CN105470177A - Wafer cleaning and drying apparatus - Google Patents

Abstract

The invention discloses a wafer cleaning and drying device. The wafer cleaning and drying device comprises: a turntable, on which the wafer is suitable for being fixed; a first fluid plate, the first fluid plate is arranged between the turntable and the wafer; The fluid plate, the second fluid plate and the first fluid plate are arranged opposite to the wafer, wherein, the surfaces of the first fluid plate and the second fluid plate facing the wafer are all provided with a plurality of nozzle holes suitable for injecting fluid, and the fluid Includes nitrogen. By setting the first fluid plate and the second fluid plate, the fluid in the first fluid plate can be sprayed on the lower surface of the wafer through the corresponding nozzle holes, and the fluid in the second fluid plate can be sprayed on the wafer through the corresponding nozzle holes. On the upper surface of the circle, the wafer can be cleaned effectively. When the fluid ejected from the first fluid plate and the second fluid plate is nitrogen, the upper and lower surfaces of the wafer can be effectively dried, and the nitrogen can effectively remove residual water marks on the upper and lower surfaces of the wafer.

Description

Wafer cleaning and drying equipment

technical field

The invention relates to the technical field of wafer drying, in particular to a wafer cleaning and drying device.

Background technique

In the production process of large-scale integrated circuits, wafers need to be processed in multiple processes. After many processes are completed, the wafer must be cleaned and dried before the wafer can enter the next process. Drying is the last process in the processing technology, and the effect of wafer drying directly affects the yield and yield of products.

A method commonly used in existing equipment is to dry the residual liquid on the surface of the wafer through high-speed rotation of the drying device, and at the same time, it is supplemented by gas purging to improve the drying efficiency. However, the drying device has the following problems: 1. No nitrogen is blown on the front of the wafer, and the liquid on the surface of the wafer is only dried by the centrifugal force of high-speed rotation, which is prone to residual water marks; Without relative movement, it can only be blown to the area where the jet holes are arranged, but not the entire wafer surface, and water marks along the radial direction of the wafer are prone to appear; 3. As the feature size of the wafer continues to decrease, the line width continues to change Narrow, it is difficult to dry the liquid in the wiring groove only by drying and purging; 4. The drying gas is heated and blown to the surface of the wafer, which will increase the surface temperature of the wafer, which will accelerate the oxidation of the wiring, affecting product performance and yield .

Contents of the invention

The present invention aims to solve one of the technical problems in the related art at least to a certain extent. For this reason, the present invention proposes a wafer cleaning and drying device capable of removing residual water marks on the upper surface of the wafer.

The wafer cleaning and drying device according to the present invention includes: a turntable, on which the wafer is adapted to be fixed; a first fluid plate, and the first fluid plate is arranged between the turntable and the wafer a second fluid plate, the second fluid plate is disposed opposite to the first fluid plate with respect to the wafer, wherein the surfaces of the first fluid plate and the second fluid plate face the wafer Each is provided with a plurality of nozzle holes suitable for injecting fluid, the fluid including nitrogen.

According to the wafer cleaning and drying device of the present invention, by setting the first fluid plate and the second fluid plate, the fluid in the first fluid plate can be sprayed on the lower surface of the wafer through the corresponding nozzle holes, and the fluid in the second fluid plate can be sprayed on the lower surface of the wafer through the corresponding nozzle holes. The fluid can be sprayed on the upper surface of the wafer through the corresponding nozzle holes, so that the upper surface and the lower surface of the wafer can be effectively cleaned. When the fluid ejected from the first fluid plate and the second fluid plate is nitrogen, nitrogen can effectively dry the upper and lower surfaces of the wafer, and nitrogen can effectively remove residual water marks on the upper and lower surfaces of the wafer , It can also improve the drying effect and drying efficiency of the wafer.

In addition, the wafer cleaning and drying device according to the present invention may also have the following distinguishing technical features:

In some examples of the present invention, the first fluid plate and the second fluid plate are fixed relative to the turntable.

In some examples of the present invention, both the first fluid plate and the second fluid plate include: a fluid plate body and a fixed shaft, the plurality of spray holes are formed on the surface of the fluid plate body, the A first channel extending in the axial direction is formed in the fixed shaft, a second channel communicating with the first channel is formed in the fluid disk body, and the second channel communicates with the plurality of spray holes.

In some examples of the present invention, a through hole penetrating through the turntable along the axial direction is formed at the center of the turntable, and the fixed shaft of the first fluid plate protrudes into the through hole.

In some examples of the present invention, in the axial direction, the second channel extends along the radial direction of the fluid plate main body to the edge direction of the fluid plate main body.

In some examples of the present invention, the plurality of spray holes include a first spray hole disposed at the center of the fluid disk main body and extending along the axial direction.

In some examples of the present invention, the plurality of injection holes include second injection holes, the plurality of second injection holes surround the first injection hole and are arranged in a ring shape, and the second injection holes face toward the One end of the second channel is adjacent to the junction of the first channel and the second channel.

In some examples of the present invention, the plurality of injection holes include third injection holes, and the plurality of third injection holes are radially distributed from the center of the fluid plate body to the outside.

In some examples of the present invention, the third nozzle hole located on the outermost side extends obliquely from the outer edge of the second channel to the outer edge of the surface of the fluid disk main body.

In some examples of the present invention, the angle between the third injection hole and the first injection hole is greater than the angle between the second injection hole and the first injection hole.

In some examples of the present invention, the extension line of the third injection hole located on the outermost side intersects the edge of the wafer.

In some examples of the present invention, the wafer cleaning and drying apparatus further includes: a plurality of shower heads, the plurality of shower heads are arranged on the outside of the wafer and the water outlets of the plurality of shower heads face the edge.

In some examples of the present invention, when the wafer starts to rotate, deionized water is introduced into the first channels of the first fluid plate and the second fluid plate; , the IPA solution or steam is passed into the first channel of the first fluid plate and the second fluid plate; after the wafer is rotated and the first channel is passed into the second fluid for a period of time, the first Nitrogen gas is passed into the first channel of the fluid plate and the second fluid plate.

Description of drawings

1 is a cross-sectional view of a wafer cleaning and drying device holding a wafer;

Fig. 2 is a schematic diagram of the turntable of the wafer cleaning and drying device in Fig. 1;

Fig. 3 is a cross-sectional view of the first fluid plate of the wafer cleaning and drying device in Fig. 1;

4 is a cross-sectional view of a wafer cleaning and drying device provided with a shower head.

Reference signs:

Wafer cleaning and drying device 100;

Turntable 10;

first fluid plate 20; second fluid plate 20a;

Fluid disk main body 21; second channel 21a; fixed shaft 22; first channel 22a; through hole 23;

Nozzle 30; first nozzle 31; second nozzle 32; third nozzle 33; nozzle 40;

Wafer 200.

detailed description

Embodiments of the invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

The wafer cleaning and drying apparatus 100 according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

The wafer cleaning and drying apparatus 100 according to the embodiment of the present invention may include: a turntable 10 , a first fluid plate 20 and a second fluid plate 20a. The wafer 200 is suitable to be fixed on the turntable 10 , the turntable 10 may be provided with claws, and a plurality of claws may fix the wafer 200 on the turntable 10 . When the turntable 10 rotates, the wafer 200 may rotate along with the turntable 10 .

As shown in FIG. 1, the first fluid plate 20 is arranged between the turntable 10 and the wafer 200, and the second fluid plate 20a and the first fluid plate 20 are arranged opposite to the wafer 200, wherein the first fluid plate 20 and the second The surface of the fluid plate 20 a facing the wafer 200 is provided with a plurality of nozzle holes 30 suitable for injecting fluid, and the fluid includes nitrogen. It can be understood that, when the wafer cleaning and drying apparatus 100 works normally, the fluid in the first fluid plate 20 can be sprayed on the lower surface of the wafer 200 through the corresponding nozzle holes 30, and the fluid in the second fluid plate 20a can be The spraying is sprayed on the upper surface of the wafer 200 through the corresponding spray holes 30 , so that the wafer cleaning and drying apparatus 100 can effectively clean the upper surface and the lower surface of the wafer 200 . When the fluid ejected in the first fluid plate 20 and the second fluid plate 20a is nitrogen, the nitrogen can effectively dry the upper surface and the lower surface of the wafer 200, and the nitrogen can effectively remove the upper surface and the lower surface of the wafer 200. The remaining water marks can also improve the drying effect and drying efficiency of the wafer 200.

Thus, according to the wafer cleaning and drying apparatus 100 of the embodiment of the present invention, by setting the first fluid plate 20 and the second fluid plate 20a, the fluid in the first fluid plate 20 can be sprayed on the wafer 200 through the corresponding nozzle holes 30 On the lower surface of the wafer 200, the fluid in the second fluid plate 20a can be sprayed on the upper surface of the wafer 200 through the corresponding nozzle holes 30, so that the upper surface and the lower surface of the wafer 200 can be effectively cleaned. When the fluid ejected in the first fluid plate 20 and the second fluid plate 20a is nitrogen, the nitrogen can effectively dry the upper surface and the lower surface of the wafer 200, and the nitrogen can effectively remove the upper surface and the lower surface of the wafer 200. The remaining water marks can also improve the drying effect and drying efficiency of the wafer 200.

According to a preferred embodiment of the present invention, the first fluid plate 20 and the second fluid plate 20 a can be fixed relative to the turntable 10 . Thus, when the wafer 200 rotates synchronously with the turntable 10, the fluid ejected from the nozzle hole 30 on the first fluid plate 20 can be sprayed onto the entire upper surface of the rotating wafer 200, and the fluid ejected from the second fluid plate 20a The fluid ejected from the spray holes 30 can be sprayed onto the entire lower surface of the rotating wafer 200, thereby increasing the effective area of cleaning and drying the wafer 200 of the first fluid plate 20 and the second fluid plate 20a, and avoiding cleaning dead ends. produced, the cleanliness of the wafer 200 can be guaranteed.

In some examples of the present invention, as shown in FIG. 1 and FIG. 3 , the first fluid plate 20 and the second fluid plate 20a may both include: a fluid plate main body 21 and a fixed shaft 22, and a plurality of nozzle holes 30 are formed in the fluid plate On the surface of the main body 21, the fixed shaft 22 is formed with a first passage 22a extending in the axial direction (that is, the up and down direction shown in FIG. 1 ), and the fluid plate main body 21 is formed with a second passage 21a communicating with the first passage 22a. , the second channel 21a communicates with a plurality of injection holes 30 . It can be understood that the fluid can flow from the first channel 22 a into the second channel 21 a, and the second channel 21 a is sprayed onto the surface of the wafer 200 through the nozzle hole 30 .

Optionally, as shown in FIG. 2 , a through hole 23 penetrating through the turntable 10 in the axial direction is formed in the center of the turntable 10 , and the fixed shaft 22 of the first fluid plate 20 protrudes into the through hole 23 . The through hole 23 can facilitate the passage of the fixed shaft 22 , thereby increasing the convenience of arrangement of the first fluid plate 20 . Preferably, there is a predetermined distance between the peripheral wall of the through hole 23 and the peripheral wall of the fixed shaft 22 , so that the arrangement of the fixed shaft 22 can be further facilitated.

Optionally, the second channel 21a extends along the radial direction of the fluid plate main body 21 to the edge direction of the fluid plate main body 21 . Thus, the fluid can diffuse freely in the second channel 21a, and the second channel 21a can fully provide the fluid for the plurality of nozzle holes 30 .

A plurality of spray holes 30 can be arranged at intervals on the surface of the fluid plate body 21 , and the types of optional spray holes 30 will be described in detail below.

As shown in FIG. 3 , the plurality of injection holes 30 may include a first injection hole 31 , a second injection hole 32 and a third injection hole 33 . The first spray hole 31 may be disposed at the center of the fluid disc body 21, and the first spray hole 31 extends in an axial direction. It can be understood that the fluid flowing from the first channel 22a to the second channel 21a can be directly sprayed onto the surface of the wafer 200 through the first nozzle hole 31, thereby ensuring the injection force of the fluid and ensuring the cleanliness of the wafer 200 Spend. Optionally, the first through hole 23 may be directly aligned with the center of the wafer 200 .

As shown in Figure 3, a plurality of second nozzle holes 32 are arranged in a ring around the first nozzle hole 31, and one end of the second nozzle hole 32 facing the second passage 21a is adjacent to the connection between the first passage 22a and the second passage 21a . It can be understood that the fluid ejected from the second nozzle holes 32 is sprayed obliquely toward the surface of the wafer 200, thereby effectively increasing the injection area of the plurality of second nozzle holes 32, and the plurality of second nozzle holes 32 can also be combined with The first spray holes 31 are matched, so that the spray range of the first spray hole 31 is adjacent to the spray range of the second spray hole 32 , so as to avoid the generation of dead angles.

As shown in FIG. 3 , a plurality of third nozzle holes 33 are radially distributed from the center of the fluid plate main body 21 to the outside. The injection areas of the plurality of third injection holes 33 are adjacent to each other, so that the generation of injection dead angle can be effectively avoided, and the cleanliness of the wafer 200 can be improved. Preferably, the outermost third spray hole 33 extends obliquely from the outer edge of the second channel 21 a to the outer edge of the surface of the fluid plate main body 21 . It can be understood that the injection range of the third nozzle hole 33 located on the outermost side can cover the outer edge of the fluid plate main body 21, so that the injection range of the plurality of nozzle holes 30 can cover the entire surface of the wafer 200, which can improve The cleanliness of the wafer 200.

Further, the extension line of the outermost third injection hole 33 intersects the edge of the wafer 200 . Thus, it can be further ensured that the injection range of the third injection hole 33 located on the outermost side can cover the outer edge of the wafer 200 .

According to a preferred embodiment of the present invention, the angle between the third injection hole 33 and the first injection hole 31 is greater than the angle between the second injection hole 32 and the first injection hole 31 . Thus, when the first spray hole 31 , the second spray hole 32 and the third spray hole 33 spray liquid simultaneously, the liquid can cover the entire surface of the wafer 200 . When the first injection hole 31, the second injection hole 32 and the third injection hole 33 inject gas (such as nitrogen) simultaneously, when the first injection hole 31 blows the liquid on the wafer 200 surface outwards, the second injection hole 32 and the third injection hole 32 The third spray hole 33 can blow the liquid toward the edge of the wafer 200 , so that the wafer 200 can be dried better.

In some specific examples of the present invention, as shown in FIG. 4 , the wafer cleaning and drying apparatus 100 may further include: a plurality of shower heads 40 arranged on the outside of the wafer 200 , and the water outlets of the plurality of shower heads 40 towards the edge of the wafer 200 . The positions of the plurality of nozzles 40 are fixed relative to the turntable 10, and the plurality of nozzles 40 can inject fluid to the side and outer edge of the wafer 200, so that the plurality of nozzles 40 can cooperate with the plurality of nozzle holes 30 on the fluid plate main body 21, further The ground can avoid the generation of dead angles, and can improve the cleanliness of the wafer 200 .

Wherein, in the process of cleaning and drying the wafer 200, the first fluid plate 20 and the second fluid plate 20a can spray fluids to the wafer 200 multiple times, and the types of fluids can be different. An optional fluid is introduced in detail below Jetting method.

When the wafer 200 starts to rotate, deionized water is introduced into the first channel 22a of the first fluid plate 20 and the second fluid plate 20a, and after passing through the first fluid for a period of time, the first fluid plate 20 and the second fluid plate Pass into IPA (IsoPropylAlcohol-isopropanol) solution or steam in the first passage 22a of 20a, after the first passage 22a passes into the second fluid for a period of time, the first passage 22a of the first fluid plate 20 and the second fluid plate 20a Introduce nitrogen gas. By spraying the IPA solution or steam on the surface of the wafer 200, the surface tension of the deionized water on the surface of the wafer 200 can be effectively reduced, and under the action of centrifugal force, nitrogen purging and the evaporation of dissolved IPA, the residual liquid in the wiring groove can be eliminated. Effective removal, so that the cleanliness of the wafer 200 can be effectively improved.

In describing the present invention, it is to be understood that the terms "central", "upper", "lower", "front", "rear", "left", "right", "axial", "radial" , "Circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific Orientation, construction and operation in a particular orientation, therefore should not be construed as limiting the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; can be mechanically connected, can also be electrically connected or can communicate with each other; can be directly connected, can also be indirectly connected through an intermediary, can be the internal communication of two components or the interaction relationship between two components, Unless expressly defined otherwise. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the present invention, unless otherwise clearly specified and limited, the first feature may be in direct contact with the first feature or the first and second feature may be in direct contact with the second feature through an intermediary. touch. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other.

Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations.

Claims (13)

1. a wafer cleaning drying device, is characterized in that, comprising:

Rotating disk, described wafer is suitable for being fixed on described rotating disk;

First-class body disc, described first-class body disc is arranged between described rotating disk and described wafer;

Second body disc, described second body disc and described first-class body disc are oppositely arranged about described wafer, wherein, described first-class body disc and described second body disc on the surface of described wafer, be provided with the multiple spray orifices being suitable for spraying fluid, described fluid comprises nitrogen.

2. wafer cleaning drying device according to claim 1, is characterized in that, described first-class body disc described rotating disk relative to described second body disc maintains static.

3. wafer cleaning drying device according to claim 1, it is characterized in that, described first-class body disc and described second body disc include: fluid disc main body and fixed axis, described multiple spray orifice is formed on the surface of described fluid disc main body, formed by the first passage extended vertically in described fixed axis, be formed with the second channel be communicated with described first passage in described fluid disc main body, described second channel is connected with described multiple spray orifice.

4. wafer cleaning drying device according to claim 3, is characterized in that, the center of described rotating disk is formed with the through hole running through described rotating disk along described axis, and the described fixed axis of described first-class body disc stretches in described through hole.

5. wafer cleaning drying device according to claim 3, is characterized in that, described second channel extends along the radial direction of described fluid disc main body to the edge direction of described fluid disc main body.

6. wafer cleaning drying device according to claim 3, is characterized in that, described multiple spray orifice comprises the first spray orifice, and described first spray orifice is arranged on the center of described fluid disc main body and axially extends along described.

7. wafer cleaning drying device according to claim 6, it is characterized in that, described multiple spray orifice comprises the second spray orifice, multiple described second spray orifice is around described first spray orifice and arrange ringwise, the contiguous described first passage in the one end towards described second channel of described second spray orifice and the connectivity part of described second channel.

8. wafer cleaning drying device according to claim 7, is characterized in that, multiple described spray orifice comprises the 3rd spray orifice, and multiple described 3rd spray orifice radially outwards distributes from the center of described fluid disc main body.

9. wafer cleaning drying device according to claim 8, is characterized in that, is positioned at outermost described 3rd spray orifice tilts to extend to the surface of described fluid disc main body outward flange from the outward flange of described second channel.

10. wafer cleaning drying device according to claim 9, is characterized in that, the angle between described 3rd spray orifice and described first spray orifice is greater than the angle between described second spray orifice and described first spray orifice.

11. wafer cleaning drying devices according to claim 9, is characterized in that, are positioned at the outermost described line stretcher of the 3rd spray orifice and the edges intersect of described wafer.

12. wafer cleaning drying devices according to claim 1, is characterized in that, also comprise: multiple shower nozzle, described multiple shower nozzle be arranged on the outside of described wafer and the delivery port of described multiple shower nozzle towards the edge of described wafer.

13. wafer cleaning drying devices according to claim 1, is characterized in that, when described wafer starts to rotate, pass into deionized water in the first passage of described first-class body disc and described second body disc;

After passing into described first fluid a period of time, in the first passage of described first-class body disc and described second body disc, pass into IPA solution or steam;

Described wafer rotates and after described first passage passes into described second fluid a period of time, pass into nitrogen in the first passage of first-class body disc and second body disc.