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CN105428335B - A kind of bonding wire - Google Patents

A kind of bonding wire Download PDF

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Publication number
CN105428335B
CN105428335B CN201510899336.0A CN201510899336A CN105428335B CN 105428335 B CN105428335 B CN 105428335B CN 201510899336 A CN201510899336 A CN 201510899336A CN 105428335 B CN105428335 B CN 105428335B
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China
Prior art keywords
bonding wire
coating
gold
palladium
quality
Prior art date
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CN201510899336.0A
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Chinese (zh)
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CN105428335A (en
Inventor
梁忠
谢允昊
闫茹
向翠华
周晓光
苏宏福
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BEIJING DOUBLINK SOLDERS Co Ltd
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BEIJING DOUBLINK SOLDERS Co Ltd
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Publication of CN105428335A publication Critical patent/CN105428335A/en
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    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
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  • Wire Bonding (AREA)

Abstract

The invention discloses a kind of bonding wire, the bonding wire is made up of bonding wire matrix and three layers of coating being coated on outside bonding wire matrix, bonding wire matrix is gold and silver palldium alloy, and three layers of coating are followed successively by gold plate, palladium coating, platinum coating from inside to outside, and thickness of the platinum coating in three layers of coating is most thick.The bonding wire of the present invention has three layers of coating structure, and its anti-oxidant cure is strong, can solve the migration problem of silver, and road stability is good after Electronic Packaging, and preparation cost is low, can substitute spun gold completely.

Description

A kind of bonding wire
Technical field
The present invention relates to a kind of bonding wire, and in particular to a kind of bonding wire with three layers of coating structure and its preparation side Method.
Background technology
At present, it is all to rely on to be bonded that the semiconductor electronic chip in integrated circuit is most of with the connection of outside lead framework What silk was completed, i.e., so-called wire bonding.Its process is bonding wire is fixed again by dedicated ceramic mouth on bonding apparatus, The bonding wire that afterbody reserves certain length is allowed to, then bonding wire afterbody is melted glomeration, Ran Houli by outside arc discharge Spherical bonding wire extruding is connected on the electrode of electronic chip with ceramic mouth, make bonding wire finally by the movement of bonding apparatus The other end using friction by the way of be connected on outside lead framework, completed after plastic resin encapsulates.Ensure above-mentioned institute There is being smoothed out for process, para-linkage silk has that balling-up is good, electrical and thermal conductivity is good, intensity is high, good-extensibility, inoxidizability and resistance to Corrosivity waits require well.So gold of the bonding wire of currently the majority all using purity more than 99.99% is used as main material, work Make line footpath in 18~50 μ ms, now bonding gold wire is well positioned to meet the requirement of above-mentioned bonding, and this circumstances is extensive Checking and be confirmed.But gold involves great expense, bonding gold wire cost is higher, is released one after another to adapt to market demands The substitute of bonding gold wire, such as Silver alloy wire and plating gold-silver alloy wire.Silver alloy wire manufacturing cost is relatively low, but its antioxygen It is relatively low to change cure, spun gold can only be substituted on low-end product.Comparatively, plating gold-silver alloy wire can preferably substitute spun gold, It has plated one layer of gold on the surface of Silver alloy wire, improves the anti-oxidant vulcanization of product really in the case where not influenceing its bonding Performance, but because golden atomic structure and silver atoms structure is quite similar, so can not solve silver in Silver alloy wire surface gold-plating Migration problem, the stability in road is poor after Electronic Packaging, so plating gold-silver alloy wire can not still substitute spun gold completely.
The content of the invention
To solve above-mentioned problems of the prior art, a kind of anti-oxidant cure of present invention offer is strong, stability is good Bonding wire and bonding wire preparation method.
Above-mentioned purpose is realized by following proposal：
A kind of bonding wire, it is characterised in that the bonding wire is by bonding wire matrix and be coated on outside bonding wire matrix three layers Coating is formed, and the bonding wire matrix is gold and silver palldium alloy；Three layers of coating be followed successively by from inside to outside gold plate, palladium coating, Platinum coating, and thickness of the platinum coating in three layers of coating is most thick.
According to above-mentioned bonding wire, it is characterised in that the chemical composition of the gold and silver palldium alloy is：Golden 5wt% -20wt%, Silver-colored 60wt% -94wt%, palladium 1wt% -20wt%.
According to above-mentioned bonding wire, it is characterised in that the quality of the gold plate is the bonding wire substrate quality 1wt% -5wt%, the quality of the palladium coating are the bonding wire matrix and 1wt% -5wt% of the gold plate quality sum, The quality of the platinum coating is 4wt% -10wt% of the bonding wire matrix, the gold plate and the palladium quality of coating sum.
A kind of preparation method of above-mentioned bonding wire, it is characterised in that be the step of methods described：
（1）By gold, silver and palladium in mass ratio（5—20）：（60—94）：（1—20）Carry out vacuum melting after, cast into A diameter of 10 ~ 6mm B alloy wire rod, through it is big or middle drawing arrive again it is micro- be pulled to a diameter of 40-80 μm, obtain bonding wire matrix；
（2）Gold-plated on bonding wire matrix, wherein the quality of gold plate is 1wt% -5wt% of bonding wire substrate quality；
（3）To step（2）B alloy wire be cleaned by ultrasonic, palladium is plated on gold plate, the wherein quality of palladium coating is key 1wt% -5wt% of plying matrix and gold plate quality sum；
（4）To step（3）B alloy wire be cleaned by ultrasonic, the platinum plating on palladium coating, the wherein quality of platinum coating are key 4wt% -10wt% of plying matrix, gold plate and palladium quality of coating sum；
（5）By step（4）B alloy wire it is micro- be pulled to required line footpath, obtain bonding wire.
According to the preparation method of above-mentioned bonding wire, it is characterised in that gold-plated, plating palladium and the mode of platinum plating is without cyanogen electricity Plating.
According to the preparation method of above-mentioned bonding wire, it is characterised in that the golden purity is more than 99.999%, described The purity of palladium is more than 99.99%, and the purity of the platinum is more than 99.99%.
Beneficial effects of the present invention：
The bonding wire of the present invention has three layers of coating structure, and its anti-oxidant cure is strong, can solve the migration problem of silver, electricity Road stability is good after son encapsulation, and preparation cost is low, can substitute spun gold completely.
Brief description of the drawings
Fig. 1 is the structural representation of the bonding gold wire of the present invention.
Embodiment
As described in Figure 1, bonding wire of the invention possesses three layers of coating structure, and three layers of coating are coated on outside bonding wire matrix 1. The material of bonding wire matrix 1 is gold and silver palldium alloy, and three layers of coating are followed successively by gold plate 2, palladium coating 3, platinum coating 4 from inside to outside, And the bonding wire of the present invention is using platinum as main coating, i.e. the thickness of platinum coating 4 is most thick in three layers of coating.As bonding wire matrix 1 Gold and silver palldium alloy chemical composition for golden 5wt% -20wt%, silver-colored 60wt% -94wt%, palladium 1wt% -20wt%.Gold plates 2 layers Quality is 1wt% -5wt% of the mass of bonding wire matrix 1, and the quality of palladium coating 3 is bonding wire matrix 1 and the quality sum of gold plate 2 1wt% -5wt%, the quality of platinum coating 4 for bonding wire matrix 1, gold plate 2 and the quality sum of palladium coating 3 4wt% - 10wt%。
The step of preparation method of the bonding wire of the present invention, is as follows：
（1）By gold, silver and palladium in mass ratio（5—20）：（60—94）：（1—20）Carry out vacuum melting, cast Cheng Zhi Footpath be 10 ~ 6mm B alloy wire rod, through it is big or middle drawing arrive again it is micro- be pulled to a diameter of 40-80 μm, obtain bonding wire matrix；
（2）Gold-plated on bonding wire matrix, wherein the quality of gold plate is 1wt% -5wt% of bonding wire substrate quality；
（3）To step（2）B alloy wire be cleaned by ultrasonic, palladium is plated on gold plate, the wherein quality of palladium coating is key 1wt% -5wt% of plying matrix and gold plate quality sum；
（4）To step（3）B alloy wire be cleaned by ultrasonic, the platinum plating on palladium coating, the wherein quality of platinum coating are key 4wt% -10wt% of plying matrix, gold plate and palladium quality of coating sum；
（5）By step（4）B alloy wire it is micro- be pulled to required line footpath, obtain bonding wire.
The mode that plating is carried out on bonding wire matrix is cyanideless electro-plating.
To improve the performance of bonding wire, the purity of metal used in the present invention is controlled, wherein, golden purity is More than 99.999%, the purity of palladium is more than 99.99%, and the purity of platinum is more than 99.99%.
Bonding wire of the present invention and preparation method thereof is further described with specific embodiment below.
Embodiment 1
（1）By gold, more than 99.99% silver and more than 99.99% palladium in mass ratio 5 that purity is more than 99.999%： 94：1 carry out vacuum melting, cast into a diameter of 10 ~ 6mm B alloy wire rod, through it is big or middle drawing arrive again it is micro- be pulled to a diameter of 80 μm, Obtain bonding wire matrix.
（2）One layer of gold is electroplated using the method for cyanideless electro-plating on bonding wire matrix, golden purity is more than 99.999%, The quality of gold plate is the 1wt% of bonding wire substrate quality.
（3）To step（2）B alloy wire be cleaned by ultrasonic, on gold plate using cyanideless electro-plating method electroplate one layer Palladium, the purity of palladium is more than 99.99%, and the quality of palladium coating is bonding wire matrix and the 1wt% of gold plate quality sum.
（4）To step（3）B alloy wire be cleaned by ultrasonic, on palladium coating using cyanideless electro-plating method electroplate one layer Platinum, the purity of platinum is more than 99.99%, and the quality of platinum coating is bonding wire matrix, gold plate and palladium quality of coating sum 4wt%。
（5）By step（4）B alloy wire it is micro- be pulled to required line footpath, obtain bonding wire.
Embodiment 2
（1）By gold, silver and palladium in mass ratio 20：60：20 carry out vacuum melting, alloy of the cast into a diameter of 10 ~ 6mm Silk rod, through it is big or middle drawing arrive again it is micro- be pulled to a diameter of 40, obtain bonding wire matrix；
（2）Gold-plated on bonding wire matrix, golden purity is more than 99.999%, and the quality of gold plate is bonding wire matrix The 5wt% of quality；
（3）To step（2）B alloy wire be cleaned by ultrasonic, plate palladium on gold plate, the purity of palladium is more than 99.99%, The quality of palladium coating is bonding wire matrix and the 5wt% of gold plate quality sum；
（4）To step（3）B alloy wire be cleaned by ultrasonic, the platinum plating on palladium coating, the purity of platinum is more than 99.99%, The quality of platinum coating is the 10wt% of bonding wire matrix, gold plate and palladium quality of coating sum；
（5）By step（4）B alloy wire it is micro- be pulled to required line footpath, obtain bonding wire.

Claims (6)

1. a kind of bonding wire, it is characterised in that the bonding wire is by bonding wire matrix and three layers of plating being coated on outside bonding wire matrix Layer is formed；The bonding wire matrix is gold and silver palldium alloy, and three layers of coating is followed successively by gold plate, palladium coating, platinum from inside to outside Coating, and thickness of the platinum coating in three layers of coating is most thick.
2. bonding wire according to claim 1, it is characterised in that the chemical composition of the gold and silver palldium alloy is：Gold 5wt% -20wt%, silver-colored 60wt% -94wt%, palladium 1wt% -20wt%.
3. bonding wire according to claim 2, it is characterised in that the quality of the gold plate is the bonding wire matrix matter 1wt% -5wt% of amount, the quality of the palladium coating for the bonding wire matrix and the 1wt% of the gold plate quality sum - 5wt%, the quality of the platinum coating for the bonding wire matrix, the gold plate and the palladium quality of coating sum 4wt%- 10wt%。
4. a kind of preparation method of bonding wire as claimed in claim 3, it is characterised in that be the step of methods described：
（1）By gold, silver and palladium in mass ratio（5—20）：（60—94）：（1—20）After carrying out vacuum melting, cast is into diameter For 10mm B alloy wire rod, through big or middle drawing arrive again it is micro- be pulled to a diameter of 40-80 μm, obtain bonding wire matrix；
（2）Gold-plated on bonding wire matrix, wherein the quality of gold plate is 1wt% -5wt% of bonding wire substrate quality；
（3）To step（2）B alloy wire be cleaned by ultrasonic, palladium is plated on gold plate, the wherein quality of palladium coating is bonding wire 1wt% -5wt% of matrix and gold plate quality sum；
（4）To step（3）B alloy wire be cleaned by ultrasonic, the platinum plating on palladium coating, the wherein quality of platinum coating are bonding wire 4wt% -10wt% of matrix, gold plate and palladium quality of coating sum；
（5）By step（4）B alloy wire it is micro- be pulled to required line footpath, obtain bonding wire.
5. the preparation method of bonding wire according to claim 4, it is characterised in that gold-plated, plating palladium and the mode of platinum plating are Cyanideless electro-plating.
6. the preparation method of bonding wire according to claim 4, it is characterised in that the golden purity is more than 99.999%, institute The purity for stating palladium is more than 99.99%, and the purity of the platinum is more than 99.99%.
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