupling model of a single MEMS bridge, back-calculate the downward height error value of the i-th MEMS bridge.
(9a)利用单个MEMS桥的机电耦合模型,以及步骤3第i个MEMS桥相移量的测量值可反推计算出“up”工作状态下可变电容值Cui(Δh),该耦合模型如下:(9a) Using the electromechanical coupling model of a single MEMS bridge and the measured value of the phase shift of the i-th MEMS bridge in step 3, the variable capacitance value C ui (Δh) in the "up" working state can be reversely calculated. The coupling model as follows:
式中,s是相邻MEMS桥间距值,ω是工作频率,Ct是传输线上单位长度的等效电容值,Lt是传输线上单位长度的等效电感值,Cd是“down”工作状态下可变电容值,Cui(Δh)是“up”工作状态下可变电容值”;Δφi是第i个MEMS桥相移量的测量值;In the formula, s is the distance between adjacent MEMS bridges, ω is the operating frequency, C t is the equivalent capacitance value per unit length on the transmission line, L t is the equivalent inductance value per unit length on the transmission line, and C d is the "down" working The variable capacitance value in the state, C ui (Δh) is the variable capacitance value in the "up" working state"; Δφ i is the measured value of the i-th MEMS bridge phase shift;
(9b)根据步骤(9a)计算的“up”工作状态下可变电容值Cui(Δh),利用“up”工作状态下可变电容值与MEMS桥高度误差的关系式,可以反推得到第i个MEMS桥向下的高度误差Δh,该关系式如下:(9b) According to the variable capacitance value C ui (Δh) in the "up" working state calculated in step (9a), using the relationship between the variable capacitance value and the MEMS bridge height error in the "up" working state, it can be inversely obtained The downward height error Δh of the i-th MEMS bridge, the relationship is as follows:
式中,wc是中心导体宽度,wb是桥宽度,h是MEMS桥距介质层的理想高度,td是介质层厚度,ε0是空气的相对介电常数,εr是介质层的相对介电常数,L是MEMS桥长,Δh是MEMS桥向下的高度误差。In the formula, w c is the width of the central conductor, w b is the width of the bridge, h is the ideal height of the MEMS bridge from the dielectric layer, t d is the thickness of the dielectric layer, ε 0 is the relative permittivity of air, ε r is the dielectric layer Relative permittivity, L is the length of the MEMS bridge, Δh is the height error of the MEMS bridge downward.
步骤10,根据MEMS桥向下的高度误差值,计算第i个MEMS桥“up”工作状态下工作电压的调整量。Step 10, according to the downward height error value of the MEMS bridge, calculate the adjustment amount of the working voltage of the i-th MEMS bridge in the "up" working state.
根据步骤(7a)中工作电压对MEMS桥高度的控制关系式,利用步骤(9b)MEMS桥向下的高度误差值,因MEMS桥“up”工作状态下的理想工作电压为零,故计算第i个MEMS桥“up”工作状态下工作电压的调整量如下:According to the control relationship between the working voltage and the height of the MEMS bridge in step (7a), using the downward height error value of the MEMS bridge in step (9b), because the ideal working voltage under the "up" working state of the MEMS bridge is zero, the first calculated The adjustment amount of the working voltage of the i MEMS bridge "up" working state is as follows:
式中,k是MEMS桥的弹性刚度,Δh是MEMS桥向下的高度误差,ε0是空气的相对介电常数,wc是中心导体宽度,wb是桥宽度。where k is the elastic stiffness of the MEMS bridge, Δh is the downward height error of the MEMS bridge, ε0 is the relative permittivity of air, wc is the width of the central conductor, and wb is the width of the bridge.
步骤11,判断是否已对全部MEMS桥计算了工作电压的调整量。Step 11, judging whether the adjustment amount of the working voltage has been calculated for all MEMS bridges.
如果是,则得到了M个MEMS桥工作电压的调整量,否则,测量下一个MEMS桥的相移量,并重复步骤3到步骤11;If yes, then the adjustments of the M MEMS bridge operating voltages have been obtained, otherwise, measure the phase shift of the next MEMS bridge, and repeat step 3 to step 11;
步骤12,测量分布式MEMS移相器的整体相移量。Step 12, measuring the overall phase shift of the distributed MEMS phase shifter.
利用计算出的工作电压调整量,重新施加到相应的MEMS桥上,测量分布式MEMS移相器的整体相移量。Using the calculated operating voltage adjustment, re-apply to the corresponding MEMS bridge to measure the overall phase shift of the distributed MEMS phase shifter.
步骤13,判断调整电压后的分布式MEMS移相器电性能是否满足指标要求。Step 13, judging whether the electrical performance of the distributed MEMS phase shifter after the voltage adjustment meets the index requirement.
如果满足,则说明得到了分布式MEMS移相器工作电压的最优调整量,可使分布式MEMS移相器在工作环境下达到最优性能;否则,修改分布式MEMS移相器的结构参数,并重复步骤1到步骤13,直至满足要求。If it is satisfied, it means that the optimal adjustment amount of the operating voltage of the distributed MEMS phase shifter has been obtained, which can make the distributed MEMS phase shifter achieve optimal performance in the working environment; otherwise, modify the structural parameters of the distributed MEMS phase shifter , and repeat steps 1 to 13 until the requirements are met.
本发明的优点可通过以下仿真实验进一步说明:Advantages of the present invention can be further illustrated by following simulation experiments:
一、确定分布式MEMS移相器的参数1. Determine the parameters of the distributed MEMS phase shifter
本实例中以工作频率为1GHZ、4位分布式MEMS移相器(每个MEMS桥标准相移量为22.5°)为例。图2为4个MEMS桥的示意图,图2、图3分别是MEMS移相器“up”、“down”工作状态下部分结构示意,图2中,A为介质层,B为MEMS桥,C为共面波导传输线,D为MEMS桥间距。图4给出了分布式MEMS移相器剖面示意图。分布式MEMS移相器的几何模型参数如表1所示、材料属性如表2所示。In this example, a 4-bit distributed MEMS phase shifter with a working frequency of 1GHZ (the standard phase shift amount of each MEMS bridge is 22.5°) is taken as an example. Figure 2 is a schematic diagram of four MEMS bridges. Figure 2 and Figure 3 are partial structural schematic diagrams of MEMS phase shifters in "up" and "down" working states. In Figure 2, A is the dielectric layer, B is the MEMS bridge, and C is the coplanar waveguide transmission line, and D is the distance between the MEMS bridges. Figure 4 shows a schematic cross-sectional view of a distributed MEMS phase shifter. The geometric model parameters of the distributed MEMS phase shifter are shown in Table 1, and the material properties are shown in Table 2.
表1分布式MEMS移相器的几何模型参数Table 1 Geometric model parameters of distributed MEMS phase shifter
表2分布式MEMS移相器的材料属性Table 2 Material properties of distributed MEMS phase shifters
二、反推计算分布式MEMS移相器MEMS桥高度的误差2. Reverse calculation of the error of the height of the MEMS bridge of the distributed MEMS phase shifter
1.测量分布式MEMS移相器在2V0工作状态下,4个MEMS桥中每个MEMS桥产生的相移量1. Measure the phase shift generated by each MEMS bridge in the 4 MEMS bridges under the 2V 0 working state of the distributed MEMS phase shifter
根据实际工作中第一个MEMS桥相移量的测量值为21.92°,由于测量值小于标准值22.5°,所以MEMS桥有向下的高度误差。According to the measured value of the phase shift of the first MEMS bridge in actual work is 21.92°, since the measured value is less than the standard value of 22.5°, the MEMS bridge has a downward height error.
2.计算分布式MEMS移相器等效电路参数值2. Calculate the parameter value of the equivalent circuit of the distributed MEMS phase shifter
2.1计算传输线上单位长度的等效电容值Ct如公式(1)所示:2.1 Calculate the equivalent capacitance C t per unit length on the transmission line as shown in formula (1):
式中,εr是介质层的相对介电常数,氮化硅的相对介电常数为7,c=3×108m/s为光速Z0是传输线的特征阻抗为50;In the formula, ε r is the relative permittivity of the dielectric layer, the relative permittivity of silicon nitride is 7, c=3×10 8 m/s is the speed of light Z 0 is the characteristic impedance of the transmission line is 50;
2.2通过单位长度的等效电容值,计算传输线上单位长度的等效电感值Lt,如公式(2):2.2 Calculate the equivalent inductance value L t per unit length on the transmission line through the equivalent capacitance value per unit length, such as formula (2):
式中,Ct是传输线上单位长度的等效电容值,Z0是传输线的特征阻抗为50。In the formula, C t is the equivalent capacitance value per unit length on the transmission line, Z 0 is the characteristic impedance of the transmission line is 50.
3.根据上述第一个MEMS桥的测量值,基于机电耦合模型反推计算第一个MEMS桥高度的误差3. According to the measured value of the first MEMS bridge above, calculate the error of the height of the first MEMS bridge based on the electromechanical coupling model
3.1相移量与MEMS桥高度的机电耦合模型关系式如下:3.1 The relationship between the phase shift and the height of the MEMS bridge electromechanical coupling model is as follows:
将表3中4个MEMS桥相移量测量值分布带入公式3,求得工作过程中“up”工作状态下的电容值;Bring the measured value distribution of the phase shift of the four MEMS bridges in Table 3 into Formula 3 to obtain the capacitance value in the "up" working state during the working process;
3.2利用“up”工作状态下可变电容值与MEMS桥高度误差的关系式,即公式4可以反推得到第MEMS桥向上的高度误差Δh。3.2 Using the relationship between the variable capacitance value and the height error of the MEMS bridge in the "up" working state, that is, formula 4 can be reversed to obtain the upward height error Δh of the MEMS bridge.
得到第一个MEMS桥的高度误差值为0.54um。The height error value of the first MEMS bridge is 0.54um.
三、计算第一个MEMS桥工作电压的调整量3. Calculate the adjustment amount of the first MEMS bridge working voltage
将上述所求的第一个MEMS桥向上的高度误差值带入公式5中,由于MEMS桥存在向下的高度误差,所以只需调整“up”工作状态下的工作电压。工作电压调整量如下式所示:Bring the above-mentioned upward height error value of the first MEMS bridge into Equation 5. Since the MEMS bridge has a downward height error, it is only necessary to adjust the working voltage in the "up" working state. The working voltage adjustment amount is shown in the following formula:
式中,MEMS桥的弹性系数k的取值为69.4×1015N/m,计算得到第一个MEMS桥工作电压调整量为1.14V。In the formula, the value of the elastic coefficient k of the MEMS bridge is 69.4×10 15 N/m, and the calculated working voltage adjustment of the first MEMS bridge is 1.14V.
四、计算其余三个MEMS桥的工作电压调整量4. Calculate the working voltage adjustment of the remaining three MEMS bridges
按照上述过程,依次测量其余三个MEMS桥的相移量测量值,分别计算三个MEMS桥的高度误差值,最后计算三个MEMS桥工作电压调整量。将4个MEMS桥数据汇总,如表3、表4、表5所示:According to the above process, measure the measured values of the phase shifts of the remaining three MEMS bridges in turn, calculate the height error values of the three MEMS bridges, and finally calculate the working voltage adjustments of the three MEMS bridges. Summarize the data of the four MEMS bridges, as shown in Table 3, Table 4, and Table 5:
表3 4个MEMS桥相移量测量值Table 3 Measured value of phase shift of four MEMS bridges
表4 4个MEMS桥高度的误差值Table 4 The error values of 4 MEMS bridge heights
表5 4个MEMS桥工作电压调整量Table 5 Adjustment of working voltage of 4 MEMS bridges
由于,MEMS桥相移量的测量值均小于标准值,可知MEMS桥均产生了向下的误差量。对应MEMS桥工作电压调整量均应产生向上的静电力,使MEMS桥回到标准位置。保证MEMS桥在“up”工作状态下为标准值,即可保证MEMS桥相移量为标准值。通过实例可见,利用机电耦合模型可以快速计算工作电压的调整量,能够保证分布式MEMS移相器正常工作,有效降低了分布式MEMS移相器在实际工况下环境载荷对其电性能的影响。Since the measured values of the phase shifts of the MEMS bridges are all smaller than the standard values, it can be known that the MEMS bridges all generate downward errors. Corresponding to the adjustment of the working voltage of the MEMS bridge, an upward electrostatic force should be generated to make the MEMS bridge return to the standard position. To ensure that the MEMS bridge is at the standard value in the "up" working state can ensure that the phase shift of the MEMS bridge is at the standard value. It can be seen from the examples that the adjustment amount of the working voltage can be quickly calculated by using the electromechanical coupling model, which can ensure the normal operation of the distributed MEMS phase shifter and effectively reduce the influence of the environmental load of the distributed MEMS phase shifter on its electrical performance under actual working conditions .
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610041328.7A CN105489978B (en) | 2016-01-21 | 2016-01-21 | The method of adjustment of distributed MEMS phase shifter operating voltage based on phase-shift phase mechanical-electric coupling |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610041328.7A CN105489978B (en) | 2016-01-21 | 2016-01-21 | The method of adjustment of distributed MEMS phase shifter operating voltage based on phase-shift phase mechanical-electric coupling |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105489978A CN105489978A (en) | 2016-04-13 |
CN105489978B true CN105489978B (en) | 2018-01-16 |
Family
ID=55676817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610041328.7A Active CN105489978B (en) | 2016-01-21 | 2016-01-21 | The method of adjustment of distributed MEMS phase shifter operating voltage based on phase-shift phase mechanical-electric coupling |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105489978B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109145448B (en) * | 2018-08-23 | 2020-05-05 | 西安电子科技大学 | X-frequency band MEMS phase shifter performance prediction method based on thermal environment and bridge material attributes |
CN110661064A (en) * | 2019-09-29 | 2020-01-07 | 京东方科技集团股份有限公司 | Phase shifter and preparation and packaging method thereof |
US12327901B2 (en) | 2022-01-04 | 2025-06-10 | Boe Technology Group Co., Ltd. | Phase shifter comprising a hydrophobic part and a hydrophilic part arranged relative to a first wire and second wires formed on a substrate |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103812468A (en) * | 2014-02-17 | 2014-05-21 | 东南大学 | Micro-mechanical clamped beam type pi type continuous reconfigurable microwave band-pass filter |
CN104021995A (en) * | 2014-06-13 | 2014-09-03 | 太原理工大学 | Capacitive radio frequency MEMS switch based on electrostatic repulsion |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7132723B2 (en) * | 2002-11-14 | 2006-11-07 | Raytheon Company | Micro electro-mechanical system device with piezoelectric thin film actuator |
US7175942B2 (en) * | 2004-02-05 | 2007-02-13 | International Business Machines Corporation | Method of conflict avoidance in fabrication of gate-shrink alternating phase shifting masks |
-
2016
- 2016-01-21 CN CN201610041328.7A patent/CN105489978B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103812468A (en) * | 2014-02-17 | 2014-05-21 | 东南大学 | Micro-mechanical clamped beam type pi type continuous reconfigurable microwave band-pass filter |
CN104021995A (en) * | 2014-06-13 | 2014-09-03 | 太原理工大学 | Capacitive radio frequency MEMS switch based on electrostatic repulsion |
Also Published As
Publication number | Publication date |
---|---|
CN105489978A (en) | 2016-04-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105489978B (en) | The method of adjustment of distributed MEMS phase shifter operating voltage based on phase-shift phase mechanical-electric coupling | |
Yu et al. | Improvement of isolation for MEMS capacitive switch via membrane planarization | |
Yi et al. | A capacitive power sensor based on the MEMS cantilever beam fabricated by GaAs MMIC technology | |
Chu et al. | Ka‐band RF MEMS capacitive switch with low loss, high isolation, long‐term reliability and high power handling based on GaAs MMIC technology | |
Tong et al. | Design of an on-chip highly sensitive misalignment sensor in silicon technology | |
Chen et al. | Unequal Wilkinson power divider with wide range of arbitrary power division based on recombinant technology | |
CN105449327B (en) | The determination method of distributed MEMS phase shifter capacitance bridge height tolerance based on mechanical-electric coupling | |
Zhang et al. | A GaAs MMIC-based coupling RF MEMS power sensor with both detection and non-detection states | |
Abdellatif et al. | Low‐loss compact MEMS phase shifter for phased array antennas | |
CN105550456B (en) | A kind of mechanical-electric coupling prediction technique of deformation distributed MEMS phase shifter performance | |
Matsunaga et al. | Novel two-dimensional planar negative refractive index structure | |
Yang et al. | Design and modeling of 4-bit MEMS switched-line phase shifter | |
CN109145448B (en) | X-frequency band MEMS phase shifter performance prediction method based on thermal environment and bridge material attributes | |
Luo et al. | Micro-Strip Line 90∘ Phase Shifter with Double Ground Slots for D-Band Applications | |
Eyebe et al. | Investigation on temperature-dependent dielectric properties of ETFE fluoropolymer for microwave temperature sensing applications | |
Chu et al. | One to 40 GHz ultra‐wideband RF MEMS direct‐contact switch based on GaAs MMIC technique | |
Ketterl et al. | A micromachined tunable CPW resonator | |
Sengar et al. | Design of 3-bit digital DMTL phase shifter for C-to Ku-band applications | |
Tian et al. | A structure and circuit coupling modeling method for flexible interconnection points and transmission performance of gold belt in microwave modules | |
Chen et al. | A low-loss Ka-band distributed metal-air-metal MEMS phase shifter | |
Kim et al. | Analysis of coupling characteristics between transmission lines with a buried meshed-ground in LTCC-MCMs | |
Zhou | RF MENS DC Contact Switches for Reconfigurable Antennas | |
Chen et al. | A Comprehensive Review of Surface Roughness Effects on Microwave Performance of Transmission Lines | |
Biglarbegian et al. | MEMS-based reflective-type phase-shifter for emerging millimeter-wave communication systems | |
Lei et al. | Fabrication of 3D MEMS toroidal microinductor for high temperature application |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |