CN105448852A - Curved surface electronic device - Google Patents

Abstract

The invention discloses a curved surface electronic device, comprising: the shaping layer is provided with a first curved surface and a second curved surface which are opposite; and an electronic component conformally disposed on the first curved surface of the molding layer, wherein the electronic component includes a substrate, and the molding layer fixes the shape of the substrate.

Description

curved electronic device

technical field

The present invention relates to electronic devices, and in particular to a curved electronic device.

Background technique

With the advancement of science and technology, the technology of the display is also constantly developing. Light, thin, short, small flat panel display (FlatPanelDisplay, FPD) has replaced the traditional heavy cathode picture tube display (CathodeRayTube, CRT).

However, there are many types of flat panel display devices, and common flat panel display devices include liquid crystal display devices, organic light emitting diode display devices, and light emitting diode display devices.

Nowadays, all kinds of consumer electronic products have changed from functional to artistic development based on design, novelty and fashion. Consumers not only pay attention to functionality, but also design and product type are the main factors affecting consumer behavior. Furthermore, due to the light and thin characteristics of flat-panel displays, flat-panel displays have been deployed on non-planar surfaces of electronic devices of consumer electronics products.

Therefore, there is a need for a curved electronic device suitable for various applications related to products with non-planar surfaces.

Contents of the invention

In order to solve the above problems, according to an embodiment, the present invention provides a curved surface electronic device, comprising: a shaping layer having a first curved surface and a second curved surface opposite to each other; an electronic component conformably disposed on the shaped surface On the first curved surface of the layer, wherein the electronic component includes a substrate, and the shaping layer fixes the shape of the substrate.

In another embodiment, the curved surface electronic device further includes a protection plate disposed on the second curved surface of the shaping layer.

In yet another embodiment, the first curved surface and the second curved surface in the curved electronic device have a surface shape of convex shape, concave shape, or wave shape.

In order to make the above-mentioned purpose, features and advantages of the present invention more comprehensible, a preferred embodiment is exemplified below and described in detail in conjunction with the accompanying drawings.

Description of drawings

FIG. 1 is a schematic flowchart showing a method for manufacturing a curved surface electronic device according to an embodiment of the present invention;

2 is a schematic flow chart showing a method for manufacturing a curved surface electronic device according to another embodiment of the present invention;

FIG. 3 is a schematic flowchart showing a method for manufacturing a curved surface electronic device according to another embodiment of the present invention;

FIG. 4 is a schematic flowchart showing a method for manufacturing a curved surface electronic device according to another embodiment of the present invention;

5 is a schematic cross-sectional view showing a curved electronic device according to another embodiment of the present invention;

6 is a schematic cross-sectional view showing a curved electronic device according to another embodiment of the present invention;

7 is a schematic cross-sectional view showing a curved electronic device according to another embodiment of the present invention;

8 is a schematic cross-sectional view showing a curved electronic device according to another embodiment of the present invention;

9 is a schematic cross-sectional view showing a curved electronic device according to another embodiment of the present invention;

10 is a schematic cross-sectional view showing a curved electronic device according to another embodiment of the present invention;

FIG. 11 is a schematic cross-sectional view showing a curved electronic device according to another embodiment of the present invention;

12 is a schematic cross-sectional view showing a curved electronic device according to another embodiment of the present invention;

13 is a schematic cross-sectional view showing a curved electronic device according to another embodiment of the present invention;

14 is a schematic cross-sectional view showing a curved electronic device according to another embodiment of the present invention;

FIG. 15 is a schematic perspective view showing a curved electronic device according to an embodiment of the present invention;

FIG. 16 is a schematic perspective view showing a curved electronic device according to another embodiment of the present invention;

FIG. 17 shows a schematic cross-sectional view along line 17-17 of the curved electronic device shown in FIG. 15; and

FIG. 18 shows a schematic cross-sectional view along line 18 - 18 of the curved electronic device shown in FIG. 16 .

Symbol Description

100, 100', 200, 200'～Manufacturing method

101, 103, 151, 153, 155, 157, 159, 201, 251, 253, 255, 257, 259, 261～steps

300, 300’, 300”, 300”’, 400, 500, 600, 600’, 700, 800～curved surface electronic devices

302, 402, 502, 602, 702～substrate

303～light emitting surface

304～electronic unit

306, 406, 508, 606, 708 ~ superstructure

307～light direction

350～Electronic components

360～shaping layer

362～first surface

364～second surface

370～protection plate

404～LED unit

450～Light-emitting elements

504～LCD layer

506, 706～color filter layer

550～LCD display element

604～OLED pixels

608, 710～packaging frame

608'～encapsulation layer

650, 750～organic light emitting diode display elements

R, R1, R2～radius of curvature

detailed description

Please refer to FIG. 1 , which shows a schematic flowchart of a method 100 for manufacturing a curved surface electronic device according to an embodiment of the present invention.

As shown in FIG. 1 , the manufacturing method 100 starts from step 101 and step 151 . In step 101, a protection plate is provided. In one embodiment, the protective plate may include glass, plastic, metal or a mixture thereof, and may have light-transmitting or opaque properties for providing functions such as mechanical support, light-shielding, light-transmitting or reflecting. In step 151 , an electronic element, such as a light emitting element or a display element, including a substrate is provided. Next, go to step 103 . In step 103, a shaping layer is formed on a surface of the protective plate. In one embodiment, the shaping layer can be a dry film or a wet film, and has a thickness between 0.5 micrometer (μm)˜0.5 centimeter (cm). Therefore, the plastic layer can be disposed on the surface of the protective plate by a method such as sticking a film or coating. In one embodiment, the shaping layer includes a curable material, such as a light-curable material or a thermal-curable material. Photocurable materials are, for example, acrylic photocurable materials, epoxy resin photocurable materials, silicon photocurable materials or mixtures thereof, while thermosetting materials are, for example, epoxy resin thermosetting materials, acrylic thermosetting materials, and acrylic photocurable materials. Curing material, silicon-based thermosetting material or a mixture thereof. Next, a step 153 is performed to combine electronic components on the surface of the shaping layer not including the protective plate, thereby forming a planar electronic device. Next, a step 155 is performed to shape the planar electronic device into a curved electronic device with a two-dimensional (2D) curved surface or a three-dimensional (3D) curved surface by using a mold with a two-dimensional curved surface or a three-dimensional curved surface. Next, step 157 is performed to harden the shaping layer and fix the shape of the substrate of the electronic components in the curved electronic device by performing an energy treatment step, such as an ultraviolet light irradiation treatment or a heat treatment. Therefore, the formed curved electronic device may have a curved surface in a non-planar form such as a two-dimensional (2D) curved surface or a three-dimensional (3D) curved surface. In an embodiment, the above-mentioned two-dimensional curved surface is, for example, a curved surface of a convex shape, a concave shape, or a wave shape.

Please refer to FIG. 2 , which shows a schematic flowchart of a method 100' for manufacturing a curved surface electronic device according to another embodiment of the present invention. The manufacturing method 100' shown in FIG. 2 is obtained by modifying the manufacturing method 100 shown in FIG. 1 , and the same steps are shown with the same reference numerals in FIG. 2 . Here, in the manufacturing method 100', after step 157, a step 159 may be performed to remove the protective plate, thereby leaving a curved electronic device without the protective plate, so as to reduce the thickness of the curved electronic device.

FIG. 3 is a schematic flowchart showing a method 200 for manufacturing a curved surface electronic device according to yet another embodiment of the present invention.

As shown in FIG. 1 , the manufacturing method 200 starts from step 201 and step 251 . In step 201, a protection plate is provided. In one embodiment, the protective plate may include glass, plastic, metal or a mixture thereof, and may have light-transmitting or opaque properties for providing functions such as mechanical support, light-shielding, light-transmitting or reflecting. In step 251 , an electronic component is provided, such as a light emitting component or a display component. Next, go to step 253 . In step 253, a shaping layer is formed on a surface of the electronic component. In one embodiment, the shaping layer can be a dry film or a wet film. Therefore, the plastic layer can be disposed on the surface of the protective plate by a method such as sticking a film or coating. In one embodiment, the shaping layer includes a curable material, such as a light-curable material or a thermal-curable material. Next, a step 255 is performed to combine the protective plate on a surface of the plastic layer on which no electronic components are formed, so as to form a planar electronic device. Next, a step 257 is performed to shape the planar electronic device into a curved electronic device with a two-dimensional (2D) curved surface or a three-dimensional (3D) curved surface by using a mold with a two-dimensional curved surface or a three-dimensional curved surface. Next, step 259 is performed to implement an energy treatment step, such as an ultraviolet light irradiation treatment or a heat treatment, to harden the shaping layer and fix the shape of the substrate of the electronic components in the curved electronic device. Therefore, the formed curved electronic device may have a curved surface in a non-planar form such as a two-dimensional (2D) curved surface or a three-dimensional (3D) curved surface. In one embodiment, the two-dimensional curved surface is, for example, a curved surface having a convex shape, a concave shape or a wave shape.

Please refer to FIG. 4 , which shows a schematic flowchart of a method 200' for manufacturing a curved surface electronic device according to another embodiment of the present invention. The manufacturing method 200' shown in FIG. 4 is obtained by modifying the manufacturing method 200 shown in FIG. 3 , and the same steps are shown with the same reference numerals in FIG. 4 . Here, in the manufacturing method 200', after step 259, a step 261 may be performed to remove the protective plate, thereby leaving a curved electronic device without the protective plate, so as to reduce the thickness of the curved electronic device.

Please refer to FIG. 5 , which shows a schematic cross-sectional view of a curved electronic device 300 according to an embodiment of the present invention. As shown in FIG. 5 , the curved electronic device 300 is a convex curved electronic device, and the curved electronic device 300 includes an electronic component 350 , a shaping layer 360 and a protective plate 370 . The electronic device 350 includes an electronic unit 304 and an upper cover layer 306 sequentially stacked on a substrate 302 . The shaping layer 360 is formed on a convex surface of the electronic component 350 so that the electronic component 350 can have a preferred degree of curvature to form the curved electronic device. The shaping layer 360 includes a first curved surface 362 and a second curved surface 364 opposite to each other. Here, the first curved surface 362 and the second curved surface 364 are convex surfaces relative to the electronic component 350 . Compared with the shaping layer 360 itself, the first curved surface 362 is a convex surface, and the second curved surface 364 is a concave surface. The upper cover layer 306 of the electronic component 350 is connected to the first curved surface 362 , the protective plate 370 is connected to the second curved surface 364 , and the shaping layer 360 fixes the shape of the inner substrate 302 of the electronic component 350 . In this embodiment, the curved surface electronic device 300 can be formed by the manufacturing method 100 shown in FIG. 1 or the manufacturing method 200 shown in FIG. Provides functions such as increasing the curved surface electronic device 300 such as mechanical support, wear resistance, scratch resistance, light shading, light transmission or reflection. In one embodiment, the electronic element 350 can be a light emitting element such as a light emitting diode element, and the electronic unit therein is a light emitting diode unit. In another embodiment, the electronic element 350 can be a display element such as an OLED display element or a liquid crystal display element, and the electronic unit 304 therein can be an organic light emitting diode display unit or a liquid crystal display unit. A surface of the protective plate 370 not in contact with the upper cover layer 306 is a light-emitting surface 303 , and a direction away from the light-emitting surface 303 is a light-emitting direction 307 .

Please refer to FIG. 6 , which shows a schematic cross-sectional view of a curved electronic device 300' according to another embodiment of the present invention. The curved electronic device 300' shown in FIG. 6 is obtained by modifying the curved electronic device 300 shown in FIG. 5 , and the same components are shown with the same reference numerals in FIG. 6 . In this embodiment, the curved electronic device 300' can be formed by the manufacturing method 100' shown in FIG. 2 or the manufacturing method 200' shown in FIG. 4, so the curved electronic device 300' does not include a protective plate 370 , and the second curved surface 364 is a light-emitting surface, and a direction away from the light-emitting surface is a light-emitting direction 307 . In this way, the thickness of the curved surface electronic device 300' can be reduced, and the implementation of other components is the same as that of the curved surface electronic device 300 in FIG. 5 , which will not be repeated here.

In the curved surface electronic devices 300 and 300' as shown in FIGS. Radius of curvature (R) between 10mm and 2000mm.

Please refer to FIG. 7 , which shows a schematic cross-sectional view of a curved electronic device 300 ″ according to another embodiment of the present invention. The curved electronic device 300 ″ shown in FIG. 7 is modified by modifying the curved electronic device 300 shown in FIG. 5 obtained, and the same components are shown with the same reference numerals in FIG. 7 . In this embodiment, the curved electronic device 300 ″ can be formed by the manufacturing method 100 shown in FIG. 1 or the manufacturing method 200 shown in FIG. 3 , so the curved electronic device 300 includes the protective plate 370 at this time. In addition, different from the curved electronic device 300 shown in FIG. 5, in the curved electronic device 300" shown in FIG. On the first curved surface 362 of the shaping layer 360 , a surface of the upper cover layer 306 not in contact with the light-emitting unit 304 is a light-emitting surface 303 , and a direction away from the light-emitting surface 303 is a light-emitting direction 307 . Here, relative to the shaping layer 360 itself, the first curved surface 362 is a concave surface, and the second curved surface 364 is a convex surface. The shaping layer 360 is formed on a convex surface of the electronic component 350 so that the electronic component 350 can have a preferred degree of curvature to form the curved electronic device. The implementation of other components in the curved electronic device 300 ″ is the same as the implementation of the curved electronic device 300 in FIG. 5 , and will not be repeated here.

Please refer to FIG. 8, which shows a schematic cross-sectional view of a curved electronic device 300"' according to another embodiment of the present invention. The curved electronic device 300"' shown in FIG. 8 is modified by modifying the curved electronic device shown in FIG. 300', and the same components are shown with the same reference numerals in Fig. 8 . In this embodiment, the curved surface electronic device 300"' can be formed by the manufacturing method 100' shown in FIG. 2 or the manufacturing method 200' shown in FIG. Including the protective plate 370, the thickness of the curved electronic device 300"' can be reduced. In addition, different from the curved surface electronic device 300' shown in FIG. 6, in the curved surface electronic device 300"' shown in FIG. A surface of the layer 306 that is not in contact with the light-emitting unit 304 is a light-emitting surface 303, and a direction away from the light-emitting surface 303 is a light-emitting direction 307. The implementation of the remaining components of the curved surface electronic device 300"' is the same as in FIG. 6 The implementation of the curved surface electronic device 300 ′ will not be described again here.

In the curved surface electronic devices 300" and 300"' shown in FIGS. 306 also has a radius of curvature (R) approximately between 10 mm and 2000 mm.

As shown above, through the above manufacturing methods 100, 100', 200, 200', various types of curved surface electronic devices 300, 300', 300", 300 as shown in Figures 5-8 can be produced. ". And by changing the implementation type of the electronic components 350 in the curved surface electronic devices 300, 300', 300", 300", multiple curved surface electronic devices suitable for different applications can be obtained.

Please refer to FIG. 9 , which shows a schematic cross-sectional view of a curved electronic device 400 according to another embodiment of the present invention. The curved electronic device 400 shown in FIG. 9 is obtained by modifying the curved electronic device 300 shown in FIG. 5 , and the same components are shown with the same reference numerals in FIG. 9 . In this embodiment, the curved electronic device 400 can be manufactured through the manufacturing method 100 shown in FIG. 1 or the manufacturing method 200 shown in FIG. 3 , so the curved electronic device 400 includes the protective plate 370 at this time. In addition, different from the curved electronic device 300 shown in FIG. 5 , in the curved electronic device 400 shown in FIG. 9 , a light emitting element 450 is used to replace the electronic element 350 of the curved electronic device 300 in FIG. 5 . Here, the light emitting element 450 is, for example, a light emitting diode element, which may include a substrate 402 , a light emitting diode unit 404 and an upper cover layer 406 arranged in sequence. Here, the LED unit 404 is shown as a single film layer, but it includes an n-type semiconductor layer, a multiple quantum well (Multiple Quantumwell, MQW) layer and a p-type semiconductor layer (not shown) stacked on the substrate 402 ). The substrate 402 may include materials such as glass, plastic, metal or mixtures thereof, and the upper cover layer 406 may include materials such as glass, plastic, metal or mixtures thereof. The implementation of the protective plate 370 and the shaping layer 350 is as described above.

In addition, in other embodiments, the electronic component 450 shown in FIG. 9 can be used to replace the electronic component 350 in the curved surface electronic devices 300 ′, 300 ″ and 300 ″’ shown in FIGS. 6-8 respectively, Furthermore, a curved electronic device having an embodiment similar to that shown in FIGS. 6-8 is obtained.

Please refer to FIG. 10 , which shows a schematic cross-sectional view of a curved electronic device 500 according to another embodiment of the present invention. The curved electronic device 500 shown in FIG. 10 is obtained by modifying the curved electronic device 300 shown in FIG. 5 , and the same components are shown with the same reference numerals in FIG. 10 . In this embodiment, the curved electronic device 500 can be manufactured through the manufacturing method 100 shown in FIG. 1 or the manufacturing method 200 shown in FIG. 3 , so the curved electronic device 500 includes the protective plate 370 at this time. In addition, different from the curved electronic device 300 shown in FIG. 5 , in the curved electronic device 500 shown in FIG. 10 , a liquid crystal display element 550 is used to replace the electronic element 350 of the curved electronic device 300 in FIG. Here, the liquid crystal display element 550 includes a substrate 502 , a liquid crystal layer 504 , a color filter layer 506 and a cover layer 508 arranged in sequence. Here, a thin film transistor element (not shown) may be further disposed on the substrate 502 and an electrode layer (not shown) may be further disposed on the upper cover layer 508 . The substrate 502 may include materials such as glass, plastic, metal or a mixture thereof, the liquid crystal layer 504 may include structures such as nematic liquid crystals, cholesteric liquid crystals, etc., and the color filter layer 506 may include materials such as dyes, photoresists, etc. The pattern array of red, blue and green formed by the materials, and the upper cover layer 508 may include materials such as glass, plastic, metal or a mixture thereof. The implementation of the protective plate 370 and the shaping layer 350 is as described above.

In addition, in other embodiments, the liquid crystal display element 550 shown in FIG. 10 can be used to replace the electronic element 350 in the curved surface electronic devices 300', 300" and 300"' shown in FIGS. 6-8 respectively. , and further obtain a curved surface electronic device having an implementation type similar to that shown in FIGS. 6-8 .

Please refer to FIG. 11 , which shows a schematic cross-sectional view of a curved electronic device 600 according to another embodiment of the present invention. The curved electronic device 600 shown in FIG. 11 is obtained by modifying the curved electronic device 300 shown in FIG. 5 , and the same components are shown with the same reference numerals in FIG. 11 . In this embodiment, the curved electronic device 600 can be formed by the manufacturing method 100 shown in FIG. 1 or the manufacturing method 200 shown in FIG. 3 , so the curved electronic device 600 includes the protective plate 370 at this time. In addition, different from the curved surface electronic device 300 shown in FIG. 5, in the curved surface electronic device 600 shown in FIG. . Here, the organic light emitting diode device 650 includes a substrate 602 arranged in sequence, an organic light emitting diode layer (OLED layer) 604 separately arranged on the substrate 602, an upper cover layer 606, and an organic light emitting diode layer (OLED layer) 606 arranged on the substrate 602 and the upper cover layer 604 An encapsulation frame 608 between and surrounding the OLED layer 604 . Here, the substrate 602 may include materials such as glass, plastic, metal or a mixture thereof, and the OLED pixel 604 may include materials such as dyes and photoresists and may emit light of different colors such as red, blue, and green. , the upper cover layer 606 may include materials such as glass, plastic, metal or a mixture thereof, and the packaging frame 608 may include materials such as photocurable, thermally curable, or pressure-sensitive adhesive. The implementation of the protective plate 370 and the shaping layer 350 is as described above.

In addition, in other embodiments, the organic light emitting diode (OLED) display element 650 shown in FIG. 11 can be used to replace the curved surface electronic devices 300', 300" and 300"' shown in FIGS. 6-8 respectively. The electronic component 350 inside is obtained to obtain a curved surface electronic device similar to that shown in FIGS. 6-8 .

Please refer to FIG. 12 , which shows a schematic cross-sectional view of a curved electronic device 600' according to another embodiment of the present invention. The curved electronic device 600' shown in FIG. 12 is obtained by modifying the curved electronic device 600 shown in FIG. 11 , and the same components are shown with the same reference numerals in FIG. 12 . Different from the curved surface electronic device 600 shown in FIG. 11 , in the curved surface electronic device 600 shown in FIG. 12 , an encapsulation layer 608' is used to completely cover the OLED layer 604.

A schematic cross-sectional view of a curved electronic device 700 according to yet another embodiment of the present invention is shown. The curved electronic device 700 shown in FIG. 13 is obtained by modifying the curved electronic device 300 shown in FIG. 5 , and the same components are shown with the same reference numerals in FIG. 13 . In this embodiment, the curved electronic device 700 can be manufactured through the manufacturing method 100 shown in FIG. 1 or the manufacturing method 200 shown in FIG. 3 , so the curved electronic device 700 includes the protective plate 370 at this time. In addition, different from the curved surface electronic device 300 shown in FIG. 5, in the curved surface electronic device 700 shown in FIG. . Here, the organic light emitting diode device 750 includes a substrate 702 arranged in sequence, several organic light emitting diode pixels (OLED pixels) 704 separately arranged on the substrate 702, a color filter layer 706, an upper cover layer 708, and An encapsulation frame 710 is disposed between the substrate 702 and the upper cover layer 704 and surrounds the OLED pixels 704 . Here, the substrate 702 may include materials such as glass, plastic, metal or a mixture thereof, and the OLED pixel 704 may include, for example, an anode layer, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, etc. layer, a stack of material layers of the cathode layer (not shown), and used to emit white light, the color filter layer 706 may include materials such as dyes, photoresists, such as red, blue, Green and colorless pattern arrays, the upper cover layer 704 may include materials such as glass, plastic, metal or a mixture thereof, and the packaging frame 710 may include materials such as photocurable, thermally curable, or pressure-sensitive adhesive. The implementation of the protective plate 370 and the shaping layer 350 is as described above.

In addition, in other embodiments, the organic light emitting diode (OLED) display element 750 shown in FIG. 13 can be used to replace the curved surface electronic devices 300', 300" and 300"' shown in FIGS. 6-8 respectively. The electronic component 350 inside is obtained to obtain a curved surface electronic device similar to that shown in FIGS. 7-8 .

In the aforementioned curved surface electronic device, the surface of each film layer is also a two-dimensional curved surface such as a convex surface or a concave surface. However, in other embodiments, these curved surface electronic devices are manufactured by using a two-dimensional curved surface mold (not shown) with other patterns so that the formed curved surface electronic device has a schematic cross-sectional view as shown in FIG. 14 Implementation of a waveshape surface.

As shown in FIG. 14 , a schematic cross-sectional view of a curved electronic device 800 according to an embodiment of the present invention is shown. As shown in FIG. 14 , the curved electronic device 800 is a wave-shaped curved electronic device, and the curved electronic device 800 includes an electronic component 350 , a plastic layer 360 and a protective plate 370 . The electronic device 350 includes an electronic unit 304 and an upper cover layer 306 sequentially stacked on a substrate 302 . The shaping layer 360 includes a first curved surface 362 and a second curved surface 364 opposite to each other. Here, the first curved surface 362 and the second curved surface 364 are corrugated surfaces relative to the electronic component 350 . The upper cover layer 306 of the electronic component 350 is connected to the first curved surface 362 , and the protection plate 370 is connected to the second curved surface 364 . In this embodiment, the curved surface electronic device 800 can be formed by the manufacturing method 100 shown in FIG. 1 or the manufacturing method 200 shown in FIG. Provides functions such as increasing the curved surface electronic device 800 such as mechanical support, wear resistance, scratch resistance, light shading, light transmission or reflection. In one embodiment, the electronic element 350 can be a light emitting element such as a light emitting diode element, and the electronic unit therein is a light emitting diode unit. In another embodiment, the electronic element 850 can be a display element such as an OLED display element or a liquid crystal display element, and the electronic unit 304 therein can be an organic light emitting diode display unit or a liquid crystal display unit. A surface of the protective plate 370 not in contact with the upper cover layer 306 is a light-emitting surface 303 , and a direction away from the light-emitting surface 303 is a light-emitting direction 307 . In the curved surface electronic device 800 shown in FIG. 14 , since the first curved surface 362 and the second curved surface 364 are wavy surfaces, there will be multiple radii of curvature on their surfaces, which are shown as two radii of curvature here. R1 and R2 have a radius of curvature (R) between 10 mm and 2000 mm, respectively. Therefore, the substrate 302 also has a plurality of radii of curvature (R) approximately between 10 mm˜2000 mm. The implementation of the film layers in the curved surface electronic device 800 shown in FIG. 14 is the same as that shown in FIG. 5 , but it is not intended to limit the present invention, and other film layer implementations are also possible.

However, in other embodiments, the above-mentioned curved surface electronic device is manufactured by using a three-dimensional curved surface mold (not shown) with other patterns so that the formed curved surface electronic device has a circle as shown in the perspective schematic diagram of FIG. 15 Implementation of different curved surfaces such as a dome shape and a bowl shape as shown in the perspective view of FIG. 16 . The implementation of the film layers in the curved surface electronic device shown in FIGS. 15-16 is the same as that shown in FIG. 5 , but the present invention is not limited thereto. Figures 17-18 respectively show the cross-sectional situations along the line segment 17-17 in Figure 15 and along the line segment 18-18 in Figure 16 . As shown in FIGS. 17-18 , the parts of all components in the curved electronic device corresponding to the dome-shaped curved surface or the bowl-shaped curved surface are bent to form the dome-shaped curved surface or the bowl-shaped curved surface.

In addition, in the curved surface electronic devices shown in FIGS. 6-13 , implementations of wave-shaped (waveshape), dome-shaped (domeshape) and bowl-shaped (bowlshape) curved surfaces as shown in FIGS. 14-16 can also be used. , rather than being limited to the situations shown in Fig. 6-Fig. 13 .

Although the present invention has been disclosed in conjunction with the above preferred embodiments, it is not intended to limit the present invention. Anyone familiar with the art can make changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope should be defined by the appended claims.

Claims (10)

1. a curved surface electronic installation, comprising:

Moulding layer, has relative first surface and the second curved surface; And

Electronic component, be conformably arranged on this first surface of this moulding layer, wherein this electronic component comprises a substrate, and this moulding layer fixes the shape of this substrate.

2. curved surface electronic installation as claimed in claim 1, also comprises baffle, is arranged on this second curved surface of this moulding layer.

3. curved surface electronic installation as claimed in claim 1, wherein this first surface of this moulding layer and this second curved surface have convex, concavity or a wavy surface configuration.

4. curved surface electronic installation as claimed in claim 1, wherein this electronic component is a display element.

5. curved surface electronic installation as claimed in claim 1, wherein this first surface and this second curved surface comprise at least one radius of curvature respectively.

6. curved surface electronic installation as claimed in claim 5, wherein this radius of curvature of this first surface of this moulding layer is between 10mm ~ 2000mm.

7. curved surface electronic installation as claimed in claim 5, wherein this radius of curvature of this second curved surface of this moulding layer is between 10mm ~ 2000mm.

8. curved surface electronic installation as claimed in claim 1, wherein the material of this moulding layer is photo-curing material or thermosetting material.

9. curved surface electronic installation as claimed in claim 8, wherein the material of this moulding layer is selected from the group be made up of acryl system photo-curing material, epoxy resin photo-curing material, silicon system photo-curing material, epoxy resin thermosetting material, acryl system thermosetting material, silicon system thermosetting material and composition thereof.

10. curved surface electronic installation as claimed in claim 1, wherein this moulding layer has the thickness between 0.5 micron ~ 0.5 centimetre.