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CN105316664B - Metal surface treating method and metal conditioner - Google Patents

Metal surface treating method and metal conditioner Download PDF

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Publication number
CN105316664B
CN105316664B CN201510422991.7A CN201510422991A CN105316664B CN 105316664 B CN105316664 B CN 105316664B CN 201510422991 A CN201510422991 A CN 201510422991A CN 105316664 B CN105316664 B CN 105316664B
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mass
epithelium
additive
alkali metal
metal salt
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CN105316664A (en
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韩钟直
韩娜丽
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Grimm Chemical Industry Co Ltd
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Grimm Chemical Industry Co Ltd
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Abstract

The present invention relates to metal surface treating method and metal conditioner, methods described includes：The step of being washed after the dirt of removal metal material；After washing, when the metal material carries out Wire Drawing by wire drawing die, in order to improve lubricant effect and protect the surface of the metal material, on the surface of the metal material the step of formation alkali metal salt epithelium；And drying steps.The present invention will not trigger environmental problem, and the surface of wire rod is had extensibility, corrosion resistance, wearability.

Description

Metal surface treating method and metal conditioner
Technical field
The present invention relates to metal surface treating method and metal conditioner, more specifically, when being related to plastic working In order to improve lubricity and epithelium be formed in metal surface with extensibility, and it is (Batch System) and continuous comprising immersing Operate the metal surface treating method and metal conditioner of (Inline System).
Background technology
Iron is oxidized easily and is difficult to take care of in atmosphere in metal.Therefore, carried out gold-plated to protect metal surface Or chemical conversion treatment.In chemical conversion treatment, in order to the close property of coating, wearability, plastic deformation processing lubricate, electricity Insulation etc. and be generally used in metal material surface formed phosphate coating phosphate coating processing.
Phosphate coating handling principle is as follows.
3[Zn(H2PO4)2)]→Zn3(PO4)2+4H3PO4
In the surface treatment used in plastic working, phosphate coating its quality for being formed by phosphate coating processing It is fitst water.
But phosphate coating processing has the waste water handling problem of the phosphate coating agent containing heavy metal, because of sludge (Sludge) (Fe (PO are produced4)) caused by offal treatment the problems such as.
Sludge produces (Fe (PO4)) process be as follows.
Fe+2H3PO4→Fe(H2PO4)2+H2
Oxidant (O) → H2O
FePO4(Sludge)+H3PO4+1/2H2O
Moreover, in order to which with more than 80 DEG C of temperature treatment phosphate coating agent, also there is the problems such as consumption thermal source.
As people increase to the cognition of environmental protection, caused trade waste and ring in phosphate coating processing Border protection clashes.
The content of the invention
It is an object of the present invention to provide improve caused by the processing of existing phosphate coating caused by waste water, sludge Environmental problem, especially, thermal source and elementary cell are reduced by reducing process, the malleable preceding place of tool is formed in metal surface Manage the metal surface treating method and metal conditioner of (Precoating) epithelium.
To reach purpose as described above, the present invention includes：The step of being washed after the dirt of removal metal material；After washing, When the metal material carries out Wire Drawing by wire drawing die, in order to improve lubricant effect and protect the table of the metal material Face, on the surface of the metal material the step of formation alkali metal salt epithelium；And drying steps.
The dirt of the metal material is removed in chemical pickling process, cathodic pickling process, physics derust process At least one method.
The alkali metal salt epithelium is that the metal material of the washing is immersed to containing alkali metal salt reactant and addition In the metal conditioner of agent, so as to be adhered to the metal material surface.
The quality ratio scope of its described alkali metal salt reactant of the metal conditioner and the additive is 10: 90-90:10。
The alkali metal salt reactant includes 10-90 mass % Na relative to the reactant gross mass2O, 10-90 matter Measure % B2O3, pH scopes are 5-10.
The additive increases the bonding amount of the alkali metal salt epithelium as adhesive, has the alkali metal salt epithelium There are corrosion resistance, and one kind or its compound in inorganic compound and organic compound, wherein the inorganic compound selects From B2O3、Al2O3、ZrO2、K2O、SiO2、Fe2O3、MgO、BaO、SO3, one or more of SrO, the organic compound is selected from CH2O、C6H10O5、CH3OH, COOH, methoxyl group (Methoxy), ethyoxyl (ethoxy), propoxyl (hydroxyproxy), Ester (Ester), galactolipin, glucose, C6H12O6、CH2One or more of OH, polyalcohol (Polyol).
The inorganic compound includes 10-90 mass % B relative to the additive gross mass2O3, more than 0 be less than 30 Quality % Al2O3, more than 0 be less than 30 mass % ZrO2, more than 0 be less than 30 mass % K2O, it is less than 30 mass % more than 0 SiO2, more than 0 be less than 10 mass % Fe2O3, more than 0 be less than 10 mass % MgO.
The organic compound includes 1-15 mass % CH relative to the additive gross mass2O, 1-15 mass % C6H10O5, 1-15 mass % CH3OH, 1-15 mass % COOH, 1-15 mass % methoxyl group, 1-15 mass % ethoxy Base, 1-15 mass % propoxyl, 1-15 mass % ester, 1-15 mass % galactolipin, 1-15 mass % glucose, 1-15 mass % C6H12O6, 1-15 mass % CH2OH, 1-15 mass % polyalcohol.
The additive is further included and is selected from lipid, vinyl-based, epoxies, methacryloxy class, ammonia Base class, sulfydryl class functional group compound in one kind, included relative to the additive gross mass and more than 0 be less than 10 mass % Scope.
The metal material is wire rod, the wire rod in steel, stainless steel, aluminium, titanium, copper, magnesium and its alloy one Kind.
Metal conditioner be used for metal material surface formed alkali metal salt epithelium, its alkali metal salt reactant and The mass ratio of additive is 10:90-90:10.
The alkali metal salt reactant includes 10-90 mass % Na relative to the reactant gross mass2O, 10-90 matter Measure % B2O3, pH scopes are 5-10.
The one kind or its compound of the additive in inorganic compound and organic compound, wherein described inorganization Compound is selected from B2O3、Al2O3、ZrO2、K2O、SiO2、Fe2O3、MgO、BaO、SO3, one or more of SrO, the organic compound Thing is selected from CH2O、C6H10O5、CH3OH, COOH, methoxyl group, ethyoxyl, propoxyl, ester, galactolipin, glucose, C6H12O6、 CH2One or more of OH, polyalcohol.
The inorganic compound includes 10-90 mass % B relative to the additive gross mass2O3, more than 0 be less than 30 Quality % Al2O3, more than 0 be less than 30 mass % ZrO2, more than 0 be less than 30 mass % K2O, it is less than 30 mass % more than 0 SiO2, more than 0 be less than 10 mass % Fe2O3, more than 0 be less than 10 mass % MgO.
The organic compound includes 1-15 mass % CH relative to the additive gross mass2O, 1-15 mass % C6H10O5, 1-15 mass % CH3OH, 1-15 mass % COOH, 1-15 mass % methoxyl group, 1-15 mass % ethoxy Base, 1-15 mass % propoxyl, 1-15 mass % ester, 1-15 mass % galactolipin, 1-15 mass % glucose, 1-15 mass % C6H12O6, 1-15 mass % CH2OH, 1-15 mass % polyalcohol.
The additive is further included and is selected from lipid, vinyl-based, epoxies, methacryloxy class, ammonia Base class, sulfydryl class functional group compound in one kind, have relative to the additive gross mass and more than 0 be less than 10 mass % Scope.
Metal conditioner is used to form alkali metal salt epithelium on the surface of metal material, is free from B2O3Without boron The quality ratio scope of (Boron Free) metal conditioner, additive and water is 5:95-50:50.
The one kind or its compound of additive in inorganic compound and organic compound, wherein the inorganic compound Selected from Al2O3、ZrO2、K2O、SiO2、Fe2O3、MgO、BaO、SO3, one or more of SrO, S, Si, Ca, organic compound is selected from CH2O、C6H10O5、CH3OH, COOH, methoxyl group, ethyoxyl, propoxyl, ester, galactolipin, glucose, C6H12O6、CH2It is OH, more One or more of first alcohol.
The metal conditioner is K2O and SiO2Reacted and form alkali metal on the surface of the metal material Salt epithelium.
The metal surface treating method of the present invention is reacted and before the surface of wire rod forms alkali metal salt by alkali metal salt Epithelium is handled, it is therefore, different from forming phosphate coating, it will not cause environmental problem, and with making wire surface with prolonging Stretching property, corrosion resistance, the effect of the effect of wearability and carrying (carrier (pick-up)) various lubricants.
The present invention has the effect for reducing thermal source and elementary cell because reducing process, therefore during progress Treatment of Metal Surface Can be cost-effective.
Brief description of the drawings
Fig. 1 is the procedure chart according to the metal surface treating method of the present invention.
Fig. 2 and Fig. 3 is the ideograph of the epithelium formed by the metal surface treating method of the present invention.
Fig. 4 is the ideograph without boron epithelium formed by the metal surface treating method of the other embodiment of the present invention.
Embodiment
Hereinafter, the preferred embodiments of the present invention are described in detail.
As shown in figure 1, the metal surface treating method of the present invention, including：Remove the step washed after the dirt of metal material Suddenly；After washing, when the metal material carries out wire drawing by wire drawing die, in order to improve lubricant effect, the protection metal material Surface and carrying (carrier (pick-up)) various lubricants, the metal material surface formed alkali metal salt before locate The step of managing epithelium (hereinafter referred to as " alkali metal salt epithelium ")；And drying steps.
Metal material selects wire rod.Wire rod refers to the wire rod (Wire Rod) that various lines are manufactured by Wire Drawing.Line Material is to be fabricated to the diameter with 5.5mm-32mm by hot rolling, by being pulled out through the hole of wire drawing die to be manufactured into wanted shape The drawing process of shape and the fine rule of size and be manufactured to steel wire, iron wire, piano wire.
Wire rod can be formed hard dirt after hot rolling on surface, in order to which Wire Drawing needs dirt.Wire rod is by hot rolling Afterwards, need to be heat-treated to obtain physical property (hardness and toughness), the wire rod being heat-treated also forms dirt on surface Dirt, therefore in order to which Wire Drawing is also required to dirt.Dirt is in oxide caused by wire surface, can be influenceed when not removing Wire Drawing.
Dirt, which removes, may be selected from chemical pickling process, cathodic pickling process, physics and derusts at least one of process method.
Pickling process is that wire rod is immersed into the stipulated times such as hydrochloric acid, sulfuric acid to make a return journey the process of dirt, and physics derusts work Sequence sprays hard particles missile and water under high pressure to remove wire rod for progress de-scaling (scale breaker) or on the surface of wire rod The process of the dirt on surface.
The dirt of pickling process, which removes, to be improved by the concentration for the Acidwash solution for increasing hydrochloric acid, sulfuric acid, nitric acid etc. Except rate.
The laggard water-filling of dirt for removing wire surface is washed, and forms alkali metal salt epithelium on the surface of wire rod.Form alkali gold Drying is carried out after category salt epithelium, then carries out Wire Drawing.
Most important condition is to ensure wire-drawing workability by lubricant effect during Wire Drawing.Wire Drawing is usually at a high speed Processing, therefore, during processing easily causing temperature to rise, reduce oil body or cause, powder lubricant is floated and oil film is broken Split.And Wire Drawing is accompanied by high temperature, therefore, because the friction of wire drawing die and wire rod easily forms adhesion in wire drawing die, and And because the adhesion easily produces flaw on the surface of wire rod or is difficult to be smoothed out being plastically deformed.
In Wire Drawing, because the friction of HTHP caused by between wire drawing die and wire rod causes wire surface damaged, In order to prevent breakage and smoothly complete plastic deformation, epithelium is formed in wire surface.
Epithelium is alkali metal salt epithelium.Alkali metal salt epithelium is that the wire rod of washing is immersed to containing alkali metal salt reactant In the metal conditioner of additive, so as to be adhered to wire surface.
In addition, the gunite also in wire surface metal injection surface conditioning agent, with the brushing method of brush brushing, Method with roll brushing etc., it is preferred to use wire rod is immersed in the groove equipped with metal conditioner, so as in wire rod table The sedimentation of face bonded metal surface conditioning agent.
Alkali metal salt epithelium improves lubricity in Wire Drawing, so as to be smoothed out being plastically deformed.
The bonding amount (thickness) of alkali metal salt epithelium is preferably 5-30g/ ㎡.
The bonding amount of alkali metal salt epithelium is relevant with Wire Drawing, and epithelium is cannot ensure when bonding amount is less than 5g/ ㎡ Corrosion resistance and wearability and lubricity is difficult to ensure that in Wire Drawing, when more than 30g/ ㎡, because excessive epithelium causes skin The close property of film in itself reduces, while reduces wire-drawing workability.
The epithelium of optimum state is formed when the bonding amount of alkali metal salt epithelium is 10g/ ㎡.
The quality ratio scope of its alkali metal salt reactant of metal conditioner and additive is 10:90-90:10.It is preferred that The quality ratio scope of ground, its alkali metal salt reactant of metal conditioner and additive is 60:40-70:30.
Alkali metal salt reactant is used to form epithelium in wire surface.
Additive plays a part of to improve the corrosion resistance of epithelium and increases the bonding amount of epithelium or lubricant.Without additive Only it can be formed epithelium when wire surface is formed epithelium with alkali metal salt reactant but be difficult to adjust bonding amount and uneven, Iron rust is produced in wire rod and is difficult to ensure that corrosion resistance.
When the mass ratio of alkali metal salt reactant and additive is less than 60:When 40, although epithelium can be formed, alkali gold Belong to the amount deficiency of reactant salt thing and be difficult to the epithelium to form optimal morphology, when more than 70:During 30 quality ratio, because of additive deficiency And carry the scarce capacity of lubricant and be difficult to the epithelium to form optimal morphology.
When the mass ratio of alkali metal salt reactant and additive is less than 10:When 90, it is difficult to ensure epithelium bonding amount, when more than 90:During 10 quality ratio, the epithelium to form optimal morphology is difficult to because of additive deficiency, and be difficult to equably be bonded epithelium.
Alkali metal salt reactant includes 10-90 mass % Na relative to the reactant gross mass2O, 10-90 mass % B2O3, pH scopes are 5-10.
Na2O and B2O3Reaction generation alkali metal salt.Therefore, alkali metal salt includes Na2B4O7.The alkali metal salt, which rises, to be neutralized The effect of acid, thus it is different from forming phosphate coating, it will not trigger environmental problem when handling the surface of wire rod.
When pH is less than 5 or more than 10, viscosity reduces and is difficult to generate epithelium at the appointed time alkali metal salt reactant. Therefore, pH ranges preferably from 5-10.
The one kind or its compound of additive in inorganic compound and organic compound, wherein the inorganic compound Selected from B2O3、Al2O3、ZrO2、K2O、SiO2、Fe2O3、MgO、BaO、SO3, one or more of SrO, organic compound is selected from CH2O、C6H10O5、CH3OH, COOH, methoxyl group, ethyoxyl, propoxyl, ester, galactolipin, glucose, C6H12O6、CH2It is OH, more One or more of first alcohol.
The basis of additive is inorganic compound.Inorganic compound (inorganic matter) increases the alkali gold as adhesive Belong to the bonding amount of salt epithelium, make the alkali metal salt epithelium that there is corrosion resistance.
Organic compound (organic matter) is added in inorganic compound and is bonded more inorganic compounds, so as to increase Add the bonding amount of epithelium or lubricant.When organic compound with inorganic compound together as additive in use, can attract More inorganic compounds and increase epithelium bonding amount.
The mass ratio of inorganic compound and organic compound can be 99:1-50:50.
Compared to inorganic compound, when the content of organic compound is more, epithelium bonding amount increase effect can be saturated.
Inorganic compound can include B2O3、Al2O3、ZrO2、K2O、SiO2、Fe2O3, MgO it is whole.For example, inorganic compound phase It may include 10-90 mass % B for the additive gross mass2O3, more than 0 be less than 30 mass % Al2O3, be less than more than 0 30 mass % ZrO2, more than 0 be less than 30 mass % K2O, it is less than 30 mass % SiO more than 02, be less than 10 matter more than 0 Measure % Fe2O3, more than 0 be less than 10 mass % MgO.
Inorganic compound can include BaO, SO3、SrO.For example, inorganic compound can wrap relative to the additive gross mass The % of mass containing 1-10 BaO, 1-90 mass % SO3, 1-90 mass % SrO.
Organic compound can include CH2O、C6H10O5、CH3OH, COOH, methoxyl group, ethyoxyl, propoxyl, ester, gala Sugar, glucose, C6H12O6、CH2OH, polyalcohol are whole.For example, organic compound can include relative to the additive gross mass 1-15 mass % CH2O, 1-15 mass % C6H10O5, 1-15 mass % CH3OH, 1-15 mass % COOH, 1-15 matter Measure % methoxyl group, 1-15 mass % ethyoxyl, 1-15 mass % propoxyl, 1-15 mass % ester, 1-15 matter Measure % galactolipin, 1-15 mass % glucose, 1-15 mass % C6H12O6, 1-15 mass % CH2OH, 1-15 matter Measure % polyalcohol.
The CH in organic compound2O、C6H10O5、CH3OH, COOH, methoxyl group, ethyoxyl, propoxyl, ester, galactolipin, Glucose, C6H12O6、CH2OH, polyalcohol refer to functional group.
Additive further include be selected from lipid, vinyl-based, epoxies, methacryloxy class, amino, One kind in the compound (having inorganic composite) of sulfydryl class functional group, can have relative to additive gross mass and be less than more than 0 10 mass % scope.
Additive has the function that to be formed uniformly epithelium in wire rod.
Usually using after wire rod is immersed in the groove equipped with metal conditioner by so as to be bonded in wire surface The method of metal conditioner, now, wire rod after being immersed in groove during, at the metal surface on wire rod top Reason agent flows to bottom because of gravity, and the metal conditioner for flowing to bottom then concentrates on the bottom of wire rod, so as to wire rod top Epithelium is thin and the epithelium of bottom is thick, produce non-uniform phenomenon.
In order to prevent the phenomenon, further include and be selected from lipid, vinyl-based, epoxies, methacryloxypropyl Base class, amino, sulfydryl class functional group compound in one kind.
With lipid, vinyl-based, epoxies, methacryloxy class, amino, sulfydryl class functional group compound Metal conditioner is set uniformly to be adhered on wire rod, so as to be formed uniformly epithelium on wire rod.
Selected from the change with lipid, vinyl-based, epoxies, methacryloxy class, amino, sulfydryl class functional group During a kind of in compound, included relative to additive gross mass when being more than 10 mass %, other additive components are inorganic chemical The composition of thing or organic compound is relative to be reduced, so as to be difficult to ensure that epithelium bonding amount.
Drying ranges preferably from 40-300 DEG C after forming epithelium.When drying temperature is less than 40 DEG C, insufficient and shape is dried Promising result can not be expected after into epithelium, when more than 300 DEG C, is not easy to cool down after drying, and carbonization because of epithelium etc. is led Deformed when causing epithelium composition to combine, and overall performance can be reduced.
Fig. 2 and Fig. 3 is the schematic diagram of the alkali metal salt epithelium formed by the metal surface treating method of the present invention.
As shown in Fig. 2 alkali metal salt epithelium can be formed by alkali metal salt reactant and inorganic compound reaction, such as scheme Shown in 3, it can be reacted by alkali metal salt reactant and inorganic compound, organic compound one to be formed.
When for Fig. 2 situations when, compared to the epithelium that Fig. 3 forms thinner thickness, two kinds of situations add choosing as additive From with lipid, vinyl-based, epoxies, methacryloxy class, amino, sulfydryl class functional group compound in one Kind, so as to be formed uniformly epithelium in the upper and lower part of wire rod.
The metal surface treating method is by Na2O and B2O3Reacted to form alkali metal salt, therefore at epithelium Excessive sludge will not be produced during reason, prevents heavy metal the like waste.
Therefore, it is different when metal surface treating method of the invention is from forming phosphate coating, when handling wire surface Environmental problem will not be caused, and make wire surface that there is extensibility, corrosion resistance, wearability etc..
Metal material is illustrated by taking wire rod as an example, but is not limited to wire rod, needs to lubricate when can be plastic working Steel plate, the various materials such as steel.
Metal material may be selected from one kind in steel, stainless steel, aluminium, titanium, copper, magnesium and its alloy.
The metal conditioner of the present invention is not damaging idea of the invention or epithelium in addition to the inscape Defoamer, water etc. are can further include in the range of energy.
The metal conditioner of the present invention can be manufactured by mixing the composition as mentioned above of ormal weight, for mixing Method is not specially limited, applicable various known methods.
The temperature of metal conditioner is kept for 70-90 DEG C.When the temperature of metal conditioner is less than 70 DEG C, bonding Effect is weak, and when more than 90 DEG C, volatile quantity is more and is difficult to keep total quality ratio.
By wire rod of the as above process formed with alkali metal salt epithelium, be fabricated to by Wire Drawing with required shape and The fine rule of size.
Hereinafter, the present invention is described in detail with reference to following example and comparative example.
But following example and comparative example are given for example only the present invention, the present invention is not limited.
Table 1 is to show to utilize bonding amount of the metal conditioner of the present invention after wire rod forms epithelium, extensibility, resistance to Mill property, epithelium uniformly whether etc..
Table 1
(unit：Quality %)
【Bonding amount unit：g/㎡】
<Extensibility>
○：It is outstanding, △：Commonly, ×：Difference
<Corrosion resistance and wearability>
○：It is outstanding, △：Commonly, ×：Difference
As reference, inorganic compound includes 10-90 mass % B relative to additive gross mass2O3, more than 0 be less than 30 Quality % Al2O3, more than 0 be less than 30 mass % ZrO2, more than 0 be less than 30 mass % K2O, it is less than 30 mass % more than 0 SiO2, more than 0 be less than 10 mass % Fe2O3, more than 0 be less than 10 mass % MgO, organic compound is relative to additive Gross mass includes 1-15 mass % CH2O, 1-15 mass % C6H10O5, 1-15 mass % CH3OH, 1-15 mass %'s COOH, 1-15 mass % methoxyl group, 1-15 mass % ethyoxyl, 1-15 mass % propoxyl, 1-15 mass % Ester, 1-15 mass % galactolipin, 1-15 mass % glucose, 1-15 mass % C6H12O6, 1-15 mass % CH2OH、 1-15 mass % polyalcohol, other compounds have used the compound with lipid functional group.
Wire rod immerses 1-10 minutes (Batch System) or 1 second to 5 minutes in the groove equipped with metal conditioner Afterwards by the way that now the temperature of metal conditioner is kept for 70-90 DEG C.
As shown in table 1, its bonding amount of the comparative example 1 without additive is low and epithelium is also uneven, without other compounds Comparative example 2, its epithelium of comparative example 3 it is uneven.
The mass ratio of alkali metal salt reactant and additive is unsatisfactory for 60:40-70:30 scope and the ratio without additive Compared with its epithelium bonding amount deficiency of example 4, thus extensibility, corrosion resistance, wearability are insufficient.
More than 10 mass % comparative example 5, its epithelium is uniform relative to additive gross mass for the content of other compounds, but The content relative deficiency of inorganic compound or organic compound and epithelium bonding amount is low.
Only include Na2O and B2O3In the comparative example 6 of composition a kind of to comparative example 9, it does not generate metal salt and can not formed Epithelium.
Meet that the example 1 of the scope of the present invention to example 7 its epithelium bonding amount meets 5-30g/ ㎡, epithelium is also equal It is even.Especially, epithelium bonding amount is 10g/ ㎡ in example 2, forms the epithelium of optimal morphology.
Being confirmed by above experimental result, metal conditioner of the invention does not trigger environmental problem, while Wire surface is formed uniformly epithelium and has extensibility, corrosion resistance, wearability.
As other embodiment, when metal conditioner is needed without boron, comprising additive and water, the matter of additive and water It can be 5 to measure ratio:95-50:50.
During without boron, it is not contained in addition using alkali metal salt reactant in additive.During without boron alkali is included in additive Reacting metal salt thing, therefore the quality of the additive contained in metal conditioner can be different from above example.
The one kind or its compound of additive in inorganic compound and organic compound, wherein the inorganic compound Selected from Al2O3、ZrO2、K2O、SiO2、Fe2O3、MgO、BaO、SO3, one or more of SrO, S, Si, Ca, the organic compound Selected from CH2O、C6H10O5、CH3OH, COOH, methoxyl group, ethyoxyl, propoxyl, ester, galactolipin, glucose, C6H12O6、 CH2One or more of OH, polyalcohol.
Preferably, inorganic compound, which includes, is more than 0 Al for being less than 30 mass %2O3, more than 0 be less than 30 mass % ZrO2、 It is less than 90 mass % K more than 02O, it is less than 90 mass % SiO more than 02, more than 0 be less than 10 mass % Fe2O3, more than 0 MgO less than 10 mass %, the S more than 0 less than 30 mass %, the Si more than 0 less than 30 mass %, it is less than 30 matter more than 0 Measure % Ca.
Organic compound includes 1-15 mass % CH2O, 1-15 mass % C6H10O5, 1-15 mass % CH3OH、1- 15 mass % COOH, 1-15 mass % methoxyl group, 1-15 mass % ethyoxyl, 1-15 mass % propoxyl, 1- 15 mass % ester, 1-15 mass % galactolipin, 1-15 mass % glucose, 1-15 mass % C6H12O6, 1-15 matter Measure % CH2OH, 1-15 mass % polyalcohol.
Additive further include be selected from lipid, vinyl-based, epoxies, methacryloxy class, amino, One kind in the compound of sulfydryl class functional group.
The principle that organic compound and the Additive further contained are formed in epithelium has been recorded in embodiment, because Its detailed description is omitted herein for this.
Without not containing B in boron2O3, it is K2O and SiO2Reaction forms alkali metal salt epithelium.That is, without including 10-90 matter in boron Measure % SiO2, 10-90 mass % K2O, B is not contained2O3。
Experimental result, as shown in figure 4, being free of B2O3The mass ratio without its additive of boron metal conditioner and water For 5:95-50:When 50, the K in additive2O and SiO2React, alkali metal salt epithelium is formed on the surface of metal material.
Moreover, being formed at the alkali metal salt epithelium of metal material surface its epithelium bonding amount meets 5-30g/ ㎡, epithelium Uniformly.
The interest field of the present invention is not limited to the embodiment, and according to right depending on, it should be understood that this The technical staff in field can carry out various modifications and change in the interest field described in right.

Claims (8)

  1. A kind of 1. metal surface treating method, it is characterised in that including：
    The step of being washed after the dirt of removal metal material；
    After washing, when the metal material carries out Wire Drawing by wire drawing die, in order to improve lubricant effect and protect the gold Belong to the surface of material, on the surface of the metal material the step of formation alkali metal salt epithelium；And
    Drying steps,
    The alkali metal salt epithelium is that the metal material of the washing is immersed to containing alkali metal salt reactant and additive In metal conditioner, so as to be adhered to the metal material surface,
    The quality ratio scope of its described alkali metal salt reactant of the metal conditioner and the additive is 10:90-90: 10,
    The alkali metal salt reactant includes 10-90 mass % Na relative to the reactant gross mass2O, 10-90 mass % B2O3,
    PH scopes are 5-10,
    The additive increases the bonding amount of the alkali metal salt epithelium as adhesive, has the alkali metal salt epithelium resistance to Corrosion,
    The additive will include and be selected from B2O3、Al2O3、ZrO2、K2O、SiO2、Fe2O3、MgO、BaO、SO3, in SrO it is a kind of with On inorganic compound as basis,
    Further add to include in the inorganic compound and be selected from CH2O、C6H10O5、CH3One kind in OH, galactolipin, glucose Organic compound above,
    The alkali metal salt epithelium is makes the metal surface have malleable pre-treatment epithelium, wire drawing after having carrying dry The effect of the lubricant used during processing,
    The bonding amount of the pre-treatment epithelium is 5-30g/m2,
    The inorganic compound includes 10-90 mass % B relative to the additive gross mass2O3, be less than 30 matter more than 0 Measure % Al2O3, more than 0 be less than 30 mass % ZrO2, more than 0 be less than 30 mass % K2O, more than 0 less than 30 mass %'s SiO2, more than 0 be less than 10 mass % Fe2O3, more than 0 be less than 10 mass % MgO,
    The organic compound includes 1-15 mass % CH relative to the additive gross mass2O, 1-15 mass % C6H10O5, 1-15 mass % CH3OH, 1-15 mass % galactolipin, 1-15 mass % glucose.
  2. 2. metal surface treating method according to claim 1, it is characterised in that the dirt of the metal material removes choosing Derusted at least one of process method from chemical pickling process, cathodic pickling process, physics.
  3. 3. metal surface treating method according to claim 1, it is characterised in that
    The additive further include be selected from lipid, vinyl-based, epoxies, methacryloxy class, amino, One kind in the compound of sulfydryl class functional group,
    Have relative to the additive gross mass and be more than 0 scope for being less than 10 mass %.
  4. 4. metal surface treating method according to claim 1, it is characterised in that
    The metal material is wire rod,
    The one kind of the wire rod in steel, aluminium, titanium, copper, magnesium and its alloy.
  5. A kind of 5. metal conditioner, it is characterised in that
    The metal conditioner is used to form alkali metal salt epithelium on the surface of metal material,
    The mass ratio of its alkali metal salt reactant of the metal conditioner and additive is 10:90-90:10,
    The alkali metal salt reactant includes 10-90 mass % Na2O, 10-90 mass % B2O3,
    PH scopes are 5-10,
    The additive increases the bonding amount of the alkali metal salt epithelium as adhesive, has the alkali metal salt epithelium resistance to Corrosion,
    The additive will include and be selected from B2O3、Al2O3、ZrO2、K2O、SiO2、Fe2O3、MgO、BaO、SO3, in SrO it is a kind of with On inorganic compound as basis,
    Further add to include in the inorganic compound and be selected from CH2O、C6H10O5、CH3One kind in OH, galactolipin, glucose Organic compound above,
    The alkali metal salt epithelium is makes the metal surface have malleable pre-treatment epithelium, wire drawing after having carrying dry The effect of the lubricant used during processing,
    The bonding amount of the pre-treatment epithelium is 5-30g/m2,
    The inorganic compound includes 10-90 mass % B relative to the additive gross mass2O3, be less than 30 matter more than 0 Measure % Al2O3, more than 0 be less than 30 mass % ZrO2, more than 0 be less than 30 mass % K2O, more than 0 less than 30 mass %'s SiO2, more than 0 be less than 10 mass % Fe2O3, more than 0 be less than 10 mass % MgO,
    The organic compound includes 1-15 mass % CH relative to the additive gross mass2O, 1-15 mass % C6H10O5, 1-15 mass % CH3OH, 1-15 mass % galactolipin, 1-15 mass % glucose.
  6. 6. metal conditioner according to claim 5, it is characterised in that
    The additive further include be selected from lipid, vinyl-based, epoxies, methacryloxy class, amino, One kind in the compound of sulfydryl class functional group,
    Have relative to the additive gross mass and be more than 0 scope for being less than 10 mass %.
  7. A kind of 7. metal conditioner, it is characterised in that
    The metal conditioner is used to form alkali metal salt epithelium on the surface of metal material, is free from B2O3Without boron gold Metal surface inorganic agent, the metal conditioner include additive and water, and the additive includes alkali metal salt reactant, institute The quality ratio scope for stating its additive of metal conditioner and water is 5:95-50:50,
    Additive increases the bonding amount of the alkali metal salt epithelium as adhesive, has the alkali metal salt epithelium anti-corrosion Property,
    The additive will include and be selected from Al2O3、ZrO2、K2O、SiO2、Fe2O3、MgO、BaO、SO3, in SrO, S, Si, Ca one The inorganic compound of kind of the above as basis,
    Further add to include in the inorganic compound and be selected from CH2O、C6H10O5、CH3One kind in OH, galactolipin, glucose Organic compound above,
    The alkali metal salt epithelium is makes the metal surface have malleable pre-treatment epithelium, wire drawing after having carrying dry The effect of the lubricant used during processing,
    The bonding amount of the pre-treatment epithelium is 5-30g/ ㎡.
  8. 8. metal conditioner according to claim 7, it is characterised in that the metal conditioner is K2O and SiO2React and form alkali metal salt epithelium in the metal material surface.
CN201510422991.7A 2014-07-24 2015-07-17 Metal surface treating method and metal conditioner Expired - Fee Related CN105316664B (en)

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JP7142498B2 (en) * 2018-06-28 2022-09-27 日本パーカライジング株式会社 Surface treatment agent for metal material, metal material with surface treatment film, and method for producing the same
CN111822531A (en) * 2020-05-29 2020-10-27 安美科技股份有限公司 A new type of aluminum wire drawing process

Citations (3)

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CN1468293A (en) * 2000-08-07 2004-01-14 日本帕卡濑精株式会社 Water-based lubricant for plastic processing of metal materials and treatment method for lubricating film
KR20080050525A (en) * 2005-12-15 2008-06-05 니혼 파커라이징 가부시키가이샤 Surface Treatment Agents, Surface Treatment Methods and Surface Treatments for Metal Materials
CN101255589A (en) * 2007-02-27 2008-09-03 高丽商事株式会社 Phospahte coated stainless steel wire for cold heading and self-drilling screw using the stainless steel wire

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Publication number Priority date Publication date Assignee Title
CN1468293A (en) * 2000-08-07 2004-01-14 日本帕卡濑精株式会社 Water-based lubricant for plastic processing of metal materials and treatment method for lubricating film
KR20080050525A (en) * 2005-12-15 2008-06-05 니혼 파커라이징 가부시키가이샤 Surface Treatment Agents, Surface Treatment Methods and Surface Treatments for Metal Materials
CN101255589A (en) * 2007-02-27 2008-09-03 高丽商事株式会社 Phospahte coated stainless steel wire for cold heading and self-drilling screw using the stainless steel wire

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