CN105283057B - The shielding structure of electronic device unit and control panel housing - Google Patents
The shielding structure of electronic device unit and control panel housing Download PDFInfo
- Publication number
- CN105283057B CN105283057B CN201510284149.1A CN201510284149A CN105283057B CN 105283057 B CN105283057 B CN 105283057B CN 201510284149 A CN201510284149 A CN 201510284149A CN 105283057 B CN105283057 B CN 105283057B
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- Prior art keywords
- mentioned
- control panel
- panel housing
- metal framework
- electronic device
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0009—Casings with provisions to reduce EMI leakage through the joining parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0049—Casings being metallic containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0054—Casings specially adapted for display applications
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The present invention provides the electric shield construction of a kind of electronic equipment unit and control panel housing, wherein, metal framework has multiple juts, and the plurality of jut has the height contacted with above-mentioned control panel housing, and conductive.Above-mentioned multiple juts are arranged at the position for surrounding above-mentioned electronic component.Above-mentioned pad has multiple hole portions for the insert of above-mentioned jut in the position of the position correspondence with above-mentioned jut.
Description
Technical field
The present invention relates to the construction of the electric shield between the electronic device unit of numerical control device etc. and control panel housing.
Background technology
Control the electronic device unit of the numerical control device of lathe etc. to be installed on control panel housing of lathe etc., using
Used under the severe environment of plant of cutting fluid, cutting fluid is directly or indirectly covered on electronic device unit sometimes.Cause
This, for protecting control panel enclosure interior from the purpose of the influence of the environment of plant, turns into and is constructed as below, control panel housing with
The seal member of pad etc. is used between electronic device unit, to the introducing port of the cable of control panel enclosure interior, so as not to it is outside
Air or cutting fluid intrusion control panel enclosure interior.
And on the other hand, requirement that electronic device unit keeps dry for the electricity such as electromagnetic wave, radiation interference, inductive interference
The incoherence and compatibility (EMC) disturbed, so needing to implement electric screen between control panel housing and electronic device unit
Cover as EMC countermeasures.So, physical seal and electric shield effect is made to get both, therefore seal member use all the time is led
Electrical pad.
Fig. 7, Fig. 8 are the figures for the construction for representing conventional control panel housing and electronic device unit.
As shown in fig. 7, the electronic device unit 1 such as display unit, operation panel unit is controlled in the environment of plant with being installed on
The state of disk housing 2 processed uses.Fig. 8 is the figure for observing the electronic device unit 1 pulled down from control panel housing 2 from the back side.Electronics
Unit 1 is assembled in metal framework 4 by electronic components such as display panel, substrates and formed.Metal framework 4 is for example configured to,
Installation portion 5 is provided with corner, metal framework 4 can be installed to control panel housing 2 using the installation portion 5.In addition, by
Conductive pad 10 is pasted between metal framework 4 and control panel housing 2, and installation portion 5 is by being arranged at electric conductivity pad 10
Hole portion 7 and be installed to control panel housing 2 so that the gap between metal framework 4 and control panel housing 2 is close by conductive spacer
Envelope, prevent cutting fluid etc. from immersing internal, and metal framework 4 contacts with control panel housing 2 via electric conductivity pad 10, forms
By the electric shield of electronic component and outside environment of plant electric screen.
In addition, as other EMC countermeasures, it is known to set rule as Japanese Unexamined Patent Publication 07-326881 publications
Fixed embossing (projection) obtains the construction of electric shield.
However, electric conductivity pad has the problem of in terms of cost than in general pad high price.In addition, because Japanese Unexamined Patent Publication
Electric shield construction described in flat 07-326881 publications is the electric shield construction for being related to device internal components, so
The seal members such as the pad as insulant are not configured between the device of composition electric shield construction, even if lathe simply uses
Such structure, there is also can not ensure the problem of physical seal is such.
The content of the invention
Therefore, it is an object of the present invention to provide can just have physical seal concurrently without using the electric conductivity pad of high price
With the construction of electric shield effect.
The electronic device unit of the present invention and the electric shield of control panel housing are configured to possess in metal framework
On be equipped with the electronic device unit of electronic component, above-mentioned metal framework has the multiple installations for being used for being installed on control panel housing
Portion, above-mentioned electronic device unit are installed on above-mentioned control panel housing via pad, and above-mentioned metal framework has multiple juts, should
Multiple juts have the height that is contacted with above-mentioned control panel housing and conductive, and above-mentioned multiple juts are arranged at encirclement
The position of above-mentioned electronic component, above-mentioned pad has on the position of the position correspondence with above-mentioned jut to be inserted for above-mentioned jut
Logical multiple hole portions.
The electronic device unit of the present invention and the electric shield of control panel housing are configured to possess in metal framework
On be equipped with the electronic device unit of electronic component, above-mentioned metal framework has the multiple installations for being used for being installed on control panel housing
Portion, above-mentioned electronic device unit are installed on above-mentioned control panel housing via pad, and above-mentioned control panel housing has multiple juts,
The plurality of jut has the height that is contacted with above-mentioned metal framework and conductive, and above-mentioned multiple juts are arranged at encirclement
The position of above-mentioned electronic component, above-mentioned pad has on the position of the position correspondence with above-mentioned jut to be inserted for above-mentioned jut
Logical multiple hole portions.
Can also be that the height of each above-mentioned multiple juts is between above-mentioned multiple installation portions of above-mentioned metal framework
Central portion is higher, lower closer to above-mentioned installation portion.
Can also be, the height of each above-mentioned multiple juts in above-mentioned control panel housing above-mentioned metal framework it is above-mentioned
The position opposed with central portion between multiple installation portions is higher, and the closer position opposed with above-mentioned installation portion is lower.
Bending can also be set on above-mentioned metal framework, and this bends towards above-mentioned multiple installation portions of above-mentioned metal framework
Between the direction heaved to the inside side of above-mentioned electronic device unit of central portion.
On above-mentioned control panel housing set bending, this bend towards above-mentioned control panel housing above-mentioned multiple installation portions it
Between the direction heaved of installation surface side of the central portion to above-mentioned electronic device unit.
Above-mentioned metal framework can also be different from the hardness of above-mentioned control panel housing.
The present invention can not use one to seal member by possessing the composition of the above using the electric conductivity pad of high price
As pad, and can provide and reduce cost and have the construction of physical seal and electric shield effect concurrently.
Brief description of the drawings
The above and other purpose and feature of the present invention is according to the explanation of following embodiment referring to the drawings
It will be clear.In these figures：
Fig. 1 is the figure for the electric shield construction for representing embodiments of the present invention 1.
Fig. 2A, Fig. 2 B are the figures for the electric shield construction for representing embodiments of the present invention 2.
Fig. 3 is the figure for the electric shield construction for representing embodiments of the present invention 3.
Fig. 4 is the figure of an example of the electric shield construction for representing embodiments of the present invention 4.
Fig. 5 is the figure of an example of the electric shield construction for representing embodiments of the present invention 4.
Fig. 6 is the figure for the electric shield construction for representing other embodiments of the present invention.
Fig. 7 is the figure for the construction for representing conventional control panel housing and electronic device unit.
Fig. 8 is the figure for the construction for representing conventional electronic device unit.
Embodiment
(embodiment 1)
Fig. 1 is the figure illustrated to the electric shield construction of embodiments of the present invention 1.
As shown in Fig. 1 top, electronic device unit 1 is assembled in metal by the electronic component of display panel, substrate etc.
Framework 4 forms, and in the environment of plant, as prior art, is installed on control panel housing 2 as illustrated in fig. 7 and utilizes.By electricity
When sub- unit 1 is installed to control panel housing 2, by the way that the multiple installation portions 5 for being arranged at such as corner of metal framework 4 are consolidated
Surely control panel housing 2 is arrived to install.As long as installation portion 5, which is screw, nut etc., to be fixed on control panel housing by metal framework 4
2 part, it is possible to be arbitrary part.
Fig. 1 bottom is the figure in the corner for being exaggerated electronic device unit 1.
The electronic device unit 1 of present embodiment is being assembled with the inside edge part of the metal framework 4 of electronic component and glued
In the part for posting pad 6, the position for surrounding electronic component installation region 3 is provided with multiple juts 8.Jut 8 is by having
Conductive material is formed, as long as being conducted with metal framework 4, it is possible to formed by arbitrary processing method, for example,
Can be by carrying out Embossing processing to metal framework 4 to form jut 8.
In addition in pad 6, the hole portion 7 passed through for installation portion 5 is set, the position also in the position correspondence with jut 8
Hole portion 9 is provided with, if pad 6 is pasted into metal framework 4, jut 8 passes through hole portion 9.
By there is provided the metal framework 4 of such structure between in a manner of pad 6 for example, by the peace of screw etc.
Dress portion 5 is installed to control panel housing 2.Then, between metal framework 4 and control panel housing 2, pad 6 deform and respectively with gold
Category framework 4 and control panel housing 2 are close to, the space surrounded by metal framework 4 and control panel housing 2 with it is outside by physics every
It is disconnected, form the seal construction that the electronic equipment inside protection is not influenceed by the infiltration of cutting fluid etc..In addition, it is arranged at metal
The jut 8 of framework 4 is contacted by being arranged at the hole portion 9 of pad 6 with control panel housing 2, so as in metal framework 4 and control
The conductance general character is ensure that between disk housing 2, electric shield is formed between the space and outside surrounded by these parts.
Height on multiple juts 8, it may be considered that the compress variation of pad 6 and be set to the thickness than pad 6
It is slightly lower, so that jut 8 contacts with control panel housing 2 when metal framework 4 is installed into control panel housing 2.
In addition, the interval on multiple juts 8, corresponding to be discharged from the electronic component for being assembled in electronic device unit 1
Electrical interference frequency, in the environment of plant caused electrical interference species, it is abundant with the wavelength for the electromagnetic wave to be shielded
The interval that ground obtains the degree of shield effectiveness is configured, so as to obtain good electricity corresponding with the utilization obstacle of device
Gas shield effect.
Electric shield effect is realized by the construction of metal framework 4 and control panel housing 2 in the present embodiment, pad
6 without using high price electric conductivity pad, in general pad can be used.
(embodiment 2)
In embodiment 1, multiple juts 8 are all set to identical height, but in the present embodiment, it is contemplated that
It is deformed, scratches because of the restoring force of pad 6 that is pasted between electronic device unit 1 and control panel housing 2 and in metal framework 4
Bent situation, and the difference in height suitable with deformation, deflection is set to the height of each jut 8.
Fig. 2A is the figure squinted the inside of the electronic device unit 1 in present embodiment, and Fig. 2 B are Fig. 2A a-
A ' regarding sectional views.
On the metal framework 4 of the electronic device unit 1 in forming present embodiment, with the phase illustrated in embodiment 1
Be provided with multiple juts 8 together, it is contemplated that metal framework 4, control panel housing 2 shape, be arranged at the installation of metal framework 4
Restoring force of the position in portion 5, the intensity of metal framework 4 or pad 6 etc., and the height of each jut 8 is set with by metal
The suitable difference in height of deformation, deflection caused by metal framework 4 when framework 4 is installed to control panel housing 2.
For example, as shown in Figure 2 A, in the case that the corner of metal framework 4 is provided with installation portion 5, because metal framework 4
Control panel housing 2 is fixed on by installation portion 5, therefore metal framework 4 is difficult to produce flexure near installation portion 5, still
With being separated from installation portion 5, metal framework 4 is pushed to bend from the direction that control panel housing 2 separates by the restoring force of pad 6,
If jut 8 therefore is set as into identical height, the central portion between installation portion 5 produces jut 8 from control panel shell
Body 2 separates the problem of such.
Therefore, as shown in Figure 2 B, it is if the height of jut 8 is high and with connecing for the central portion between each installation portion 5
Nearly installation portion 5 and step-down, then when metal framework 4 is installed into control panel housing 2 via installation portion 5, due to the reply of pad 6
The whole metal framework 4 of power produces flexure, but because corresponding such flexure sets the height of jut 8, jut 8 is not
Discretely seamless unoccupied place contacts with control panel housing 2, can form the electric shield for playing good electric shield effect.
In addition, in fig. 2b, in order to which the composition of jut is readily appreciated that and emphasis is demonstrated by difference in height, but actually set
Put the appropriate difference in height suitable with deformation, deflection caused by the metal framework 4.
(embodiment 3)
Present embodiment is the variation of embodiment 2.In embodiment 2, by jut 8 set difference in height come
Absorb in deformation, flexure caused by metal framework 4, but in the present embodiment, jut 8 is highly formed with identical, separately
On the one hand, it is contemplated that metal framework 4, the shape of control panel housing 2, the position of installation portion 5 for being arranged at metal framework 4, pad 6
Intensity etc., the bending with deforming, deflection is suitable is set to metal framework 4 in advance, makes metal framework 4 so as to set
The construction that jut 8 contacts with 2 seamless unoccupied place of control panel housing.
Fig. 3 is the figure illustrated to the electric shield construction of embodiments of the present invention 3.
For example, as shown in figure 3, being provided with bending on metal framework 4, this is bent towards to be installed on control panel housing
2 and the direction heaved to the inside side of electronic device unit 1 of central portion between multiple installation portions 5 for setting.In other words, metal
The part for being provided with installation portion 5 of framework 4 is provided with bending, and this bends towards the side opposite with the surface of electronic device unit 1
To (direction of the arrow in Fig. 3).By using such construction, metal framework 4 is being installed to control panel via installation portion 5
During housing 2, make the four angular side of control panel housing 2 flexures of metal framework 4, it is flat so as to the height and control panel housing 2 of jut 8
OK, therefore jut 8 is not from the discretely seamless unoccupied place contact of control panel housing 2, can form and play good electric shield effect
The electric shield of fruit.
(embodiment 4)
Present embodiment by metal framework 4 with the different material of hardness is used in control panel housing 2, utilized to set
The material damage of soft side makes the construction that metal framework 4 and control panel housing 2 reliably contact.
Fig. 4 is that the electric shield of the hardness of metal framework 4 in the case of higher than the hardness of control panel housing 2 is constructed to carry out
The figure of explanation.As shown in figure 4, if metal framework 4 is installed on control panel housing 2, the jut 8 for being arranged at metal framework 4 passes through
Control panel housing 2 is urged towards by being arranged at the hole portion 9 of pad 6, but because jut 8 is with identical with metal framework 4
Hardness, it is and higher than the hardness of control panel housing 2, therefore contacted in the form of biting more soft control panel housing 2.
And on the other hand, Fig. 5 is electric in the case of lower than the hardness of control panel housing 2 to the hardness of metal framework 4
The figure that shielding structure illustrates.As shown in figure 5, if metal framework 4 is installed on control panel housing 2, metal framework 4 is arranged on
Jut 8 be urged towards control panel housing 2 via the hole portion 9 for being arranged at pad 6, but due to jut 8 have and gold
Belong to the identical hardness of framework 4, and it is lower than the hardness of control panel housing 2, so to be damaged using the difference of hardness with control panel housing 2
The form contact of jut 8.
(other embodiments)
In embodiment 1~4, jut 8 is provided with the side of electronic device unit 1, but for obtaining electric shield
Jut 8 is not arranged in the side of electronic device unit 1 and is provided in the gold around the side of control panel housing 2 and electronic device unit
Category framework 4 is even surface, can also be obtained and other embodiment identical effects.
In addition, in embodiment 3, the bending suitable with deformation, deflection is provided with for metal framework 4 in advance, but
It is in the case of can also being configured to set jut in the side of control panel housing 2, to pre-set and become in the side of control panel housing 2
The suitable bending of shape, deflection.
As shown in fig. 6, in the control panel housing 2 there is provided jut 8, it is mounted with to be located at multiple peaces during metal framework 4
The direction that installation surface side of the central portion of control panel housing 2 between dress portion 5 to metal framework 4 is heaved sets bending.According to this
The construction of sample, when metal framework 4 is installed into control panel housing 2 via installation portion 5, metal framework 4 is along in control panel housing 2
The bending of setting and bend, jut 8 is not separated with control panel housing 2 and contacted so as to seamless unoccupied place, can form play it is good
Electric shield effect electric shield.
Claims (3)
1. the electric shield of a kind of electronic equipment unit and control panel housing constructs, the electric shield is configured in metal
Framework is installed on control panel housing, above-mentioned metal framework tool via pad equipped with the above-mentioned electronic device unit of electronic component
There are multiple installation portions for being installed on above-mentioned control panel housing, the electric shield of above-mentioned electronic device unit and control panel housing
Construct and be characterised by,
Multiple juts are provided with a manner of surrounding above-mentioned electronic component in above-mentioned metal framework, the plurality of jut has
The height that is contacted when above-mentioned electronic device unit is installed on into above-mentioned control panel housing with above-mentioned control panel housing and with conduction
Property,
Above-mentioned pad is provided with multiple hole portions for the insert of above-mentioned jut, the plurality of hole portion is arranged at via above-mentioned pad
And position when above-mentioned metal framework is installed on into above-mentioned control panel housing with the position correspondence of above-mentioned jut,
Central portion of the height of each above-mentioned multiple juts between above-mentioned multiple installation portions of above-mentioned metal framework is higher, with
Close to above-mentioned installation portion and it is lower.
2. the electric shield of a kind of electronic equipment unit and control panel housing constructs, the electric shield is configured in metal
Framework is installed on control panel housing, above-mentioned metal framework tool via pad equipped with the above-mentioned electronic device unit of electronic component
There are multiple installation portions for being installed on above-mentioned control panel housing, the electric shield of above-mentioned electronic device unit and control panel housing
Construct and be characterised by,
It is provided with a manner of above-mentioned control panel housing surrounds above-mentioned electronic component when in the installation of above-mentioned electronic device unit
Multiple juts, the plurality of jut has when above-mentioned electronic device unit is installed on into above-mentioned control panel housing and above-mentioned gold
Belong to the height of contact therewith and conductive,
Above-mentioned pad is provided with multiple hole portions for the insert of above-mentioned jut, the plurality of hole portion is arranged at via above-mentioned pad
And position when above-mentioned metal framework is installed on into above-mentioned control panel housing with the position correspondence of above-mentioned jut,
Central portion of the height of each above-mentioned multiple juts between above-mentioned multiple installation portions of above-mentioned metal framework is higher, with
Close to above-mentioned installation portion and it is lower.
3. the electric shield of electronic device unit according to claim 1 or 2 and control panel housing constructs, its feature exists
In,
Above-mentioned metal framework is different from the hardness of above-mentioned control panel housing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-111677 | 2014-05-29 | ||
| JP2014111677A JP5905510B2 (en) | 2014-05-29 | 2014-05-29 | Shield structure of electronic device unit and control panel housing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105283057A CN105283057A (en) | 2016-01-27 |
| CN105283057B true CN105283057B (en) | 2017-12-05 |
Family
ID=54481616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510284149.1A Active CN105283057B (en) | 2014-05-29 | 2015-05-28 | The shielding structure of electronic device unit and control panel housing |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9668387B2 (en) |
| JP (1) | JP5905510B2 (en) |
| CN (1) | CN105283057B (en) |
| DE (1) | DE102015108105B4 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016174105A (en) * | 2015-03-17 | 2016-09-29 | アスモ株式会社 | Dynamo-electric means |
| CN110708939B (en) * | 2018-07-10 | 2023-09-05 | 阿尔派株式会社 | Housing arrangement |
| TR202101270A2 (en) * | 2021-01-27 | 2022-08-22 | Aselsan Elektronik Sanayi Ve Tic A S | ELECTROMAGNETIC INTERFERENCE (EMI) and ELECTROMAGNETIC COMPATIBILITY (EMC) SWITCH PANEL |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5898127A (en) * | 1996-05-10 | 1999-04-27 | Leybold System Gmbh | Apparatus for shielding against high-frequency electromagnetic radiation |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH0440317Y2 (en) * | 1987-02-04 | 1992-09-21 | ||
| US5170321A (en) * | 1990-12-24 | 1992-12-08 | Motorola, Inc. | Enclosure system for environmental isolation of RF circuitry |
| JPH07326881A (en) | 1994-05-30 | 1995-12-12 | Nec Eng Ltd | Shielding structure of case |
| JPH08330777A (en) * | 1995-06-02 | 1996-12-13 | Fanuc Ltd | Panel protecting structure |
| JP2822982B2 (en) * | 1996-06-25 | 1998-11-11 | 日本電気株式会社 | Electronic equipment housing |
| DE19805352A1 (en) * | 1998-02-12 | 1999-08-19 | Abb Daimler Benz Transp | Arrangement for sealed connection of housing components for electrical equipment |
| US6674653B1 (en) | 1999-04-16 | 2004-01-06 | Agilent Technologies, Inc. | Shielding scheme for a circuit board |
| JP4637332B2 (en) * | 2000-08-04 | 2011-02-23 | パナソニック株式会社 | Folding portable wireless device |
| TW200616524A (en) * | 2004-11-05 | 2006-05-16 | Coretronic Corp | Shielding structure for a control module |
| JP4420227B2 (en) * | 2004-12-21 | 2010-02-24 | Ｎｏｋ株式会社 | Electromagnetic shield structure |
| JP5162222B2 (en) * | 2007-12-04 | 2013-03-13 | パナソニック株式会社 | Shield structure of electronic equipment |
| KR101483176B1 (en) * | 2008-01-02 | 2015-01-16 | 삼성디스플레이 주식회사 | Gasket and screen spacers and display devices containing them |
| JP2011077446A (en) * | 2009-10-01 | 2011-04-14 | Sanyo Electric Co Ltd | Shield case and image display device |
| KR101930521B1 (en) * | 2012-09-18 | 2018-12-19 | 삼성디스플레이 주식회사 | Display module of display device |
| US9078351B2 (en) * | 2012-11-15 | 2015-07-07 | Kabushiki Kaisha Toshiba | Grounding gasket and electronic apparatus |
| US9416988B2 (en) * | 2013-03-15 | 2016-08-16 | Honeywell International Inc. | Self-aligning back plate for an electronic device |
-
2014
- 2014-05-29 JP JP2014111677A patent/JP5905510B2/en active Active
-
2015
- 2015-05-22 DE DE102015108105.9A patent/DE102015108105B4/en active Active
- 2015-05-27 US US14/722,371 patent/US9668387B2/en active Active
- 2015-05-28 CN CN201510284149.1A patent/CN105283057B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5898127A (en) * | 1996-05-10 | 1999-04-27 | Leybold System Gmbh | Apparatus for shielding against high-frequency electromagnetic radiation |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105283057A (en) | 2016-01-27 |
| JP5905510B2 (en) | 2016-04-20 |
| JP2015226025A (en) | 2015-12-14 |
| US20150351291A1 (en) | 2015-12-03 |
| DE102015108105A1 (en) | 2015-12-03 |
| US9668387B2 (en) | 2017-05-30 |
| DE102015108105B4 (en) | 2020-08-20 |
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