CN105437083B - Ejecting device - Google Patents
Ejecting device Download PDFInfo
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- CN105437083B CN105437083B CN201410512483.3A CN201410512483A CN105437083B CN 105437083 B CN105437083 B CN 105437083B CN 201410512483 A CN201410512483 A CN 201410512483A CN 105437083 B CN105437083 B CN 105437083B
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- liquid
- head body
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- buffer part
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- 239000007788 liquid Substances 0.000 claims abstract description 119
- 230000000903 blocking effect Effects 0.000 claims abstract description 26
- 230000001105 regulatory effect Effects 0.000 claims abstract description 9
- 230000004323 axial length Effects 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 230000002265 prevention Effects 0.000 abstract description 3
- 238000005498 polishing Methods 0.000 description 17
- 239000012530 fluid Substances 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 7
- 239000007921 spray Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000007517 polishing process Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005518 electrochemistry Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
Present invention is disclosed a kind of ejecting devices, including：Buffer part, head body, regulating device, electrode and bubble isolated part.Buffer part is equipped with cushion chamber, liquid feeding end and outlet end.Head body is equipped with nozzle, several liquid outlets and the head cover being connected with nozzle.Regulating device includes blocking above several liquid outlets and the blocking parts below head cover and the actuating member in cushion chamber, actuating member link with blocking parts.The gap that can be adjusted is formed between blocking parts and liquid outlet, a part for the liquid of buffered portion's output is exported by nozzle, another part is overflowed by gap, actuating member is moved according to the size of the amount for the liquid for being input to buffer part, the linkage of actuating member and blocking parts adjusts the size in gap to change the amount of the liquid overflowed by gap so that maintains to stablize by the amount of the liquid of nozzle output.The inner wall in cushion chamber and the outlet end close to buffer part is arranged in electrode.Bubble isolated part connect with head body and is located in cushion chamber, and the bubble generated at bubble isolated part prevention electrode enters the nozzle of head body.
Description
Technical field
The present invention relates to semiconductor equipment part field more particularly to a kind of can export with stablizing the liquid of pattern
Ejecting device, the ejecting device be suitable for electrochemical polish.
Background technology
It is main using copper extra on chemically mechanical polishing (CMP) removal wafer in current polished semiconductor technique
Film.Chemical mechanical polishing apparatus includes turntable, is arranged on turntable polishing pad, the rubbing head that wafer is clamped and polishing fluid supply
Pipeline.When polishing, once pressure acts on rubbing head, and to make the polished face of wafer be contacted with polishing pad, rubbing head drives
Wafer rotates, and has the polishing fluid that polishing fluid supply line provides between the polished face of wafer and polishing pad, by making wafer phase
Polishing pad is rotated, to remove copper film extra on wafer.However, in order to further reduce the feature ruler of semiconductor devices
Very little, in the semiconductor device, low-k dielectric materials or air-gap have weaker machine for low-k dielectric materials or air-gap application
Tool characteristic, the lower pressure of rubbing head is acted in CMP process will cause the damage of low-k dielectric materials, in turn
Reduce the yield of semiconductor devices.
In order to solve to chemically-mechanicapolish polish existing technology drawback, electrochemical polish technology is gradually taken seriously, electrochemistry
Polishing due to only having polishing fluid to be contacted with crystal column surface, can without the extra copper film on wafer that removes of mechanical stress, and
Low k dielectric layers on wafer will not be damaged, to improve the manufacturing yield of semiconductor devices, having captured manufacture has
The technical bottleneck of the semiconductor devices of small features.In electrochemical polishing process, polishing fluid is sprayed by ejecting device
To crystal column surface.Current ejecting device is unable to control the pattern of the polishing fluid ejected from ejecting device, when supplied to nozzle
When the amount of the polishing fluid of device fluctuates, the pattern of the polishing fluid ejected from ejecting device can also fluctuate, thus can not essence
The really removal rate of control copper film and removal uniformity.
Invention content
The purpose of the present invention is providing a kind of follow-on ejecting device in view of the above technical problems, which can
Exporting has the liquid for stablizing pattern and is suitable for electrochemical polishing process.
To achieve the above object, the present invention proposes a kind of ejecting device, including buffer part, head body, regulating device, electricity
Pole and bubble isolated part.Buffer part is equipped with cushion chamber, liquid feeding end and outlet end.What head body was fixed on buffer part goes out liquid
End, head body are equipped with nozzle, several liquid outlets and the head cover being connected with nozzle, the nozzle of head body and several liquid
Outlet is connect with the outlet end of buffer part respectively.Regulating device includes blocking above several liquid outlets and below head cover
Blocking parts and the actuating member in cushion chamber, actuating member and blocking parts link.Blocking parts and liquid outlet
Between form the gap that can adjust, a part for the liquid that buffered portion exports is exported by nozzle, and another part is overflowed by gap,
Actuating member is moved according to the size of the amount for the liquid for being input to buffer part, and the linkage of actuating member and blocking parts adjusts gap
Size to change the amount of the liquid overflowed by gap so that by nozzle output liquid amount maintain stablize.Electrode setting exists
The outlet end of the inner wall of cushion chamber and close buffer part.Bubble isolated part connect with head body and is located in cushion chamber, gas
The bubble generated at bubble isolated part prevention electrode enters the nozzle of head body.
In one embodiment, blocking parts includes covering, being several to locating part, gasket and elastic component.Setting is covered to spray
The top of several liquid outlets of head ontology simultaneously shelters from several liquid outlets, covers equipped with several to limit hole.It is several to limit
Part passes through cover several to limit hole and to be fixed in head body, and covering rises or falls along locating part.Gasket setting is hiding
Between lid and head body so that cover and form gap between head body.Elastic component be arranged cover it is upper with locating part
Between end.
In one embodiment, actuating member includes baffle and link.Baffle plate setting in the cushion chamber of buffer part simultaneously
Face the liquid feeding end of buffer part.One end of link is connect with baffle, and the other end and the covering of link connect.
In one embodiment, the liquid feeding end of buffer part is connected to a pulse liquid feed device by pipe resistance relief member.
In one embodiment, pipe resistance relief member is hollow pipeline, and one end of hollow pipeline is connected to pulse feed flow dress
It sets, the other end of hollow pipeline is connected to the liquid feeding end of buffer part.
In one embodiment, pulse liquid feed device is pneumatic diaphragm pump.
In one embodiment, several liquid outlets are symmetrically distributed in the circumferential direction of nozzle.
In one embodiment, blocking parts includes several independent components, each liquid outlet of head body it is upper
Side's one independent component of setting is to shelter from the liquid outlet.
In one embodiment, bubble isolated part is cylindrical shape, bubble isolated part be located at nozzle and liquid outlet it
Between, if bubble isolated part is equipped with dry passage, the peak of the internal orifice in each channel is less than the minimum point of the channel collar extension.
In one embodiment, electrode is cylindrical shape, and the axial length of electrode is shorter than the axial length of bubble isolated part.
According to the present invention, the liquid part in cushion chamber is sprayed by the nozzle of head body, and another part passes through spray
The liquid outlet of head ontology and the gap spilling between covering and head body.Fluid flow at the liquid feeding end of buffer part
When increase, baffle is moved upwards by the extruding force of liquid, is risen along locating part to promote to cover, and is covered upper with locating part
The elastic component being arranged between end is extruded compression, and the gap covered between head body becomes larger, from cover with head body it
Between gap overflow liquid amount increase；When fluid flow at the liquid feeding end of buffer part reduces, baffle is by liquid
Extruding force reduces, and elastic component, which discharges compressing force and to cover, to be declined, to make the gap between covering and head body become smaller,
The amount for the liquid that gap between covering and head body is overflowed reduces.Ejecting device passes through automatic adjusument, it is ensured that from spray
The stability of flow for the liquid that mouth sprays, so as to export the liquid for having and stablizing pattern.Be arranged it is above blocking parts and
The head cover being connected with nozzle separates the liquid sprayed from nozzle with the liquid sprayed from liquid outlet, prevents from throwing in electrochemistry
The liquid sprayed from nozzle in light technology contacts with the liquid sprayed from liquid outlet and causes to leak electricity.
Description of the drawings
Fig. 1 discloses the cross-sectional view of an embodiment of the ejecting device of the present invention.
Fig. 2 discloses the cross-sectional view of the head body of the ejecting device of the present invention.
Fig. 3 discloses the vertical view of the head body of the present invention.
Fig. 4 discloses the vertical view after the head body removal head cover of the present invention.
Fig. 5 discloses the vertical view of the covering of the ejecting device of the present invention.
Fig. 6 discloses the sectional view of the covering of the present invention.
Fig. 7 disclose the present invention ejecting device baffle combined with link after vertical view.
Fig. 8 discloses the vertical view of the electrode of the ejecting device of the present invention.
Fig. 9 discloses the sectional view of the electrode of the present invention.
Figure 10 discloses the vertical view of the bubble isolated part of the ejecting device of the present invention.
Figure 11 discloses the sectional view of the bubble isolated part of the present invention.
Figure 12 discloses the schematic diagram of the application of the ejecting device of the present invention.
Specific implementation mode
For technology contents, construction feature, institute's reached purpose and the effect that the present invention will be described in detail, below in conjunction with embodiment
And schema is coordinated to be described in detail.
It is a kind of pulse liquid feed device, therefore its is defeated in view of the most commonly used is pneumatic diaphragm pumps in liquid supplying apparatus
The liquid gone out is pulsed.As elucidated before, pulsed feed flow leads to fluid flow there are larger fluctuations so that nozzle
Going out flow quantity also has larger fluctuation, causes the pattern of liquid unstable.Ejecting device proposed by the present invention includes buffering as a result,
Portion, head body, regulating device, electrode and bubble isolated part.Buffer part is equipped with cushion chamber, liquid feeding end and outlet end.Nozzle
Ontology is fixed on the outlet end of buffer part, and head body is equipped with nozzle, several liquid outlets and the head cover being connected with nozzle, spray
The nozzle and several liquid outlets of head ontology are connect with the outlet end of buffer part respectively.Regulating device includes blocking in several liquid
Outlet top and the blocking parts below head cover and the actuating member in cushion chamber, actuating member join with blocking parts
It is dynamic.The gap that can be adjusted is formed between blocking parts and liquid outlet, a part for the liquid of buffered portion's output is defeated by nozzle
Go out, another part is overflowed by gap, actuating member according to the size of the amount for the liquid for being input to buffer part move, actuating member with
The linkage of blocking parts adjusts the size in gap to change the amount of the liquid overflowed by gap so that the liquid exported by nozzle
Amount maintains to stablize.The inner wall in cushion chamber and the outlet end close to buffer part is arranged in electrode.Bubble isolated part and head body
It connects and is located in cushion chamber, the bubble generated at bubble isolated part prevention electrode enters the nozzle of head body.
Refering to what is shown in Fig. 1, disclosing the cross-sectional view of an embodiment of the ejecting device of the present invention.Such as Fig. 1 institutes
Show, which includes buffer part 21, head body 22, covering 23, baffle 24, link 25, electrode 31 and bubble isolation
Component 32.
Buffer part 21 is equipped with cushion chamber 211, liquid feeding end and outlet end.What head body 22 was fixed on buffer part 21 goes out liquid
End.In conjunction with shown in Fig. 2 to Fig. 4, the center of head body 22 is equipped with nozzle 221, according to different requirements, the shape of nozzle 221
Can be rectangular, round etc., in the present embodiment, the shape of exemplary nozzle 221 is rectangular.Head body 22 is additionally provided with several
Liquid outlet 222, several liquid outlets 222 are symmetrically distributed in the circumferential direction of nozzle 221, the shape of several liquid outlets 222
For sector.Obviously, the shape of liquid outlet 222 is not limited to exemplified sector.The nozzle 221 and liquid of head body 22
Outlet 222 is connect with the outlet end of buffer part 21 respectively.Head body 22 is additionally provided with the head cover 223 being connected with nozzle 221.
23 are covered to be arranged in the top of several liquid outlets 222 of head body 22 and shelter from several liquid outlets
222, cover 23 lower sections for being located at head cover 223.In conjunction with shown in Fig. 5 and Fig. 6, Fig. 5 and Fig. 6 disclose cartridge nozzle of the invention respectively
The vertical view and sectional view for the covering set.In one embodiment, the center for covering 23 is equipped with through-hole 231.23 are covered to be additionally provided with
It is several to limit hole 232.It covers 23 to be set in head body 22, the nozzle 221 of head body 22 is from the through-hole 231 for covering 23
It is pierced by.Several passed through to locating part 26 covers 23 several and to limit hole 232 and is fixed in head body 22, is limited to cover 23
It is scheduled on the top of several liquid outlets 222 of head body 22 and shelters from several liquid outlets 222.Cover 23 and nozzle sheet
Gasket 27 is provided between body 22, to form gap between covering 23 and head body 22.Cover 23 and each locating part 26
Upper end between be provided with elastic component 28, covering 23 can rise or fall along each locating part 26, when covering 23 along locating part 26
When rising, elastic component 28 is extruded compression, and the gap covered between 23 and head body 22 becomes larger；When covering 23 is in elastic component 28
Elastic acting force under when declining along locating part 26, the gap covered between 23 and head body 22 becomes smaller.Cover 23, locating part
26, gasket 27 and elastic component 28 constitute blocking parts.
In another embodiment, it includes that (i.e. blocking parts includes several independent portions for several independent small coverings to cover 23
Part), a small covering is arranged in the top of each liquid outlet 222 of head body 22, to shelter from the liquid outlet 222.Often
A small cover is equipped with a pair of of limit hole, and a pair of of locating part to limit hole and is fixed in head body 22 across this.Each small screening
It is provided with gasket between lid and head body 22, to form gap between the small covering and head body 22.Each small screening
It covers and is provided with elastic component between the upper end of corresponding locating part.
Baffle 24 is arranged in the cushion chamber 211 of buffer part 21 and faces the liquid feeding end of buffer part 21, in conjunction with Fig. 7 institutes
Show, Fig. 7 disclose the present invention ejecting device baffle combined with link after vertical view.Baffle 24 and the one of link 25
End connection, the other end of link 25 are connect with covering 23.Baffle 24 and link 25 constitute actuating member.
Electrode 31 is arranged the inner wall in cushion chamber 211 and close to the outlet end of buffer part 21.In conjunction with shown in Fig. 8 and Fig. 9, figure
8 and Fig. 9 discloses the vertical view and sectional view of electrode respectively.Electrode 31 is cylindrical shape.In electrochemical polishing process, electrode 31
It is electrically connected with the cathode of power supply.
Bubble isolated part 32 is connect with head body 22 and in cushion chamber 211, bubble isolated part 32 prevents electricity
The nozzle 221 that the bubble generated at pole 31 enters head body 22 can prevent bubble with liquid in electrochemical polishing process
It is ejected to crystal column surface from nozzle 221 and polishing uniformity is caused to reduce.In conjunction with shown in Figure 10 and Figure 11, Figure 10 and Figure 11 difference
Disclose the vertical view and sectional view of bubble isolated part.Bubble isolated part 32 is cylindrical shape, and bubble isolated part 32
Axial length is longer than the axial length of electrode 31.Bubble isolated part 32 is between nozzle 221 and liquid outlet 222, bubble
If isolated part 32 is equipped with dry passage 321, the peak of the internal orifice in each channel 321 is less than the minimum point of the channel collar extension.Nationality
Thus it designs, the bubble generated at electrode 31 can be prevented to enter the nozzle 221 of head body 22 so that bubble can only be with liquid
Body is overflowed from the gap covered between 23 and liquid outlet 222.
With reference to shown in figure 12, the schematic diagram of the application of the ejecting device of the present invention is disclosed.Regulating device above-mentioned can
So that the stability of flow of the liquid exported from nozzle, it is thus possible to obtain with stable liquid pattern.The present invention is also in pipeline
In used pipe to hinder relief member, such as hollow pipeline.As shown in figure 12, in one embodiment, the buffering of the ejecting device
The liquid feeding end in portion 21 is connect with one end of hollow pipeline 41, and the other end of the hollow pipeline 41 is connect with pneumatic diaphragm pump 51.Liquid
Body is exported from pneumatic diaphragm pump 51 to hollow pipeline 41, is supplied to via hollow pipeline 41 in the cushion chamber 211 of buffer part 21.It is slow
The liquid part rushed in chamber 211 is sprayed by the nozzle 221 of head body 22, the liquid that another part passes through head body 22
It is simultaneously overflowed from the gap covered between 23 and head body 22 outlet 222.When pulse wave crest arrives, baffle 24 is by liquid
Extruding force moves upwards, and rises to promote to cover 23, covers 28 quilt of elastic component being arranged between 23 and the upper end of locating part 26
Compression is squeezed, the gap covered between 23 and head body 22 becomes larger, and is overflowed from the gap covered between 23 and head body 22
Liquid amount increase；When pulse trough arrives, baffle 24 is reduced by the extruding force of liquid, and elastic component 28 discharges compressing force
And so that covering 23 declines, to make the gap between covering 23 and head body 22 become smaller, from covering 23 and head body 22
Between gap overflow liquid amount reduce.Be arranged cover above in the of the 23 and head cover 223 that is connected with nozzle 221 will be from
The liquid that nozzle 221 sprays is separated with the liquid sprayed from liquid outlet 222, is prevented in electrochemical polishing process from nozzle
221 liquid sprayed contact with the liquid sprayed from liquid outlet 222 and cause to leak electricity.Ejecting device by automatic adjusument,
Ensure the stability of flow of liquid sprayed from nozzle 221, reduces the liquid pattern that pneumatic diaphragm pump 51 sprays nozzle 221
It influences, so as to export the liquid for having and stablizing pattern.In addition, the ejecting device is connect with hollow pipeline 41, can offset
The pipe of horizontal direction hinders, and the liquid to eliminate irregular " Δ " shape (sealene triangle) exports pattern.
In conclusion the ejecting device of the present invention illustrates that oneself is specific, full and accurate by the above embodiment and correlative type
The relevant technologies are disclosed, those skilled in the art is allow to implement according to this.And embodiment described above is used only to illustrate this
Invention, rather than for limiting the present invention, interest field of the invention should be defined by the claim of the present invention.As for
The change of component number described herein or the replacement of equivalence element etc. still should all belong to the interest field of the present invention.
Claims (10)
1. a kind of ejecting device, which is characterized in that including：
Buffer part, the buffer part are equipped with cushion chamber, liquid feeding end and outlet end；
Head body, the head body are fixed on the outlet end of buffer part, head body be equipped with nozzle, several liquid outlets and
The head cover being connected with nozzle, the nozzle of head body and several liquid outlets are connect with the outlet end of buffer part respectively；
Regulating device, the regulating device include block above several liquid outlets and the blocking parts below head cover and
Actuating member in cushion chamber, the actuating member link with blocking parts；
The inner wall in cushion chamber and the outlet end close to buffer part is arranged in electrode, the electrode；
Bubble isolated part, the bubble isolated part connect with head body and are located in cushion chamber, the resistance of bubble isolated part
The bubble only generated at electrode enters the nozzle of head body；
Wherein, the gap that formation can be adjusted between the blocking parts and liquid outlet, one of the liquid of buffered portion's output
It point is exported by nozzle, another part is overflowed by the gap, and the actuating member is according to the amount of the liquid for being input to buffer part
Size moves, and the linkage of actuating member and blocking parts adjusts the size in gap to change the liquid overflowed by the gap
Amount so that the amount of the liquid exported by the nozzle maintains to stablize.
2. ejecting device according to claim 1, which is characterized in that the blocking parts includes：
It covers, covering is arranged in the top of several liquid outlets of head body and shelters from several liquid outlets, and covering is set
Have several to limit hole；
It is several to locating part, several that cover several is passed through to limit hole and to be fixed in head body to locating part, coverings is along limiting
Position part rises or falls；
Gasket, gasket are arranged between covering and head body so that cover and form gap between head body；
Elastic component, elastic component are arranged between covering and the upper end of locating part.
3. ejecting device according to claim 2, which is characterized in that the actuating member includes：
Baffle, baffle plate setting is in the cushion chamber of buffer part and faces the liquid feeding end of buffer part；
One end of link, link is connect with baffle, and the other end and the covering of link connect.
4. ejecting device according to claim 1, which is characterized in that the liquid feeding end of the buffer part is hindered by a pipe to be eliminated
Component is connected to a pulse liquid feed device.
5. ejecting device according to claim 4, which is characterized in that the pipe resistance relief member is hollow pipeline, hollow
One end of pipeline is connected to pulse liquid feed device, and the other end of hollow pipeline is connected to the liquid feeding end of buffer part.
6. ejecting device according to claim 5, which is characterized in that the pulse liquid feed device is pneumatic diaphragm pump.
7. according to the ejecting device described in any one of claim 1-6, which is characterized in that several liquid outlets symmetrically divide
Circumferential direction of the cloth in nozzle.
8. ejecting device according to claim 7, which is characterized in that the blocking parts includes several independent components,
An independent component is arranged to shelter from the liquid outlet in the top of each liquid outlet of head body.
9. ejecting device according to claim 1, which is characterized in that the bubble isolated part be cylindrical shape, bubble every
From component between nozzle and liquid outlet, if bubble isolated part is equipped with dry passage, the peak of the internal orifice in each channel
Less than the minimum point of the channel collar extension.
10. ejecting device according to claim 9, which is characterized in that the electrode is cylindrical shape, the axial length of electrode
The shorter than axial length of bubble isolated part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410512483.3A CN105437083B (en) | 2014-09-29 | 2014-09-29 | Ejecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410512483.3A CN105437083B (en) | 2014-09-29 | 2014-09-29 | Ejecting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105437083A CN105437083A (en) | 2016-03-30 |
| CN105437083B true CN105437083B (en) | 2018-11-06 |
Family
ID=55547955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410512483.3A Active CN105437083B (en) | 2014-09-29 | 2014-09-29 | Ejecting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105437083B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4236371A1 (en) * | 1992-10-28 | 1994-05-05 | Erno Raumfahrttechnik Gmbh | Injection device and method |
| CN1318207A (en) * | 1998-07-09 | 2001-10-17 | Acm研究公司 | Methods and appts. for electropolishing metal intennections on semiconductor devices |
| WO2005059970A2 (en) * | 2003-12-17 | 2005-06-30 | Acm Research, Inc. | Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication |
| CN101834120A (en) * | 2009-03-10 | 2010-09-15 | 东京毅力科创株式会社 | Shower head and plasma processing apparatus |
| CN102694061A (en) * | 2011-03-25 | 2012-09-26 | 大日本网屏制造株式会社 | Pattern forming apparatus and pattern forming method |
| CN103692293A (en) * | 2012-09-27 | 2014-04-02 | 盛美半导体设备（上海）有限公司 | Stress-free polishing device and polishing method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6720263B2 (en) * | 2001-10-16 | 2004-04-13 | Applied Materials Inc. | Planarization of metal layers on a semiconductor wafer through non-contact de-plating and control with endpoint detection |
| US7189146B2 (en) * | 2003-03-27 | 2007-03-13 | Asm Nutool, Inc. | Method for reduction of defects in wet processed layers |
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2014
- 2014-09-29 CN CN201410512483.3A patent/CN105437083B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4236371A1 (en) * | 1992-10-28 | 1994-05-05 | Erno Raumfahrttechnik Gmbh | Injection device and method |
| CN1318207A (en) * | 1998-07-09 | 2001-10-17 | Acm研究公司 | Methods and appts. for electropolishing metal intennections on semiconductor devices |
| WO2005059970A2 (en) * | 2003-12-17 | 2005-06-30 | Acm Research, Inc. | Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication |
| CN101834120A (en) * | 2009-03-10 | 2010-09-15 | 东京毅力科创株式会社 | Shower head and plasma processing apparatus |
| CN102694061A (en) * | 2011-03-25 | 2012-09-26 | 大日本网屏制造株式会社 | Pattern forming apparatus and pattern forming method |
| CN103692293A (en) * | 2012-09-27 | 2014-04-02 | 盛美半导体设备（上海）有限公司 | Stress-free polishing device and polishing method |
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|---|---|
| CN105437083A (en) | 2016-03-30 |
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Address after: 201203 building 4, No. 1690, Cailun Road, free trade zone, Pudong New Area, Shanghai Patentee after: Shengmei semiconductor equipment (Shanghai) Co., Ltd Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Cailun Road No. fourth 1690 Patentee before: ACM (SHANGHAI) Inc. |