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CN105388160A - Inspecting method and inspecting unit of substrate - Google Patents

Inspecting method and inspecting unit of substrate Download PDF

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Publication number
CN105388160A
CN105388160A CN201510667059.0A CN201510667059A CN105388160A CN 105388160 A CN105388160 A CN 105388160A CN 201510667059 A CN201510667059 A CN 201510667059A CN 105388160 A CN105388160 A CN 105388160A
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China
Prior art keywords
distance
film forming
substrate
edge
inspection unit
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Pending
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CN201510667059.0A
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Chinese (zh)
Inventor
李淳钟
禹奉周
朴炳澯
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Semisysco Co Ltd
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Semisysco Co Ltd
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Publication of CN105388160A publication Critical patent/CN105388160A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/14Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306Details
    • G02F1/1309Repairing; Testing
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1339Gaskets; Spacers; Sealing of cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mathematical Physics (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Electroluminescent Light Sources (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

The present invention discloses an inspecting method and an inspecting unit of substrate. The invention is composed of a device for inspecting whether the vertical and horizontal distances of film formation coated on the substrate surface and the edge portions are constant. Accordingly, the device can effectively check out undesirable distortion on the surface of the substrate which is difficult to identify by naked eye, while can prevent display defects caused by film formation distortion in the state of completion of the manufacture of LCD or OLED products in a processing chamber.

Description

Substrate inspecting method and inspection unit
The application is the applying date is on 01 13rd, 2012, and application number is CN201210013362.5, and denomination of invention is the divisional application of the patented claim of " substrate becomes film detection apparatus ".
Technical field
The present invention relates to and check film forming (such as, polyimide) whether bad technology, this film forming is coated and is used in Organic Light Emitting Diode (OrganicLightEmittingDiode, OLED) or on the surface of the substrate of liquid crystal display (hereinafter referred to as " substrate "), crooked bad substrate inspecting method and the inspection unit that can check the film forming coating substrate surface by measuring the distance coated between the film forming of substrate surface and substrate edge part is particularly related to.
Background technology
Thin-film transistor LCD device is substantially made up of the lower basal plate for the formation of thin film transistor (TFT) and the upper substrate for the formation of color filter and the liquid crystal flow between lower basal plate and upper substrate, and the technique manufacturing described liquid crystal indicator can be divided into these three parts of thin film transistor (TFT) (TFT) operation, unit (cell) operation, module operation.
Described TFT and semiconductor fabrication sequence closely similar, be a kind of by repeatedly carrying out evaporation operation (deposition) and photo-mask process (photolithography) and etching work procedure and thin film transistor (TFT) being aligned to operation substrate carrying out manufacture.
In described cell processes, at TFT lower plate and the upper plate formation alignment film being formed with color filter (Colorfilter), and orientation for make liquid crystal on alignment film preferably arrangement after, scatter sept (Spacer), and fitted by sealing (seal) printing.Utilize capillarity after laminating by Liquid crystal pour to inner, then seal inlet, complete the manufacturing process for liquid crystal indicator thus.
Described module process is the step determining the product quality finally passing to user, Polarizer pasted by completed panel and after mounting drive integrated circult (Driver-IC), assembling printed circuit board (PCB) (PrintedCircuitBoard), thus final assembling back light unit and structural member, complete Liquid Crystal Module thus.
In addition, OLED is by obtaining the unit evaporation organic substance between upper plate and lower glass sheet, this OLED has and can be driven at lower voltages and can manufacture thinner slim advantage, and there is wider visual angle and response speed faster, even if therefore watch in side, image quality also can not change, and picture also can not remain image retention, and this point is different from general LCD.
Further, in small-sized picture, owing to having the image quality and simple manufacturing process that exceed LCD, therefore there is remunerative price competitive power.
This OLED is for colored display mode, there is three looks (red, green, blue) independent pixel mode, color conversion mode (CCM) and colour filter mode, and be divided into low molecule OLED and macromolecule OLED according to the luminescent material for display, be divided into type hand type of drive (passivematrix) and active type of drive (activematrix) according to type of drive.
Further, OLED compares LCD, PDP, and not only structurally more simple, thickness is thinner, but also has the characteristic that can bend, and therefore makes the prospect in the market of flexible display brighter.
Now, in the technique of substrate manufacturing described LCD or OLED, for multiple film forming that coating is formed at described substrate surface, fitly should arrange according to its coating, if its arrangement occurs bad, then there is the problem that the display of substrate is bad.
Namely; on a surface of a substrate during coating film forming; level between film forming and the marginal portion of substrate and vertical range should be constant; when but coating forms film forming on a surface of a substrate; often can occur the level of be coated with described film forming and substrate edge part and vertical range crooked and and inconstant situation, and checked that the crooked device of this film forming did not exist in the past.
Summary of the invention
The present invention proposes to solve the problem, its object is to provide a kind of and coat the whether constant substrate inspecting method of the film forming of substrate surface and the level of substrate edge part and vertical range and inspection unit by producing inspection, effectively check and coat the crooked bad of the film forming of substrate surface, and can prevent under the state of the manufacture completing LCD or OLED product through process chamber by this inspection, the substrate inspecting method that the display caused because becoming film location uneven is bad and inspection unit.
To achieve these goals, inspection unit according to an aspect of the present invention comprises: first component, and it detects the distance between the edge of described substrate and described film forming from the image information of the substrate being formed with film forming; Second component, whether it is the distance in normal range by the described distance that compares the described distance that detects and reference value and judge to detect; And the 3rd parts, its result in described judgement is be defined as described substrate when not being distance in described normal range to occur abnormal.
And, described first component detects the distance between the longitudinal part edge of distance between the transverse part edge of described substrate and described film forming and described substrate and described film forming, is defined as described substrate and occurs bad when described 3rd parts at least one distance in described distance is not the distance in corresponding normal range.
Further, the distance between the edge of described substrate and described film forming is by calculating the datum length of the pixel count between the edge of described substrate and described film forming and every pixel.
Inspection unit according to a further aspect of the invention comprises: according to the image information of substrate being formed with film forming, carries out calculating the parts of the distance between edge and described film forming detecting described substrate to the datum length of the pixel count between the edge of described substrate and described film forming and every pixel; And, be defined as described substrate when the described distance detected is not the distance in normal range and bad parts occur.
Inspection unit according to another aspect of the invention comprises: first component, and it detects the distance in distance described multilayer film forming between the first film forming and the edge of described substrate and described multilayer film forming between the second film forming and the edge of described substrate from the image information of the substrate being formed with multilayer film forming; And second component, is defined as described substrate when its at least one distance in the described distance detected is not the distance in normal range and occurs bad.
Further, described first component, when the size of described first film forming is less than the size of described second film forming, detects the distance between described second film forming and described edge after first detecting the distance between described first film forming and described edge.
Inspection unit according to another aspect of the invention comprises: first component, and it detects the distance between the edge of described substrate and described film forming from the image information of the substrate being formed with film forming; And second component, with reference value, it judges whether described substrate is normally coated with described film forming by comparing the described distance detected.
Inspection unit according to another aspect of the invention comprises: first component, and it detects the distance between the edge of described substrate and described film forming from the image information of the object being formed with film forming; And second component, with reference value, it judges whether described object is normally coated with described film forming by comparing the described distance detected.
Substrate inspecting method according to an aspect of the present invention comprises: the step detecting the distance between the edge of described substrate and described film forming from the image information of the substrate being formed with film forming; By comparing the step whether described distance that the described distance that detects and reference value judge to detect is the distance in normal range; And the result of described judgement is be defined as described substrate when not being distance in described normal range bad step occurs.
As mentioned above, the present invention is configured for checking and coats the whether constant substrate inspecting method of the film forming of substrate surface and the level of substrate edge part and vertical range and inspection unit, following effect can be expected by this substrate inspecting method and inspection unit, namely effectively check out be difficult to the naked eye to identify coat the crooked bad of the film forming of substrate surface, prevent under the state of the manufacture completing LCD or OLED product through process chamber, the display caused because film forming is crooked is bad simultaneously.
Accompanying drawing explanation
Fig. 1 is the side view that the substrate illustrating as embodiments of the invention becomes the structure of film detection apparatus;
Fig. 2 is the vertical view that the substrate illustrating as embodiments of the invention becomes the structure of film detection apparatus;
Fig. 3 illustrates the skeleton diagram being formed with the image information of the substrate of film forming produced by camera model as embodiments of the invention;
Fig. 4 is the enlarged drawing of the Fig. 3 as embodiments of the invention, is the enlarged drawing of the marginal portion of the substrate being coated with individual layer film forming;
Fig. 5 is the block scheme that the substrate illustrating as embodiments of the invention becomes the outline of film detection apparatus;
Fig. 6 is the enlarged drawing being coated with the marginal portion of the substrate of multilayer film forming as another embodiment of the present invention.
Symbol description:
10: inspecting stand 20: lighting module
30: camera model 40: inspection unit
100: substrate 101,101a, 101b: film forming
Embodiment
Hereinafter, with reference to the accompanying drawings of embodiments of the invention.
Fig. 1 is the side view that the substrate illustrating as embodiments of the invention becomes the structure of film detection apparatus, Fig. 2 is the vertical view that the substrate illustrating as embodiments of the invention becomes the structure of film detection apparatus, Fig. 3 illustrates the skeleton diagram being formed with the image information of the substrate of film forming produced by camera model as embodiments of the invention, Fig. 4 is the enlarged drawing of the Fig. 3 as embodiments of the invention, be the enlarged drawing of the marginal portion of the substrate being coated with individual layer film forming, Fig. 5 is the block scheme that the substrate illustrating as embodiments of the invention becomes the outline of film detection apparatus.
Referring to figs. 1 through Fig. 5, the substrate that embodiments of the invention provide becomes film detection apparatus to be arranged at inspecting stand 10 for dropping into described substrate 100, when described substrate 100 forming pattern the multiple film forming 101 comprising Kapton to be applied on the surface of substrate 100, check that whether described film forming 101 is crooked, thisly the present invention includes lighting module 20, camera model 30 and inspection unit 40.
Described lighting module 20 is any one in xenon lamp, Halogen lamp LED, high-frequency florescent lamp, light emitting diode illuminator, its Width intersected vertically along the incidence (length direction) with substrate 100 in the lower end of described inspecting stand 10 is arranged, and be configured to when the substrate being coated with film forming 101 is through described inspecting stand 10, to the surperficial radiation source of described substrate 100 from needless to say, also to transverse part edge H and the longitudinal part edge V radiation source of described substrate 100.
Described camera model 30 is arranged in the upper end of described inspecting stand 10, consist of the surface of the substrate 100 through described inspecting stand 10 from needless to say, after the transverse part edge H of the substrate 100 through described inspecting stand 10 and longitudinal part edge V is taken in line scanning mode, this is supplied to described inspection unit 40.
Namely, described camera model 30 is configured to according to exposing to the light source on the surface of substrate 100 from described lighting module 20 certainly needless to say, according to exposing to the transverse part edge H of substrate 100 and the light source of longitudinal part edge V from described lighting module 20, to the surface of the base stage 100 of movement from needless to say, the transverse part edge H of the substrate 100 of movement and longitudinal part edge V is taken in line scanning mode.
Described inspection unit 40 is equipped with and controls the control program of the action of described lighting module 20 and camera model 30 certainly needless to say for ON/OFF, whether the film forming 101 be also equipped with for being applied to the surface of substrate 100 from the image information inspection of being taken by described camera model 30 belongs to the distance in normal range respectively with the transverse part edge H of substrate 100 and distance d1, the d2 of longitudinal part edge V, or whether due to crooked and maintain the scrutiny program of improper distance.
Namely, described inspection unit 40 from the image information of being taken by camera model 30 calculate respectively the distance d1 that coats the film forming 101 on substrate 100 surface and the transverse part edge H of substrate 100 and with the distance d2 of longitudinal part edge V after, its calculated value and the normal range reference value stored are compared computing, checks whether crooked bad thus.
Now, the distance d1 coating the film forming 101 on the surface of 100 of described substrate and the transverse part edge H of substrate 100, by being multiplied by the datum length (such as 46 μm) of every pixel to the pixel (Pixel) between the film forming 101 measured from image information and transverse part edge H is several and calculates, coats the film forming 101 on the surface of 100 of described substrate and the distance d2 of longitudinal part edge V calculates by being multiplied by the datum length (such as 46 μm) of every pixel to the pixel count between the film forming 101 measured from image information and longitudinal part edge V.
As shown in Figures 1 to 5, the substrate provided at embodiments of the invention as constructed as above becomes in film detection apparatus, first when input surface in present dynasty's inspecting stand 10 side is coated with the substrate 100 of film forming 101, the action of inspection unit 40 to the lighting module 20 being arranged at inspecting stand 10 carries out control from needless to say, also controls the action of the camera model 30 being arranged at inspecting stand 10.
That is, the action of camera model 30 of described inspection unit 40 to the upper end being fixedly installed on described inspecting stand 10 carries out control from needless to say, also controls the action of fixed and arranged in the lighting module 20 of the strip of the lower end of described inspecting stand 10.Described lighting module 20 is to substrate 100 radiation source through inspecting stand 10, and the camera model 30 being arranged in the upside of described inspecting stand 10 is taken after the transverse part edge H and longitudinal part edge V of the substrate 100 of described inspecting stand 10, be sent to inspection unit 40.
After this, described inspection unit 40 drives scrutiny program, detects that whether the film forming 101 on the surface coating substrate 100 is crooked thus from the image information of being taken by described camera model 30.
Namely, described inspection unit 40 has stored the information of the normal range reference value for distance d1 and the normal range reference value for distance d2 (at this, described normal range reference value is set arbitrarily separately by each manufacturer, its reference value is likely different), described distance d1 is the film forming 101 on the surface coating substrate 100 and the distance of the transverse part edge H of substrate 100, and described distance d2 is the film forming 101 on the surface coating described substrate 100 and the distance of the longitudinal part edge V of substrate 100.
While described inspection unit 40 is calculated by the datum length (such as 46 μm) of the every pixel of pixel count computing (multiplication) between the film forming 101 that measures the image information provided from being taken by described camera model 30 and transverse part edge H and coats the film forming 101 on described substrate 100 surface and the distance d1 of the transverse part edge H of substrate 100, calculate by the datum length (such as 46 μm) of the every pixel of pixel count computing (multiplication) between the film forming 101 that measures the image information provided from being taken by described camera model 30 and longitudinal part edge V the film forming 101 and the distance d2 of the longitudinal part edge V of substrate 100 of coating described substrate 100 surface.
Then, the calculated film forming 101 coating surface compares with the transverse part edge H of substrate 100 and distance d1, the d2 of longitudinal part edge V and the normal range reference value stored by described inspection unit 40, the film forming 101 judging to coat described substrate 100 surface be thus formed under crooked state be coated with or normally applied.
As an example, because in the image information of being taken by described camera model 30, pixel has the length of 46 μm, therefore when being assumed to be in the image information of being taken by described camera model 30, when distance d1 between the transverse part edge H of substrate 100 and film forming 101 is 252 pixels, distance d1 between the described transverse part edge H calculated and film forming 101 is 252 pixel × 46 micron=11.592mm, then confirms whether the described distance d1 (d1=11.592mm) calculated belongs within the scope of the normal range reference value that stored in described inspection unit 40.
And then, because in the image information of being taken by described camera model 30, pixel has the length of 46 μm, therefore when being assumed to be in the image information of being taken by described camera model 30, when distance d2 between the longitudinal part edge V of substrate 100 and film forming 101 is 147 pixels, the distance d2 calculated between described longitudinal part edge V and film forming 101 is 147 pixel × 46 micron=6.762mm, then confirms whether the described distance d2 (d1=6.762mm) calculated belongs within the scope of the normal range reference value that stored in described inspection unit 40.
Accordingly, when described inspection unit 40 is judged as that calculated distance d1, d2 are identical with the reference value in normal range or close from described comparative result, be judged to be that the applied one-tenth of film forming 101 on the surface coating described substrate 100 is without crooked and normal.
In addition, although in the embodiment of described Fig. 1 to Fig. 5 to film forming 101 with the surface of single coating in substrate 100, and check that the crooked bad situation of this individual layer film forming 101 is illustrated, but as shown in other Fig. 6, described inspection unit 40 can also film forming 101,101a, 101b with multi-layer coated in described substrate 100 surperficial time check out this multilayer film forming 101,101a, 101b crooked bad.
Namely, as shown in Figure 6, when substrate 100 being coated with multilayer film forming 101,101a, 101b, described inspection unit 40 is according to first from from the transverse part edge H of substrate 100 and longitudinal part edge V film forming 101b farthest, namely coat the minimum film forming 101b of the size of the film forming on described substrate 100 surface start to the order (101b → 101a → 101) of maximum film forming 101 calculate distance (d1 "; d2 ") (d1 ', d2 ') (d1, d2), this computing method are identical with the embodiment of aforesaid Fig. 1 to Fig. 5 respectively.
Above, although accompanying drawings substrate of the present invention becomes the technological thought of film detection apparatus, this only illustrates the embodiment of the best of the present invention, the present invention is not limited thereto.
Accordingly, the present invention is not limited to the preferred embodiment with above-mentioned feature, should know for the technician with usual knowledge of technical field of the present invention, when not departing from the purport of the present invention that claims are asked, anyone can carry out various distortion, and such change all belongs to the scope that claims are asked.

Claims (9)

1. an inspection unit, is characterized in that, comprising:
First component, it detects the distance between the edge of described substrate and described film forming from the image information of the substrate being formed with film forming;
Second component, whether it is the distance in normal range by the described distance that compares the described distance that detects and reference value and judge to detect; And
3rd parts, its result in described judgement is be defined as described substrate when not being distance in described normal range to occur abnormal.
2. inspection unit according to claim 1, is characterized in that:
Described first component detects the distance between the longitudinal part edge of distance between the transverse part edge of described substrate and described film forming and described substrate and described film forming, is defined as described substrate and occurs bad when described 3rd parts at least one distance in described distance is not the distance in corresponding normal range.
3. inspection unit according to claim 1, is characterized in that:
Distance between the edge of described substrate and described film forming is by calculating the datum length of the pixel count between the edge of described substrate and described film forming and every pixel.
4. an inspection unit, is characterized in that, comprising:
According to the image information of substrate being formed with film forming, carry out calculating the parts of the distance between edge and described film forming detecting described substrate to the datum length of the pixel count between the edge of described substrate and described film forming and every pixel; And
The described distance detected is defined as described substrate when not being the distance in normal range and bad parts occurs.
5. an inspection unit, is characterized in that, comprising:
First component, it detects the distance in distance described multilayer film forming between the first film forming and the edge of described substrate and described multilayer film forming between the second film forming and the edge of described substrate from the image information of the substrate being formed with multilayer film forming; And
Second component, is defined as described substrate when its at least one distance in the described distance detected is not the distance in normal range and occurs bad.
6. inspection unit according to claim 5, is characterized in that:
Described first component, when the size of described first film forming is less than the size of described second film forming, detects the distance between described second film forming and described edge after first detecting the distance between described first film forming and described edge.
7. an inspection unit, is characterized in that, comprising:
First component, it detects the distance between the edge of described substrate and described film forming from the image information of the substrate being formed with film forming; And
Second component, with reference value, it judges whether described substrate is normally coated with described film forming by comparing the described distance detected.
8. an inspection unit, is characterized in that, comprising:
First component, it detects the distance between the edge of described substrate and described film forming from the image information of the object being formed with film forming; And
Second component, with reference value, it judges whether described object is normally coated with described film forming by comparing the described distance detected.
9. a substrate inspecting method, is characterized in that, comprising:
The step of the distance between the edge of described substrate and described film forming is detected from the image information of the substrate being formed with film forming;
By comparing the step whether described distance that the described distance that detects and reference value judge to detect is the distance in normal range; And
The result of described judgement is be defined as described substrate when not being distance in described normal range bad step occurs.
CN201510667059.0A 2011-12-02 2012-01-13 Inspecting method and inspecting unit of substrate Pending CN105388160A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020110128434A KR101231184B1 (en) 2011-12-02 2011-12-02 Permeable membrane inspecting device of glass
KR10-2011-0128434 2011-12-02
CN2012100133625A CN103134806A (en) 2011-12-02 2012-01-13 Inspecting device of substrate membrane-forming

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2012100133625A Division CN103134806A (en) 2011-12-02 2012-01-13 Inspecting device of substrate membrane-forming

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Publication Number Publication Date
CN105388160A true CN105388160A (en) 2016-03-09

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CN201510667059.0A Pending CN105388160A (en) 2011-12-02 2012-01-13 Inspecting method and inspecting unit of substrate
CN2012100133625A Pending CN103134806A (en) 2011-12-02 2012-01-13 Inspecting device of substrate membrane-forming
CN201610515785.5A Withdrawn CN106226312A (en) 2011-12-02 2012-01-13 Substrate becomes film detection apparatus

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CN2012100133625A Pending CN103134806A (en) 2011-12-02 2012-01-13 Inspecting device of substrate membrane-forming
CN201610515785.5A Withdrawn CN106226312A (en) 2011-12-02 2012-01-13 Substrate becomes film detection apparatus

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CN107727654B (en) * 2017-09-29 2019-12-24 绵阳京东方光电科技有限公司 Film detection method, device and system
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