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CN105282892A - LED lighting apparatus with communication port for sending related information - Google Patents

LED lighting apparatus with communication port for sending related information Download PDF

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Publication number
CN105282892A
CN105282892A CN201510459200.8A CN201510459200A CN105282892A CN 105282892 A CN105282892 A CN 105282892A CN 201510459200 A CN201510459200 A CN 201510459200A CN 105282892 A CN105282892 A CN 105282892A
Authority
CN
China
Prior art keywords
led
electrical contact
mounting panel
lighting device
contact surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510459200.8A
Other languages
Chinese (zh)
Inventor
杰勒德·哈伯斯
格雷戈里·W·恩格
克里斯多佛·R·里德
彼特·K·曾
约翰·S·日贝里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
XICATO Inc
Original Assignee
XICATO Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by XICATO Inc filed Critical XICATO Inc
Priority claimed from US13/089,317 external-priority patent/US8517562B2/en
Publication of CN105282892A publication Critical patent/CN105282892A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40Details of LED load circuits
    • H05B45/44Details of LED load circuits with an active control inside an LED matrix
    • H05B45/48Details of LED load circuits with an active control inside an LED matrix having LEDs organised in strings and incorporating parallel shunting devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/50Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
    • H05B45/58Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits involving end of life detection of LEDs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10Controlling the light source
    • H05B47/175Controlling the light source by remote control
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10Controlling the light source
    • H05B47/175Controlling the light source by remote control
    • H05B47/19Controlling the light source by remote control via wireless transmission

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

An electrical interface module (EIM) (120) is provided between an LED lighting apparatus (100) and a light fixture (130). The EIM (120) comprises a contact point arrangement (170) and second contact point arrangements (121, 152), wherein the contact point arrangement is suitable for being coupled with the LED lighting apparatus (100); the second contact point arrangements are suitable for being coupled with the light fixture (130); and the EIM (120) also comprises a power converter (30). Furthermore, an LED selection module (40) can be included to switch on or off the LED (102) selectively; a communication port can be included to send information related to the LED lighting apparatus (100), such as mark, service life and flux index etc. The service life of the LED lighting apparatus (100) can be measured and transmitted through RF single, IR signal, wire signal or by controlling the light output of the LED lighting apparatus (100). An optical device (140) that can be installed on the LED lighting apparatus (100) in a replacing way comprises a flux sensor (32) that is connected with the electrical interface.

Description

There is the LED light device of the communication port for sending related information
Gerard Haber Si
Gregory W grace lattice
Christopher R Reed
Those special K once
John R Bei Li
The divisional application that the application is the applying date is on April 19th, 2011, application number is the Chinese patent application (" having the LED light device of the communication port for sending related information ") of 201180022168.7.
The cross reference of related application
This application claims the U.S. Provisional Application No.61/331 submitted on May 4th, 2010,225, the U. S. application No.13/089 submitted on April 19th, 2011, the U. S. application No.13/089 that on April 19th, 316 and 2011 submits, the priority of 317, is all incorporated in this as a reference by it.
Technical field
Described embodiment relates to the lighting device comprising light-emitting diode (LED).
Background technology
In general lighting, use LED just becoming desirable and more general more.The lighting device comprising LED typically requires a large amount of heat sink and specific power requirements.Therefore, must be installed on lamp fitting by many this lighting devices, described lamp fitting comprises heat sink and provides required power.It is not user-friendly for it's a pity that this LED light device is connected with the typical electrical of lamp fitting.Therefore need to improve.
Summary of the invention
According to an embodiment, between LED light device and lamp fitting, provide electrical interface module.Described electrical interface module comprises: electrical contact surface is arranged, is suitable for coupling with LED light device; And second electrical contact surface arrange, be suitable for coupling with described lamp fitting.Described electrical contact surface can be suitable for configuring electric coupling from the different contact surfaces on different LED lighting device.Described electrical interface module can comprise power converter, and power converter is coupled by described electrical contact surface and described LED light device.In addition, LED selection module use switch element optionally turns on and off the LED in described LED light device.The communication port that controlled by processor can be comprised to send the information be associated with described LED light device, such as mark, instruction to life-span, flux etc.By to be produced by electronic circuit and the number in the cycle of being transmitted by such as RF signal, IR signal, wire signal is accumulated, or by controlling the light output of described LED light device, the life-span of described LED light device can be measured.In addition, the optics (optic) be removably installed in described LED light device can comprise the flux sensor be such as connected with electrical interface.
Accompanying drawing explanation
Fig. 1-2 describes two the exemplary luminaires comprising lighting device, reflector and lamp fitting.
Fig. 3 A shows the enlarged drawing of the parts of explanation LED-based lighting device as shown in Figure 1.
Fig. 3 B shows the perspective cross-sectional view of LED-based lighting device as shown in Figure 1.
Fig. 4 describes the cross section view of luminaire as shown in Figure 2, has the electrical interface module be coupled between LED light device and lamp fitting.
Fig. 5 A-5B describes two different configurations of electrical interface module.
Fig. 6 A-6B selectivity described on electrical interface module is sheltered and exposed terminal position.
Fig. 7 describes and may be used for locating multiple spring catch to contact the lead frame of electrical interface module.
Fig. 8 describes the embodiment that may be used for the spring catch contacting electrical interface module.
Fig. 9 A-9C describes the multiple electrical contacts be radially spaced that may be used for electrical interface module.
Figure 10 is the schematic diagram describing more detailed electrical interface module.
Figure 11 is that LED selects schematically illustrating of module.
Figure 12 selects LED to represent with the curve of the flux changing the LED transmitting be powered.
Figure 13 describes the outside flow chart transmitting the process of LED light device information.
Figure 14 describes the optics of reflector form, comprises at least one transducer with electrical interface module electrical contact.
Figure 15 is the explanation of the position that emitter transducer can be positioned at.
Embodiment
Present general is in detail with reference to background example and some embodiments of the present invention, and the example of described embodiment is illustrated in the accompanying drawings.
Fig. 1-2 describes two exemplary luminaires.Luminaire shown in Fig. 1 comprises the lighting device 100 with the rectangular in form factor.Luminaire shown in Fig. 2 comprises the lighting device 100 with the circular form factor.These examples are the objects for illustration of property.Also it is contemplated that the example of the lighting device of General polygon meshes and elliptical shape.Luminaire 150 comprises lighting device 100, reflector 140 and lamp fitting 130.As directed, lamp fitting 130 is heat sink, therefore sometimes can be called heat sink 130.But lamp fitting 130 can comprise other structures and decoration element (not shown).Reflector 140 is installed to the light that lighting device 100 is launched from lighting device 100 with collimation or deflection.Reflector 140 can be made up of Heat Conduction Material, such as comprise aluminium or copper and can with the material of lighting device 100 thermal coupling.Heat is flowed by the conduction of lighting device 100 and heat conduction reflection device 140.Heat also flows via the thermal convection on reflector 140.Reflector 140 can be compound parabolic face condenser, and wherein said condenser is made up of high reverse--bias material or is coated with high reverse--bias material.Compound parabolic face condenser trends towards higher, but they use according to the length fashion reduced usually, which increase beamwidth.The advantage of this structure be the scattering object that do not need to add to make light uniformization, add and pass through efficiency.The optical element of such as scattering object or reflector 140 and so on can such as pass through screw thread, fixture, twist lock mechanism or other suitable structures, is coupled to lighting device 100 removedly.
Lighting device 100 is installed to lamp fitting 130.As depicted in figs. 1 and 2, lighting device 100 is installed to heat sink 130.Heat sink 130 can be made up of Heat Conduction Material, such as comprise aluminium and copper and can with the material of lighting device 100 thermal coupling.Heat is flowed by the conduction of lighting device 100 and thermal conductance heat sink 130.Heat is also via the thermal convection flowing on heat sink 130.Lighting device 100 can be attached to heat sink 130 by screw thread, to be clipped on heat sink 130 by lighting device 100.For the ease of easy dismounting and the replacing of lighting device 100, lighting device 100 removably can be coupled to heat sink 130, such as, by fixture, twist lock mechanism or other suitable structures.Lighting device 100 comprises at least one heat-transfer surface, and described heat-transfer surface such as directly or use hot grease, the torrid zone, hot disc or hot epoxy resin and heat sink 130 thermal couplings.In order to the abundant cooling of LED, should for the electric energy of each watt in the LED flowed on plate, use at least 50 square millimeters, the preferably thermocontact area of 100 square millimeters.Such as, when use 20 LED, the heat sink contact area of 1000 to 2000 square millimeters should be used.Use larger heat sink 130 can allow according to higher power drive LED102, and also allow different heat sink designs.Such as, some designs can show the cooling capacity less to the dependence of heat sink orientation.In addition, fan or for forcing other schemes cooled to may be used for removing from the heat of device.Bottom is heat sink can comprise hole, makes it possible to achieve the electrical connection with lighting device 100.
Fig. 3 A shows the enlarged drawing of the parts of explanation LED light device 100 as shown in Figure 1.It should be understood that LED light device is not LED as herein defined, but the parts of LED light source or utensil or LED light source or utensil.LED light device 100 comprises the LED of one or more LED die or encapsulation and attached to the mounting panel of LED of LED die or encapsulation.Fig. 3 B describes the perspective cross-sectional view of LED light device 100 as shown in Figure 1.LED light device 100 comprises the one or more solid-state light emitting elements be arranged on mounting panel 104, such as light-emitting diode (LED) 102.Mounting panel 104 to be attached in mounting seat 101 by mounting panel retaining ring 103 and to be fixed to appropriate location.The mounting panel 104 assembling LED102 and mounting panel retaining ring 103 comprises light source subassemblies 115.Light source subassemblies 115 is operating as and uses LED102 to convert electrical energy into light.The photoconduction launched from light source subassemblies 115 is caused light converting sub-assemblies 116, for blend of colors and color conversion.Light converting sub-assemblies 116 comprises cavity 105 and output window 108, and any one or both that comprise alternatively in bottom reflector insert 106 and sidewall insert 107.Output window 108 is fixed to the top of cavity 105.Cavity 105 comprises madial wall, makes the described madial wall when being installed on light source subassemblies 115 by cavity 105 that the photoconduction from LED102 is caused output window 108.Bottom reflector insert 106 can be positioned on mounting panel 104 alternatively.Bottom reflector insert 106 comprises hole, makes the luminous component of each LED102 not by the stop of bottom reflector insert 106.It is inner that sidewall insert 106 can be positioned over cavity 105 alternatively, makes the inner surface of the sidewall insert 107 when being arranged on light source subassemblies 115 by cavity 105 that the photoconduction from LED102 is caused output window.Although as shown, when watching from lighting device 100 top, the shape of the madial wall of cavity 105 is rectangles, it is contemplated that other shapes (such as clover shape or polygon).In addition, the madial wall of cavity 105 outwards can be tapered from mounting panel 104 towards output window, instead of as directed vertical with output window 108.
In this embodiment, the sidewall insert 107 that mounting panel 104 is placed, output window 108 and bottom reflector insert 106 define the light mixing chamber 109 in described LED light device 100, a part of light from LED102 in light mixing chamber 109 is reflected, until light is by output window 108 outgoing.Before output window 108 outgoing, in cavity 109 reflects light, there is following effect: light is mixed, and provide from LED light device 100 launch light evenly distribution.The some parts of sidewall insert 107 can be coated with material for transformation of wave length.In addition, the some parts of output window 108 can be coated with identical or different material for transformation of wave length.In addition, the some parts that bottom reflector is disclosed into thing 106 can be coated with identical or different material for transformation of wave length.The mixed phase of light conversion properties matter light in cavity 109 of these materials is combined, and obtains the light of color through changing exported by output window 108.By the geometric properties of coating in the chemical property of tuning wavelength transition material and the inner surface of cavity 109, can specify the particular color character of the light exported by output window 108, such as color dot, colour temperature and color present index (CRI).
For the object of this patent document, material for transformation of wave length performs any single chemical compound of color conversion function or the mixture of different chemical compound, and color conversion function is such as the light of an absorption peak wavelength and launches the light of another peak wavelength.
Can, with the non-solid material filled chamber 109 of such as air or inert gas and so on, light be transmitted in non-solid material by LED102.Exemplarily, can seal chamber airtightly, and argon gas is used for filled chamber.Alternatively, nitrogen can be used.In other embodiments, solid sealing material filled chamber 109 can be used.Exemplarily, silicones may be used for filled chamber.
LED102 can launch different colors or identical color, by directly to launch or by phosphor converted, such as, when phosphor layer is coated to the part as LED on LED.Therefore, lighting device 100 can use the combination in any of color LED 102, such as red, green, blueness, brown color or blue-green, or LED102 can produce the light of same color or can produce white light.Such as, LED102 can launch blue light or ultraviolet light.When using in combination with phosphor (or other wavelength convert means) (such as, phosphor can in output window 108 or on output window 108, be coated to the sidewall of cavity 105, or be coated to the miscellaneous part (not shown) placed in inside cavity), the output light of lighting device 100 can be made to have required color.
Mounting panel 104 provides the electrical connection with power supply (not shown) to accompanying LED102.In one embodiment, LED102 is packaged LED, the LuxeonRebel such as manufactured by PhilipsLumiledsLighting.Also the packaged LED of other types can be used, the packaged LED such as manufactured by OSRAM (Ostarpackage), LuminusDevice (U.S.), Cree (USA), Nichia (Japan) or Tridonic (Austria).As herein defined, packaged LED is the assembly of one or more LED die, comprises the such as electrical connection such as wire-bonded connection or screw bolt-type raised pad, and comprises optical element and heat, machinery and electrical interface possibly.LED102 can comprise the lens on LED chip.Alternatively, lensless LED can be used.Lensless LED can comprise protective layer, and described protective layer can comprise phosphor.Described phosphor can be applied as the dispersion in adhesive, or apply as the sheet be separated.Each LED102 comprises can be installed at least one LED chip on sub-base or tube core.LED chip typically has the size of about 1mm*1mm*0.5mm, but these sizes can change.In certain embodiments, LED102 can comprise multiple chip.Multiple chip can launch light that is similar or different colours, such as red, green and blue.LED102 can polarized light-emitting or non-polarized light, and LED-based lighting device 100 can use the combination in any of polarization LED or non-polarized light LED.In certain embodiments, LED102 launches blue light or ultraviolet light, and this is the efficiency due to the LED launched in these wave-length coverages.In addition, different phosphor layers can be coated on the different chips on identical sub-base.Sub-base can be pottery or other suitable materials.Sub-base typically comprises the electrical contact pads in the lower surface that couples with the contact on mounting panel 104.Alternatively, electric bonding wire may be used for chip to be electrically connected with mounting panel.Together with electrical contact pads, LED102 can comprise the thermo-contact region in the lower surface of sub-base, the heat that can be produced by LED chip by thermo-contact extracted region.Thermal diffusion layer on thermo-contact region and mounting panel 104 couples.Thermal diffusion layer can be arranged on the top of mounting panel 104, bottom or intermediate layer any one on.Thermal diffusion layer can be connected by through hole, and described through hole connects any one in top, bottom and intermediate heat diffusion layer.
In certain embodiments, mounting panel 104 is by the side of heat transfer to plate 104 that produced by LED102 and the bottom of plate 104.In one example, the bottom of mounting panel 104 can be thermally coupled to heat sink 130 (illustrating in fig. 1 and 2) via mounting seat 101.In other examples, mounting panel 104 directly can be coupled to heat sink, ligthing paraphernalia and/or other mechanisms (such as fan) to dispel the heat.In certain embodiments, what mounting panel 104 conducted heat to the top thermal coupling of this plate 104 is heat sink.Such as, the top surface of heat from mounting panel 104 can conduct by mounting panel retaining ring 103 and cavity 105.Mounting panel 104 can be the FR4 plate (such as 0.5mm is thick) with relatively thick layers of copper (such as, 30 μm to 100 μm) on the top being used as thermo-contact region and lower surface.In other examples, plate 104 can be have the metal inner core printed circuit board (PCB) (PCB) of appropriate electrical connection or ceramic sub-base.The plate of other types can be used, the plate be such as made up of alumina (aluminium oxide of ceramic formula) or aluminium nitride (being ceramic formula equally).
Mounting panel 104 comprises the electrical bonding pads be connected with the electrical bonding pads on LED102.Electrical bonding pads is electrically connected with contact by metal (such as copper) trace, and lead-in wire, bridgeware or other external power sources are connected with described contact.In certain embodiments, electrical bonding pads can be the through hole by described plate 104, and realizes electrical connection on the opposite side (such as bottom) of described plate.As directed mounting panel 104 is rectangle in dimension.The LED102 be installed on mounting panel 104 can be arranged to the difference configuration on rectangular mounting plate 104.In one example, the LED102 row that can extend according to the length dimension along mounting panel 104 and aliging along the row that the width dimensions of mounting panel 104 extends.In another example, LED102 is arranged in hexagon contracted structure.In such an embodiment, each of its immediate neighbours of each LED is equidistant.Expect for the uniformity of the light that this arrangement is launched from light source subassemblies 115 for raising and efficiency.
Fig. 4 describes the cross section view of luminaire 150 as shown in Figure 2.Reflector 140 is removably coupled to lighting device 100.Reflector 140 is coupled by twist lock mechanism and lighting device 100.By the opening in reflector retaining ring 110, reflector 140 is contacted with lighting device 100, reflector 140 is alignd with lighting device 100.By reflector 140 being rotated to the position of engagement around optical axis (OA), reflector 140 and lighting device 100 are coupled.In the position of engagement, reflector 140 is captured between mounting panel retaining ring 103 and reflector retaining ring 110.In the position of engagement, can matched with hot interface surface 140 between reflector 140 and mounting panel retaining ring 103 surfacebetween produce interfacial pressure.In this manner, the heat produced by LED102 can via mounting panel 104, by mounting panel retaining ring 103, by interface 140 surfaceconduction enters reflector 140.In addition, multiple electrical connection can be formed between reflector 140 and retaining ring 103.
Lighting device 100 comprises electrical interface module (ELM) 120.As shown, EIM120 can removably be attached to lighting device 100 by geometrical clamp 137.In other embodiments, EIM120 can removably be attached to lighting device 100 by electric connector EIM120 being coupled to mounting panel 104.EIM120 also can be coupled to lighting device 100 by other fastener meanses, such as screw fastener, rivet or have contact with matching connector.As shown, EIM120 is positioned in the cavity of lighting device 100.In this manner, it is inner that EIM102 is comprised in lighting device 100, and can access from the bottom side of lighting device 100.In other embodiments, EIM120 can be positioned in lamp fitting 130 at least in part.The signal of telecommunication is sent to lighting device 100 from lamp fitting 130 by EIM120.Electric conductor 132 couples with lamp fitting 130 mutually at electric connector 133 place.Exemplarily, electric connector 133 can be Registered Jack (RJ) connector conventional in network communication applications.In other examples, electric conductor 132 can be coupled to lamp fitting 130 by screw or fixture.In other examples, electric conductor 132 can be coupled to lamp fitting 130 by dismountable electric connector that is slidably matched.Connector 133 is coupled to conductor 134.Conductor 134 is removably coupled to the electric connector 121 being installed to EIM120.Similarly, electric connector 121 can be the detachable electric connector of rj connector or any appropriate.Connector 121 is coupled to EIM120 regularly.The signal of telecommunication is sent to EIM120 by electric connector 133 on conductor 132, on conductor 134, by electric connector 121.The signal of telecommunication 135 can comprise power signal and data-signal.The signal of telecommunication 135 is routed to the suitable electrical contact pads EIM120 by EIM120 from electric connector 121.Such as, connector 121 can be coupled to the electrical contact pads 170 on the top surface of EIM120 by the conductor 139 in EIM120.Alternatively, connector 121 can be installed to EIM120 with on electrical contact pads 170 phase the same side, and therefore connector 121 can be coupled to electrical contact pads 170 by surface conductor.As shown, electrical contact pads 170 is removably coupled to mounting panel 104 by the hole 138 in mounting seat 101 by spring catch 122.The contact weld pad that the top surface of EIM120 is placed is coupled to the contact weld pad of mounting panel 104 by spring catch.In this manner, the signal of telecommunication is sent to mounting panel 104 from EIM120.Mounting panel 104 comprises conductor suitably LED102 to be coupled to the contact weld pad of mounting panel 104.In this manner, the signal of telecommunication is sent to suitable LED102 to produce light from mounting panel 104.EIM102 can be built by printed circuit board (PCB) (PCB), metal inner core PCB, ceramic substrate or Semiconductor substrate.The plate of other types can be used, the plate be such as made up of aluminium oxide (aluminium oxide of ceramic formula) or aluminium nitride (being also ceramic formula).EIM120 can be configured to the plastic components comprising multiple inserted mode system metallic conductor.
Mounting seat 101 is removably coupled to lamp fitting 130.In the example shown, lamp fitting 130 is used as heat sink.Together with mounting seat 101 and lamp fitting 130 are coupled at hot interface 136 place.At hot interface 136 place, when lighting device 100 is coupled to lighting tool 130, a part for mounting seat 101 contacts with a part for lamp fitting 130.In this manner, the heat produced by LED102 can via mounting panel 104, by mounting seat 104, conduct in lamp fitting 130 by interface 136.
In order to dismantle and change lighting device 100, lighting device 100 is separated with lamp fitting 130, and disconnects electric connector 121.In one example, conductor 134 comprises enough length to allow enough to be separated between lighting device 100 and lamp fitting 130, allows operator to arrive between utensil 130 and lighting device 100 with disconnect connector 121.In another example, connector 121 can be arranged so that the displacement between lighting device 100 and lamp fitting 130 to be used for disconnect connector 121.In another example, conductor 134 is wound on spring load spool.In this manner, by launching to extend conductor 134 from spool, to allow connection or the disconnection of connector 121, then by the action of spring load spool conductor 134 can be wound on spool and regain conductor 134.
Fig. 5 A-B describes the EIM120 being coupled to mounting panel 104 according to two kinds of different configurations.As shown in Figure 5A, by the spring catch assembly 123 of the first configuration, mounting panel 104 is coupled to EIM120.EIM120 comprises conductor 124 and 125.The spring catch assembly 123 of the signal of telecommunication 126 from connector 121, on conductor 124, in the first configuration is sent to the terminal 128 of mounting panel 104.The signal of telecommunication 127 is from the terminal 129 of mounting panel 104, on the spring catch assembly 123 of the first configuration, be sent to connector 121 at conductor 125.As shown in Figure 5 B, by the spring catch assembly 123 of the second configuration, mounting panel 104 is coupled to EIM120.The signal of telecommunication 126 is sent to the terminal 141 of mounting panel 104 from connector 121, on conductor 124, at the spring catch assembly 123 of the second configuration.The signal of telecommunication 127 is from the terminal 142 of mounting panel 104, on the spring catch assembly 123 of the second configuration, be sent to connector 121 at conductor 125.As indicated by figures 5 a-5b, the signal of telecommunication can be sent to the mounting panel with different terminal position by identical EIM120.Conductor 124 and 125 is configured to transmit between multiple terminals of the interface of identical signal between EIM120 and spring catch assembly 123 from connector 121.The difference configuration of spring catch assembly 123 may be used for the different terminal positions transmitting signals to mounting panel 104.In this manner, identical connector 121 and EIM120 may be used for the multiple different terminal arrangement for mounting panel in lighting device 100.
In other embodiments, identical spring catch assembly 123, connector 121 and EIM120 may be used for the multiple different terminal arrangement for mounting panel in lighting device 100.As shown in fig. 6 a-b, by optionally sheltering and exposing the terminal position on mounting panel 104 surface, the different terminals of mounting panel 104 can be coupled to spring catch assembly 123.As above relative to Fig. 5 A and 5B discuss, EIM120 can provide the signal of telecommunication to the mounting panel of different physical configuration.Conductor 124 and 125 is configured so that multiple terminals that the signal from connector 121 can be sent to interface between EIM120 and spring catch assembly 123.In this manner, by optionally sheltering and exposing the terminal position on mounting panel 104 surface, identical connector 121, EIM120 and spring catch assembly 123 may be used for the multiple different terminal arrangement for mounting panel in lighting device 100, and Fig. 6 A shows and shelters terminal 142 shelterwith exposed terminal 129 expose, Fig. 6 B shows exposed terminal 142 exposewith shelter terminal 129 shelter.
As shown in Fig. 4 and 6A, 6B, spring catch assembly 123 comprises multiple spring catch.As shown in Figure 7, the multiple spring catch in spring catch assembly 123 can be positioned relative to each other by lead frame 143.In other embodiments, frame 143 can be utilized to be molded described multiple spring catch to produce molded lead frame 143.Lead frame 143 can be connected with EIM120 or mounting seat 101.Spring catch 122 can be shaped, spring catch 122 be obedient to along the axle of pin, as shown in Figure 4.Such as, pin 122 comprises the hook shape of an end, for termination contact, but realize displacement during also for applying power between the two ends of pin.Spring catch assembly 123 each pin biddability ensure that when making EIM120 and mounting panel 104 electrical contact, each pin each sell each end on termination contact.In other embodiments, spring catch 122 can comprise multiple parts to realize the biddability along the axial direction of pin 122, as shown in Figure 8.Electrical contact between each pin and EIM120 can realize at the top surface of EIM120, but also can realize in lower surface.
Although as shown in Figure 4, adopt rj connector to be coupled with EIM120 by lamp fitting 130, but it is contemplated that other connectors configure.In certain embodiments, can adopt slide connector that EIM120 is electrically coupled to utensil 130.In other embodiments, multiple electric contact be radially spaced can be adopted.Such as, Fig. 9 A-C describes the embodiment adopting multiple electric contact be radially spaced.Fig. 9 A describes the end view of lamp fitting 130 and EIM120.Fig. 9 B describes the bottom view of EIM120.EIM120 comprises multiple electric contact 152 be radially spaced.As directed, electric contact 152 is round-shaped, but it is contemplated that other oval or polygonal shapes.When EIM120 is coupled to lamp fitting 130, align with the spring contact 152 of lamp fitting 130 and contact in contact 152.Fig. 9 C describes the top view of the lamp fitting 130 comprising spring contact 151.In shown configuration, EIM120 can align with lamp fitting 130 and with utensil 130 electrical contact, regardless of the orientation of EIM120 relative to utensil 130.In other examples, alignment feature parts can be utilized, according to predetermined orientation, EIM120 be alignd with lamp fitting 130.
Figure 10 is the schematic view illustrating of more detailed EIM120.In the embodiment shown, EIM120 comprises bus 21, is powered device interface controller (PDIC) 34, processor 22, uses time counter module (ETCM) 27, nonvolatile memory 26 (such as EPROM), nonvolatile memory 23 (such as flash memory), infrared transceiver 25, RF transceiver 24, sensor interface 28, power converter interface 29, power converter 30 and LED to select module 40.LED mounting panel 104 is coupled to EIM120.LED mounting panel 104 comprises flux sensor 36, comprises the LED circuit 33 of LED102 and temperature sensor 31.EIM120 is also coupled to flux sensor 32 and is coupled to the occupancy sensors 35 be installed on lamp fitting 130.In certain embodiments, flux sensor 32 and occupancy sensors 35 can be installed on optics, such as, relative to the reflector 140 that Figure 14 discusses.In certain embodiments, also occupancy sensors can be installed on mounting panel 104.In certain embodiments, any one in degree of will speed up meter, pressure sensor and humidity sensor mounting panel 104 can be installed to.Such as, accelerometer can be added to detect the orientation of lighting device 100 relative to gravitational field.In another example, accelerometer can provide measuring of the vibration existed in the operating environment of illumination apparatus 100.In another example, humidity sensor can be added to provide measuring of the moisture of the operating environment of illumination apparatus 100.Such as, if illumination apparatus 100 carries out sealing reliably operate in humid conditions, it is malfunctioning and pollute that humidity sensor may be used for detecting the sealing of lighting device.In another example, pressure sensor may be used for providing measuring of the pressure of the operating environment of illumination apparatus 100.Such as, if illumination apparatus 100 carries out sealing and vacuumizing, or alternatively seal and pressurize, it is malfunctioning that pressure sensor may be used for detecting sealing.
PDIC34 is coupled to connector 121 and receives the signal of telecommunication 135 by conductor 134.In one example, PDIC34 is the device in accordance with IEEE802.3 agreement, for through-put power and data-signal on many conductor cables (such as 5e class cable).Input signal is separated into the data-signal 41 being sent to bus 21 and the power signal 42 being sent to power converter 30 according to IEEE802.3 agreement by PDIC34.Power converter 30 operates to perform power transfer, produces the signal of telecommunication with one or more LED circuits of drive circuit system 33.In certain embodiments, power converter 30 according to current control mode operation with in predetermined voltage range to LED circuit supply controlled variable electric current.In certain embodiments, power converter 30 is DC-to-DC (DC-DC) power converters.In these embodiments, power signal 42 can have the rated voltage of 48 volts according to IEEE802.3 standard.Power signal 42 is reduced on voltage the voltage level of the voltage request meeting each LED circuit coupled with dc-dc 30 by DC-DC power converter 30.
In some other embodiments, power converter 30 is AC-DC (AC-DC) power converters.In further embodiments, power converter 30 is AC-AC (AC-AC) power converters.In the embodiment adopting AC-AC power converter 30, the LED102 being installed to mounting panel 104 produces light according to the AC signal of telecommunication.Power converter 30 can be single channel or multichannel.Each passage of power converter 30 is to the LED circuit supply electric energy of in the LED be connected in series.In one embodiment, power converter 30 operates according to constant current mode.This is particularly useful when the electrical connection of LED strip connection.In some other embodiments, power converter 30 can operate as constant pressure source.This is particularly useful when LED parallel connection electrical connection.
As shown, power converter 30 is coupled to power converter interface 29.In this embodiment, power converter interface 29 comprises digital-to-analog (D/A) ability.Digital command can be produced by the operation of processor 22, and be sent to power converter interface 29 by bus 21.Digital command signal is converted to analog signal by interface 29, and obtained analog signal is sent to power converter 30.Power converter 30 regulates the electric current being sent to the LED circuit coupled in response to the analog signal received.In some instances, power converter 30 can be closed in response to the signal received.In other examples, power converter 30 can carry out the electric current that chopping or modulation are sent to the LED circuit coupled in response to the analog signal received.In certain embodiments, power converter 30 operates and is used for directly receiving digital command signal.In these embodiments, power converter interface 29 is not implemented.In certain embodiments, power converter 30 operates for sending signal.Such as, power converter 30 can be sent to bus 21 by power converter interface 29 and not meet to power failure situation or power the signal that regularization condition indicated.
EIM120 comprises for receiving data from the device with lighting device 100 communication linkage or sending some mechanism of data to it.EIM120 can be received by PDIC34, RF transceiver 24 and IR transceiver 25 and be sent data.In addition, EIM120 can carry out broadcast data by the light controlling to export from lighting device 100.Such as, processor 22 can order the electric current supplied by power converter 30 periodically to be glimmered by the light output of LED circuit 33 light output of (flash) or frequency or amplitude modulation(PAM) LED circuit 33.Pulse is human perceivable, and the light such as exported by lighting device 100 according to the sequence pair of 31 pulse per second (PPS)s per minute glimmers.But pulse also can be the mankind, and not discernable passing flux detector is detectable, such as, the light exported according to 1kHz illumination apparatus 100 carries out chopping.In these embodiments, can the light output of illumination apparatus 100 carry out modulating to indicate code.The accumulation of lighting device 100 is comprised by time, LED fault, sequence number, the occupancy sensed by occupancy sensors 35, the flux sensed by flux sensor on plate 36, the flux sensed by flux sensor 32, the temperature sensed by temperature sensor 31 and power failure situation by any one Examples of information sent by EIM120 of above-mentioned means.In addition, the modulation of the signal of telecommunication that can be powered by subtend lighting device 100 of EIM120 or loop cycle be carried out sensing and carried out receipt message.Such as, power lines voltage can be made to require that lighting device 100 transmits the request of its sequence number with instruction three times circulation in a minute.
Figure 11 is that more detailed LED selects schematically showing of module 40.As shown, LED circuit 33 comprises being connected in series and being coupled to LED and selects the LED55-59 of module 140.Although LED circuit 33 comprises 5 LED be connected in series, but it is contemplated that more or less LED.In addition, LED board 104 can comprise and more than one is connected in series LED circuit.As directed, LED selects module 40 to comprise 5 switch element 44-48 be connected in series.Each wire of switch element is coupled to the respective wire of the LED of LED circuit 33.Such as, the first wire of switch element 44 is coupled to the anode of LED55 at voltage node 49 place.In addition, the second wire of switch element 44 is coupled to the negative electrode of LED55 at voltage node 50 place.In a comparable manner, switch element 45-48 is coupled to LED55-58 respectively.In addition, the output channel of power converter 30 is coupled between voltage node 49 and 54, defines the current circuit 61 of conduction current 60.In certain embodiments, switch element 44-48 can be transistor (such as, bipolar junction transistor or field-effect transistor).
The LED of the LED circuit 33 that LED selects module 40 optionally to couple to the passage with power converter 30 powers.Such as, in scram position, switch element 44 non-conducting electric current in fact between voltage node 49 and 50.In this manner, the electric current 60 flowing to voltage node 50 from voltage node 49 passes through LED55.In this case, LED55 provides conducting path more low-resistance in fact than switch element 44, thus electric current produces light by LED55.In this manner, switch element 44 is for " connection " LED55.Exemplarily, at on-position, switch element 47 is in fact conducting.Electric current 60 flows to node 53 from voltage node 52 by switch element 47.In this case, switch element 47 provides conducting path more low-resistance in fact than LED57, thus electric current 60 is by switch element 47 instead of LED57, and LED57 does not produce light.In this manner, switch element 47 is for " shutoff " LED58.According to described mode, switch element 44-48 can optionally power to LED55-59.
Select module 40 receives binary control signal SEL [5: 1] at LED.The state of each of control signal SEL [5: 1] control switch element 44-48, thus determine LED55-59 each " connection " or " shutoff ".In one embodiment, the condition (flux such as sensed by flux sensor 36 reduces) that processor 22 detects in response to EIM120 produces control signal SEL.In other embodiments, processor 22 produces control signal SEL in response to the command signal received on EIM120 (communication such as, received by RF transceiver 24, IR transceiver 25 or PDIC34).In another embodiment, from controller transfer control signal SEL the plate of LED light device.
How Figure 12 can connect or turn off LED to change by the amount being powered the flux that LED launches of LED circuit 33 if showing.Relative to LED circuit 33 be powered LED launch luminous flux to draw electric current 60.Due to the physical restriction of LED55-59, electric current 60 is limited to lowest high-current value I max, will become very limited in the lowest high-current value above life-span.In one example, I maxit can be 0.7 ampere.Usually, LED55-59 shows the linear relationship between luminous flux and drive current.The luminous flux that Figure 12 launches according to drive current under describing four kinds of situations: as " connection " LED, as " connection " two LED, as " connection " three LED, and as " connection " four LED.In one example, can by connection three LED and according to I maxdrive them to realize luminous flux and export L 3.Alternatively, can by connect four LED and utilize less current drives they realize luminous flux export L 3.When requiring to reduce light quantity over a time period (such as, restaurant's illumination dims), light selects module 40 to may be used for optionally " shutoff " LED, instead of reduces electric current simply.By the LED in inoperation lamp fitting on the selected period, increase the life-span of these " shutoffs " LED, this makes us expecting.Can dispatch selecting the LED of " shutoff ", make the time quantum of each LED " shutoff " be similar to identical with the time quantum of " shutoff " of other LED.In this manner, the life-span of lighting device 100 can be extended by the time life of each LED being similar to identical amount.
LED55-59 optionally can be turned on and off response is made to LED fault.In one embodiment, lighting device 100 comprises " shutoff " extra LED.But, when there is LED fault, by one or more " connections " in extra LED to compensate the LED broken down.In another example, extra LED " can be connected " to provide additional light output.This is needs for following situation: when the lighting device 100 not knowing requirement before the mounting throws light on output, or when lighting requirement changes after mounting.
Figure 13 is the flow chart describing the process externally transmitting LED light device information.As shown, the information this locality be associated with LED light device is stored in such as nonvolatile memory 23 and/or 26 (202).Exemplarily, described information can be the LED light device identifier of such as sequence number and so on or the information with parameter correlation, and described parameter is such as life-span, flux, occupancy, LED or power failure condition, temperature or the parameter arbitrarily needed for other.In some instances, the information of such as life-span, flux or temperature and so on is measured, and in other examples, information does not need to measure, such as lighting device identifier or configuration information.Such as by RF transceiver 24, IR transceiver, wired connection or by the request (204) received information that circulates to power lines voltage.Such as, by RF transceiver 24, IR transceiver, wired connection or the light output by controlling lighting device 100, LED light device information (206) is transmitted.
EIM120 storage sequence number, sequence number identifies that wherein EIM120 is as the lighting device 100 of a part individually.Sequence number is stored in the nonvolatile memory 26 of EIM120.In one example, nonvolatile memory 26 is Erasable Programmable Read Only Memory EPROM (EPROM).During manufacture the sequence number that illumination apparatus 100 carries out identifying is programmed in EPROM26.EIM120 can carry out transfer sequence number in response to the request received for transmitting Sequence Number (such as by the communication of RF transceiver 24, IR transceiver 25 or PDIC34 reception).Such as, EIM120 receives the request (such as by the communication of RF transceiver 24, IR transceiver 25 or PDIC34 reception) for transmitting lighting device sequence number.Responsively, processor 22 reads in the sequence number stored in memory 26, and sequence number is sent to any one in RF transceiver 24, IR transceiver 25 or PDIC34, with from EIM120 transfer sequence number.
EIM120 comprises temperature survey, record and communication function.When lighting device 100 powers on, transducer 28 receives temperature survey from temperature sensor 31.Processor 22 periodically reads current temperature survey from sensor interface 28, and is written in memory 23 current temperature survey as TEMP.In addition, described measurement and the maximum temperature measured value (TMAX) stored in memory 23 and minimum temperature value (TMIN) compare by processor 22.If processor 22 determines that Current Temperatures measurement is greater than TMAX, processor 22 Current Temperatures measures overwrite TMAX.If processor 22 determines that Current Temperatures measurement is less than TMIN, processor 22 Current Temperatures measures overwrite TMIN.In certain embodiments, processor 22 calculates the difference between TMAX and TMIN, and sends this difference.In certain embodiments, the initial value of TMIN and TMAX is stored in memory 26.In other embodiments, when Current Temperatures measurement is more than TMAX or when being less than TMIN, EIM120 transmits alarm.Such as, when processor 22 detect Current Temperatures measure reached or more than TMAX time, processor 22 transmits alarm code by RF transceiver 24, IR transceiver 25 or PDIC34.In other embodiments, EIM120 can carry out broadcast warning by the light output controlling to export lighting device 100.Such as, processor 22 can order the electric current to power converter 30 is supplied to carry out recurrent pulses to indicate alert consitions.Pulse can be human perceivable, and such as, the light output of illumination apparatus 100 glimmers according to the sequence of 31 pulse per second (PPS)s in every 5 minutes.Pulse also can be that the mankind are ND, but can detect by passing flux detector, such as, carry out chopping according to the light output of 1kHz illumination apparatus 100.In these embodiments, can the light output of illumination apparatus 100 carry out modulating to indicate alarm code.In other embodiments, when Current Temperatures measurement reaches TMAX, EIM120 turns off the electric current supply for LED circuit 33.In other embodiments, EIM120 measures to transmit Current Temperatures in response to the request received for sending Current Temperatures.
EIM120 comprises and uses time counter module 27.When lighting device 100 powers on, used the time (AET) to be sent to ETCM27 the accumulation stored in memory 23, and ETCM27 start time counting and will increase progressively with the time.Periodically, by being stored in memory 23 with the copy transmission of time, make all the time current AET to be stored in the nonvolatile memory.In this manner, also current AET can not be lost when lighting device 100 power down suddenly.In certain embodiments, processor 22 can comprise ETCM function on sheet.In certain embodiments, EIM120 stores target life objective value (TLV), and the life expectancy of illumination apparatus 120 identifies.Target life objective value is stored in the nonvolatile memory 26 of EIM120.During manufacture the target life objective value be associated with concrete lighting device 100 is programmed in EPROM26.In some instances, target life objective value can be chosen as is expecting that the luminous flux that lighting device 100 will occur exports the expection hours worked of the front lighting device 100 that existence 30% is degenerated.In one example, target life objective value can be 50,000 hour.In certain embodiments, the difference between processor 22 couples of AET and TLV calculates.In certain embodiments, when AET reaches TLV, EIM120 transmits alarm.Such as, when processor 22 detect AET reached or more than TLV time, processor 22 transmits alarm code by RF transceiver 24, IR transceiver 25 or PDIC34.In other embodiments, EIM120 can carry out broadcast warning by controlling lighting device 100 light output.Such as, processor 22 can order the electric current to power converter 30 is supplied to carry out recurrent pulses to indicate alert consitions.Pulse can be human perceivable, such as, glimmer according to the light output of the sequence pair lighting device 100 of 31 pulse per second (PPS)s in every 5 minutes.Pulse also can be that the mankind are ND, but passing flux detector is detectable, such as, carry out chopping according to the light output of 1kHz illumination apparatus 100.In these embodiments, can the light output of illumination apparatus 100 carry out modulating to indicate alarm code.In other embodiments, when AET reaches TLV, EIM120 turns off the electric current supply to LED circuit 33.In other embodiments, EIM120 in response to the request received for sending AET to transmit AET.
Figure 14 shows the optics of reflector 140 form, comprises at least one transducer and at least one electric conductor.Figure 14 shows the flux sensor 32 installed on the inner surface of reflector 140.Transducer 32 is located to there is direct sight line between the light sensing surface and the output window 108 of lighting device 100 of transducer 32.In one embodiment, transducer 32 is silicon diode transducers.Transducer 32 is coupled to electric conductor 62.Conductor 62 is molded into the conductive trace in reflector 140.In other embodiments, conductive trace can be printed onto on reflector 140.When reflector 140 is installed to lighting device 100, conductor 62 through reflector 140 base and be coupled to the conductive through hole 65 of mounting panel retaining ring 103.Conductive through hole 65 is coupled to the conductor 64 of mounting panel 104.Conductor 64 is coupled to EIM120 via spring catch 66.In this manner, flux sensor 32 is electrically coupled to EIM120.In other embodiments, conductor 62 is directly coupled to the conductor 64 of mounting panel 104.Similarly, occupancy detector 35 can be electrically coupled to EIM120.In certain embodiments, transducer 32 and 35 can removably be coupled to reflector 140 by connector.In other embodiments, transducer 32 and 35 can be coupled to reflector 140 regularly.
Figure 14 also shows flux sensor 36 and the temperature sensor 31 of the mounting panel 104 being attached to lighting device 100.Transducer 31 and 36 provides information relevant with the operating condition of lighting device 100 in plate rank.Any one in transducer 31,32,35 and 36 can be one of these transducers multiple of placing of the multiple positions on mounting panel 104, reflector 140, lamp fitting 130 and lighting device 100.In addition, color sensor can be adopted.Figure 15 is in order to color, flux and occupancy sensors can be positioned the expression of the position on reflector 140 by exemplary object.In one example, transducer can be positioned at position A, B and C.Outside position A-C faces, make the transducer arranged at position A-C can sense the color of the scene of being irradiated by lighting device 100, flux or occupancy.Similarly, outside the transducer at F, G and H place, position also can face, and the color of the scene that lighting device 100 irradiates, flux or occupancy can be sensed.Also can by sensor setting at position D and E place.In position D and E faces, and flux or the color of the illumination of lighting device 100 can be detected.Sensing station D and E there are differences in its angle sensitivity for lighting device 100 light output, and the character that this difference may be used for the light output of illumination apparatus 100 is characterized.
Although in order to instruct object to be illustrated above specific embodiment, the instruction of this patent document has common application, and is not limited to specific embodiment as above.Such as, lighting device 100 is described as comprising mounting seat 101.But in certain embodiments, mounting seat 101 can not be comprised.In another example, EIM120 is described as comprise bus 21, is powered device interface controller (PDIC) 34, processor 22, use time counter module (ETCM) 27, nonvolatile memory 26 (such as EPROM), nonvolatile memory 23 (such as flash memory), infrared transceiver 25, RF transceiver 24, sensor interface 28, power converter interface 29, power converter 30 and LED select module 40.But in other embodiments, if any one in these elements does not need its function, can be excluded.In another example, PDIC34 is described as the IEEE802.3 standard met for communicating.But, in order to data and power reception and send object, the any-mode for distinguishing power signal and data-signal can be adopted.In another example, LED-based lighting module 100 is described as a part for luminaire 150 in Fig. 1-2.But LED-based lighting module 100 can be the part changing lamp or renovation lamp, or replacing lamp or renovation lamp can be configured as.Therefore, when not departing from the scope of the invention set forth in claims, the various amendments of the various features of embodiment, adaptation and combination can be implemented.

Claims (12)

1. an equipment, comprising:
LED light device, operation is used for utilizing emitted light, and wherein said LED light device comprises electrical interface module EIM;
Optics, is removably installed to described LED light device; And
Transducer, is arranged on described optics, wherein said transducer and described electrical interface module electric coupling.
2. equipment according to claim 1, wherein said optics comprises conductor, and the output signal of wherein said transducer is sent to the LED mounting panel of described LED light device via the conductor of described optics, and is sent to described electrical interface module by described LED mounting panel.
3. equipment according to claim 1, wherein said transducer is any one in flux sensor, color sensor and occupancy sensors.
4. a device, comprising:
LED light device, operation is used for utilizing emitted light, and wherein said LED light device comprises electrical interface module EIM;
Optics, is removably installed to described LED light device; And
Transducer, is arranged on described optics, wherein said transducer and described electrical interface module electric coupling;
Wherein said electrical interface module comprises:
Multiple first electrical contact surface, arranges with first and is placed on electrical interface plate;
Multiple second electrical contact surface, arranges with second and is placed on described electrical interface plate;
First conductor, the first electrical contact surface in the first electrical contact surface in described multiple first electrical contact surface and described multiple second electrical contact surface is coupled, wherein said multiple first electrical contact surface be configured to can with LED light device electric coupling, and wherein said more than second electrical contact surface be configured to can with lamp fitting electric coupling; And
Frame, comprises multiple pin, and described multiple pin operation is used for described multiple first electrical contact surfaces of described electrical interface plate to be coupled to described LED light device.
5. device according to claim 4, also comprises:
Second conductor, couples the second electrical contact surface in the first electrical contact surface in described multiple first electrical contact surface and described multiple second electrical contact surface.
6. device according to claim 4, described multiple first electrical contact surfaces of wherein said electrical interface plate are adapted for can from the LED light device electric coupling with different number LED.
7. device according to claim 4, described multiple first electrical contact surfaces of wherein said electrical interface plate are adapted for and can configure electric coupling from the different electrical contact surfaces on different LED lighting device.
8. device according to claim 4, wherein said frame is lead frame, and described multiple pin is multiple spring catch.
9. device according to claim 4, wherein said frame is holding frame, and described multiple pin is the contact plug being molded into holding frame.
10. device according to claim 4, also comprises:
At least one LED, is installed to mounting panel;
First side of wherein said electrical interface module and described mounting panel is separated; And
Wherein said optics is the heat conduction reflection device that can be couple to LED-based lighting device on the second side relative with mounting panel first side, and described heat conduction reflection device is configured to deflect the light launched from LED-based lighting device.
11. devices according to claim 10, wherein said heat conduction reflection device is made up of Heat Conduction Material.
12. devices according to claim 10, wherein said heat conduction reflection device is compound parabolic face condenser.
CN201510459200.8A 2010-05-04 2011-04-19 LED lighting apparatus with communication port for sending related information Pending CN105282892A (en)

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US33122510P 2010-05-04 2010-05-04
US61/331,225 2010-05-04
US13/089,317 US8517562B2 (en) 2010-05-04 2011-04-19 Flexible electrical connection of an LED-based illumination device to a light fixture
US13/089,316 2011-04-19
US13/089,317 2011-04-19
US13/089,316 US8237381B2 (en) 2010-05-04 2011-04-19 Flexible electrical connection of an LED-based illumination device to a light fixture
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Application publication date: 20160127