CN105407190A - Mobile phone - Google Patents
Mobile phone Download PDFInfo
- Publication number
- CN105407190A CN105407190A CN201510900009.2A CN201510900009A CN105407190A CN 105407190 A CN105407190 A CN 105407190A CN 201510900009 A CN201510900009 A CN 201510900009A CN 105407190 A CN105407190 A CN 105407190A
- Authority
- CN
- China
- Prior art keywords
- mobile phone
- substrate
- open region
- tft substrate
- phone according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 64
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000003139 buffering effect Effects 0.000 description 5
- 239000006260 foam Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Telephone Set Structure (AREA)
Abstract
The invention provides a mobile phone. The mobile phone comprises a TFT substrate and a CF substrate, wherein a side-end surface of the TFT substrate is provided with a bonding pad for a driving IC and a flexible printed circuit board; the CF substrate is the same as the TFT substrate in a length and a width; and the CF substrate is provided with an open area corresponding to the bonding pad for the driving IC and the flexible printed circuit board in order that the TFT substrate can be combined with the CF substrate smoothly, thereby absorbing stress on the mobile phone generated during falling of the mobile phone in a balanced way, and lowering the screen breaking probability. According to the mobile phone, a step structure is avoided after the TFT substrate is combined with the CF substrate, so that a screen is not liable to break during falling of the mobile phone, and the falling resistance of the mobile phone is enhanced.
Description
Technical field
The present invention relates to a kind of mobile phone, particularly a kind of mobile phone of shatter-resistant better performances.
Background technology
Current large-size screen monitors touch-control smart mobile phone is more and more universal, in use unavoidably can because various situation is slipped out of the hand and fallen, and most of mobile phone is easy to brokenly screen when falling.
Refer to Fig. 1, Fig. 1 is the simplified structure schematic diagram that in prior art, preventing mobile phone breaks screen design.
As shown in Figure 1, in prior art, CF substrate 120 is combined in TFT substrate 110, CF substrate is slightly short compared to TFT substrate 110, define ledge structure, the surface combination of CF substrate 120 has skin glass cover plate 130, prevents brokenly screen between skin glass cover plate 130 and TFT substrate 110 by filling foam or buffering adhesive 140.
But, add cost of labor by filling foam or the mode of buffering adhesive 140, and the support effect clogging foam or buffering adhesive 140 is poor, fails to improve the shatter-resistant performance of mobile phone.
Summary of the invention
The invention provides a kind of mobile phone, add cost of labor to solve in prior art by filling foam or the mode of buffering adhesive, and the support effect clogging foam or buffering adhesive is poor, fail the problem of the shatter-resistant performance improving mobile phone.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of mobile phone, comprising:
TFT substrate, side end surface is provided with the pad of drive IC and flexible PCB;
CF substrate, length and width same with described TFT substrate, described CF substrate is provided with the open region corresponding with the pad of described drive IC and described flexible PCB, make described TFT substrate can with the smooth combination of described CF substrate, thus equilibrium absorbs the stress be subject to when mobile phone falls, reduce broken screen probability.
According to one preferred embodiment of the present invention, the length of described open region is 11 to 50 millimeters.
According to one preferred embodiment of the present invention, the length of described open region is 15 to 20 millimeters.
According to one preferred embodiment of the present invention, the width of described open region is 1 to 10 millimeter.
According to one preferred embodiment of the present invention, the length of described open region is 2 to 10 millimeters.
According to one preferred embodiment of the present invention, described open region is untight rectangular aperture or closed rectangular through slot.
According to one preferred embodiment of the present invention, described open region is untight arc opening, closed arc-shaped slot or occluded ellipse shape groove.
According to one preferred embodiment of the present invention, described open region is that profile mates the non-closing openings of the pad of described drive IC and described flexible PCB or closed groove just.
According to one preferred embodiment of the present invention, the pad of described drive IC and described flexible PCB be located at the surface, upside of described TFT substrate or lower side surperficial, upside or the lower side of described CF substrate are located in the position that described open region corresponds to the pad of described drive IC and described flexible PCB.
According to one preferred embodiment of the present invention, described mobile phone also comprises housing, main control unit, power module, top layer cover plate, described TFT substrate and described CF substrate are located in described housing, described main control unit is powered by described power module and is controlled described TFT substrate, described top layer cover plate and the smooth combination of described CF substrate.
The invention has the beneficial effects as follows: the situation being different from prior art, mobile phone provided by the invention, owing to there is not ledge structure after TFT substrate and CF substrate in combination, relatively not easily breaking screen when falling, enhancing the crash resistance energy of mobile phone.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the simplified structure schematic diagram that in prior art, preventing mobile phone breaks screen design;
Fig. 2 is the TFT substrate of the mobile phone of the preferred embodiment of the present invention and the simplification floor map of CF substrate;
Fig. 3 is the TFT substrate of the mobile phone of the preferred embodiment of the present invention and the simplification combining structure schematic diagram of CF substrate.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
See also Fig. 2 and Fig. 3, the invention provides a kind of mobile phone, this mobile phone comprises TFT substrate 210, CF substrate 220.
Certainly, this mobile phone also comprises the general components such as housing, main control unit, power module, top layer cover plate (not shown), wherein, TFT substrate 210 and CF substrate 220 are located in housing, main control unit is powered by power module and is controlled TFT substrate 210, top layer cover plate and the smooth combination of CF substrate 220, because the structures such as housing, main control unit, power module, top layer cover plate do not relate to inventive point place, do not repeat herein.
In embodiments of the present invention, TFT substrate 210 side end surface is provided with the pad (bondingpad) 211 of drive IC and flexible PCB.CF substrate 220 and the same length and width of TFT substrate 210, CF substrate 220 is provided with the open region 221 corresponding with the pad 211 of drive IC and flexible PCB, make TFT substrate 210 can combination smooth with CF substrate 220 thus, thus balancedly absorb the stress be subject to when mobile phone falls, reduce broken screen probability.
In specific product, the size of open region 221 can be determined according to the size of the pad 211 of drive IC and flexible PCB.
Particularly, the length of open region 221 can be 11 to 50 millimeters, and preferably, the length of open region 221 is 15 to 20 millimeters.The width of open region 221 can be 1 to 10 millimeter, and preferably, the length of open region 221 is 2 to 10 millimeters.
In embodiments of the present invention, open region 221 can be untight rectangular aperture or closed rectangular through slot; Or open region 221 can be untight arc opening, closed arc-shaped slot or occluded ellipse shape groove; Or open region 221 can be profile and just mates the non-closing openings of the pad 211 of drive IC and flexible PCB or closed groove.
In embodiments of the present invention, the pad 211 of drive IC and flexible PCB is located at the surface, lower side of TFT substrate 210, and the lower side of CF substrate 220 is located in the position that open region 221 corresponds to the pad 211 of drive IC and flexible PCB.
In other embodiments, the pad 211 of drive IC and flexible PCB also can be located at the surface, upside of TFT substrate 210, and the upside of CF substrate 220 is located in the position that open region 221 corresponds to the pad 211 of drive IC and flexible PCB.
In sum, one of ordinary skill in the art will readily recognize that the situation being different from prior art, mobile phone provided by the invention, owing to there is not ledge structure after TFT substrate 210 and CF substrate 220 combination, relatively not easily breaking screen when falling, enhancing the crash resistance energy of mobile phone.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (10)
1. a mobile phone, is characterized in that, comprising:
TFT substrate, side end surface is provided with the pad of drive IC and flexible PCB;
CF substrate, length and width same with described TFT substrate, described CF substrate is provided with the open region corresponding with the pad of described drive IC and described flexible PCB, make described TFT substrate can with the smooth combination of described CF substrate, thus equilibrium absorbs the stress be subject to when mobile phone falls, reduce broken screen probability.
2. mobile phone according to claim 1, is characterized in that, the length of described open region is 11 to 50 millimeters.
3. mobile phone according to claim 2, is characterized in that, the length of described open region is 15 to 20 millimeters.
4. mobile phone according to claim 1, is characterized in that, the width of described open region is 1 to 10 millimeter.
5. mobile phone according to claim 4, is characterized in that, the length of described open region is 2 to 10 millimeters.
6. mobile phone according to claim 1, is characterized in that, described open region is untight rectangular aperture or closed rectangular through slot.
7. mobile phone according to claim 1, is characterized in that, described open region is untight arc opening, closed arc-shaped slot or occluded ellipse shape groove.
8. mobile phone according to claim 1, is characterized in that, described open region is that profile mates the non-closing openings of the pad of described drive IC and described flexible PCB or closed groove just.
9. the mobile phone according to any one of claim 1-8, it is characterized in that, the pad of described drive IC and described flexible PCB be located at the surface, upside of described TFT substrate or lower side surperficial, upside or the lower side of described CF substrate are located in the position that described open region corresponds to the pad of described drive IC and described flexible PCB.
10. mobile phone according to claim 9, it is characterized in that, described mobile phone also comprises housing, main control unit, power module, top layer cover plate, described TFT substrate and described CF substrate are located in described housing, described main control unit is powered by described power module and is controlled described TFT substrate, described top layer cover plate and the smooth combination of described CF substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510900009.2A CN105407190A (en) | 2015-12-08 | 2015-12-08 | Mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510900009.2A CN105407190A (en) | 2015-12-08 | 2015-12-08 | Mobile phone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105407190A true CN105407190A (en) | 2016-03-16 |
Family
ID=55472433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510900009.2A Pending CN105407190A (en) | 2015-12-08 | 2015-12-08 | Mobile phone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105407190A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1447161A (en) * | 2002-03-27 | 2003-10-08 | 富士通显示技术株式会社 | Substrate for LCD, LCD and its mfg. method and mfg. appts. |
| US20050062907A1 (en) * | 2003-09-22 | 2005-03-24 | Kohji Matsuoka | Liquid crystal display device |
| CN101266367A (en) * | 2007-03-16 | 2008-09-17 | 株式会社日立显示器 | LCD panel |
| CN205336332U (en) * | 2015-12-08 | 2016-06-22 | 深圳天珑无线科技有限公司 | Mobile phone |
-
2015
- 2015-12-08 CN CN201510900009.2A patent/CN105407190A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1447161A (en) * | 2002-03-27 | 2003-10-08 | 富士通显示技术株式会社 | Substrate for LCD, LCD and its mfg. method and mfg. appts. |
| US20050062907A1 (en) * | 2003-09-22 | 2005-03-24 | Kohji Matsuoka | Liquid crystal display device |
| CN101266367A (en) * | 2007-03-16 | 2008-09-17 | 株式会社日立显示器 | LCD panel |
| CN205336332U (en) * | 2015-12-08 | 2016-06-22 | 深圳天珑无线科技有限公司 | Mobile phone |
Non-Patent Citations (1)
| Title |
|---|
| 杨国义: "《材料力学》", 28 February 2007 * |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160316 |