CN105278239A - Stereo-lithography rapid-prototyping polysiloxane photosensitive resin composition and preparation method and application thereof - Google Patents
Stereo-lithography rapid-prototyping polysiloxane photosensitive resin composition and preparation method and application thereof Download PDFInfo
- Publication number
- CN105278239A CN105278239A CN201410264127.4A CN201410264127A CN105278239A CN 105278239 A CN105278239 A CN 105278239A CN 201410264127 A CN201410264127 A CN 201410264127A CN 105278239 A CN105278239 A CN 105278239A
- Authority
- CN
- China
- Prior art keywords
- polysiloxane
- acrylate
- methyl
- photosensitive resin
- rapid prototyping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- -1 polysiloxane Polymers 0.000 title claims abstract description 87
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 44
- 239000011342 resin composition Substances 0.000 title claims abstract description 14
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 238000001459 lithography Methods 0.000 title 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000003085 diluting agent Substances 0.000 claims abstract description 15
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 239000003999 initiator Substances 0.000 claims abstract description 7
- 150000003254 radicals Chemical class 0.000 claims abstract description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 17
- 150000002148 esters Chemical class 0.000 claims description 9
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 8
- 238000003756 stirring Methods 0.000 claims description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 7
- 239000012965 benzophenone Substances 0.000 claims description 6
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 5
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 claims description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 3
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical group CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 claims description 3
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical group COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 claims description 3
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 claims description 2
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 claims description 2
- FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 claims description 2
- FWWXYLGCHHIKNY-UHFFFAOYSA-N 2-ethoxyethyl prop-2-enoate Chemical compound CCOCCOC(=O)C=C FWWXYLGCHHIKNY-UHFFFAOYSA-N 0.000 claims description 2
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 claims description 2
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical group CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 claims description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 claims description 2
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 claims description 2
- 238000006116 polymerization reaction Methods 0.000 claims description 2
- 239000012749 thinning agent Substances 0.000 claims 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims 3
- 229920000151 polyglycol Polymers 0.000 claims 3
- 239000010695 polyglycol Substances 0.000 claims 3
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 claims 2
- RSNQKPMXXVDJFG-UHFFFAOYSA-N tetrasiloxane Chemical compound [SiH3]O[SiH2]O[SiH2]O[SiH3] RSNQKPMXXVDJFG-UHFFFAOYSA-N 0.000 claims 2
- WXPWZZHELZEVPO-UHFFFAOYSA-N (4-methylphenyl)-phenylmethanone Chemical compound C1=CC(C)=CC=C1C(=O)C1=CC=CC=C1 WXPWZZHELZEVPO-UHFFFAOYSA-N 0.000 claims 1
- NNNLYDWXTKOQQX-UHFFFAOYSA-N 1,1-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OC(CC)(OC(=O)C=C)OC(=O)C=C NNNLYDWXTKOQQX-UHFFFAOYSA-N 0.000 claims 1
- BYRQZFQBDJEADA-UHFFFAOYSA-N 1-(1-phenylpiperazin-2-yl)ethanone Chemical compound C(C)(=O)C1N(CCNC1)C1=CC=CC=C1 BYRQZFQBDJEADA-UHFFFAOYSA-N 0.000 claims 1
- IEORSVTYLWZQJQ-UHFFFAOYSA-N 2-(2-nonylphenoxy)ethanol Chemical compound CCCCCCCCCC1=CC=CC=C1OCCO IEORSVTYLWZQJQ-UHFFFAOYSA-N 0.000 claims 1
- RFVNOJDQRGSOEL-UHFFFAOYSA-N 2-hydroxyethyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCO RFVNOJDQRGSOEL-UHFFFAOYSA-N 0.000 claims 1
- HRDDBYWTPPDWDH-UHFFFAOYSA-N 3-[methyl(trimethylsilyloxy)silyl]propyl 2-methylprop-2-enoate Chemical compound C[SiH](CCCOC(=O)C(C)=C)O[Si](C)(C)C HRDDBYWTPPDWDH-UHFFFAOYSA-N 0.000 claims 1
- MCQIKMFOILBABV-UHFFFAOYSA-N 3-[methyl(trimethylsilyloxy)silyl]propyl prop-2-enoate Chemical compound C(C=C)(=O)OCCC[SiH](C)O[Si](C)(C)C MCQIKMFOILBABV-UHFFFAOYSA-N 0.000 claims 1
- 239000005711 Benzoic acid Substances 0.000 claims 1
- RBEKNHSVDMWRMK-UHFFFAOYSA-N C(C(=C)C)(=O)OCCCC[Si]1(O[Si](O[Si](O1)(C)C)(C)C)C Chemical compound C(C(=C)C)(=O)OCCCC[Si]1(O[Si](O[Si](O1)(C)C)(C)C)C RBEKNHSVDMWRMK-UHFFFAOYSA-N 0.000 claims 1
- RIXILMQBMXMSIS-UHFFFAOYSA-N C(C(=C)C)(=O)OCCCC[Si]1(O[Si](O[Si](O[Si](O1)(C)C)(C)C)(C)C)C Chemical compound C(C(=C)C)(=O)OCCCC[Si]1(O[Si](O[Si](O[Si](O1)(C)C)(C)C)(C)C)C RIXILMQBMXMSIS-UHFFFAOYSA-N 0.000 claims 1
- WVSWSKGZGXBAOQ-UHFFFAOYSA-N C(C=C)(=O)OCCCC[Si]1(O[Si](O[Si](O1)(C)C)(C)C)C Chemical compound C(C=C)(=O)OCCCC[Si]1(O[Si](O[Si](O1)(C)C)(C)C)C WVSWSKGZGXBAOQ-UHFFFAOYSA-N 0.000 claims 1
- RQLFSNHQURCNNY-UHFFFAOYSA-N C(C=C)(=O)OCCCC[Si]1(O[Si](O[Si](O[Si](O1)(C)C)(C)C)(C)C)C Chemical compound C(C=C)(=O)OCCCC[Si]1(O[Si](O[Si](O[Si](O1)(C)C)(C)C)(C)C)C RQLFSNHQURCNNY-UHFFFAOYSA-N 0.000 claims 1
- ZMDDERVSCYEKPQ-UHFFFAOYSA-N Ethyl (mesitylcarbonyl)phenylphosphinate Chemical compound C=1C=CC=CC=1P(=O)(OCC)C(=O)C1=C(C)C=C(C)C=C1C ZMDDERVSCYEKPQ-UHFFFAOYSA-N 0.000 claims 1
- NNJVILVZKWQKPM-UHFFFAOYSA-N Lidocaine Chemical compound CCN(CC)CC(=O)NC1=C(C)C=CC=C1C NNJVILVZKWQKPM-UHFFFAOYSA-N 0.000 claims 1
- 235000010233 benzoic acid Nutrition 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 229960004194 lidocaine Drugs 0.000 claims 1
- 229950007687 macrogol ester Drugs 0.000 claims 1
- 125000005395 methacrylic acid group Chemical group 0.000 claims 1
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical class COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 claims 1
- 229920000847 nonoxynol Polymers 0.000 claims 1
- 238000007493 shaping process Methods 0.000 claims 1
- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 claims 1
- 239000002994 raw material Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 238000010146 3D printing Methods 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- CUHKVBVNLQPDQC-UHFFFAOYSA-N 3-[2,4,6,8-tetramethyl-4,6,8-tris(3-prop-2-enoyloxypropyl)-1,3,5,7,2,4,6,8-tetraoxatetrasilocan-2-yl]propyl prop-2-enoate Chemical compound C=CC(=O)OCCC[Si]1(C)O[Si](C)(CCCOC(=O)C=C)O[Si](C)(CCCOC(=O)C=C)O[Si](C)(CCCOC(=O)C=C)O1 CUHKVBVNLQPDQC-UHFFFAOYSA-N 0.000 description 2
- BSUWHQDKSFHJPE-UHFFFAOYSA-N 3-[2,4,6,8-tetramethyl-4,6,8-tris[3-(2-methylprop-2-enoyloxy)propyl]-1,3,5,7,2,4,6,8-tetraoxatetrasilocan-2-yl]propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC[Si]1(C)O[Si](C)(CCCOC(=O)C(C)=C)O[Si](C)(CCCOC(=O)C(C)=C)O[Si](C)(CCCOC(=O)C(C)=C)O1 BSUWHQDKSFHJPE-UHFFFAOYSA-N 0.000 description 2
- DVKLFIGSJYRFRH-UHFFFAOYSA-N 3-[[[dimethyl(trimethylsilyloxy)silyl]oxy-dimethylsilyl]oxy-methyl-[3-(2-methylprop-2-enoyloxy)propyl]silyl]propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC[Si](C)(CCCOC(=O)C(C)=C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C DVKLFIGSJYRFRH-UHFFFAOYSA-N 0.000 description 2
- UGJOKEOWFRIAAS-UHFFFAOYSA-N 3-[methyl-(3-prop-2-enoyloxypropyl)-trimethylsilyloxysilyl]propyl prop-2-enoate Chemical compound C=CC(=O)OCCC[Si](C)(O[Si](C)(C)C)CCCOC(=O)C=C UGJOKEOWFRIAAS-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- PJAKWOZHTFWTNF-UHFFFAOYSA-N (2-nonylphenyl) prop-2-enoate Chemical class CCCCCCCCCC1=CC=CC=C1OC(=O)C=C PJAKWOZHTFWTNF-UHFFFAOYSA-N 0.000 description 1
- MVCFIQHTLYKLBE-UHFFFAOYSA-N (3-ethoxy-2-nonylphenyl) prop-2-enoate Chemical compound C(C=C)(=O)OC1=C(C(=CC=C1)OCC)CCCCCCCCC MVCFIQHTLYKLBE-UHFFFAOYSA-N 0.000 description 1
- LJUKODJASZSKFL-UHFFFAOYSA-N 2-(9-oxothioxanthen-2-yl)oxyacetic acid Chemical compound C1=CC=C2C(=O)C3=CC(OCC(=O)O)=CC=C3SC2=C1 LJUKODJASZSKFL-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- FGTYTUFKXYPTML-UHFFFAOYSA-N 2-benzoylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 FGTYTUFKXYPTML-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- ZIFLDVXQTMSDJE-UHFFFAOYSA-N 3-[[dimethyl-[3-(2-methylprop-2-enoyloxy)propyl]silyl]oxy-dimethylsilyl]propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC[Si](C)(C)O[Si](C)(C)CCCOC(=O)C(C)=C ZIFLDVXQTMSDJE-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- NRTJGTSOTDBPDE-UHFFFAOYSA-N [dimethyl(methylsilyloxy)silyl]oxy-dimethyl-trimethylsilyloxysilane Chemical compound C[SiH2]O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C NRTJGTSOTDBPDE-UHFFFAOYSA-N 0.000 description 1
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- YMCOIFVFCYKISC-UHFFFAOYSA-N ethoxy-[2-(2,4,6-trimethylbenzoyl)phenyl]phosphinic acid Chemical compound CCOP(O)(=O)c1ccccc1C(=O)c1c(C)cc(C)cc1C YMCOIFVFCYKISC-UHFFFAOYSA-N 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- YAGMLECKUBJRNO-UHFFFAOYSA-N octyl 4-(dimethylamino)benzoate Chemical compound CCCCCCCCOC(=O)C1=CC=C(N(C)C)C=C1 YAGMLECKUBJRNO-UHFFFAOYSA-N 0.000 description 1
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000012265 solid product Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Macromonomer-Based Addition Polymer (AREA)
Abstract
本发明涉及一种立体光刻快速成形聚硅氧烷基光敏树脂组合物及其制备方法和应用,它主要包括以下质量配比的原料组份:双端丙烯酸酯基聚硅氧烷10~85%;多丙烯酸酯基聚硅氧烷3-21%;丙烯酸酯聚硅氧烷稀释剂10~60%;丙烯酸酯稀释剂10-60%;自由基引发剂1.0~4.0%。按上述配比,将原料混合,搅拌下加热至透明的液体,即得立体光刻快速成形聚硅氧烷基光敏树脂。本发明所述的一种立体光刻快速成形聚硅氧烷基光敏树脂组合物经过立体光刻成形后,既发挥光敏树脂的快速成型的特点,又具有聚硅氧烷的耐高低温的特性。利用该光敏树脂成形的零部件,具有精度高,耐热性好等优点。The invention relates to a stereolithography rapid prototyping polysiloxane-based photosensitive resin composition and its preparation method and application, which mainly includes the following raw material components in mass ratio: double-ended acrylate-based polysiloxane 10-85 %; multi-acrylic polysiloxane 3-21%; acrylate polysiloxane diluent 10-60%; acrylate diluent 10-60%; free radical initiator 1.0-4.0%. According to the above ratio, the raw materials are mixed, stirred and heated to a transparent liquid, and the stereolithography rapid prototyping polysiloxane-based photosensitive resin is obtained. A stereolithography rapid prototyping polysiloxane-based photosensitive resin composition according to the present invention has not only the characteristics of rapid prototyping of photosensitive resins, but also the high and low temperature resistance characteristics of polysiloxane after being formed by stereolithography . The parts formed by using the photosensitive resin have the advantages of high precision, good heat resistance and the like.
Description
技术领域technical field
本发明属于3D打印快速成形制造技术领域,具体涉及到立体光刻快速成形自由基型聚硅氧烷基光敏树脂组合物及其制备方法。The invention belongs to the technical field of 3D printing rapid prototyping manufacturing, and in particular relates to a stereolithography rapid prototyping free radical polysiloxane-based photosensitive resin composition and a preparation method thereof.
背景技术Background technique
3D打印技术,是以计算机三维设计模型为蓝本,通过软件分层离散和数控成型系统,利用激光束、热熔喷嘴等方式将金属粉末、陶瓷粉末、塑料、细胞组织等特殊材料进行逐层堆积黏结,最终叠加成型,制造出实体产品。与传统制造业通过模具、车铣等机械加工方式对原材料进行定型、切削以最终生产成品不同,3D打印将三维实体变为若干个二维平面,通过对材料处理并逐层叠加进行生产,大大降低了制造的复杂度。这种数字化制造模式不需要复杂的工艺、不需要庞大的机床、不需要众多的人力,直接从计算机图形数据中便可生成任何形状的零件,使生产制造得以向更广的生产人群范围延伸。3D printing technology is based on the computer three-dimensional design model, through the software layered discrete and numerical control forming system, using laser beams, hot-melt nozzles, etc. to accumulate metal powder, ceramic powder, plastic, cell tissue and other special materials layer by layer Bonding, and finally overlaying and molding to create a solid product. Unlike the traditional manufacturing industry, which shapes and cuts raw materials through mechanical processing methods such as moulds, turning and milling to finally produce finished products, 3D printing transforms a three-dimensional entity into several two-dimensional planes. The manufacturing complexity is reduced. This digital manufacturing mode does not require complex processes, huge machine tools, or a lot of manpower. Parts of any shape can be generated directly from computer graphics data, enabling manufacturing to extend to a wider range of production groups.
作为新一代3D打印,使用液态光敏树脂成形制件,用紫外光进行固化。不需要昂贵的激光系统,因此设备价格便宜,运行和维护成本也很低,可以在更低的温度(最低可达50℃)下工作;而且,还具有操作简单、成形速度快、成形过程无污染、成形件的精度高,可在办公室环境使用等优点,因此,应用前景十分看好。As a new generation of 3D printing, liquid photosensitive resin is used to form parts and cured with ultraviolet light. There is no need for expensive laser systems, so the equipment is cheap, the operation and maintenance costs are also very low, and it can work at lower temperatures (up to 50°C); moreover, it also has the advantages of simple operation, fast forming speed, and seamless forming process. Pollution, high precision of formed parts, and can be used in office environment, etc. Therefore, the application prospect is very promising.
适合3D打印的光敏树脂要求胶水体系的粘度低,流动性好,固化速率快,固化收缩率低,制品无撬曲,耐热性优良等要求。目前,国内对于高精度、高耐热性立体光刻快速成形材料的制备方法报道较少。具体到立体光刻快速成形自由基型聚硅氧烷基光敏树脂及其制备未见报道。The photosensitive resin suitable for 3D printing requires the glue system to have low viscosity, good fluidity, fast curing rate, low curing shrinkage, no prying of the product, and excellent heat resistance. At present, there are few domestic reports on the preparation methods of high-precision, high-heat-resistant stereolithography rapid prototyping materials. Specific to stereolithography rapid prototyping free radical polysiloxane-based photosensitive resin and its preparation have not been reported.
发明内容Contents of the invention
本发明的目的在于提供一种高精度、高耐热性立体光刻快速成形聚硅氧烷基光敏树脂。采用此技术制备的光敏胶水具有体系粘度低,流动性好的优点,在紫外光照射下,具有胶水固化速率快,固化收缩率低,制品无撬曲的特性,由于其聚硅氧烷的主体结构,赋予固化后制品优异的耐高低温特性。利用该聚硅氧烷基光敏树脂成形的零部件,具有精度高,耐热性好,低温性能优异,韧性增强等优点。The purpose of the present invention is to provide a high-precision, high-heat-resistant stereolithography rapid prototyping polysiloxane-based photosensitive resin. The photosensitive glue prepared by this technology has the advantages of low system viscosity and good fluidity. Under the irradiation of ultraviolet light, it has the characteristics of fast glue curing rate, low curing shrinkage rate, and no prying of the product. Due to its polysiloxane main body structure, which endows the cured product with excellent high and low temperature resistance characteristics. Parts formed by using the polysiloxane-based photosensitive resin have the advantages of high precision, good heat resistance, excellent low-temperature performance, enhanced toughness, and the like.
本发明的目的还在于提供立体光刻快速成形自由基型聚硅氧烷基光敏树脂的制造方法。The object of the present invention is also to provide a method for manufacturing the free-radical polysiloxane-based photosensitive resin for stereolithography rapid prototyping.
本发明是通过以下技术方案来实现的:The present invention is achieved through the following technical solutions:
一种立体光刻快速成形聚硅氧烷基光敏树脂组合物,包括以下质量配比的原料组份:A stereolithography rapid prototyping polysiloxane-based photosensitive resin composition, comprising the following raw material components in mass ratio:
双端丙烯酸酯基聚硅氧烷10~85%;Double-ended acrylate-based polysiloxane 10-85%;
多丙烯酸酯基聚硅氧烷3-21%;Multi-acrylate polysiloxane 3-21%;
稀释剂10-60%;Thinner 10-60%;
自由基引发剂1.0~4.0%。Free radical initiator 1.0-4.0%.
优选地,所述双端丙烯酸酯基聚硅氧烷为聚硅氧烷主链,两端含有(甲基)丙烯酰氧丙基的丙烯酸酯聚硅氧烷树脂,分子量为1000-50000之间,分别使用一种或者多种分子量的聚合物混合使用。Preferably, the double-ended acrylate-based polysiloxane is a polysiloxane main chain, an acrylate polysiloxane resin containing (meth)acryloyloxypropyl groups at both ends, and the molecular weight is between 1000-50000 , using one or more molecular weight polymers in combination.
优选地,所述多丙烯酸酯基聚硅氧烷是聚硅氧烷为主链,侧基或(和)端基含有(甲基)丙烯酰氧丙基基团的聚硅氧烷丙烯酸酯树脂,也称之谓丙烯酰氧丙基改性聚硅氧烷,分子量为300-50000之间。Preferably, the polyacrylate-based polysiloxane is a polysiloxane acrylate resin with polysiloxane as the main chain and side groups or (and) terminal groups containing (meth)acryloyloxypropyl groups , also known as acryloxypropyl modified polysiloxane, the molecular weight is between 300-50000.
优选地,所谓稀释剂为丙烯酸酯聚硅氧烷稀释剂、丙烯酸酯稀释剂或它们的混合物。Preferably, the so-called diluent is an acrylate polysiloxane diluent, an acrylate diluent or a mixture thereof.
更优选地,所谓丙烯酸酯聚硅氧烷稀释剂为二(丙烯酰氧丙基)四甲基二硅氧烷,二(丙烯酰氧丙基)六甲基三硅氧烷,二(丙烯酰氧丙基)八甲基四硅氧烷,二(丙烯酰氧丙基)十甲基五硅氧烷,二(甲基丙烯酰氧丙基)四甲基二硅氧烷,二(甲基丙烯酰氧丙基)六甲基三硅氧烷,二(甲基丙烯酰氧丙基)八甲基四硅氧烷,二(甲基丙烯酰氧丙基)十甲基五硅氧烷,四(丙烯酰氧丙基)四甲基环四硅氧烷,四(甲基丙烯酰氧丙基)四甲基环四硅氧烷或以上物质的混合物。More preferably, the so-called acrylate polysiloxane diluents are bis(acryloyloxypropyl)tetramethyldisiloxane, bis(acryloyloxypropyl)hexamethyltrisiloxane, bis(acryloxypropyl) Oxypropyl) octamethyltetrasiloxane, bis(acryloxypropyl) decamethylpentasiloxane, bis(methacryloxypropyl) tetramethyldisiloxane, bis(methyl Acryloxypropyl) hexamethyltrisiloxane, bis(methacryloxypropyl) octamethyltetrasiloxane, bis(methacryloxypropyl) decamethylpentasiloxane, Tetrakis(acryloxypropyl)tetramethylcyclotetrasiloxane, tetrakis(methacryloxypropyl)tetramethylcyclotetrasiloxane or a mixture of the above substances.
更优选地,所谓丙烯酸酯稀释剂为丙烯酸月桂酯,丙烯酸乙氧基乙酯、丙烯酸乙氧基乙氧基乙酯、二丙烯酸一缩二乙二醇酯,三丙烯酸三羟甲基丙烷酯,乙氧基壬基苯酚丙烯酸酯,丙烯酸异辛酯,甲基丙烯酸-β-羟乙酯,1,6-己二醇二丙烯酸酯,季戊四醇三(甲基)丙烯酸酯,季戊四醇四(甲基)丙烯酸酯,二缩三羟甲基四(甲基)丙烯酸酯或它们的混合物。More preferably, the so-called acrylate diluent is lauryl acrylate, ethoxyethyl acrylate, ethoxyethoxyethyl acrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, Ethoxylated nonylphenol acrylate, isooctyl acrylate, beta-hydroxyethyl methacrylate, 1,6-hexanediol diacrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(methyl) Acrylates, trimethylol tetra(meth)acrylates or mixtures thereof.
优选地,所谓自由基引发剂为引发丙烯酸酯基聚合的自由基引发剂。Preferably, the so-called free-radical initiator is a free-radical initiator that initiates acrylate-based polymerization.
更优选地,所谓自由基引发剂为苯甲酰甲酸甲酯,2-羟基-2-甲基-1-[4-(2-羟基乙氧基)苯基]-1-丙酮,2-二甲氨基-2-苄基-1-[4-(4-吗啉基)苯基]-1-丁酮,2,4,6-三甲基苯甲酰基苯基膦酸乙酯,2,4,6-三甲基苯甲酰基-二苯基氧化膦,2-甲基-2-(4-吗啉基)-1-[4-(甲硫基)苯基]-1-丙酮,1-羟基环己基苯基甲酮,2-羟基-2-甲基-1-苯基丙酮,聚合[2-羟基-2-甲基-1-[4-(1-甲基乙烯基)苯基]丙酮,2-异丙基硫杂蒽酮,2,4-二乙基硫杂蒽酮,4-苯基二苯甲酮,邻苯甲酰基苯甲酸甲酯,4-(二甲氨基)-苯甲酸-(2-乙基)己酯,4-二甲基氨基苯甲酸乙酯,2,2-二甲氧基-1,2-二苯乙酮,4-甲基二苯甲酮,二苯甲酮,4,4’-二(二乙氨基)二苯甲酮,邻苯甲酰基苯甲酸聚乙二醇酯,聚乙二醇二(β-4-[对(2-二甲基胺-2-苯甲基)丁酰基苯基]哌嗪)丙酸酯,,聚乙二醇二(β-4-对乙酰基苯基-哌嗪)丙酸酯,聚乙二醇二-(对-二甲基氨基苯甲酸)酯,聚丁二醇250二-(2-羧甲氧基噻吨酮)酯,聚丁二醇250-(4-苯甲酰基苯氧乙酸)酯,聚丁二醇双苯甲酰甲酸酯或它们中两种或两种以上的混合物。More preferably, the so-called free radical initiators are methyl benzoylformate, 2-hydroxy-2-methyl-1-[4-(2-hydroxyethoxy)phenyl]-1-propanone, 2-di Methylamino-2-benzyl-1-[4-(4-morpholinyl)phenyl]-1-butanone, ethyl 2,4,6-trimethylbenzoylphenylphosphonate, 2, 4,6-trimethylbenzoyl-diphenylphosphine oxide, 2-methyl-2-(4-morpholinyl)-1-[4-(methylthio)phenyl]-1-propanone, 1-Hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenylacetone, poly[2-hydroxy-2-methyl-1-[4-(1-methylvinyl)benzene Base] acetone, 2-isopropylthioxanthone, 2,4-diethylthioxanthone, 4-phenylbenzophenone, methyl o-benzoylbenzoate, 4-(dimethylamino )-(2-ethyl)hexyl benzoate, ethyl 4-dimethylaminobenzoate, 2,2-dimethoxy-1,2-benzophenone, 4-methylbenzophenone Ketone, benzophenone, 4,4'-bis(diethylamino)benzophenone, polyethylene glycol phthaloylbenzoate, polyethylene glycol bis(β-4-[p-(2- Dimethylamine-2-benzyl)butyrylphenyl]piperazine) propionate, polyethylene glycol di(β-4-p-acetylphenyl-piperazine) propionate, polyethylene glycol Alcohol di-(p-dimethylaminobenzoate) ester, polytetramethylene glycol 250 di-(2-carboxymethoxythioxanthone) ester, polytetramethylene glycol 250-(4-benzoylphenoxyacetic acid ) ester, polytetramethylene glycol bisbenzoate or a mixture of two or more of them.
本发明还提供了一种上述立体光刻快速成形光敏树脂的制备方法,该方法是将所述原料组份按所述的质量配比混合,将混合物料进行加热,搅拌直至成为透明的均匀液体为止,获得的产物即为立体光刻快速成形光敏树脂。The present invention also provides a preparation method of the stereolithography rapid prototyping photosensitive resin, the method is to mix the raw material components according to the mass ratio, heat the mixed material, and stir until it becomes a transparent uniform liquid So far, the obtained product is stereolithography rapid prototyping photosensitive resin.
上述的立体光刻快速成形光敏树脂作为光固化材料应用于立体光刻快速成形技术领域,其固化光源优选采用波长为355nm~385nmnm的紫外光。The stereolithography rapid prototyping photosensitive resin mentioned above is used as a photocuring material in the field of stereolithography rapid prototyping technology, and the curing light source is preferably ultraviolet light with a wavelength of 355nm-385nm.
具体实施方式detailed description
下面结合实施例,对本发明做进一步地详细说明,但本发明的实现方式并不局限于此。The present invention will be described in further detail below in conjunction with the embodiments, but the implementation of the present invention is not limited thereto.
实施例1Example 1
在装有搅拌器和冷凝管的5000毫升的玻璃三口瓶中,加入双端丙烯酸酯基聚硅氧烷(分子量为1000左右)1700g,多丙烯酰氧丙基改性聚硅氧烷(分子量为50000左右)420.0g,稀释剂二(丙烯酰氧丙基)四甲基二硅氧烷60g和丙烯酸月桂酯600g,苯甲酰甲酸甲酯和2-羟基-2-甲基-1-[4-(2-羟基乙氧基)苯基]-1-丙酮各40g。加热,搅拌直至成为透明的淡黄色均匀液体,这种液体即为配制的一种光敏树脂。In a 5000 ml glass three-neck flask equipped with a stirrer and a condenser tube, add 1700 g of double-ended acrylate-based polysiloxane (molecular weight is about 1000), polyacryloxypropyl modified polysiloxane (molecular weight: 50000 or so) 420.0g, diluent bis(acryloxypropyl)tetramethyldisiloxane 60g and lauryl acrylate 600g, methyl benzoylformate and 2-hydroxy-2-methyl-1-[4 40 g each of -(2-hydroxyethoxy)phenyl]-1-propanone. Heat and stir until it becomes a transparent light yellow homogeneous liquid, which is a prepared photosensitive resin.
实施例2Example 2
在装有搅拌器和冷凝管的5000毫升的玻璃三口瓶中,加入双端丙烯酸酯基聚硅氧烷(分子量为50000左右)1000克,多丙烯酰氧丙基改性聚硅氧烷(分子量为300左右)300克,稀释剂二(甲基丙烯酰氧丙基)六甲基三硅氧烷500克和1,6-己二醇二丙烯酸酯500克,,2-异丙基硫杂蒽酮40g和邻苯甲酰基苯甲酸甲酯40克。加热,搅拌直至成为透明的淡黄色均匀液体,这种液体即为配制的一种光敏树脂。In a 5000 ml glass three-neck flask equipped with a stirrer and a condenser tube, add 1000 grams of double-ended acrylate-based polysiloxane (molecular weight is about 50,000), polyacryloxypropyl modified polysiloxane (molecular weight about 300) 300 grams, 500 grams of diluent bis(methacryloxypropyl) hexamethyltrisiloxane and 500 grams of 1,6-hexanediol diacrylate, 2-isopropylthia Anthrone 40g and methyl phthaloylbenzoate 40g. Heat and stir until it becomes a transparent light yellow homogeneous liquid, which is a prepared photosensitive resin.
实施例3Example 3
在装有搅拌器和冷凝管的5000毫升的玻璃三口瓶中,加入双端丙烯酸酯基聚硅氧烷(分子量为22000左右)1000克,多丙烯酰氧丙基改性聚硅氧烷(分子量为24000左右)300克,稀释剂二(丙烯酰氧丙基)八甲基四硅氧烷1000克和季戊四醇三(甲基)丙烯酸酯1000克,聚丁二醇250二-(2-羧甲氧基噻吨酮)酯60g和2,2-二甲氧基-1,2-二苯乙酮60克。加热,搅拌直至成为透明的淡黄色均匀液体,这种液体即为配制的一种光敏树脂。In a 5000 ml glass three-neck flask equipped with a stirrer and a condenser tube, add 1000 grams of double-ended acrylate-based polysiloxane (molecular weight is about 22000), polyacryloxypropyl modified polysiloxane (molecular weight 24000 or so) 300 grams, diluent two (acryloxypropyl) octamethyltetrasiloxane 1000 grams and pentaerythritol tri (meth) acrylate 1000 grams, polytetramethylene glycol 250 two - (2- carboxymethyl Oxythioxanthone) ester 60g and 2,2-dimethoxy-1,2-benzophenone 60g. Heat and stir until it becomes a transparent light yellow homogeneous liquid, which is a prepared photosensitive resin.
实施例4Example 4
在装有搅拌器和冷凝管的5000毫升的玻璃三口瓶中,加入双端甲基丙烯酸酯基聚硅氧烷(分子量为20000左右)1000克,多甲基丙烯酰氧丙基改性聚硅氧烷(分子量为18000左右)300克,稀释剂二(甲基丙烯酰氧丙基)八甲基四硅氧烷600克和二丙烯酸一缩二乙二醇酯600克,聚丁二醇250二-(2-羧甲氧基噻吨酮)酯40g和2,2-二甲氧基-1,2-二苯乙酮60克。加热,搅拌直至成为透明的淡黄色均匀液体,这种液体即为配制的一种光敏树脂。In a 5000 ml glass three-neck flask equipped with a stirrer and a condenser, add 1000 grams of double-ended methacrylate polysiloxane (molecular weight is about 20000), polymethacryloxypropyl modified polysiloxane Oxane (molecular weight is about 18000) 300 grams, diluent bis(methacryloxypropyl) octamethyltetrasiloxane 600 grams and diethylene glycol diacrylate 600 grams, polytetramethylene glycol 250 40 g of bis-(2-carboxymethoxythioxanthone) ester and 60 g of 2,2-dimethoxy-1,2-benzophenone. Heat and stir until it becomes a transparent light yellow homogeneous liquid, which is a prepared photosensitive resin.
实施例5Example 5
在装有搅拌器和冷凝管的5000毫升的玻璃三口瓶中,加入双端甲基丙烯酸酯基聚硅氧烷(分子量为50000左右)800克,多甲基丙烯酰氧丙基改性聚硅氧烷(分子量为300左右)500克,稀释剂二(甲基丙烯酰氧丙基)十甲基五硅氧烷600克和乙氧基壬基苯酚丙烯酸酯400克,邻苯甲酰基苯甲酸甲酯40克4-(二甲氨基)-苯甲酸-(2-乙基)己酯50克。加热,搅拌直至成为透明的淡黄色均匀液体,这种液体即为配制的一种光敏树脂。In a 5000 ml glass three-neck flask equipped with a stirrer and a condenser tube, add 800 grams of double-ended methacrylate-based polysiloxane (molecular weight is about 50,000), polymethacryloxypropyl modified polysiloxane Oxane (molecular weight is about 300) 500 grams, diluent bis(methacryloxypropyl) decamethylpentasiloxane 600 grams and ethoxy nonylphenol acrylate 400 grams, o-benzoyl benzoic acid 40 grams of methyl ester and 50 grams of 4-(dimethylamino)-benzoic acid-(2-ethyl)hexyl ester. Heat and stir until it becomes a transparent light yellow homogeneous liquid, which is a prepared photosensitive resin.
实施例6Example 6
在装有搅拌器和冷凝管的5000毫升的玻璃三口瓶中,加入双端甲基丙烯酸酯基聚硅氧烷(分子量为30000左右)1000克,多丙烯酰氧丙基改性聚硅氧烷(分子量为10000左右)400克,稀释剂四(丙烯酰氧丙基)四甲基环四硅氧烷500克和四(甲基丙烯酰氧丙基)四甲基环四硅氧烷600克,2,4,6-三甲基苯甲酰基-二苯基氧化膦30克和2-甲基-2-(4-吗啉基)-1-[4-(甲硫基)苯基]-1-丙酮40克。加热,搅拌直至成为透明的淡黄色均匀液体,这种液体即为配制的一种光敏树脂。In a 5000 ml glass three-neck flask equipped with a stirrer and a condenser, add 1000 grams of double-ended methacrylate polysiloxane (molecular weight is about 30000), polyacryloxypropyl modified polysiloxane (Molecular weight is about 10000) 400 grams, diluent tetrakis (acryloyloxypropyl) tetramethylcyclotetrasiloxane 500 grams and tetrakis (methacryloyloxypropyl) tetramethylcyclotetrasiloxane 600 grams , 2,4,6-trimethylbenzoyl-diphenylphosphine oxide 30 g and 2-methyl-2-(4-morpholinyl)-1-[4-(methylthio)phenyl] - 1-acetone 40 g. Heat and stir until it becomes a transparent light yellow homogeneous liquid, which is a prepared photosensitive resin.
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410264127.4A CN105278239A (en) | 2014-05-30 | 2014-05-30 | Stereo-lithography rapid-prototyping polysiloxane photosensitive resin composition and preparation method and application thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410264127.4A CN105278239A (en) | 2014-05-30 | 2014-05-30 | Stereo-lithography rapid-prototyping polysiloxane photosensitive resin composition and preparation method and application thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN105278239A true CN105278239A (en) | 2016-01-27 |
Family
ID=55147503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410264127.4A Pending CN105278239A (en) | 2014-05-30 | 2014-05-30 | Stereo-lithography rapid-prototyping polysiloxane photosensitive resin composition and preparation method and application thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105278239A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107141426A (en) * | 2017-04-18 | 2017-09-08 | 华南协同创新研究院 | It is a kind of for silastic material of 3D printing and its preparation method and application |
CN107357136A (en) * | 2017-08-23 | 2017-11-17 | 广西众昌树脂有限公司 | Photosensitive liquid resin |
CN109476844A (en) * | 2016-05-12 | 2019-03-15 | Swimc有限公司 | The insulation of spraying and protective coating |
EP3636207A1 (en) * | 2018-10-11 | 2020-04-15 | Dreve ProDiMed GmbH | Material for the additive production of three-dimensional objects and method for the production and use thereof |
CN111500189A (en) * | 2020-05-22 | 2020-08-07 | 眉山拓利科技有限公司 | UV-cured organic silicon-acrylic acid hybrid system coating |
CN113195507A (en) * | 2018-12-31 | 2021-07-30 | 美国陶氏有机硅公司 | Multifunctional organosilicon compounds and related methods, compounds, and compositions |
CN114415471A (en) * | 2022-03-01 | 2022-04-29 | 之江实验室 | A two-photon photoresist based on siloxane and its preparation method, use method and application |
US12227530B2 (en) | 2018-12-31 | 2025-02-18 | Dow Silicones Corporation | Method of preparing functional organosilanol compounds |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070049652A1 (en) * | 2005-08-29 | 2007-03-01 | Cmet Inc | Rapid prototyping resin compositions |
CN101122742A (en) * | 2007-09-14 | 2008-02-13 | 西北工业大学 | Hyperbranched polysiloxane based photoresists |
CN102844708A (en) * | 2010-04-14 | 2012-12-26 | 东丽株式会社 | Negative photosensitive resin composition, and protective film and touch panel member using the same |
-
2014
- 2014-05-30 CN CN201410264127.4A patent/CN105278239A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070049652A1 (en) * | 2005-08-29 | 2007-03-01 | Cmet Inc | Rapid prototyping resin compositions |
CN101122742A (en) * | 2007-09-14 | 2008-02-13 | 西北工业大学 | Hyperbranched polysiloxane based photoresists |
CN102844708A (en) * | 2010-04-14 | 2012-12-26 | 东丽株式会社 | Negative photosensitive resin composition, and protective film and touch panel member using the same |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109476844B (en) * | 2016-05-12 | 2021-08-31 | Swimc有限公司 | Sprayed insulating and protective coating |
CN109476844A (en) * | 2016-05-12 | 2019-03-15 | Swimc有限公司 | The insulation of spraying and protective coating |
CN107141426A (en) * | 2017-04-18 | 2017-09-08 | 华南协同创新研究院 | It is a kind of for silastic material of 3D printing and its preparation method and application |
CN107357136A (en) * | 2017-08-23 | 2017-11-17 | 广西众昌树脂有限公司 | Photosensitive liquid resin |
JP7306939B2 (en) | 2018-10-11 | 2023-07-11 | ドレーベ・プロデイメド・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | Materials for the additive manufacturing of three-dimensional objects and methods of making and using the same |
CN111040092A (en) * | 2018-10-11 | 2020-04-21 | 德雷弗普罗迪医疗有限责任公司 | Material for additive manufacturing of three-dimensional objects, and manufacturing method and use |
KR20200041271A (en) * | 2018-10-11 | 2020-04-21 | 드레페 프로디메드 게엠베하 | Material for 3d printing and method of making and use of the material |
JP2020059270A (en) * | 2018-10-11 | 2020-04-16 | ドレーベ・プロデイメド・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | Material for additive manufacturing of three-dimensional object, manufacturing method and use thereof |
EP3636207A1 (en) * | 2018-10-11 | 2020-04-15 | Dreve ProDiMed GmbH | Material for the additive production of three-dimensional objects and method for the production and use thereof |
CN111040092B (en) * | 2018-10-11 | 2024-02-06 | 德雷弗普罗迪医疗有限责任公司 | Materials used for additive manufacturing of three-dimensional objects as well as manufacturing methods and uses |
KR102783016B1 (en) | 2018-10-11 | 2025-03-14 | 드레페 프로디메드 게엠베하 | Material for 3d printing and method of making and use of the material |
CN113195507A (en) * | 2018-12-31 | 2021-07-30 | 美国陶氏有机硅公司 | Multifunctional organosilicon compounds and related methods, compounds, and compositions |
CN113195507B (en) * | 2018-12-31 | 2024-09-10 | 美国陶氏有机硅公司 | Multifunctional organosilicon compounds and related methods, compounds, and compositions |
US12227530B2 (en) | 2018-12-31 | 2025-02-18 | Dow Silicones Corporation | Method of preparing functional organosilanol compounds |
CN111500189A (en) * | 2020-05-22 | 2020-08-07 | 眉山拓利科技有限公司 | UV-cured organic silicon-acrylic acid hybrid system coating |
CN111500189B (en) * | 2020-05-22 | 2022-08-16 | 眉山拓利科技有限公司 | UV-cured organic silicon-acrylic acid hybrid system coating |
CN114415471A (en) * | 2022-03-01 | 2022-04-29 | 之江实验室 | A two-photon photoresist based on siloxane and its preparation method, use method and application |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105278239A (en) | Stereo-lithography rapid-prototyping polysiloxane photosensitive resin composition and preparation method and application thereof | |
CN107778406B (en) | Photopolymer composition for 3D printing | |
CN105622859B (en) | It is a kind of for light-cured resin of visible ray SLA3D printers and preparation method thereof | |
US7815835B2 (en) | Rapid prototyping method and radiation-curable composition for use therein | |
CN111936525B (en) | Curable composition for light molding, lost foam, and method for producing three-dimensional molded article | |
CN101481492B (en) | UV curing photosensitive resin for rapid moulding injection mold | |
CN108170003A (en) | A kind of DLP 3D printings elastic photosensitive resin and preparation method thereof | |
CN105199058B (en) | A kind of 3D printing light curing resin composition and moulder prepared therefrom | |
CN111154050B (en) | A kind of polyetheretherketone photosensitive material and its preparation method and application | |
CN105131581A (en) | Photocurable liquid resin composition for three-dimensional molding and molded object obtained by photocuring same | |
JP4409683B2 (en) | Optical molding resin composition, method for producing the same, and optical molding | |
CN111836723B (en) | Model material formulations for additive manufacturing of three-dimensional objects at low temperatures | |
CN104109328A (en) | A kind of light curing wax material for 3D printing | |
CN105223777A (en) | A kind of stereolithography rapid prototyping mixes type polysiloxane group photosensitive resin composition and its preparation method and application | |
CN110724236A (en) | High-temperature-resistant light-cured resin and preparation method thereof | |
CN108026194A (en) | Pattern forming material, pattern formation method and patterning device | |
CN113736085B (en) | Photosensitive resin composition for photo-curing 3D printing and preparation method and application thereof | |
JP3657057B2 (en) | Photocurable resin composition for molding resin mold production and method for producing molding resin mold | |
CN106750049A (en) | A kind of 3D printing rapid shaping photocurable resin material and its preparation method and application | |
CN106608952A (en) | Flexible light-cured resin material for 3D printing and preparation method and application thereof | |
CN109401259A (en) | Solid material composition and its preparation method and application | |
CN103941543A (en) | Photosensitive resin composition based on polylactide polyol, preparation method thereof and photosensitive resin | |
CN106554467B (en) | Epoxy radicals crosslinked microsphere and its preparation method and application | |
JP7429783B2 (en) | Photocurable compositions, three-dimensional objects, and dental products | |
JP4007704B2 (en) | Photocurable resin composition for optical three-dimensional modeling |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160127 |
|
RJ01 | Rejection of invention patent application after publication |