CN105403318A - Surface multi-point temperature monitoring method and system - Google Patents

Abstract

The invention relates to a method and system for monitoring surface multi-point temperature, comprising a plurality of temperature sensors and a monitoring system, the temperature sensors are connected to the monitoring system, the monitoring system includes a processor, and a plurality of temperature sensors are respectively preset at intervals for sampling Periodically collect the temperature value corresponding to the temperature monitoring point, and transmit the temperature value to the processor; the processor performs the fitting of the temperature step response curve according to the received multiple temperature values, so as to obtain the temperature corresponding to the multiple temperature monitoring points The temperature step response curve of the surface being monitored. The temperature step response curve can reflect the temperature change of the temperature monitoring point in advance, and the temperature change of the temperature monitoring point can be reasonably predicted by obtaining the temperature step response curve. It can be seen that the method and system for multi-point temperature monitoring on the surface can reasonably predict the temperature change of the temperature monitoring point by collecting the temperature value at the temperature monitoring point of the monitored surface, which is helpful for precise temperature control.

Description

A method and system for surface multi-point temperature monitoring

technical field

The invention relates to the technical field of industrial temperature collection, in particular to a method and system for monitoring surface multi-point temperature.

Background technique

Temperature is one of the important indicators for the normal operation of instruments and equipment. In addition to the equipment for temperature control, such as freezers and thermostats, which must require precise temperature control, industrial and agricultural equipment, medical equipment, or the most basic circuit components used in other fields can only be used within a limited temperature range. able to work. Therefore, temperature detection is of great significance. The Chinese patent application with the publication number CN101852652A discloses a multi-point temperature acquisition system and its acquisition method, including multiple one-line bus temperature sensors DS18B20, PIC, RS232, liquid crystal display device and PC computer main control machine. The PC controls the temperature conversion, and can display multi-point temperatures on the computer interface. The Chinese patent application with the publication number CN103630260A discloses a lower-level temperature acquisition terminal system, which mainly includes a single-chip microcomputer MSP430F149, a liquid crystal display circuit, a thermistor circuit NTC, and a single-chip radio frequency transceiver nRF24L01, which can realize multi-point temperature detection and remote wireless control. The above two temperature acquisition methods can only display the temperature value at the temperature detection point on the surface of the instrument and equipment, and know nothing about the temperature outside the temperature detection point. The temperature detection is not comprehensive and cannot perform precise temperature control.

Contents of the invention

The purpose of the present invention is to propose a method and system for surface multi-point temperature monitoring. By collecting the temperature value at the temperature monitoring point of the monitored surface, the temperature change of the temperature monitoring point can be reasonably predicted, which is helpful for precise temperature monitoring. control.

For reaching this purpose, the present invention adopts following technical scheme:

In the first aspect, a method for surface multi-point temperature monitoring is provided, including:

Multiple temperature sensors collect temperature values corresponding to temperature monitoring points at intervals of preset sampling periods, and transmit the temperature values to the processor;

The processor fits the temperature step response curve according to the received multiple temperature values, so as to obtain the temperature step response curve of the monitored surface corresponding to the multiple temperature monitoring points.

Wherein, the fitting of the temperature step response curve includes the establishment of a mathematical model of a first-order inertia link with a hysteresis property;

The mathematical model is G(s)=K e^(-τs)/(Ts+1), wherein, G(s) is a temperature transfer function, K is a proportional coefficient, τ is a delay time constant, and s is Differential control operator, e^(-τs) is the part of the pure delay link, T is the inertial time constant.

Wherein, the temperature sensor is an infrared temperature sensor.

Wherein, the plurality of temperature sensors collect temperature values corresponding to temperature monitoring points at intervals of preset sampling periods, and transmit the temperature values to the processor; including:

A plurality of temperature sensors collect temperature values corresponding to temperature monitoring points at intervals of preset sampling periods, and transmit the temperature values to the processor, and the plurality of temperature monitoring points are respectively located in an orthogonal grid drawn by vertical and horizontal lines intersection of lines;

The processor obtains a temperature density map of the monitored surface corresponding to the multiple temperature monitoring points according to the received multiple temperature values and the preset position information of the temperature monitoring points respectively corresponding to the multiple temperature values, and the temperature density The map is obtained by performing an interpolation algorithm on a temperature value matrix formed by multiple temperature values and multiple position information.

Wherein, after the plurality of temperature sensors collect the temperature values corresponding to the temperature monitoring points at intervals of preset sampling periods, and transmit the temperature values to the processor, it also includes:

The processor obtains the average temperature of the monitored surface corresponding to the multiple temperature monitoring points according to the multiple received temperature values, and the average temperature=the sum of the received temperature values/the temperature monitoring point corresponding to the received temperature values sum of numbers.

Wherein, after the plurality of temperature sensors collect the temperature values corresponding to the temperature monitoring points at intervals of preset sampling periods, and transmit the temperature values to the processor, it also includes:

When any temperature value is outside the preset safe temperature range, the processor activates an alarm so as to issue an alarm message.

Wherein, after the plurality of temperature sensors collect the temperature values corresponding to the temperature monitoring points at intervals of preset sampling periods, and transmit the temperature values to the processor, it also includes:

When the average temperature value is outside the preset safe average temperature range, the processor activates an alarm so as to issue an alarm message.

Wherein, after obtaining the temperature step response curve of the monitored surface corresponding to a plurality of temperature monitoring points, it also includes:

the processor saves the temperature data of the monitored surface; or,

the processor sends the temperature data of the monitored surface to the display screen for display; or,

The processor sends the temperature data of the monitored surface to the display screen for display through the GUI interface.

In a second aspect, a system for monitoring surface multi-point temperature is provided, including a plurality of temperature sensors and a monitoring system, the temperature sensors are connected to the monitoring system, and the monitoring system includes a processor,

A plurality of temperature sensors are used to collect temperature values corresponding to temperature monitoring points at intervals of preset sampling periods, and transmit the temperature values to the processor;

The processor is configured to fit the temperature step response curve according to the received multiple temperature values, so as to obtain the temperature step response curve of the monitored surface corresponding to the multiple temperature monitoring points.

Wherein, the fitting of the temperature step response curve includes the establishment of a mathematical model of a first-order inertia link with a hysteresis property;

The mathematical model is G(s)=K e^(-τs)/(Ts+1), wherein, G(s) is a temperature transfer function, K is a proportional coefficient, τ is a delay time constant, and s is Differential control operator, e^(-τs) is the part of the pure delay link, T is the inertial time constant.

Wherein, the temperature sensor is an infrared temperature sensor.

Wherein, the monitoring system also includes a bracket, and a plurality of fixing holes for fixing the temperature sensor are arranged on the bracket, and the fixing holes correspond to the temperature sensors one by one, and each fixing hole is located on the the intersection of the drawn orthogonal grid lines;

A plurality of temperature sensors are respectively fixed in the fixing holes of the bracket according to a preset order, and are also used to collect temperature values corresponding to the temperature monitoring points at intervals of preset sampling periods, and transmit the temperature values to the processor,

The processor is further configured to obtain a temperature density map of the monitored surface corresponding to the multiple temperature monitoring points according to the received multiple temperature values and the preset position information of the temperature monitoring points respectively corresponding to the multiple temperature values, The temperature density map is obtained by performing an interpolation algorithm on a temperature value matrix formed by multiple temperature values and multiple position information.

Wherein, the processor is further configured to obtain the average temperature of the monitored surface corresponding to a plurality of temperature monitoring points according to the received multiple temperature values, the average temperature=sum of the received temperature values/received The sum of the number of temperature monitoring points corresponding to the temperature value.

Wherein, the bracket includes a frame body plane and a frame body axis, the frame body plane and the frame body axis are orthogonally connected, and 25 fixing holes are arranged on the frame body plane, and the fixing holes are circular concave holes.

Wherein, the bracket includes a frame body plane and a frame body axis, the frame body plane and the frame body axis are connected orthogonally, and the surface shape of the frame body plane is a square of 30cm×30cm.

Wherein, the monitoring system further includes a monitoring subsystem, the processor is a host computer, the host computer is electrically connected to the monitoring subsystem, and the bracket is detachably connected to the monitoring subsystem.

Wherein, the monitoring subsystem includes a single-chip microcomputer and a plurality of temperature sensor selection switches for controlling the on-off circuit of each temperature sensor, the temperature sensor selection switch corresponds to the temperature sensor one by one, and the temperature sensor selection switch and the single-chip connect.

Wherein, the single-chip microcomputer is a PIC16 single-chip microcomputer, and the monitoring subsystem further includes an A/D expansion circuit, and the A/D expansion circuit is connected to the single-chip microcomputer.

Wherein, the single-chip microcomputer is an ARM type single-chip microcomputer or a DSP type single-chip microcomputer.

Wherein, the monitoring subsystem further includes an alarm circuit, the alarm circuit is connected to the single-chip microcomputer, the alarm circuit includes an alarm, and the alarm is a buzzer.

Wherein, the monitoring subsystem also includes a power circuit, and the power circuit is connected to the single-chip microcomputer.

Wherein, the monitoring subsystem further includes a display circuit, the display circuit is connected to a single-chip microcomputer, and the display circuit includes an LCD display screen.

Wherein, the monitoring subsystem further includes a serial communication circuit, one end of the serial communication circuit is connected to the single-chip computer, and the other end of the serial communication circuit is connected to the host computer.

Wherein, the monitoring subsystem includes a box body, a control panel, a plurality of temperature sensor working indicator lights, an alarm temperature setting button for setting the alarm temperature and a display setting button are arranged on a surface of the box body. The alarm temperature display digital tube of the alarm temperature, the alarm temperature setting button and the alarm temperature display digital tube are all connected to the single-chip microcomputer, the LCD display screen and a plurality of temperature sensor selection switches are arranged on the control panel, and each temperature sensor The working indicator lights are electrically connected with a temperature sensor selector switch. When the temperature sensor selector switch is connected to the circuit of the corresponding temperature sensor, the corresponding temperature sensor work indicator light is on. When the temperature sensor selector switch cuts off the circuit of the corresponding temperature sensor circuit, the corresponding temperature sensor working indicator light goes out.

Wherein, the monitoring subsystem includes a box, a surface of the box is provided with a power circuit interface, and the power circuit interface is connected to the power circuit.

Wherein, the monitoring subsystem includes a box body, a serial port communication interface is arranged on a surface of the box body, and the serial port communication interface is connected to the serial port communication circuit.

Wherein, the other surface of the box is provided with a temperature sensor interface, and each temperature sensor interface is connected to a temperature sensor through a wire.

Wherein, the monitoring subsystem includes a box body, the box body is a six-sided box body, the upper end of the six-sided box body is provided with a fixing groove, the frame axis and the fixing groove are fixed together, and the frame body plane can be wound around The frame shaft rotates, and the frame shaft can rotate along the central axis of the fixing groove.

The beneficial effects of the present invention are: a method and system for monitoring surface multi-point temperature, including multiple temperature sensors and a monitoring system, the temperature sensors are connected to the monitoring system, the monitoring system includes a processor, and multiple temperature sensors are respectively The temperature value corresponding to the temperature monitoring point is collected at interval preset sampling periods, and the temperature value is transmitted to the processor; the processor performs temperature step response curve fitting according to the received multiple temperature values to obtain multiple temperature The temperature step response curve of the monitored surface corresponding to the monitoring point. The temperature step response curve can reflect the temperature change of the temperature monitoring point in advance, and the temperature change of the temperature monitoring point can be reasonably predicted by obtaining the temperature step response curve. It can be seen that the method and system for multi-point temperature monitoring on the surface can reasonably predict the temperature change of the temperature monitoring point by collecting the temperature value at the temperature monitoring point of the monitored surface, which is helpful for precise temperature control.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments of the present invention. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention , for those skilled in the art, other drawings can also be obtained according to the content of the embodiment of the present invention and these drawings without any creative effort.

Fig. 1 is a schematic flowchart of the first embodiment of the method for monitoring surface multi-point temperature provided by the embodiment of the present invention.

Fig. 2 is a schematic flowchart of the second embodiment of the method for monitoring surface multi-point temperature provided by the embodiment of the present invention.

Fig. 3 is a temperature density diagram of interpolation of 20 numbers and a temperature density diagram of interpolation of 40 numbers provided by the embodiment of the present invention.

Fig. 4 is a schematic flowchart of the third embodiment of the method for monitoring surface multi-point temperature provided by the embodiment of the present invention.

Fig. 5 is a temperature monitoring GUI interface displayed after applying the method for surface multi-point temperature monitoring provided by an embodiment of the present invention.

Fig. 6 is a structural block diagram of a system for monitoring surface multi-point temperature provided by an embodiment of the present invention.

Fig. 7 is a schematic perspective view of the first embodiment in which 25 fixing holes are provided on the frame body plane of the bracket provided by the embodiment of the present invention.

Fig. 8 is a schematic perspective view of the second embodiment of the bracket body plane provided with 25 fixing holes provided by the embodiment of the present invention.

Fig. 9 is a block diagram of the circuit structure of the monitoring subsystem provided by the embodiment of the present invention.

Fig. 10 is a front perspective structural schematic diagram of the box body provided by the embodiment of the present invention.

Fig. 11 is a schematic diagram of a rear perspective structure of a box provided by an embodiment of the present invention.

The accompanying drawings are as follows:

20-box; 201-control panel; 202-LCD display; 2011-temperature sensor selection switch;

2012-Temperature sensor working indicator light; 2013-Alarm temperature setting button;

2014-alarm temperature display digital tube; 2015-power circuit interface; 2016-serial communication interface;

2017-temperature sensor interface; 2018-fixing slot; 30-bracket; 301-frame plane;

302-frame shaft.

detailed description

In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only the technical solutions of the present invention. Some, but not all, embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

Please refer to FIG. 1 , which is a schematic flowchart of the first embodiment of the method for monitoring surface multi-point temperature provided by the embodiment of the present invention. The surface multi-point temperature monitoring method provided by the embodiment of the present invention can be applied to the temperature monitoring of the surface of various industrial and agricultural equipment, medical instruments, or circuit components.

The method of surface multi-point temperature monitoring includes:

Step S101 , a plurality of temperature sensors collect temperature values corresponding to temperature monitoring points at intervals of preset sampling periods, and transmit the temperature values to a processor.

The preset sampling period can be set as required, and can be selected as 0.5s, 1s or 2s. At each interval of the preset sampling period, multiple temperature sensors will transmit the collected temperature values to the processor.

Step S102 , the processor performs temperature step response curve fitting according to the multiple received temperature values, so as to obtain temperature step response curves of the monitored surface corresponding to multiple temperature monitoring points.

The step response is the change response of the output of a system when its input is a step function. In the field of control, step response refers to the time-domain characteristics of the output of a system when the input changes from 0 to a fixed value in a short time. Analyzing the step response of a system helps to understand the characteristics of the system, because when the input changes rapidly and substantially after a long period of steady state, the characteristics of each part of the system can be seen, and the characteristics of a system can also be known. stability. It can be seen that the temperature step response curve can reflect the temperature change of the temperature monitoring point in advance, and can reasonably predict the temperature change of the temperature monitoring point, which is helpful for precise temperature control.

Wherein, the fitting of the temperature step response curve includes the establishment of a mathematical model of a first-order inertia link with a hysteresis property;

The mathematical model is G(s)=K e^(-τs)/(Ts+1), wherein, G(s) is a temperature transfer function, K is a proportional coefficient, τ is a delay time constant, and s is Differential control operator, e^(-τs) is the part of the pure delay link, T is the inertial time constant.

According to the temperature value of the surface of the monitored object, the temperature step response curve of the surface of the monitored object is fitted. The specific implementation methods include:

a) Set the type of curve to be fitted in the program. It is generally required that the interior of the monitored object contains heating or cooling equipment, and its temperature step response curve is a mathematical model of the first-order inertial link with hysteresis properties:

G(s)=K·e^(-τs)/(Ts+1);

b) Save the average temperature data TT and the corresponding time t;

c) Fit the curve and display it.

The corresponding command of the program to obtain the temperature step response curve under the Matlab environment is:

fun=inline('a(1).*exp(-a(3).*t)./(a(2).*t+1)','a','t');% set the curve The equation is K*e-τs/(Ts+1), where a includes three parameters: a(1)=K, a(2)=T, a(3)=τ;

a=lsqcurvefit(fun,aa,t,TT);% fitting curve, aa represents the starting point of the curve, the average temperature of the first temperature sensor sampling is taken as the starting point of the curve,

holdon; plot(t,TT,'bo');% draw the original data points,

T0=fun(a,t); % use T0 to represent the fitted curve,

plot(t,T0,'r');% draw a fitting curve,

holdoff; disp(a)% Calculate and display K, t, T parameter values.

Wherein, the temperature sensor is an infrared temperature sensor.

The infrared temperature sensor can accurately monitor the surface temperature of the object without touching the surface of the object to be monitored.

In nature, when the temperature of an object is higher than absolute zero, due to the existence of its internal thermal motion, it will continuously radiate electromagnetic waves to the surroundings, including infrared rays with a band of 0.75-100 μm. Infrared temperature sensors can sense infrared rays in this band. The physical essence of infrared radiation is thermal radiation. The higher the temperature of an object, the more infrared rays it radiates, and the stronger the energy of infrared radiation. The infrared temperature sensor can reflect the temperature value of the object according to the energy of the received infrared rays.

The method for surface multi-point temperature monitoring provided by the present invention reasonably predicts the temperature change of the temperature monitoring point by collecting the temperature value at the temperature monitoring point of the monitored surface, which is helpful for precise temperature control.

Please refer to FIG. 2 , which is a method flowchart of the second embodiment of the method for monitoring surface multi-point temperature provided by the embodiment of the present invention. The main difference between this embodiment and the first embodiment of the method for surface multi-point temperature monitoring is that, on the basis of obtaining the temperature step response curve, a description of specific steps for obtaining a temperature density map is added.

The method of surface multi-point temperature monitoring includes:

Step S201, a plurality of temperature sensors collect temperature values corresponding to temperature monitoring points at intervals of preset sampling periods, and transmit the temperature values to the processor. The intersection point of the grid lines.

Step S202, the processor obtains the temperature density map of the monitored surface corresponding to the multiple temperature monitoring points according to the received multiple temperature values and the preset position information of the temperature monitoring points respectively corresponding to the multiple temperature values. The temperature density map is obtained by performing an interpolation algorithm on a temperature value matrix formed by multiple temperature values and multiple position information.

Step S203, the processor performs temperature step response curve fitting according to the multiple received temperature values, so as to obtain temperature step response curves of the monitored surface corresponding to multiple temperature monitoring points.

Wherein, the interpolation algorithm includes:

Interpolate 20 values into a matrix of temperature values formed by multiple temperature values and multiple location information; or,

40 values are interpolated to the temperature value matrix formed by multiple temperature values and multiple position information.

Wherein, the plurality of temperature monitoring points are located at the intersection of the orthogonal grid lines drawn by vertical and horizontal lines, including:

The nine temperature monitoring points are respectively located at intersections of orthogonal grid lines drawn by vertical and horizontal lines.

Preferably, the nine temperature monitoring points are respectively located at the intersections of the orthogonal grid lines drawn by vertical and horizontal lines, and the corresponding temperature sensors are placed in a square matrix in order, and the processor is based on the temperature value and position information corresponding to the temperature monitoring points, The temperature interpolation calculation is performed between two corresponding temperature monitoring points, and the temperature density map of the surface of the monitored object can be simulated.

To make the temperature density map meaningful, the temperature sensors must be placed in a square matrix in a preset order. The temperature density map in this embodiment is obtained based on 9 temperature values in a two-dimensional 3×3 data matrix. Then the preset sequence is: after numbering the temperature sensors respectively, set the first temperature sensor at the first temperature monitoring point, the second temperature sensor at the second temperature monitoring point, and so on until the ninth temperature sensor Set at the ninth temperature monitoring point, and then input the temperature sensor number and the temperature monitoring point position into the processor, so that the temperature sensor and the temperature monitoring point form a one-to-one corresponding positional relationship. The temperature density map itself represents the surface temperature of the monitored object, so the position order of the temperature sensor's temperature value in the temperature density map (position in the 3×3 matrix) must be consistent with the position order of the temperature sensor on the surface of the monitored object. have practical significance. In addition, the interpolation calculation is performed between the corresponding two temperature values, the more interpolation times, the smoother the surface transition of the temperature density map.

Please refer to FIG. 3 , which is a temperature density diagram for interpolating 20 numbers and a temperature density diagram for interpolating 40 numbers provided by an embodiment of the present invention.

Figure a is a temperature density map of 20 numbers interpolated, and picture b is a temperature density map of 40 numbers interpolated. It can be seen from the figure that the range of temperature change in figure b is smaller than that in figure a, and the transition is smoother. It can be seen that the more interpolation times of the interpolation algorithm, the smoother the temperature transition, and more accurately reflect the temperature change.

The corresponding command of the program to obtain the temperature density map in the Matlab environment is:

matrix=[Temp1Temp2Temp3; Temp4Temp5Temp6; Temp7Temp8Temp9]; % establish a 3×3 temperature matrix, and TempN represents the corresponding temperature value collected by each temperature sensor

[rows,cols]=size(matrix);% Calculate the number of rows and columns of the matrix

[x,y]=meshgrid(1:1:rows,1:1:cols); % establish the position of the original temperature value distribution

[xi,yi]=meshgrid(1:0.05:rows,1:0.05:cols);% interpolate to 1/0.05=20 values based on the original temperature number

zi=interp2(x,y,matrix',xi,yi,'cubic'); % interpolation

h=imagesc(zi);% draw temperature density map

colormap(gray); % Display temperature density map in grayscale.

The method for surface multi-point temperature monitoring provided by the present invention obtains the temperature step response curve and temperature density curve of the monitored surface corresponding to multiple temperature monitoring points by collecting the temperature values at the temperature monitoring points of the monitored surface. Reasonable prediction of temperature changes at monitoring points is helpful for precise temperature control.

Please refer to FIG. 4 , which is a method flowchart of the third embodiment of the method for monitoring surface multi-point temperature provided by the embodiment of the present invention. The main difference between this embodiment and the second embodiment of the method for surface multi-point temperature monitoring is that, on the basis of obtaining the temperature step response curve and the temperature density map, specific steps for obtaining the average temperature and alarm are added.

The method of surface multi-point temperature monitoring includes:

Step S301 , a plurality of temperature sensors collect temperature values corresponding to temperature monitoring points at intervals of preset sampling periods, and transmit the temperature values to a processor.

Step S302 , the processor performs temperature step response curve fitting according to the multiple received temperature values, so as to obtain temperature step response curves of the monitored surface corresponding to multiple temperature monitoring points.

Step S303, the processor obtains the average temperature of the monitored surface corresponding to the multiple temperature monitoring points according to the multiple received temperature values, and the average temperature = the sum of the received temperature values/the temperature corresponding to the received temperature values The sum of the number of monitoring points.

The corresponding command of the program to obtain the average temperature in the Matlab environment is:

Suppose the temperature of the temperature sensor is Temp, and the values of each temperature sensor are Temp1, Temp2...Temp9;

Each temperature sensor has a control switch N, N=1 when the temperature sensor is enabled, otherwise N=0, the parameters of each temperature sensor are N1, N2...N9;

Average temperature = (N1*Temp1+N2*Temp2+...+N9*Temp9)/9;

Step S304a, when any temperature value is outside the preset safe temperature range, the processor activates the alarm so as to issue an alarm message.

Step S304b, when the average temperature value is outside the preset safe average temperature range, the processor activates the alarm so as to issue an alarm message.

It should be noted that there is no sequential relationship between step S304a and step S304b. Step S304a may be implemented first and then step S304b may be implemented; One of S304a and step S304b is implemented.

Step S305, the processor saves the temperature data of the monitored surface; or,

the processor sends the temperature data of the monitored surface to the display screen for display; or,

The processor sends the temperature data of the monitored surface to the display screen for display through the GUI interface.

The processor can record the running time and save the temperature data, establish a one-to-one correspondence between the temperature data and the corresponding running time, and provide data basis for further temperature control.

Please refer to FIG. 5 , which is a temperature monitoring GUI interface displayed after applying the method for surface multi-point temperature monitoring provided by an embodiment of the present invention.

The temperature monitoring GUI interface displays the serial communication parameter adjustment part, the enabling temperature sensor selection part, the temperature sensor collecting temperature value part, the temperature change curve part, and the temperature step change curve part. The serial port communication parameter adjustment part includes communication port, baud rate, parity bit, data bit, stop bit. The enabling temperature sensor selection part includes 9 temperature sensors, and the corresponding working temperature sensor can be checked in the enabling temperature sensor selection box for accurate temperature value display and calculation. The temperature sensor collecting temperature value part includes 9 temperature values. The temperature change curve part and the temperature step change curve part are to display the temperature change curve in real time on the coordinate axis.

The multi-point surface temperature monitoring method provided by the present invention is mainly used for monitoring the monitored surface temperature of various industrial and agricultural equipment, medical instruments or circuit components, etc., and displays the monitoring results in real time. The method adopts an infrared temperature sensor, which can effectively monitor and display the temperature value and value change at the temperature monitoring point without contacting the surface of the monitored object. Combined with the temperature value and location information at the temperature monitoring point, the temperature density map of the entire monitored surface is roughly simulated. At the same time, according to the average temperature change of the surface of the monitored object, the temperature step response curve of the surface of the monitored object is fitted to understand the thermal performance of the monitored object more intuitively. In addition, this method can also save temperature data in real time to provide data basis for further temperature control, and this method can set the temperature alarm range, when the temperature value exceeds this range, the alarm will send out a reminder message.

To sum up, the method for surface multi-point temperature monitoring provided by the present invention solves how to accurately collect the multi-point temperature of the surface of the monitored object, how to display the temperature value and changes in real time, and how to use the temperature density map to obtain the temperature of the surface of the monitored object. The overall temperature situation, how to obtain the temperature step response curve of the surface of the monitored object and other technical issues.

The following is an embodiment of the system for monitoring surface multi-point temperature provided by the present invention. The embodiment of the system of surface multi-point temperature monitoring belongs to the same idea as the above-mentioned method embodiment of surface multi-point temperature monitoring. For the details not described in detail in the embodiment of the surface multi-point temperature monitoring system, you can refer to the above-mentioned surface multi-point temperature monitoring method. Example of a method for temperature monitoring.

Please refer to FIG. 6 , which is a structural block diagram of a system for monitoring surface multi-point temperature provided by an embodiment of the present invention.

The system for surface multi-point temperature monitoring includes a plurality of temperature sensors and a monitoring system, the temperature sensors are connected to the monitoring system, and the monitoring system includes a processor,

A plurality of temperature sensors are used to collect temperature values corresponding to temperature monitoring points at intervals of preset sampling periods, and transmit the temperature values to the processor;

The processor is configured to fit the temperature step response curve according to the received multiple temperature values, so as to obtain the temperature step response curve of the monitored surface corresponding to the multiple temperature monitoring points.

The surface multi-point temperature monitoring system provided by the present invention reasonably predicts the temperature change of the temperature monitoring point by collecting the temperature value at the temperature monitoring point of the monitored surface, which is helpful for precise temperature control.

Wherein, the fitting of the temperature step response curve includes the establishment of a mathematical model of a first-order inertia link with a hysteresis property;

The mathematical model is G(s)=K e^(-τs)/(Ts+1), wherein, G(s) is a temperature transfer function, K is a proportional coefficient, τ is a delay time constant, and s is Differential control operator, e^(-τs) is the part of the pure delay link, T is the inertial time constant.

Wherein, the temperature sensor is an infrared temperature sensor.

Wherein, the processor is further configured to obtain the average temperature of the monitored surface corresponding to a plurality of temperature monitoring points according to the received multiple temperature values, the average temperature=sum of the received temperature values/received The sum of the number of temperature monitoring points corresponding to the temperature value.

Please refer to FIG. 7 and FIG. 8 , which are the three-dimensional structural diagrams of the first embodiment and the second embodiment in which 25 fixing holes are provided on the bracket body plane 301 of the bracket 30 provided by the embodiment of the present invention.

Wherein, the monitoring system also includes a bracket 30, and a plurality of fixing holes for fixing the temperature sensor are arranged on the bracket 30, and the fixing holes correspond to the temperature sensors one by one, and each of the fixing holes is located at The intersection of the orthogonal grid lines drawn by vertical and horizontal lines;

A plurality of temperature sensors are respectively fixed in the fixing holes of the bracket 30 in a preset order, and are also used to collect temperature values corresponding to the temperature monitoring points at intervals of preset sampling periods, and transmit the temperature values to the processor,

The processor is further configured to obtain a temperature density map of the monitored surface corresponding to the multiple temperature monitoring points according to the received multiple temperature values and the preset position information of the temperature monitoring points respectively corresponding to the multiple temperature values, The temperature density map is obtained by performing an interpolation algorithm on a temperature value matrix formed by multiple temperature values and multiple position information.

Wherein, the bracket 30 includes a frame body plane 301 and a frame body shaft 302, the frame body plane 301 and the frame body shaft 302 are orthogonally connected, and the frame body plane 301 is provided with 25 fixing holes, and the fixing holes are Round hole.

Wherein, the bracket 30 includes a frame body plane 301 and a frame body axis 302, the frame body plane 301 and the frame body axis 302 are connected orthogonally, and the surface shape of the frame body plane 301 is a square of 30cm×30cm.

Preferably, the bracket 30 is used to place the temperature sensor, including the plane of the bracket 30 and the axis 302 of the bracket. The surface shape of the frame plane 301 is a square of 30cm×30cm. There are 5×5 circular concave holes on the frame body plane 301. When in use, the temperature sensor is fixed in the circular concave holes, and different circular concave holes can be selected according to the surface area of the monitored object to place the temperature sensor. If the surface area of the object to be monitored is large, then the temperature sensors can be placed in 9 circular concave holes at the intersection of the solid lines in the first embodiment of the frame plane 301; if the surface area of the object to be monitored is small, then the frame plane 301 can be selected The temperature sensor is placed in the circular concave hole at the intersection of the dotted lines in the second embodiment. Only when the temperature sensors are placed in a square matrix in a preset order, the temperature density map of the surface of the monitored object simulated by the processor has practical significance. If the temperature sensors are not placed in a square matrix, the surface temperature of the monitored object can also be monitored and displayed in real time, but the temperature density map at this time is no longer of reference significance.

Wherein, the monitoring system further includes a monitoring subsystem, the processor is a host computer, the host computer is electrically connected to the monitoring subsystem, and the bracket 30 is detachably connected to the monitoring subsystem.

The multi-point surface temperature monitoring system proposed by the present invention is mainly used for monitoring the temperature value of the surface of the monitored object, and displays it in real time through the LCD display screen 202 of the monitoring subsystem and the host computer. The system mainly includes two parts, the monitoring subsystem and the upper computer.

The upper computer can realize three major functions, which are to display the temperature value, average temperature and temperature change curve monitored by each temperature sensor in real time; combine the temperature value and position information at the temperature monitoring point to simulate the temperature density map of the entire monitored surface ; According to the average temperature change of the monitored surface, the temperature step response curve of the surface of the monitored object is fitted to provide data basis for further temperature control.

Based on the temperature of the temperature monitoring point monitored by the infrared temperature sensor, you can choose to enable any 1-9 infrared temperature sensors to work. The sensor calculates the average temperature value. The infrared temperature sensor can be optionally placed on the bracket 30 or placed directly on the surface of the object to be monitored. When the infrared temperature sensors are placed in a square matrix in a preset order, the temperature density map of the surface of the monitored object simulated by the host computer has practical significance. According to the average temperature change of the surface of the monitored object, the upper computer can fit the temperature step response curve of the surface of the monitored object. The upper computer can also save the temperature data and time information to provide data basis for further temperature control.

The monitoring subsystem can be used independently. At this time, the LCD display 202 of the monitoring subsystem can display the temperature values of each temperature sensor and the average temperature.

Please refer to FIG. 9 , which is a block diagram of a circuit structure of a monitoring subsystem provided by an embodiment of the present invention.

Wherein, the monitoring subsystem includes a single chip microcomputer and a plurality of temperature sensor selection switches 2011 for controlling the on-off circuit of each temperature sensor, the temperature sensor selection switch 2011 corresponds to the temperature sensor one by one, and the temperature sensor selection switch 2011 and microcontroller connection.

Wherein, the single-chip microcomputer is a PIC16 single-chip microcomputer, and the monitoring subsystem further includes an A/D expansion circuit, and the A/D expansion circuit is connected to the single-chip microcomputer.

Wherein, the single-chip microcomputer is an ARM type single-chip microcomputer or a DSP type single-chip microcomputer.

Wherein, the monitoring subsystem further includes an alarm circuit, the alarm circuit is connected to the single-chip microcomputer, the alarm circuit includes an alarm, and the alarm is a buzzer.

Wherein, the monitoring subsystem also includes a power circuit, and the power circuit is connected to the single-chip microcomputer.

Wherein, the monitoring subsystem further includes a display circuit, the display circuit is connected to a single-chip microcomputer, and the display circuit includes an LCD display screen 202 .

Wherein, the monitoring subsystem further includes a serial communication circuit, one end of the serial communication circuit is connected to the single-chip computer, and the other end of the serial communication circuit is connected to the host computer.

The monitoring subsystem includes a power supply circuit, a single chip microcomputer, an A/D expansion circuit, a serial port communication circuit, an alarm circuit, a temperature sensor selection switch 2011, and a display circuit. The power supply circuit is powered by the single-chip microcomputer. The single-chip microcomputer chooses PIC16 single-chip microcomputer, which has 8 channels of A/D conversion. This system intends to use 9 temperature sensors. The /D conversion needs to be connected with the A/D expansion circuit to expand the number of A/D sampling channels. The serial port communication circuit is used to transmit the monitored temperature value to the host computer. The alarm circuit has the functions of alarm temperature setting and buzzer reminder. If the actual monitored temperature value or average temperature exceeds the set alarm temperature, the buzzer will send out a warning message. Each temperature sensor is connected to a temperature sensor selection switch 2011, which can select whether the corresponding temperature sensor works.

Please refer to FIG. 10 and FIG. 11 , which are respectively a front perspective structural schematic diagram and a rear perspective structural schematic diagram of the box body 20 provided by the embodiment of the present invention.

Wherein, the monitoring subsystem includes a box body 20, a surface of the box body 20 is provided with a control panel 201, a plurality of temperature sensor working indicator lights 2012, an alarm temperature setting button 2013 for setting the alarm temperature, and The alarm temperature display digital tube 2014 for displaying the set alarm temperature, the alarm temperature setting button 2013 and the alarm temperature display digital tube 2014 are all connected to the single-chip microcomputer, the LCD display screen 202 and a plurality of temperature sensor selection switches 2011 is set on the control panel 201, and each temperature sensor working indicator light 2012 is electrically connected with a temperature sensor selection switch 2011. When the temperature sensor selection switch 2011 is connected to the circuit of the corresponding temperature sensor, the corresponding temperature sensor working indicator light 2012 is lit, and when the temperature sensor selection switch 2011 cuts off the circuit of the corresponding temperature sensor, the corresponding temperature sensor working indicator light 2012 is extinguished.

Wherein, the monitoring subsystem includes a box body 20, a surface of the box body 20 is provided with a power circuit interface 2015, and the power circuit interface 2015 is connected to the power circuit.

Wherein, the monitoring subsystem includes a box body 20, a serial port communication interface 2016 is arranged on a surface of the box body 20, and the serial port communication interface 2016 is connected to the serial port communication circuit.

Wherein, the other surface of the box body 20 is provided with a temperature sensor interface 2017, and each temperature sensor interface 2017 is connected to a temperature sensor through a wire.

One surface of the box body 20 is connected to an LCD display 202 and a temperature sensor selection switch 2011 , and a control panel 201 is provided below the LCD display 202 . The control panel 201 includes a temperature sensor working indicator light 2012 and an alarm temperature setting button 2013 . Another surface of the box body 20 includes a power circuit interface 2015 and a serial communication interface 2016 . Another surface of the box body 20 includes a temperature sensor interface 2017 . The temperature sensor interface 2017 is electrically connected to the single chip. The temperature sensor is connected to the temperature sensor interface 2017 on the box body 20 through wires. The temperature sensor can be fixed on the bracket 30 for easy movement and measurement, or it can be directly placed on the surface of the object to be monitored.

Wherein, the monitoring subsystem includes a box body 20, the box body 20 is a six-sided box body 20, the upper end of the six-sided box body 20 is provided with a fixing groove 2018, and the frame body shaft 302 cooperates with the fixing groove 2018 Fixed, the frame plane 301 can rotate around the frame axis 302 , and the frame axis 302 can rotate along the central axis of the fixing groove 2018 .

The bracket shaft 302 is connected and fixed with the fixing groove 2018 of the box body 20 to support the bracket 30 . At the same time, the frame plane 301 can rotate along the frame axis 302 . When monitoring the temperature of the surface of the object to be monitored, the bracket 30 can be fixed on the box body 20 or hand-held. When the bracket 30 is fixed on the box body 20, the object to be monitored can be placed on the box body 20 or near the box body 20, and the temperature sensor can be perpendicular to the top of the object to be monitored by rotating the frame body shaft 302 for temperature monitoring; The bracket 30 is held by hand, or the bracket body plane 301 is placed on the surface of the object to be monitored for multi-point temperature monitoring. The temperature sensor is placed at the fixed hole position of the bracket 30. Compared with directly placing the temperature sensor on the surface of the object to be monitored, which may cause sliding and position changes, the measurement is more convenient and the result is more accurate. Of course, the temperature sensor can also be placed directly on the surface of the object to be monitored instead of being placed on the bracket 30 .

The LCD display 202 can display the temperature values monitored by each temperature sensor and the average temperature. The nine temperature sensor selection switches 2011 can respectively select whether the corresponding temperature sensor is working. The temperature sensor indicator light indicates whether the corresponding temperature sensor is working. If the temperature sensor corresponding to the temperature sensor indicator light is in the working state, the temperature sensor indicator light is on, otherwise it is off. The alarm temperature setting button 2013 can set the alarm temperature, if the actual temperature value is higher or lower than the alarm temperature, a buzzer will be given to remind; the alarm temperature display nixie tube 2014 can display the set alarm temperature. The power interface circuit and the serial communication interface 2016 are used to connect the power line and the serial line respectively. The temperature sensor interface 2017 is connected to the temperature sensor through wires, and the fixing groove 2018 is used to fix the bracket 30 .

The multi-point surface temperature monitoring system provided by the present invention includes temperature sensors for monitoring multi-point temperatures, a monitoring subsystem for simply displaying temperature values, and a host computer for displaying temperature changes and thermal performance curves of monitored objects. . The mechanical structure of the monitoring subsystem includes a box body 20 and a bracket 30 . The bracket 30 includes a bracket plane 301 and a bracket axis 302 . A circular concave hole is provided on the frame plane 301 , and the circular concave hole is used to fix the temperature sensor. The plane of the bracket 30 can rotate along the frame axis 302 . Any temperature sensor can be optionally enabled in the monitoring subsystem. The LCD display 202 displays whether the corresponding temperature sensor is in working state. The upper computer can adjust the temperature sensor working in the upper computer according to the temperature sensor enabled in the monitoring subsystem, and is used for calculating and saving data of the average temperature of the corresponding temperature sensor. The upper computer displays the temperature value and temperature change curve of each working temperature sensor in real time. If the temperature sensors are placed in a preset order and in a square matrix, the host computer can also simulate a meaningful temperature density map on the surface of the monitored object to reflect the approximate temperature distribution on the surface of the monitored object. According to the change of the average temperature of the surface of the monitored object, the temperature step response curve of the monitored object is fitted to carry out precise temperature control and understand the thermal performance of the monitored object. The upper computer can also save the running time and the corresponding temperature value to facilitate further data analysis.

The multi-point surface temperature monitoring system provided by the present invention integrates multi-point temperature collection and monitoring. It can not only collect multi-point temperature values on the surface of the monitored object, but also display the temperature value, average temperature and change curve of each temperature monitoring point in real time. . The system is simple in structure and easy to operate. The monitoring subsystem is arranged in the box body 20 , the temperature sensor can be placed on the bracket 30 fixedly connected with the box body 20 , and electrically connected with the monitoring subsystem in the box body 20 through wires.

A method and system for multi-point temperature monitoring on a surface. By collecting temperature values at temperature monitoring points on the surface to be monitored, the temperature variation of the temperature monitoring points can be reasonably predicted, which is helpful for precise temperature control.

Those of ordinary skill in the art can understand that all or part of the steps for realizing the above-mentioned embodiments can be completed by hardware, and can also be completed by instructing related hardware through a program. The program can be stored in a computer-readable storage medium, and the storage medium can include memory, disk or CD, etc.

The above content is only a preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation and application scope. limits.

Claims (28)

1. a method for surperficial multipoint temperature monitoring, is characterized in that, comprising:

The temperature value that sampling period collection corresponds to temperature monitoring point preset by multiple temperature sensor respectively interval, and this temperature value is transferred to processor;

Processor carries out the matching of temperature jump response curve according to the multiple temperature values received, to obtain the temperature jump response curve on monitored surface corresponding to multiple temperature monitoring point.

2. the method for surperficial multipoint temperature monitoring according to claim 1, is characterized in that, the matching of described temperature jump response curve, comprises the foundation of the mathematical model of the first order inertial loop with hysteresis property;

Described mathematical model be G (s)=Ke^ (-τ s)/(Ts+1), wherein, G (s) is temperature transport function, K is scale-up factor, τ is delay time constant, s is differential Control operators, and (-τ is s) pure delay link part to e^, and T is inertia time constant.

3. the method for surperficial multipoint temperature monitoring according to claim 1, is characterized in that, described temperature sensor is infrared temperature sensor.

4. the method for surperficial multipoint temperature monitoring according to claim 1, is characterized in that, the temperature value that sampling period collection corresponds to temperature monitoring point preset by described multiple temperature sensor respectively interval, and this temperature value is transferred to processor; Comprise:

The temperature value that sampling period collection corresponds to temperature monitoring point preset by multiple temperature sensor respectively interval, and this temperature value is transferred to processor, and multiple described temperature monitoring point lays respectively at the intersection point of the orthogonal grid line drawn by co-ordination;

Processor is according to the positional information of the multiple temperature value received with the temperature monitoring point corresponding respectively with the plurality of temperature value preset, obtain the temperature-density figure on monitored surface corresponding to multiple temperature monitoring point, described temperature-density figure carries out interpolation algorithm by the temperature value matrix formed multiple temperature value and multiple positional information and obtains.

5. the method for surperficial multipoint temperature monitoring according to claim 1, is characterized in that, the temperature value that sampling period collection corresponds to temperature monitoring point preset by described multiple temperature sensor respectively interval, and after this temperature value is transferred to processor, also comprises:

Processor, according to the multiple temperature values received, obtains the medial temperature on monitored surface corresponding to multiple temperature monitoring point, the number sum of the temperature monitoring point that the temperature value of the temperature value sum of described medial temperature=receive/receive is corresponding.

6. the method for surperficial multipoint temperature monitoring according to claim 1, is characterized in that, the temperature value that sampling period collection corresponds to temperature monitoring point preset by described multiple temperature sensor respectively interval, and after this temperature value is transferred to processor, also comprises:

When any one temperature value is in outside preset security temperature range, processor starts alarm, to send warning message.

7. the method for surperficial multipoint temperature monitoring according to claim 5, is characterized in that, the temperature value that sampling period collection corresponds to temperature monitoring point preset by described multiple temperature sensor respectively interval, and after this temperature value is transferred to processor, also comprises:

When average temperature value is in outside preset security average temperature range, processor starts alarm, to send warning message.

8. the method for surperficial multipoint temperature monitoring according to claim 1, is characterized in that, described with after the temperature jump response curve obtaining monitored surface corresponding to multiple temperature monitoring point, also comprises:

The temperature data on monitored surface preserved by processor; Or,

The temperature data on monitored surface is sent to display screen to show by processor; Or,

The temperature data on monitored surface is sent to display screen to be shown by gui interface by processor.

9. a system for surperficial multipoint temperature monitoring, is characterized in that, comprises multiple temperature sensor and monitoring system, and described temperature sensor is connected with monitoring system, and described monitoring system comprises processor,

Multiple temperature sensor, presets the sampling period for interval respectively and gathers the temperature value corresponding to temperature monitoring point, and this temperature value is transferred to processor;

Processor, for carrying out the matching of temperature jump response curve according to the multiple temperature values received, to obtain the temperature jump response curve on monitored surface corresponding to multiple temperature monitoring point.

10. the system of surperficial multipoint temperature monitoring according to claim 9, is characterized in that, the matching of described temperature jump response curve, comprises the foundation of the mathematical model of the first order inertial loop with hysteresis property;

Described mathematical model be G (s)=Ke^ (-τ s)/(Ts+1), wherein, G (s) is temperature transport function, K is scale-up factor, τ is delay time constant, s is differential Control operators, and (-τ is s) pure delay link part to e^, and T is inertia time constant.

The system of 11. surperficial multipoint temperature monitorings according to claim 9, is characterized in that, described temperature sensor is infrared temperature sensor.

The system of 12. surperficial multipoint temperature monitorings according to claim 9, it is characterized in that, described monitoring system also comprises bracket, described bracket is arranged multiple fixed orifice for fixed temperature sensor, described fixed orifice and temperature sensor one_to_one corresponding, each described fixed orifice lays respectively at the intersection point of the orthogonal grid line drawn by co-ordination;

Multiple temperature sensor is fixed on the fixed orifice of bracket respectively by preset order after, also presets the sampling period for interval respectively and gather the temperature value corresponding to temperature monitoring point, and this temperature value is transferred to processor,

Processor, also for the positional information according to the multiple temperature value received and the default temperature monitoring point corresponding respectively with the plurality of temperature value, obtain the temperature-density figure on monitored surface corresponding to multiple temperature monitoring point, described temperature-density figure carries out interpolation algorithm by the temperature value matrix formed multiple temperature value and multiple positional information and obtains.

The system of 13. surperficial multipoint temperature monitorings according to claim 9, it is characterized in that, described processor, also for according to multiple temperature values of receiving, obtain the medial temperature on monitored surface corresponding to multiple temperature monitoring point, the number sum of the temperature monitoring point that the temperature value of the temperature value sum of described medial temperature=receive/receive is corresponding.

The system of 14. surperficial multipoint temperature monitorings according to claim 12, it is characterized in that, described bracket comprises support body plane and support body axle, described support body plane and the orthogonal connection of support body axle, described support body plane arranges 25 fixed orifices, and described fixed orifice is round mouth shrinkage pool.

The system of 15. surperficial multipoint temperature monitorings according to claim 12, is characterized in that, described bracket comprises support body plane and support body axle, described support body plane and the orthogonal connection of support body axle, and the surface configuration of described support body plane is the square of 30cm × 30cm.

The system of 16. surperficial multipoint temperature monitorings according to claim 12, it is characterized in that, described monitoring system also comprises monitoring subsystem, and described processor is host computer, described host computer and described monitoring subsystem are electrically connected, and described bracket and described monitoring subsystem removably connect.

The system of 17. surperficial multipoint temperature monitorings according to claim 16, it is characterized in that, described monitoring subsystem comprises the temperature sensor selector switch of single-chip microcomputer and multiple connecting and disconnecting of the circuit for controlling each temperature sensor, described temperature sensor selector switch and temperature sensor one_to_one corresponding, described temperature sensor selector switch is connected with single-chip microcomputer.

The system of 18. surperficial multipoint temperature monitorings according to claim 17, it is characterized in that, described single-chip microcomputer is the single-chip microcomputer of PIC16 type, and described monitoring subsystem also comprises A/D expanded circuit, described A/D expanded circuit is connected with single-chip microcomputer.

The system of 19. surperficial multipoint temperature monitorings according to claim 17, is characterized in that, described single-chip microcomputer is the single-chip microcomputer of ARM type or the single-chip microcomputer of DSP type.

The system of 20. surperficial multipoint temperature monitorings according to claim 17, it is characterized in that, described monitoring subsystem also comprises warning circuit, and described warning circuit is connected with single-chip microcomputer, and described warning circuit comprises alarm, and described alarm is hummer.

The system of 21. surperficial multipoint temperature monitorings according to claim 17, it is characterized in that, described monitoring subsystem also comprises power circuit, and described power circuit is connected with single-chip microcomputer.

The system of 22. surperficial multipoint temperature monitorings according to claim 17, it is characterized in that, described monitoring subsystem also comprises display circuit, and described display circuit is connected with single-chip microcomputer, and described display circuit comprises LCD display.

The system of 23. surperficial multipoint temperature monitorings according to claim 17, it is characterized in that, described monitoring subsystem also comprises serial communication circuit, and one end of described serial communication circuit is connected with single-chip microcomputer, and the other end of serial communication circuit is connected with host computer.

The system of 24. surperficial multipoint temperature monitorings according to claim 22, it is characterized in that, described monitoring subsystem comprises a casing, one surface of described casing arranges control panel, multiple temperature sensor relay indicating light, for setting the alarm temperature setting button of alarm temperature and the alarm temperature display charactron for the alarm temperature of display setting, described alarm temperature setting button is all connected with single-chip microcomputer with alarm temperature display charactron, described LCD display and multiple described temperature sensor selector switch are arranged at control panel, each temperature sensor relay indicating light all with one temperature sensor selector switch is electrically connected, when temperature sensor selector switch connects the circuit of corresponding temperature sensor, then corresponding temperature sensor relay indicating light is lighted, when temperature sensor selector switch cuts off the circuit of corresponding temperature sensor, then corresponding temperature sensor relay indicating light extinguishes.

The system of 25. surperficial multipoint temperature monitorings according to claim 21, it is characterized in that, described monitoring subsystem comprises a casing, and a surface of described casing arranges power circuit interface, and described power circuit interface is connected with described power circuit.

The system of 26. surperficial multipoint temperature monitorings according to claim 23, it is characterized in that, described monitoring subsystem comprises a casing, and a surface of described casing arranges serial communication interface, and described serial communication interface is connected with described serial communication circuit.

The system of 27. surperficial multipoint temperature monitorings according to claim 24 to 26 any one, it is characterized in that, another surperficial set temperature sensor interface of described casing, each temperature sensor interface is connected with a temperature sensor by wire.

The system of 28. surperficial multipoint temperature monitorings according to claim 14, it is characterized in that, described monitoring subsystem comprises a casing, described casing is six casings, the upper end of described six casings arranges pickup groove, described support body axle and pickup groove coordinate fixing, and support body plane can rotate by frame body axle, and described support body axle can rotate along the central shaft of pickup groove.