CN105462135A - Silicon-free heat-conducting wave-absorbing material and preparation method thereof - Google Patents
Silicon-free heat-conducting wave-absorbing material and preparation method thereof Download PDFInfo
- Publication number
- CN105462135A CN105462135A CN201510844614.2A CN201510844614A CN105462135A CN 105462135 A CN105462135 A CN 105462135A CN 201510844614 A CN201510844614 A CN 201510844614A CN 105462135 A CN105462135 A CN 105462135A
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- Prior art keywords
- absorbing material
- silicon
- heat conduction
- powder
- conducting
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to the field of heat-conducting materials, and provides a silicon-free heat-conducting wave-absorbing material which comprises the following components in percentage by weight: 50%-80% of heat-conducting powder, 5%-35% of magnetic powder, 10%-20% of acrylic resin, 0.5%-10% of a curing agent, 0.2%-6% of an anti-scorching agent and 0.5%-5% of a coupling agent. The invention further relates to a method for preparing the silicon-free heat-conducting wave-absorbing material. The method comprises the following steps: A, weighing the raw materials according to requirements; B, treating the magnetic powder through a wet process; C, adding the acrylic resin, the anti-scorching agent and the curing agent into a kneading machine, uniformly stirring, adding the heat-conducting powder and the magnetic powder, stirring, compressing the mixture to the needed thickness, and curing so as to obtain the silicon-free heat-conducting wave-absorbing material. The silicon-free heat-conducting wave-absorbing material has the dual functions of heat conduction and wave absorption, and the electromagnetic wave shielding stability of the material can be greatly improved due to the wet treatment process of the magnetic powder; the silicon-free heat-conducting wave-absorbing material contains no silicone oil, does not volatilize at high temperature, can be applied to silicone oil sensitive electronic products, and does not generate pollution in the use process.
Description
Technical field
The present invention relates to Material Field, particularly a kind of without silicon heat conduction absorbing material and preparation method thereof.
Background technology
Along with the miniaturization of electronic product and improving constantly of performance, wherein the thermal value of electronic components of high power improves constantly thereupon, how effective the amount of heat of generation is conducted to product outside fast, and the clutter that will produce absorbs, and has become an important topic of design of electronic products.
For solving heating and the Contamination of Electromagnetic Wave problem of electronic product, heat abstractor can be installed thermal source is dispelled the heat.Conventional thermal conductive material does not possess the function of electromagnetic wave absorption, and absorbing material is lower due to thermal conductivity, cause radiating effect not good, not only can reduce product work-ing life, and because thermal ageing causes absorbing material surface adhesive tape viscosity to reduce, absorbing material comes off, lose absorption of electromagnetic wave effect.
Summary of the invention
The object of the present invention is to provide a kind of without silicon thermally conductive material, while again can electromagnetic wave absorption, the present invention proposes following technical scheme:
A kind of without silicon heat conduction absorbing material, this material component and each constituent mass per-cent as follows:
Conduction powder: 50% ~ 80%;
Magnetic: 5% ~ 35%;
Acrylic resin: 10% ~ 20%;
Solidifying agent: 0.5% ~ 10%;
Scorch retarder: 0.2% ~ 6%;
Coupling agent: 0.5% ~ 5%.
As a preferred embodiment of the present invention, described conduction powder is the one or more kinds of mixtures in aluminum oxide, aluminium hydroxide, zinc oxide, aluminium powder, Graphite Powder 99, silicon nitride, aluminium nitride, boron nitride.
As another kind of preferred version of the present invention, described magnetic is one in ferrite, super-fine metal powder, carbonyl iron particles or two or more mixture.
As another preferred version of the present invention, described acrylic resin is one in methyl acrylate, ethyl propenoate, n-butyl acrylate, methyl methacrylate, n-BMA or two or more polymkeric substance.
As another preferred version of the present invention, described solidifying agent is one in hydrogen peroxide, ammonium persulphate, benzoyl peroxide, methylethyl ketone peroxide, azo-bis-isobutyl cyanide or two or more mixture.
As another preferred version of the present invention, described scorch retarder is one or more mixtures in N-cyclohexylthiophthalimide, Tetra hydro Phthalic anhydride, phenylformic acid, oxalic acid, Whitfield's ointment, oleic acid, stearic acid.
As another preferred version of the present invention, described coupling agent is one or more mixtures in titanate coupling agent, aluminate coupling agent, phosphate coupling agent.
Another object of the present invention is to provide a kind of preparation method without silicon heat conduction absorbing material, this preparation method comprises the following steps:
A, require to take raw material according to above-mentioned weight proportion;
B, wet processing magnetic, use water, solvent oil, Virahol, acetone, one or more mixtures in dehydrated alcohol be medium, to add after coupling agent closed processes in high speed disperser material cylinder, then dry, obtain the magnetic processed;
C, acrylic resin, scorch retarder, solidifying agent added stir in kneader after, then add conduction powder, processed magnetic stirs, after using twin-roll machine compacting desired thickness, 100 DEG C of solidifications obtain described without silicon heat conduction absorbing material.
The beneficial effect that the present invention brings is:
1, the present invention has heat conduction without silicon heat conduction absorbing material simultaneously and inhales the dual-use function of ripple, and the wet processing process of magnetic, significantly can improve the electromagnetic wave shielding stability of product;
2, the present invention is without silicon heat conduction absorbing material not silicate-containing oil, at high temperature can not volatilize, and can be used in the electronic product of silicone oil sensitivity, can not produce pollution in product use procedure;
3, the present invention is simple without silicon heat conduction absorbing material preparation method technique, and cost of manufacture is low, can promote the use of on a large scale.
Embodiment
Below preferred embodiment of the present invention is described in detail, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus more explicit defining is made to protection scope of the present invention.
A kind of without silicon heat conduction absorbing material, this material component and each constituent mass per-cent as follows:
Conduction powder: 50%;
Magnetic: 30%;
Methacrylate resin: 10%;
Solidifying agent: 6%;
Scorch retarder: 3%;
Phosphate coupling agent: 1%.
Concrete preparation process is as follows:
A, require to take raw material according to above-mentioned weight proportion;
B, wet processing magnetic, use water, solvent oil, Virahol, acetone, one or more mixtures in dehydrated alcohol be medium, to add after coupling agent closed processes in high speed disperser material cylinder, then dry, obtain the magnetic processed;
C, acrylic resin, scorch retarder, solidifying agent added stir in kneader after, then add conduction powder, processed magnetic stirs, after using twin-roll machine compacting desired thickness, 100 DEG C of solidifications obtain described without silicon heat conduction absorbing material.
The above; be only the specific embodiment of the present invention; but protection scope of the present invention is not limited thereto; any those of ordinary skill in the art are in the technical scope disclosed by the present invention; the change can expected without creative work or replacement, all should be encompassed within protection scope of the present invention.Therefore, the protection domain that protection scope of the present invention should limit with claims is as the criterion.
Claims (8)
1., without a silicon heat conduction absorbing material, it is characterized in that: this material component and each constituent mass per-cent as follows:
Conduction powder: 50% ~ 80%;
Magnetic: 5% ~ 35%;
Acrylic resin: 10% ~ 20%;
Solidifying agent: 0.5% ~ 10%;
Scorch retarder: 0.2% ~ 6%;
Coupling agent: 0.5% ~ 5%.
2. according to claim 1 a kind of without silicon heat conduction absorbing material, it is characterized in that: described conduction powder is the one or more kinds of mixtures in aluminum oxide, aluminium hydroxide, zinc oxide, aluminium powder, Graphite Powder 99, silicon nitride, aluminium nitride, boron nitride.
3. the one stated according to claim 1, without silicon heat conduction absorbing material, is characterized in that: described magnetic is one in ferrite, super-fine metal powder, carbonyl iron particles or two or more mixture.
4. according to claim 1 a kind of without silicon heat conduction absorbing material, it is characterized in that: described acrylic resin is one in methyl acrylate, ethyl propenoate, n-butyl acrylate, methyl methacrylate, n-BMA or two or more polymkeric substance.
5. according to claim 1 a kind of without silicon heat conduction absorbing material, it is characterized in that: described solidifying agent is one in hydrogen peroxide, ammonium persulphate, benzoyl peroxide, methylethyl ketone peroxide, azo-bis-isobutyl cyanide or two or more mixture.
6. according to claim 1 a kind of without silicon heat conduction absorbing material, it is characterized in that: described scorch retarder is one or more mixtures in N-cyclohexylthiophthalimide, Tetra hydro Phthalic anhydride, phenylformic acid, oxalic acid, Whitfield's ointment, oleic acid, stearic acid.
7. according to claim 1 a kind of without silicon heat conduction absorbing material, it is characterized in that: described coupling agent is one or more mixtures in titanate coupling agent, aluminate coupling agent, phosphate coupling agent.
8. according to claim 1 without a silicon heat conduction absorbing material preparation method, it is characterized in that: this preparation method comprises the following steps:
A, require to take raw material according to above-mentioned weight proportion;
B, wet processing magnetic, use water, solvent oil, Virahol, acetone, one or more mixtures in dehydrated alcohol be medium, to add after coupling agent closed processes in high speed disperser material cylinder, then dry, obtain the magnetic processed;
C, acrylic resin, scorch retarder, solidifying agent added stir in kneader after, then add conduction powder, processed magnetic stirs, after using twin-roll machine compacting desired thickness, 100 DEG C of solidifications obtain described without silicon heat conduction absorbing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510844614.2A CN105462135A (en) | 2015-11-26 | 2015-11-26 | Silicon-free heat-conducting wave-absorbing material and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510844614.2A CN105462135A (en) | 2015-11-26 | 2015-11-26 | Silicon-free heat-conducting wave-absorbing material and preparation method thereof |
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| CN105462135A true CN105462135A (en) | 2016-04-06 |
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| CN201510844614.2A Pending CN105462135A (en) | 2015-11-26 | 2015-11-26 | Silicon-free heat-conducting wave-absorbing material and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107484400A (en) * | 2017-03-03 | 2017-12-15 | 倪进焕 | A kind of composite with high heat conduction radiating and suction wave energy and its production and use |
| CN116179118A (en) * | 2022-12-16 | 2023-05-30 | 江苏博云塑业股份有限公司 | Preparation method of wave-absorbing and heat-conducting material, adhesive tape, electronic components and adhesive tape |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001310984A (en) * | 2000-04-28 | 2001-11-06 | Efuko Kk | Thermal conductive moldings |
-
2015
- 2015-11-26 CN CN201510844614.2A patent/CN105462135A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001310984A (en) * | 2000-04-28 | 2001-11-06 | Efuko Kk | Thermal conductive moldings |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107484400A (en) * | 2017-03-03 | 2017-12-15 | 倪进焕 | A kind of composite with high heat conduction radiating and suction wave energy and its production and use |
| CN116179118A (en) * | 2022-12-16 | 2023-05-30 | 江苏博云塑业股份有限公司 | Preparation method of wave-absorbing and heat-conducting material, adhesive tape, electronic components and adhesive tape |
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| CB02 | Change of applicant information |
Address after: 215000, No. 9, Sheng Lu, Luzhi Town, Wuzhong District, Jiangsu, Suzhou Applicant after: Suzhou Tianmai Thermal Technology Co., Ltd. Address before: Wuzhong District Luzhi town Suzhou city Jiangsu province 215000 Huikai Road No. 6 Applicant before: Suzhou Tianmai Thermal Technology Co., Ltd. |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160406 |
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| RJ01 | Rejection of invention patent application after publication |