CN105310358A - Constant-temperature and constant-humidity historical relic showcase with solid fan and semiconductor coupled - Google Patents

Abstract

The invention discloses a display cabinet for cultural relics with a solid-state fan coupling semiconductor constant temperature and humidity, which includes a cabinet body, a constant temperature and humidity unit, and an air delivery unit. Constant humidity gas, the gas transmission unit includes an air duct connecting the cabinet and a constant temperature and humidity unit, a first solid-state fan that provides gas circulation power, and a driving power supply; the gas transmission device of the present invention uses a solid-state fan to achieve gas flow through ion wind. Accelerated flow can provide power for gas transmission, which overcomes the problems of noise, vibration and high energy consumption of traditional mechanical fans, and has the advantages of low energy consumption, no noise and vibration, and easy control.

Description

A solid-state fan coupled semiconductor constant temperature and humidity cultural relic display cabinet

technical field

The invention relates to a constant temperature and humidity control technology, in particular to a display cabinet for cultural relics with a solid-state fan coupled to a semiconductor constant temperature and humidity display.

Background technique

The storage, preservation and display of cultural relics require a specific air environment to prevent them from being damaged, and temperature and humidity are important factors affecting the preservation of cultural relics. Therefore, it is very necessary to adjust the temperature and humidity of the cultural relics display cabinet.

In the document "Museum Constant Temperature and Humidity Cultural Relics Environmental Control System Design", Jiang Guoliang pointed out that in the display and preservation environment of cultural relics with a large space area, it is more reasonable to use a refrigeration dehumidification type constant temperature and humidity system. He designed the Dalian Museum system, using The chiller provides chilled water to the air handling unit to realize the cooling and dehumidification, heating and humidification of the space in the air handling unit. The temperature and humidity are controlled through the control cabinet, and the processed air is transported to each showcase through the air duct. This technology adopts the traditional vapor compression refrigeration method, which has a large cooling capacity and can well meet the temperature regulation and dehumidification function of large spaces. However, the unit is large in size and mass, and the compressor and conveying fan will generate vibration and noise, which needs to be designed separately. The unit is placed in the machine room, and complex controllers need to be set up for the temperature and humidity control of each showcase, which increases the cost. At the same time, the movement of the showcase is not easy to achieve, so it is more suitable for large-scale systems and large-scale heat and humidity adjustment.

In the patent document with the application number ZL201110443214.2, a high-quality storage cabinet is proposed, which realizes heat and humidity treatment of air by installing a humidification module, a refrigeration module, a heating module, and a refrigeration unit in the equipment room of the storage cabinet. The evaporator of the refrigeration unit realizes cooling, adopts electric heating and a water tank to realize heating and humidification, and pipes the processed air through a fan. Because it only processes a single cultural relic cabinet, the system is small in size and realizes power-off protection. However, the refrigeration unit and the conveying fan are placed near the cabinet, which will also generate vibration and noise, and the heating efficiency of electric heating is adopted. Low energy consumption, and too many mechanical parts of the system increase the weight and make it difficult for the cabinet to move.

In the patent literature with the application number ZL201410317617.6, a new refrigeration scheme is proposed to deal with the exhibition space of cultural relics. The patent uses a semiconductor thermopile as a cooling element, and realizes heat and humidity treatment of air through semiconductor refrigeration chips, heaters, and humidifiers. , due to the small size and light weight of the semiconductor refrigeration chip, the control of the micro-environment is very good, and the equipment does not need to add water in the process of adjusting the humidity of the micro-environment, and the drainage reduces the design of the pipeline, and the system is simple. However, in order to ensure the normal and efficient work of the semiconductor cooling chip, a radiator needs to be installed at the hot and cold ends of the cooling chip. The existing technology mostly uses a mechanical fan, which will also generate vibration and noise, and the efficiency and air volume are single and difficult to control, and the power consumption is low. Large, the fan of the conveying system also has the problem of vibration and noise.

To sum up, it can be seen that the constant temperature and humidity system for cultural relics using vapor compression refrigeration is suitable for large-scale systems. It has weak control and processing capabilities for a single display cabinet, is large in size and heavy in weight, complex in structure, difficult to move, and has problems of vibration and noise. , Although the volume and quality of the constant temperature and humidity system using semiconductor refrigeration technology have been reduced, there are also problems with vibration and noise, and the system efficiency needs to be improved.

Contents of the invention

The invention provides a solid-state fan-coupled semi-conductor constant temperature and humidity exhibition cabinet for cultural relics, which has the advantages of simple structure, small volume, no vibration and noise, easy movement and low energy consumption.

A solid-state fan coupled semiconductor constant temperature and humidity display cabinet for cultural relics, including a cabinet body, a constant temperature and humidity unit, and a gas delivery unit, the gas delivery unit is used to circulate the gas in the cabinet and the constant temperature and humidity gas generated by the constant temperature and humidity unit, The gas transmission unit includes an air duct connecting the cabinet body and a constant temperature and humidity unit, a first solid-state fan providing gas circulation power, and a driving power supply.

The air transmission device of the present invention uses a solid-state fan to provide the power for gas circulation. The solid-state fan uses the ion flow generated by corona discharge to realize the circulation of the air in the pipeline; the solid-state fan can adjust and increase the air volume by setting multiple ones. Multiple solid-state fans are connected in series or in parallel to provide the driving force of the air in the air duct, and the air duct is connected with the constant temperature and humidity device and the cabinet to form an air flow loop.

Solid-state fans are different from traditional mechanical fans. The efficiency and air volume of solid-state fans will be affected by structural parameters such as heat exchange surfaces, spacing, power supply voltage, and heat flux on heat exchange surfaces. At the same time, heat flux on heat dissipation surfaces will also affect semiconductors. The efficiency of the refrigeration element has an impact, so there are optimal parameters to make the entire semiconductor constant temperature and humidity system operate in the best state, and the parameters can also be adjusted to meet the needs of different environmental conditions.

The constant temperature and humidity device is used to process the gas from the cabinet. After adjusting the temperature and humidity, it recirculates into the cabinet, and its circulation power is provided by the first solid-state fan. The constant temperature and humidity device adjusts the temperature and humidity of the gas by setting the temperature control device and the humidity control device.

Preferably, the first solid-state fan includes: a collector cylinder with both ends open and connected to the air duct, and a first discharge electrode that cooperates with one end of the collector cylinder and the collector cylinder to form ion wind. The collector tube can be conveniently connected to the air duct, and the inner cavity of the collector tube generates ion wind to effectively drive the air flow.

The first discharge electrode is a linear discharge electrode straddling the opening at one end of the collector cylinder. The linear discharge electrode is simple in design and processing, and can reduce the number of electrodes that need to be arranged, is easy to fix, and can save design time and cost.

The first discharge electrode is a needle-shaped discharge electrode straddling the opening at one end of the collector cylinder, and the needle of the needle-shaped discharge electrode points into the collector cylinder and is parallel to the central axis of the collector cylinder. The needle-shaped discharge electrode can be easily made smaller due to the radius of curvature, and the corona initiation voltage can be lower, which makes it easier to realize corona discharge. At the same time, the needle-shaped electrode can better control the flow direction of the generated ion wind by adjusting the orientation of the needle. control.

In order to improve the air volume of a single first solid-state fan, the needle-shaped discharge electrodes are arranged radially along the collector cylinder in multiple numbers, and the needles of all the needle-shaped discharge electrodes point to the inside of the collector cylinder and the direction is the same as the central axis of the collector cylinder. parallel.

In order to further reduce the volume of the device and avoid noise and vibration, preferably, the constant temperature and humidity unit includes: an air heat and humidity treatment chamber communicated with the cabinet body, a semiconductor refrigeration element installed on the air heat and humidity treatment chamber, and A cooling module mounted on a semiconductor cooling element.

The semiconductor refrigeration element usually adopts a sheet structure, that is, the semiconductor refrigeration sheet. The semiconductor refrigeration is based on the thermoelectric effect to produce a cooling effect to achieve temperature and humidity control. The cooling element is a semiconductor cold end on the side of the air heat and humidity treatment space, and the temperature of the cold end is lower than the dew point of the air to achieve cooling and dehumidification; then by changing the connection between the cooling element and the power supply, the current flows in the opposite direction. The side of the wet processing space is a semiconductor hot end, and the high temperature of the hot end heats the surrounding space to realize further adjustment and control of the temperature of the air in the space.

The air heat and humidity treatment space can be controlled by freezing and dehumidification. The heat exchange between the semiconductor cold and cold end and the air in the heat and humidity treatment space. When the temperature of the cold end is lower than the air dew point temperature, the water in the air will condense into a liquid and be removed from the air. The low-temperature and low-humidity air is obtained in the heat-humidity space. By controlling the power supply voltage of the first solid-state fan entering the heat-humidity treatment space, the conveying wind speed is changed to provide untreated air with different air volumes. These untreated air and air heat-humidity The air that has been dehumidified in the treatment space is mixed to reach the required relative humidity, so as to realize the treatment and control of the humidity of the space.

The present invention adopts semiconductor refrigeration to realize the constant temperature and humidity function, because it uses thermoelectric technology without the need for refrigerant and will not cause environmental pollution due to refrigerant leakage, and is small in size and has no moving parts.

The semiconductor refrigeration element can be in the form of a single-stage thermopile or a multi-stage thermopile. The refrigeration temperature that can be achieved by single-stage thermopile is relatively high. Since the dehumidification capacity is limited by the minimum temperature that can be achieved by thermopile, in order to meet the requirements of high humidity load conditions and lower temperature control, multi-stage thermopile can be used. Preferably, the semiconductor refrigeration element adopts a multi-stage thermopile.

In order to further reduce the volume of the device and avoid generating noise and vibration, the heat dissipation module adopts a second solid-state fan. The solid-state fan is based on the ion airflow generated by corona discharge to cool and dissipate heat from the hot end of the semiconductor, so that the semiconductor refrigeration element can work efficiently, quietly and stably.

The solid-state fan is used to dissipate heat from the hot end or cold end of the semiconductor refrigeration element, because it uses the ion wind formed by corona discharge to cool the hot end instead of the traditional mechanical fan, reducing the noise caused by the mechanical fan. Mechanical fans have operational reliability problems due to rotating parts, while solid-state fans do not have rotating parts, which improves the stability and reliability of heat dissipation, and solid-state fans have low operating power due to their small current, so they overcome the problem. The problem of high energy consumption of mechanical fans, the volume of solid-state fans is much smaller than that of mechanical fans, which is convenient for equipment miniaturization, and solid-state fans are composed of discharge electrodes and collector electrodes with various designs, which can be applied to different forms of heat dissipation surfaces. The mechanical fan has a high degree of freedom in design.

In order to facilitate manufacturing and improve the cooling effect, the second solid-state fan includes a power supply and a discharge electrode and a collector that cooperate with each other to generate corona wind, the electrode frame is used to fix the discharge electrode, and the wire is used to connect the power supply. The different positions fixed on the top of the collector or on the left and right sides realize the wind of different flow directions to dissipate heat from the cold and hot end faces of the semiconductor. Preferably, the second solid-state fan includes a collector plate and a second discharge electrode that cooperate with each other to generate corona wind, and the collector plate includes a base installed against the surface of the semiconductor refrigeration element and several The fins on one side of the semi-conductor cooling element extend longitudinally substantially parallel to each other, and ion wind channels extending longitudinally are formed between adjacent fins, and the second discharge electrode is installed and distributed on the collector plate through a fixing frame The outer periphery and the discharge end are arranged opposite to the ion wind channel. The collector plate is a metal finned plate.

Preferably, each fin is composed of fin columns arranged at intervals along the longitudinal direction, and the fin columns of adjacent fins correspond one-to-one so that the intervals between the fin columns form ion wind channels extending in the transverse direction. Due to the use of pin-shaped fins (fin columns), external ambient air can enter the channel from all sides, which can better cool the semiconductor, and the heat transfer coefficient is higher, which makes the heat transfer coefficient of the pin-shaped fins higher.

Preferably, the second discharge electrode is linear, located above the ion wind channel and parallel to the ion wind channel. The design and processing of the linear discharge electrode are simple, and at the same time, the number of electrodes to be arranged can be reduced, and it is easy to fix, which can save design time and cost. The upper part is a position away from the base with the base as the bottom surface. The second discharge electrode is metal wire or stainless steel wire.

Preferably, the second discharge electrode is needle-shaped. The needle-shaped discharge electrode can be easily made smaller due to the radius of curvature, and the corona initiation voltage can be lower, which makes it easier to realize corona discharge. At the same time, the needle-shaped electrode can better control the flow direction of the generated ion wind by adjusting the orientation of the needle. control.

In order to improve the air volume and heat dissipation effect, preferably, the fins are composed of fin columns arranged at intervals in the longitudinal direction, and the intervals between adjacent fins are opposite to each other, and all the relative intervals form ion wind channels extending in the transverse direction , the second discharge electrode is arranged above the intersection of the longitudinal and transverse ion wind channels, that is, the second discharge electrode is arranged on the center line of the cube formed by the surrounding fin columns and the needle points towards the ion wind channel.

Preferably, each ion wind channel corresponds to a plurality of second discharge electrodes, and these second discharge electrodes are located above the ion wind channel, distributed along the length direction of the ion wind channel, and have needles facing the ion wind channel. The discharge electrode is located above the ion wind channel, and the electrode layout can cover the entire heat dissipation plane. The generated ion wind will blow from the upper side of the channel to the required heat dissipation plane, which can make the wind speed uniform everywhere and better realize the heat dissipation of the entire plate.

Preferably, the second discharge electrodes are located at the end of the ion wind channel with the needles facing the ion wind channel, and all the second discharge electrodes are located on the same side of the collector plate with the needles facing the same direction. The discharge electrode is arranged at the end of the ion wind channel, which can not only reduce the height of the ion wind device, but also weaken the interference of the ion wind generated between adjacent electrodes in the channel, so that the direction of the ion wind can be better controlled.

At the same time, the whole system can greatly reduce the volume and weight of the equipment due to the adoption of the above technology. Compared with the traditional vapor compression system, the structure is simpler, it is easier to move and carry the display cabinet, and the design forms are more diverse.

Beneficial effects of the present invention:

The gas conveying device of the present invention uses a solid-state fan to realize the accelerated flow of gas through ion wind, which can provide power for gas conveying, overcomes the problems of noise, vibration and high energy consumption of traditional mechanical fans, and has low energy consumption, no noise and vibration and Easy to control and so on.

Description of drawings

FIG. 1 is a schematic diagram of the system structure of the showcase in Embodiment 1.

FIG. 2 is a schematic perspective view of the solid-state fan used for heat dissipation in Embodiment 1. FIG.

FIG. 3 is a schematic perspective view of the solid-state fan of the air delivery device of Embodiment 1. FIG.

FIG. 4 is a schematic structural view of the semiconductor heat sink of Embodiment 1. FIG.

FIG. 5 is a schematic perspective view of the solid-state fan for heat dissipation in Embodiment 2. FIG.

FIG. 6 is a schematic perspective view of the solid-state fan for heat dissipation in Embodiment 3. FIG.

FIG. 7 is a schematic perspective view of the solid-state fan used for heat dissipation in Embodiment 4. FIG.

FIG. 8 is a schematic perspective view of the solid-state fan for heat dissipation in Embodiment 5. FIG.

FIG. 9 is a schematic perspective view of the solid-state fan for heat dissipation in Embodiment 6. FIG.

FIG. 10 is a schematic perspective view of the solid state fan of the air delivery device of Embodiment 7. FIG.

FIG. 11 is a schematic perspective view of the solid state fan of the air delivery device of Embodiment 8. FIG.

FIG. 12 is a schematic perspective view of the solid-state fan for heat dissipation in Embodiment 9. FIG.

detailed description

The present invention will be described in further detail below in conjunction with examples, but the embodiments of the present invention are not limited thereto.

Example 1

As shown in Figure 1, the solid-state fan coupled semiconductor constant temperature and humidity exhibition cabinet for cultural relics in this embodiment includes an air heat and humidity treatment space, a semiconductor refrigeration element, a solid-state fan cooling device at the hot end of semiconductor refrigeration, an air transmission device, and a cultural relics exhibition cabinet. . The solid-state fan cooling device uses corona wind to achieve the purpose of heat dissipation and cooling of the semiconductor hot end, and the gas transmission device uses ion wind to generate airflow to provide the power of gas flow to realize the gas transmission function.

It specifically includes: air heat and humidity treatment space 1, solid-state fan drive power supply 2, wire 3, electrode frame 4, discharge electrode 5, collector plate 6, semiconductor refrigeration element 7, air duct 8, solid-state fan 9 and cabinet 10. The hot end of the semiconductor refrigeration element 7 is equipped with a heat sink with a solid-state fan structure. The semiconductor refrigeration element 7 is fixed on the wall of the air heat and humidity treatment space 1, and the air in the space is treated with heat and humidity. The air in the processing space 1 exchanges heat. When the temperature of the cold end is lower than the air dew point temperature, the water in the air is condensed into a liquid state and removed from the air to obtain low-temperature and low-humidity air. Control the power supply voltage of the discharge electrode, change the conveying wind speed, and provide untreated air with different air volumes. The untreated air is mixed with the dehumidified low-temperature and low-humidity air to achieve the required relative humidity, so as to realize the treatment and humidity of the space. Control: The two sides of the air heat and humidity treatment space 1 are connected to the cultural relics exhibition cabinet 10 through the solid fan 9 and the air duct 8 to realize the circulation of the air treated with constant temperature and humidity.

As shown in Figure 2, the heat dissipation device of the solid-state fan structure includes the driving power supply 2 of the solid-state fan, the wire 3, the electrode frame 4, the discharge electrode 5 and the collector plate 6, and the discharge electrode 5 adopts a metal wire or a stainless steel wire 11, and the wire 3 It is connected to the positive pole of the driving power supply 2, and the collector plate 6 is connected to the negative pole of the driving power supply 2 through the wire 3 as the collector. In this embodiment, the solid-state fan adopts the wire-plate discharge form. Metal wires or stainless steel wires 11 are fixed on the electrode frame 4 above the collector plate 6, and the formed ion wind blows to the collector plate 6 from above the plate.

The collector plate 6 includes a base 61 installed against the surface of the semiconductor refrigeration element 7 and a number of fins 62 fixed on the base 61. The fins 61 in this embodiment adopt flat fins, and the flat fins are basically parallel to each other. Extending in the longitudinal direction, an ion wind channel 63 extending in the longitudinal direction is formed between adjacent flat fins, and the metal wire or stainless steel wire 11 is located above the ion wind channel 63 and parallel to the ion wind channel 63 . The electrode frame 4 is used to fix the two ends of the wire or stainless steel wire 11, and the electrode frame 4 is formed by assembling acrylic plates.

As shown in Figure 3, the solid-state fan 9 of this embodiment includes a collector cylinder 13, a metal needle 1201, an electrode frame 401, a wire 301 and a driving power supply 2, and in this embodiment, the discharge electrode is a metal needle 1201, which is fixed on the electrode frame 401 is connected to the positive pole of the driving power supply 2 through the wire 301, and the collector tube 13 is connected to the negative pole of the driving power supply 2 through the wire 301 to form a solid-state fan. The whole solid-state fan and the air duct 8 are connected by a flange. The installed quantity and position of the solid-state fans 9 can be adjusted as required. In this embodiment, solid-state fans 9 are respectively provided at the air inlet and outlet of the air heat and humidity treatment space 1 and the cabinet 10 to provide the driving force of the gas.

Depending on the size of the system, the demand for air volume is different, the difference in pipeline resistance and other factors, the number of the aforementioned solid-state fans 9 can be multiple, and multiple solid-state fans can be connected in series on the air duct 8, or can be connected in parallel and then connected to the wind pipe. Tube 8 is connected.

As shown in FIG. 4 , the structure of the semiconductor refrigeration element 7 used in this embodiment adopts the form of a single-stage thermopile. The main structure includes a P-N junction 14, a metal connecting piece 15 and a fixed ceramic plate 16.

The cooling device of the solid-state fan structure of the present embodiment and the solid-state fan 9 all adopt the ion wind formed by the positive corona discharge, and the ion wind produced by the negative corona contains a relatively large concentration of ozone, and the oxidizing property of ozone is not conducive to the storage of cultural relics. Therefore, it needs to be avoided, so all positive corona discharges are used in this system.

Example 2

The solid-state fan-coupled semi-conductor constant-temperature and constant-humidity display cabinet for cultural relics of this embodiment is the same as that of Embodiment 1 except for the structure of the solid-state fan for heat dissipation.

As shown in Figure 5, the cooling device of the solid-state fan structure of the present embodiment is a pin-plate structure, and the needle-shaped discharge electrodes 12 distributed in an array are fixed on the electrode frame 4 above the collector plate 6 as solid-state fan discharge electrodes, The needles are distributed along the length direction of the ion wind channel 63 and the needles face the ion wind channel 63 . The needle-shaped discharge electrodes 12 are metal needles or metal pricking needles. The needle-shaped discharge electrode 12 is connected to the positive pole of the drive power supply 2 through the wire 3, and the collector plate 6 is connected to the negative pole of the drive power supply 2 as a collector through the wire 3, and the formed ion wind blows to the collector plate 6 from above.

Example 3

The solid-state fan-coupled semi-conductor constant-temperature and constant-humidity display cabinet for cultural relics of this embodiment is the same as that of Embodiment 1 except for the structure of the solid-state fan for heat dissipation.

As shown in Figure 6, the discharge form of the heat dissipation device of the solid-state fan structure of this embodiment adopts the needle-plate type, the needle-shaped discharge electrode 12 is located at the end of the ion wind channel 63 and the needle head faces the ion wind channel 63, all the needle-shaped discharge The electrodes 12 are located on the same side of the collector plate 6 with the needles facing the same direction. The needle-shaped discharge electrodes 12 are metal needles or metal pricking needles. The needle-shaped discharge electrode 12 is connected to the positive pole of the driving power supply 2 through the wire 3, and the collector plate 6 is connected to the negative pole of the driving power supply 2 as a collector through the wire 3. The collector plate 6 shown by the arrow in the figure is obtained through the above arrangement. The ion wind that flows in from one side to the other and flows out from the other side can dissipate heat to the hot and cold ends of the semiconductor refrigeration element 7 .

Example 4

The solid-state fan-coupled semi-conductor constant-temperature and constant-humidity display cabinet for cultural relics of this embodiment is the same as that of Embodiment 1 except for the structure of the solid-state fan for heat dissipation.

As shown in Figure 7, the fins 62 in this embodiment are fin columns 64 arranged at intervals in a row, forming an ion wind channel 63 in the longitudinal and transverse directions, and a linear discharge electrode is arranged above the longitudinal ion wind channel 63 11. The linear discharge electrode 11 extends longitudinally along the ion wind channel to the electrode frame for fixing.

Example 5

The solid-state fan-coupled semi-conductor constant-temperature and constant-humidity display cabinet for cultural relics of this embodiment is the same as that of Embodiment 4 except for the structure of the solid-state fan for heat dissipation.

As shown in Figure 8, the discharge electrode in the present embodiment adopts the needle-shaped discharge electrode 12, and the needle-shaped discharge electrode 12 is located above the intersection position of the longitudinal and horizontal ion wind passages, distributed along the length direction of the ion wind passage 63 and the needles Towards the ion wind channel 63 . The needle-shaped discharge electrodes 12 are metal needles or metal pricking needles.

Example 6

The solid-state fan-coupled semi-conductor constant-temperature and constant-humidity display cabinet for cultural relics of this embodiment is the same as that of Embodiment 1 except for the structure of the solid-state fan for heat dissipation.

As shown in Figure 9, in the present embodiment, the needle-shaped discharge electrode 12 is located at the end of the ion wind channel 63 and the needle head is facing the ion wind channel 63, and only one end of each ion wind channel 63 is provided with the needle-shaped discharge electrode 12, correspondingly The needle-shaped discharge electrodes 12 corresponding to the adjacent ion wind channels 63 are respectively arranged on both sides of the collector plate 6 . With the above structure, the discharge electrodes 12 arranged at intervals are arranged on both sides of the collector plate, so that two ion winds in opposite directions can be generated, and the cooling effect is better.

Example 7

The structure of the solid-state fan-coupled semi-conductor constant-temperature and constant-humidity display cabinet for cultural relics of this embodiment is the same as that of Embodiment 1 except for the structure of the solid-state fan 9 .

As shown in Figure 10, the solid-state fan 9 in the present embodiment adopts a plurality of needle-shaped discharge electrodes as the discharge electrodes, and the discharge electrode is fixed on the electrode frame 401 by a multi-electrode group formed by arranging a plurality of metal needles (needle-shaped discharge electrodes) 1201 , and then connected to the positive pole of the solid-state fan drive power supply 2 through the wire 301, the collector tube 13 is connected to the negative pole of the power supply 2 through the wire 301 to form a solid-state fan, and the whole solid-state fan is connected to the air duct 8 by a flange.

Example 8

The structure of the solid-state fan-coupled semi-conductor constant-temperature and constant-humidity display cabinet for cultural relics of this embodiment is the same as that of Embodiment 1 except for the structure of the solid-state fan 9 .

As shown in Figure 11, the solid-state fan 9 in the present embodiment adopts the wire-barrel discharge mode, in which the solid-state fan discharge electrode is a metal wire or a stainless steel wire 1101, and the metal wire or stainless steel wire 1101 is fixed on the electrode frame 401, and then passed The wire 301 is connected to the positive pole of the solid-state fan drive power supply 2, the collector tube 13 is connected to the negative pole of the power supply 2 through the wire 301 to form a solid-state fan, and the entire solid-state fan is connected to the air duct 8 by a flange.

Example 9

The structure of the solid-state fan-coupled semi-conductor constant-temperature and constant-humidity display cabinet for cultural relics of this embodiment is the same as that of Embodiment 1 except for the semiconductor refrigeration element 7 .

As shown in Figure 12, the semiconductor refrigeration element 7 adopts the form of a multi-stage thermopile, including a P-N junction 14, a metal connecting piece 15, a fixed ceramic plate 16, an insulating heat conducting layer 17, a temperature equalizing plate 18 and an electrical connecting piece 19.

Claims (10)

1. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic, comprise cabinet, constant temperature and humidity unit and gas transmission unit, the constant temperature and humidity gas that described gas transmission unit produces for gas in the cabinet that circulates and constant temperature and humidity unit, it is characterized in that, described gas transmission unit comprises the airduct connecting cabinet and constant temperature and humidity unit, provides first of gas circulation power the solid-state fan and driving power.

2. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic as claimed in claim 1, it is characterized in that, described first solid-state fan comprises: both ends open and the colelctor electrode cylinder be connected with airduct and coordinate the first sparking electrode forming ion wind with colelctor electrode cylinder with the one end being arranged on colelctor electrode cylinder.

3. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic as claimed in claim 2, is characterized in that, described first sparking electrode is the wire sparking electrode across colelctor electrode cylinder one end open.

4. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic as claimed in claim 2, it is characterized in that, described first sparking electrode is the pin shaped electric discharging electrodes across colelctor electrode cylinder one end open, and the syringe needle sensing colelctor electrode cylinder of pin shaped electric discharging electrodes is interior and direction is parallel with the central shaft of colelctor electrode cylinder.

5. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic as described in claim as arbitrary in Claims 1 to 4, it is characterized in that, described constant temperature and humidity unit comprises: to circulate the air heat and wet treatment room be communicated with, the radiating module being arranged on the semiconductor refrigerating element on air heat and wet treatment room and being arranged on semiconductor refrigerating element with cabinet, described radiating module adopts the second solid-state fan.

6. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic as claimed in claim 5, it is characterized in that, described second solid-state fan comprises the collector plate and the second sparking electrode that cooperatively interact and produce corona wind, described collector plate comprises the substrate and some fins being fixed on substrate backside semiconductor cooling module side that to recline with the surface of semiconductor refrigerating element and install, fin extends with being substantially parallel to each other in the vertical, the ion wind passage extended longitudinally is formed between adjacent fins, described second sparking electrode by fixed mount install be distributed in collector plate periphery and discharge end and ion wind passage positioned opposite.

7. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic as claimed in claim 6, it is characterized in that, each fin is made up of the fin post be longitudinally intervally arranged, the ion wind passage that the fin post one_to_one corresponding of adjacent fins makes the gap-forming between fin post extend in the horizontal.

8. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic as claimed in claims 6 or 7, it is characterized in that, described second sparking electrode is wire, to be positioned at above ion wind passage and parallel with ion wind passage.

9. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic as claimed in claims 6 or 7, it is characterized in that, described second sparking electrode is needle-like.

10. the old showcase of solid-state fan couple semiconductor constant temperature and humidity historical relic as claimed in claim 9, it is characterized in that, every bar ion wind passage to there being multiple second sparking electrode, these second sparking electrodes are positioned at above ion wind passage, along the distribution of ion wind channel-length direction and syringe needle towards ion wind passage.