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CN105459283A - Knife pouch device - Google Patents

Knife pouch device Download PDF

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Publication number
CN105459283A
CN105459283A CN201510617062.1A CN201510617062A CN105459283A CN 105459283 A CN105459283 A CN 105459283A CN 201510617062 A CN201510617062 A CN 201510617062A CN 105459283 A CN105459283 A CN 105459283A
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Prior art keywords
cutting
nozzle
axis
fitting
fixed
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Chinese (zh)
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畑亮
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Disco Corp
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Disco Corp
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Abstract

本发明提供一种刀套装置,其能够防止喷嘴的位置偏离。该刀套装置具有:固定于主轴外壳(48)上的基台部(50);移动基台部(52),其固定有对切削刀(40)供给切削水的喷嘴(56),且能够相对于基台部进行移动;以及移动单元(54),其与移动基台部连结,且使喷嘴在对切削刀供给切削水的作用位置与相比于作用位置更远离切削刀的退避位置之间移动,在移动基台部与基台部互相接触的部分处,设置了规定作用位置的定位嵌合部(66、72、78)。

The present invention provides a knife holder device capable of preventing position deviation of a nozzle. The tool set device has: a base part (50) fixed on the spindle housing (48); a movable base part (52), which is fixed with a nozzle (56) for supplying cutting water to the cutting tool (40), and can moving relative to the base portion; and a moving unit (54) that is connected to the moving base portion and places the nozzle between an action position where cutting water is supplied to the cutting blade and a retreat position farther from the cutting blade than the action position The positioning and fitting parts (66, 72, 78) for specifying the action position are provided at the part where the mobile base part and the base part contact each other.

Description

刀套装置Knife set

技术领域technical field

本发明涉及覆盖切削装置的切削刀的刀套装置。The present invention relates to a holder device covering a cutting blade of a cutting device.

背景技术Background technique

用于晶片等的板状物的加工中的切削装置具有圆环状的切削刀、以及覆盖该切削刀的刀套装置。在刀套装置上固定有夹住切削刀的正反面的一对喷嘴。在通过喷嘴供给切削水的同时,旋转切削刀并使其切入板状物中,从而能够加工板状物。A cutting device used for processing a plate-shaped object such as a wafer has an annular cutting blade and a holder device covering the cutting blade. A pair of nozzles clamping the front and back of the cutting knife are fixed on the knife holder device. While the cutting water is supplied through the nozzle, the cutting blade is rotated and cut into the plate, thereby enabling processing of the plate.

在上述切削装置中,在拆装切削刀时,固定于刀套装置上的喷嘴会妨碍作业。于是,刀套装置设置有移动机构,该移动机构使得喷嘴在对切削刀供给切削水的作用位置与不会妨碍切削刀的拆装的退避位置之间移动(例如,参照专利文献1)。In the above-mentioned cutting device, when the cutting blade is attached or detached, the nozzle fixed to the holder device hinders the operation. Therefore, the tool holder device is provided with a movement mechanism that moves the nozzle between an active position where cutting water is supplied to the cutting blade and a retracted position where the cutting blade is not hindered from being attached or detached (for example, refer to Patent Document 1).

近些年来,为了效率良好地加工板状物,具备2件切削刀的切削装置得以实际使用(例如,参照专利文献2)。如果使用这种切削装置,则例如能够通过2件切削刀同时加工2个板状物。另外,在覆盖各切削刀的刀套装置上,固定有夹住切削刀的正反面的一对喷嘴。In recent years, in order to efficiently process a plate-like object, a cutting device provided with two cutting blades has been put into practical use (for example, refer to Patent Document 2). If such a cutting device is used, for example, two plate-shaped objects can be processed simultaneously with two cutting blades. In addition, a pair of nozzles sandwiching the front and back of the cutting blades are fixed to the holder device covering the cutting blades.

专利文献1日本特开平7-276183号公报Patent Document 1 Japanese Patent Application Laid-Open No. 7-276183

专利文献2日本特开2013-222834号公报Patent Document 2 Japanese Patent Application Laid-Open No. 2013-222834

另外,在上述切削装置中,例如2件切削刀能够在30mm以下的极近距离处彼此相对。因此,如果通过移动机构而移动的喷嘴的位置略微偏差,则会存在喷嘴彼此产生干扰而破损的可能性。In addition, in the cutting device described above, for example, two cutting blades can face each other at an extremely short distance of 30 mm or less. Therefore, if the positions of the nozzles moved by the moving mechanism are slightly misaligned, the nozzles may interfere with each other and be damaged.

发明内容Contents of the invention

本发明就是鉴于上述问题点而完成的,其目的在于提供一种能够防止喷嘴的位置偏离的刀套装置。The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a tool holder device capable of preventing positional deviation of a nozzle.

本发明提供一种刀套装置,其配设于以自由旋转的方式支撑主轴的主轴外壳的末端,并覆盖安装于该主轴上的切削刀,其特征在于,具有:固定于该主轴外壳上的基台部;移动基台部,其固定有对该切削刀供给切削水的喷嘴,且能够相对于该基台部进行移动;以及移动单元,其与该移动基台部连结,且使该喷嘴在作用位置与退避位置之间移动,在该作用位置处,对该切削刀供给该切削水,该退避位置相比于该作用位置离该切削刀更远,在该移动基台部与该基台部彼此接触的部分处,形成有规定该作用位置的定位嵌合部。The present invention provides a tool holder device, which is arranged at the end of a main shaft housing that supports the main shaft in a freely rotatable manner, and covers a cutting tool mounted on the main shaft, and is characterized in that it has: a base unit; a movable base unit fixed with a nozzle for supplying cutting water to the cutting blade and capable of moving relative to the base unit; Moves between an active position where the cutting water is supplied to the cutting blade, and a retracted position that is farther from the cutting blade than the active position, between the moving base portion and the base A positioning fitting portion defining the action position is formed at a portion where the stage portions contact each other.

本发明优选形成有2组以上的该定位嵌合部。In the present invention, it is preferable to form two or more sets of the positioning fitting parts.

发明的效果The effect of the invention

在本发明的刀套装置中,在固定于主轴外壳上的基台部与固定有喷嘴的移动基台部互相接触的部分处,形成有规定喷嘴的作用位置的定位嵌合部。因此,如果使移动基台部移动并接触基台部,则定位嵌合部会嵌合而能够防止喷嘴的位置偏离。In the tool holder device according to the present invention, a positioning fitting portion defining an action position of the nozzle is formed at a portion where the base portion fixed to the spindle housing and the movable base portion on which the nozzle is fixed contact each other. Therefore, when the movable base part is moved and comes into contact with the base part, the positioning fitting part fits and the positional deviation of the nozzle can be prevented.

附图说明Description of drawings

图1是示意性表示切削装置的结构例的立体图。FIG. 1 is a perspective view schematically showing a configuration example of a cutting device.

图2的(A)是示意性表示切削组件的第1状态的立体图,图2的(B)是示意性表示切削组件的第2状态的立体图。2(A) is a perspective view schematically showing the first state of the cutting unit, and FIG. 2(B) is a perspective view schematically showing the second state of the cutting unit.

图3的(A)是示意性表示图2的(A)所示的状态下的刀套装置的图,图3的(B)是示意性表示图2的(B)所示的状态下的刀套装置的图。(A) of FIG. 3 is a diagram schematically showing the tool holder device in the state shown in (A) of FIG. 2 , and (B) of FIG. Diagram of the knife set.

标号说明Label description

2:切削装置,4:基台,4a、4b、4c:开口,6:料盒放置台,8:料盒,10:X轴移动台,12:防尘防滴罩,14:保持台,14a:保持面,16:夹钳,18:切削组件(切削单元),20:支撑结构,22:切削组件移动机构(分度进给单元、升降单元),24:Y轴导轨,26:Y轴移动板,28:Y轴滚珠丝杠,30:Y轴脉冲电动机,32:Z轴导轨,34:Z轴移动板,36:Z轴滚珠丝杠,38:Z轴脉冲电动机,40:切削刀,42:刀套装置,44:相机(摄像单元),46:清洗机构(清洗单元),48:主轴外壳,50:固定罩(基台部),52:滑动罩(移动基台部),54:气缸(移动单元),56:喷嘴,58:连结具,60:连结具,62:第1嵌合凸部,64:第1嵌合凹部(切口部),66:第1规定部(定位嵌合部),68:第2嵌合凸部,70:第2嵌合凹部(切口部),72:第2规定部(定位嵌合部),74:第3嵌合凸部,76:第3嵌合凹部,78:第3规定部(定位嵌合部),11:晶片,13:器件,15:切割带,17:框架。2: Cutting device, 4: Abutment, 4a, 4b, 4c: Opening, 6: Material box placement table, 8: Material box, 10: X-axis moving table, 12: Dust-proof and drip-proof cover, 14: Holding table, 14a: holding surface, 16: clamp, 18: cutting assembly (cutting unit), 20: support structure, 22: cutting assembly moving mechanism (index feeding unit, lifting unit), 24: Y-axis guide rail, 26: Y Axis moving plate, 28: Y-axis ball screw, 30: Y-axis pulse motor, 32: Z-axis guide rail, 34: Z-axis moving plate, 36: Z-axis ball screw, 38: Z-axis pulse motor, 40: cutting Knife, 42: knife holder device, 44: camera (imaging unit), 46: cleaning mechanism (cleaning unit), 48: spindle housing, 50: fixed cover (abutment), 52: sliding cover (movable abutment) , 54: Air cylinder (moving unit), 56: Nozzle, 58: Connector, 60: Connector, 62: 1st fitting convex part, 64: 1st fitting concave part (notch part), 66: 1st regulation part (positioning fitting part), 68: second fitting convex part, 70: second fitting recessed part (notch part), 72: second predetermined part (positioning fitting part), 74: third fitting convex part, 76: 3rd fitting recessed part, 78: 3rd predetermined part (positioning fitting part), 11: wafer, 13: device, 15: dicing tape, 17: frame.

具体实施方式detailed description

参照附图,说明本发明的实施方式。首先,说明具有本实施方式的刀套装置的切削装置。图1是示意性表示切削装置的结构例的立体图。如图1所示,切削装置2具有支撑各结构的基台4。Embodiments of the present invention will be described with reference to the drawings. First, a cutting device including the holder device of the present embodiment will be described. FIG. 1 is a perspective view schematically showing a configuration example of a cutting device. As shown in FIG. 1 , the cutting device 2 has a base 4 that supports each structure.

在基台4的前方的角部形成有矩形状的开口4a,在该开口4a内以能够升降的方式设置有料盒放置台6。在料盒放置台6的上表面放置有用于收纳多个晶片11的长方体状的料盒8。另外,图1中为了便于说明,仅示出料盒8的轮廓。A rectangular opening 4 a is formed at a front corner of the base 4 , and a cartridge placement table 6 is provided in a manner capable of ascending and descending within the opening 4 a. A rectangular parallelepiped magazine 8 for storing a plurality of wafers 11 is placed on the upper surface of the magazine placement table 6 . In addition, in FIG. 1 , only the outline of the magazine 8 is shown for convenience of description.

晶片11是例如由硅等的材料构成的大致圆形的板状物,其正面侧被划分为中央的器件区域以及包围器件区域的外周剩余区域。器件区域被呈格子状排列的切割线(分割预定线)进一步划分为多个区域,且在各区域形成有IC等的器件13。The wafer 11 is a substantially circular plate-shaped object made of a material such as silicon, and its front side is divided into a device region in the center and a remaining peripheral region surrounding the device region. The device region is further divided into a plurality of regions by dicing lines (planned division lines) arranged in a grid pattern, and devices 13 such as ICs are formed in each region.

在晶片11的背面侧贴附有直径大于晶片11的切割带15。切割带15的外周部分固定于环状框架17。即,晶片11隔着切割带15而被支撑于框架17。其中,晶片11的结构不限于此。A dicing tape 15 having a larger diameter than the wafer 11 is attached to the back side of the wafer 11 . The outer peripheral portion of the dicing tape 15 is fixed to the ring frame 17 . That is, wafer 11 is supported by frame 17 via dicing tape 15 . Wherein, the structure of the wafer 11 is not limited thereto.

在料盒放置台6的侧方形成有在X轴方向(前后方向、加工进给方向)上较长的矩形状的开口4b。在该开口4b内设有X轴移动台10、使X轴移动台10在X轴方向上移动的X轴移动机构(加工进给单元、未图示)、以及覆盖X轴移动机构的防尘防滴罩12。A rectangular opening 4b long in the X-axis direction (front-rear direction, machining feed direction) is formed on the side of the magazine placement table 6 . Inside the opening 4b are provided an X-axis moving table 10, an X-axis moving mechanism (processing feed unit, not shown) for moving the X-axis moving table 10 in the X-axis direction, and a dustproof cover for covering the X-axis moving mechanism. Anti-drip cover 12.

X轴移动机构具有平行于X轴方向的一对X轴导轨(未图示),并且在X轴导轨上以能够滑动的方式设置有X轴移动台10。在X轴移动台10的下表面侧设有螺母部(未图示),在该螺母部上螺合着平行于X轴导轨的X轴滚珠丝杠(未图示)。The X-axis moving mechanism has a pair of X-axis guide rails (not shown) parallel to the X-axis direction, and the X-axis moving table 10 is slidably provided on the X-axis guide rails. A nut portion (not shown) is provided on the lower surface side of the X-axis moving table 10, and an X-axis ball screw (not shown) parallel to the X-axis guide rail is screwed to the nut portion.

在X轴滚珠丝杠的一端部连结有X轴脉冲电动机(未图示)。通过X轴脉冲电动机使X轴滚珠丝杠进行旋转,从而X轴移动台10沿着X轴导轨在X轴方向上移动。An X-axis pulse motor (not shown) is connected to one end of the X-axis ball screw. When the X-axis ball screw is rotated by the X-axis pulse motor, the X-axis moving table 10 moves in the X-axis direction along the X-axis guide rail.

在X轴移动台10的上方设有吸引保持晶片11的保持台14。在保持台14的周围设置有从四方夹持固定用于支撑晶片11的环状框架17的4个夹钳16。Above the X-axis moving table 10, a holding table 14 for sucking and holding the wafer 11 is provided. Around the holding table 14 are provided four grippers 16 clamping and fixing an annular frame 17 for supporting the wafer 11 from four directions.

保持台14与电动机等的旋转驱动源(未图示)连结,并且绕平行于Z轴方向(铅直方向)的旋转轴而旋转。此外,保持台14通过上述X轴移动机构而在X轴方向上被加工进给。The holding table 14 is connected to a rotational drive source (not shown) such as a motor, and rotates around a rotational axis parallel to the Z-axis direction (vertical direction). In addition, the holding table 14 is machine-feeded in the X-axis direction by the X-axis moving mechanism described above.

保持台14的正面(上表面)成为吸引保持晶片11的保持面14a。该保持面14a通过形成于保持台14的内部的流路(未图示)而与吸引源(未图示)连接。The front (upper surface) of the holding table 14 serves as a holding surface 14 a for sucking and holding the wafer 11 . This holding surface 14 a is connected to a suction source (not shown) through a flow path (not shown) formed inside the holding table 14 .

在切削装置2中的接近开口4b的位置处,设有将上述晶片11搬送至保持台14的搬送机构(搬送单元、未图示)。通过搬送机构而被搬送的晶片11例如以正面侧在上方露出的方式而放置于保持台14上。A transfer mechanism (transfer unit, not shown) for transferring the wafer 11 to the holding table 14 is provided at a position close to the opening 4 b in the cutting device 2 . The wafer 11 transported by the transport mechanism is placed on the holding table 14 with the front side exposed upward, for example.

在基台4的上表面以跨越开口4b的方式配置有支撑2组切削组件(切削单元)18的门型的支撑结构20。在支撑结构20的前表面上部设有使各切削组件18在Y轴方向(分度进给方向)和Z轴方向上移动的2组切削组件移动机构(分度进给单元、升降单元)22。A gate-shaped support structure 20 that supports two sets of cutting units (cutting units) 18 is disposed on the upper surface of the base 4 so as to straddle the opening 4b. On the upper front surface of the support structure 20, two sets of cutting unit moving mechanisms (index feeding unit, lifting unit) 22 are provided to move each cutting unit 18 in the Y-axis direction (index feeding direction) and Z-axis direction. .

各切削组件移动机构22都具有配置于支撑结构20的前表面且平行于Y轴方向的一对Y轴导轨24。在Y轴导轨24上以能够滑动的方式设置有构成各切削组件移动机构22的Y轴移动板26。Each cutting unit moving mechanism 22 has a pair of Y-axis guide rails 24 disposed on the front surface of the supporting structure 20 and parallel to the Y-axis direction. A Y-axis moving plate 26 constituting each cutting unit moving mechanism 22 is slidably provided on the Y-axis guide rail 24 .

在各Y轴移动板26的背面侧(后面侧)设有螺母部(未图示),在该螺母部上分别螺合着平行于Y轴导轨24的Y轴滚珠丝杠28。各Y轴滚珠丝杠28的一端部连结着Y轴脉冲电动机30。如果通过Y轴脉冲电动机30使Y轴滚珠丝杠28进行旋转,则Y轴移动板26沿着Y轴导轨24在Y轴方向上移动。A nut portion (not shown) is provided on the back side (rear side) of each Y-axis moving plate 26 , and a Y-axis ball screw 28 parallel to the Y-axis guide rail 24 is screwed to the nut portion. A Y-axis pulse motor 30 is connected to one end of each Y-axis ball screw 28 . When the Y-axis ball screw 28 is rotated by the Y-axis pulse motor 30 , the Y-axis moving plate 26 moves in the Y-axis direction along the Y-axis guide rail 24 .

在各Y轴移动板26的正面(前表面)上设有平行于Z轴方向的一对Z轴导轨32。在Z轴导轨32上以能够滑动的方式设置有Z轴移动板34。A pair of Z-axis guide rails 32 parallel to the Z-axis direction is provided on the front surface (front surface) of each Y-axis moving plate 26 . A Z-axis moving plate 34 is slidably provided on the Z-axis guide rail 32 .

在各Z轴移动板34的背面侧(后面侧)设有螺母部(未图示),在该螺母部上分别螺合着平行于Z轴导轨32的Z轴滚珠丝杠36。各Z轴滚珠丝杠36的一端部连结着Z轴脉冲电动机38。如果通过Z轴脉冲电动机38使Z轴滚珠丝杠36进行旋转,则Z轴移动板34沿着Z轴导轨32在Z轴方向上移动。A nut portion (not shown) is provided on the back side (rear side) of each Z-axis moving plate 34 , and a Z-axis ball screw 36 parallel to the Z-axis guide rail 32 is screwed to the nut portion. A Z-axis pulse motor 38 is connected to one end of each Z-axis ball screw 36 . When the Z-axis ball screw 36 is rotated by the Z-axis pulse motor 38 , the Z-axis moving plate 34 moves in the Z-axis direction along the Z-axis guide rail 32 .

在各Z轴移动板34的下部设有切割晶片11的切削组件18。该切削组件18包括覆盖切削刀40的刀套装置42。此外,在与切削组件18相邻的位置处,设置有对晶片11摄像的相机(摄像单元)44。A cutting unit 18 for cutting the wafer 11 is provided on the lower portion of each Z-axis moving plate 34 . The cutting assembly 18 includes a pocket arrangement 42 covering a cutting knife 40 . Further, at a position adjacent to the cutting unit 18 , a camera (imaging unit) 44 for imaging the wafer 11 is provided.

如果通过各切削组件移动机构22使Y轴移动板26在Y轴方向上移动,则切削组件18和相机44被分度进给,而如果使Z轴移动板34在Z轴方向上移动,则切削组件18和相机44进行升降。If the Y-axis moving plate 26 is moved in the Y-axis direction by each cutting assembly moving mechanism 22, the cutting assembly 18 and the camera 44 are indexed, and if the Z-axis moving plate 34 is moved in the Z-axis direction, The cutting assembly 18 and camera 44 are raised and lowered.

在相对于开口4b而位于与开口4a的相反侧的位置处,形成有圆形状的开口4c。在开口4c内设有清洗切削后的晶片11的清洗机构(清洗单元)46。A circular opening 4c is formed at a position opposite to the opening 4a with respect to the opening 4b. A cleaning mechanism (cleaning unit) 46 for cleaning the cut wafer 11 is provided in the opening 4c.

接着,说明包括本实施方式的刀套装置42的切削组件18。图2的(A)是示意性表示切削组件18的第1状态的立体图,图2的(B)是示意性表示切削组件18的第2状态的立体图。Next, the cutting unit 18 including the holder device 42 of this embodiment will be described. (A) of FIG. 2 is a perspective view schematically showing the first state of the cutting unit 18 , and (B) of FIG. 2 is a perspective view schematically showing the second state of the cutting unit 18 .

如图2的(A)和图2的(B)所示,切削组件18具有固定于Z轴移动板34的下部的主轴外壳48。在主轴外壳48的内部,以能够旋转的方式支撑着在Y轴方向上延伸的主轴(未图示)。主轴的末端部安装有切削刀40。As shown in FIG. 2(A) and FIG. 2(B), the cutting unit 18 has a spindle housing 48 fixed to the lower portion of the Z-axis moving plate 34 . Inside the spindle housing 48 , a spindle (not shown) extending in the Y-axis direction is rotatably supported. A cutting blade 40 is attached to the tip of the main shaft.

在主轴外壳48的末端部设有用于收纳安装于主轴上的切削刀40的刀套装置42。刀套装置42包括固定于主轴外壳48的末端的固定罩(基台部)50、以及能够相对于固定罩50移动的滑动罩(移动基台部)52。A tool holder device 42 for accommodating the cutting blade 40 attached to the main shaft is provided at the distal end of the main shaft housing 48 . The tool holder device 42 includes a fixed cover (base portion) 50 fixed to the end of the spindle housing 48 , and a slide cover (movable base portion) 52 movable relative to the fixed cover 50 .

滑动罩52通过气缸(移动单元)54(图2的(B))而与固定罩50连结,并且利用通过连结件(未图示)而被供给的空气而在X轴方向上滑动。The sliding cover 52 is coupled to the fixed cover 50 via an air cylinder (moving means) 54 ( FIG. 2(B) ), and slides in the X-axis direction by air supplied through a coupling (not shown).

在该滑动罩52上固定着夹住切削刀40的正反面的大致L字状的一对喷嘴56。喷嘴56通过设置于滑动罩52上的连结件58而被供给切削水。在喷嘴56的末端侧,以面对切削刀40的方式形成有多条缝(未图示)。利用通过多条缝而喷射的切削水,使得切削刀40被冷却,并对所切削的晶片11的上表面进行清洗。A pair of substantially L-shaped nozzles 56 sandwiching the front and back of the cutting blade 40 are fixed to the slide cover 52 . The nozzle 56 is supplied with cutting water through a coupling 58 provided on the slide cover 52 . A plurality of slits (not shown) are formed on the distal end side of the nozzle 56 so as to face the cutting blade 40 . The cutting blade 40 is cooled by the cutting water sprayed through a plurality of slits, and the upper surface of the wafer 11 to be cut is cleaned.

如果通过气缸54使滑动罩52进行滑动,则喷嘴56在对切削刀40供给切削水的作用位置与在X轴方向上从作用位置远离的退避位置之间移动。图2的(A)示出喷嘴56被定位于作用位置上的状态,图2的(B)示出喷嘴56被定位于退避位置上的状态。When the slide cover 52 is slid by the air cylinder 54 , the nozzle 56 moves between an action position where cutting water is supplied to the cutting blade 40 and a retreat position away from the action position in the X-axis direction. FIG. 2(A) shows a state where the nozzle 56 is positioned at the active position, and FIG. 2(B) shows a state where the nozzle 56 is positioned at the retracted position.

如果将喷嘴56定位于从切削刀40远离的退避位置处,则如图2的(B)所示,切削刀40的正面侧开放。由此,能够容易拆装切削刀40。另一方面,如果将喷嘴56定位于接近切削刀40的作用位置处,则如图2的(A)所示,切削刀40的正反面被喷嘴56夹住。由此,能够对切削刀40供给切削水。If the nozzle 56 is positioned at a retracted position away from the cutting blade 40 , as shown in FIG. 2(B) , the front side of the cutting blade 40 is opened. Thereby, the cutting blade 40 can be easily attached and detached. On the other hand, if the nozzle 56 is positioned close to the action position of the cutting blade 40 , as shown in FIG. 2(A) , the front and back surfaces of the cutting blade 40 are sandwiched by the nozzle 56 . Thus, cutting water can be supplied to the cutting blade 40 .

另一方面,在固定罩50上形成有用于对切削刀40供给切削水的供给孔(未图示)。该供给孔通过设置于固定罩50上的连结件60而被供给切削水。利用从供给孔喷射出的切削水,使得切削刀40被冷却、清洗。On the other hand, a supply hole (not shown) for supplying cutting water to the cutting blade 40 is formed in the fixed cover 50 . The supply hole is supplied with cutting water through the coupling 60 provided on the fixed cover 50 . The cutting blade 40 is cooled and cleaned by the cutting water sprayed from the supply hole.

另外,在如上构成的切削装置2中,如果喷嘴56从作用位置即使略微产生偏离(成为斜向),则在2组切削组件18距离极近距离彼此相对时,喷嘴56彼此间会产生干扰。于是,在本实施方式的刀套装置42中的固定罩50和滑动罩52彼此接触的部分处,设置了规定作用位置的规定部(定位嵌合部)。In addition, in the cutting device 2 configured as above, if the nozzle 56 deviates even slightly from the operating position (inclined), the nozzles 56 interfere with each other when the two sets of cutting units 18 face each other at a very close distance. Then, in the portion where the fixed cover 50 and the sliding cover 52 are in contact with each other in the knife holder device 42 of the present embodiment, a predetermined portion (positioning fitting portion) that defines an action position is provided.

图3的(A)是示意性表示图2的(A)所示的状态下的刀套装置42的图,图3的(B)是示意性表示图2的(B)所示的状态下的刀套装置42的图。(A) of FIG. 3 is a diagram schematically showing the tool holder device 42 in the state shown in (A) of FIG. 2 , and (B) of FIG. 3 is a schematic representation of the state shown in (B) of FIG. 2 The figure of the tool pocket device 42 of.

如图3的(A)和图3的(B)所示,在将喷嘴56定位于作用位置处时与滑动罩52接触的固定罩50的上端部,形成有第1嵌合凸部62。As shown in FIG. 3(A) and FIG. 3(B), a first fitting protrusion 62 is formed on the upper end portion of the fixed cover 50 that contacts the sliding cover 52 when the nozzle 56 is positioned at the active position.

另一方面,在将喷嘴56定位于作用位置处时与固定罩50接触的滑动罩52的上端部,形成有形状与第1嵌合凸部62对应的第1嵌合凹部(切口部)64。通过第1嵌合凸部62和第1嵌合凹部64,构成了第1规定部(定位嵌合部)66。On the other hand, at the upper end portion of the sliding cover 52 that contacts the fixed cover 50 when the nozzle 56 is positioned at the action position, a first fitting concave portion (notch portion) 64 having a shape corresponding to the first fitting convex portion 62 is formed. . A first predetermined portion (positioning fitting portion) 66 is formed by the first fitting convex portion 62 and the first fitting concave portion 64 .

同样地,在与滑动罩52接触的固定罩50的下端部,形成有第2嵌合凸部68。此外,在与固定罩50接触的滑动罩52的下端部,形成有形状与第2嵌合凸部68对应的第2嵌合凹部(切口部)70。通过第2嵌合凸部68和第2嵌合凹部70,构成了第2规定部(定位嵌合部)72。Similarly, a second fitting convex portion 68 is formed at the lower end portion of the fixed cover 50 in contact with the sliding cover 52 . In addition, a second fitting recessed portion (notch portion) 70 having a shape corresponding to the second fitting convex portion 68 is formed at the lower end portion of the sliding cover 52 in contact with the fixed cover 50 . A second predetermined portion (positioning fitting portion) 72 is formed by the second fitting convex portion 68 and the second fitting concave portion 70 .

进而,在与滑动罩52接触的固定罩50的中央部,形成有第3嵌合凸部74。此外,在与固定罩50接触的滑动罩52的中央部,形成有形状与第3嵌合凸部74对应的第3嵌合凹部76。通过第3嵌合凸部74和第3嵌合凹部76,构成了第3规定部(定位嵌合部)78。Furthermore, a third fitting convex portion 74 is formed at the central portion of the fixed cover 50 that is in contact with the sliding cover 52 . In addition, a third fitting concave portion 76 having a shape corresponding to the third fitting convex portion 74 is formed at a central portion of the sliding cover 52 that is in contact with the fixed cover 50 . A third predetermined portion (positioning fitting portion) 78 is formed by the third fitting convex portion 74 and the third fitting concave portion 76 .

因此,如图2的(A)和图3的(A)所示,如果使滑动罩52滑动并使其接触固定罩50,则第1嵌合凸部62与第1嵌合凹部64嵌合,第2嵌合凸部68与第2嵌合凹部70嵌合,而第3嵌合凸部74与第3嵌合凹部76嵌合。由此,能够防止滑动罩52相对于固定罩50的位置偏离(倾斜、转动),从而将喷嘴56适当地定位于作用位置处。Therefore, as shown in (A) of FIG. 2 and (A) of FIG. , the second fitting convex portion 68 is fitted to the second fitting concave portion 70 , and the third fitting convex portion 74 is fitted to the third fitting concave portion 76 . Accordingly, it is possible to appropriately position the nozzle 56 at the action position by preventing positional deviation (tilting, rotation) of the sliding cover 52 with respect to the fixed cover 50 .

如上,在本实施方式的刀套装置42中,在固定于主轴外壳48上的固定罩(基台部)50与固定有喷嘴56的滑动罩(移动基台部)52彼此接触的部分处,形成有规定喷嘴56的作用位置的第1规定部(定位嵌合部)66、第2规定部(定位嵌合部)72和第3规定部(定位嵌合部)78。As described above, in the tool holder device 42 of the present embodiment, at the portion where the fixed cover (base portion) 50 fixed to the spindle housing 48 and the sliding cover (movable base portion) 52 fixed to the nozzle 56 contact each other, A first predetermined portion (positioning fitting portion) 66 , a second predetermined portion (positioning fitting portion) 72 , and a third predetermined portion (positioning fitting portion) 78 that define the operating position of the nozzle 56 are formed.

因此,如果使滑动罩52滑动并使其接触固定罩50,则第1规定部66的第1嵌合凸部62与第1嵌合凹部64嵌合,第2规定部72的第2嵌合凸部68与第2嵌合凹部70嵌合,而第3规定部78的第3嵌合凸部74与第3嵌合凹部76嵌合,从而能够防止喷嘴56的位置偏离。Therefore, when the sliding cover 52 is slid and brought into contact with the fixed cover 50, the first fitting convex portion 62 of the first predetermined portion 66 is fitted into the first fitting concave portion 64, and the second fitting portion of the second predetermined portion 72 is The protrusion 68 fits into the second fitting recess 70 , and the third fitting protrusion 74 of the third predetermined portion 78 fits into the third fitting recess 76 , thereby preventing the position of the nozzle 56 from shifting.

另外,本发明不限于上述实施方式的内容,可以进行各种变更并实施。例如,在上述实施方式中,通过3组规定部(定位嵌合部)规定喷嘴的作用位置,然而对于规定部的数量不做特别限定。此外,关于规定部的形状等,在能够适当规定喷嘴的作用位置的范围内可以任意变更。In addition, this invention is not limited to the content of the said embodiment, Various changes can be made and implemented. For example, in the above-described embodiment, the action position of the nozzle is defined by three sets of predetermined portions (positioning fitting portions), but the number of predetermined portions is not particularly limited. In addition, the shape of the predetermined part, etc., can be changed arbitrarily within the range where the action position of the nozzle can be appropriately defined.

此外,上述实施方式的结构、方法等可以在不脱离本发明目的的范围内适当变更并实施。In addition, the structure, method, etc. of the said embodiment can be suitably changed and implemented in the range which does not deviate from the object of this invention.

Claims (2)

1. a broach shell device, it is disposed in the end of the main shaft shell of the mode supports main shaft rotated freely, and covers the bite be installed on this main shaft,
The feature of this broach shell device is to have:
Be fixed on the abutment portion in this main shaft shell;
Mobile abutment portion, it is fixed with the nozzle supply of this bite being cut to water, and can move relative to this abutment portion; And
Mobile unit, itself and this move abutment portion and link, and this nozzle is moved between active position and retreating position, at this active position place, supply this cutting water to this bite, this retreating position is farther from this bite compared to this active position,
Move at this part place that abutment portion and this abutment portion contact with each other, be formed with the location fitting portion specifying this active position.
2. broach shell device according to claim 1, is characterized in that,
This broach shell device is formed with this location fitting portion of more than 2 groups.
CN201510617062.1A 2014-09-26 2015-09-24 Knife pouch device Pending CN105459283A (en)

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JP2014196084A JP6410541B2 (en) 2014-09-26 2014-09-26 Blade cover device

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