CN105371324A - Manufacturing method for externally-arranged semiconductor refrigerating module of smoke exhauster - Google Patents
Manufacturing method for externally-arranged semiconductor refrigerating module of smoke exhauster Download PDFInfo
- Publication number
- CN105371324A CN105371324A CN201410433827.1A CN201410433827A CN105371324A CN 105371324 A CN105371324 A CN 105371324A CN 201410433827 A CN201410433827 A CN 201410433827A CN 105371324 A CN105371324 A CN 105371324A
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- China
- Prior art keywords
- heat
- smoke exhaust
- exhaust ventilator
- semiconductor refrigerating
- exchange system
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a manufacturing method for an externally-arranged semiconductor refrigerating module of a smoke exhauster. The manufacturing method includes the following steps that firstly, a first heat exchange system, a semiconductor chilling plate and a second heat exchange system are assembled together; secondly, the product in the first step is arranged in a module shell with a first hollow cavity and a second hollow cavity, wherein the first hollow cavity and the second hollow cavity are communicated, the first heat exchange system is located in the first hollow cavity, and the second heat exchange system is located in the second hollow cavity; and thirdly, a first cross-flow fan and a second cross-flow fan are arranged in the first hollow cavity and the second hollow cavity of the module shell respectively. According to the manufacturing method for the externally-arranged semiconductor refrigerating module of the smoke exhauster, processing and manufacturing are simple, and cost is low.
Description
Technical field
The present invention relates to a kind of processing method of refrigeration module, refer in particular to the smoke exhaust ventilator external semiconductor refrigerating block preparation method that a kind of tool send cool breeze function.
Background technology
Be an arduous housework in the culinary art of cooking of kitchen focus edge of table, particularly in summer, originally hot weather adds the heat that kitchen range send, and makes working environment in kitchen very harsh.
In order to solve the too high problem of kitchen temperature, have people provided with fan or air-conditioning in kitchen, but fan blowing refrigeration is general, and gas-cooker can be affected normally works, also there is potential safety hazard.Due to the oil smoke surroundings that kitchen is special, after general fan uses a period of time, fan adheres to a large amount of putties, is difficult to cleaning, also can causes the pollution of kitchen environment.
Install an air-conditioner equipment in kitchen, there is Cost Problems on the one hand, also can there is the problem being difficult to clean on the other hand, after air-condition heat exchanger surface attachment oil smoke, also there is the problem that refrigeration declines.
Summary of the invention
The object of the present invention is to provide a kind of smoke exhaust ventilator external semiconductor refrigerating block preparation method, its processing and fabricating is simple, and cost is low.
To achieve these goals, the invention provides a kind of smoke exhaust ventilator external semiconductor refrigerating block preparation method, it comprises the steps:
(1) the first heat-exchange system, semiconductor chilling plate and the second heat-exchange system are assembled into together;
(2) the first heat-exchange system is placed in has in the module housing of cavity;
(3) in the cavity of module housing, cross flow fan is loaded.
In described step (1), the preparation method of the first heat-exchange system comprises: first adopt pressing equipment to be pressed in the groove held successfully in the first conductive substrate at the suspension end of the lower tubular section of multiple first heat pipe, afterwards at multiple first heat pipe epimere socket fin.
First conductive substrate has the first heat pipe and thermal conductive silicon glue-line or silicone grease layer are coated in the surface contacted with semiconductor chilling plate, make semiconductor chilling plate and the first conductive substrate have the one side of the first heat pipe to be closely connected.
In described step (1), the preparation method of the second heat-exchange system comprises: first adopt pressing equipment to be pressed in the groove held successfully in the second conductive substrate at the suspension end of the upper tubular section of multiple second heat pipe, holds in the groove adopting pressing equipment press-in heat sink to hold successfully afterwards in the lower tubular section suspension of multiple second heat pipe.
Second conductive substrate has the second heat pipe and thermal conductive silicon glue-line or silicone grease layer are coated in the surface contacted with semiconductor chilling plate, make semiconductor chilling plate and the second conductive substrate have the one side of the second heat pipe to be closely connected.
Described fin adopts the gluing or welding manner of heat conduction to be socketed on the first heat pipe.
In described step (1), semiconductor chilling plate, the first conductive substrate, the second conductive substrate are nested with close-fitting first insulation material of size, in step (2), module housing outer surface is nested with close-fitting second insulation material of size, the heat in order to isolated semiconductor hot junction and cold junction is disturbed simultaneously.
Be bolted fixing in described step (1) between first heat-exchange system, semiconductor chilling plate and the second heat-exchange system.
Process opening on the described module housing in step (2), opening is installed the screen pack filtering oil smoke.
Heat exchange air inlet and heat exchange air outlet is processed on the described module housing in step (2).
After adopting such scheme, smoke exhaust ventilator external semiconductor refrigerating block preparation method of the present invention can obtain smoke exhaust ventilator external semiconductor refrigerating module by above-mentioned preparation process, its processing and making process is simple, and the refrigeration module structure prepared is simple, and preparation cost is low.
Accompanying drawing explanation
Fig. 1 is embodiment one stereogram of the smoke exhaust ventilator semiconductor refrigerating module (not adding the second insulation material) that the present invention prepares;
Fig. 2 is the embodiment one internal structure front view of the smoke exhaust ventilator semiconductor refrigerating module that the present invention prepares;
Fig. 3 is the embodiment one internal structure right view of the smoke exhaust ventilator semiconductor refrigerating module that the present invention prepares;
Fig. 4 is embodiment two stereogram of the smoke exhaust ventilator semiconductor refrigerating module (not adding the second insulation material) that the present invention prepares.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the invention will be further described, can better understand the present invention and can be implemented, but illustrated embodiment is not as a limitation of the invention to make those skilled in the art.
Shown in composition graphs 1 to Fig. 3, smoke exhaust ventilator external semiconductor refrigerating block preparation method of the present invention, it comprises the steps:
(1) the first heat-exchange system 1, semiconductor chilling plate 2 and the second heat-exchange system 3 are first assembled into together;
Wherein the preparation method of the first heat-exchange system 1 comprises: first adopt pressing equipment to be pressed in the groove held successfully in the first conductive substrate 5 at the suspension end of the lower tubular section of multiple U-shaped first heat pipe 4 in inversion 90 degree, or welding manner gluing in the upper tubular section employing heat conduction of multiple first heat pipe 4 is socketed the first fin 6 afterwards, the preparation method of the second heat-exchange system 3 comprises: first adopt pressing equipment to be pressed in the groove held successfully in the second conductive substrate 8 at the suspension end of the upper tubular section of multiple U-shaped second heat pipe 7 in inversion 90 degree, afterwards the suspension end of the lower tubular section of multiple second heat pipe 7 is adopted in the groove that pressing equipment press-in heat sink 9 has been held successfully, after the first heat-exchange system 1 and the second heat-exchange system 2 prepare, at semiconductor chilling plate 2, first conductive substrate 5, second conductive substrate 8 is nested with close-fitting first insulation material 10 of size, heat in order to isolated semiconductor hot junction and cold junction is disturbed, and by the first heat-exchange system 1, the assembling process of semiconductor chilling plate 2 and the second heat-exchange system 3 is: first the first conductive substrate 5 will have the first heat pipe 4 and the first thermal conductive silicon glue-line 11 is coated on the surface contacted with semiconductor chilling plate 2, also silicone grease layer can be coated with herein, semiconductor chilling plate 2 and the first conductive substrate 5 is made to have the one side of the first heat pipe 4 to be closely connected, the second heat pipe 7 is had afterwards and the second thermal conductive silicon glue-line 12 is coated on the surface contacted with semiconductor chilling plate 2 on the second conductive substrate 8, also silicone grease layer can be coated with herein, semiconductor chilling plate 2 and the second conductive substrate 8 is made to have the one side of the second heat pipe 7 to be closely connected, finally by bolt by the first conductive substrate 5, semiconductor chilling plate 2, link together between second conductive substrate 8 and the first insulation material 10,
(2) the first heat-exchange system 1 is placed in has in the module housing 14 of cavity 13, close-fitting second insulation material 15 of size is nested with afterwards at the outer surface of module housing 14, heat in order to isolated semiconductor hot junction and cold junction is disturbed, this module housing 14 upper surface is processed with opening, opening is provided with the screen pack (not shown) of filtering oil smoke, the upper wall rear portion of this module housing 14 is processed with heat exchange air inlet 16, antetheca top is processed with heat exchange air outlet 17, and the installation of the second insulation material 15 can not shelter from heat exchange air inlet 16 and heat exchange air outlet 17,
(3) in the cavity 13 of module housing 14, load cross flow fan 18, this cross flow fan 18 is positioned at the rear end of the first heat-exchange system 1 and is positioned at the below of heat exchange air inlet 16.
As shown in Figure 4, for embodiment two stereogram of the smoke exhaust ventilator external semiconductor refrigerating module that the present invention prepares, its preparation method is substantially identical with the preparation method of embodiment one, and difference is: the suspension end vertical welding of the lower tubular section of multiple second heat pipe 7 is on the vertical heat sink 9 ' to placing.
The present invention can obtain smoke exhaust ventilator external semiconductor refrigerating module by above-mentioned preparation process, and its processing and making process is simple, and the refrigeration module structure prepared is simple, and preparation cost is low.
The above embodiment is only that protection scope of the present invention is not limited thereto in order to absolutely prove the preferred embodiment that the present invention lifts.The equivalent alternative or conversion that those skilled in the art do on basis of the present invention, all within protection scope of the present invention.Protection scope of the present invention is as the criterion with claims.
Claims (10)
1. a smoke exhaust ventilator external semiconductor refrigerating block preparation method, it comprises the steps:
(1) the first heat-exchange system, semiconductor chilling plate and the second heat-exchange system are assembled into together;
(2) the first heat-exchange system is placed in has in the module housing of cavity;
(3) in the cavity of module housing, cross flow fan is loaded.
2. smoke exhaust ventilator external semiconductor refrigerating block preparation method according to claim 1, it is characterized in that: in described step (1), the preparation method of the first heat-exchange system comprises: first adopt pressing equipment to be pressed in the groove held successfully in the first conductive substrate at the suspension end of the lower tubular section of multiple first heat pipe, afterwards at multiple first heat pipe epimere socket fin.
3. smoke exhaust ventilator external semiconductor refrigerating block preparation method according to claim 2, it is characterized in that: on the first conductive substrate, have the first heat pipe and thermal conductive silicon glue-line or silicone grease layer are coated in the surface contacted with semiconductor chilling plate, make semiconductor chilling plate and the first conductive substrate have the one side of the first heat pipe to be closely connected.
4. smoke exhaust ventilator external semiconductor refrigerating block preparation method according to claim 3, it is characterized in that: in described step (1), the preparation method of the second heat-exchange system comprises: first adopt pressing equipment to be pressed in the groove held successfully in the second conductive substrate at the suspension end of the upper tubular section of multiple second heat pipe, hold in the lower tubular section suspension of multiple second heat pipe in the groove adopting pressing equipment press-in heat sink to hold successfully afterwards.
5. smoke exhaust ventilator external semiconductor refrigerating block preparation method according to claim 4, it is characterized in that: on the second conductive substrate, have the second heat pipe and thermal conductive silicon glue-line or silicone grease layer are coated in the surface contacted with semiconductor chilling plate, make semiconductor chilling plate and the second conductive substrate have the one side of the second heat pipe to be closely connected.
6. smoke exhaust ventilator external semiconductor refrigerating block preparation method according to claim 2, is characterized in that: described fin adopts the gluing or welding manner of heat conduction to be socketed on the first heat pipe.
7. smoke exhaust ventilator external semiconductor refrigerating block preparation method according to claim 6, it is characterized in that: in described step (1), semiconductor chilling plate, the first conductive substrate, the second conductive substrate are nested with close-fitting first insulation material of size, in step (2), module housing outer surface is nested with close-fitting second insulation material of size, the heat in order to isolated semiconductor hot junction and cold junction is disturbed simultaneously.
8. smoke exhaust ventilator external semiconductor refrigerating block preparation method according to claim 1, is characterized in that: be bolted fixing in described step (1) between the first heat-exchange system, semiconductor chilling plate and the second heat-exchange system.
9. smoke exhaust ventilator external semiconductor refrigerating block preparation method according to claim 1, is characterized in that: process opening on the described module housing in step (2), opening is installed the screen pack filtering oil smoke.
10. smoke exhaust ventilator external semiconductor refrigerating block preparation method according to claim 1, is characterized in that: process heat exchange air inlet and heat exchange air outlet on the described module housing in step (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410433827.1A CN105371324A (en) | 2014-08-29 | 2014-08-29 | Manufacturing method for externally-arranged semiconductor refrigerating module of smoke exhauster |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410433827.1A CN105371324A (en) | 2014-08-29 | 2014-08-29 | Manufacturing method for externally-arranged semiconductor refrigerating module of smoke exhauster |
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| Publication Number | Publication Date |
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| CN105371324A true CN105371324A (en) | 2016-03-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410433827.1A Pending CN105371324A (en) | 2014-08-29 | 2014-08-29 | Manufacturing method for externally-arranged semiconductor refrigerating module of smoke exhauster |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108327269A (en) * | 2018-01-25 | 2018-07-27 | 广州迈普再生医学科技有限公司 | A kind of semiconductor temperature biology 3D printing nozzle |
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- 2014-08-29 CN CN201410433827.1A patent/CN105371324A/en active Pending
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| CN108327269A (en) * | 2018-01-25 | 2018-07-27 | 广州迈普再生医学科技有限公司 | A kind of semiconductor temperature biology 3D printing nozzle |
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Application publication date: 20160302 |