CN105314358A - Electronic component transfer apparatus and electronic component inspection apparatus - Google Patents

Abstract

The present invention relates to an electronic component transfer apparatus and an electronic component inspection apparatus. The electronic component transfer apparatus includes: parts constituting the apparatus; a hearting portion heating the parts; a humidity detection portion detecting humidity; and a temperature detection portion detecting temperature. When the temperature detected by the temperature detection portion is less than two times of dew point temperature, the parts are heated. In addition, humidity of air contacting the parts is preferably less than humidity of air contacting the humidity detection portion. Furthermore, the temperature detection portion is preferably configured to the parts.

Description

Electronic component conveying device and electronic component inspection device

technical field

The present invention relates to an electronic component conveyance device and an electronic component inspection device.

Background technique

Conventionally, there is known an electronic component inspection apparatus for inspecting electrical characteristics of electronic components such as IC devices, and the electronic component inspection apparatus is provided with an electronic component transfer device for transferring the IC device to a holding unit of the inspection unit. When inspecting an IC device, the IC device is placed on a holding portion, and a plurality of probes provided on the holding portion are brought into contact with each terminal of the IC device.

Such an inspection of an IC device may be performed by cooling the IC device to a predetermined temperature. In this case, the placement parts where the IC devices are placed are cooled to cool the IC devices, and the humidity of the atmosphere around the placement parts (humidity inside the device) is adjusted to prevent dew condensation and icing (ice accumulation). )reduce.

However, dew condensation occurs inside the electronic component conveyance device. In this case, the operator confirms the dew condensation, and performs heating for removing the dew condensation by the operator's operation. Thereby, the above-mentioned dew condensation can be removed.

In addition, Patent Document 1 describes a component testing device (electronic component transfer device), which is configured to include a chamber having a test bench inside for cooling components to a low temperature for testing. In case of abnormal temperature, stop cooling and heat the room to return to normal temperature. In this Patent Document 1, the generation of dew condensation in the room is suppressed by heating the room to return to normal temperature.

Patent Document 1: Japanese Patent Laid-Open No. 2000-9793

However, when dew condensation occurs inside the electronic component conveying device, if the operator fails to find the dew condensation and makes a wrong judgment when heating to remove the dew condensation is performed according to the operation of the operator, then Carry out IC devices in a state where condensation has occurred. Accordingly, there is a possibility that water adheres to the IC device, short-circuits and inspection cannot be performed, or the IC device may be damaged. Moreover, if it cools in the state which condensed, it will freeze.

In addition, in the component testing device described in the above-mentioned Patent Document 1, when an abnormal temperature occurs in the room, the cooling is stopped uniformly, and the room is heated to return to normal temperature. That is, it returns to normal temperature even when no dew condensation occurs. Therefore, there is a problem that it takes a long time until the work is resumed.

In addition, in the component testing apparatus described in Patent Document 1, when an abnormal temperature occurs in the room, the room is returned to normal temperature. Therefore, when dew condensation occurs in the room due to other reasons, the dew condensation cannot be removed.

Contents of the invention

An object of the present invention is to provide an electronic component conveying device and an electronic component inspection device capable of automatically avoiding dew condensation or icing and removing dew condensation or icing if generated.

An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

Application example 1

The electronic component conveying device of the present invention is characterized in that it includes: a component, which constitutes the device; a heating unit, which heats the above-mentioned component; a humidity detection unit, which detects humidity; and a temperature detection unit, which detects temperature and passes the temperature detection When the detected temperature is less than twice the dew point temperature, the above-mentioned components are heated.

Thereby, it is possible to automatically avoid dew condensation or icing on components constituting the electronic component conveyance device, and to remove dew condensation or icing when dew condensation or icing occurs.

Application example 2

In the electronic component conveyance device of the present invention, it is preferable to heat the component when the temperature detected by the temperature detection unit is 0.5 to 2 times the dew point temperature.

Thereby, it is possible to automatically avoid dew condensation or icing on components constituting the electronic component conveyance device, and to remove dew condensation or icing when dew condensation or icing occurs.

Application example 3

In the electronic component conveyance apparatus of this invention, it is preferable that the humidity of the air which contacts the said component is lower than the humidity of the air which contacts the said humidity detection part.

Thus, in the case where the temperature detection unit is not attached to the above-mentioned component, etc., in the case of setting that the temperature of the above-mentioned component is lower than the temperature around the temperature detection unit, although the probability of dew condensation or freezing becomes high, the By reducing the humidity of the air around the components, the probability of dew condensation or icing can be reduced.

Application example 4

In the electronic component conveying apparatus of this invention, it is preferable that the said temperature detection part is arrange|positioned at the said component.

Thus, the temperature of the above-mentioned components can be directly measured. In addition, by disposing the above-mentioned temperature detection part on the part that is afraid of dew condensation, it is possible to avoid dew condensation or icing in the part that is afraid of dew condensation. Or in the case of freezing, it can be removed.

Application example 5

In the electronic component conveyance apparatus of this invention, it is preferable that the said component is arrange|positioned in the room controlled to the predetermined humidity of the said electronic component conveyance apparatus.

Thereby, it is possible to prevent dew condensation or icing from occurring on the above-mentioned components where dew condensation or icing is not particularly desired, and to remove dew condensation or icing when dew condensation or icing occurs.

Application example 6

In the electronic component conveyance device of the present invention, preferably, the heating unit includes a heating wire.

Thereby, dew condensation or freezing can be removed easily and quickly.

Application example 7

In the electronic component conveying apparatus of this invention, it is preferable that the said heating part includes an air blowing source.

Thereby, dew condensation or freezing can be removed more easily and quickly.

Application example 8

In the electronic component conveyance apparatus of this invention, it is preferable to stop the said heating, when the indoor humidity of the said electronic component conveyance apparatus becomes below predetermined 1st threshold value.

Accordingly, it is possible to avoid dew condensation or icing on the above-mentioned members, and to remove dew condensation or icing if generated.

Application example 9

In the electronic component conveyance apparatus of this invention, it is preferable to stop said heating, when predetermined time elapses.

Accordingly, it is possible to prevent dew condensation or icing from occurring on the above-mentioned members, and to remove dew condensation or icing if generated.

Application Example 10

The electronic component conveyance device of the present invention is characterized by comprising: a component, which constitutes the device; and a heating unit that heats the component, and heats the component when a predetermined condition is satisfied.

Thereby, it is possible to automatically avoid dew condensation or icing on components constituting the electronic component conveyance device, and to remove dew condensation or icing when generated.

Application Example 11

In the electronic component conveyance apparatus of this invention, it is preferable that the said member has the cooling member which can arrange an electronic component and can cool.

Accordingly, it is possible to prevent dew condensation or icing from occurring on the above-mentioned members, and to remove dew condensation or icing if generated.

Application example 12

In the electronic component conveying apparatus of the present invention, it is preferable that the condition refers to a case where the power supply is turned off after the cooling member is cooled, and then the power supply is turned on.

Accordingly, it is possible to prevent dew condensation or icing from occurring on the above-mentioned members, and to remove dew condensation or icing if generated.

Application Example 13

In the electronic component conveying device according to the present invention, preferably, the above-mentioned condition means that the power supply is turned off in a state in which the cooling member is cooled, and the power supply is turned on within a preset time after the power supply is turned off. Condition.

Accordingly, it is possible to prevent dew condensation or icing from occurring on the above-mentioned members, and to remove dew condensation or icing if generated.

Application Example 14

In the electronic component conveyance device of the present invention, preferably, liquid nitrogen is used for cooling the cooling member, and the above-mentioned conditions refer to a case where the liquid nitrogen leaks.

In this way, it is possible to prevent a portion other than the setting from being cooled and dew condensation or ice formation in the portion, and to remove dew condensation or ice formation if it occurs.

Application Example 15

In the electronic component conveyance apparatus of this invention, it is preferable that the said condition is the case where the humidity of at least one chamber of the said electronic component conveyance apparatus is more than predetermined|prescribed 2nd threshold value.

Accordingly, it is possible to prevent dew condensation or icing from occurring on the above-mentioned members, and to remove dew condensation or icing if generated.

Application Example 16

In the electronic component transport device of the present invention, preferably, dry gas is supplied to at least one chamber of the electronic component transport device, and the condition refers to a case where the supply of the gas is stopped or the flow rate of the gas falls below a predetermined value.

Thereby, it is possible to prevent dew condensation or icing from occurring on the above-mentioned members, and to remove dew condensation or icing when they occur.

Application Example 17

In the electronic component transporting device according to the present invention, it is preferable that there are a plurality of control modes for controlling the operation of the electronic component transporting device, and that the electronic component transporting device has a display unit, and the display unit displays, among the plurality of control modes, The image corresponding to the currently set control mode.

Thereby, since the information related to dew condensation and icing, a processing method, etc. are displayed on a display part, for example, an operator can grasp said information, and can respond easily and quickly.

Application Example 18

The electronic component inspection device of the present invention is characterized by comprising: a component constituting the device; a heating unit constituting the component; a humidity detecting unit detecting humidity; a temperature detecting unit detecting temperature; and an inspecting unit inspecting the electronic component. and heating the member when the temperature detected by the temperature detection unit is twice or less than the dew point temperature.

Thereby, it is possible to automatically avoid dew condensation or icing on components constituting the electronic component inspection apparatus, and to remove dew condensation or icing when dew condensation or icing occurs.

Description of drawings

FIG. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention.

FIG. 2 is a block diagram of the electronic component inspection device shown in FIG. 1 .

3 is a diagram showing a display screen of a display unit of the electronic component inspection device shown in FIG. 1 .

FIG. 4 is a diagram showing a display screen of a display unit of the electronic component inspection device shown in FIG. 1 .

FIG. 5 is a diagram showing a display screen of a display unit of the electronic component inspection device shown in FIG. 1 .

FIG. 6 is a flowchart showing a control operation of the electronic component inspection device shown in FIG. 1 .

FIG. 7 is a flowchart showing a control operation of the electronic component inspection device shown in FIG. 1 .

FIG. 8 is a flowchart showing a control operation of the electronic component inspection device shown in FIG. 1 .

FIG. 9 is a block diagram showing a second embodiment of the electronic component inspection device of the present invention.

10 is a schematic plan view showing a third embodiment of the electronic component inspection apparatus of the present invention.

detailed description

Hereinafter, the electronic component conveyance apparatus and the electronic component inspection apparatus which concerns on this invention are demonstrated in detail based on embodiment shown in drawing.

first embodiment

FIG. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention. FIG. 2 is a block diagram of the electronic component inspection device shown in FIG. 1 . 3 to 5 are diagrams each showing a display screen of a display unit of the electronic component inspection device shown in FIG. 1 . 6 to 8 are flowcharts each showing a control operation of the electronic component inspection device shown in FIG. 1 .

In addition, in the following, for convenience of description, as shown in FIG. 1 , three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. In addition, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. In addition, the direction parallel to the X axis is also called "X direction", the direction parallel to the Y axis is also called "Y direction", and the direction parallel to the Z axis is also called "Z direction". In addition, the direction of the arrow of each of the X axis, the Y axis, and the Z axis is referred to as a positive side, and the direction opposite to the arrow is referred to as a negative side. In addition, the upstream side of the conveyance direction of an electronic component is only called "upstream side", and the downstream side is also called only "downstream side". In addition, the term "horizontal" in the specification of this application is not limited to being completely horizontal, but also includes a state inclined slightly (for example, less than 5°) relative to the horizontal as long as it does not hinder the conveyance of electronic components.

The inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. Devices for electrical characteristics of electronic components such as IC devices, LCD (Liquid Crystal Display; liquid crystal display), CIS (CMOS Image Sensor; CMOS image sensor). In addition, in the following, for convenience of explanation, the case where an IC device is used as the above-mentioned electronic component to be inspected will be described as a representative, and this will be referred to as "IC device 90".

As shown in FIG. 1 , the inspection device 1 is divided into: a tray supply area A1; a component supply area (hereinafter simply referred to as "supply area") A2; an inspection area A3; a component recovery area (hereinafter only referred to as "recovery area") A4 ; Pallet removal area A5. The above-mentioned respective regions are separated from each other by walls, gates and the like which are not shown in the figure. Furthermore, the supply area A2 becomes the first chamber R1 divided by walls, gates, etc., and the inspection area A3 becomes the second chamber R2 divided by walls, gates, etc., and the recovery area A4 becomes divided by walls, gates, etc. The third room R3. In addition, the first chamber R1 (supply area A2 ), the second chamber R2 (inspection area A3 ), and the third chamber R3 (recovery area A4 ) are each configured to ensure airtightness and heat insulation. Thereby, each of the first chamber R1, the second chamber R2, and the third chamber R3 can maintain humidity and temperature as much as possible. In addition, the insides of the first chamber R1 and the second chamber R2 are controlled to a predetermined humidity and a predetermined temperature, respectively.

The IC device 90 passes through each of the above areas sequentially from the tray supply area A1 to the tray removal area A5, and is inspected in the inspection area A3 on the way. In this way, the inspection device 1 includes: an electronic component conveyance device that conveys IC devices 90 in each area and has a control unit 80 ; an inspection unit 16 that performs inspection in the inspection area A3 ; and an inspection control unit (not shown). In addition, in the inspection apparatus 1, the electronic component conveyance apparatus is comprised by the structure other than the inspection part 16 and an inspection control part.

The tray supply area A1 is an area where trays 200 in which a plurality of uninspected IC devices 90 are arrayed are supplied. A plurality of trays 200 can be stacked in the tray supply area A1.

The supply area A2 is an area for supplying the plurality of IC devices 90 on the tray 200 from the tray supply area A1 to the inspection area A3, respectively. Moreover, the 1st tray conveyance mechanism 11A and the 2nd tray conveyance mechanism 11B which convey the tray 200 one by one are provided so that the tray supply area A1 and the supply area A2 may straddle.

The supply area A2 is provided with a temperature adjustment unit (permeable plate) 12 as an arrangement unit for arranging the IC devices 90 , a first device conveyance head (conveyance member) 13 , and a third tray conveyance mechanism 15 .

The temperature adjustment unit 12 is a device that heats or cools a plurality of IC devices 90 to adjust (control) the IC devices 90 to a temperature suitable for inspection. That is, the temperature adjustment unit 12 is a cooling member (member) capable of arranging the IC device 90 and capable of cooling. In the structure shown in FIG. 1, two temperature adjustment parts 12 are arrange|positioned along a Y direction, and are fixed. Then, the IC devices 90 on the tray 200 carried in (transported) from the tray supply area A1 by the first tray conveyance mechanism 11A are conveyed and placed on any one of the temperature adjustment units 12 .

The first device transport head 13 is supported so as to be movable in the supply area A2. Thus, the first device transport head 13 can handle the transport of the IC devices 90 between the tray 200 carried in from the tray supply area A1 and the temperature adjustment unit 12, and the transfer between the temperature adjustment unit 12 and the device supply unit 14 described later. Handling of the IC device 90 . Furthermore, the first device transport head 13 has a plurality of gripping sections (not shown) for gripping the IC device 90 , and each gripping section includes a suction nozzle, and grips the IC device 90 by suction.

The third tray conveyance mechanism 15 is a mechanism that conveys the empty tray 200 in the state where all the IC devices 90 have been removed, in the X direction. And after this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the 2nd tray conveyance mechanism 11B.

The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, a device supply part (supply shuttle) 14, an inspection part 16, a second device transfer head (contact part) 17, and a device recovery part (recovery trolley) are provided as an electronic component conveyance part for conveying IC devices 90. )18.

The device supply unit 14 is a device that transports the temperature-adjusted (temperature-controlled) IC device 90 to the vicinity of the inspection unit 16 . The device supply unit 14 is supported between the supply area A2 and the inspection area A3 so as to be movable in the X direction. In addition, in the configuration shown in FIG. 1 , two device supply units 14 are arranged along the Y direction, and the IC device 90 on the temperature adjustment unit 12 is conveyed and placed on any one of the device supply units 14 . In addition, in the device supply part 14, the IC device 90 can be heated or cooled similarly to the temperature adjustment part 12, and this IC device 90 can be adjusted to the temperature suitable for an inspection. That is, the device supply unit 14 is a cooling member (member) capable of arranging the IC device 90 and capable of cooling.

The inspection unit 16 is a means for inspecting and testing the electrical characteristics of the IC device 90 , that is, a holding unit that holds the IC device 90 when the IC device 90 is inspected. A plurality of probes electrically connected to terminals of the IC device 90 while holding the IC device 90 are provided in the inspection section 16 . Furthermore, the terminals of the IC device 90 are electrically connected (contacted) to the probes, and the IC device 90 is inspected via the probes. The inspection of the IC device 90 is performed based on a program stored in a storage unit of an inspection control unit included in a tester (not shown) connected to the inspection unit 16 . In addition, in the inspection unit 16 , as in the temperature adjustment unit 12 , the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection. That is, the inspection unit 16 is a cooling member (member) capable of arranging the IC device 90 and capable of cooling.

The second device carrying head 17 is movably supported in the inspection area A3. Thereby, the second device transport head 17 can transport and mount the IC device 90 on the device supply unit 14 carried in from the supply area A2 on the inspection unit 16 . In addition, when inspecting the IC device 90 , the second device transport head 17 presses the IC device 90 against the inspection unit 16 , thereby bringing the IC device 90 into contact with the inspection unit 16 . Therefore, as described above, the terminals of the IC device 90 are electrically connected to the probes of the inspection unit 16 . In addition, the second device transport head 17 has a plurality of gripping sections (not shown) for gripping the IC device 90 , and each gripping section includes a suction nozzle, and grips the IC device 90 by suction. In addition, in the second device transport head 17 , the IC device 90 can be heated or cooled similarly to the temperature adjustment unit 12 , and the IC device 90 can be adjusted to a temperature suitable for inspection. That is, the second device transport head 17 is a cooling member (member) capable of arranging and cooling the IC device 90 .

The device recovery unit 18 is a device that transports the IC device 90 after the inspection by the inspection unit 16 to the recovery area A4. The device collection unit 18 is supported so as to be movable in the X direction between the inspection area A3 and the collection area A4. In addition, in the configuration shown in FIG. 1 , two device recovery units 18 are arranged in the Y direction, similarly to the device supply unit 14 , and the IC device 90 on the inspection unit 16 is transported and placed on any one of the device recovery units 18 . . This conveyance is performed by the second device conveyance head 17 .

The collection area A4 is an area where IC devices 90 after inspection are collected. In this collection area A4, the tray 19 for collection, the 3rd device conveyance head (conveyance member) 20, and the 6th tray conveyance mechanism 21 are provided. In addition, empty trays 200 are also prepared in the collection area A4.

The collection tray 19 is fixed in the collection area A4, and three are arranged along the X direction in the structure shown in FIG. 1 . In addition, three empty trays 200 are also arranged along the X direction. Then, the IC device 90 moved to the device collection unit 18 in the collection area A4 is conveyed and placed on any one of these collection trays 19 and empty trays 200 . Thus, IC devices 90 are collected and sorted based on the inspection results.

The third device transport head 20 is supported so as to be movable within the collection area A4. Thereby, the third device conveyance head 20 can convey the IC device 90 from the device collection part 18 to the collection tray 19 and the empty tray 200 . Furthermore, the third device transport head 20 has a plurality of gripping units (not shown) holding the IC device 90 , each gripping unit is provided with a suction nozzle, and grips the IC device 90 by suction.

The sixth pallet transport mechanism 21 is a mechanism for transporting the empty pallet 200 carried in from the pallet removal area A5 in the X direction. Then, after this conveyance, the empty tray 200 is distributed to the position where the IC device 90 is recovered, that is, it becomes any one of the above-mentioned three empty trays 200 .

The tray removal area A5 is an area where the trays 200 in which a plurality of IC devices 90 in an inspected state are lined up are collected and removed. In the tray removal area A5, a plurality of trays 200 can be stacked.

Moreover, the 4th tray conveyance mechanism 22A and the 5th tray conveyance mechanism 22B which convey the tray 200 one by one are provided so that the recovery area A4 and the tray removal area A5 may be straddled.

The fourth tray conveyance mechanism 22A is a mechanism that conveys the tray 200 on which the inspected IC devices 90 are mounted from the collection area A4 to the tray removal area A5. The fifth tray conveyance mechanism 22B is a mechanism that conveys the empty tray 200 for collecting the IC devices 90 from the tray removal area A5 to the collection area A4.

The inspection control unit of the tester performs inspection of the electrical characteristics of the IC device 90 arranged in the inspection unit 16 based on, for example, a program stored in a not-shown storage unit.

In addition, the control unit 80, for example, controls the driving of the following parts, including: the first tray transport mechanism 11A; the second tray transport mechanism 11B; the temperature adjustment unit 12; the first device transport head 13; the device supply unit 14; Mechanism 15 ; inspection unit 16 ; second device transport head 17 ; device recovery unit 18 ; third device transport head 20 ; sixth tray transport mechanism 21 ; fourth tray transport mechanism 22A and fifth tray transport mechanism 22B.

In addition, as shown in FIG. 2 , the inspection device 1 has: a temperature sensor (temperature detection unit) 41 for detecting temperature; a humidity sensor (humidity detection unit) 42 for detecting humidity; a flow sensor 43 for detecting the flow rate of dry gas described later; Heating mechanism (heating unit) 51 for heating; cooling mechanism (cooling unit) 52 for cooling; dry gas supply mechanism (dry gas supply unit) 53 for supplying dry gas; operation unit 6 for performing various operations of the inspection device 1 and alarm 71. In addition, in FIG. 2, for example, the temperature sensor 41, the humidity sensor 42, the flow rate sensor 43, the heating mechanism 51, etc. are provided with several components, and only one of them is shown as a representative. In addition, the control unit 80 has a storage unit 801 for storing various information, a timer 802 for measuring time, and a determination unit 803 for performing various determinations (discrimination), and controls the heating mechanism 51, the cooling mechanism 52, and the dry gas supply mechanism. 53, the drive of each part such as the display unit 62 and the alarm 71 is controlled.

The temperature sensor 41 and the humidity sensor 42 are respectively arranged in predetermined parts inside the inspection device 1. In this embodiment, they are arranged in the first chamber R1 and the second chamber R2, and the temperature sensor 41 and the humidity sensor 42 , the temperature and humidity in the first chamber R1 and the second chamber R2 can be detected respectively. In this case, the temperature sensor 41 may be disposed at any position in the first chamber R1 and the second chamber R2 , but is preferably disposed at the temperature adjustment unit 12 , the device supply unit 14 , the inspection unit 16 and the second device transport head 17 . Thereby, the temperature of the temperature adjustment part 12, the device supply part 14, the inspection part 16, and the 2nd device carrying head 17 can be measured directly.

In addition, in this embodiment, each humidity is a relative humidity, respectively.

The flow sensor 43 is arranged in each predetermined part inside the inspection apparatus 1, and in the present embodiment, is arranged in the flow path of each of the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the device recovery unit 18. , the flow rate of the dry gas in the flow path can be detected by the flow sensor 43 .

In addition, the operation unit 6 has an input unit 61 for performing various inputs, and a display unit 62 for displaying images. It does not specifically limit as the input part 61, For example, a keyboard, a mouse, etc. are mentioned. In addition, it does not specifically limit as the display part 62, For example, a liquid crystal display panel, an organic electroluminescent display panel, etc. are mentioned. For the operator's operation of the operation unit 6, for example, by operating the input unit 61, the cursor is moved to the position of each operation button (icon) displayed on the display unit 62, and the operation button (icon) is selected (clicked). This operation is also referred to as "pressing the operation button".

In addition, some or all of the operation buttons displayed on the display unit 62 may be mechanical operation buttons such as push buttons.

In addition, as the operation part 6, it is not limited to the above-mentioned structure, For example, the device etc. which can perform the input of a touch panel etc. and the display of an image can be mentioned.

In addition, it does not specifically limit as the heating mechanism 51, For example, the heater etc. which have a heating wire can be mentioned. In addition, the heating mechanism 51 may be configured to have an air blowing source such as a fan, and warm air (hot air) may be blown by the air blowing source. In this embodiment, the heating mechanism 51 is arranged in the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transport head 17, and can heat them. In addition, if the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transport head 17 are heated, the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and The temperature of the chamber of the second device transport head 17 also rises.

In addition, the cooling mechanism 52 is not particularly limited, and examples thereof include a cooling device, a Peltier element, and the like that cool a refrigerant (for example, a low-temperature gas) by flowing it in a tube disposed near the object to be cooled. In the present embodiment, the cooling mechanism 52 uses a device that cools a refrigerant by flowing it in a tube disposed near the object to be cooled, and nitrogen gas obtained by vaporizing liquid nitrogen is used as the refrigerant. In addition, in the present embodiment, the cooling mechanism 52 can individually cool the temperature adjustment unit 12 , the device supply unit 14 , the inspection unit 16 , and the second device transport head 17 . In addition, if the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transport head 17 are cooled, the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transport head 17 are respectively arranged corresponding to the cooling. The temperature of the chamber of the second device transfer head 17 is also lowered.

In addition, the dry gas supply mechanism 53 is configured to be able to supply (flow) gas with low humidity such as air or nitrogen (hereinafter also referred to as dry gas) to predetermined portions inside the inspection apparatus 1 . When the IC device 90 is cooled to a predetermined temperature for inspection, necessary parts are cooled accordingly, and dew condensation and freezing (ice accumulation) can be prevented by supplying dry air to the necessary parts. In this embodiment, the dry gas supply mechanism 53 can supply dry gas to the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the device recovery unit 18, that is, can supply the dry gas to the first chamber R1, the second chamber R2, and the second chamber R2. Three chambers R3 supply dry gas.

In addition, the humidity of the air in contact with the temperature adjustment unit 12 , the device supply unit 14 , the inspection unit 16 , and the second device transport head 17 is preferably lower than the humidity of the air in contact with the humidity sensor 42 . Thus, when the temperature sensor 41 is not attached to the temperature adjustment unit 12, the component supply unit 14, the inspection unit 16, and the second component transport head 17, etc., the temperature adjustment unit 12, the component supply unit 14, the inspection unit, etc. are set. When the temperature of the part 16 and the second device transport head 17 is lower than the temperature around the temperature sensor 41, although the probability of dew condensation or icing becomes high, the temperature adjustment part 12, the device supply part 14, and the inspection The humidity of the air around the part 16 and the second device transport head 17 is reduced, and the probability of dew condensation or icing can be reduced.

In addition, the dry gas used by the dry gas supply mechanism 53 is a mixed gas of nitrogen gas used by the cooling mechanism 52 and low-humidity air in the case of cooling by the cooling mechanism 52 in this embodiment. When the above-mentioned cooling is stopped, only the above-mentioned low-humidity air is present.

In the inspection device 1 , at least one condition of at least one dew condensation or freezing of each member (structural member) constituting the inspection device 1 is stored in the storage unit 801 of the control unit 80 in advance. Furthermore, whether any one of the above-mentioned conditions is satisfied is judged by the judging unit 803 , and if any one of the above-mentioned conditions is satisfied, the above-mentioned structural components are heated by the heating mechanism 51 .

In addition, the said conditions are also called "dew condensation conditions" below. In addition, in this embodiment, the above-mentioned structural members are described as the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transport head 17, and they are also collectively referred to as “cooling members” hereinafter.

In this embodiment, the dew condensation conditions of the following (1) to (3) are stored in the storage unit 801 .

(1) When the indoor humidity of at least one of the first chamber R1 and the second chamber R2 is equal to or higher than a preset predetermined threshold value (second threshold value) α.

When the dew condensation condition is satisfied, that is, when the humidity of the first room R1 is equal to or higher than the threshold value α, the cooling member arranged in the first room R1 is heated, and the humidity of the second room R2 is In the case of more than the threshold value α, the cooling member arranged in the second chamber R2 is heated. In addition, hereinafter, such a distinction is not indicated, and it is simply referred to as "heating".

(2) When the power supply is turned off while the cooling member is being cooled, and then turned on.

Preferably, the dew condensation condition is further provided with a condition that "the power supply is turned off while the cooling member is being cooled, and the power supply is turned on within a predetermined time t1 after the power supply is turned off". The reason is that even if the power is turned off while the cooling member is being cooled, and then turned on, if a long time elapses after the power is turned off, the temperature of the cooling member rises during this period, preventing dew condensation or freezing. possibility is high.

In addition, when the dew condensation condition is satisfied, each cooling member is heated. In addition, it is only referred to as "heating" below.

(3) When the supply of the dry gas is stopped or the flow rate of the dry gas falls below a predetermined value.

Preferably, the dew condensation condition is further provided with a condition that "supply of the dry gas is stopped or the flow rate of the dry gas falls below a predetermined value and the cooling process is in progress". The reason for this is that there is a high possibility of no dew condensation or freezing unless it is in the cooling process.

In addition, when the dew condensation condition is satisfied, the dry gas is supplied to the cooling means in which the supply of the dry gas is stopped or the flow rate of the dry gas is set to a predetermined value or less, that is, the room in which the cooling means is arranged. In addition, below, such a distinction is not shown, and it is only called "supply dry gas".

Next, the control operation of the inspection device 1 will be described.

The inspection device 1 has a plurality of control modes for controlling its operation. In the present embodiment, there are a first control mode (power failure recovery mode), a second control mode (excessive humidity detection mode), and a third control mode (dry gas abnormality mode) as the control modes.

The first control mode is a control mode for processing (initial processing) from a state where the power is turned off to when the power is turned on. In addition, the second control mode is a control mode in which humidity is monitored and processed after the initial processing. In addition, the third control mode is a control mode in which the supply of the dry gas is monitored and the processing is performed after the initial processing.

Hereinafter, based on FIG. 6, the processing from the state where the power is cut off to when the power is turned on will be described, based on FIG. 7, the processing of monitoring humidity after the initial processing will be described, and based on FIG. The processing performed by the supply will be described.

First, the control operation of the inspection device 1 in the initial processing from the power-off state to the power-on state will be described.

In addition, the timer 802 measures the time since the power was turned off last time, and the time (elapsed time) measured by the timer 802 is set to "ta".

As shown in Figure 6, at first, switch on the power supply (step S101), detect the humidity (relative humidity) RH in the first room R1 and the second room R2 by the humidity sensor 42 afterwards (step S102), in the first room R1 and the second room R2 In the second chamber R2, it is determined whether the humidity RH is equal to or greater than the threshold value α (step S103).

When it is judged that the humidity RH is equal to or greater than the threshold value α, dew condensation or icing occurs, or there is a possibility of dew condensation or icing, and a report (B) is made (step S111 ).

In addition, the threshold value α is not particularly limited, and is a value appropriately set according to various conditions, preferably within a range of 90% to 100%, more preferably within a range of 95% to 100%. In this embodiment, for example, it is set to 100%.

In step S111 , the image shown in FIG. 3 is displayed on the screen 620 of the display unit 62 , and the alarm 71 is activated to generate a warning sound. Thereby, the operator can understand that an abnormality has occurred, that is, an abnormality that may be related to dew condensation or icing has occurred, and can understand the details of the abnormality, the processing method, etc. through the image displayed on the display unit 62 . In addition, the image shown in FIG. 3 is an example, and this example is demonstrated below.

As shown in FIG. 3 , the above image has a first image (main window) 621 displayed on the entire screen 620, and a dialog box or the like displayed on the first image 621 smaller than the first image 621. Second image (sub-window) 622 .

In the first image 621 , "stopping" is displayed on the upper left of the screen 620 in FIG. 3 .

In addition, in the second image 622, in the frame 623, there are displayed in the frame 623 the current state (content of the abnormality) of the inspection device 1 such as "a humidity abnormality has occurred in the index." etc., and processing such as "Please START after selecting RETRY, CLEANOUT." methods and other information. In addition, the above-mentioned index is "second room R2 (examination area A3)".

In addition, the reporting method in step S111 and the reporting described later is not limited to the above-mentioned method, and other examples include lighting and blinking of a light emitting unit such as a lamp.

Next, the dry gas supply mechanism 53 is driven to start supply of dry gas (step S112), and the heating mechanism 51 is driven to start heating of the cooling member (step S113). As a result, when dew condensation or icing occurs, the dew condensation and icing are removed. In addition, since the humidity is lowered, dew condensation and icing can be avoided.

Next, the humidity RH in the first chamber R1 and the second chamber R2 is detected by the humidity sensor 42 (step S114), and in the first chamber R1 and the second chamber R2, it is judged whether the humidity RH is a predetermined threshold (the first threshold) β or less (step S115).

If it is determined that the humidity RH is not equal to or less than the threshold β, the process returns to step S114, and the steps after step S114 are executed again, and when it is determined that the humidity RH is not greater than the threshold β, the process proceeds to step S116.

In addition, the threshold value β is not particularly limited as long as it is a value that does not cause dew condensation or icing, and is a value that is appropriately set according to various conditions, but is preferably set within a range of 50% to 100%, and more preferably It is preferably in the range of 80% to 100%, most preferably set to be in the range of 80% to 90%. In addition, the threshold β is preferably set to a value smaller than the above-mentioned threshold α.

In addition, in step S103, when it is determined that the humidity RH is not equal to or greater than the threshold value α, it is determined whether or not the previous power cutoff was performed during cooling (step S104).

When it is determined that the previous power cutoff was performed during the cooling process, it is determined whether the time ta measured by the timer 802 is less than or equal to the predetermined time t1 (step S105). , dew condensation or icing occurs, or there is a possibility of dew condensation or icing, report (A) (step S106).

The reason why the power was turned off last time, especially during the cooling process, may include, for example, a power outage or a case where an operator presses an emergency stop button.

In addition, the time t1 is not particularly limited, and is a value appropriately set according to various conditions, preferably within a range of 5 hours or less, more preferably within a range of 4 hours or less, and most preferably within a range of 3 hours within the following range.

In step S106 , the image shown in FIG. 4 is displayed on the screen 620 of the display unit 62 , and the alarm 71 is activated to generate a warning sound. In this way, the operator knows that an abnormality has occurred, that is, an abnormality that may be related to dew condensation or icing has occurred, and can understand the details of the abnormality, the processing method, etc. from the image displayed on the display unit 62 . In addition, the image shown in FIG. 4 is an example, and this example is demonstrated below.

As shown in FIG. 4 , in the above image, "stopping" is displayed in the upper left frame 624 in FIG. 4 . In addition, in the frame 624, various messages such as "Power off during low temperature. Drying and cleaning" are displayed.

Next, the dry gas supply mechanism 53 is driven to start the supply of dry gas (step S107), the heating mechanism 51 is driven to start heating of the cooling member (step S108), and the measurement of time (elapsed time) tb by the timer 802 is started ( Step S109). As a result, when dew condensation or icing occurs, the dew condensation and icing are removed. In addition, since the humidity is lowered, dew condensation and icing can be avoided.

Next, it is determined whether the time tb measured by the timer 802 is equal to or longer than the predetermined time t2 (step S110 ).

In addition, the time t2 is not particularly limited, and is a value appropriately set according to various conditions, preferably within a range of 5 minutes to 1 hour, and more preferably within a range of 10 minutes to 40 minutes.

Next, stop the driving of the heating mechanism 51, stop the heating of the cooling member (step S116), stop the driving of the dry gas supply mechanism 53, stop the supply of dry gas (step S117), and be in a standby state (step S118).

In addition, in step S105, when it is judged that the time ta is not below the time t1, it is inferred that a sufficient time has elapsed since the power was turned off last time, no dew condensation or icing has occurred, and no special processing is performed, and it is in a standby state ( Step S118).

Also, in step S104, when it is judged that the previous power off was not in the cooling process, it is estimated that there is no dew condensation or icing, and no special processing is performed, and it is in a standby state (step S118). The description of subsequent operations is omitted.

Next, the control operation of the inspection device 1 that monitors the humidity after the initial processing will be described. In addition, this processing is performed in the operating state and in the standby state.

First, the humidity (relative humidity) RH in the first chamber R1 and the second chamber R2 is detected by the humidity sensor 42. As shown in FIG. 7, in the first chamber R1 and the second chamber R2, whether the humidity RH is Threshold α or more (step S201). The detection and judgment of the above-mentioned humidity are performed periodically. In addition, this threshold value α is the same as the threshold value α in step S103 described above.

When it is determined that the humidity RH is not the threshold value α, it is estimated that no dew condensation or icing has occurred, no special processing is performed, and the process proceeds to the next step. Description of the following operations is omitted.

In addition, in step S201, when it is judged that the humidity RH is equal to or greater than the threshold value α, dew condensation or icing occurs, or there is a possibility of dew condensation or icing, and a report is made (step S202).

In step S202 , the image shown in FIG. 3 is displayed on the screen 620 of the display unit 62 , and the alarm 71 is activated to generate a warning sound. In addition, this step S202 is the same as the above-mentioned step S111.

Next, it is determined whether the cooling mechanism 52 is in the process of cooling (step S203), and if it is determined not to be in the process of cooling, the dry gas supply mechanism 53 is driven to start supplying the dry gas (step S204), and the process moves to step S206. In addition, in step S203, when it judges that it is cooling, the drive of the cooling mechanism 52 is stopped, and cooling is stopped (step S205), and it transfers to step S206. In addition, when the cooling process is in progress, since the dry gas is supplied by the dry gas supply mechanism 53, the supply of the dry gas is continued.

Next, the heating mechanism 51 is driven to start heating of the cooling member (step S206). As a result, when dew condensation or icing occurs, the dew condensation and icing are removed. In addition, since the humidity is lowered, dew condensation and icing can be avoided.

Next, detect the humidity RH in the first chamber R1 and the second chamber R2 by the humidity sensor 42 (step S207), and in the first chamber R1 and the second chamber R2, judge whether the humidity RH is below the threshold value β respectively (step S207). S208). In addition, this threshold β is the same as the threshold β in step S115 described above.

When it is judged that the humidity RH is not equal to or less than the threshold value β, the process returns to step S207, and steps after step S207 are executed again.

In addition, in step S208, when it is judged that the humidity RH is below the threshold value β, the drive of the heating mechanism 51 is stopped, the heating of the cooling member is stopped (step S209), the drive of the dry gas supply mechanism 53 is stopped, and the supply of dry gas is stopped. (Step S210), move to the next step. The description of subsequent operations is omitted.

Next, the control operation of the inspection device 1 for monitoring and performing the supply of dry gas after the initial processing will be described.

First, as shown in FIG. 8 , it is determined whether or not there is an abnormality in the supply of dry gas by the dry gas supply mechanism 53 (step S301 ).

In step S301, when the supply of the dry gas is stopped or the flow rate of the dry gas falls below a predetermined value a, it is judged to be abnormal, and when the flow rate of the dry gas is not below the predetermined value a, it is judged not to be abnormal (normal). . In addition, the flow sensor 43 detects the flow rate of the dry gas, and the detection of the flow rate of the dry gas and the above-mentioned determination are performed periodically.

In addition, the predetermined value a is not particularly limited, and is a value appropriately set according to various conditions, and is preferably set within a range of 100 mL/sec or less, and more preferably set within a range of 10 mL/sec or less.

When it is judged that there is an abnormality in the supply of dry gas, there is dew condensation or icing, or there is a possibility of dew condensation or icing, and a report is made (step S302 ).

In step S302 , the image shown in FIG. 5 is displayed on the screen 620 of the display unit 62 , and the alarm 71 is activated to generate a warning sound. In this way, the operator knows that an abnormality has occurred, that is, an abnormality that may be related to dew condensation or icing has occurred, and can understand the details of the abnormality and how to deal with it through the image displayed on the display unit 62 Wait. In addition, the image shown in FIG. 5 is an example, and this example is demonstrated below.

As shown in FIG. 5 , the above images include a first image 621 displayed on the entire screen 620 , and a second image 622 smaller than the first image 621 displayed on the first image 621 .

In the first image 621 , "stopping" is displayed on the upper left of the screen 620 in FIG. 5 .

In addition, in the second image 622, the current state (abnormal content) of the inspection device 1 is displayed in the frame 623 such as "the cleaning flow rate of the trolley part is abnormal." etc., "Please START after selecting RETRY, CLEANOUT." etc. methods and other information.

In addition, an abnormal position is indicated by a circle 625 . In addition, the said trolley part is a "device supply part 14."

Next, the cooling mechanism 52 is stopped, cooling is stopped (step S304), the heating mechanism 51 is driven, and heating of the cooling member is started (step S305), and the process proceeds to the next step. As a result, when dew condensation or icing occurs, the dew condensation and icing are removed. In addition, since humidity decreases due to temperature, dew condensation and icing can be avoided.

In addition, in step S303, when it is judged that it is not cooling, it is estimated that no dew condensation or icing has occurred, no special processing is performed, and the process proceeds to the next step.

In addition, in step S301, when it is judged that there is no abnormality in the supply of dry gas, it is estimated that dew condensation and icing do not occur, no special processing is performed, and the process proceeds to the next step. The description of subsequent operations is omitted.

As described above, according to the inspection device 1, when any one of the plurality of dew condensation conditions is satisfied, it is estimated that dew condensation or icing has occurred, or dew condensation or icing has occurred, and the heating mechanism is driven. 51 to heat the cooling part.

Accordingly, when dew condensation or icing occurs, the dew condensation or icing is removed, and the occurrence of dew condensation or icing can be avoided.

In addition, since there is no need for an operator to confirm dew condensation, icing, and the operation required for heating, the inspection device 1 infers that dew condensation or icing occurs, or dew condensation or icing occurs, and automatically drives the heating mechanism 51 to cool the components. Since the heating is performed, it is not troublesome, and it is possible to prevent dew condensation and freezing from being removed due to an operator's confirmation error or the like.

In addition, the inspection device 1 may also have a sensor for detecting dew condensation or icing. When dew condensation or icing occurs, the sensor can detect the occurrence of dew condensation or icing, thereby removing the dew condensation or icing.

The above-mentioned sensor is not particularly limited as long as it is a sensor capable of detecting dew condensation or icing, and for example, a leak sensor can be mentioned.

second embodiment

FIG. 9 is a block diagram showing a second embodiment of the electronic component inspection device of the present invention.

Hereinafter, the second embodiment will be described, focusing on the differences from the first embodiment described above, and the description of the same matters will be omitted.

As shown in FIG. 9 , the inspection device 1 according to the second embodiment includes a leak sensor 44 as a sensor for detecting a leak of liquid nitrogen used as a refrigerant of the cooling mechanism 52 .

In addition, as the dew condensation condition, in addition to the dew condensation conditions (1) to (3) described in the first embodiment, a dew condensation condition of "the above liquid nitrogen leakage" is added.

The inspection device 1 periodically detects the leakage of liquid nitrogen through the leak sensor 44 , and when the leakage of liquid nitrogen is detected, it drives a heating mechanism (not shown) to heat the part cooled by the leaked liquid nitrogen of the inspection device 1 . Thereby, it is possible to avoid condensation or freezing of the part outside the assumption that it is cooled by the leaked liquid nitrogen, and when condensation or freezing occurs, it can be removed.

Also according to the second embodiment as described above, the same effects as those of the first embodiment described above can be exhibited.

third embodiment

10 is a schematic plan view showing a third embodiment of the electronic component inspection apparatus of the present invention.

Hereinafter, the third embodiment will be described, focusing on the differences from the first embodiment described above, and the description of the same matters will be omitted.

As shown in FIG. 10 , in the inspection device 1 according to the third embodiment, a humidity sensor 45 is provided outside the inspection device 1 , and the humidity outside the inspection device 1 is detected by the humidity sensor 45 .

In addition, as the dew condensation condition, in addition to the dew condensation conditions (1) to (3) described in the above-mentioned first embodiment, "the humidity outside the inspection device 1 is equal to or greater than a predetermined threshold value set in advance" is added. conditions" condensation condition.

The inspection device 1 periodically detects the humidity outside the inspection device 1 by the humidity sensor 45, and when the humidity is equal to or higher than a predetermined threshold value set in advance, a heating mechanism (not shown) is driven to heat the outer wall of the inspection device 1, etc. heating. Accordingly, it is possible to avoid dew condensation or icing on the outer wall of the inspection device 1 or the like, and to remove dew condensation or icing if generated.

Even according to the third embodiment as described above, the same effects as those of the first embodiment described above can be exhibited.

Fourth Embodiment

Hereinafter, the fourth embodiment will be described, focusing on the differences from the first embodiment described above, and the description of the same items will be omitted.

The inspection apparatus 1 of the fourth embodiment changes the condensation condition of (1) described in the first embodiment to the condensation condition of the following (1A) regarding the condensation condition.

(1A) A case where the temperature detected by the temperature sensor 41 is twice or less than the dew point temperature.

When the temperature detected by the temperature sensor 41 is twice or less than the dew point temperature, there is a possibility that condensation or freezing may occur due to the dew point temperature. By driving the heating mechanism 51, the cooling member is heated to prevent dew condensation. , In the case of icing, the dew condensation and icing can be removed, and the dew condensation and icing can be avoided.

The dew point temperature can be obtained based on the temperature detected by the temperature sensor 41 and the humidity detected by the humidity sensor 42 . That is, the storage unit 801 of the control unit 80 stores calibration curves such as tables and arithmetic expressions for obtaining the dew point temperature based on temperature and humidity in advance, and the control unit 80 uses the calibration curves to obtain the dew point temperature.

In addition, in this embodiment, heating is performed when the temperature detected by the temperature sensor 41 is 2 times or less than the dew point temperature, preferably 0.5 times or more and 2 times or less the dew point temperature, more preferably Heating is performed at a ratio of 1.05 to 2 times, more preferably at a ratio of 1.05 to 1.5, particularly preferably at a ratio of 1.1 to 1.4.

Even according to the fourth embodiment as described above, the same effects as those of the first embodiment described above can be exhibited.

As mentioned above, although the electronic component conveyance apparatus and the electronic component inspection apparatus of this invention were demonstrated based on illustration, this invention is not limited to this, The structure of each part can be replaced with the arbitrary structure which has the same function. In addition, other arbitrary components may be added.

In addition, the present invention may combine any two or more structures (features) of the above-mentioned embodiments.

Explanation of reference signs:

1...inspection device (electronic component inspection device); 11A...first pallet transfer mechanism; 11B...second pallet transfer mechanism; 12...temperature adjustment unit (absorbing plate); 13...first device transfer head; 14...device supply unit (supply shuttle); 15...the third pallet conveying mechanism; 16...the inspection department; 17...the second device conveying head; 18...the device recycling department (recycling trolley); 19...recycling tray; 20...the third device conveying head; 21...sixth pallet conveying mechanism; 22A...fourth pallet conveying mechanism; 22B...fifth pallet conveying mechanism; 41...temperature sensor; 42, 45...humidity sensor; 43...flow sensor; 44...leakage sensor; 51...heating mechanism ;52...cooling mechanism; 53...dry gas supply mechanism; 6...operating part; 61...input part; 62...display part; 620...picture; 621...first image; 622...second image; 625…circle; 71…alarm; 80…control unit; 801…storage unit; 802…timer; 803…judgment unit; 90…IC device; supply area); A3...inspection area; A4...device recovery area (recovery area); A5...tray removal area; R1...first room; R2...second room; R3...third room; S101-S118...steps; S201 ~S210...steps; S301~S305...steps.

Claims (18)

1. an electronic component conveying device, is characterized in that, possesses:

Parts, its constituent apparatus;

Heating part, it heats described parts;

Humidity detection unit, it detects humidity; And

Temperature detecting part, its detected temperatures,

When the temperature detected by described temperature detecting part is less than 2 times of dew temperature, described parts are heated.

2. electronic component conveying device according to claim 1, is characterized in that,

When the temperature detected by described temperature detecting part is more than 0.5 times less than 2 times of dew temperature, described parts are heated.

3. the electronic component conveying device according to claims 1 or 2, is characterized in that,

The humidity of the air contacted with described humidity detection unit with the humidity ratio of the air of described component contact is low.

4. the electronic component conveying device according to any one of claims 1 to 3, is characterized in that,

Described temperature detecting part is configured at described parts.

5. the electronic component conveying device according to any one of Claims 1 to 4, is characterized in that,

Described component configuration is in the indoor being controlled as the humidity of regulation of described electronic component conveying device.

6. the electronic component conveying device according to any one of Claims 1 to 5, is characterized in that,

Described heating part comprises heating wire.

7. electronic component conveying device according to claim 6, is characterized in that,

Described heating part comprises air-supply source.

8. the electronic component conveying device according to any one of claim 1 ~ 7, is characterized in that,

Described heating is stopped below the first threshold that the humidity of the indoor of described electronic component conveying device becomes regulation.

9. the electronic component conveying device according to any one of claim 1 ~ 7, is characterized in that,

Described heating is stopped when have passed through specific time.

10. an electronic unit carrying device, is characterized in that, possesses:

Parts, its constituent apparatus; And

Heating part, it heats described parts,

When becoming predetermined condition, described parts are heated.

11. electronic component conveying devices according to claim 10, is characterized in that,

Described parts have can configure electronic unit and the cooling-part that can cool.

12. electronic component conveying devices according to claim 11, is characterized in that,

Described condition refers to: cut off the electricity supply under the state that described cooling-part has been cooled, connect the situation of described power supply afterwards.

13. electronic component conveying devices according to claim 11, is characterized in that,

Described condition refers to: cut off the electricity supply under the state that described cooling-part has been cooled, and starts the situation connecting described power supply within the time preset when described power supply is cut off.

14. electronic component conveying devices according to any one of claim 11 ~ 13, is characterized in that,

Liquid nitrogen is used in the cooling of described cooling-part,

Described condition refers to the situation that described liquid nitrogen is revealed.

15. electronic component conveying devices according to any one of claim 10 ~ 14, is characterized in that,

Described condition refers to: the humidity of at least one indoor of described electronic component conveying device is the situation of more than the Second Threshold of regulation.

16. electronic component conveying devices according to any one of claim 10 ~ 15, is characterized in that,

To the gas of at least one indoor supply drying of described electronic component conveying device,

Described condition refers to: the supply stopping of described gas or the flow of described gas are reduced to the situation of below specified value.

17. electronic component conveying devices according to any one of claim 1 ~ 16, is characterized in that,

There are the multiple master modes controlled the action of described electronic component conveying device,

Described electronic component conveying device has display part, by the image corresponding with the master mode of current setting in the described multiple master mode of this display part display.

18. 1 kinds of electronic component inspection device, is characterized in that possessing:

Parts, its constituent apparatus;

Heating part, it heats described parts;

Humidity detection unit, it detects humidity;

Temperature detecting part, its detected temperatures; And

Inspection portion, it checks electronic unit,

When the temperature detected by described temperature detecting part is less than 2 times of dew temperature, described parts are heated.