CN105451510B - Liquid cooling heat radiator capable of being used in turnover mode and turnover configuration method thereof - Google Patents

Abstract

The present invention discloses a liquid cooling device that can be flipped for use and a flip configuration method thereof. The liquid cooling device is located in a three-dimensional space and includes a pump, a liquid storage tank, a liquid cooling head, a cooling module, and a plurality of pipelines connecting the pump, the liquid storage tank, the liquid cooling head and the cooling module; wherein, any of the liquid storage tank, the liquid cooling head, the cooling module and the pipelines exceeds the pump in any direction of the X-axis, the Y-axis or the Z-axis in the three-dimensional space. The present invention can ensure that when the liquid cooling device is in use, no matter how it is flipped in use, the pump will not be in the highest position in the entire liquid cooling device, thereby avoiding problems such as air accumulation in the pump causing it to run idle or be damaged. In addition, since the liquid cooling device can be in any one-way or multi-way use state, it is not restricted in assembly, which can make the liquid cooling device more widely used in occasions.

Description

Reversible liquid cooling heat sink and method for reversing it

technical field

The present invention relates to a cooling system, in particular to a reversible liquid cooling heat sink and a reversible configuration method thereof.

Background technique

With the advancement of semiconductor technology, electronic components are getting smaller and smaller, and the heat generation is also increasing, resulting in a significant increase in the difficulty of heat dissipation. In the existing heat dissipation components, components such as heat dissipation fins, heat pipes or fans have long been insufficient. Therefore, there is a liquid cooling system that uses pipelines to match coolant, and then uses a pump to push the coolant in the pipeline to form a heat dissipation cycle. Cooling and cooling devices were born, and this kind of liquid cooling and cooling devices are used in more and more occasions, becoming more and more common and common.

However, when this kind of liquid cooling device is applied to occasions such as desktop computers, it is usually installed behind electronic heating components such as the CPU or GPU of the computer, so that it will not change its placement with the displacement of the computer case. form, for example, there is no need to flip over the computer case. However, if it is applied to a device such as a projector that may be placed flat on the table or hung on the ceiling, it often needs to match the decoration of the use environment, and the projector must be turned over at any angle to install, or use It operates in a different form from being placed on the desktop, which will also cause the liquid cooling device installed in the projector to change its form inside the projector after being turned over, resulting in liquid cooling. The actual use state of the cooling device is different from the original design considerations, or there are unconsidered use states and problems.

The current liquid cooling heat dissipation device is mainly composed of a pump, a liquid storage tank, a liquid cooling head, a cooling module, and pipelines connecting the above components in series, and the cooling liquid is provided from the liquid storage tank, and then The pump pushes the cooling liquid to flow in the pipeline, so that the cooling liquid can take away the heat absorbed by the liquid cooling head attached to the heat source, and then reduce the temperature of the cooling liquid through the cooling module, so that the circulation can achieve The effect of liquid cooling. However, due to the thermal expansion characteristics of the coolant, the coolant will expand due to heat in the high-temperature operating environment, so a pressure relief valve is generally added to the design to overcome this problem. However, if it is applied to the projector and other equipment that needs to be turned over, the pressure relief valve cannot be used due to the water leakage problem after turning over, so it can only be reserved when the coolant is filled inside the liquid cooling device. The space acts as a buffer space after the coolant expands.

However, although the above-mentioned method solves the problem of coolant expansion caused by the inability to use the pressure relief valve, as the use of the liquid cooling device increases, the coolant will still evaporate due to heat when passing through the liquid cooling head , so it is inevitable that there will be excess air inside, and if the accumulated air is stored in the pump (for example, when the pump is at the highest position in the entire liquid cooling device), it will make the pump inside The air exceeds the expected design and idling occurs, so that the coolant flow that the pump can drive is reduced, which affects the heat dissipation efficiency, and even the pump will be damaged due to idling, so that it cannot continue to meet the heat dissipation needs of the equipment, which will cause the equipment to overheat. and damaged.

Contents of the invention

A brief overview of the invention is given below in order to provide a basic understanding of some aspects of the invention. It should be understood that this summary is not an exhaustive overview of the invention. It is not intended to identify key or critical parts of the invention nor to delineate the scope of the invention. Its purpose is merely to present some concepts in a simplified form as a prelude to the more detailed description that is discussed later.

The main purpose of the present invention is to provide a reversible liquid-cooled heat sink and its reversible configuration method, which can make the liquid-cooled heat sink in use, no matter how it is required by the external environment, to reverse its use state, None of its pumps are located at the highest position in the entire liquid-cooled heat sink; in this way, it is possible to avoid problems such as air accumulation in the pump causing it to run idle or be damaged.

Another object of the present invention is to provide a reversible liquid-cooled heat sink and its reversible configuration method. Since it can be used in any orientation or multiple orientations, there is no restriction on assembly. This makes the liquid-cooling heat dissipation device more extensive in application occasions or scopes.

In order to achieve the above-mentioned purpose, the present invention provides a reversible liquid-cooled heat dissipation device, including a pump, a liquid storage tank, a liquid cooling head, a cooling module, and a communication pump, a liquid storage tank, a liquid cooling A plurality of pipelines of the head and the cooling module; wherein, any one of the liquid storage tank, the liquid cooling head, the cooling module, and the pipelines is in any direction of the X-axis, Y-axis or Z-axis in three-dimensional space are beyond the pump.

The length, width, and height dimensions of the liquid storage tank, the liquid cooling head, or the internal space of the cooling module exceed the corresponding length, width, or height dimensions of the internal space of the pump.

The pump, the liquid storage tank, the liquid cooling head and the cooling module form an L-shaped configuration relationship.

The liquid storage tank is located between the liquid cooling head and the cooling module, so that the liquid cooling head extends toward one end of the L-shape, and the cooling module extends toward the other end of the L-shape.

The pump is disposed between the liquid storage tank and the cooling module.

In order to achieve the above purpose, the present invention provides a reversible configuration method for a liquid cooling heat sink, the steps of which are as follows:

a) Provide pumps, liquid storage tanks, liquid cooling heads, and cooling modules;

b) placing the pump, the liquid storage tank, the liquid cooling head and the cooling module in a three-dimensional space, and in any direction of the X-axis, Y-axis or Z-axis in the three-dimensional space, the storage Any one of the liquid tank, the liquid block and the cooling module is beyond the pump;

c) The pump, the liquid storage tank, the liquid cooling head and the cooling module are connected and positioned by a plurality of pipelines.

Further, the length, width and height of the liquid storage tank, the liquid cooling head or the internal space of the cooling module in step b) exceed the corresponding length, width or height of the internal space of the pump.

Further, in step b), the pump, the liquid storage tank, the liquid cooling head and the cooling module form an L-shaped configuration relationship.

Further, the liquid storage tank in step b) is located between the liquid cooling head and the cooling module, so that the liquid cooling head extends toward one end of the L-shape, and the cooling module faces toward the L-shaped end. Extended setting at the other end.

Further, the pump in step b) is disposed between the liquid storage tank and the cooling module.

Compared with prior art, the beneficial effect of the present invention is:

The present invention can make the liquid cooling device in use state, no matter how it is turned over by the demand of the external environment, its pump will not be at the highest position in the entire liquid cooling device, so as to avoid air accumulation in the pump Causes problems such as idling or damage. In addition, since the liquid cooling device can be used in any orientation or multiple orientations, there is no restriction on assembly, so the application occasions or scope of the liquid cooling device can be wider.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained according to these drawings without any creative effort.

FIG. 1 is a schematic diagram of the appearance of a preferred embodiment of the liquid cooling heat dissipation device of the present invention;

2 is a schematic diagram of the first use state of the liquid cooling device of the present invention;

3 is a schematic diagram of a second use state of the liquid cooling device of the present invention;

4 is a schematic diagram of a third use state of the liquid cooling device of the present invention;

5 is a schematic diagram of a fourth use state of the liquid cooling device of the present invention;

6 is a schematic diagram of a fifth usage state of the liquid cooling device of the present invention;

7 is a schematic diagram of a sixth usage state of the liquid cooling device of the present invention;

Fig. 8 is a flow chart of the steps of the configuration method of the present invention.

【Symbol Description】

pump 1

Reservoir 2

Liquid block 3

Cooling Module 4

pipeline 5

Heat source 6

circuit board 60

Steps S1-S3.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Elements and features described in one drawing or one embodiment of the present invention may be combined with elements and features shown in one or more other drawings or embodiments. It should be noted that representation and description of components and processes that are not related to the present invention and known to those of ordinary skill in the art are omitted from the drawings and descriptions for the purpose of clarity. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Please refer to FIG. 1 , which is a schematic view of the appearance of a preferred embodiment of the present invention. The present invention provides a reversible liquid cooling heat dissipation device and its reversible configuration method. The liquid cooling heat dissipation device includes a pump 1, a liquid storage tank 2, a liquid cooling head 3, a cooling module 4, and a The pump 1, the liquid storage tank 2, the liquid cooling head 3 and the plurality of pipelines 5 of the cooling module 4; the present invention is mainly even if the liquid cooling device exists in a three-dimensional environment, and no matter how it is affected by the outside world The liquid-cooled heat sink can be turned over to change its use state according to the requirements of the environment, and the pump 1 of the liquid-cooled heat sink will not cause air to accumulate in the pump 1 because it is at the highest position in the entire liquid-cooled heat sink.

Based on the above, in the embodiment of the present invention, the liquid cooling heat dissipation device forms an L-shaped configuration relationship of the pump 1, the liquid storage tank 2, the liquid cooling head 3 and the cooling module 4, wherein the liquid storage tank 2 is located between the liquid cooling head 3 and the cooling module, so that the liquid cooling head 3 extends toward one end of the L-shape, and the cooling module 4 extends toward the other end of the L-shape, and the pump 1 is configured in the liquid storage Between the tank 2 and the cooling module 4, the above-mentioned pump 1, the liquid storage tank 2, the liquid cooling head 3 and the cooling module 4 are connected through various pipelines 5, so that a cooling fluid circulation can be formed inside. flow loop.

Please refer to FIG. 1 and FIG. 2 together. The liquid cooling device is located in a three-dimensional space, and the three-dimensional space has an X axis, a Y axis and a Z axis. As shown in Figure 2, the liquid cooling device needs to cooperate with a heat source 6 arranged on a circuit board 60, so that the liquid cooling head 3 is attached to the heat source 6 in the use state shown in Figure 2, at this time The X-axis is the height orientation, and at least one of the liquid storage tank 2, the liquid cooling head 3, and the cooling module 4 exceeds the pump 1, as shown in Figure 2, that is, the height orientation of the cooling module 4 on the X-axis beyond the pump 1. In more detail, the so-called exceeding the pump 1 means that the length, width and height of the internal space of the liquid storage tank 2, the liquid cooling head 3 or the cooling module 4 exceed the corresponding length, width and height of the internal space of the pump 1. width or height; or, the size range of length, width or height formed by the liquid storage tank 2, the liquid cooling head 3 and the cooling module 4 covers the corresponding length, width, Tall dimensions other than.

In order to further illustrate the liquid-cooled heat dissipation device of the present invention, it is indeed possible to keep the pump 1 from being at the highest position in any orientation in the above-mentioned three-dimensional space, as shown in Figure 3 to Figure 7 respectively as follows:

As shown in Figure 3, it is the use state after turning 180 degrees in Figure 2, so the X-axis is still used as the height orientation, but the direction is just opposite. At this time, the liquid storage tank 2 or the liquid cooling head 3 exceeds the pump 1 in the height direction of the X-axis.

As shown in FIG. 4 , if turned over to the use state with the Y axis as the height orientation, the liquid cooling head 3 still exceeds the pump 1 . On the contrary, FIG. 5 shows the use state of FIG. 4 turned 180 degrees, and the pump 1 does not exceed the liquid storage tank 2 and the cooling module 4 at the height orientation opposite to that of FIG. 4 in the Y-axis direction.

As shown in FIG. 6 , if turned over to the use state with the Z-axis as the height orientation, the liquid storage tank 2 and the cooling module 4 still exceed the pump 1 in the Z-axis height orientation. On the contrary, FIG. 7 shows the use state after turning over 180 degrees of FIG. 6 , the pump 1 does not exceed the liquid storage tank 2 and the cooling module 4 at the height orientation opposite to that of FIG. 6 in the Z-axis direction.

In addition, as shown in FIG. 8 , the present invention further provides a reversible configuration method for a liquid-cooled heat sink, the steps of which include:

Step S1: Provide the above-mentioned pump 1, liquid storage tank 2, liquid cooling head 3, and cooling module 4, as shown in FIG. 1 .

Step S2: Place the pump 1, the liquid storage tank 2, the liquid cooling head 3, and the cooling module in the aforementioned three-dimensional space, that is, have an orientation such as the X-axis, Y-axis, or Z-axis, and in the three-dimensional space Any one of the liquid storage tank 2 , the liquid cooling head 3 and the cooling module 4 exceeds the pump 1 in any direction of the X-axis, Y-axis or Z-axis, as shown in FIGS. 2 to 7 .

Step S3: Finally, the pump 1, the liquid storage tank 2, the liquid cooling head 3, and the cooling module 4 are connected and positioned through the above-mentioned plurality of pipelines 5, thereby forming a liquid cooling heat dissipation device.

Therefore, through the above-mentioned structural composition, the reversible liquid-cooling heat sink and its reversible arrangement method of the present invention can be obtained.

Therefore, through the reversible liquid-cooled heat dissipation device and its reversible configuration method of the present invention, the above-mentioned liquid-cooled heat dissipation device can be turned over in use no matter how it is required by the external environment. It will be at the highest position in the entire liquid cooling heat dissipation device, so as to avoid problems such as idling or damage caused by air accumulation in the pump 1. In addition, since the liquid cooling device can be used in any orientation or multiple orientations, there is no restriction on assembly, so the application occasions or scope of the liquid cooling device can be wider.

To sum up, the present invention can clearly achieve the expected purpose of use, and solve the deficiencies of the known, and because it is extremely novel and progressive, it fully meets the requirements of the invention patent application, and the application should be filed in accordance with the Patent Law.

The above description is only a preferred feasible embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent techniques, means and other changes made by using the description and drawings of the present invention are all the same. It is included in the scope of the present invention and shall be stated together.

Claims (4)

1. a kind of turnable liquid-cooling heat radiator used, including：

A gang of Pu；

One liquid reserve tank；

One liquid cooling head；

One refrigerating module；And

Be connected to the side Pu, the liquid reserve tank, the liquid cooling head and the refrigerating module multiple pipelines；

Wherein, the liquid reserve tank, the liquid cooling head, the refrigerating module, the side Pu and multiple pipeline are located in a three dimensions, In the either direction of X-axis, Y-axis or Z axis in the three dimensions, at least the liquid reserve tank, the liquid cooling head, the refrigerating module or Multiple pipeline exceeds the side Pu；

The side Pu, the liquid reserve tank, the liquid cooling head and the refrigerating module constitute the configuration relation of a L-type；

The liquid reserve tank is located between the liquid cooling head and the refrigerating module, is set so that the liquid cooling head extends towards one end of the L-type Set and the refrigerating module then towards the other end of the L-type be extended；

The side Pu is configured between the liquid reserve tank and the refrigerating module.

2. as described in claim 1 may be reversed the liquid-cooling heat radiator used, which is characterized in that the liquid reserve tank, the liquid cooling head Or length and width and the high size of the refrigerating module inner space, exceed the corresponding length and width in side Pu inner space and high size.

3. a kind of turnable configuration method used of liquid-cooling heat radiator, which is characterized in that its step includes：

A) side Pu, liquid reserve tank, liquid cooling head and refrigerating module are provided；

B) the side Pu, the liquid reserve tank, the liquid cooling head and the refrigerating module are placed in a three dimensions, and in the three dimensions In X-axis, in the either direction of Y-axis or Z axis, any one in the liquid reserve tank, the liquid cooling head and the refrigerating module exceeds the side Pu；

C) the side Pu, the liquid reserve tank, the liquid cooling head and the refrigerating module are connected with multiple pipelines and are positioned；

The side Pu of step b), the configuration relation of the liquid reserve tank, the liquid cooling head and the refrigerating module one L-type of composition；

The liquid reserve tank of step b) is located between the liquid cooling head and the refrigerating module, so that the liquid cooling head is towards the one of the L-type End is extended and the refrigerating module is then extended towards the other end of the L-type；

The side Pu of step b) is configured between the liquid reserve tank and the refrigerating module.

4. the turnable configuration method used of liquid-cooling heat radiator as claimed in claim 3, which is characterized in that step b's) The liquid reserve tank, the length and width of the liquid cooling head or the refrigerating module inner space and high size, it is corresponding beyond the side Pu inner space Length and width and high size.